JP4946484B2 - Temperature sensor and vehicle - Google Patents

Temperature sensor and vehicle Download PDF

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JP4946484B2
JP4946484B2 JP2007031668A JP2007031668A JP4946484B2 JP 4946484 B2 JP4946484 B2 JP 4946484B2 JP 2007031668 A JP2007031668 A JP 2007031668A JP 2007031668 A JP2007031668 A JP 2007031668A JP 4946484 B2 JP4946484 B2 JP 4946484B2
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circuit board
temperature sensor
detection element
heat transfer
temperature
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JP2008196936A (en
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宏志 中尾
稔 窪川
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NSK Ltd
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Description

本発明は、伝熱性を有する筐体内に、温度検出素子の実装された回路基板を配した構成の温度センサに関する。   The present invention relates to a temperature sensor having a configuration in which a circuit board on which a temperature detection element is mounted is disposed in a case having heat conductivity.

従来、鉄道車両や自動車等の車両では、保全のため、温度センサや振動センサ等の軸受センサを車両の軸受装置に取り付け、軸受センサからの検出信号に基づいて車両の運転状態を監視している。
図３は、従来の軸受装置の一部および軸受センサの径方向の断面図である。
軸受装置１は、図３に示すように、転がり軸受１０と、転がり軸受１０を収容する軸箱２とで構成されている。 Conventionally, in a vehicle such as a railway vehicle or an automobile, a bearing sensor such as a temperature sensor or a vibration sensor is attached to the vehicle bearing device for maintenance, and the operation state of the vehicle is monitored based on a detection signal from the bearing sensor. .
FIG. 3 is a radial sectional view of a part of a conventional bearing device and a bearing sensor.
As illustrated in FIG. 3, the bearing device 1 includes a rolling bearing 10 and a shaft box 2 that houses the rolling bearing 10.

転がり軸受１０は、内輪１１と、外輪１２と、内輪１１および外輪１２の間で転動自在に配設された複数のボール（不図示）とを備え、内輪１１が車両の車軸３を回転可能に支持し、外輪１２が軸箱２に固定されている。
軸箱２の外周面２ａには、温度センサ８０が取り付けられている。
温度センサ８０は、伝熱性を有する材質の筐体８１内に、温度検出素子８５の実装されたプリント基板８２が配設された構成となっている。 The rolling bearing 10 includes an inner ring 11, an outer ring 12, and a plurality of balls (not shown) disposed so as to be able to roll between the inner ring 11 and the outer ring 12, and the inner ring 11 can rotate the axle 3 of the vehicle. The outer ring 12 is fixed to the axle box 2.
A temperature sensor 80 is attached to the outer peripheral surface 2 a of the axle box 2.
The temperature sensor 80 has a configuration in which a printed board 82 on which a temperature detection element 85 is mounted is disposed in a case 81 made of a material having heat conductivity.

また、プリント基板８２は、その支持部以外が、筐体８１との間に空間をもって配設されている。
筐体８１には、ボルト９１を通過させるためのボルト穴９２が形成されている。外周面２ａには、ボルト穴９２の位置に合せてネジ穴９３が形成されている。温度センサ８０は、ボルト穴９２を介してボルト９１を軸箱２に設けられたネジ穴に螺合することにより外周面２ａに取り付けられている。 Further, the printed circuit board 82 is arranged with a space between the casing 81 and the portion other than the support portion.
Bolt holes 92 for allowing the bolts 91 to pass therethrough are formed in the casing 81. A screw hole 93 is formed in the outer peripheral surface 2 a in accordance with the position of the bolt hole 92. The temperature sensor 80 is attached to the outer peripheral surface 2 a by screwing a bolt 91 into a screw hole provided in the axle box 2 through a bolt hole 92.

また、プリント基板８２には、筐体８１の外側面を介してケーブル８６が接続され、ケーブル８６の端部は、ケーブルグランド８７により筐体８１の外側面に固定されている。
図４は、従来の温度センサ８０における、温度検出素子８５の実装されたプリント基板８２を示す図である。
図４に示すように、プリント基板８２には、温度検出素子８５が実装されている。 In addition, a cable 86 is connected to the printed circuit board 82 via an outer surface of the housing 81, and an end portion of the cable 86 is fixed to the outer surface of the housing 81 by a cable gland 87.
FIG. 4 is a diagram showing a printed circuit board 82 on which a temperature detection element 85 is mounted in a conventional temperature sensor 80.
As shown in FIG. 4, a temperature detection element 85 is mounted on the printed circuit board 82.

また、プリント基板８２の４隅には、基板取付ネジ部９０が形成されており、この基板取付ネジ部９０を介して、筐体８１に設けられたネジ穴に、ネジを螺合することによって、プリント基板８２が筐体８１内に支持されている。
上記のような構成の温度センサ８０は、転がり軸受１０の発熱によって軸箱２に伝わる熱を、筐体８１における軸箱２との接触面を介して筐体８１内に伝え、この熱を、温度検出素子８５で検出することで、転がり軸受１０の温度を測定している。 Also, board mounting screw portions 90 are formed at the four corners of the printed circuit board 82, and screws are screwed into screw holes provided in the housing 81 via the board mounting screw portions 90. The printed circuit board 82 is supported in the housing 81.
The temperature sensor 80 configured as described above transfers the heat transmitted to the axle box 2 due to the heat generated by the rolling bearing 10 into the casing 81 through the contact surface of the casing 81 with the axle box 2, and this heat is transferred to the casing 81. By detecting with the temperature detection element 85, the temperature of the rolling bearing 10 is measured.

なお、このような構成の軸受センサとしては、例えば、特許文献１記載の技術が知られている。
特開２００３−４２８３５号公報 As a bearing sensor having such a configuration, for example, a technique described in Patent Document 1 is known.
JP 2003-42835 A

しかしながら、上記従来技術では、温度検出素子がガラスエポキシ基板などのプリント基板上に実装されるため、センサ筐体の温度と温度検出素子の検出する温度とに、プリント基板を介する分の温度差が生じる。また、筐体とプリント基板との間には空間が設けられているため、これによる温度差も生じる。これらの温度差は、両者の温度勾配となって現われ、軸受の温度測定精度を低減させる。   However, in the above prior art, since the temperature detection element is mounted on a printed board such as a glass epoxy board, there is a difference in temperature between the sensor housing and the temperature detected by the temperature detection element through the printed board. Arise. Moreover, since a space is provided between the housing and the printed circuit board, a temperature difference due to this is also generated. These temperature differences appear as a temperature gradient between the two, reducing the temperature measurement accuracy of the bearing.

また、上記従来技術では、センサ筐体の側面部から放熱を行うために、軸箱表面の温度と温度検出素子の検出する温度との温度差が大きくなり、軸受の温度を精度良く測定することが困難であった。
そこで、本発明は、このような従来の技術の有する未解決の課題に着目してなされたものであって、センサ筐体の温度を精度良く検出するのに好適な温度センサ及び当該温度センサを備えた車両を提供することを目的としている。
Moreover, in the above prior art, since heat is radiated from the side surface of the sensor housing, the temperature difference between the temperature of the surface of the axle box and the temperature detected by the temperature detection element becomes large, and the temperature of the bearing is accurately measured. It was difficult.
Therefore, the present invention has been made paying attention to such an unsolved problem of the conventional technology, and a temperature sensor suitable for accurately detecting the temperature of the sensor housing and the temperature sensor are provided. The object is to provide a vehicle equipped .

〔発明１〕 上記目的を達成するために、発明１の温度センサは、伝熱性を有する筐体内に、温度検出素子の実装された回路基板を配設した構成の温度センサであって、
前記回路基板に、前記筐体の熱を前記実装された温度検出素子の近傍まで伝える伝熱パターンを形成したことを特徴とする。
このような構成であれば、筐体に発した熱を、伝熱パターンを介して温度検出素子の近傍まで伝えることが可能である。 [Invention 1] In order to achieve the above object, the temperature sensor of Invention 1 is a temperature sensor having a configuration in which a circuit board on which a temperature detection element is mounted is disposed in a case having heat conductivity,
A heat transfer pattern is formed on the circuit board to transmit heat of the housing to the vicinity of the mounted temperature detection element.
With such a configuration, the heat generated in the housing can be transmitted to the vicinity of the temperature detection element through the heat transfer pattern.

ここで、伝熱パターンは、例えば、プリント基板上に金属などにより形成されるパターンであり、伝熱性を有するのはもちろん、筐体の熱を温度検出素子に正確に伝えるために、熱の伝導効率が比較的高い材料を用いて形成されることが好ましい。   Here, the heat transfer pattern is, for example, a pattern formed of metal or the like on a printed circuit board. In addition to having heat transfer properties, the heat transfer pattern is used to accurately transfer the heat of the housing to the temperature detection element. It is preferable to use a material having a relatively high efficiency.

〔発明２〕 更に、発明２の温度センサは、発明１の温度センサにおいて、前記回路基板における、前記筐体と前記回路基板とが熱的に接している部分から前記実装された温度検出素子の近傍まで、前記伝熱パターンを形成したことを特徴とする。   [Invention 2] Further, the temperature sensor of Invention 2 is the temperature sensor of Invention 1, wherein the temperature detection element mounted on the circuit board from a portion where the casing and the circuit board are in thermal contact with each other is provided. The heat transfer pattern is formed up to the vicinity.

このような構成であれば、筐体と回路基板とが熱的に接触している部分の熱を、伝熱パターンを介して温度検出素子の近傍まで伝えることが可能である。
ここで、熱的に接している部分とは、筐体の発する熱が回路基板に接している部分であり、筐体が回路基板に直接接している部分、伝熱性を有する部材等を介して筐体の熱が接している部分などが該当する。 With such a configuration, it is possible to transfer the heat of the portion where the housing and the circuit board are in thermal contact to the vicinity of the temperature detection element via the heat transfer pattern.
Here, the portion in thermal contact is the portion in which the heat generated by the housing is in contact with the circuit board, and the portion in which the housing is in direct contact with the circuit board, a member having heat conductivity, or the like. The part where the heat of the case is in contact corresponds.

〔発明３〕 更に、発明３の温度センサは、発明２の温度センサにおいて、前記熱的に接続されている部分は、前記回路基板を前記筐体内に支持する伝熱性を有した支持部材が、前記回路基板と接触している部分であることを特徴とする。
このような構成であれば、筐体から支持部材を介して伝わる熱を、伝熱パターンを介して温度検出素子の近傍まで伝えることが可能である。 [Invention 3] Further, the temperature sensor of Invention 3 is the temperature sensor of Invention 2, wherein the thermally connected portion is a support member having heat conductivity for supporting the circuit board in the housing. It is a portion in contact with the circuit board.
With such a configuration, it is possible to transfer the heat transferred from the housing through the support member to the vicinity of the temperature detection element through the heat transfer pattern.

〔発明４〕 更に、発明４の温度センサは、発明１乃至３のいずれか１の温度センサにおいて、前記伝熱パターンを、前記回路基板における、前記実装された温度検出素子の底部が面する位置まで形成したことを特徴とする。
このような構成であれば、筐体に発した熱を、伝熱パターンを介して、回路基板上の温度検出素子の底部が面する位置まで伝えることが可能である。 [Invention 4] The temperature sensor according to Invention 4 is the temperature sensor according to any one of Inventions 1 to 3, wherein the heat transfer pattern is positioned at the bottom of the mounted temperature detection element on the circuit board. It is characterized by being formed up to.
With such a configuration, it is possible to transfer the heat generated in the housing to a position where the bottom of the temperature detection element on the circuit board faces through the heat transfer pattern.

〔発明５〕 更に、発明５の温度センサは、発明１乃至４のいずれか１の温度センサにおいて、前記伝熱パターンを、当該伝熱パターンの一部が、前記実装された温度検出素子の外周を囲むように形成したことを特徴とする。
このような構成であれば、筐体に発した熱を、回路基板上の温度検出素子の外周を囲んだ状態の伝熱パターンによって伝えることが可能である。 [Invention 5] The temperature sensor according to Invention 5 is the temperature sensor according to any one of Inventions 1 to 4, wherein the heat transfer pattern is an outer periphery of the temperature detection element on which a part of the heat transfer pattern is mounted. It is characterized by being formed so as to surround.
With such a configuration, the heat generated in the housing can be transmitted by a heat transfer pattern in a state surrounding the outer periphery of the temperature detection element on the circuit board.

〔発明６〕 更に、発明６の温度センサは、発明１乃至５のいずれか１の温度センサにおいて、前記伝熱パターンを、他の電気回路のパターンとは独立に形成したことを特徴とする。
このような構成であれば、伝熱パターンと、他の電気回路のパターンとを、熱的且つ電気的に分離することが可能である。 [Invention 6] The temperature sensor according to Invention 6 is characterized in that, in the temperature sensor according to any one of Inventions 1 to 5, the heat transfer pattern is formed independently of other electric circuit patterns.
With such a configuration, it is possible to thermally and electrically separate the heat transfer pattern and the pattern of another electric circuit.

以上説明したように、発明１乃至５の温度センサによれば、筐体の熱を、伝熱パターンを介して温度検出素子の近傍まで伝えることができるので、筐体の温度測定精度を向上することができるという効果が得られる。
更に、発明６の温度センサによれば、伝熱パターンを伝わる熱が他の電気回路へと与える悪影響を軽減することができるという効果が得られる。 As described above, according to the temperature sensor of the first to fifth aspects, the heat of the casing can be transmitted to the vicinity of the temperature detection element via the heat transfer pattern, so that the temperature measurement accuracy of the casing is improved. The effect that it can be obtained.
Furthermore, according to the temperature sensor of the sixth aspect of the invention, it is possible to reduce the adverse effect that the heat transmitted through the heat transfer pattern has on other electric circuits.

以下、本発明の実施の形態を図面に基づき説明する。図１〜図２は、本発明に係る温度センサの実施の形態を示す図である。
本実施の形態は、本発明に係る温度センサを、鉄道車両や自動車等の車両の軸受装置に適用したものである。
図１は、本実施の形態に係る軸受装置の一部および温度センサの径方向の断面図である。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 to 2 are diagrams showing an embodiment of a temperature sensor according to the present invention.
In the present embodiment, the temperature sensor according to the present invention is applied to a bearing device for a vehicle such as a railway vehicle or an automobile.
FIG. 1 is a radial sectional view of a part of a bearing device and a temperature sensor according to the present embodiment.

軸受装置１は、図１に示すように、転がり軸受１０と、転がり軸受１０を収容する軸箱２とで構成されている。
転がり軸受１０は、内輪１１と、外輪１２と、内輪１１および外輪１２の間で転動自在に配設された複数のボール（不図示）とを備え、内輪１１が車両の車軸３を回転可能に支持し、外輪１２が軸箱２に固定されている。なお、図示しないが、転がり軸受１０は、車軸３の軸方向に少なくとも２つ設けられ、車軸３は、複数の転がり軸受１０により回転可能に支持されている。 As illustrated in FIG. 1, the bearing device 1 includes a rolling bearing 10 and a shaft box 2 that houses the rolling bearing 10.
The rolling bearing 10 includes an inner ring 11, an outer ring 12, and a plurality of balls (not shown) disposed so as to be able to roll between the inner ring 11 and the outer ring 12, and the inner ring 11 can rotate the axle 3 of the vehicle. The outer ring 12 is fixed to the axle box 2. Although not shown, at least two rolling bearings 10 are provided in the axial direction of the axle 3, and the axle 3 is rotatably supported by a plurality of rolling bearings 10.

軸箱２の外周面２ａには、温度センサ２０が取り付けられている。
温度センサ２０は、伝熱性を有する筐体２１内に、温度検出素子２３の実装されたプリント基板２２が配設されている。本実施の形態において、プリント基板２２は、図１に示すように、筐体２１の軸箱２との接触面と、プリント基板２２のプリント面とが平行に支持されている。また、プリント基板２２は、温度検出素子２３の実装面と反対側の面が、筐体２１の前記接触面と対向するように支持されている。 A temperature sensor 20 is attached to the outer peripheral surface 2 a of the axle box 2.
The temperature sensor 20 is provided with a printed circuit board 22 on which a temperature detection element 23 is mounted in a case 21 having heat conductivity. In the present embodiment, as shown in FIG. 1, the contact surface of the housing 21 with the axle box 2 and the printed surface of the printed circuit board 22 are supported in parallel on the printed circuit board 22. The printed circuit board 22 is supported such that the surface opposite to the mounting surface of the temperature detection element 23 faces the contact surface of the housing 21.

図２は、温度センサ２０における、温度検出素子２３の実装されたプリント基板を示す図である。
図２に示すように、プリント基板２２には、温度検出素子２３が実装されている。
また、プリント基板２２の４隅には、基板取付ネジ部５０がそれぞれ形成されており、この基板取付ネジ部５０を介して、筐体２１に設けられたネジ穴に、伝熱性を有する金属ネジを螺合することによって、プリント基板２２が筐体２１内に支持されている。 FIG. 2 is a diagram showing a printed circuit board on which the temperature detection element 23 is mounted in the temperature sensor 20.
As shown in FIG. 2, a temperature detection element 23 is mounted on the printed circuit board 22.
Also, board mounting screw portions 50 are respectively formed at four corners of the printed circuit board 22, and metal screws having heat conductivity are passed through screw mounting holes provided in the housing 21 via the board mounting screw portions 50. The printed circuit board 22 is supported in the housing 21 by screwing together.

更に、プリント基板２２には、図２に示すように、プリント基板２２における、当該プリント基板２２を筐体２１内に支持する金属ネジの接触部から、プリント基板２２上に実装された温度検出素子２３の近傍まで伝熱パターン２２ａが形成されている。
具体的に、伝熱パターン２２ａは、図２に示すように、プリント基板２２上における、温度検出素子２３に最も近い金属ネジがプリント基板２２に接する部分（図２における丸で囲った基板取付ネジ部５０のネジ穴の外周部）から、温度検出素子２３に向かって放射状に形成され、更に、温度検出素子２３の近傍において、温度検出素子２３の外周を円環状にとり囲む形状となっている。従って、図２中の丸で囲った基板取付ネジ部５０のネジ穴を介して筐体２１のネジ穴に螺合された金属ネジは伝熱パターン２２ａと接することになる。また、温度検出素子２３では、周囲（３６０°）の伝熱パターンから放射される熱が検出されることになる。 Further, as shown in FIG. 2, the printed circuit board 22 includes a temperature detection element mounted on the printed circuit board 22 from a contact portion of a metal screw that supports the printed circuit board 22 in the housing 21. The heat transfer pattern 22 a is formed up to the vicinity of 23.
Specifically, as shown in FIG. 2, the heat transfer pattern 22 a is a portion on the printed circuit board 22 where the metal screw closest to the temperature detection element 23 contacts the printed circuit board 22 (a board mounting screw surrounded by a circle in FIG. 2). The outer periphery of the screw hole of the portion 50 is formed radially toward the temperature detection element 23, and further has a shape surrounding the outer periphery of the temperature detection element 23 in an annular shape in the vicinity of the temperature detection element 23. Therefore, the metal screw screwed into the screw hole of the housing 21 through the screw hole of the board mounting screw part 50 surrounded by a circle in FIG. 2 comes into contact with the heat transfer pattern 22a. Further, the temperature detection element 23 detects the heat radiated from the surrounding (360 °) heat transfer pattern.

更に、伝熱パターン２２ａは、図２に示すように、温度検出素子２３の底部がプリント基板２２に面する位置にも形成されている。つまり、温度検出素子２３は、その真下に形成された伝熱パターンから放射される熱も検出するようになっている。但し、温度検出素子２３の底部が面する位置に形成される伝熱パターンは、図２に示すように、温度検出素子２３がプリント基板２２と電気的に接触している部分（温度検出素子２３の両端部）を避けるように形成されている。   Furthermore, the heat transfer pattern 22 a is also formed at a position where the bottom of the temperature detecting element 23 faces the printed circuit board 22 as shown in FIG. 2. That is, the temperature detection element 23 detects heat radiated from the heat transfer pattern formed immediately below the temperature detection element 23. However, as shown in FIG. 2, the heat transfer pattern formed at the position where the bottom of the temperature detection element 23 faces is a portion where the temperature detection element 23 is in electrical contact with the printed circuit board 22 (temperature detection element 23 Are formed so as to avoid the both ends of the.

また、伝熱パターン２２ａは、ひとつながりに形成されていると共に、プリント基板２２に形成された、不図示の他の電気回路（センサ回路など）のパターンとは独立に形成されている。
上記構成の温度センサ２０が軸箱２に取り付けられた軸受装置１は、車軸３の回転によって発する熱で転がり軸受１０が発熱し、更に、この熱は、軸箱２を介して、当該軸箱２に接している温度センサ２０の筐体２１へと伝わる。筐体２１に伝わった熱は、筐体２１内に放熱されると共に、プリント基板２２を筐体２１内に支持している金属ネジへと伝わる。 In addition, the heat transfer pattern 22a is formed in a single line and is formed independently of the pattern of other electric circuits (not shown) (such as sensor circuits) formed on the printed circuit board 22.
In the bearing device 1 in which the temperature sensor 20 having the above-described configuration is attached to the axle box 2, the rolling bearing 10 generates heat by heat generated by the rotation of the axle 3, and this heat is further transmitted through the axle box 2 to the axle box. 2 is transmitted to the housing 21 of the temperature sensor 20 in contact with the temperature sensor 20. The heat transmitted to the housing 21 is dissipated in the housing 21 and is transmitted to a metal screw that supports the printed circuit board 22 in the housing 21.

プリント基板２２における、温度検出素子２３に最も近い基板取付ネジ部５０のネジ穴外周には、先述したように、伝熱パターン２２ａが形成されているため、筐体２１から金属ネジへと伝わってきた熱は、伝熱パターン２２ａへと伝わる。伝熱パターン２２ａに伝わった熱は、温度検出素子２３の周囲（３６０°）及び真下から放射され、温度検出素子２３は、筐体２１から伝わる基板周辺の熱に加え、伝熱パターン２２ａを伝わってきた熱も検出する。   Since the heat transfer pattern 22a is formed on the outer periphery of the screw hole of the board mounting screw portion 50 closest to the temperature detecting element 23 in the printed board 22, as described above, the heat is transferred from the housing 21 to the metal screw. The heat is transferred to the heat transfer pattern 22a. The heat transmitted to the heat transfer pattern 22a is radiated from around (360 °) and directly below the temperature detection element 23. The temperature detection element 23 is transmitted through the heat transfer pattern 22a in addition to the heat around the substrate transmitted from the housing 21. It also detects the heat that has come.

ここで、伝熱パターン２２ａを伝わる熱を無視すると（従来の構成）、筐体２１の軸箱２との接触部を介して筐体２１内に伝わってくる熱は、温度検出素子２３に到達するまでに、プリント基板２２及びプリント基板２２と筐体２１の前記接触部との間の空間において温度が降下したものとなる。
一方、伝熱パターン２２ａに伝わる熱は、筐体２１との間に伝熱性を有する金属ネジが介在するのみであり、プリント基板２２及び空間を介在する場合よりも温度の降下が少ない。従って、伝熱パターン２２ａを伝わってきた熱も検出する本発明の構成の方が、転がり軸受１０の温度を、より高精度に測定することが可能である。 Here, if the heat transmitted through the heat transfer pattern 22a is ignored (conventional configuration), the heat transferred into the housing 21 through the contact portion of the housing 21 with the axle box 2 reaches the temperature detection element 23. Until then, the temperature is lowered in the printed board 22 and the space between the printed board 22 and the contact portion of the housing 21.
On the other hand, the heat transferred to the heat transfer pattern 22a is merely a metal screw having heat transferability between the case 21 and the temperature drop is smaller than when the printed circuit board 22 and the space are interposed. Therefore, the configuration of the present invention that also detects the heat transmitted through the heat transfer pattern 22a can measure the temperature of the rolling bearing 10 with higher accuracy.

以上、本実施の形態の温度センサ２０は、筐体２１の熱を、温度検出素子２３の実装されたプリント基板２２に形成した伝熱パターン２２ａを介して、温度検出素子２３の近傍まで伝えることが可能である。これにより、転がり軸受１０の温度を、より高精度に測定することができる。
また、伝熱パターン２２ａを、プリント基板２２の他の電気回路のパターンとは独立して形成したので、例えば、ネジ部で筐体２１に導通しても、他の電気回路とは絶縁されているため、他の電気回路に悪影響が及ぶのを防ぐことができる。 As described above, the temperature sensor 20 of the present embodiment transmits the heat of the casing 21 to the vicinity of the temperature detection element 23 through the heat transfer pattern 22a formed on the printed circuit board 22 on which the temperature detection element 23 is mounted. Is possible. Thereby, the temperature of the rolling bearing 10 can be measured with higher accuracy.
Further, since the heat transfer pattern 22a is formed independently of the pattern of the other electric circuit of the printed circuit board 22, for example, even if the heat conduction pattern 22a is conducted to the housing 21 by the screw portion, it is insulated from the other electric circuit. Therefore, adverse effects on other electric circuits can be prevented.

上記実施の形態において、プリント基板２２は、発明１乃至５のいずれか１の回路基板に対応する。
なお、上記実施の形態においては、温度センサ２０を、センサ素子として、温度検出素子２３のみを有する構成としたが、これに限らず、温度検出素子２３に加えて、振動検出素子等を有するマルチセンサとして構成しても良い。これによって、温度による軸受の異常検出だけでなく、振動など他の要素による異常検出を行うことができる。 In the above-described embodiment, the printed circuit board 22 corresponds to any one of the circuit boards of the inventions 1 to 5.
In the above embodiment, the temperature sensor 20 has only the temperature detection element 23 as a sensor element. However, the present invention is not limited to this, and a multi-sensor having a vibration detection element or the like in addition to the temperature detection element 23 is used. You may comprise as a sensor. As a result, not only the abnormality of the bearing due to the temperature but also the abnormality can be detected by other factors such as vibration.

また、上記実施の形態においては、金属ネジがプリント基板２２に接する部分から形成する伝熱パターン２２ａを、プリント基板２２における、温度検出素子２３の近傍で、その外周を囲むように形成すると共に、温度検出素子２３の底部が面する位置まで形成するようにしたが、この構成に限らず、外周を囲む形状とするか、底部が面する位置まで形成するかのいずれか一方の構成としても良い。   In the above embodiment, the heat transfer pattern 22a formed from the portion where the metal screw is in contact with the printed board 22 is formed so as to surround the outer periphery of the printed board 22 in the vicinity of the temperature detecting element 23, The temperature detecting element 23 is formed up to the position where the bottom portion faces, but the present invention is not limited to this configuration, and may be either a shape surrounding the outer periphery or a position where the bottom portion is formed. .

また、上記実施の形態においては、温度検出素子２３を伝熱パターンで円環状に囲む構成としたが、円環状に限らず、例えば、温度検出素子２３の外周形状に沿って囲むなど、他の形状で囲む構成としても良い。
また、上記実施の形態においては、プリント基板２２を筐体２１に支持する金属ネジを介して、伝熱パターン２２ａへと筐体２１の熱を伝える構成としたが、これに限らず、筐体２１の熱を効率よく伝熱パターン２２ａへと伝えることができる構成であれば、他の構成としても良い。 Moreover, in the said embodiment, although it was set as the structure which encloses the temperature detection element 23 in an annular | circular shape with a heat-transfer pattern, it is not limited to an annular shape, For example, it surrounds along the outer periphery shape of the temperature detection element 23, etc. It is good also as a structure enclosed with a shape.
Moreover, in the said embodiment, although it was set as the structure which transmits the heat | fever of the housing | casing 21 to the heat-transfer pattern 22a via the metal screw which supports the printed circuit board 22 to the housing | casing 21, not only this but a housing | casing Other configurations may be used as long as the heat of 21 can be efficiently transmitted to the heat transfer pattern 22a.

また、上記実施の形態においては、本発明に係る温度センサ２０を、鉄道車両や自動車等の車両の軸受装置１に取り付ける場合について適用したが、これに限らず、本発明の主旨を逸脱しない範囲で他の場合にも適用可能である。   Moreover, in the said embodiment, although applied about the case where the temperature sensor 20 which concerns on this invention is attached to the bearing apparatus 1 of vehicles, such as a railway vehicle and a motor vehicle, not only this but the range which does not deviate from the main point of this invention It can be applied to other cases.

本実施の形態に係る軸受装置の一部および温度センサの径方向の断面図である。It is sectional drawing of the radial direction of a part of bearing device and temperature sensor which concern on this Embodiment. 本実施の形態に係る温度センサにおける、温度検出素子の実装されたプリント基板を示す図である。It is a figure which shows the printed circuit board with which the temperature detection element was mounted in the temperature sensor which concerns on this Embodiment. 従来の軸受装置の一部および軸受センサの径方向の断面図である。It is sectional drawing of the radial direction of some conventional bearing apparatuses and a bearing sensor. 従来の温度センサにおける、温度検出素子の実装されたプリント基板を示す図である。It is a figure which shows the printed circuit board with which the temperature detection element was mounted in the conventional temperature sensor.

符号の説明Explanation of symbols

１ 軸受装置
２ 軸箱
１１ 内輪
１２ 外輪
２ａ 軸箱外周
８１ 筐体
２２、８２ プリント基板
２３、８５ 温度検出素子
４３、８６ ケーブル
５０、９０ 基板取付ネジ部
４１、９１ ボルト
４２、９２ ボルト穴
２０，８０ 温度センサ
２２ａ 伝熱パターン DESCRIPTION OF SYMBOLS 1 Bearing apparatus 2 Shaft box 11 Inner ring 12 Outer ring 2a Shaft box outer periphery 81 Case 22, 82 Printed circuit board 23, 85 Temperature detection element 43, 86 Cable 50, 90 Board attachment screw part 41, 91 Bolt 42, 92 Bolt hole 20, 80 Temperature sensor 22a Heat transfer pattern

Claims (9)

伝熱性を有する筐体内に、温度検出素子の実装された回路基板を配設した構成の温度センサであって、
前記回路基板には基板取付用のネジ穴が形成されており、
前記回路基板は、伝熱性を有する支持部材である金属ネジを前記基板取付用のネジ穴を介して、前記基板取付用のネジ穴に対応して前記筐体に設けられたネジ穴に螺合することによって、前記筐体内に支持され、
前記回路基板における、前記金属ネジを前記基板取付用のネジ穴を介して前記筐体のネジ穴に螺合時において前記金属ネジの頭部が前記回路基板と接する前記基板取付用のネジ穴の外周部から前記実装された温度検出素子の近傍まで、前記筐体の熱を前記温度検出素子に伝える伝熱パターンを形成し、
前記金属ネジによって前記回路基板を前記筐体内に支持した状態において、当該金属ネジの頭部と伝熱パターンとが前記回路基板上において接触するように構成したことを特徴とする温度センサ。 A temperature sensor having a configuration in which a circuit board on which a temperature detection element is mounted is disposed in a case having heat conductivity,
The circuit board is formed with a screw hole for mounting the board,
The circuit board is screwed into a screw hole provided in the housing corresponding to the screw hole for mounting the board through a screw hole for mounting the board through a metal screw which is a support member having heat conductivity. By being supported in the housing,
In the circuit board, when the metal screw is screwed into the screw hole of the housing through the board mounting screw hole, the head of the metal screw is in contact with the circuit board. From the outer periphery to the vicinity of the mounted temperature detection element, a heat transfer pattern is formed that transfers heat of the housing to the temperature detection element ,
A temperature sensor , wherein the head of the metal screw and a heat transfer pattern are in contact with each other on the circuit board in a state where the circuit board is supported in the housing by the metal screw . 前記筐体は、筐体面が温度検出対象に接触する状態で当該温度検出対象に取り付けられることを特徴とする請求項１に記載の温度センサ。  The temperature sensor according to claim 1, wherein the casing is attached to the temperature detection target in a state where the casing surface is in contact with the temperature detection target. 前記温度検出素子は、リードレス型の素子であり、
前記伝熱パターンを、前記実装された温度検出素子の前記回路基板との電気的な接触部分を避けて、前記回路基板における、前記温度検出素子の底部が面する位置まで形成したことを特徴とする請求項１又は請求項２に記載の温度センサ。 The temperature detection element is a leadless element,
Characterized in that said heat transfer pattern, avoiding the electrical contact portion between the circuit board of the mounting temperature sensing elements, in the circuit board and formed to a position where the bottom of the temperature detecting element faces The temperature sensor according to claim 1 or 2 . 前記伝熱パターンを、当該伝熱パターンの一部が、前記実装された温度検出素子の外周を囲むように形成したことを特徴とする請求項１乃至請求項３のいずれか１項に記載の温度センサ。 The heat transfer pattern, part of the heat transfer pattern, according to any one of claims 1 to 3, characterized in that formed so as to surround the outer periphery of the mounting temperature sensing elements Temperature sensor. 前記実装された温度検出素子の外周を囲む前記伝熱パターンの一部を、円環形状としたことを特徴とする請求項４に記載の温度センサ。  5. The temperature sensor according to claim 4, wherein a part of the heat transfer pattern surrounding an outer periphery of the mounted temperature detection element has an annular shape. 前記実装された温度検出素子の外周を囲む前記伝熱パターンの一部を、前記温度検出素子の周囲３６０°を囲んで形成したことを特徴とする請求項４又は請求項５に記載の温度センサ。  6. The temperature sensor according to claim 4, wherein a part of the heat transfer pattern surrounding an outer periphery of the mounted temperature detection element is formed to surround 360 ° around the temperature detection element. . 前記伝熱パターンを、前記金属ネジの頭部が前記回路基板と接している部分から前記実装された温度検出素子の近傍に向けて放射状に延びるように形成したことを特徴とする請求項１乃至請求項６のいずれか１項に記載の温度センサ。  The heat transfer pattern is formed so as to extend radially from a portion where the head of the metal screw is in contact with the circuit board toward the vicinity of the mounted temperature detection element. The temperature sensor of any one of Claim 6. 前記伝熱パターンを、他の電気回路のパターンとは独立に形成したことを特徴とする請求項１乃至請求項７のいずれか１項に記載の温度センサ。 The temperature sensor according to any one of claims 1 to 7 , wherein the heat transfer pattern is formed independently of a pattern of another electric circuit. 請求項１乃至請求項８のいずれか１項に記載の温度センサを備えた車軸を有する車両。  A vehicle having an axle including the temperature sensor according to any one of claims 1 to 8.
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