JP4877157B2 - ANTENNA WITH THIN FILM COIL, ANTENNA SYSTEM, AND ANTENNA MANUFACTURING METHOD - Google Patents

Description

  The present invention relates to an antenna provided with a thin film coil, an antenna system using the antenna, and a method for manufacturing the antenna.

  As an antenna mounted in a cellular phone or a smaller electronic device, a laminated flat antenna coil using a thin film coil is known (for example, Patent Document 1).

  The antenna disclosed in Patent Document 1 includes a coiled flat laminated coil that continuously circulates in the laminating direction, and a coil core formed by laminating a magnetic layer on the inner portion thereof. It consists of a magnetic material layer.

Japanese Patent Publication No. 2-6445

  According to the antenna disclosed in Patent Document 1, it is possible to reduce the size to some extent, but since the amount of magnetic flux passing through the coil portion cannot be increased, the induced electromotive force is greatly reduced as the size is reduced. As a result, there arises a disadvantage that the function as an antenna cannot be fully exhibited.

  Accordingly, it is an object of the present invention to provide an antenna, an antenna system, and an antenna manufacturing method including a thin film coil capable of obtaining a sufficiently high induced electromotive force while being reduced in size.

  According to the present invention, the first magnetic layer formed of the magnetic material, the second magnetic layer formed of the magnetic material, and the first magnetic layer and the second magnetic layer are inserted. A thin film comprising: a thin film coil made of a conductive material; and a penetrating magnetic body formed of a magnetic material that penetrates the central portion of the thin film coil and magnetically connects the first magnetic layer and the second magnetic layer. An antenna with a coil is provided.

  Since the second and first magnetic layers are disposed above and below the thin film coil, the amount of magnetic flux passing through the thin film coil can be increased. In addition, since the penetrating magnetic material penetrating through the central portion of the thin film coil magnetically connects the first and second magnetic layers, the magnetic flux input to the first and second magnetic layers is passed through the penetrating magnetic material. Since it is collected by the body, the amount of magnetic flux passing through the thin film coil is further greatly increased. For this reason, a high induced electromotive force can be obtained while maintaining a small size without increasing the size.

  It is preferable that the first magnetic layer is a magnetic layer made of a soft magnetic material laminated on a substrate made of a nonmagnetic material, or a substrate made of a magnetic material.

  The magnetic permeability of the magnetic material forming the penetrating magnetic body is preferably higher than the magnetic permeability of the magnetic material forming the first magnetic layer and the second magnetic layer.

  It is also preferable that an insulating layer made of an insulating material formed on the entire surface or part of the first magnetic layer is further provided, and a thin film coil is formed on the insulating layer. In this case, it is more preferable that the thin film coil is a coil made of at least one layer of conductive material formed in a spiral shape so as to surround the penetrating magnetic body on the insulating layer.

  It is also preferable to further include a coil insulating layer made of an insulating material formed on the thin film coil and between the thin film coils, and a protective layer made of an insulating material laminated on the second magnetic layer.

  A pair of connection pads made of a conductive material electrically connected to both ends of the thin-film coil, and a pair of conductive materials electrically connected to the pair of connection pads and provided on the side surfaces of the antenna. It is also preferable to further include the side electrode.

  It is also preferable that the penetrating magnetic body is formed only on the inner wall surface of the through hole penetrating the center portion of the thin film coil, or the through hole penetrating the center portion of the thin film coil is filled without a space. .

  According to the present invention, the antenna and the magnetic sheet magnetically bonded to at least one surface of the antenna, or the magnetic material magnetically bonded to the two surfaces, An antenna system including a magnetic sheet is provided.

  According to the present invention, furthermore, the step of forming the insulating layer with the insulating material on the entire surface or part of the first magnetic layer formed with the magnetic material, and the thin film with a predetermined pattern on the insulating layer A step of forming the coil with a conductive material, a step of forming a penetrating magnetic body that penetrates the center of the thin film coil with a magnetic material, and a second magnetically connected to the first magnetic layer by the penetrating magnetic body. And a step of forming the magnetic layer with a magnetic material.

  Preferably, the method further includes a step of laminating a first magnetic layer on a substrate formed of a non-conductive material, or a step of preparing a substrate formed of a magnetic material as the first magnetic layer.

  It is also preferred that the step of forming the thin film coil is a step of forming at least one coil formed in a spiral shape on the insulating layer with a conductive material.

  The step of forming the thin film coil includes forming a first layer coil on the insulating layer with a conductive material, forming a coil insulating layer between the first layer coils and on the coil with an insulating material, and forming the coil insulation. It is also preferable to include forming a second layer coil on the layers with a conductive material and forming a coil insulating layer between and on the second layer coils with an insulating material.

  The step of forming the thin film coil includes forming a first layer coil on the insulating layer with a conductive material, forming a coil insulating layer between the first layer coils and on the coil with an insulating material, and forming the coil insulation. And planarizing the surface of the layer, forming a coil of the second layer on the conductor material thereon, and forming a coil insulating layer between and on the coils of the second layer of the insulator material. preferable.

  A step of forming a pair of connection pads electrically connected to both ends of the thin film coil by using a conductive material, and a pair of side electrodes that are electrically connected to the pair of connection pads, respectively, on the side surface of the antenna It is also preferable to further include a step of forming the conductive material.

  It is also preferable to further include a step of forming a protective layer with an insulator material on the second magnetic layer.

  It is also preferable that the step of forming the penetrating magnetic body is a step of forming the magnetic body only on the inner wall surface in the through hole penetrating the central portion of the thin film coil in the step of forming the second magnetic layer.

  The step of forming the penetrating magnetic body is the step of forming the second magnetic layer, the step of forming the magnetic body on the inner wall surface in the through hole penetrating the central portion of the thin film coil, and the space inside the through hole. It is also preferable that the step is a step of filling the magnetic material without any.

  According to the present invention, a high induced electromotive force can be obtained while maintaining a small size without increasing the size.

  FIG. 1 is a perspective view schematically showing an example of a basic configuration of a small antenna of the present invention, and FIG. 2 is a cross-sectional view taken along line AA of FIG.

  As can be seen from these drawings, the small antenna of the present invention is formed in a rectangular parallelepiped shape in which thin films are laminated on a substrate in this example, and the laminated surface has a rectangular shape with a side of 10 mm or less.

In both figures, 10 is a nonmagnetic substrate having a thickness of about 0.2 to 2 mm formed of a nonmagnetic material such as alumina (Al ₂ O ₃ ) or silicon, and 11 is laminated on the nonmagnetic substrate 10. A magnetic layer (corresponding to the first magnetic layer of the present invention) having a thickness of about 0.1 to 10 μm made of a soft magnetic material such as nickel iron (NiFe), 12 is laminated in parallel with the magnetic layer 11 For example, a magnetic layer (corresponding to the second magnetic layer of the present invention) having a thickness of about 0.1 to 10 μm made of a soft magnetic material such as NiFe, 13 is provided in two layers in a spiral shape between the magnetic layers 11 and 12. For example, a thin film coil having a thickness of about 1 to 20 μm made of a conductive material such as copper (Cu), 14 is made of an insulating material such as Al ₂ O ₃ or polyimide resin formed above and below the thin film coil 13, or Resist material The magnetic insulating layer 15 penetrates the center of the thin film coil 13 and is magnetically coupled to the magnetic layers 11 and 12, preferably through magnetic material such as NiFe having a high magnetic permeability. Each body is shown.

  Thus, since the magnetic layers 12 and 11 are arranged above and below the thin film coil 13 in the small antenna of the present invention, the amount of magnetic flux passing through the thin film coil 13 can be increased. In addition, since the penetrating magnetic body 15 penetrating through the central portion of the thin film coil 13 magnetically connects the magnetic layers 11 and 12, the magnetic flux that has entered the magnetic layers 11 and 12 is collected in the penetrating magnetic body 15. Therefore, the amount of magnetic flux passing through the thin film coil 13 is further increased. For this reason, a high induced electromotive force can be obtained while maintaining a small size without increasing the size.

  By using a magnetic material having a higher permeability than the magnetic material of the magnetic layers 11 and 12 for the penetrating magnetic body 15, it becomes easier to guide the magnetic flux from the magnetic layers 11 and 12 to the penetrating magnetic body 15 and passes through the thin film coil 13. The magnetic flux can be further increased.

  FIG. 3 is a perspective view showing an example of an antenna system in which the small antenna of FIG. 1 is attached to a magnetic sheet.

  As shown in the figure, this antenna system includes a small antenna 30 and a magnetic sheet 31 in which the magnetic layer 12 side surface of the small antenna 30 is magnetically bonded. The magnetic sheet 31 is a soft magnetic material sheet rich in flexibility made of a magnetic material and a resin, and has a thickness of 0 which is commercially available as a noise suppression sheet, a magnetic sheet for RFID (Radio Frequency IDentification), a flexible sheet, and the like. A flexible magnetic sheet of about 4 to 2 mm.

  By magnetically joining one surface of the small antenna 30 to such a large-area magnetic sheet 31, the induced electromotive force is increased, and the sensitivity of the antenna can be greatly increased.

  By configuring so that the magnetic permeability of the small antenna 30 is greater than the magnetic permeability of the magnetic sheet 31, the magnetic permeability of the penetrating magnetic body 15 is further increased within the small antenna 30 as described above. The magnetic flux can be more effectively guided to the center of the coil by configuring the magnetic flux to be larger than the magnetic permeability. It is also effective to change the magnetic permeability of the magnetic sheet 31 itself, that is, to make the magnetic permeability of the joint portion of the small antenna 30 high.

  It may be desirable to use a transparent sheet as the magnetic sheet 31 depending on the use of the small antenna.

  It is also effective to magnetically bond the small antenna 30 to a surface on which a magnetic material is deposited or applied instead of the magnetic sheet.

  FIG. 4 is a cross-sectional view showing the configuration of the first embodiment of the small antenna of the present invention.

In the figure, reference numeral 40 denotes a nonmagnetic substrate having a thickness of about 0.2 to 2 mm formed of a nonmagnetic material such as Al ₂ O ₃ or silicon, and 41 denotes NiFe or the like laminated on the nonmagnetic substrate 40. A magnetic layer (corresponding to the first magnetic layer of the present invention) having a thickness of about 0.1 to 10 μm made of a soft magnetic material, and 42 is an Al layer having a thickness of about 0.3 to 3 μm laminated on the magnetic layer 41. ₂ O ₃ or an insulating layer made of an insulating material such as polyimide resin having a thickness of about 1 to 10 μm, 43 is a thickness of 1 to 20 μm made of a conductive material such as Cu provided in a spiral shape on the insulating layer 42 in two layers A thin film coil of about 44, a coil insulating layer 44 made of an insulating material such as Al ₂ O ₃ , polyimide resin or the like formed on and between the thin film coil 43 or a resist material, and 45 a thin film coil on the coil insulating layer 44 and the thin film coil 43 centers , A magnetic layer (corresponding to the second magnetic layer and the penetrating magnetic body of the present invention) having a thickness of about 0.1 to 10 μm made of a soft magnetic material such as NiFe laminated on the insulating layer 42, 46 is a magnetic layer 45 is a protective layer made of an insulating material such as Al ₂ O ₃ or polyimide resin, and 47 is a pair of connections made of a conductive material such as gold (Au) electrically connected to both ends of the thin film coil 43. Each pad is shown.

  In the present embodiment, the magnetic layer 45 is formed not only on the coil insulating layer 44 but also on the inner wall surface and the bottom surface of the through hole 48 that penetrates the central portion of the thin film coil 43. Thus, the magnetic layer 45 itself serves as the penetrating magnetic body of the present invention, and the magnetic layer 45 and the magnetic layer 41 are magnetically connected. Actually, the insulating layer 42 exists between the bottom surface of the magnetic layer 45 and the magnetic layer 41. However, since the insulating layer 42 is thin, the magnetic layer 41 and the magnetic layer 45 are magnetically separated. Will be combined.

  5A and 5B are cross-sectional views for explaining a manufacturing process of the small antenna according to the first embodiment. Hereinafter, the manufacturing method of the small antenna in this embodiment is demonstrated using these figures.

First, as shown in FIG. 5A (a), a NiFe film is formed by sputtering on a nonmagnetic substrate 40 having a thickness of about 0.2 to 2 mm made of Al ₂ O ₃ or silicon, and a NiFe film is formed thereon. A magnetic layer 41 having a thickness of about 0.1 to 10 μm is laminated by plating NiFe. The magnetic layer 41 may be laminated only by sputtering without performing plating.

Next, as shown in FIG. 5A (b), an insulating layer 42 made of an insulating material such as Al ₂ O _{3 having a} thickness of about 0.3 to ₃ μm or a polyimide resin having a thickness of about 1 to 10 μm is laminated thereon. . For example, Al ₂ O ₃ is formed by sputtering and polyimide resin is applied by spin coating and baked.

  Next, as shown in FIG. 5A (c), an electrode film 49 having a two-layer structure of chromium (Cr) film / Cu film (a structure in which a Cu film is laminated on a Cr film) is laminated thereon by sputtering.

  Next, as shown in FIG. 5A (d), a thin film coil 43 having a thickness of about 1 to 20 μm is formed by forming a photoresist pattern 50 for forming a thin film coil thereon and plating a conductor material such as Cu. After forming, the photoresist pattern 50 is peeled off. This state is shown in FIG. 5A (e).

Next, as shown in FIG. 5A (f), a coil insulating layer 44 made of an insulating material such as Al ₂ O ₃ , polyimide resin or a resist material is formed on and between the thin film coils 43. In the case of Al ₂ O _3, a photoresist pattern is formed thereon and sputtered, followed by lift-off. In the case of a polyimide resin and a resist material, it is applied and baked, and then exposed, developed and patterned.

  By repeating the manufacturing steps shown in FIGS. 5A (c) to 5 (f), a two-layer spiral thin film coil 43 is formed as shown in FIG. 5A (g).

  Next, as shown in FIG. 5A (h), a NiFe film 45a is formed on the coil insulating layer 44 by sputtering, and as shown in FIG. 5A (i), a photoresist pattern 51 for forming a magnetic layer is formed thereon. The magnetic layer 45 having a thickness of about 0.1 to 10 μm is formed by plating and plating a magnetic material such as NiFe, and then the photoresist pattern 51 is peeled off. This state is shown in FIG. 5A (j). The magnetic layer 45 may be formed only by NiFe sputtering without plating.

Next, as shown in FIG. 5B (a), a protective layer 46 made of an insulating material such as Al ₂ O ₃ or polyimide resin is laminated thereon. In the case of Al ₂ O ₃ , after sputtering, a photoresist pattern is formed and milled. In the case of polyimide resin, it is applied and baked, and then exposed, developed and patterned.

  Next, as shown in FIG. 5B (b), a pair of connection pads 47 made of a conductive material such as Au is formed so as to be electrically connected to both ends of the thin film coil 43, respectively. This is formed by sputtering Au, forming a photoresist pattern for the connection pad, plating Au, and then peeling the photoresist pattern.

  FIG. 6 is a sectional view showing the configuration of the second embodiment of the small antenna of the present invention. In the present embodiment, the same reference numerals are used for the same components as those in the first embodiment of FIG.

In FIG. 6, reference numeral 40 denotes a nonmagnetic substrate having a thickness of about 0.2 to 2 mm formed of a nonmagnetic material such as Al ₂ O ₃ or silicon, and 41 denotes NiFe or the like laminated on the nonmagnetic substrate 40. A magnetic layer (corresponding to the first magnetic layer of the present invention) having a thickness of about 0.1 to 10 μm made of a soft magnetic material, and 42 is an Al layer having a thickness of about 0.3 to 3 μm laminated on the magnetic layer 41. ₂ O ₃ or an insulating layer made of an insulating material such as polyimide resin having a thickness of about 1 to 10 μm, 43 is a thickness of 1 to 20 μm made of a conductive material such as Cu provided in a spiral shape on the insulating layer 42 in two layers A thin film coil of about 44, a coil insulating layer 44 made of an insulating material such as Al ₂ O ₃ , polyimide resin or the like formed on and between the thin film coil 43 or a resist material, and 45 a thin film coil on the coil insulating layer 44 and the thin film coil 43 centers , A magnetic layer (corresponding to the second magnetic layer of the present invention) having a thickness of about 0.1 to 10 μm made of a soft magnetic material such as NiFe laminated on the insulating layer 42, 52 is a central portion of the magnetic layer 45 The magnetic layer 45 formed on the inner wall surface and the bottom surface of the through hole 48 penetrating through the inside of the magnetic layer 45 is filled with a composite ferrite or the like filled with no space (together with the magnetic layer 45, the penetrating magnetic body of the present invention). 46) is a protective layer made of an insulating material such as Al ₂ O ₃ or polyimide resin laminated on the magnetic layer 45, and 47 is a conductor material such as Au electrically connected to both ends of the thin film coil 43. A pair of connection pads is shown.

  In the present embodiment, the magnetic layer 45 is formed not only on the coil insulating layer 44 but also on the inner wall surface and the bottom surface of the through hole 48 that penetrates the central portion of the thin film coil 43, and the through hole 48. The inside of the inner magnetic layer 45 is filled with a filling magnetic body 52 with no space. Thereby, the magnetic layer 45 and the filling magnetic body 52 serve as the penetrating magnetic body of the present invention, and the magnetic layer 45 and the magnetic layer 41 are magnetically connected. Actually, the insulating layer 42 exists between the bottom surface of the magnetic layer 45 and the magnetic layer 41. However, since the insulating layer 42 is thin, the magnetic layer 41 and the magnetic layer 45 are magnetically separated. Will be combined.

  7A and 7B are cross-sectional views for explaining a manufacturing process of the small antenna according to the second embodiment. Hereinafter, the manufacturing method of the small antenna in this embodiment is demonstrated using these figures.

First, as shown in FIG. 7A (a), a NiFe film is formed by sputtering on a non-magnetic substrate 40 having a thickness of about 0.2 to 2 mm made of Al ₂ O ₃ or silicon, and a NiFe film is formed thereon. A magnetic layer 41 having a thickness of about 0.1 to 10 μm is laminated by plating NiFe. The magnetic layer 41 may be laminated only by sputtering without performing plating.

Next, as shown in FIG. 7A (b), an insulating layer 42 made of an insulating material such as Al ₂ O _{3 having a} thickness of about 0.3 to ₃ μm or a polyimide resin having a thickness of about 1 to 10 μm is laminated thereon. . For example, Al ₂ O ₃ is formed by sputtering and polyimide resin is applied by spin coating and baked.

  Next, as shown in FIG. 7A (c), an electrode film 49 having a two-layer structure of Cr film / Cu film (a structure in which a Cu film is laminated on a Cr film) is laminated thereon by sputtering.

  Next, as shown in FIG. 7A (d), a thin film coil 43 having a thickness of about 1 to 20 μm is formed by forming a photoresist pattern 50 for forming a thin film coil thereon and plating a conductor material such as Cu. After forming, the photoresist pattern 50 is peeled off. This state is shown in FIG. 7A (e).

Next, as shown in FIG. 7A (f), a coil insulating layer 44 made of an insulating material such as Al ₂ O ₃ , polyimide resin or a resist material is formed on and between the thin film coils 43. In the case of Al ₂ O _3, a photoresist pattern is formed thereon and sputtered, followed by lift-off. In the case of a polyimide resin and a resist material, it is applied and baked, and then exposed, developed and patterned.

  By repeating the manufacturing steps of FIGS. 7A (c) to 7 (f), a two-layer spiral thin film coil 43 is formed as shown in FIG. 7A (g).

  Next, as shown in FIG. 7A (h), a NiFe film 45a is formed on the coil insulating layer 44 by sputtering, and as shown in FIG. 7A (i), a photoresist pattern 51 for forming a magnetic layer is formed thereon. The magnetic layer 45 having a thickness of about 0.1 to 10 μm is formed by plating and plating a magnetic material such as NiFe, and then the photoresist pattern 51 is peeled off. This state is shown in FIG. 7A (j). The magnetic layer 45 may be formed only by NiFe sputtering without plating.

  Next, as shown in FIG. 7B (a), the composite magnetic material 52 made of ferrite grains having a diameter of about 3 to 60 μm is screen-printed on the inner side of the magnetic layer 45 in the through-hole 48, thereby filling the filled magnetic body 52 into the space. Fill without.

Next, as shown in FIG. 7B (b), a protective layer 46 made of an insulating material such as Al ₂ O ₃ or polyimide resin is laminated thereon. In the case of Al ₂ O ₃ , after sputtering, a photoresist pattern is formed and milled. In the case of polyimide resin, it is applied and baked, and then exposed, developed and patterned.

  Next, as shown in FIG. 7B (c), a pair of connection pads 47 made of a conductive material such as Au is formed so as to be electrically connected to both ends of the thin film coil 43, respectively. This is formed by sputtering Au, forming a photoresist pattern for the connection pad, plating Au, and then peeling the photoresist pattern.

  FIG. 8 is a cross-sectional view schematically showing another example of the basic configuration of the small antenna of the present invention, and corresponds to a cross section taken along line AA of FIG.

  Also in this example, the small antenna of the present invention is formed in a rectangular parallelepiped shape in which thin films are laminated on a substrate, and the laminated surface has a rectangular shape with a side of 10 mm or less.

In FIG. 8, 80 is a magnetic substrate (corresponding to the first magnetic layer of the present invention) having a thickness of about 0.2 to 2 mm made of a magnetic material such as ferrite, and 82 is a magnetic substrate 80. A magnetic layer (corresponding to the second magnetic layer of the present invention) having a thickness of about 0.1 to 10 μm made of a soft magnetic material such as NiFe laminated in parallel is provided between the magnetic substrate 80 and the magnetic layer 82. A thin film coil having a thickness of about 1 to 20 μm made of a conductive material such as Cu provided in two layers in a spiral shape, and 84 is formed of, for example, Al ₂ O ₃ , polyimide resin or the like formed above and below the thin film coil 83 A coil insulating layer 85 made of an insulating material or a resist material, and 85 is a magnetic material that penetrates through the central portion of the thin film coil 83 and is magnetically coupled to the magnetic substrate 80 and the magnetic layer 82, preferably, for example, a high magnetic permeability. N Magnetic material such as Fe, respectively show through magnetic body according.

  As described above, since the magnetic substrate 80 and the magnetic layer 82 are disposed above and below the thin film coil 83, the small antenna of the present invention can increase the amount of magnetic flux passing through the thin film coil 83. In addition, since the penetrating magnetic body 85 penetrating through the central portion of the thin film coil 83 magnetically connects the magnetic substrate 80 and the magnetic layer 82, the magnetic flux input to the magnetic substrate 80 and the magnetic layer 82 is this. Since the magnetic flux is collected in the penetrating magnetic body 85, the amount of magnetic flux passing through the thin film coil 83 is further greatly increased. For this reason, a high induced electromotive force can be obtained while maintaining a small size without increasing the size.

  By using a magnetic material having a higher magnetic permeability than the magnetic material of the magnetic substrate 80 and the magnetic layer 82 for the penetrating magnetic member 85, it becomes easier to guide the magnetic flux from the magnetic substrate 80 and the magnetic layer 82 to the penetrating magnetic member 85, The magnetic flux passing through the thin film coil 83 can be further increased.

  The small antenna of FIG. 8 may also be attached to a magnetic sheet as shown in FIG. 3 to form an antenna system. Further, both surfaces of the small antenna of FIG. 8 may be attached to two magnetic sheets and magnetically coupled.

  By magnetically joining one or both sides of the small antenna to such a large area magnetic sheet, the induced electromotive force is increased, and the sensitivity of the antenna can be greatly increased.

  By configuring the small antenna so that the magnetic permeability of the small antenna is larger than that of the magnetic sheet, the magnetic permeability of the penetrating magnetic body 85 can be increased within the small antenna as described above. The magnetic flux can be more effectively guided to the center of the coil by configuring the magnetic flux to be larger than the magnetic permeability. It is also effective to change the magnetic permeability of the magnetic sheet itself, that is, to increase the magnetic permeability of the joint portion of the small antenna.

  It may be desirable to use a transparent sheet as the magnetic sheet depending on the use of the small antenna.

  It is also effective to magnetically bond a small antenna to a surface on which a magnetic material is deposited or applied instead of the magnetic sheet.

  FIG. 9 is a cross-sectional view showing the configuration of the third embodiment of the small antenna of the present invention.

In the figure, 90 is a magnetic substrate having a thickness of about 0.2 to 2 mm formed of a magnetic material such as ferrite (corresponding to the first magnetic layer of the present invention), and 92 is on the magnetic substrate 90. An insulating layer 93 made of an insulating material such as Al ₂ O ₃ having a thickness of about 0.3 to ₃ μm or a polyimide resin having a thickness of about 1 to 10 μm is provided on the insulating layer 92 in a spiral manner. A thin film coil having a thickness of about 1 to 20 μm made of a conductive material such as Cu, and a coil 94 made of an insulating material such as Al ₂ O ₃ , polyimide resin or the like formed on and between the thin film coil 93 or a resist material An insulating layer 95 is a magnetic layer having a thickness of about 0.1 to 10 μm made of a soft magnetic material such as NiFe laminated on the insulating layer 92 on the coil insulating layer 94 and in the central portion of the thin film coil 93 (first embodiment of the present invention). 2 magnets 96 corresponds to a conductive layer and a penetrating magnetic body), 96 is a protective layer made of an insulating material such as Al ₂ O ₃ or polyimide resin laminated on the magnetic layer 95, and 97 is electrically connected to both ends of the thin film coil 93. A pair of connection pads made of a conductive material such as Au is shown.

  In the present embodiment, the magnetic layer 95 is formed not only on the coil insulating layer 94 but also on the inner wall surface and the bottom surface of the through hole 98 that penetrates the central portion of the thin film coil 93. As a result, the magnetic layer 95 itself serves as the penetrating magnetic body of the present invention, and the magnetic layer 95 and the magnetic substrate 90 are magnetically connected. Actually, the insulating layer 92 exists between the bottom surface of the magnetic layer 95 and the magnetic substrate 90. However, since the insulating layer 92 is thin, the magnetic substrate 90 and the magnetic layer 95 are magnetically formed. Will be combined.

  10A and 10B are cross-sectional views for explaining a manufacturing process of the small antenna according to the third embodiment. Hereinafter, the manufacturing method of the small antenna in this embodiment is demonstrated using these figures.

First, as shown in FIG. 10A (a), Al ₂ O _{3 with a} thickness of about 0.3 to ₃ μm or a thickness of 1 is formed on a magnetic substrate 90 with a thickness of about 0.2 to ₂ mm formed of ferrite. An insulating layer 92 made of an insulating material such as polyimide resin having a thickness of about 10 μm is laminated, and further, an electrode film 99 having a two-layer structure of Cr film / Cu film (a structure in which a Cu film is laminated on the Cr film). Are laminated by sputtering.

  Next, as shown in FIG. 10A (b), a photoresist pattern 100 for forming a thin film coil is formed thereon, and a conductive material such as Cu is plated, whereby a thin film coil 93 having a thickness of about 1 to 20 μm is formed. After forming, the photoresist pattern 100 is peeled off. This state is shown in FIG. 10A (c).

Next, as shown in FIG. 10A (d), a coil insulating layer 94 made of an insulating material such as Al ₂ O ₃ and polyimide resin or a resist material is formed on and between the thin film coils 93. In the case of Al ₂ O _3, a photoresist pattern is formed thereon and sputtered, followed by lift-off. In the case of a polyimide resin and a resist material, it is applied and baked, and then exposed, developed and patterned.

  By repeating the manufacturing steps shown in FIGS. 10A (a) to 10 (d), a two-layer spiral thin film coil 93 is formed as shown in FIG. 10A (e).

  Next, as shown in FIG. 10A (f), a NiFe film 95a is formed on the coil insulating layer 94 by sputtering, and as shown in FIG. 10A (g), a photoresist pattern 101 for forming a magnetic layer is formed thereon. After forming a magnetic layer 95 having a thickness of about 0.1 to 10 μm by plating and plating a magnetic material such as NiFe, the photoresist pattern 101 is peeled off. This state is shown in FIG. 10A (h). The magnetic layer 95 may be formed only by NiFe sputtering without plating.

Next, as shown in FIG. 10A (i), a protective layer 96 made of an insulating material such as Al ₂ O ₃ or polyimide resin is laminated thereon. In the case of Al ₂ O ₃ , after sputtering, a photoresist pattern is formed and milled. In the case of polyimide resin, it is applied and baked, and then exposed, developed and patterned.

  Next, as shown in FIG. 10B (a), a pair of connection pads 97 made of a conductive material such as Au is formed so as to be electrically connected to both ends of the thin film coil 93, respectively. This is formed by sputtering Au, forming a photoresist pattern for the connection pad, plating Au, and then peeling the photoresist pattern.

  FIG. 11 is a sectional view showing the configuration of the fourth embodiment of the small antenna of the present invention. In the present embodiment, the same reference numerals are used for the same components as in the third embodiment of FIG.

In FIG. 11, 90 is a magnetic substrate formed of a magnetic material such as ferrite and has a thickness of about 0.2 to 2 mm (corresponding to the first magnetic layer of the present invention), and 92 is on the magnetic substrate 90. An insulating layer 93 made of an insulating material such as Al ₂ O ₃ having a thickness of about 0.3 to ₃ μm or a polyimide resin having a thickness of about 1 to 10 μm is provided on the insulating layer 92 in a spiral manner. A thin film coil having a thickness of about 1 to 20 μm made of a conductive material such as Cu, and a coil 94 made of an insulating material such as Al ₂ O ₃ , polyimide resin or the like formed on and between the thin film coil 93 or a resist material An insulating layer 95 is a magnetic layer having a thickness of about 0.1 to 10 μm made of a soft magnetic material such as NiFe laminated on the insulating layer 92 on the coil insulating layer 94 and in the central portion of the thin film coil 93 (first embodiment of the present invention). 2 102 (corresponding to the magnetic layer) is composed of a composite ferrite or the like filled with no space inside the magnetic layer 95 formed on the inner wall surface and the bottom surface of the through-hole 98 penetrating the central portion of the magnetic layer 95. Filled magnetic body (corresponding to the penetrating magnetic body of the present invention together with the magnetic layer 95), 96 is a protective layer made of an insulating material such as Al ₂ O ₃ or polyimide resin laminated on the magnetic layer 95, 97 is a thin film coil 93 A pair of connection pads made of a conductive material such as Au electrically connected to both ends of each are shown.

  In the present embodiment, the magnetic layer 95 is formed not only on the coil insulating layer 94 but also on the inner wall surface and the bottom surface of the through hole 98 that penetrates the central portion of the thin film coil 93. Inside the magnetic layer 95, the filling magnetic body 102 is filled without any space. As a result, the magnetic layer 95 and the filled magnetic body 102 serve as the penetrating magnetic body of the present invention, and the magnetic layer 95 and the magnetic substrate 90 are magnetically connected. Actually, the insulating layer 92 exists between the bottom surface of the magnetic layer 95 and the magnetic substrate 90. However, since the insulating layer 92 is thin, the magnetic substrate 90 and the magnetic layer 95 are magnetically formed. Will be combined.

  12A and 12B are cross-sectional views for explaining a manufacturing process of the small antenna according to the fourth embodiment. Hereinafter, the manufacturing method of the small antenna in this embodiment is demonstrated using these figures.

First, as shown in FIG. 12A (a), Al ₂ O ₃ having a thickness of about 0.3 to ₃ μm or a thickness of 1 is formed on a magnetic substrate 90 having a thickness of about 0.2 to ₂ mm formed of ferrite. An insulating layer 92 made of an insulating material such as polyimide resin having a thickness of about 10 μm is laminated, and further, an electrode film 99 having a two-layer structure of Cr film / Cu film (a structure in which a Cu film is laminated on the Cr film). Are laminated by sputtering.

  Next, as shown in FIG. 12A (b), a thin film coil 93 having a thickness of about 1 to 20 μm is formed by forming a photoresist pattern 100 for forming a thin film coil thereon and plating a conductor material such as Cu. After forming, the photoresist pattern 100 is peeled off. This state is shown in FIG. 12A (c).

Next, as shown in FIG. 12A (d), a coil insulating layer 94 made of an insulating material such as Al ₂ O ₃ and polyimide resin or a resist material is formed on and between the thin film coils 93. In the case of Al ₂ O _3, a photoresist pattern is formed thereon and sputtered, followed by lift-off. In the case of a polyimide resin and a resist material, it is applied and baked, and then exposed, developed and patterned.

  By repeating the manufacturing steps shown in FIGS. 12A (a) to 12 (d), a two-layer spiral thin film coil 93 is formed as shown in FIG. 12A (e).

  Next, as shown in FIG. 12A (f), a NiFe film 95a is formed on the coil insulating layer 94 by sputtering, and as shown in FIG. 12A (g), a photoresist pattern 101 for forming a magnetic layer is formed thereon. After forming the magnetic layer 9 having a thickness of about 0.1 to 10 μm by plating with a magnetic material such as NiFe, the photoresist pattern 101 is peeled off. This state is shown in FIG. 12A (h). The magnetic layer 95 may be formed only by NiFe sputtering without plating.

  Next, as shown in FIG. 12B (a), the composite magnetic material 102 made of ferrite grains having a diameter of about 3 to 60 μm is screen-printed on the inner side of the magnetic layer 95 in the through hole 98, so that the filled magnetic body 102 is made into a space. Fill without.

Next, as shown in FIG. 12B (b), a protective layer 96 made of an insulating material such as Al ₂ O ₃ or polyimide resin is laminated thereon. In the case of Al ₂ O ₃ , after sputtering, a photoresist pattern is formed and milled. In the case of polyimide resin, it is applied and baked, and then exposed, developed and patterned.

  Next, as shown in FIG. 12B (c), a pair of connection pads 97 made of a conductive material such as Au is formed so as to be electrically connected to both ends of the thin film coil 93, respectively. This is formed by sputtering Au, forming a photoresist pattern for the connection pad, plating Au, and then peeling the photoresist pattern.

  FIG. 13: is sectional drawing which shows the structure of 5th Embodiment of the small antenna of this invention.

In the figure, reference numeral 130 denotes a nonmagnetic substrate having a thickness of about 0.2 to 2 mm formed of a nonmagnetic material such as Al ₂ O ₃ or silicon, and 131 denotes NiFe or the like laminated on the nonmagnetic substrate 130. A magnetic layer (corresponding to the first magnetic layer of the present invention) made of a soft magnetic material having a thickness of about 0.1 to 10 μm, 132 is an Al layer laminated on the magnetic layer 131 only in the region where the thin film coil is formed. _An insulating layer made of an insulating material such as ₂ O ₃ or polyimide resin, 133 is a thin film coil having a thickness of about 1 to 20 μm made of a conductive material such as Cu provided in two layers spirally on the insulating layer 132, 134 A coil insulating layer made of an insulating material such as Al ₂ O ₃ , polyimide resin or the like formed on and between the thin film coil 133 or a resist material, 135 is on the coil insulating layer 134 and the thin film coil 1 In the central portion of 33, a magnetic layer (corresponding to the second magnetic layer and the penetrating magnetic body of the present invention) having a thickness of about 0.1 to 10 μm made of a soft magnetic material such as NiFe laminated on the magnetic layer 131, 136 is a protective layer made of an insulating material such as Al ₂ O ₃ or polyimide resin laminated on the magnetic layer 135, and 137 is a pair of a conductive material such as Au that is electrically connected to both ends of the thin film coil 133. Each connection pad is shown.

  In the present embodiment, the magnetic layer 135 is formed not only on the coil insulating layer 134 but also on the inner wall surface and the bottom surface of the through hole 138 that penetrates the central portion of the thin film coil 133. As a result, the magnetic layer 135 itself serves as the penetrating magnetic body of the present invention, and the magnetic layer 135 and the magnetic layer 131 are magnetically connected.

  14A and 14B are cross-sectional views for explaining a manufacturing process of the small antenna according to the fifth embodiment. Hereinafter, the manufacturing method of the small antenna in this embodiment is demonstrated using these figures.

First, as shown in FIG. 14A (a), a NiFe film is formed by sputtering on a non-magnetic substrate 130 having a thickness of about 0.2 to 2 mm formed of Al ₂ O ₃ or silicon, and a NiFe film is formed thereon. A magnetic layer 131 having a thickness of about 0.1 to 10 μm is laminated by plating NiFe. The magnetic layer 131 may be laminated only by sputtering without performing plating.

Next, as shown in FIG. 14A (b), an insulating layer 132 made of an insulating material such as Al ₂ O ₃ or polyimide resin is laminated only on the region where the thin film coil is formed. For example, in the case of Al ₂ O ₃ , after sputtering, a photoresist pattern is formed and milled, or after forming a photoresist pattern and sputtering, lift-off is performed. In the case of a polyimide resin, it is applied by spin coating and baked, and then exposed, developed and patterned.

  Next, as shown in FIG. 14A (c), an electrode film 139 having a two-layer structure of Cr film / Cu film (a structure in which a Cu film is laminated on a Cr film) is laminated thereon by sputtering.

  Next, as shown in FIG. 14A (d), a thin film coil forming photoresist pattern 140 is formed thereon, and a thin film coil 133 having a thickness of about 1 to 20 μm is formed by plating a conductive material such as Cu. After forming, the photoresist pattern 140 is peeled off. This state is shown in FIG. 14A (e).

Next, as shown in FIG. 14A (f), a coil insulating layer 134 made of an insulating material such as Al ₂ O ₃ , polyimide resin or a resist material is formed on and between the thin film coils 133. In the case of Al ₂ O _3, a photoresist pattern is formed thereon and sputtered, followed by lift-off. In the case of a polyimide resin and a resist material, it is applied and baked, and then exposed, developed and patterned.

  14A (c) to 14 (f) are repeated to form a two-layer spiral thin film coil 133 as shown in FIG. 14A (g).

  Next, as shown in FIG. 14A (h), a NiFe film 135a is formed on the coil insulating layer 134 by sputtering, and as shown in FIG. 14A (i), a photoresist pattern 141 for forming a magnetic layer is formed thereon. After forming the magnetic layer 135 having a thickness of about 0.1 to 10 μm by plating and plating a magnetic material such as NiFe, the photoresist pattern 141 is peeled off. This state is shown in FIG. 14A (j). The magnetic layer 135 may be formed only by NiFe sputtering without plating.

Next, as shown in FIG. 14B (a), a protective layer 136 made of an insulating material such as Al ₂ O ₃ or polyimide resin is laminated thereon. In the case of Al ₂ O ₃ , after sputtering, a photoresist pattern is formed and milled. In the case of polyimide resin, it is applied and baked, and then exposed, developed and patterned.

  Next, as shown in FIG. 14B (b), a pair of connection pads 137 made of a conductive material such as Au is formed so as to be electrically connected to both ends of the thin film coil 133, respectively. This is formed by sputtering Au, forming a photoresist pattern for the connection pad, plating Au, and then peeling the photoresist pattern.

  FIG. 15 is a cross-sectional view showing the configuration of the sixth embodiment of the small antenna of the present invention. In the present embodiment, the same reference numerals are used for the same components as in the fifth embodiment of FIG.

In FIG. 15, reference numeral 130 denotes a nonmagnetic substrate having a thickness of about 0.2 to 2 mm formed of a nonmagnetic material such as Al ₂ O ₃ or silicon, and 131 denotes NiFe or the like laminated on the nonmagnetic substrate 130. A magnetic layer (corresponding to the first magnetic layer of the present invention) made of a soft magnetic material having a thickness of about 0.1 to 10 μm, 132 is an Al layer laminated on the magnetic layer 131 only in the region where the thin film coil is formed. _An insulating layer made of an insulating material such as ₂ O ₃ or polyimide resin, 133 is a thin film coil having a thickness of about 1 to 20 μm made of a conductive material such as Cu provided in two layers spirally on the insulating layer 132, 134 A coil insulating layer made of an insulating material such as Al ₂ O ₃ , polyimide resin or the like formed on and between the thin film coil 133 or a resist material, 135 is on the coil insulating layer 134 and the thin film coil In the central part of 133, a magnetic layer (corresponding to the second magnetic layer and the penetrating magnetic body of the present invention) having a thickness of about 0.1 to 10 μm made of a soft magnetic material such as NiFe laminated on the magnetic layer 131, 136 is a protective layer made of an insulating material such as Al ₂ O ₃ or polyimide resin laminated on the magnetic layer 135, and 137 is a pair of a conductive material such as Au that is electrically connected to both ends of the thin film coil 133. A connection pad 143 is provided on the side surface of the small antenna, and indicates a pair of side electrodes made of a conductive material electrically connected to the pair of connection pads 137, respectively. Thus, mounting is facilitated by forming the side electrodes. Moreover, the directionality at the time of mounting can be eliminated. For example, it can be easily installed regardless of whether the board to be mounted is on the upper side or the lower side.

  In the present embodiment, the magnetic layer 135 is formed not only on the coil insulating layer 134 but also on the inner wall surface and the bottom surface of the through hole 138 that penetrates the central portion of the thin film coil 133. As a result, the magnetic layer 135 itself serves as the penetrating magnetic body of the present invention, and the magnetic layer 135 and the magnetic layer 131 are magnetically connected.

  16A and 16B are cross-sectional views for explaining a manufacturing process of a small antenna according to the sixth embodiment. Hereinafter, the manufacturing method of the small antenna in this embodiment is demonstrated using these figures.

First, as shown in FIG. 16A (a), a NiFe film is formed by sputtering on a nonmagnetic substrate 130 having a thickness of about 0.2 to 2 mm made of Al ₂ O ₃ or silicon, and a NiFe film is formed thereon. A magnetic layer 131 having a thickness of about 0.1 to 10 μm is laminated by plating NiFe. The magnetic layer 131 may be laminated only by sputtering without performing plating.

Next, as shown in FIG. 16A (b), an insulating layer 132 made of an insulating material such as Al ₂ O ₃ or polyimide resin is laminated only in the region where the thin film coil is formed. For example, in the case of Al ₂ O ₃ , after sputtering, a photoresist pattern is formed and milled, or after forming a photoresist pattern and sputtering, lift-off is performed. In the case of a polyimide resin, it is applied by spin coating and baked, and then exposed, developed and patterned.

  Next, as shown in FIG. 16A (c), an electrode film 139 having a two-layer structure of Cr film / Cu film (a structure in which a Cu film is laminated on a Cr film) is laminated thereon by sputtering.

  Next, as shown in FIG. 16A (d), a photoresist pattern 140 for forming a thin film coil is formed thereon, and a conductive material such as Cu is plated, whereby a thin film coil 133 having a thickness of about 1 to 20 μm is formed. After forming, the photoresist pattern 140 is peeled off. This state is shown in FIG. 16A (e).

Next, as shown in FIG. 16A (f), a coil insulating layer 134 made of an insulating material such as Al ₂ O ₃ and polyimide resin or a resist material is formed on and between the thin film coils 133. In the case of Al ₂ O _3, a photoresist pattern is formed thereon and sputtered, followed by lift-off. In the case of a polyimide resin and a resist material, it is applied and baked, and then exposed, developed and patterned.

  16A (c) to 16 (f) are repeated to form a two-layer spiral thin film coil 133 as shown in FIG. 16A (g).

  Next, as shown in FIG. 16A (h), a NiFe film 135a is formed on the coil insulating layer 134 by sputtering, and as shown in FIG. 16A (i), a photoresist pattern 141 for forming a magnetic layer is formed thereon. After forming the magnetic layer 135 having a thickness of about 0.1 to 10 μm by plating and plating a magnetic material such as NiFe, the photoresist pattern 141 is peeled off. This state is shown in FIG. 16A (j). The magnetic layer 135 may be formed only by NiFe sputtering without plating.

Next, as shown in FIG. 16B (a), a protective layer 136 made of an insulating material such as Al ₂ O ₃ or polyimide resin is laminated thereon. In the case of Al ₂ O ₃ , after sputtering, a photoresist pattern is formed and milled. In the case of polyimide resin, it is applied and baked, and then exposed, developed and patterned.

  Next, as shown in FIG. 16B (b), a pair of connection pads 137 made of a conductive material such as Au is formed so as to be electrically connected to both ends of the thin film coil 133, respectively. This is formed by sputtering Au, forming a photoresist pattern for the connection pad, plating Au, and then peeling the photoresist pattern.

  Thereafter, as shown in FIG. 16B (c), a pair of side electrodes 143 electrically connected to a pair of connection pads 137 are formed on the side surfaces of the small antenna. Specifically, after a conductive material such as Cu or Au is sputtered on the side surface where the connection pad 137 is exposed, a photoresist pattern is formed thereon, and the same conductive material is plated. Is formed by peeling.

  FIG. 17 is a sectional view showing the configuration of the seventh embodiment of the small antenna of the present invention.

In the figure, 170 is a magnetic substrate (corresponding to the first magnetic layer of the present invention) having a thickness of about 0.2 to 2 mm formed of a magnetic material such as ferrite, and 172 is a thin film coil. An insulating layer made of an insulating material such as Al ₂ O ₃ or polyimide resin laminated on the magnetic substrate 170 only in the region, 173 is a conductive material such as Cu provided in two layers in a spiral shape on the insulating layer 172 Is a thin film coil having a thickness of about 1 to 20 μm, 174 is a coil insulating layer made of an insulating material such as Al ₂ O ₃ , polyimide resin or the like formed on and between the thin film coil 173 or a resist material, and 175 is a coil insulating film On the layer 174 and in the central portion of the thin film coil 173, a magnetic layer (mainly about 0.1 to 10 μm thick) made of a soft magnetic material such as NiFe laminated on the magnetic substrate 170. Corresponds to the second magnetic layer and through the magnetic material of the light), 176 Al 2 _O 3 is laminated on the magnetic layer _175, protective layer of an insulating material such as polyimide resin, 177 at both ends of the thin film coil 173 A pair of connection pads made of a conductive material such as Au, which are electrically connected, are shown.

  In the present embodiment, the magnetic layer 175 is formed not only on the coil insulating layer 174 but also on the inner wall surface and the bottom surface of the through hole 178 that penetrates the central portion of the thin film coil 173. As a result, the magnetic layer 175 itself serves as the penetrating magnetic body of the present invention, and the magnetic layer 17 and the magnetic substrate 170 are magnetically connected.

  18A and 18B are cross-sectional views for explaining a manufacturing process of a small antenna according to the seventh embodiment. Hereinafter, the manufacturing method of the small antenna in this embodiment is demonstrated using these figures.

  First, as shown in FIG. 18A (a), a magnetic substrate 170 made of ferrite and having a thickness of about 0.2 to 2 mm is prepared.

Next, as shown in FIG. 18A (b), an insulating layer 172 made of an insulating material such as Al ₂ O ₃ or polyimide resin is laminated only in the region where the thin film coil is formed. For example, in the case of Al ₂ O ₃ , after sputtering, a photoresist pattern is formed and milled, or after forming a photoresist pattern and sputtering, lift-off is performed. In the case of a polyimide resin, it is applied by spin coating and baked, and then exposed, developed and patterned.

  Next, as shown in FIG. 18A (c), an electrode film 179 having a two-layer structure of Cr film / Cu film (a structure in which a Cu film is laminated on a Cr film) is laminated thereon by sputtering.

  Next, as shown in FIG. 18A (d), a thin film coil 173 having a thickness of about 1 to 20 μm is formed by forming a photoresist pattern 180 for forming a thin film coil thereon and plating a conductor material such as Cu. After forming, the photoresist pattern 180 is peeled off. This state is shown in FIG. 18A (e).

Next, as shown in FIG. 18A (f), a coil insulating layer 174 made of an insulating material such as Al ₂ O ₃ and polyimide resin or a resist material is formed on and between the thin film coil 173. In the case of Al ₂ O _3, a photoresist pattern is formed thereon and sputtered, followed by lift-off. In the case of a polyimide resin and a resist material, it is applied and baked, and then exposed, developed and patterned.

  18A (c) to 18 (f) are repeated to form a two-layer spiral thin film coil 173 as shown in FIG. 18A (g).

  Next, as shown in FIG. 18A (h), a NiFe film 175a is formed on the coil insulating layer 174 by sputtering, and as shown in FIG. 18A (i), a photoresist pattern 181 for forming a magnetic layer is formed thereon. After forming a magnetic layer 175 having a thickness of about 0.1 to 10 μm by plating and plating a magnetic material such as NiFe, the photoresist pattern 181 is peeled off. This state is shown in FIG. 18A (j). The magnetic layer 175 may be formed only by NiFe sputtering without plating.

Next, as shown in FIG. 18B (a), a protective layer 176 made of an insulating material such as Al ₂ O ₃ or polyimide resin is laminated thereon. In the case of Al ₂ O ₃ , after sputtering, a photoresist pattern is formed and milled. In the case of polyimide resin, it is applied and baked, and then exposed, developed and patterned.

  Next, as shown in FIG. 18B (b), a pair of connection pads 177 made of a conductive material such as Au is formed so as to be electrically connected to both ends of the thin film coil 173, respectively. This is formed by sputtering Au, forming a photoresist pattern for the connection pad, plating Au, and then peeling the photoresist pattern.

  FIG. 19 is a cross-sectional view showing the configuration of the eighth embodiment of the small antenna of the present invention.

In the figure, 190 is a nonmagnetic substrate having a thickness of about 0.2 to 2 mm formed of a nonmagnetic material such as Al ₂ O ₃ or silicon, 191 is NiFe laminated on the nonmagnetic substrate 190, etc. A magnetic layer (corresponding to the first magnetic layer of the present invention) having a thickness of about 0.1 to 10 μm made of a soft magnetic material, 192 is an Al layer having a thickness of about 0.3 to 3 μm laminated on the magnetic layer 191. _An insulating layer made of an insulating material such as ₂ O ₃ or a polyimide resin having a thickness of about 1 to 10 μm, and 193 has a thickness of 1 to 20 μm made of a conductive material such as Cu provided in two layers spirally on the insulating layer 192 A thin film coil of about 194, a coil insulating layer made of an insulating material such as Al ₂ O ₃ formed on and between the thin film coil 193, or a resist material and an insulating material, 202 is a central portion of the thin film coil 193 A through magnetic body made of a magnetic material having a high magnetic permeability filled inside the through hole 198 that penetrates through the space 198 (corresponding to the through magnetic body of the present invention), 195 on the coil insulating layer 194 and the thin film coil 193 Is a magnetic layer (corresponding to the second magnetic layer of the present invention) made of a soft magnetic material such as NiFe laminated on the penetrating magnetic body 202 (corresponding to the second magnetic layer of the present invention), 196 195 is a protective layer made of an insulating material such as Al ₂ O ₃ and polyimide resin laminated on 195, and 197 is a pair of connection pads made of a conductive material such as Au that is electrically connected to both ends of the thin film coil 193. Show.

  In the present embodiment, the penetrating magnetic body 202 is filled inside the through hole 198 penetrating the central portion of the thin film coil 193 without any space. By the penetrating magnetic body 202, the magnetic layer 195 and the magnetic layer 191 are magnetically connected. Actually, the insulating layer 192 exists between the bottom surface of the penetrating magnetic body 202 and the magnetic layer 191, but since the insulating layer 192 is thin, the penetrating magnetic body 202 and the magnetic layer are magnetically formed. 191 will be combined.

  20A and 20B are cross-sectional views for explaining a manufacturing process of the small antenna according to the eighth embodiment. Hereinafter, the manufacturing method of the small antenna in this embodiment is demonstrated using these figures.

First, as shown in FIG. 20A (a), a NiFe film is formed by sputtering on a non-magnetic substrate 190 having a thickness of about 0.2 to 2 mm formed of Al ₂ O ₃ or silicon, and a NiFe film is formed thereon. A magnetic layer 191 having a thickness of about 0.1 to 10 μm is laminated by plating NiFe. The magnetic layer 191 may be laminated only by sputtering without performing plating.

Next, after planarizing the upper surface of the magnetic layer 191 by chemical mechanical polishing (CMP), Al ₂ O _{3 having a} thickness of about 0.3 to ₃ μm or polyimide resin having a thickness of about 1 to 10 μm is formed thereon. An insulating layer 192 made of an insulating material is stacked. For example, Al ₂ O ₃ is formed by sputtering and polyimide resin is applied by spin coating and baked. FIG. 20A (b) shows this state.

  Next, as shown in FIG. 20A (c), an electrode film 199 having a two-layer structure of Cr film / Cu film (a structure in which a Cu film is laminated on a Cr film) is laminated thereon by sputtering.

  Next, as shown in FIG. 20A (d), a thin film coil 193 having a thickness of about 1 to 20 μm is formed by forming a photoresist pattern 200 for forming a thin film coil thereon and plating a conductor material such as Cu. After forming, the photoresist pattern 200 is peeled off. This state is shown in FIG. 20A (e).

  Next, as shown in FIG. 20A (f), a NiFe film 202a is formed thereon by sputtering, and as shown in FIG. 20A (g), a photoresist pattern 204 for forming a penetrating magnetic material is formed thereon. After the through magnetic body 202 is formed by plating a high magnetic permeability magnetic material, the photoresist pattern 204 is peeled off. This state is shown in FIG. 20A (h).

Next, as shown in FIG. 20A (i), a coil insulating layer 194 made of an insulating material such as Al ₂ O ₃ is formed on and between the thin film coils 193. In the case of Al ₂ O ₃ , the surface is planarized by CMP after sputtering.

  20A (c) to 20 (i) are repeated, the two layers of spiral thin film coil 193 and the penetrating magnetic body 202 penetrating through the central portion thereof are obtained as shown in FIG. 20A (j). Form.

In place of the step of FIG. 20A (i), a coil insulating layer made of a resist material layer 194a and an Al ₂ O ₃ layer 194b may be formed as shown in FIG. Specifically, first, after applying and baking a resist material on and between the thin film coils 193, a photoresist pattern is formed thereon and patterned to form a resist material layer 194a. Next, Al ₂ O ₃ is sputtered thereon, and then the surface is planarized by CMP to form an Al ₂ O ₃ layer 194b.

  Next, a NiFe film 195a is formed on the coil insulating layer 194 by sputtering, and as shown in FIG. 20B (a), a photoresist pattern 201 for forming a magnetic layer is formed thereon, and a magnetic material such as NiFe is formed. By plating, a magnetic layer 195 having a thickness of about 0.1 to 10 μm is formed, and then the photoresist pattern 201 is peeled off. This state is shown in FIG. 20B (b). Note that the magnetic layer 195 may be formed only by NiFe sputtering without plating.

Next, as shown in FIG. 20B (c), a protective layer 196 made of an insulating material such as Al ₂ O ₃ or polyimide resin is laminated thereon. In the case of Al ₂ O ₃ , after sputtering, a photoresist pattern is formed and milled. In the case of polyimide resin, it is applied and baked, and then exposed, developed and patterned.

  Next, as shown in FIG. 20B (d), a pair of connection pads 197 made of a conductive material such as Au is formed so as to be electrically connected to both ends of the thin film coil 193, respectively. This is formed by sputtering Au, forming a photoresist pattern for the connection pad, plating Au, and then peeling the photoresist pattern.

  FIG. 22 is a sectional view showing the configuration of the ninth embodiment of the small antenna of the present invention.

In the figure, reference numeral 220 denotes a magnetic substrate having a thickness of about 0.2 to 2 mm formed of a magnetic material such as ferrite (corresponding to the first magnetic layer of the present invention), and 222 is formed on the magnetic substrate 220. The insulating layer 223 made of an insulating material such as laminated Al ₂ O ₃ having a thickness of about 0.3 to ₃ μm or polyimide resin having a thickness of about 1 to 10 μm is provided in two layers on the insulating layer 222 in a spiral shape. A thin film coil having a thickness of about 1 to 20 μm made of a conductive material such as Cu, 224 is made of an insulating material such as Al ₂ O ₃ formed on and between the thin film coil 223, or a resist material and an insulating material The coil insulation layer 232 is a penetrating magnetic body made of a high permeability magnetic material filled inside the through hole 228 penetrating the center of the thin film coil 223 without any space (the penetrating magnetic material of the present invention). 225 denotes a magnetic layer (about 0.1 to 10 μm thick) made of a soft magnetic material such as NiFe laminated on the magnetic insulating layer 232 on the coil insulating layer 224 and in the central portion of the thin film coil 223. (Corresponding to the second magnetic layer of the invention) 226 is a protective layer made of an insulating material such as Al ₂ O ₃ or polyimide resin laminated on the magnetic layer 225, and 227 is electrically connected to both ends of the thin film coil 223 A pair of connection pads made of a conductive material such as Au is shown.

  In the present embodiment, the penetrating magnetic body 232 is filled inside the through hole 228 penetrating the center portion of the thin film coil 223 without a space. The magnetic layer 225 and the magnetic substrate 220 are magnetically connected by the penetrating magnetic body 232. Actually, the insulating layer 222 exists between the bottom surface of the penetrating magnetic body 232 and the magnetic substrate 220. However, since the insulating layer 222 is thin, magnetically the penetrating magnetic body 232 and the magnetic substrate 232 are magnetic. The body substrate 220 is bonded.

  23A and 23B are cross-sectional views for explaining a manufacturing process of a small antenna according to the ninth embodiment. Hereinafter, the manufacturing method of the small antenna in this embodiment is demonstrated using these figures.

First, as shown in FIG. 23A (a), Al ₂ O ₃ having a thickness of about 0.3 to ₃ μm or a thickness of 1 is formed on a magnetic substrate 220 having a thickness of about 0.2 to ₂ mm formed of ferrite. An insulating layer 222 made of an insulating material such as polyimide resin having a thickness of about 10 μm is laminated, and further an electrode film 229 having a two-layer structure of Cr film / Cu film (a structure in which a Cu film is laminated on the Cr film). Are laminated by sputtering.

  Next, as shown in FIG. 23A (b), a thin film coil 223 having a thickness of about 1 to 20 μm is formed by forming a photoresist pattern 230 for forming a thin film coil thereon and plating a conductor material such as Cu. After forming, the photoresist pattern 230 is peeled off. This state is shown in FIG. 23A (c).

  Next, as shown in FIG. 23A (d), a NiFe film 232a is formed thereon by sputtering, and as shown in FIG. 23A (e), a photoresist pattern 234 for forming a penetrating magnetic material is formed thereon. After plating the high magnetic permeability magnetic material to form the penetrating magnetic body 232, the photoresist pattern 234 is peeled off. This state is shown in FIG. 23A (f).

Next, as shown in FIG. 23A (g), a coil insulating layer 224 made of an insulating material such as Al ₂ O ₃ is formed on and between the thin film coils 223. In the case of Al ₂ O ₃ , the surface is planarized by CMP after sputtering.

  By repeating the manufacturing steps shown in FIGS. 23A (a) to 23 (g), as shown in FIG. 23A (h), a two-layer spiral thin film coil 223 and a penetrating magnetic body 232 penetrating through the central portion are formed. Form.

Instead of the step of FIG. 23A (g), as shown in FIG. 24, a coil insulating layer made of a resist material layer 224a and an Al ₂ O ₃ layer 224b may be formed. Specifically, first, after applying and baking a resist material on and between the thin film coils 223, a photoresist pattern is formed thereon and patterned to form a resist material layer 224a. Next, Al ₂ O ₃ is sputtered thereon, and then the surface is planarized by CMP to form an Al ₂ O ₃ layer 224b.

  Next, a NiFe film 225a is formed on the coil insulating layer 224 by sputtering, and as shown in FIG. 23A (i), a photoresist pattern 231 for forming a magnetic layer is formed thereon, and a magnetic material such as NiFe is formed. By plating, a magnetic layer 225 having a thickness of about 0.1 to 10 μm is formed, and then the photoresist pattern 231 is peeled off. This state is shown in FIG. 23A (j). The magnetic layer 225 may be formed only by sputtering of NiFe without performing plating.

Next, as shown in FIG. 23B (a), a protective layer 226 made of an insulating material such as Al ₂ O ₃ or polyimide resin is laminated thereon. In the case of Al ₂ O ₃ , after sputtering, a photoresist pattern is formed and milled. In the case of polyimide resin, it is applied and baked, and then exposed, developed and patterned.

  Next, as shown in FIG. 23B (b), a pair of connection pads 227 made of a conductive material such as Au is formed so as to be electrically connected to both ends of the thin film coil 223, respectively. This is formed by sputtering Au, forming a photoresist pattern for the connection pad, plating Au, and then peeling the photoresist pattern.

  All the embodiments described above are illustrative of the present invention and are not intended to be limiting, and the present invention can be implemented in other various modifications and changes. Therefore, the scope of the present invention is defined only by the claims and their equivalents.

It is a perspective view showing roughly an example of the basic composition of the small antenna of the present invention. It is the sectional view on the AA line of FIG. It is a perspective view which shows an example of the antenna system which attached the small antenna of FIG. 1 to the magnetic sheet. It is sectional drawing which shows the structure of 1st Embodiment of the small antenna of this invention. It is sectional drawing explaining the manufacturing process of the small antenna in 1st Embodiment. It is sectional drawing explaining the manufacturing process of the small antenna in 1st Embodiment. It is sectional drawing which shows the structure of 2nd Embodiment of the small antenna of this invention. It is sectional drawing explaining the manufacturing process of the small antenna in 2nd Embodiment. It is sectional drawing explaining the manufacturing process of the small antenna in 2nd Embodiment. It is sectional drawing which shows schematically the other example of the basic composition of the small antenna of this invention, and is a figure corresponding to the AA line cross section of FIG. It is sectional drawing which shows the structure of 3rd Embodiment of the small antenna of this invention. It is sectional drawing explaining the manufacturing process of the small antenna in 3rd Embodiment. It is sectional drawing explaining the manufacturing process of the small antenna in 3rd Embodiment. It is sectional drawing which shows the structure of 4th Embodiment of the small antenna of this invention. It is sectional drawing explaining the manufacturing process of the small antenna in 4th Embodiment. It is sectional drawing explaining the manufacturing process of the small antenna in 4th Embodiment. It is sectional drawing which shows the structure of 5th Embodiment of the small antenna of this invention. It is sectional drawing explaining the manufacturing process of the small antenna in 5th Embodiment. It is sectional drawing explaining the manufacturing process of the small antenna in 5th Embodiment. It is sectional drawing which shows the structure of 6th Embodiment of the small antenna of this invention. It is sectional drawing explaining the manufacturing process of the small antenna in 6th Embodiment. It is sectional drawing explaining the manufacturing process of the small antenna in 6th Embodiment. It is sectional drawing which shows the structure of 7th Embodiment of the small antenna of this invention. It is sectional drawing explaining the manufacturing process of the small antenna in 7th Embodiment. It is sectional drawing explaining the manufacturing process of the small antenna in 7th Embodiment. It is sectional drawing which shows the structure of 8th Embodiment of the small antenna of this invention. It is sectional drawing explaining the manufacturing process of the small antenna in 8th Embodiment. It is sectional drawing explaining the manufacturing process of the small antenna in 8th Embodiment. It is sectional drawing explaining the one part process in the change aspect of 8th Embodiment. It is sectional drawing which shows the structure of 9th Embodiment of the small antenna of this invention. It is sectional drawing explaining the manufacturing process of the small antenna in 9th Embodiment. It is sectional drawing explaining the manufacturing process of the small antenna in 9th Embodiment. It is sectional drawing explaining the one part process in the change aspect of 9th Embodiment.

Explanation of symbols

10, 40, 130, 190 Non-magnetic substrate 11, 12, 41, 45, 82, 95, 131, 135, 175, 191, 195, 225 Magnetic layer 13, 43, 83, 93, 133, 173, 193, 223 Thin film coil 14, 44, 84, 94, 134, 174, 194, 224 Coil insulating layer 15, 85, 202, 232 Through magnetic body 30 Small antenna 31 Magnetic sheet 42, 92, 132, 172, 192, 222 Insulating layer 45a, 95a, 135a, 175a, 195a, 202a, 232a NiFe film 46, 96, 136, 176, 196, 226 Protective layer 47, 97, 137, 177, 197, 227 Connection pad 48, 98, 138, 178, 198 228 Through hole 49, 99, 139, 179, 199, 229 Electrode film 5 51, 100, 101, 140, 141, 180, 181, 200, 201, 204, 230, 231, 234 Photoresist pattern 52, 102 Filled magnetic body 80, 90, 170, 220 Magnetic substrate 145 Side electrode 194a, 224a resist material layer 194b, 224b Al ₂ O ₃ layer

Claims (20)

An antenna for obtaining an induced electromotive force by magnetic flux, a first magnetic layer formed of a magnetic material, a second magnetic layer formed of a magnetic material, the first magnetic layer, and the second magnetic layer A thin film coil made of a conductive material inserted between the magnetic layers of the magnetic film and a magnetic material that penetrates through the center of the thin film coil and magnetically connects the first magnetic layer and the second magnetic layer. The first magnetic layer and the second magnetic layer are magnetically connected to the penetrating magnetic body so that magnetic flux is collected on the penetrating magnetic body, An antenna provided with a thin film coil, wherein a magnetic material forming a penetrating magnetic body has a magnetic permeability higher than that of a magnetic material forming the first magnetic layer and the second magnetic layer .   The antenna according to claim 1, wherein the first magnetic layer is a magnetic layer made of a soft magnetic material laminated on a substrate made of a non-magnetic material.   The antenna according to claim 1, wherein the first magnetic layer is a substrate formed of a magnetic material. 2. An insulating layer made of an insulating material formed on the entire surface or a part of the first magnetic layer is further provided, and the thin film coil is formed on the insulating layer. 4. The antenna according to any one of items 1 to 3 . The antenna according to claim 4 , wherein the thin film coil is at least one coil formed in a spiral shape so as to surround the penetrating magnetic body on the insulating layer. A coil insulating layer made of an insulating material formed on the thin film coil and between the thin film coils, and a protective layer made of an insulating material laminated on the second magnetic layer. Item 6. The antenna according to any one of Items 1 to 5 . A pair of connection pads made of a conductive material electrically connected to both ends of the thin-film coil, and a conductive material electrically connected to the pair of connection pads and provided on the side surface of the antenna. antenna according to any one of claims 1 6 further characterized in that a pair of side electrodes by. The antenna according to any one of claims 1 to 7 , wherein the penetrating magnetic body is formed only on an inner wall surface of a through hole that penetrates a central portion of the thin film coil. The antenna according to any one of claims 1 to 7 , wherein the penetrating magnetic body is filled without a space in a through hole penetrating a central portion of the thin film coil. An antenna system comprising: the antenna according to any one of claims 1 to 9 ; and a magnetic sheet made of a magnetic material magnetically bonded to at least one surface of the antenna. An antenna manufacturing method for obtaining an induced electromotive force by magnetic flux , comprising: forming an insulating layer on an entire surface or a part of a first magnetic layer formed of a magnetic material with an insulating material; and Forming a thin film coil having a predetermined pattern on a conductive material; forming a penetrating magnetic body penetrating through a central portion of the thin film coil with a magnetic material; and forming the first magnetic layer by the penetrating magnetic body. And forming a second magnetic layer magnetically connected to the first magnetic layer and the second magnetic layer so that the magnetic fluxes of the first magnetic layer and the second magnetic layer are collected in the penetrating magnetic material. Further, the first magnetic layer and the second magnetic layer are magnetically connected to the penetrating magnetic body, and the first magnetic layer and the second magnetic layer are used as magnetic materials for forming the penetrating magnetic body. Permeation of the magnetic material forming the layer Method of manufacturing an antenna, which comprises using a magnetic material having a higher rate permeability. The manufacturing method according to claim 11 , further comprising a step of laminating the first magnetic layer on a substrate formed of a nonmagnetic material. The manufacturing method according to claim 11 , further comprising a step of preparing a substrate formed of a magnetic material as the first magnetic layer. The step of forming the thin film coil, any one of claims 11 to 13, wherein the a step of forming a conductive material coil of at least one layer which is formed in a spiral shape on the insulating layer The manufacturing method as described in. The step of forming the thin film coil includes forming a first layer coil on the insulating layer with a conductive material, forming a coil insulating layer between and on the first layer coil with an insulating material, Forming a coil of a second layer with a conductive material on the formed coil insulating layer, and forming a coil insulating layer with an insulating material between and on the coils of the second layer. The manufacturing method according to any one of claims 11 to 14 . The step of forming the thin film coil includes forming a first layer coil on the insulating layer with a conductive material, forming a coil insulating layer between and on the first layer coil with an insulating material, The surface of the formed coil insulating layer is flattened, a second layer coil is formed thereon by a conductor material, and a coil insulating layer is formed by an insulator material between and on the second layer coils. The manufacturing method according to any one of claims 11 to 14 , wherein the manufacturing method is included. A step of forming a pair of connection pads electrically connected to both ends of the thin film coil with a conductive material, and a pair of connection pads electrically connected to the pair of connection pads, respectively, on the side surface of the antenna The method according to any one of claims 11 to 16 , further comprising a step of forming the side electrode with a conductive material. The process according to any one of claims 11 to 17, characterized in that the protective layer on the second magnetic layer further comprising a step of forming an insulating material. The step of forming the penetrating magnetic body is a step of forming the magnetic body only on the inner wall surface in the through hole penetrating the central portion of the thin film coil in the step of forming the second magnetic layer. The manufacturing method according to any one of claims 11 to 18 , characterized in that: The step of forming the penetrating magnetic body is the step of forming a second magnetic layer, the step of forming a magnetic body on the inner wall surface of the through hole penetrating the central portion of the thin film coil, The manufacturing method according to any one of claims 11 to 18 , wherein the manufacturing method is a step of filling a magnetic material without space inside.

Images