JP4912750B2 - Liquid crystal display device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a liquid crystal display device including a light shielding layer that shields a light shielding region arranged along an outer periphery of a display region for displaying an image, and a method for manufacturing the same.

  Currently, a generally provided liquid crystal display device is configured by interposing a liquid crystal between an array substrate and a counter substrate. And the part except the liquid crystal sealing port of the periphery of these array substrates and a counter substrate is being fixed with the adhesive agent, and this liquid crystal sealing port is sealed with the sealing agent. Further, between the array substrate and the counter substrate, plastic beads having a uniform particle diameter are interspersed as spacers in order to keep the distance between the array substrate and the counter substrate constant.

  Furthermore, among these liquid crystal display devices, a liquid crystal display device capable of color display includes R (Red), G (Green) and B on either the array substrate or the counter substrate of the liquid crystal display device. A color filter layer composed of a colored layer of (Blue) is formed. As a display method of this liquid crystal display device, for example, TN (Twisted Nematic) type, ST (Stock Time) type, GH (Guest Host) type, ECB (Electrically Controlled Birefringence) type, ferroelectric liquid crystal, etc. are used. ing. Further, as the sealant, for example, a thermosetting type curable by heat or an ultraviolet curable type acrylic or epoxy type adhesive curable by ultraviolet irradiation is used.

  In addition, as a liquid crystal display device capable of color display, scanning lines and signal lines are provided in a lattice pattern on an insulating substrate, and amorphous silicon (a-Si) is applied to the semiconductor layer corresponding to the intersections of these scanning lines and signal lines. A thin film transistor (TFT) is provided, and an array substrate is provided as an active matrix substrate in which pixel electrodes are electrically connected to the thin film transistor. A counter substrate provided with a counter electrode is disposed opposite to the array substrate, and a color filter layer is provided on the counter electrode of the counter substrate. Further, a frame portion having a light shielding property is provided on the periphery of the color filter layer. Further, an electrode transfer material, which is a transfer for applying a voltage from the array substrate to the counter substrate, is disposed at the periphery of the screen between the array substrate and the counter substrate. As the electrode transition material, a silver paste or the like in which conductive silver particles are pasted with a binder is used. Each of the array substrate and the counter substrate is sandwiched between polarizing plates, and is configured to display a color image as an optical shutter.

  In this type of liquid crystal display device, a color filter layer and a frame portion are generally formed on one main surface of either the array substrate or the counter substrate by photolithography (for example, Patent Document 1). However, this photolithography requires about four processing steps such as coating, exposure, development, and baking (baking), and it is not easy to reduce the manufacturing cost. Therefore, a method of forming a color filter layer by ink jet printing is known (for example, see Patent Documents 2 and 3).

As the ink jet method, a new receiving layer is provided on one main surface of either the array substrate or the counter substrate and dyed from the receiving layer (for example, see Patent Document 4), or these. A method in which a separate bank-like pattern protruding from the one main surface is provided on one main surface of either the array substrate or the counter substrate, and a colored layer is applied between the bank-like patterns (for example, patents) Reference 5) is known.
JP 2000-120702 A JP-A-10-170712 JP 2002-55223 A Japanese Patent Laid-Open No. 10-148713 JP 2000-353594 A

  However, when the color filter layer and the frame portion are formed by the above-described ink jet printing, a bank-like pattern is required, which may reduce the aperture ratio of the liquid crystal display device. Moreover, when forming a color filter layer and a frame part using photolithography, since four processes are required as a manufacturing process for forming these color filter layers and a frame part, manufacture is not easy. have.

  SUMMARY An advantage of some aspects of the invention is that it provides a liquid crystal display device that is easy to manufacture and has a low aperture ratio and a method for manufacturing the same.

  The present invention relates to a pixel having a color filter layer having a plurality of colored layers arranged in a display area for displaying an image on a light-transmitting substrate, and a light-shielding area arranged along the outer periphery of the display area A liquid crystal display device comprising a light shielding layer that shields light from the color filter layer when the color filter layer is formed on the light transmissive substrate with the material used for the color filter layer. A light receiving layer is formed around the outer periphery of the color filter layer by forming a receiving pattern on the periphery, applying a light shielding material at the periphery of the color filter layer, and receiving the light receiving material with the receiving pattern. .

  Then, when forming the color filter layer on the light transmissive substrate, a receiving pattern is formed on the periphery of the color filter layer with the material used for the color filter layer, and then the light is blocked at the periphery of the color filter layer. By forming a light shielding layer that surrounds the outer periphery of the color filter layer by applying a functional material and receiving it with a receiving pattern, the light shielding layer can be formed on the periphery of the color filter layer without forming a bank-like pattern or the like Therefore, the aperture ratio is difficult to decrease. Further, since the manufacturing process is reduced as compared with the case where a separate light shielding layer is formed using photolithography, the liquid crystal display device can be easily manufactured.

  According to the present invention, when the color filter layer is formed on the light transmissive substrate, a receiving pattern is formed on the periphery of the color filter layer with the material used for the color filter layer, and then the color filter layer is formed. By applying a light-shielding material at the periphery and receiving it with a receiving pattern, a light-shielding layer surrounding the outer periphery of the color filter layer is formed, so that the aperture ratio is unlikely to decrease. In addition, since the manufacturing process can be reduced, the liquid crystal display device can be easily manufactured.

  The configuration of the first embodiment of the liquid crystal display device of the present invention will be described below with reference to the drawings.

  1 to 4, reference numeral 1 denotes a liquid crystal panel which is a liquid crystal display panel as a flat display device. The liquid crystal panel 1 is a liquid crystal as an active matrix type liquid crystal display element using a thin film transistor (TFT). It is a display device. The liquid crystal panel 1 includes a substantially rectangular flat array substrate 2 that is a light-transmitting substrate as an active matrix substrate, a counter substrate 3 disposed opposite to the array substrate 2, and the array substrate 2 and the counter substrate. The array substrate 2 and the counter substrate 3 are bonded together by a sealing material 5 which is a sealing member while forming a predetermined gap for sandwiching the liquid crystal layer 4. It has been.

  The liquid crystal panel 1 is, for example, a transmission type that selectively transmits light from the array substrate 2 side toward the counter substrate 3 side. For this reason, a backlight unit BL that illuminates the liquid crystal panel 1 from the back surface is provided on the back surface of the transmissive liquid crystal panel 1 (the outer surface side of the array substrate 2).

  The array substrate 2 is, for example, an XGA (eXtended Graphics Array) type thin film transistor (TFT) substrate, and has a light transmissive substrate as a substantially transparent rectangular flat plate-like insulating substrate, that is, a glass substrate 7 which is a light transmissive substrate. is doing.

  Further, a screen portion 8 that is an image display region as a display region for displaying an image is formed in the central portion on the surface that is one main surface of the glass substrate 7. A plurality of pixels 9 are arranged in a matrix on the screen portion 8 on the glass substrate 7, and the screen portion 8 is configured by these pixels 9. The plurality of pixels 9 are formed along the vertical direction of the glass substrate 7, and m pixels are formed along the horizontal direction of the glass substrate 7. Accordingly, n × m pixels 9 are formed on the glass substrate 7. Further, each of the pixels 9 corresponds to a pixel electrode 11, an auxiliary capacitance element 12 as a pixel auxiliary capacitance element as a storage capacitance element forming the auxiliary capacitance CS, and a thin film transistor 13 as a switching element. Are arranged.

  Further, on the surface of the glass substrate 7, a plurality (m) of scanning lines 15 which are gate electrode wirings as electrode wirings in the screen portion 8 are arranged in the width direction of the glass substrate 7 (the row direction of the pixel electrodes 11). Are arranged along. These scanning lines 15 are spaced in parallel at equal intervals in the lateral direction of the glass substrate 7. In the screen portion 8, a plurality (n) of signal lines 16 as image signal wirings as electrode wirings are provided between the scanning lines 15 in the vertical direction of the glass substrate 7 (column direction of the pixel electrodes 11). ). These signal lines 16 are spaced in parallel at equal intervals in the lateral direction of the glass substrate 7.

  Therefore, the scanning lines 15 and the signal lines 16 are arranged in a matrix shape that intersects the glass substrate 7 and has a lattice shape. A pixel electrode 11, an auxiliary capacitance element 12, and a thin film transistor 13 are provided for each pixel 9 corresponding to each intersection of the scanning line 15 and the signal line 16.

  On the other hand, in the peripheral area OA around the screen portion 8 of the glass substrate 7, an elongated rectangular plate-shaped Y driver circuit 18 as a signal line driving circuit including a driving TFT for driving the signal line 16 is disposed. The Y driver circuit 18 is provided on one side edge along the horizontal direction of the glass substrate 7. Further, the Y driver circuit 18 is provided along the vertical direction of the glass substrate 7, and one end of each scanning line 15 on the glass substrate 7 is electrically connected. Further, an X driver circuit 19 in the form of an elongated rectangular plate as a scanning line driving circuit including a driving TFT for driving the scanning line 15 is provided at one end along the vertical direction of the peripheral area OA around the screen portion 8 of the glass substrate 7. Is arranged. The X driver circuit 19 is provided along the horizontal direction of the glass substrate 7, and one end of each signal line 16 on the glass substrate 7 is electrically connected. The Y driver circuit 18 and the X driver circuit 19 are connected to each signal line from the X driver circuit 19 in synchronization with a timing at which the thin film transistor 13 is turned on / off by a scanning signal supplied from the Y driver circuit 18 to each scanning line 15. By supplying pixel signals to 16, a predetermined image is displayed on the screen portion 8 of the array substrate 2. The driving TFTs included in the Y driver circuit 18 and the X driver circuit 19 are constituted by an n-channel thin film transistor and a p-channel thin film transistor having a polysilicon semiconductor layer.

  Further, an unshown undercoat layer (undercoating layer) made of a silicon nitride film, a silicon oxide film or the like is laminated on the surface of the glass substrate 7 to form a film. On this undercoat layer, a top gate type thin film transistor 13 as a top gate type structure is disposed as one pixel component. That is, the thin film transistor 13 is a pixel TFT element as a semiconductor element as well as a switching element, and n × m pieces of thin film transistors 13 are arranged in the screen portion 8. These thin film transistors 13 include a source electrode 21 and a drain electrode 22 formed on the undercoat layer. The source electrode 21 and the drain electrode 22 are provided in a state where they are electrically insulated with a predetermined gap therebetween. The signal line 16 is provided for the source electrode 21, and the auxiliary capacitive element 12 is provided for the drain electrode 22. Connected.

  Further, an active layer 23 as a semiconductor layer is provided between the source electrode 21 and the drain electrode 22. The active layer 23 is provided on the undercoat layer including the source electrode 21 and the drain electrode 22. The active layer 23 is a polysilicon semiconductor layer as a polycrystalline semiconductor layer made of polysilicon (p-Si) as a polycrystalline semiconductor. That is, the active layer 23 is an island-shaped polysilicon thin film formed by patterning after annealing amorphous silicon (a-Si) as an amorphous semiconductor, which is excimer laser melting crystallization.

  On the active layer 23, a conductive gate electrode 24 is laminated and formed. The gate electrode 24 is integrally connected to one side edge of the scanning line 15 and constitutes a part of the scanning line 15. Here, the gate electrode 24 has a longitudinal direction orthogonal to the longitudinal direction of the active layer 23. Further, the gate electrode 24 has a width dimension smaller than the width dimension of the active layer 23 and is provided in the central portion on the active layer 23.

  Further, a transparent insulating film T having a thickness of about 3.0 μm is formed in a portion corresponding to the screen portion 8 on the undercoat layer, and the drain electrode 22 of the thin film transistor 13 is opened in the transparent insulating film T. A contact hole HA having a size of 20 × 20 μm in the top view is formed. On the transparent insulating film T including the contact hole HA, a transparent pixel electrode 11 as a pixel ITO (Indium Tin Oxide) is laminated and provided. The pixel electrode 11 is provided adjacent to a portion where the thin film transistor 13 on the undercoat layer is provided, and is electrically connected to the drain electrode 22 of the thin film transistor 13. That is, the pixel electrode 11 is provided corresponding to each of the pixels 9 arranged in a matrix in the screen portion 8 and is controlled by the thin film transistor 13 in which the drain electrode 22 is electrically connected to the pixel electrode 11. . The pixel electrode 11 is electrically connected to the auxiliary capacitance electrode 12a of the auxiliary capacitance element 12, and has the same potential as the source electrode 21 of the thin film transistor 13 and the auxiliary capacitance electrode 12a of the auxiliary capacitance element 12. Here, the auxiliary capacitance electrode 12a of the auxiliary capacitance element 12 is formed of an impurity-doped polysilicon film. The auxiliary capacitance line 12b of the auxiliary capacitance element 12 is set to a predetermined potential.

  Further, between the pixel electrode 11 of any pixel 9 of the screen portion 8 of the array substrate 2 and the source electrode 21 of the thin film transistor 13, an elongated cylindrical shape having a longitudinal direction along the thickness direction of the array substrate 2. A spacer 25 which is a columnar spacer is projected. These spacers 25 are provided on each of the pixels 9 positioned in a predetermined number, for example, three pixel 9 portions in the vertical and horizontal directions of the screen portion 8. That is, the spacers 25 are provided on the screen portion 8 of the array substrate 2 so as to be spaced apart at equal intervals. Further, an alignment film (not shown) is laminated on the entire surface of the undercoat layer including the spacer 25, the pixel electrode 11, and the thin film transistor 13.

  The counter substrate 3 includes a light transmissive substrate as a substantially transparent rectangular flat plate-like insulating substrate, that is, a glass substrate 32 which is a light transmissive substrate. A color filter layer 33 is laminated on the surface which is one main surface of the glass substrate 32 facing the array substrate 2. The color filter layer 33 is provided so as to protrude from the surface of the glass substrate 32.

  Specifically, the color filter layer 33 includes a red filter portion 34 that is a colored layer of at least two colors, for example, a red (R) color, and a green (Green: G) color. Three dots of a green filter portion 35 as a first color filter layer that is a colored layer and a blue filter portion 36 as a second color filter layer that is a blue (Blue: B) colored layer are formed on the counter substrate 3. It is configured to be repeatedly arranged in each of the vertical direction and the horizontal direction.

  Here, the red filter part 34 is formed of an ultraviolet curable acrylic resin resist, for example, CRY-S623C (manufactured by Fuji Film Electronics Materials Co., Ltd.) as a colored resin that disperses a red pigment and transmits red component light. Has been. The green filter unit 35 is formed of an ultraviolet curable acrylic resin resist, for example, CGY-S624D (manufactured by Fuji Film Electronics Materials Co., Ltd.) as a colored resin that disperses a green pigment and transmits green component light. ing. Further, the blue filter portion 36 is formed of an ultraviolet curable acrylic resin resist as a colored resin that disperses a blue pigment and transmits blue component light, for example, CBY-S625C (manufactured by Fuji Film Electronics Materials Co., Ltd.). ing. At this time, each of the red filter part 34, the green filter part 35, and the blue filter part 36 is formed to have an equal film thickness of, for example, 2.0 μm.

  The color filter layer 33 composed of the plurality of red filter portions 34, green filter portions 35, and blue filter portions 36 corresponds to the array substrate 2 when the counter substrate 3 is opposed to the array substrate 2. It is provided so as to face each other corresponding to each pixel 9 of the color. Further, on the surface of the color filter layer 33, a rectangular flat counter electrode 37 that is a common electrode as a common electrode is laminated and provided in the screen portion 8. The counter electrode 37 is made of a transparent conductive member such as an ITO film as a transparent electrode. Further, when the surface of the counter substrate 3 and the surface of the array substrate 2 are opposed to each other, the counter electrode 37 applies to all the pixels 9 over the entire screen portion 8 of the glass substrate 7 of the array substrate 2. It is a large rectangular electrode that is arranged in common and faces all n × m pixel electrodes 11 through the liquid crystal layer 4. In other words, the counter electrode 37 is disposed so as to face the pixel electrode 11 of the array substrate 2 when the counter substrate 3 is opposed to the array substrate 2.

  Further, on the glass substrate 32 of the counter substrate 3, a bank pattern 38, which is a partition wall as a bank-shaped receiving pattern covering the periphery of the color filter layer 33 provided on the glass substrate 32, is provided. It has been. The bank pattern 38 is provided at a position separated from the outermost peripheral portion of the color filter layer 33 by a predetermined distance. That is, the bank pattern 38 is formed by continuously forming a light shielding region 39 formed in a frame shape on the outer periphery of the screen portion 8 around the color filter layer 33 through a predetermined interval except for the liquid crystal injection port 40. Surrounding.

  Further, the bank pattern 38 protrudes from the surface of the glass substrate 32 as much as the height of the color filter layer 33. Accordingly, the bank pattern 38 forms a bank A as a groove which is a gap having a concave cross section between the bank pattern 38 and the peripheral edge of the color filter layer 33. That is, the bank pattern 38 functions as a frame for blocking the light shielding ink C when the liquid light shielding ink C is applied to the bank A between the bank pattern 38 and the color filter layer 33. The inclination of the C color filter layer 33 to the outside (avalanche) is prevented.

  Further, the bank pattern 38 is made of the same material as that of the colored layer located on the outermost side of the color filter layer 33, for example, the blue filter portion 36, and is simultaneously formed in the same process as the blue filter portion 36. That is, the bank pattern 38 is formed of the same material as that used for any of the red filter portion 34, the green filter portion 35, and the blue filter portion 36 of the color filter layer 33.

  Further, a frame-shaped frame portion formed by injecting liquid light-shielding ink C into a bank A having a concave section formed on the glass substrate 32 between the bank pattern 38 and the peripheral edge of the color filter layer 33. The light shielding layer 41 is provided. The light shielding layer 41 shields the light shielding area 39, and is provided by applying a liquid light shielding ink C with an ink jet or a dispenser. Here, as the light-shielding ink C, a resin to which a black pigment or the like is added is used. Further, a solvent can be mixed with the light-shielding ink C as appropriate in order to improve the coating property. Therefore, the light shielding layer 41 has a thickness smaller than the thickness dimension of the color filter layer 33 in order to prevent leakage due to the liquid light shielding material before curing from the bank A between the bank pattern 38 and the periphery of the color filter layer 33. It has a size. Further, the light shielding layer 41 and the bank pattern 38 constitute a light shielding part 42 that surrounds the outer periphery of the screen portion 8 in the peripheral area OA and is disposed in the light shielding area 39. Further, an alignment film (not shown) is laminated on the entire surface of the glass substrate 32 including the light shielding layer 41, the bank pattern 38, and the counter electrode 37.

  The counter substrate 3 is attached to the array substrate 2 with the counter electrode 37 side of the counter substrate 3 facing the pixel electrode 11 side of the array substrate 2. That is, the counter substrate 3 has each spacer 25 provided on the array substrate 2 in contact with the counter electrode 37 of the counter substrate 3 so that a predetermined interval is provided between the array substrate 2 and the counter substrate 3. The liquid crystal sealing region B is attached in a state of being separated in parallel so as to be formed.

  The liquid crystal layer 4 is formed by injecting and sandwiching a liquid crystal composition 43 having a positive dielectric anisotropy as a liquid crystal material between the alignment film of the counter substrate 3 and the alignment film of the array substrate 2. It is a light modulation layer. That is, the liquid crystal layer 4 is configured by sealing the liquid crystal composition 43 interposed between the alignment film of the counter substrate 3 and the alignment film of the array substrate 2 through the liquid crystal injection port 40. Further, the liquid crystal layer 4 forms a liquid crystal capacitor CL electrically parallel to the auxiliary capacitor CS of the auxiliary capacitor element 12 between the pixel electrode 11 of the array substrate 2 and the counter electrode 37 of the counter substrate 3.

  The sealing material 5 is a liquid crystal seal that seals the liquid crystal layer 4 in the liquid crystal sealing region B between the array substrate 2 and the counter substrate 3 at the peripheral edge between the array substrate 2 and the counter substrate 3. It is a stop. The sealing material 5 is bonded and fixed between the array substrate 2 and the counter substrate 3. The sealing material 5 is provided so as to cover the periphery of the screen portion 8 of the array substrate 2, and a liquid crystal sealing region B is formed between the screen portion 8 of the array substrate 2 and the counter substrate 3. . The sealing material 5 is provided between the bank pattern 38 and the light shielding layer 41 of the counter substrate 3 and a portion outside the screen portion 8 of the glass substrate 7 of the array substrate 2.

  Further, an electrode transition material (not shown) for applying a voltage from the array substrate 2 to the counter electrode 37 is formed around the seal material 5. This electrode transition material is formed on an electrode transition electrode (not shown) provided in the peripheral portion of the screen (not shown) between the array substrate 2 and the counter substrate 3.

  On the other hand, substantially rectangular flat plate-shaped polarizing plates 44 and 45 are laminated and attached to the back surface or outer surface of the glass substrate 7 of the array substrate 2 and the back surface or outer surface of the glass substrate 32 of the counter substrate 3, respectively. . These polarizing plates 44 and 45 cover substantially the entire back surface of the glass substrate 7 of the array substrate 2 and the back surface of the glass substrate 32 of the counter substrate 3.

  Next, a method for manufacturing the liquid crystal display device according to the first embodiment will be described.

  First, the film formation step and the patterning step are repeated to form the pixel electrode 11, the auxiliary capacitance element 12, the thin film transistor 13, the scanning line 15 and the signal line 16 on the screen portion 8 on the glass substrate 7, thereby forming the array substrate 2. Make it.

  Next, an ultraviolet curable acrylic resin resist in which a red pigment is dispersed, for example, CRY-S623C (manufactured by Fuji Film Electronics Materials Co., Ltd.) is applied on the glass substrate 32 with a spinner (not shown). A resist mask (not shown) is formed so that light is irradiated on a portion of the portion 32 to be colored red.

Thereafter, a pixel pattern is formed on the glass substrate 32 by irradiating with ultraviolet light of, for example, 100 mJ / cm ² at a wavelength of 365 nm through a resist mask to form a pixel pattern, and then hydroxylating containing a surfactant. Development is performed with a 1% aqueous solution of potassium (KOH) for 20 seconds to form a red filter portion 34 having a thickness of 2.0 μm.

  Further, photolithography is performed in the same manner as when the red filter portion 34 is formed, and a green filter portion 35 having a thickness of 2.0 μm is formed using, for example, CGY-S624D (manufactured by Fuji Film Electronics Materials Co., Ltd.). At the same time, for example, by using CBY-S625C (Fuji Film Electronics Materials Co., Ltd.), the blue filter part 36 having a film thickness of 2.0 μm is formed, and the color filter layer 33 is formed in the display region of the glass substrate 32.

  At this time, in the step of forming the blue filter portion 36, as shown in FIG. 5, the color filter on the glass substrate 32 is formed using the ultraviolet curable acrylic resin resist used when forming the blue filter portion 36. A bank pattern 38 is simultaneously formed on the outside of the layer 33.

  Thereafter, as shown in FIG. 6, a solution containing a solvent, an acrylic monomer, or the like is applied to the bank A between the bank pattern 38 and the peripheral edge of the color filter layer 33 by an application means 47 which is an inkjet nozzle or a dispenser. A light-shielding ink C as a light-shielding material, which is a black pigment-containing resin having a light-shielding resin in which a black pigment is dispersed, is applied and, as shown in FIG. 7, between the bank pattern 38 and the color filter layer 33. A 1.8 μm-thickness light-shielding layer 41 that functions as a light-shielding layer is formed in the bank A to produce a framed color filter substrate.

Next, an ITO film having a thickness of 500 m ⁻¹⁰ (Å) is formed on the color filter layer 33 by a sputtering method and then patterned to form the counter electrode 37.

Further, a photosensitive acrylic transparent resin such as NN600 (manufactured by JSR Corporation) is applied onto the array substrate 2 by spinner coating, dried at 90 ° C. for 10 minutes, and then passed through a photomask (not shown) at a wavelength of 365 nm at 80 mJ / Exposure is performed with an exposure amount of cm ² .

  Thereafter, the array substrate 2 is developed with an alkaline aqueous solution having a pH of 11.5 and then baked at 200 ° C. for 60 minutes to form a spacer 25 having a height of 5.2 μm on the array substrate 2.

Subsequently, for example, AL-3046 (manufactured by JSR Corporation) is applied to the entire surface of the array substrate 2 on which the spacers 25 are formed and the counter substrate 3 as an alignment film material, and 800 m ^-10 (Å) is applied. An alignment film (not shown) is formed on each of the substrate 2 and the counter substrate 3.

  After this, an adhesive to be the sealing material 5 is printed along the periphery of the alignment film of the counter substrate 3 excluding the portion where the liquid crystal composition 43 is injected, and then a voltage is applied from the array substrate 2 to the counter electrode 37. The electrode transfer material (not shown) is formed on the electrode transfer electrode (not shown) around the adhesive.

  Next, the alignment film of the array substrate 2 and the alignment film of the counter substrate 3 are made to face each other, and then the adhesive is cured by heating to form the seal material 5. The array substrate 2 and the counter substrate 3 are bonded with the seal material 5. to paste together.

  Thereafter, a portion not sealed by the sealing material 5 between the array substrate 2 and the counter substrate 3 becomes an injection port, and, for example, ZLI-1565 (manufactured by Merck Co., Ltd.) is dielectrically formed from the injection port. The liquid crystal composition 43 having a positive anisotropy is injected, and the liquid crystal composition 43 is interposed in the liquid crystal sealing region B between the array substrate 2 and the counter substrate 3.

  In this state, the injection port between the array substrate 2 and the counter substrate 3 is sealed using an ultraviolet curable resin as a sealing agent, and the liquid crystal panel 1 capable of color display is manufactured.

  Thereafter, the liquid crystal panel 1 was evaluated for lighting. As a result, the liquid crystal panel 1 had excellent display quality and sufficiently secured the light shielding property of the light shielding layer 41.

  As described above, according to the first embodiment, when the color filter layer 33 is formed on the glass substrate 32 of the counter substrate 3, the red filter portion 34, the green filter constituting the color filter layer 33 is formed. A bank pattern 38 is simultaneously formed on the outer side of the color filter layer 33 on the glass substrate 32 using the ultraviolet curable acrylic resin resist used in forming either the portion 35 or the blue filter portion 36. Thereafter, the light shielding ink C is applied to the bank A between the bank pattern 38 and the periphery of the color filter layer 33, and the light shielding layer 41 is applied to the bank A between the bank pattern 38 and the periphery of the color filter layer 33. It was set as the structure which forms.

  As a result, the bank pattern 38 that is stacked in two steps separately from the color filter layer 33 is formed, and the color filter layer 33 is compared with the case where the light shielding ink C is applied between the bank patterns 38 to form the light shielding layer. Since the light shielding layer 41 can be formed continuously to the periphery, the light shielding layer 41 is unlikely to overlap or enter the screen portion 8 of the liquid crystal panel 1, so that the aperture ratio of the liquid crystal panel 1 is unlikely to decrease. Therefore, the liquid crystal panel 1 having a large aperture ratio can be obtained.

  Also, compared to the case where the light shielding layer 41 is formed separately from the color filter layer using photolithography that requires many processing steps such as coating, exposure, development and baking (baking), the manufacturing process of the light shielding layer 41 Therefore, the manufacture of the color filter layer 33 and the light shielding layer 41 can be facilitated. Accordingly, the manufacturing cost of the liquid crystal panel 1 can be reduced, and the display quality excellent by lighting evaluation and the light shielding property of the light shielding layer 41 can be sufficiently ensured. Therefore, the liquid crystal panel 1 having a high display quality can be provided at low cost.

  In the first embodiment, the same material as that of any one of the red filter part 34, the green filter part 35, and the blue filter part 36 located on the outermost periphery of the color filter layer 33 is used from the periphery of the color filter layer 33. The bank pattern 38 was formed by being laminated on the outer glass substrate 32. However, according to the cell gap between the array substrate 2 and the counter substrate 3 as in the second embodiment shown in FIG. When the red filter unit 34, the green filter unit 35, and the blue filter unit 36 are sequentially manufactured, the same material as the red filter unit 34, the green filter unit 35, and the blue filter unit 36 is laminated in multiple layers to form a bank pattern 38. You can also

  That is, as shown in FIG. 8, the red filter part 34 is formed on the glass substrate 32. At this time, with the same material as the red filter portion 34, a lower layer pattern is formed at each of a position continuous outside the periphery of the color filter layer 33 and a position spaced a predetermined distance outside the periphery of the color filter layer 33. 51 is formed.

  Thereafter, after the green filter portion 35 is formed adjacent to the red filter portion 34, the blue filter portion 36 is formed between the green filter portion 35 and the red filter portion 34. At this time, the same material as the blue filter portion 36 is laminated on the lower layer pattern 51 to form an upper layer pattern 52, and the lower layer pattern 51 and the upper layer pattern 52 have a laminated structure of 3.5 μm in thickness. A bank pattern 38 is formed.

  Next, as shown in FIG. 9, a light-shielding ink C is applied to the bank A between the bank patterns 38, and as shown in FIG. 10, 3 μm thicker than the color filter layer 33 is formed in the gap between the bank patterns 38. A light shielding layer 41 is formed to produce a framed color filter substrate.

  As a result, on the lower layer pattern 51 in which the same material as the red filter part 34 is laminated on the glass substrate 32 in the same process, the upper layer pattern 52 is laminated in the same process on the same material as the blue filter part 36 to form the bank pattern 38. By forming, the height dimension of the bank pattern 38 can be made larger than the thickness dimension of the color filter layer 33. Therefore, the thickness of the light shielding layer 41 applied between the bank patterns 38 is made larger than the thickness of the color filter layer 33. Since the thickness can be increased, the light shielding property of the light shielding layer 41 can be further improved.

  Further, since the light shielding layer 41 can be thickened, the amount of the black pigment added to the light shielding ink C applied as the light shielding layer 41 can be reduced, so that the viscosity of the light shielding ink C can be reduced. Therefore, since it is not easy to apply the light-shielding ink C having a high viscosity with the application means 47 that is an ink jet or dispenser, the light shielding ink C can be made to have a viscosity suitable for the application means 47 that is an ink jet or dispenser. The light shielding layer 41 can be more efficiently produced by the means 47. Further, when the lighting evaluation is performed, since the black of the light shielding layer 41 is deeply tightened more than the liquid crystal panel 1 of the first embodiment, the liquid crystal panel 1 with higher quality image quality can be obtained.

  Further, the color filter layer 33 can be formed on the array substrate 2 as in the third embodiment shown in FIG. The color filter layer 33 is stacked on the undercoat layer including the thin film transistor 13. The red filter portion 34, the green filter portion 35, and the blue filter portion 36 of the color filter layer 33 are provided to face the red filter portion 34, the green filter portion 35, and the blue filter portion 36, respectively. A contact hole 61 in which the drain electrode 22 of the thin film transistor 13 is opened is formed. Here, these contact holes 61 are formed in a size of 20 μm × 20 μm in a top view. The pixel electrode 11 is laminated on the red filter part 34, the green filter part 35, and the blue filter part 36 including the contact holes 61. The pixel electrode 11 is electrically connected to the drain electrode 22 of the thin film transistor 13 through the contact hole 61.

  Further, a spacer 25 is provided between the red filter part 34 and the green filter part 35. The spacer 25 is provided between the pixel electrode 11 on the red filter part 34 and the pixel electrode 11 on the green filter part 35, and on the pixel electrode 11 on the red filter part 34 and on the green filter part 35. The pixel electrode 11 is electrically insulated. A bank pattern 38 is provided on the undercoat layer outside the periphery of the color filter layer 33, and the light shielding ink C is applied to the bank A between the bank pattern 38 and the color filter layer 33 to block light. A layer 41 is formed.

  On the other hand, the counter substrate 3 has a counter electrode 37 laminated on the entire surface of the glass substrate 32, and the counter electrode 37 and the light shielding layer 41 and the bank pattern 38 of the array substrate 2 are connected by a sealing material 5. ing.

  As a result, a bank pattern 38 is formed when the color filter layer 33 is formed on the glass substrate 7 of the array substrate 2, and the light-shielding ink C is applied to the bank A between the bank pattern 38 and the color filter layer 33. Thus, since the light shielding layer 41 can be formed, the same effects as those of the first embodiment can be obtained. Further, since the color filter layer 33 is formed on the array substrate 2 side, it is not necessary to separately prepare a transparent insulating film, and the manufacturing cost can be reduced. Then, when the liquid crystal panel 1 provided with the color filter layer 33 on the array substrate 2 side was evaluated for lighting, a high display quality could be obtained as in the first embodiment.

  Further, as shown in FIG. 12, the peripheral edge of the color filter layer 33 is not provided with the bank pattern 38 outside the peripheral edge of the color filter layer 33 as in the fourth embodiment shown in FIGS. It is also possible to apply the light shielding ink C to the surface of the color filter layer 33 to form the light shielding layer 41 as shown in FIG. That is, since the outer side of the light shielding layer 41 is not partitioned by the bank pattern 38, the light shielding layer 41 flows to the outside, so that the pattern of the light shielding layer 41 may be destroyed, but it may be peeled off when formed. Since it is not necessary to form the bank pattern 38 that may occur, the productivity of the liquid crystal panel 1 can be further improved.

  In each of the above embodiments, the top gate type thin film transistor 13 has been described. However, a bottom gate type thin film transistor 13 having a bottom gate type structure or a coplanar type thin film transistor 13 can be used correspondingly. .

  Further, peripheral drive circuits such as a Y driver circuit 18 and an X driver circuit 19 are formed on the periphery of the screen portion 8 of the glass substrate 7 of the array substrate 2, but peripheral drive circuits such as the Y driver circuit 18 and the X driver circuit 19 are provided. May be formed separately from the array substrate 2 and connected to the array substrate 2.

  Next, a fifth embodiment will be described with reference to FIGS. In addition, about the structure and effect | action similar to said each embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  In the liquid crystal panel 1 of the fifth embodiment, a color filter layer 33 is provided on the array substrate 2 side. In other words, the array substrate 2 is disposed on the glass substrate 7 having light transparency, the color filter layer 33 formed so as to cover the thin film transistor 13 for each pixel 9, and disposed on the color filter layer 33 for each pixel 9. A pixel electrode 11, a spacer 25 formed on the color filter layer 33, an alignment film 65 formed so as to cover the entire plurality of pixel electrodes 11, and the like are provided.

  Each pixel electrode 11 is connected to the corresponding thin film transistor 13 through a through hole 67 that penetrates the color filter layer 33.

  Each thin film transistor 13 is, for example, an n-channel type coplanar TFT having a polysilicon semiconductor layer, and an active layer 71, which is a semiconductor layer formed of a polysilicon film, is shown in FIG. Have. This active layer 71 is disposed on an undercoat layer 72 disposed on the glass substrate 7, and has a drain region 74 and a source region 75 formed by doping impurities on both sides of the channel region 73. Yes.

  The source electrode 21 of each thin film transistor 13 is formed by being electrically connected to the source region 75 of the active layer 71 through a contact hole 79 that penetrates the gate insulating film 77 and the interlayer insulating film 78. Further, the source electrode 21 is electrically connected to the pixel electrode 11 through a through hole 67 formed in the color filter layer 33 covering the interlayer insulating film 78, the drain electrode 22, and the source electrode 21.

  Further, the drain electrode 22 of each thin film transistor 13 is formed integrally with the signal line 16, and is electrically connected to the drain region 74 of the active layer 71 through a contact hole 81 that penetrates the gate insulating film 77 and the interlayer insulating film 78. It is formed by being.

  Further, the gate electrode 24 of each thin film transistor 13 is formed integrally with the scanning line 15 and is disposed to face the active layer 71 with the gate insulating film 77 interposed therebetween.

  As a result, the thin film transistor 13 is connected to the scanning line 15 and the signal line 16, is made conductive by the driving voltage from the scanning line 15, and applies the signal voltage from the signal line 16 to the pixel electrode 11.

  The auxiliary capacitance electrode 12a of the auxiliary capacitance element 12 is disposed on the undercoat layer 72, which is the same layer as the active layer 71, and is electrically connected to the contact electrode 84 via the contact hole 83 penetrating the gate insulating film 77 and the interlayer insulating film 78. Connected. The contact electrode 84 is electrically connected to the pixel electrode 11 through a contact hole 85 that penetrates the color filter layer 33. As a result, the source electrode 21, the pixel electrode 11, and the auxiliary capacitance electrode 12a of the thin film transistor 13 have the same potential. On the other hand, at least a part of the auxiliary capacitance line 12b of the auxiliary capacitance element 12 is disposed to face the auxiliary capacitance electrode 12a via the gate insulating film 77, and is set to a predetermined potential.

  As shown in FIGS. 14 to 16, the light-shielding portion 42 includes a pair of partition walls 91 and 92 that are bank patterns as receiving patterns obtained by laminating two layers of the color resin constituting the color filter layer 33, and the pair of partition walls 91 and 92. A light shielding layer 41 disposed on the upper surface of the glass substrate 7 is provided in the bank A formed between the partition walls 91 and 92.

  More specifically, the pair of partition walls 91 and 92 includes a partition wall lower step portion 91a and 92a forming a part of the partition wall upper step portion 91b and 92b forming another part, and different colored resins (for example, lower step portions 91a and 92a). Green colored resin, and upper stage portions 91b and 92b are made of blue colored resin), and are provided in the light shielding region 39 excluding the liquid crystal injection port 40. As a result, a groove-shaped bank A surrounding the light-shielding region 39 excluding the liquid crystal injection port 40 is formed between the pair of partition walls 91 and 92. In the bank A, a black resin or the like in which a black pigment is dispersed is formed. A light shielding layer 41 made of a light shielding resin is formed.

  The spacer 25 is made of, for example, a photosensitive resin. The spacer 25 is disposed on each color filter portion 34, 35, 36 of the color filter layer 33 stacked on the light-shielding wiring portion. The alignment film 65 aligns liquid crystal molecules contained in the liquid crystal layer 4 in a predetermined direction with respect to the array substrate 2.

  The counter substrate 3 includes a counter electrode 37 formed on the glass substrate 32, an alignment film 94 covering the counter electrode 37, and the like. The alignment film 94 aligns liquid crystal molecules contained in the liquid crystal layer 4 in a predetermined direction with respect to the counter substrate 3.

  The light emitted from the backlight unit BL passes through the polarizing plate 44 on the array substrate 2 side in the liquid crystal panel 1, is modulated through the liquid crystal layer 4, and is selectively transmitted by the polarizing plate 45 on the counter substrate 3 side. The Thereby, an image is displayed on the screen unit 8 of the liquid crystal panel 1.

  Next, a method for manufacturing the liquid crystal panel 1 will be described.

  In the manufacturing process of the array substrate 2, first, an undercoat layer 72 is formed on the glass substrate 7, and then an active layer 71 of polysilicon such as the thin film transistor 13 and the auxiliary capacitance electrode 12 a are formed. Subsequently, after forming the gate insulating film 77, various wirings such as the scanning line 15, the auxiliary capacitance line 12b, and the gate electrode 24 integrated with the scanning line 15 are formed. Subsequently, using the gate electrode 24 as a mask, impurities are implanted into the polysilicon active layer 71 to form the drain region 74 and the source region 75, and then the entire substrate is annealed to activate the impurities. Subsequently, after forming the interlayer insulating film 78, the contact holes 81, 79, 83 are formed through the gate insulating film 77 and the interlayer insulating film 78. Subsequently, the signal line 16 is formed, and the drain electrode 22, the source electrode 21, and the contact electrode 84 of the thin film transistor 13 are formed integrally with the signal line 16, so that the thin film transistor 13 and the electrode wiring as shown in FIG. The formed array substrate 2 is obtained.

  Next, the color filter portions 34, 35, and 36 of the color filter layer 33 corresponding to each color pixel 9 are formed, and a pair of partition walls 91 and 92 are formed in the light shielding region 39.

More specifically, an ultraviolet curable acrylic resin resist in which a green pigment is dispersed is applied to the entire surface of the substrate by a spinner. Then, this resist film is exposed to 100 mJ / cm ² at a wavelength of 365 nm through a photomask that irradiates light to a portion corresponding to the green pixel and a portion corresponding to the partition walls 91 and 92 at the periphery of the screen portion 8. Expose in quantity. The resist film is developed with a 1% aqueous solution of potassium hydroxide (KOH) containing a surfactant for 10 seconds and baked. As a result, as shown in FIG. 18, the green filter part 35 having a film thickness of 3.0 μm is formed, and the lower stage parts 91a and 92a made of acrylic resin in which a green pigment is dispersed are formed. To do.

  The width dimension (line width) of the lower stage portions of the partition walls 91 and 92 is not particularly limited as long as the width dimension capable of forming the upper stage portions 91b and 92b formed on the upper surface of the lower stage portion can be secured. For example, in the present embodiment, as shown in FIG. 19, the width dimension W1a of the lower step portion 91a of the partition wall 91 formed on the inner side (that is, the screen portion 8 side) is 50 μm, and is formed on the outer peripheral side of the partition wall 91. The width dimension W2a of the lower step portion 92a of the partition wall 92 is set to 250 μm. Further, the dimension W of the interval between the lower step portion 91a of the partition wall 91 and the lower step portion 92a of the partition wall 92 can be appropriately set according to the size of the light shielding region required in the liquid crystal panel 1 to be manufactured. In the embodiment, the dimension W is set to 2 mm.

  Next, by repeating the same UV curable acrylic resin resist coating and photolithography process, a blue filter portion 36 having a film thickness of 3.0 μm is formed as shown in FIG. Upper partition portions 91b and 92b made of acrylic resin in which a blue pigment is dispersed are formed on the upper surfaces of the lower step portions 91a and 92a, whereby a depth of 6.0 μm is formed between the partition walls 91 and 92. A groove-shaped bank A having the shape is formed in the light shielding region 39.

  The width dimension of the upper stage portions 91b and 92b of the partition walls 91 and 92 is a width dimension equal to or higher than the limit resolution (line width) that the ultraviolet curable acrylic resin constituting the upper stage portions 91b and 92b can secure a predetermined adhesion strength. For example, in the present embodiment, as shown in FIG. 19, the width dimension W1b of the upper step portion 91b of the inner partition wall 91 is 25 μm, and the width of the upper step portion 92b of the outer peripheral partition wall 92, as shown in FIG. The dimension W2b is set to 100 μm.

  Then, by repeating the same process, as shown in FIG. 21, a red filter portion 34 having a film thickness of 3.0 μm made of acrylic resin in which a red pigment is dispersed is formed in a portion corresponding to the red pixel. .

  In the formation process of these color filter portions 34, 35, 36, the through hole 67 and the contact hole 85 are also formed at the same time.

  Next, ITO is deposited on the color filter layer 33 by sputtering and patterned into a predetermined pixel pattern, thereby forming the pixel electrode 11 in contact with the thin film transistor 13. Next, an ultraviolet curable acrylic resin resist, for example, is applied to the substrate surface with a predetermined film thickness using a spinner. Then, after the resin material is heated and dried, it is exposed with a predetermined exposure amount of ultraviolet rays using a photomask having a predetermined pattern shape. Then, the resin material is developed with an alkaline aqueous solution, heated and baked for a predetermined time, and as shown in FIG. 22, about a predetermined position on the color filter layer 33 avoiding the pixel electrode 11 on the substrate surface. A spacer 25 having a height of 5 μm is formed.

  Next, as shown in FIGS. 23 and 24, the light shielding ink C is applied to the bank A by dropping the light shielding ink C from the inkjet nozzle 95 into the bank A formed between the partition walls 91 and 92. Then, the light-blocking layer 41 made of a black resin is formed in the bank A by curing the acrylic monomer by heating and baking. In the present embodiment, the light-shielding ink C containing a thermosetting resin that is cured by heat treatment is used. Instead, a light-shielding ink containing a photocurable resin that is cured by light irradiation is used. Also good.

  Next, the alignment film material AL-1051 (manufactured by JSR Corporation) is applied to the entire surface of the substrate, and a rubbing process is performed to form the alignment film 65. Thereby, the array substrate 2 as shown in FIG. 25 is manufactured.

  On the other hand, in the manufacturing process of the counter substrate 3, first, ITO is formed to a thickness of about 150 nm by sputtering, and the counter electrode 37 is formed by patterning. Then, the alignment similar to the alignment film 65 is formed thereon. By applying a film material and performing a rubbing process, an alignment film 94 is formed, whereby the counter substrate 3 is manufactured.

  In the manufacturing process of the liquid crystal panel 1, the seal material 5 is printed and applied along the outer edge of the array substrate 2 leaving the liquid crystal inlet 40, and an electrode transfer material for applying a voltage from the array substrate 2 to the counter electrode 37. Is formed on the electrode transition electrode around the sealing material 5. Subsequently, the array substrate 2 and the counter substrate 3 are arranged so that the alignment film 65 of the array substrate 2 and the alignment film 94 of the counter substrate 3 are opposed to each other, and the sealing material 5 is cured by heating, whereby both substrates are cured. to paste together. Subsequently, a liquid crystal composition such as ZLI-1565 (manufactured by E. Merck) is injected from the liquid crystal injection port 40, and the liquid crystal injection port 40 is further sealed by the sealing member 93, thereby forming the liquid crystal layer 4. A liquid crystal display panel is manufactured.

  As described above, according to the fifth embodiment, in the color filter layer 33 forming step, the color filter layer 33 is formed in the screen portion 8 and the light blocking ink C is blocked in the light blocking region 39. Since the partition walls 91 and 92 for forming the film can be formed, a separate process is not required, and the light-shielding ink C does not spread on the peripheral edge of the array substrate 2 and is positioned at a predetermined position on the outer peripheral portion of the screen portion 8. The light shielding layer 41 can be formed by an ink jet method, thereby improving the raw material utilization efficiency and reducing the manufacturing cost.

  Further, the light shielding layer 41 and the color filter layer 33 (the blue filter portion 36 in the present embodiment) disposed on the outermost periphery of the screen portion 8 are not adjacent to each other, and no color mixing occurs between the two layers. .

  In the present embodiment, the lower step portions 91a and 92a and the upper step portions 91b and 92b of the pair of partition walls 91 and 92 are formed of a green colored resin and a blue colored resin, respectively, but the present invention is limited to this. Instead, it may be formed of any color resin that forms the color filter portions 34, 35, 36 of the color filter layer 33.

  Further, in this embodiment, each of the partition walls 91 and 92 is formed by laminating two layers of colored resins of different colors in a stepped manner. For example, as in the sixth embodiment shown in FIG. The lower step portions 91b and 92b of the partition walls 91 and 92 may be formed so as to cover the lower step portions 91a and 92a of the partition walls 91 and 92. Furthermore, in the seventh embodiment shown in FIGS. As described above, the pair of partition walls 91 and 92 are formed of one layer or three layers, or the inner partition wall 91 is formed of two layers as in the eighth embodiment shown in FIG. The laminated structure of the colored resin is not particularly limited, and the laminated structure of the colored resins of the partition walls 91 and 92 can be appropriately set so that the light shielding layer 41 having a desired thickness can be formed. Here, in the case of the ninth embodiment in which the inner partition 91 is composed of two layers and the outer partition 92 is composed of one layer, as shown in FIG. By dropping into the bank A so as to ride on 92, the light shielding layer 41 having a thickness substantially the same as that of the case where both the partition walls 91 and 92 are formed of two layers can be formed.

  In the present embodiment, the color filter layer 33 and the light shielding portion 42 are formed on the array substrate 2, but the color filter layer and the light shielding portion as described above may be formed on the counter substrate 3.

  Next, a tenth embodiment will be described with reference to FIGS. In addition, about the structure and effect | action similar to said each embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  As shown in FIG. 31, the liquid crystal panel 1 of the tenth embodiment includes a partition wall on the upper stage portion 91b of the partition wall 91 on the inner peripheral side (that is, the screen portion 8 side) of the pair of partition walls 91 and 92. A groove 97 recessed downward along 91 is formed on the upper surface of the upper step 91b. In the case where the inner peripheral partition 91 has light transmittance, a light shielding metal pattern (not shown) may be disposed under the partition 91.

  A bank A is formed between the pair of partition walls 91 and 92, and a light shielding layer 41 is formed on the bank A.

  Next, a method for manufacturing the liquid crystal panel 1 will be described.

As shown in FIG. 32, after forming the array substrate 2 on which the thin film transistor 13 and the electrode wiring are formed by the same process as in the fifth embodiment, a color filter layer 33 of a color corresponding to each pixel 9 of each color. The color filter portions 34, 35, and 36 are formed, and a pair of partition walls 91 and 92 are formed in the light shielding region 39. In this case, for example, an ultraviolet curable acrylic resin resist in which a red pigment is dispersed is applied to the entire surface of the substrate by, for example, a spinner, and this resist film is applied to a photomask so that light is irradiated to a portion corresponding to a red pixel. The film is exposed at an exposure dose of 100 mJ / cm ² at a wavelength of 365 nm. The resist film is developed with a 0.05% aqueous solution of potassium hydroxide (KOH) containing a surfactant for 40 seconds and baked at 230 ° C. for 3 minutes. Thus, as shown in FIG. 33, a red filter portion 34 having a thickness of 3.0 μm is formed.

  Next, a resist in which a green pigment is dispersed in the same ultraviolet curable acrylic resin resist is applied to the entire surface of the substrate by a spinner, and the resist film is applied to the portions corresponding to the green pixels and the partitions 91 and 92 at the periphery of the screen portion 8. As shown in FIG. 34, a film having a thickness of 3.0 μm is obtained by performing exposure under the same conditions as described above through a photomask that irradiates light to a portion corresponding to, and developing and baking. The green filter part 35 is formed, and the lower stage parts 91a and 92a made of the acrylic resin in which the green pigment is dispersed are formed.

  Note that the width dimension (line width) of the lower step portions 91a and 92a of the partition walls 91 and 92 is secured so that the upper step portions 91b and 92b of the partition walls 91 and 92 formed on the upper surfaces of the lower step portions 91a and 92a can be formed. Although it is not particularly limited if possible, for example, in this embodiment, as shown in FIG. 35, the width dimensions W1a and W2a of the lower step portions 91a and 92a are respectively set to 70 μm. Further, the dimension W of the interval between the lower step portion 91a of the partition wall 91 and the lower step portion 92a of the partition wall 92 can be appropriately set according to the size of the light shielding region required in the liquid crystal panel 1 to be manufactured. In the embodiment, the dimension W is set to 1 to 7 mm.

  Next, by repeating the application of the same ultraviolet curable acrylic resin resist, photolithography process and baking, as shown in FIG. 36, a blue filter portion 36 having a film thickness of 3.0 μm is formed and both partition walls 91, The upper step portions 91b and 92b made of an acrylic resin in which a blue pigment is dispersed are formed on the upper surfaces of the lower step portions 91a and 92a of the 92, whereby 5.5 μm between the partition walls 91 and 92 is formed. A groove-shaped bank A having a depth is formed in the light shielding region 39. Here, in the lower step portion 91a on the inner peripheral side, a pair of resin layers 98, 98 made of an acrylic resin in which a blue pigment is dispersed are disposed on the upper surface of the lower step portion 91a with a predetermined interval therebetween, so that the lower step portion An upper step 91b having a groove 97 recessed downward is formed on 91a.

  The width dimension of the upper stage portions 91b and 92b of the partition walls 91 and 92 is a width dimension equal to or higher than the limit resolution (line width) that the ultraviolet curable acrylic resin constituting the upper stage portions 91b and 92b can secure a predetermined adhesion strength. For example, in the present embodiment, as shown in FIG. 35, the width W2a of the resin layers 98 and 98 constituting the upper stage portion 91b of the inner partition wall 91 is set to 20 μm. The space W3 between 98 and 98 is set to 20 μm, and the width dimension W2b of the upper step portion 92b of the partition wall 92 on the outer peripheral side is set to 20 μm.

  Next, the array substrate 2 on which the color filter layer 33 and the partition walls 91 and 92 are formed is baked at 220 ° C. for 60 minutes to completely cure the acrylic resin.

  In the formation process of these color filter portions 34, 35, 36, the through hole 67 and the contact hole 85 are also formed at the same time.

  Next, ITO is deposited to a thickness of 150 nm on the color filter layer 33 by sputtering, and patterned into a predetermined pixel pattern, thereby forming the pixel electrode 11 in contact with the thin film transistor 13. Next, an ultraviolet curable acrylic resin resist, for example, is applied to the substrate surface with a predetermined film thickness using a spinner. Then, after the resin material is heated and dried, it is exposed with a predetermined exposure amount of ultraviolet rays using a photomask having a predetermined pattern shape. Then, this resin material is developed with an alkaline aqueous solution, heated and baked for a predetermined time, thereby avoiding the pixel electrode 11 on the surface of the substrate at a predetermined position on the color filter layer 33 as shown in FIG. A spacer 25 having a height of 5 μm is formed.

  Next, as shown in FIG. 38, the light shielding ink C is applied to the bank A by discharging the light shielding ink C from the inkjet nozzle 95 into the bank A formed between the partition walls 91 and 92. At this time, the inkjet nozzle 95 ejects the light-shielding ink C so that the ejection distance H in the ejection direction from the ejection port of the inkjet nozzle 95 to the upper end portions 91b and 92b of the partition walls 91 and 92 is set to 60 μm to 90 μm. It is preferable to determine the discharge position. Then, after removing the solvent under reduced pressure, the acrylic monomer is cured by heating and baking to form a light shielding layer 41 made of a black resin in the bank A, as shown in FIG. By forming the alignment film 65 in the same process as in the embodiment, the array substrate 2 as shown in FIG. 40 is manufactured.

  In the present embodiment, the light-shielding ink C containing a thermosetting resin that is cured by heat treatment is used. Instead, a light-shielding ink containing a photocurable resin that is cured by light irradiation is used. Also good.

  As described above, according to the tenth embodiment, in the color filter layer 33 forming step, the color filter layer 33 is formed in the screen portion 8 and the light blocking ink C is blocked in the light blocking region 39. Since the partition walls 91 and 92 for forming the film can be formed, a separate process is not required, and the light-shielding ink C does not spread on the peripheral edge of the array substrate 2 and is positioned at a predetermined position on the outer peripheral portion of the screen portion 8. The light shielding layer 41 can be formed by an ink jet method, thereby improving the raw material utilization efficiency and reducing the manufacturing cost.

  In addition, since the upper stage 91b of the inner peripheral side partition wall 91 is provided with the groove 97, even when the light shielding ink C discharged from the inkjet nozzle 95 reaches the upper end of the inner peripheral side partition wall 91. The light-shielding ink C flows into the groove 97 and is dispersed and the momentum is weakened, so that it is blocked in the groove 97 and can be prevented from flowing out to the screen portion 8.

  This is because the inkjet nozzle 95 applies the light-shielding ink C to the bank A when the groove 97 is formed in the upper step 91b of the inner peripheral partition wall 91 and when the groove 97 is not formed in the upper step 91b. 41 and 42 showing the relationship between the ejection distance H in the ejection direction from the ejection port of the inkjet nozzle 95 to the upper ends of the upper portions 91b and 92b of the partition walls 91 and 92 and the presence or absence of ejection failure of the light-shielding ink C. It is clear from

  That is, in the case where the groove 97 shown in FIG. 41 is not formed, the light shielding ink C does not flow out to the screen portion 8 when the discharge distance H is 80 μm or more, and the light shielding layer 41 is poorly formed when the discharge distance H is 90 μm or less. Therefore, the range of the discharge distance H in which the discharge failure of the light-shielding ink C does not occur is 80 μm to 90 μm.

  On the other hand, in the case where the groove 97 shown in FIG. 42 is formed, the light shielding ink C does not flow out to the screen portion 8 when the ejection distance H is 60 μm or more, and the light shielding layer 41 is formed when the ejection distance H is 90 μm or less. The range of the discharge distance H in which no defective molding occurs and the ejection failure of the light-shielding ink C does not occur is 60 μm to 90 μm, which is three times that in the case where the groove 97 is not formed. The light shielding layer 41 can be formed stably without causing the light shielding ink C to flow out to the screen portion 8 even if the shapes of 91 and 92 vary.

  Further, the light shielding layer 41 and the color filter layer 33 (the blue filter portion 36 in the present embodiment) disposed on the outermost periphery of the screen portion 8 are not adjacent to each other, and no color mixing occurs between the two layers. .

  In the tenth embodiment described above, the lower step portions 91a and 92a and the upper step portions 91b and 92b of the pair of partition walls 91 and 92 are respectively formed of a green colored resin and a blue colored resin. However, the color filter layer 33 may be formed of any color resin that forms the color filter portions 34, 35, 36 of the color filter layer 33.

  Further, as in the eleventh embodiment shown in FIG. 43, in the tenth embodiment, the side surfaces of the upper stage portions 91b, 92b corresponding to the upper end side surfaces of the pair of partition walls 91, 92 are The tapered surface 99 may be at an angle of 25 to 150 degrees with respect to the glass substrate 7. Even in such a case, the light-shielding ink C discharged from the inkjet nozzle 95 flows out to the screen unit 8. Can be prevented.

  In each of the above embodiments, an example using the three color layers of the red filter part 34, the green filter part 35, and the blue filter part 36 is shown, but the present invention is not limited to this, You may form using the colored layer of 4 colors of the red filter part 34, the green filter part 35, the blue filter part 36, and a transparent color filter part.

  Next, a twelfth embodiment will be described with reference to FIG. In addition, about the structure and effect | action similar to the said 10th Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  In the twelfth embodiment, the groove 97 is not formed in the upper step 91b of the inner peripheral partition 91 in the tenth embodiment, and the side surfaces of the upper steps 91b and 92b of the partition 91 and 92 Are different from each other in that they form a tapered surface 99. The tapered surface 99 is formed so that the taper angle θ with respect to the glass substrate 7 is 25 degrees to 150 degrees, preferably 90 degrees to 120 degrees.

  The taper angle θ of the tapered surface 99 can be adjusted by controlling the development time of the resist film after exposure, and can also be adjusted by controlling the resist material, the exposure amount, or the baking conditions.

  As described above, in this embodiment, the side surfaces of the upper stage portions 91b and 92b of the partition walls 91 and 92 are provided on the tapered surface 99, so that the light-shielding ink C discharged from the inkjet nozzle 95 flows out to the screen unit 8. Can be prevented.

  In the twelfth embodiment, each of the partition walls 91 and 92 is formed by laminating two layers of colored resins of different colors stepwise, but the partition walls 91 and 92 are configured by one layer or three layers. Or the laminated structure of the colored resin is not particularly limited, for example, the inner peripheral partition wall 91 is composed of two layers, and the outer peripheral partition wall 92 is composed of one layer. The laminated structure of the colored resins of the partition walls 91 and 92 can be set as appropriate so that 41 can be formed. At that time, by providing the side surface of the colored resin layer formed at the uppermost stage, that is, the side surfaces of the upper ends of the pair of partition walls 91 and 92 on the tapered surface 99, the light-shielding ink C can be prevented from flowing out to the screen unit 8. .

1 is a perspective view showing a first embodiment of a liquid crystal display device of the present invention. It is explanatory circuit block diagram which shows a liquid crystal display device same as the above. It is explanatory sectional drawing which shows a liquid crystal display device same as the above. It is a top view which shows a liquid crystal display device same as the above. It is explanatory drawing which shows the state which formed the receiving pattern on the light transmissive board | substrate of a liquid crystal display device same as the above. It is explanatory drawing which shows the state which apply | coats a light-shielding material between a receiving pattern same as the above and a color filter layer. It is explanatory drawing which shows the state which formed the light shielding layer between the receiving pattern same as the above and a color filter layer. It is explanatory drawing which shows the state which formed the receiving pattern on the transparent substrate of 2nd Embodiment of the liquid crystal display device of this invention. It is explanatory drawing which shows the state which apply | coats a light-shielding material between a receiving pattern same as the above and a color filter layer. It is explanatory drawing which shows the state which formed the light shielding layer between the receiving pattern same as the above and a color filter layer. It is explanatory sectional drawing which shows 3rd Embodiment of the liquid crystal display device of this invention. It is explanatory drawing which shows the state which coat | covers the light-shielding material on the outer side of the color filter layer of 4th Embodiment of the liquid crystal display device of this invention. It is explanatory drawing which shows the state which formed the light shielding layer in the outer side of a color filter layer same as the above. It is a top view which shows 5th Embodiment of the liquid crystal display device of this invention. It is explanatory sectional drawing which shows the structure of the array substrate of a liquid crystal display device same as the above. It is explanatory sectional drawing which shows a liquid crystal display device same as the above. It is explanatory drawing which shows the state which formed the switching element on the light transmissive board | substrate of a liquid crystal display device same as the above. It is explanatory drawing which shows the state which formed a part of color filter layer and the partition lower stage part on the light transmissive board | substrate same as the above. It is explanatory drawing which shows the state which hardened the light-shielding material apply | coated between a pair of partition walls same as the above. It is explanatory drawing which shows the state which formed the other part of the color filter layer and the partition upper stage part on the light transmissive substrate same as the above. It is explanatory drawing which shows the state which formed the other part of the color filter layer on the transparent substrate same as the above. It is explanatory drawing which shows the state which formed the pixel electrode and the spacer on the color filter layer same as the above. It is explanatory drawing which shows the state which apply | coats a light-shielding material between a pair of partition as above. It is explanatory drawing which shows the state which formed the light shielding layer between a pair of partition as same as the above. It is explanatory drawing which shows the state which formed the alignment film on the light transmissive substrate same as the above. It is explanatory drawing which shows 6th Embodiment of the liquid crystal display device of this invention. It is explanatory drawing which shows the state which formed the partition lower stage part on the transparent substrate of 7th Embodiment of the liquid crystal display device of this invention. It is explanatory drawing which shows the state which formed the partition on the light transmissive board | substrate of a liquid crystal display device same as the above. It is explanatory drawing which shows 8th Embodiment of the liquid crystal display device of this invention. It is explanatory drawing which shows 9th Embodiment of the liquid crystal display device of this invention. It is explanatory sectional drawing which shows 10th Embodiment of the liquid crystal display device of this invention. It is explanatory drawing which shows the state which formed the switching element on the light transmissive board | substrate of a liquid crystal display device same as the above. It is explanatory drawing which shows the state which formed a part of color filter layer and the partition lower stage part on the light transmissive board | substrate same as the above. It is explanatory drawing which shows the state which formed the other part of the color filter layer and the partition upper stage part on the light transmissive substrate same as the above. It is explanatory drawing which shows the state which hardened the light-shielding material apply | coated between a pair of partition walls same as the above. It is explanatory drawing which shows the state which formed the other part of the color filter layer on the transparent substrate same as the above. It is explanatory drawing which shows the state which formed the pixel electrode and the spacer on the color filter layer same as the above. It is explanatory drawing which shows the state which apply | coats a light-shielding material between a pair of partition as above. It is explanatory drawing which shows the state which formed the light shielding layer between a pair of partition as same as the above. It is explanatory drawing which shows the state which formed the alignment film on the light transmissive substrate same as the above. It is a graph which shows the relationship between the discharge distance of an inkjet nozzle same as the above, and the presence or absence of the discharge defect of a translucent material, Comprising: It is a graph which shows the case where the groove | channel is not provided in the upper stage part of the partition. It is a graph which shows the relationship between the discharge distance of an inkjet nozzle same as the above, and the presence or absence of the discharge defect of a translucent material, Comprising: It is a graph which shows the case where the groove | channel is provided in the upper stage part of the partition. It is explanatory drawing which shows the 11th Embodiment of this invention. It is explanatory drawing which shows the 12th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Liquid crystal panel as a liquid crystal display device 2 Array substrate as a light-transmitting substrate 8 Screen section as a display area 9 pixels
11 Pixel electrode
13 Thin-film transistors as switching elements
33 Color filter layer
34 Red filter section as a colored layer
35 Green filter part as the first color filter layer as the colored layer
36 Blue filter part which is the second color filter layer as the colored layer
38 Bank pattern as a receiving pattern
39 Shading area
41 Shading layer
42 Shading part
91, 92 Bulkhead as receiving pattern
91a, 92a Bulkhead lower part
91b, 92b Bulkhead upper section
95 Inkjet nozzle
99 Tapered surface C Light-shielding ink as light-shielding material

Claims (19)

A pixel having a color filter layer having a plurality of colored layers arranged in a display area for displaying an image on a light-transmitting substrate, and a light shielding part for shielding the light shielding area arranged along the outer periphery of the display area A method for manufacturing a liquid crystal display device comprising a layer,
When forming the color filter layer on the light transmissive substrate, forming a receiving pattern on the periphery of the color filter layer with the material used for the color filter layer,
A method for manufacturing a liquid crystal display device, comprising: forming a light-shielding layer surrounding an outer periphery of the color filter layer by applying a light-shielding material at a periphery of the color filter layer and receiving the light-receiving material with the receiving pattern. The method for manufacturing a liquid crystal display device according to claim 1, wherein the light shielding material is applied by inkjet to form the light shielding layer. When sequentially forming the color filter layer with the colored layers of a plurality of colors, the colored layer located on the outermost side of the color filter layer and the receiving pattern are formed by laminating the colored layers of different colors. ,
The light shielding layer is formed by injecting the light shielding material between the colored layer located on the outermost side of the laminated color filter layers and the receiving pattern. The manufacturing method of the liquid crystal display device of description. When forming the color filter layer with the color layers of a plurality of colors, the first color filter layer and the light-shielding area surround the outer periphery of the display area with a predetermined distance from each other by the first color resin of the first color. And a pair of partition lower steps that form a part of the receiving pattern, and at least inside the second color filter layer and the pair of partition lower steps by a second colored resin of the second color. Forming an upper partition wall portion forming the other part of the receiving pattern on the upper surface of the lower partition wall portion on the circumferential side;
The ink having the light-shielding material is dropped from an inkjet nozzle between the pair of partition lower steps and on the upper surface of the light-transmitting substrate when the light-shielding layer is formed. The manufacturing method of the liquid crystal display device of description. When forming the color filter layer with the color layers of a plurality of colors, the first color filter layer and the light-shielding area surround the outer periphery of the display area with a predetermined distance from each other by the first color resin of the first color. And a pair of partition lower steps that form a part of the receiving pattern, and at least inside the second color filter layer and the pair of partition lower steps by a second colored resin of the second color. On the upper surface of the partition wall lower step portion on the circumferential side, a partition upper step portion having a groove along the partition wall and forming the other part of the receiving pattern is formed,
The ink having the light-shielding material is dropped from an inkjet nozzle between the pair of partition lower steps and on the upper surface of the light-transmitting substrate when the light-shielding layer is formed. The manufacturing method of the liquid crystal display device of description. 6. The liquid crystal display device according to claim 4, wherein a distance from an ejection port of the inkjet nozzle to an upper end of the upper stage of the partition wall is set to 60 μm to 90 μm when ink is dropped from the inkjet nozzle. Method. The receiving pattern is a pair of partition walls arranged at a predetermined interval so as to surround the outer periphery of the display area in the light-shielding area, and the side surfaces are tapered surfaces;
When forming the light-shielding layer, claims 1 and characterized in that dropping the ink having the light-shielding materials from the inkjet nozzles while the and the upper surface of the light transmitting substrate of the pair of partition walls 6 The manufacturing method of the liquid crystal display device as described in any one of these. The liquid crystal according to any one of claims 1 to 7, wherein the light transmissive substrate is an array substrate including switching elements arranged in a matrix and pixel electrodes connected to the switching elements. Manufacturing method of display device. A liquid crystal display device comprising: a pixel having a color filter layer arranged in a display area for displaying an image on a light-transmitting substrate; and a light shielding part for shielding the light shielding area arranged along the outer periphery of the display area. In
The shading part is
A receiving pattern formed on the periphery of the color filter layer;
A light shielding material applied on the light transmissive substrate at the periphery of the color filter layer is received by the receiving pattern, and includes a light shielding layer surrounding an outer periphery of the color filter layer,
The receiving pattern is a pair of partition walls made of a colored resin that is disposed at a predetermined interval so as to surround the outer periphery of the display area in the light shielding area, and forms the color filter layer,
The liquid crystal display device, wherein the light shielding layer is formed by applying the light shielding material between the pair of partition walls. The colored resin forming the color filter layer is composed of a plurality of colored resins,
10. The liquid crystal display device according to claim 9, wherein at least an inner peripheral partition wall of the pair of partition walls is formed by laminating any two colored resins of the plurality of colored resins. . The liquid crystal display device according to claim 10, wherein the pair of partition walls are formed of a green resin and a blue resin. 12. The liquid crystal display device according to claim 9, wherein a line width of the pair of partition walls is 20 μm or more. The said light transmissive board | substrate is an array board | substrate provided with the switching element arrange | positioned in the matrix form, and the pixel electrode connected to the said switching element. The Claim 13 characterized by the above-mentioned. Liquid crystal display device. The liquid crystal display device according to any one of claims 9 to 13, wherein a groove is formed along an upper surface of a partition wall at least on an inner peripheral side of the pair of partition walls. The colored resin forming the color filter layer is composed of a plurality of colored resins,
The partition wall on the inner peripheral side of at least the pair of partition walls is formed by laminating any two colored resins of the plurality of colored resins in two upper and lower stages, and along the partition wall on the upper surface of the upper stage portion. The liquid crystal display device according to claim 14, wherein the groove is formed. The liquid crystal display device according to claim 14 or 15, wherein the side surfaces of the upper end portions of the pair of partition walls form a tapered surface in which the width of the partition walls changes toward the upper end. The colored resin forming the color filter layer is composed of a plurality of colored resins,
The pair of partition walls are formed by laminating at least one color resin of the plurality of color resins,
The liquid crystal display device according to any one of claims 14 to 16, wherein the side surfaces of the upper end portions of the pair of partition walls form a tapered surface in which the widths of the partition walls change toward the upper end. The liquid crystal display device according to claim 9, wherein the colored resin is a photocurable resin. The liquid crystal display device according to any one of claims 9 to 18, wherein the light-shielding material is one of a thermosetting resin and a photocurable resin.

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