JP4869285B2 - Semiconductor manufacturing apparatus, semiconductor manufacturing apparatus operating method, and semiconductor device manufacturing method - Google Patents

Description

  The present invention relates to a semiconductor manufacturing apparatus, a method for operating a semiconductor manufacturing apparatus, and a method for manufacturing a semiconductor device.

  In a process of manufacturing a semiconductor device such as an IC or an LSI, a semiconductor manufacturing apparatus that performs a process such as an oxidation process or a chemical vapor deposition (CVD) process on a semiconductor substrate is used.

  In such a semiconductor manufacturing apparatus, it is necessary to reduce the size of the apparatus in order to reduce the footprint. However, in a 300 mm apparatus (an apparatus for processing a wafer having a diameter of 300 mm), an outside air blocking substrate cassette (FOUP, Front The access dimensions of Open Unified Pod) have been determined, and securing the installation space for maintenance and operation units from the front has become a problem.

  FIG. 5 shows an example of a conventional semiconductor manufacturing apparatus. In the figure, (a) is a front perspective view of the semiconductor manufacturing apparatus 1, and (b) is a rear perspective view of the apparatus 1.

  In FIG. 5, reference numeral 3 denotes a loading / unloading stage unit on which the outside air blocking substrate cassette 2 is carried into the apparatus 1 or temporarily placed when the outside air blocking substrate cassette 2 is unloaded from the apparatus 1.

In the prior art, as shown in FIG. 5 (a), the display operation unit 6 for performing the operation status display and the operation command operation is further provided on the front shutter-equipped device front opening 4 at the top of the loading / unloading stage unit 3. It was installed on the upper device front wall 5.
JP 7-320997 A

  In the above case, as shown in FIG. 6, when the display operation unit 6 is installed from the outside of the apparatus 1, the installation position is the rear part of the loading / unloading stage unit 3, and the apparatus operator 7 operates the apparatus 1. Since the substrate cassette 2 may be lowered onto the stage unit 3 from the overhead transport device (OHT, abbreviation of Overhead Hoist Transfer) 8, the installation position of the display operation unit 6 is an inconvenient position for the apparatus operator 7. The problem of becoming will occur. That is, when the operator 7 operates the apparatus 1, there is a possibility that the operator 7 may come into contact with the outside air blocking substrate cassette 2 that is lowered from the overhead transporter 8.

  The object of the present invention is to solve the above-mentioned problems in the prior art, that is, that the installation position of the display operation unit for performing the operation status display and operation command operation is an inconvenient position, and further, the SEMI standard (semiconductor device An object of the present invention is to provide a semiconductor manufacturing apparatus in which a display operation unit is accommodated in a part within a standard dimension defined by the Material Association Standard, an operation method of the apparatus, and a semiconductor device manufacturing method using the apparatus.

In the present invention, in order to solve the above problem, as described in claim 1,
Semiconductor manufacturing having a loading / unloading stage section on which a substrate cassette descending from an overhead transfer machine located outside the semiconductor manufacturing apparatus can be placed, and a display operation section for displaying operation status and operation command operation on the front of the apparatus In the apparatus, the display operation unit is provided on the apparatus front wall below the vertical track of the substrate cassette descending from the overhead transport device or on the apparatus front wall protruding before the vertical track. The semiconductor manufacturing apparatus characterized by this is configured.

In the present invention, as described in claim 2,
A method for operating a semiconductor manufacturing apparatus, wherein the substrate cassette is placed on a loading / unloading stage portion capable of placing a substrate cassette passing through a passage provided in front of the apparatus by descending from an overhead transporter located above the apparatus. And a step in which the device is operated by a display operation unit that is housed in the front wall of the device protruding before the passage and performs an operation status display and operation command operation. A method for operating a semiconductor manufacturing apparatus is configured.

In the present invention, as described in claim 3,
A method of manufacturing a semiconductor device, wherein the substrate cassette is mounted on a loading / unloading stage portion where a substrate cassette can be placed through a passage provided in front of the apparatus by dropping from an overhead transfer machine located above the semiconductor manufacturing apparatus. And a step of operating the device in a display operation unit for operating status display and operation command operation stored in the front wall of the device protruding before the passage, and in the substrate cassette And a step of processing a base slope in the apparatus.

  By implementing the present invention, it is possible to solve the problem that the installation position of the display operation unit for performing the operation status display and the operation command operation is an inconvenient position, and within the standard dimensions defined by the SEMI standard (Semiconductor Device / Material Association Standard). It is possible to provide a semiconductor manufacturing apparatus in which a display operation unit is housed in a part, an operation method of the apparatus, and a semiconductor device manufacturing method using the apparatus.

  In the embodiment of the present invention, the display operation unit for performing the operation status display and operation command operation of the semiconductor manufacturing apparatus is the front wall of the loading / unloading stage unit, that is, the vertical trajectory of the substrate cassette descending from the overhead transfer machine It is installed on the front wall of the apparatus located below or on the front wall of the apparatus protruding before the vertical track of the substrate cassette. Here, the vertical trajectory means a trajectory drawn by one point in the substrate cassette, for example, the center of gravity when the substrate cassette is lowered. In such a form, the display operation unit is below the passage where the substrate cassette (not limited to the outside air blocking type) descends from the overhead transporter to the carry-in / carry-out stage unit, as seen from the operator of the apparatus. Alternatively, since it is in front of the operator, even if the operator reaches for the display operation unit, the substrate cassette that is lowered to the loading / unloading stage unit is not contacted, and there is no inconvenience.

  FIG. 1 shows an example of an embodiment of the present invention. In the figure, (a) is an overall perspective view of the semiconductor manufacturing apparatus 1, (b) is a perspective view in a state where the door at the lower front of the apparatus 1, that is, the front lower door 13 is opened, and (c) is a display. It is a perspective view of an operation part, (d) is a side view which shows the positional relationship of the apparatus 1 and the operator 7. FIG.

  As shown in FIG. 1, an operation unit related unit, that is, a support panel 12 that supports the operation panel 10 and the gas pattern panel 11 is provided on the front lower door 13 that is a front wall of the carry-in / out stage unit 3. For example, the installation position is not inconvenient for the operator 7. That is, in the carrying panel 12 carrying the operation panel 10 and the gas pattern panel 11, the outside air blocking substrate cassette 2 (not shown) is lowered from the overhead transfer machine 8 (not shown) to the loading / unloading stage unit 3. Since it is provided on the front wall of the apparatus 1 below the vertical track (indicated by dotted arrows in FIGS. 1 (a) and 1 (d)), that is, on the front lower door 13, FIG. 1 (d) As shown, when the operator 7 operates the apparatus 1, it does not come into contact with the outside air blocking substrate cassette 2 (not shown) that is lowered from the overhead transporter 8 (not shown), and is safe. is there. Moreover, it can be installed with the size of the device within the SEMI standard.

  In this case, the front lower door 13 corresponds to “the front wall of the apparatus below the vertical track of the substrate cassette descending from the overhead transporter” according to claim 1, and the operation panel 10 and the gas pattern panel 11 are The “display operation unit” according to claim 1 is configured.

  In the present embodiment, the effect of the present invention is not changed even if a substrate cassette that is not an outside air blocking type is used instead of the outside air blocking substrate cassette 2.

  If the height of the front lower door 13 is 900 mm or less and the carrier panel 12 is fixed to the front lower door 13, the height is low for the operator to operate and the operability deteriorates. A rotating shaft having a function equivalent to that of a hinge is provided between the upper edge of the door and the front lower door 13, and the carrier panel 12 has a flap structure, as shown in FIGS. 1C and 1D. As described above, the operability is improved by allowing the support panel 12 to be rotated at least until the surface of the support panel 12 becomes horizontal.

  Further, if the operation unit (supporting panel 12) remains lifted, as shown in FIG. 2, interference with the automatic transfer robot (AGV) 20 for transporting the outside air blocking substrate cassette 2 that accesses the front surface of the apparatus 1 may occur. Since there is a concern, a switch (not shown) is installed on the front lower door 13 or the supporting panel 12 so that the supporting panel 12 is opened or closed (in the closed state, the surface of the supporting panel 12 is parallel to the surface of the front lower door 13). The operation panel 10 is a touch pen type, and the touch pen holder (not shown) for the operation unit is inserted into the touch panel. By adding a sensor for detecting whether or not the touch panel is not inserted into the sensor holder and the operation panel is opened, the operator 7 is in front of the device 1. It is highly likely to be in operation, has a configuration in which a warning.

  The carry-in / carry-out stage unit 3 can also accept the outside air-blocking substrate cassette 2 (shown in FIG. 2) conveyed by the automatic conveyance robot 20.

  FIG. 3 is a diagram for explaining an apparatus obtained by changing a part of the front surface of the semiconductor manufacturing apparatus 1 shown in FIG. (A) of the figure is an overall perspective view of the semiconductor manufacturing apparatus 1, and (b) is an explanation of the operation button row 37 fixed to the front lower door 13.

  In FIG. 3 (a), 30 is a panel made of, for example, stainless steel, which is a front portion of the apparatus 1 excluding the front lower door 13, and the material thereof is not limited to stainless steel, but with the carrying panel 12 or the like. In order to avoid confusion, this panel is referred to as a stainless steel panel 30. 31 is a connection part with the suspension mechanism of the overhead transporter, 32 is a signal tower for displaying various signals in a vertical arrangement, 35 is a load port for carrying in / out the outside air blocking substrate cassette 2, Reference numeral 33 denotes a load port indicator for displaying the state of the load port 35, and 34 is a front shutter for shutting off the apparatus 1 and the outside world in the loading / unloading passage of the outside air blocking substrate cassette 2. Along with this, a light beam of a beam sensor (not shown) that detects loading / unloading of the outside air blocking substrate cassette 2 is running. 36 is an infrared signal unit for exchanging information with an automatic transfer robot (not shown), and 37 is an operation button row.

  The carrier panel 12 can be manually opened and closed, and a warning buzzer sounds when the carrier panel 12 is open for a certain period of time when not in use.

  The beam sensor cannot be detected when accessing the load port 35.

  The load port indicator 33 indicates whether the load port 35 is loaded with the outside air blocking substrate cassette 2, whether it is in a loaded state (a substrate in the outside air blocking substrate cassette 2 is in the processing chamber of the apparatus 1) or unloaded. Either the substrate in the outside air blocking substrate cassette 2 is taken out from the processing chamber of the apparatus 1 or the reserve state (the substrate in the outside air blocking substrate cassette 2 is in the spare chamber), or an abnormality has occurred. Is displayed.

  The signal tower 32 is not protruded from the stainless steel panel 30.

  FIG. 3B shows the operation button row 37 fixed to the front lower door 13. In the figure, “stop” and “pause” in the descriptions attached to the buttons mean stop and pause of the machine operation, respectively, and “load” means that the substrate in the outside air blocking substrate cassette 2 is processed by the apparatus 1. “Unload” means that the substrate is taken out of the processing chamber of the apparatus 1, and “Pendant connector” means control of the connection part 31 with the fishing mechanism of the overhead transfer machine “EMO switch” means an EMO related switch.

  FIG. 4 shows another example of the embodiment of the present invention. In the figure, (a) is an overall perspective view of the semiconductor manufacturing apparatus 1, and (b) is an illustration of the apparatus 1 in a state in which the carrier panel 12 is slid (translated) to a position where the operator of the apparatus 1 can easily operate. It is a whole perspective view, (c) is a side view showing the positional relationship between the device 1 and the operator 7.

  The support panel 12 carrying the operation panel 10 and the gas pattern panel 11 is arranged on a vertical track (FIG. 4C) where the outside air blocking substrate cassette 2 (not shown) is lowered from the overhead transporter 8 (not shown). Since it is provided on the outside of the device 1, that is, on the front wall of the device 1 that protrudes before the vertical trajectory of the device 1 as shown in FIG. When operating the apparatus 1, the apparatus does not come into contact with the outside air blocking substrate cassette 2 (not shown) that is lowered from the overhead conveyor 8 (not shown), and is safe.

  In this case, the operation panel 10 and the gas pattern panel 11 constitute the “display operation unit” according to claim 1, and as is apparent from the above description, the display operation unit is an overhead conveyor 8 ( It is provided on the front wall of the apparatus 1 protruding before the vertical track of the outside air blocking substrate cassette 2 (not shown) descending from the not shown.

  In the present embodiment, the effect of the present invention is not changed even if a substrate cassette that is not an outside air blocking type is used instead of the outside air blocking substrate cassette 2.

  The carrier panel 12 carrying the operation panel 10 and the gas pattern panel 11 is easy for the operator 7 to use from the state shown in FIG. 4A, as shown in FIGS. 4B and 4C. It can slide to the position.

  As explained above, the operation command operation is not performed in the space where the substrate cassette descends, even when the substrate cassette descends from the overhead transporter in compliance with the SEMI standard. It is. In addition, a display operation unit is installed at a position with good operability even for a person with a short height.

It is a figure which shows the example of embodiment of this invention. It is a figure explaining the positional relationship of the semiconductor manufacturing apparatus and automatic conveyance robot in the embodiment of this invention. It is a figure explaining the apparatus formed by changing a part of front of the semiconductor manufacturing apparatus shown in FIG. It is a figure which shows the other example of embodiment of this invention. It is a figure explaining the semiconductor manufacturing apparatus in a prior art. It is a figure explaining the positional relationship of the semiconductor manufacturing apparatus and operator in a prior art shown in FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Semiconductor manufacturing apparatus, 2 ... Outside air shielding substrate cassette, 3 ... Loading / unloading stage part, 4 ... Apparatus front opening part, 5 ... Apparatus front wall, 6 ... Display operation part, 7 ... Operator, 8 ... Overhead conveyance machine DESCRIPTION OF SYMBOLS 10 ... Operation panel, 11 ... Gas pattern panel, 12 ... Carrying panel, 13 ... Front lower door, 20 ... Automatic transfer robot, 30 ... Stainless steel panel, 31 ... Connection part with fishing mechanism of overhead transfer machine, 32 ... Signal tower 33... Load port indicator 34. Front shutter 35. Load port 36. Infrared signal unit 37.

Claims (3)

Semiconductor manufacturing having a loading / unloading stage section on which a substrate cassette descending from an overhead transfer machine located outside the semiconductor manufacturing apparatus can be placed, and a display operation section for displaying operation status and operation command operation on the front of the apparatus In the device
The display operation unit is provided on the device front wall below the vertical track of the substrate cassette descending from the overhead transporter or on the device front wall protruding before the vertical track. Semiconductor manufacturing equipment. A method of operating a semiconductor manufacturing apparatus,
A step of placing the substrate cassette on a loading / unloading stage part capable of placing a substrate cassette passing through a passage provided in front of the device by descending from an overhead transporter located above the device;
An operation of the semiconductor manufacturing apparatus, wherein the apparatus is operated by a display operation unit that is housed in the front wall of the apparatus protruding before the passage and performs an operation status display and an operation command operation. Method. A method for manufacturing a semiconductor device, comprising:
A step of placing a substrate cassette on a loading / unloading stage portion capable of placing a substrate cassette passing through a passage provided in front of the apparatus descending from an overhead transfer machine located outside the semiconductor manufacturing apparatus;
The step of operating the device in a display operation unit that performs operation status display and operation command operation, housed in the device front wall protruding before the passage,
And a step of processing a base slope in the substrate cassette in the apparatus.

Images