JP4911590B2 - Solid electrolytic capacitor and manufacturing method thereof - Google Patents

Solid electrolytic capacitor and manufacturing method thereof Download PDF

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JP4911590B2
JP4911590B2 JP2006272060A JP2006272060A JP4911590B2 JP 4911590 B2 JP4911590 B2 JP 4911590B2 JP 2006272060 A JP2006272060 A JP 2006272060A JP 2006272060 A JP2006272060 A JP 2006272060A JP 4911590 B2 JP4911590 B2 JP 4911590B2
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anode lead
lead frame
anode
solid electrolytic
electrolytic capacitor
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JP2008091704A (en
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平田  義和
千博 加藤
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Sanyo Electric Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/008Terminals
    • H01G9/012Terminals specially adapted for solid capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/022Electrolytes; Absorbents
    • H01G9/025Solid electrolytes
    • H01G9/028Organic semiconducting electrolytes, e.g. TCNQ

Description

本発明は、リードフレームを具えた固体電解コンデンサ及びその製造方法に関する。
The present invention relates to a solid electrolytic capacitor having a lead frame and a method for manufacturing the same .

従来、固体電解コンデンサ(1)として、図3に示すような構造が知られている。(特許文献1参照)この図に示した固体電解コンデンサは、図4に詳細を示すように弁金属(タンタル、ニオブ、アルミニウム等)からなる陽極体(31)の一端面から植立された陽極体(31)と同一の弁金属から成る細いワイヤ状の陽極リード(2)を有し、該陽極体(31)の周面に誘電体酸化被膜(32)、二酸化マンガン等の導電性無機材料、或いはTCNQ錯塩、導電性ポリマー等の導電性有機材料から成る固体電解質層(33)、導電性カーボン、銀等からなる陰極引出層(34)を順次形成してコンデンサ素子(3)を構成し、該コンデンサ素子(3)の周面に導電性接着剤(5)により陰極リードフレーム(42)が接続され、陽極リード(2)の先端部(22)に抵抗溶接等により陽極リードフレーム(41)を夫々接続し、その後外装樹脂(6)でコンデンサ素子(3)、陽極リード(2)、陽極リードフレーム(41)及び陰極リードフレーム(42)の一部をハウジングし、該ハウジングの外側に突出したリードフレーム(41)(42)を、外装樹脂(6)の周面に沿って下向きに曲げることで得られる。   Conventionally, a structure as shown in FIG. 3 is known as a solid electrolytic capacitor (1). (See Patent Document 1) The solid electrolytic capacitor shown in this figure is an anode planted from one end face of an anode body (31) made of a valve metal (tantalum, niobium, aluminum, etc.) as shown in detail in FIG. Conductive inorganic material having a thin wire-like anode lead (2) made of the same valve metal as the body (31), a dielectric oxide film (32), manganese dioxide, etc. on the peripheral surface of the anode body (31) Alternatively, a solid electrolyte layer (33) made of a conductive organic material such as TCNQ complex salt or a conductive polymer, and a cathode lead layer (34) made of conductive carbon, silver, etc. are sequentially formed to constitute a capacitor element (3). The cathode lead frame (42) is connected to the peripheral surface of the capacitor element (3) by a conductive adhesive (5), and the anode lead frame (41) is connected to the tip (22) of the anode lead (2) by resistance welding or the like. ), And then the capacitor element (3), anode lead (2), anode lead frame (41) with exterior resin (6) And a part of the cathode lead frame (42) is housed, and the lead frames (41) (42) protruding outside the housing are bent downward along the peripheral surface of the exterior resin (6).

また前記陽極リード(2)は、引出部(21)と先端部(22)からなり、陽極リードフレーム(41)に溶接する際、先端部(22)は押し潰され平板状になっている。
特2003−163136号公報
The anode lead (2) includes a lead portion (21) and a tip portion (22), and when the anode lead frame (41) is welded, the tip portion (22) is crushed into a flat plate shape.
Japanese Patent Publication No. 2003-163136

上記従来例による固体電解コンデンサ(1)は、高周波回路に用いられることが多く、固体電解コンデンサ(1)の ESR(等価直列抵抗)を下げることが求められている。このESRを下げる方策として、陽極リード(2)の径を太くして、陽極リード全体の電気抵抗を小さくすることが考えられる。   The solid electrolytic capacitor (1) according to the conventional example is often used in a high frequency circuit, and it is required to lower the ESR (equivalent series resistance) of the solid electrolytic capacitor (1). As a measure for reducing the ESR, it is conceivable to increase the diameter of the anode lead (2) to reduce the electrical resistance of the entire anode lead.

しかしながら、ハウジングの中央から陽極、陰極リードフレームが引き出される場合、陽極リード(2)の径を太くすると、図5に示すようにコンデンサ素子(3)が両リードフレーム(41)(42)に取り付けられる際、コンデンサ素子(3)が傾いた状態で取り付けられる。コンデンサ素子(3)が傾いた状態で両リードフレーム(41)(42)に取り付けられると、リードフレーム(41)(42)と陽極リード(2)及びコンデンサ素子(3)の周面との接触面積が小さくなり、却ってESRを増大させてしまう。また、素子(3)がリードフレーム(41)(42)に対して傾いたままハウジングされると、該コンデンサ素子(3)にかかる負荷が大きくなり、漏れ電流が増大してしまう。   However, when the anode and cathode lead frames are pulled out from the center of the housing, the capacitor element (3) is attached to both lead frames (41) and (42) as shown in FIG. The capacitor element (3) is attached in a tilted state. When the capacitor element (3) is attached to both lead frames (41) and (42) in a tilted state, the lead frame (41) and (42) contact with the anode lead (2) and the peripheral surface of the capacitor element (3). The area becomes smaller and the ESR increases. Further, when the element (3) is housed while being tilted with respect to the lead frames (41) and (42), the load applied to the capacitor element (3) increases, and the leakage current increases.

本願発明の目的は、上記問題を解決し、リードフレームに接続される際のコンデンサ素子の傾きをなくし、陽極リードと陽極リードフレームとの好適な接続手段を提供することにある。   An object of the present invention is to solve the above problems, eliminate the inclination of the capacitor element when connected to the lead frame, and provide a suitable connection means between the anode lead and the anode lead frame.

前述の問題を解決するため、本発明は陽極リードが植立された弁作用金属からなる陽極体の表面に、誘電体酸化被膜、固体電解質層、カーボン及び銀ペースト層を順次形成したコンデンサ素子と、前記陽極リードに接続してなる陽極リードフレームと、前記陰極引出層に接続してなる陰極リードフレームと、前記コンデンサ素子の回りを陽極リードフレームと陰極リードフレームの一部を残して直方体状に被覆してなる外装樹脂とからなり、該外装樹脂の高さ方向の中央からそれぞれ陽極リードフレームと陰極リードフレームが引き出された固体電解コンデンサにおいて、
前記陽極リードは、焼結体に繋がる引出部と先端部からなり、該先端部が陽極リードフレームに接合される平坦な接合面を有し、且つ該接合面が、前記陽極リードフレームの垂直方向に関して、前記引出部の中心面より上方にあることを特徴とする。
そして、本発明の固体電解コンデンサは、陽極リードフレームと陽極リード先端部が接合する際に起きるコンデンサ素子と陽極リードフレーム間での傾きをなくすため、陽極リード先端部が接合面と、該接合面に略平行な平坦面を有し、先端部の端面から焼結体への平坦面の幅寸法は、前記接合面の幅寸法より大きいことを特徴とする。
In order to solve the above-mentioned problems, the present invention provides a capacitor element in which a dielectric oxide film, a solid electrolyte layer, a carbon and a silver paste layer are sequentially formed on the surface of an anode body made of a valve metal in which an anode lead is implanted. An anode lead frame connected to the anode lead; a cathode lead frame connected to the cathode lead layer; and a rectangular parallelepiped shape around the capacitor element, leaving a part of the anode lead frame and the cathode lead frame. In a solid electrolytic capacitor comprising an exterior resin formed by coating, and an anode lead frame and a cathode lead frame drawn from the center in the height direction of the exterior resin,
The anode lead includes a lead portion and a tip portion connected to the sintered body, and the tip portion has a flat joint surface joined to the anode lead frame, and the joint surface is perpendicular to the anode lead frame. Is characterized by being above the center plane of the drawer.
The solid electrolytic capacitor according to the present invention eliminates the inclination between the capacitor element and the anode lead frame that occurs when the anode lead frame and the anode lead tip are joined. The width of the flat surface from the end surface of the tip portion to the sintered body is larger than the width of the joint surface.

また、本発明の固体電解コンデンサの製法方法は、陽極リードが植立された陽極体と、該陽極リードの先端部に設けた平坦な接合面に接続された陽極リードフレームと、を備えた固体電解コンデンサの製造方法である。陽極リードとなる部材を前記陽極体に植立する工程と、前記部材の、前記先端部に相当する部分において前記部材の延在方向と垂直な方向における一方端部に第1の圧力を加えると共に、前記一方端部と対向する他方端部に第1の圧力より大きい第2の圧力を加えることにより、前記他方端部側から押し潰して形成されると共に前記垂直な方向における中心よりも一方端部側に位置する前記接合面を形成する工程と、互いに平行な状態で前記接合面と前記陽極リードフレームとを接続する工程と、を備えることを特徴とする。
Further, the method for producing a solid electrolytic capacitor of the present invention comprises a solid body comprising an anode body in which an anode lead is planted, and an anode lead frame connected to a flat joint surface provided at the tip of the anode lead. This is a method of manufacturing an electrolytic capacitor. A step of planting the member serving as the anode lead to the anode body, said member, together with the addition of a first pressure to the one end portion in a direction perpendicular to a running direction of said member at a portion corresponding to the tip portion The second end larger than the first pressure is applied to the other end opposite to the one end so as to be crushed from the other end and at one end from the center in the vertical direction. A step of forming the bonding surface located on the portion side, and a step of connecting the bonding surface and the anode lead frame in a state parallel to each other .

接合面を形成する工程では、一方端部側から押し潰すことにより一方端部側に位置する平坦面をさらに形成し、延在方向において平坦面の幅寸法を接合面の幅寸法より大きくすることができる。In the step of forming the joint surface, a flat surface located on the one end side is further formed by crushing from the one end side, and the width dimension of the flat surface is made larger than the width dimension of the joint surface in the extending direction. Can do.

上記発明の構成によれば、径の大きな陽極リードを用いたとき、陽極リードと陽極リードフレームが平行に接続されるので、陽極リードフレームとコンデンサ素子との傾きがなくなり、陽極リードフレームと陽極リード及びコンデンサ素子と陰極リードフレームとの接触面積が小さくなることによるESRの増大がなくなる。また、コンデンサ素子と陰極リードフレーム間の傾きがない状態でハウジングされるので、コンデンサ素子にかかる負荷も軽減され、漏れ電流の増大を防ぐことができる。   According to the configuration of the above invention, when the anode lead having a large diameter is used, the anode lead and the anode lead frame are connected in parallel, so that there is no inclination between the anode lead frame and the capacitor element, and the anode lead frame and the anode lead. In addition, the increase in ESR due to the reduction in the contact area between the capacitor element and the cathode lead frame is eliminated. In addition, since it is housed in a state where there is no inclination between the capacitor element and the cathode lead frame, a load applied to the capacitor element is reduced, and an increase in leakage current can be prevented.

以下に、本発明の好ましい実施例を、図を用いて詳述する。    Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

固体電解コンデンサは、図4に示すように陽極リード(2)が植立された焼結体の表面に、誘電体酸化被膜、陰極層、陰極引出層を順次形成し、コンデンサ素子(3)を形成した。ここで焼結体はタンタルを用いたが、ニオブ、チタン、アルミニウム等の弁作用金属を使用しても良く、さらに、陽極リード(2)は、焼結体と同一の弁作用金属から構成した。   In the solid electrolytic capacitor, as shown in FIG. 4, a dielectric oxide film, a cathode layer, and a cathode lead layer are sequentially formed on the surface of the sintered body on which the anode lead (2) is implanted, and the capacitor element (3) is formed. Formed. Here, the sintered body used tantalum, but a valve metal such as niobium, titanium, and aluminum may be used, and the anode lead (2) is made of the same valve metal as the sintered body. .

また、陰極層として、ポリピロールを用い、陰極引出層はカーボン及び銀ペーストを用いた。   Further, polypyrrole was used as the cathode layer, and carbon and silver paste were used as the cathode lead layer.

陰極層としては、ポリピロールだけでなく、ポリチオフェン、ポリアニリン、ポリフラン等の導電性高分子やTCNQ(7,7,8,8-テトラシアノキノジメタン)錯塩等を使用しても良い。   As the cathode layer, not only polypyrrole but also conductive polymers such as polythiophene, polyaniline, and polyfuran, TCNQ (7,7,8,8-tetracyanoquinodimethane) complex salt, and the like may be used.

次に図1に示すように、陽極リードを陽極リードフレームと接合しやすい形に成形する。その際、陽極リード先端部と、冶具との接触点にかかる圧力を、下部(221)と上部(222)で比較して下部(221)が大きい状態で先端部(22)の上下を押し潰し、陽極リード先端部(22)の陽極リードフレーム(41)との接合面を、陽極リード引出部(21)の陽極リードフレーム(41)垂直方向中心より上側に形成する。   Next, as shown in FIG. 1, the anode lead is formed into a shape that can be easily joined to the anode lead frame. At that time, the pressure applied to the contact point between the tip of the anode lead and the jig is crushed up and down the tip (22) with the lower part (221) larger than the lower part (221) and the upper part (222). The joining surface of the anode lead tip (22) with the anode lead frame (41) is formed above the center of the anode lead extraction part (21) in the vertical direction of the anode lead frame (41).

その後、前記陽極リード先端部の接合面を陽極リードフレーム(41)と抵抗溶接等で、コンデンサ素子(3)の陰極引出層と陰極リードフレーム(42)を導電性接着剤(5)を用いて夫々接続し、前記陽極リードフレーム(41)と陰極リードフレーム(42)の一部を残し、コンデンサ素子を直方体状に外装樹脂(6)でハウジングする。ここで、両極リードフレーム(41)(42)は、銅を含む合金や鉄とニッケルとの合金等からなる。   Thereafter, the bonding surface of the anode lead tip is bonded to the anode lead frame (41) by resistance welding or the like, and the cathode lead layer of the capacitor element (3) and the cathode lead frame (42) are used using a conductive adhesive (5). Each of them is connected, leaving a part of the anode lead frame (41) and the cathode lead frame (42), and housing the capacitor element in the shape of a rectangular parallelepiped with the exterior resin (6). Here, the bipolar lead frames (41) and (42) are made of an alloy containing copper, an alloy of iron and nickel, or the like.

外装樹脂(6)の高さ方向の中央から引き出し、両極リードフレーム(41)(42)をハウジングの周面に沿って下向きに曲げ、固体電解コンデンサを得た。    The outer resin (6) was pulled out from the center in the height direction, and the bipolar lead frames (41) and (42) were bent downward along the peripheral surface of the housing to obtain a solid electrolytic capacitor.

上記固体電解コンデンサの製造過程において、前記陽極リード先端部(22)を押し潰す際、図6(a)のような形状をした冶具を用いる。該冶具は、陽極リード先端部(22)の形状に沿った上部(71a)と、略直方体の下部(72a)とからなる。前記冶具を用いて先端部(22)を押し潰すと、陽極リード先端部(22)と冶具上部(71a)との接触面積が先端部(22)と冶具下部(72a)とが接触する部分より大きくなり、先端部(22)の下方にかかる圧力が上方にかかる圧力に比べ大きくなるため、図6(b)のようにして押し潰すと、図1(a)に示すように接合面は前記引出部(21)の陽極リードフレーム(41)の垂直方向中心より上に形成される。また冶具の形状から、陽極リード先端部(22)端面から見ると図1(b)のように、陽極リード先端部(22)の上部は曲面で接合面が平坦な形状となる。    In the manufacturing process of the solid electrolytic capacitor, when crushing the tip end portion (22) of the anode lead, a jig having a shape as shown in FIG. 6 (a) is used. The jig includes an upper portion (71a) along the shape of the tip end portion (22) of the anode lead and a lower portion (72a) of a substantially rectangular parallelepiped. When the tip portion (22) is crushed using the jig, the contact area between the anode lead tip portion (22) and the jig upper portion (71a) is more than the portion where the tip portion (22) and the jig lower portion (72a) are in contact with each other. Since the pressure applied to the lower end of the tip (22) becomes larger than the pressure applied to the upper end, the joint surface is deformed as shown in FIG. 1 (a) when crushed as shown in FIG. 6 (b). The lead portion (21) is formed above the vertical center of the anode lead frame (41). Further, when viewed from the end surface of the anode lead tip (22) from the shape of the jig, as shown in FIG. 1B, the upper portion of the anode lead tip (22) has a curved surface and a flat joining surface.

実施例1の製造工程の中で、前記陽極リード先端部(22)を押し潰す際、図7(a)のような形状の冶具を用いる以外は、実施例1と同様な方法で固体電解コンデンサを作製した。該冶具は共に略直方体の上部(71b)下部(72b)からなり、且つ下部(72b)の陽極リード先端部(22)の端面から焼結体方向への幅寸法Yが、上部(71b)の幅寸法Xより小さくなっていることを特徴とする。前記冶具を用いて陽極リード先端部(22)を押し潰すと、陽極リード先端部(22)上方にかかる圧力より、下方にかかる圧力の方が大きいので、図7(b)のようにして押し潰すと、図2(a)に示すように、接合面は陽極リード引出層(21)のリードフレーム(41)(42)垂直方向中心より上方に形成される。また、冶具の形状から、陽極リード先端部(22)は平坦な接合面と、該先端部に略平行な平坦面を有し、リードフレーム(41)(42)垂直方向から見ると図1(b)、前記先端部(22)の端面方向から見ると図2(b)に示される形状となる。   In the manufacturing process of Example 1, when crushing the tip portion (22) of the anode lead, a solid electrolytic capacitor is obtained in the same manner as in Example 1 except that a jig having a shape as shown in FIG. Was made. The jigs are both substantially rectangular parallelepiped upper part (71b) lower part (72b), and the width dimension Y from the end surface of the anode lead tip part (22) of the lower part (72b) to the sintered body direction is the upper part (71b). It is characterized by being smaller than the width dimension X. When the tip of the anode lead (22) is crushed by using the jig, the pressure applied downward is larger than the pressure applied upward of the anode lead tip (22). When crushed, as shown in FIG. 2 (a), the joining surface is formed above the center in the vertical direction of the lead frame (41) (42) of the anode lead extraction layer (21). Further, due to the shape of the jig, the anode lead tip (22) has a flat joint surface and a flat surface substantially parallel to the tip, and when viewed from the vertical direction of the lead frame (41) (42), FIG. b) When viewed from the end face direction of the tip portion (22), the shape shown in FIG. 2 (b) is obtained.

上記実施例1、2の構成にすることで、陽極リードと陽極リードフレームが平行に接続されるので、コンデンサ素子と陰極リードフレームの傾きが改善され略平行になり、コンデンサ素子にかかる負荷が緩和される。さらに、陽極リードと陽極リードフレームとの傾きも改善され、接触面積の増大により、ESRを小さくできる。   By adopting the configuration of the first and second embodiments, since the anode lead and the anode lead frame are connected in parallel, the inclination of the capacitor element and the cathode lead frame is improved and becomes substantially parallel, and the load on the capacitor element is reduced. Is done. Furthermore, the inclination between the anode lead and the anode lead frame is also improved, and the ESR can be reduced by increasing the contact area.

また、上記実施例は本発明を説明するためのものであって、特許請求の範囲に記載の発明を限定し、或いは範囲を減縮する様に解すべきでない。   Moreover, the said Example is for demonstrating this invention, Comprising: It should not be understood that the invention as described in a claim is limited or the range is reduced.

本発明実施例1の陽極リードの側面図、正面図である。It is the side view of the anode lead of this invention Example 1, and a front view. 本発明実施例2の陽極リードの側面図、正面図である。It is the side view and front view of an anode lead of Example 2 of this invention. 従来の固体電解コンデンサの断面図。Sectional drawing of the conventional solid electrolytic capacitor. コンデンサ素子の断面詳細図。Sectional detail drawing of a capacitor | condenser element. 従来方法でのコンデンサ素子とリードフレームの接続状態。Connection state of capacitor element and lead frame in the conventional method. 本発明実施例1で陽極リード先端部を潰すために用いた冶具を示す正面図及び斜視図である。It is the front view and perspective view which show the jig used in order to crush an anode lead front-end | tip part in this invention Example 1. FIG. 本発明実施例2で陽極リード先端部を潰すために用いた冶具を示す正面図及び斜視図である。It is the front view and perspective view which show the jig used in order to crush an anode lead front-end | tip part in Example 2 of this invention.

符号の説明Explanation of symbols

(1) 固体電解コンデンサ
(2) 陽極リード
(21)陽極リード引出部
(22) 陽極リード先端部
・ コンデンサ素子
(31) 陽極体
(32)誘電体酸化被膜
(33)固体電解質層
(34)カーボン層及び銀ペースト層
(41) 陽極リードフレーム
(42) 陰極リードフレーム
(5) 導電性接着剤
(6) 外装樹脂
(71a) 陽極リード先端部を押し潰すときに用いる冶具
(72b) 陽極リード先端部を押し潰すときに用いる冶具

(1) Solid electrolytic capacitor
(2) Anode lead
(21) Anode lead lead-out part
(22) Anode lead tip / capacitor element
(31) Anode body
(32) Dielectric oxide film
(33) Solid electrolyte layer
(34) Carbon layer and silver paste layer
(41) Anode lead frame
(42) Cathode lead frame
(5) Conductive adhesive
(6) Exterior resin
(71a) Jig used to crush the tip of the anode lead
(72b) Jig used to crush the tip of the anode lead

Claims (3)

陽極リードが植立された弁作用金属からなる焼結体の表面に、誘電体被膜、陰極層、陰極引出層を順次形成したコンデンサ素子と、前記陽極リードに接続してなる陽極リードフレームと、前記陰極引出層に接続してなる陰極リードフレームと、前記コンデンサ素子の回りを陽極リードフレームと陰極リードフレームの一部を残して直方体状に被覆してなる外装樹脂とからなり、前記外装樹脂の高さ方向の中央からそれぞれ陽極リードフレームと陰極リードフレームが引き出された固体電解コンデンサにおいて、
前記陽極リードは、焼結体に繋がる引出部と先端部とからなり、該先端部は、陽極リードフレームの上面に接合される平坦な接合面を有し、且つ該接合面が、前記陽極リードフレームの垂直方向に関して、前記引出部の中心面より上にあり、
前記先端部は、前記接合面と、該接合面に略平行な平坦面を有し、先端部の端面から焼結体方向への平坦面の幅寸法は、前記接合面の幅寸法より大きいことを特徴とする固体電解コンデンサ。
A capacitor element in which a dielectric film, a cathode layer, and a cathode lead layer are sequentially formed on the surface of a sintered body made of a valve action metal in which an anode lead is implanted; an anode lead frame connected to the anode lead; A cathode lead frame connected to the cathode lead layer; and an exterior resin formed by covering the capacitor element in a rectangular parallelepiped shape with the anode lead frame and a part of the cathode lead frame being covered. In the solid electrolytic capacitor in which the anode lead frame and the cathode lead frame are drawn from the center in the height direction, respectively.
The anode lead includes a lead portion and a tip portion connected to the sintered body, and the tip portion has a flat joint surface joined to the upper surface of the anode lead frame, and the joint surface is the anode lead. The vertical direction of the frame is above the center plane of the drawer,
The tip portion has the joint surface and a flat surface substantially parallel to the joint surface, and the width dimension of the flat surface from the end face of the tip portion toward the sintered body is larger than the width dimension of the joint surface. Solid electrolytic capacitor characterized by
陽極リードが植立された陽極体と、該陽極リードの先端部に設けた平坦な接合面に接続された陽極リードフレームと、を備えた固体電解コンデンサの製造方法であって、
陽極リードとなる部材を前記陽極体に植立する工程と、
前記部材の、前記先端部に相当する部分において前記部材の延在方向と垂直な方向における一方端部に第1の圧力を加えると共に、前記一方端部と対向する他方端部に第1の圧力より大きい第2の圧力を加えることにより、前記他方端部側から押し潰して形成されると共に前記垂直な方向における中心よりも一方端部側に位置する前記接合面を形成する工程と、
互いに平行な状態で前記接合面と前記陽極リードフレームとを接続する工程と、
を備えることを特徴とする固体電解コンデンサの製造方法。
A method for producing a solid electrolytic capacitor comprising: an anode body in which an anode lead is planted; and an anode lead frame connected to a flat joint surface provided at a tip portion of the anode lead.
Planting a member to be an anode lead in the anode body ;
A first pressure is applied to one end in a direction perpendicular to the extending direction of the member at a portion corresponding to the tip of the member, and a first pressure is applied to the other end facing the one end. Forming the joining surface formed by crushing from the other end side by applying a larger second pressure and positioned on one end side than the center in the vertical direction;
Connecting the joining surface and the anode lead frame in a mutually parallel state;
A method for producing a solid electrolytic capacitor, comprising:
請求項2記載の固体電解コンデンサの製造方法において、
前記接合面を形成する工程では、前記一方端部側から押し潰すことにより前記一方端部側に位置する平坦面をさらに形成し、前記延在方向において前記平坦面の幅寸法は前記接合面の幅寸法より大きいことを特徴とする固体電解コンデンサの製造方法。
In the manufacturing method of the solid electrolytic capacitor of Claim 2,
In the step of forming the joining surface, a flat surface located on the one end side is further formed by crushing from the one end side, and the width dimension of the flat surface in the extending direction is equal to that of the joining surface. A method for manufacturing a solid electrolytic capacitor, wherein the solid electrolytic capacitor is larger than a width dimension.
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