JP4857887B2 - Laser welding laser absorbent, laser welding resin composition, molded product and method for producing molded product - Google Patents

Laser welding laser absorbent, laser welding resin composition, molded product and method for producing molded product Download PDF

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JP4857887B2
JP4857887B2 JP2006121106A JP2006121106A JP4857887B2 JP 4857887 B2 JP4857887 B2 JP 4857887B2 JP 2006121106 A JP2006121106 A JP 2006121106A JP 2006121106 A JP2006121106 A JP 2006121106A JP 4857887 B2 JP4857887 B2 JP 4857887B2
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laser
group
laser welding
molded
resin composition
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JP2007291245A (en
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美織 石田
修一 前田
理恵子 藤田
勝 内田
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Mitsubishi Chemical Corp
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16Laser beams
    • B29C65/1603Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612Infrared [IR] radiation, e.g. by infrared lasers
    • B29C65/1616Near infrared radiation [NIR], e.g. by YAG lasers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16Laser beams
    • B29C65/1629Laser beams characterised by the way of heating the interface
    • B29C65/1635Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16Laser beams
    • B29C65/1629Laser beams characterised by the way of heating the interface
    • B29C65/1654Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16Laser beams
    • B29C65/1677Laser beams making use of an absorber or impact modifier
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/40General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43Joining a relatively small portion of the surface of said articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B29C66/73921General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/721Fibre-reinforced materials
    • B29C66/7212Fibre-reinforced materials characterised by the composition of the fibres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/735General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the extensive physical properties of the parts to be joined
    • B29C66/7352Thickness, e.g. very thin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/90Measuring or controlling the joining process
    • B29C66/91Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/90Measuring or controlling the joining process
    • B29C66/93Measuring or controlling the joining process by measuring or controlling the speed
    • B29C66/939Measuring or controlling the joining process by measuring or controlling the speed characterised by specific speed values or ranges

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Description

本発明は、レーザー光を吸収するレーザー溶着用のレーザー吸収剤、該レーザー光吸収剤を含むレーザー溶着用組成物、成形品及び成形品の製造方法に関する。より詳しくは、少なくとも700〜1200nmの波長範囲においてレーザー光を吸収するレーザー溶着用のレーザー吸収剤、該レーザー光吸収剤を含むレーザー溶着用組成物、成形品及び成形品の製造方法に関する。   The present invention relates to a laser welding laser absorbent that absorbs laser light, a laser welding composition containing the laser light absorbent, a molded article, and a method for producing the molded article. More particularly, the present invention relates to a laser welding laser absorber that absorbs laser light in a wavelength range of at least 700 to 1200 nm, a laser welding composition containing the laser light absorber, a molded product, and a method for manufacturing the molded product.

プラスチック成形部品の接合方法は、接着剤等による化学的接合技術と、例えば非特許文献1に記載されるレーザー溶着、振動溶着、超音波溶着、熱板溶着等の物理的接合技術とに大別される。物理的接合は溶剤を用いない接合技術であるため、接着剤では接合が難しい材質同士であっても十分な接着強度が得られる点、タクトタイムが短い点を特徴とする。但し、振動溶着、超音波溶着および熱板溶着では、溶着に適合する樹脂の形状が限定されること、ポリエチレンテレフタレート(融解温度270℃)とポリカーボネート(融
解温度225℃)などの組み合わせに代表される融点に開きのある樹脂同士の溶着には適
用できないこと、また溶着部の外観の問題から非露出部位の接合に適用が限定されること等から、近年、これらの代替技術として、レーザー溶着技術が特に注目されるようになっている。
The method of joining plastic molded parts is roughly divided into chemical joining technology using an adhesive or the like and physical joining technology such as laser welding, vibration welding, ultrasonic welding, hot plate welding described in Non-Patent Document 1, for example. Is done. Since physical bonding is a bonding technique that does not use a solvent, it is characterized in that sufficient adhesive strength can be obtained even with materials difficult to bond with an adhesive, and the tact time is short. However, in vibration welding, ultrasonic welding and hot plate welding, the shape of the resin suitable for welding is limited, and it is represented by a combination of polyethylene terephthalate (melting temperature 270 ° C.) and polycarbonate (melting temperature 225 ° C.). In recent years, laser welding technology has been used as an alternative technology for these because it cannot be applied to welding between resins with melting points and is limited to joining unexposed parts due to the appearance of the welded part. Particular attention has been paid.

レーザー溶着では、加熱源としてのレーザー光に対して透過性を有する成形部品(レーザー透過樹脂部材)と、該レーザー光に対して吸収性を有する成形部品(レーザー吸収樹脂部材)とを当接させ、該当接部に向けてレーザー透過樹脂部材側から前記レーザー光を照射する。これによりレーザー透過樹脂部材を透過したレーザー光が、レーザー吸収樹脂部材の当接端部に到達して吸収され、この当接端部に吸収されたレーザー光がエネルギーとして蓄積される。その結果、レーザー吸収性樹脂が加熱溶融されるとともに、このレーザー吸収樹脂部材の当接端部からの熱伝達によりレーザー透過樹脂部材の当接端部が加熱溶融される。この状態で、両成形部材の当接端部同士を圧着させれば、両者を一体的に接合することができる。   In laser welding, a molded part (laser-transmitting resin member) that is transparent to laser light as a heating source is brought into contact with a molded part that is absorbent to the laser light (laser-absorbing resin member). The laser beam is irradiated from the laser transmitting resin member side toward the corresponding contact portion. As a result, the laser light transmitted through the laser transmitting resin member reaches the contact end portion of the laser absorbing resin member and is absorbed, and the laser light absorbed in the contact end portion is accumulated as energy. As a result, the laser absorbing resin is heated and melted, and the contact end portion of the laser transmitting resin member is heated and melted by heat transfer from the contact end portion of the laser absorbing resin member. In this state, if the contact end portions of both molded members are pressure-bonded, they can be joined together.

レーザー溶着は、レーザーと被加工部材とが非接触の状態で加工可能であるため、加工手段と被加工部材の直接の接触が困難な部材同士の接合が可能であること、3次元溶接・精密加工が可能であり、自由な溶着形状が達成できること、高い溶着強度を有しながら、外観にも優れること、超音波溶着等で問題となるゴミの発生もないこと、自動化が容易であることなどから、ランプ、電装部品、センター、タンク等の自動車用取り付け部品、注射器、フィルターケース等の接合部位を有する医療器具、OA機器関連のプラグ、ケース等、多岐にわたる導入が期待されている。   Laser welding can be performed in a state where the laser and the workpiece are not in contact with each other, so that it is possible to join members that are difficult to directly contact the machining means and the workpiece, 3D welding / precision It can be processed, a free welding shape can be achieved, it has a high welding strength, it has an excellent appearance, there is no generation of dust that becomes a problem with ultrasonic welding, etc., it is easy to automate, etc. Therefore, a wide variety of introductions such as lamps, electrical parts, mounting parts for automobiles such as centers and tanks, medical instruments having joint parts such as syringes and filter cases, plugs and cases related to OA equipment are expected.

たとえば、特許文献1には、車両用ランプのPC製レンズとボディとを当接させ、レーザー光を斜め照射することにより、ボディのストレスクラック発生を抑制しながらレーザー溶着する方法について、記載されている。しかし、従来用いられてきたレーザー吸収剤は、高いレーザー吸収効率を得るため、価格面でも有利なカーボンブラックを高比率で含むものが主であった。ところが、多くの場合、カーボンブラックの使用はじん性を初めとする機械的特性の悪化、結晶化促進による表面品質の悪化を招く。また、部材の色調が暗色から黒色に限定され、他の色調への彩色を困難にする。これは、透明、半透明の部品が多い医療機器分野では特に大きな課題である。   For example, Patent Document 1 describes a method of laser welding while suppressing the occurrence of stress cracks in the body by bringing a PC lens of a vehicle lamp into contact with the body and obliquely irradiating laser light. Yes. However, conventionally used laser absorbers mainly contain carbon black, which is advantageous in terms of price, in a high ratio in order to obtain high laser absorption efficiency. However, in many cases, the use of carbon black causes deterioration of mechanical properties such as toughness, and deterioration of surface quality due to promotion of crystallization. In addition, the color tone of the member is limited from dark to black, making it difficult to color to other colors. This is a particularly big problem in the medical device field where there are many transparent and translucent parts.

カーボンブラック含有量低減の試みとして、レーザー透過性熱可塑性樹脂材料を含む組成物全体のカーボンブラック含有量が0.1重量%未満であり、ナフタロシアニン系化合物等のIR吸収性色素を含有する組成物が提案されている(特許文献2参照)。しかし、ナフタロシアニン系化合物は一般に青から緑の色調を帯びており、彩色の自由度には未だ限界がある。また、レーザー感度の点で更なる改良が望まれている。
Kunststoffe 87,(1997),11,1632-1640 特開2002−292741 特開2003−183524
As an attempt to reduce the carbon black content, the composition containing the laser-transmissive thermoplastic resin material has a carbon black content of less than 0.1% by weight and contains an IR-absorbing dye such as a naphthalocyanine compound. The thing is proposed (refer patent document 2). However, naphthalocyanine compounds generally have a color tone from blue to green, and there is still a limit to the degree of freedom in coloring. Further improvements are desired in terms of laser sensitivity.
Kunststoffe 87, (1997), 11,1632-1640 JP 2002-292741 JP 2003-183524 A

本発明は上記実情に鑑みてなされたものであって、その目的は、樹脂、特に熱可塑性樹脂材料に対する溶解性に優れ、700〜1200nmの波長域、特には700〜900nmに高い吸収感度を有し、且つ可視領域における吸収感度が低く、耐光性および耐熱性に優れるレーザー溶着用レーザー吸収剤を提供することにある。又、700〜1200nmの波長域、特には800〜1000nmに高い吸収感度を有するレーザー溶着用樹脂組成物、該組成物を用いて得られる成形品及びレーザー溶着による成形品の製造方法を提供するものである。   The present invention has been made in view of the above circumstances, and its object is to have excellent solubility in resins, particularly thermoplastic resin materials, and high absorption sensitivity in the wavelength range of 700 to 1200 nm, particularly 700 to 900 nm. Another object of the present invention is to provide a laser welding laser absorbent having low absorption sensitivity in the visible region and excellent in light resistance and heat resistance. Also provided are a resin composition for laser welding having a high absorption sensitivity in a wavelength range of 700 to 1200 nm, particularly 800 to 1000 nm, a molded article obtained using the composition, and a method for producing a molded article by laser welding. It is.

本発明者らは、上記課題を解決すべく鋭意検討した結果、特定構造のジオキサジナフトペンタセン系化合物が、熱可塑性樹脂材料に対する溶解性に優れ、700〜1200nmの波長域の少なくとも一部の範囲に非常に強い吸収を示し、且つ可視領域においてはめだった吸収が少なく、目視では無彩色に近いことを見出し、本発明を完成させた。
即ち、本発明の要旨は、下記一般式(1)で表されるジオキサジナフトペンタセン系化合物からなるレーザー溶着用レーザー吸収剤に存する。
As a result of intensive studies to solve the above problems, the present inventors have found that a dioxadinaphthopentacene compound having a specific structure is excellent in solubility in a thermoplastic resin material, and at least a part of the wavelength region of 700 to 1200 nm. The present invention was completed by finding that the range showed very strong absorption and that there was little absorption that was visible in the visible region and that it was close to an achromatic color by visual observation.
That is, the gist of the present invention resides in a laser welding laser absorbent comprising a dioxadinaphthopentacene compound represented by the following general formula (1).

Figure 0004857887
Figure 0004857887

(式中、環A、B、C、D及びEは、それぞれ独立に任意の置換基を有していてもよいベンゼン環を表すが、同一の環上の複数の置換基が連結して環A、B、C、D及びEはそれぞれ独立に縮合環を形成していてもよい。X及びYは、それぞれ独立に酸素原子、硫黄原子、=C(CN)2、=C(CN)COOR、=C(CN)CONRR’または=N−C≡
N(但し、RおよびR’はそれぞれ独立に水素原子または任意の置換基を表す)を表すが、X及びYのうち少なくとも一方は酸素原子以外の基を表す。ZおよびZ’は各々独立に酸素原子、硫黄原子または−NR’’−(但し、R’’は水素原子または任意の置換基を表す)を表す。)
他の要旨は、熱可塑性樹脂及び上記レーザー吸収剤を含有することを特徴とするレーザー溶着用樹脂組成物、に存する。
(In the formula, rings A, B, C, D and E each independently represent a benzene ring optionally having any substituent, but a plurality of substituents on the same ring are linked to form a ring. A, B, C, D and E may each independently form a condensed ring, and X and Y each independently represent an oxygen atom, a sulfur atom, = C (CN) 2 , = C (CN) COOR , = C (CN) CONRR 'or = N-C≡
N (wherein R and R ′ each independently represents a hydrogen atom or an arbitrary substituent), but at least one of X and Y represents a group other than an oxygen atom. Z and Z ′ each independently represent an oxygen atom, a sulfur atom or —NR ″ — (where R ″ represents a hydrogen atom or an arbitrary substituent). )
Another gist lies in a resin composition for laser welding characterized by containing a thermoplastic resin and the above laser absorber.

更に他の要旨は、レーザー溶着で接合された成形品であって、該成形品を構成する少なくとも1つの成形部品が前記のレーザー溶着用樹脂組成物で構成されてなることを特徴とする成形品、に存する。
更に他の要旨は、(1)加熱源としてのレーザー光に対して透過性を有する成形部品と、該レーザー光に対して吸収性を有する成形部品とを当接させる工程、及び、(2)該レーザー光に対して透過性を有する成形部品側から該レーザー光を照射し、両成形部品の当接面同士を加熱溶融させて接合させる工程、を有する成形品の製造方法において、該レーザー光に対して吸収性を有する成形部品が上記レーザー溶着用樹脂組成物からなる成形部品であることを特徴とする成形品の製造方法、に存する。
Still another gist is a molded article joined by laser welding, wherein at least one molded part constituting the molded article is composed of the above-mentioned resin composition for laser welding. , Exist.
Still another subject matter is: (1) a step of contacting a molded part that is transparent to laser light as a heating source and a molded part that is absorbent to the laser light; and (2) In the method of manufacturing a molded product, the method includes the step of irradiating the laser beam from the side of the molded component having transparency to the laser beam, and heating and melting the contact surfaces of both molded components together. The molded part manufacturing method is characterized in that a molded part having absorptivity to the above is a molded part made of the above laser welding resin composition.

本発明のレーザー溶着用レーザー吸収剤は、熱可塑性樹脂に対する溶解性、近赤外光に対する吸収感度に優れる一方、可視領域における吸収感度は低い。従って、このレーザー吸収剤と透明な熱可塑性樹脂とを含むレーザー溶着用樹脂組成物は、レーザー吸収感度に優れる一方、肉眼ではほぼ透明とすることが可能であり、さらには他の色素の併用により自在に彩色された樹脂組成物とすることが可能である。また、レーザー吸収樹脂部材とレーザー透過樹脂部材に用いる樹脂の色調が同一であるか、近い場合には、着色を目的として添加する色素はほぼ同一組成とすることも可能である。また、この樹脂組成物をレーザー吸収樹脂部材として用いることにより、低いレーザーパワーにて樹脂溶着が可能である。   The laser-absorbing laser absorbent of the present invention is excellent in solubility in thermoplastic resins and absorption sensitivity to near-infrared light, but has low absorption sensitivity in the visible region. Therefore, the laser welding resin composition containing the laser absorbent and the transparent thermoplastic resin is excellent in laser absorption sensitivity, and can be made almost transparent to the naked eye. A freely colored resin composition can be obtained. In addition, when the color tones of the resins used for the laser-absorbing resin member and the laser-transmitting resin member are the same or close to each other, the dyes added for the purpose of coloring can have almost the same composition. Further, by using this resin composition as a laser-absorbing resin member, resin welding can be performed with low laser power.

以下、本発明の実施の形態を具体的に説明するが、本発明は、以下の実施の形態に限定されるものではなく、その要旨の範囲内で種々に変更して実施することができる。
本発明は、レーザー溶着用レーザー吸収剤、レーザー溶着用樹脂組成物、成形品及び成形品の製造方法に関するが、以下、レーザー溶着用レーザー吸収剤とは、レーザーの照射により該吸収剤を含む組成物が溶融し、該組成物以外の物質と固着する現象を利用して接着する用途に使用されるレーザー吸収剤を意味し、典型的には、熱可塑性樹脂と該レーザー吸収剤を含む組成物としてレーザー溶着する用途に使用されるものである。又、レーザー溶着用樹脂組成物とは、レーザーの照射により該組成物が溶融し、該組成物以外の物質と固着する現象を利用して接着する用途に使用される樹脂組成物を意味する。
1.レーザー吸収剤
本発明に係るレーザー溶着用のレーザー吸収剤は、下記一般式(1)で表されるジオキサジナフトペンタセン系化合物からなる。
Embodiments of the present invention will be specifically described below, but the present invention is not limited to the following embodiments, and various modifications can be made within the scope of the gist of the present invention.
The present invention relates to a laser welding laser absorbent, a laser welding resin composition, a molded article, and a method for producing the molded article. Hereinafter, a laser welding laser absorbent is a composition containing the absorbent by laser irradiation. Meaning a laser absorber used for the purpose of bonding by utilizing the phenomenon that an object melts and adheres to a substance other than the composition, typically a composition comprising a thermoplastic resin and the laser absorber Used for laser welding. Moreover, the resin composition for laser welding means a resin composition used for the purpose of bonding by utilizing a phenomenon that the composition melts by laser irradiation and adheres to a substance other than the composition.
1. Laser absorber The laser absorber for laser welding according to the present invention comprises a dioxadinaphthopentacene compound represented by the following general formula (1).

Figure 0004857887
Figure 0004857887

(式中、環A、B、C、D及びEはそれぞれ独立に任意の置換基を有していてもよいベンゼン環を表すが、同一の環上の複数の置換基が連結して環A、B、C、D及びEはそれぞれ独立に縮合環を形成していてもよい。X、Yは各々独立に酸素原子、硫黄原子、=C(CN)2、=C(CN)COOR、=C(CN)CONRR’または=N−C≡N(但し、
RおよびR’はそれぞれ独立に水素原子または任意の置換基を表す)を表すが、X及びYのうち少なくとも一方は酸素原子以外の基を表す。ZおよびZ’はそれぞれ独立に酸素原子、硫黄原子または−NR’’−(但し、R’’は水素原子または任意の置換基を表す)を表す。)
尚、以下、本明細書において、「置換基を有していても良い」とは、1つ以上の置換基を有していても良いことを意味する。
(In the formula, rings A, B, C, D and E each independently represent an optionally substituted benzene ring, but a plurality of substituents on the same ring are linked to form ring A. , B, C, D and E may each independently form a condensed ring, X and Y are each independently an oxygen atom, a sulfur atom, = C (CN) 2 , = C (CN) COOR, = C (CN) CONRR ′ or ═N—C≡N (where
R and R ′ each independently represents a hydrogen atom or an arbitrary substituent, and at least one of X and Y represents a group other than an oxygen atom. Z and Z ′ each independently represent an oxygen atom, a sulfur atom or —NR ″ — (where R ″ represents a hydrogen atom or an arbitrary substituent). )
Hereinafter, in the present specification, “may have a substituent” means that it may have one or more substituents.

1−1)環A、B、C、D及びEについて
前記式(1)における環A、B、C、D及びEは、それぞれ独立に任意の置換基を有していてもよいベンゼン環を表すが、同一の環上の複数の置換基が連結して環A、B、C、D及びEはそれぞれ独立に縮合環を形成していてもよい。環A、B、C、D及びEが有していてもよい置換基としては、アルキル基、ハロアルキル基、アルコキシ基、アルコキシアルコキシ基、ハロゲン原子、水酸基、カルボキシル基、アルキルカルボニル基またはアルコキシカルボニル基が挙げられ、好ましくはアルキル基、ハロアルキル基、アルコキシアルコキシ基、カルボキシル基またはアルコシキシカルボニル基である。
1-1) Rings A, B, C, D and E Rings A, B, C, D and E in formula (1) each independently represent a benzene ring optionally having an arbitrary substituent. As shown, a plurality of substituents on the same ring may be connected to form rings A, B, C, D and E independently of each other to form a condensed ring. As the ring A, B, C, D and E are substituent which may have, A alkyl group, a haloalkyl group, an alkoxy group, alkoxyalkoxy group, a halogen atom, a hydroxyl group, a carboxyl group, an alkylcarbonyl group or an alkoxycarbonyl A group , preferably an alkyl group, a haloalkyl group, an alkoxyalkoxy group, a carboxyl group or an alkoxycarbonyl group.

アルキル基としては、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘプチル基、ヘキシル基、オクチル基等の炭素数1〜8のアルキル基が、好ましくは炭素数1〜6のアルキル基が挙げられる。
ハロアルキル基としては、フッ素原子、塩素原子、臭素原子またはヨウ素原子で置換された炭素数1〜8ハロアルキル基が、好ましくは炭素数1〜6のハロアルキル基が挙げられる。
As the alkyl group, an alkyl group having 1 to 8 carbon atoms such as a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a heptyl group, a hexyl group, and an octyl group, preferably an alkyl group having 1 to 6 carbon atoms. Is mentioned.
As a haloalkyl group, a C1-C8 haloalkyl group substituted by a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom, Preferably a C1-C6 haloalkyl group is mentioned.

またアルコキシ基としては、メトキシ基、エトキシ基、プロポキシ基、ブトキシ基、ペンチルオキシ基、ヘプチルオキシ基、ヘキシルオキシ基、オクチルオキシ基等の炭素数1〜8のアルコキシ基が、好ましくは炭素数1〜6のアルコキシ基が挙げられる。
またアルコキシアルコキシ基としては、メトキシエトキシ基、エトキシエトキシ基、メトキシプロポキシ基、ブトキシエトキシ基等の、炭素数が2〜8のアルコキシアルコキシ基が、好ましくは炭素数2〜6のアルコキシアルコキシ基が挙げられる。
Moreover, as an alkoxy group, C1-C8 alkoxy groups, such as a methoxy group, an ethoxy group, a propoxy group, a butoxy group, a pentyloxy group, a heptyloxy group, a hexyloxy group, an octyloxy group, Preferably it is carbon number 1 ˜6 alkoxy groups.
The alkoxyalkoxy group is an alkoxyalkoxy group having 2 to 8 carbon atoms, preferably an alkoxyalkoxy group having 2 to 6 carbon atoms, such as a methoxyethoxy group, an ethoxyethoxy group, a methoxypropoxy group, or a butoxyethoxy group. It is done.

ハロゲン原子としては、フッ素原子、臭素原子、塩素原子、ヨウ素原子が挙げられる。アルキルカルボニル基としては、アセチル基、エチルカルボニル基、プロピルカルボニル基、ブチルカルボニル基、ペンチルカルボニル基、ヘプチルカルボニル基、ヘキシルカルボニル基、オクチルカルボニル基等の炭素数1〜8のアルキルカルボニル基が、好ましくは炭素数1〜6のアルキルカルボニル基が挙げられる。   Examples of the halogen atom include a fluorine atom, a bromine atom, a chlorine atom, and an iodine atom. As the alkylcarbonyl group, an alkylcarbonyl group having 1 to 8 carbon atoms such as an acetyl group, an ethylcarbonyl group, a propylcarbonyl group, a butylcarbonyl group, a pentylcarbonyl group, a heptylcarbonyl group, a hexylcarbonyl group, and an octylcarbonyl group is preferable. Is an alkylcarbonyl group having 1 to 6 carbon atoms.

アルコキシカルボニル基としては、アセチルオキシカルボニル基、エチルオキシカルボニル基、プロピルオキシカルボニル基、ブチルオキシカルボニル基、ペンチルオキシカルボニル基、ヘプチルオキシカルボニル基、ヘキシルオキシカルボニル基、オクチルオキシカルボニル基等の炭素数1〜8のアルコキシカルボニル基が、好ましくは炭素数1〜6のアルコキシカルボニル基が挙げられる。   The alkoxycarbonyl group has 1 carbon atom such as acetyloxycarbonyl group, ethyloxycarbonyl group, propyloxycarbonyl group, butyloxycarbonyl group, pentyloxycarbonyl group, heptyloxycarbonyl group, hexyloxycarbonyl group, octyloxycarbonyl group, etc. -8 alkoxycarbonyl groups, preferably an alkoxycarbonyl group having 1 to 6 carbon atoms.

上記アルキル基、ハロアルキル基、アルコキシ基、アルコキシアルコキシ基、カルボキシル基、アルキルカルボニル基およびアルコキシカルボニル基におけるアルキル基部分は、鎖状でも環状でもよく、また直鎖であっても分岐していてもよい。
環A、B、C、D及びEにおける同一の環上の複数の置換基が連結して環A、B、C、D及びEがそれぞれ独立に縮合環を形成する場合、置換基が連結して形成される環としてはベンゼン環等の芳香族炭化水素環、ピリジン環、チオフェン環等の芳香族複素環、又はシクロヘキシル環等の脂環式炭化水素環が挙げられるが、中でもベンゼン環などの芳香族炭化水素環が望ましく、芳香族炭化水素環が縮合した環A、B、C、D及びEとしては、ナフタレン環、アントラセン環等の炭素数10〜12の縮合芳香族炭化水素環が好ましい。
The alkyl group portion in the alkyl group, haloalkyl group, alkoxy group, alkoxyalkoxy group, carboxyl group, alkylcarbonyl group and alkoxycarbonyl group may be linear or cyclic, and may be linear or branched. .
When a plurality of substituents on the same ring in rings A, B, C, D, and E are linked to form rings A, B, C, D, and E each independently form a condensed ring, the substituents are linked. Examples of the ring formed include aromatic hydrocarbon rings such as benzene rings, aromatic heterocyclic rings such as pyridine rings and thiophene rings, and alicyclic hydrocarbon rings such as cyclohexyl rings. Aromatic hydrocarbon rings are desirable, and the condensed aromatic hydrocarbon rings A, B, C, D and E are preferably condensed aromatic hydrocarbon rings having 10 to 12 carbon atoms such as naphthalene ring and anthracene ring. .

1-2) X及びYについて
前記式(1)におけるXおよびYは、それぞれ独立に酸素原子、硫黄原子、=C(CN)、=C(CN)COOR、=C(CN)CONRR’または=N−C≡N(但し、RおよびR’は各々独立に水素原子または任意の置換基を表す)を表すが、X及びYのうち少なくとも一方は酸素原子以外の基を表す。X及びYがいずれも酸素原子である場合、最大吸収波長が短くなりレーザー溶着に適さない、或いは着色する等の問題がある。
1-2) X and Y In the formula (1), X and Y are each independently an oxygen atom, a sulfur atom, ═C (CN) 2 , ═C (CN) COOR, ═C (CN) CONRR ′ or ═N—C≡N (wherein R and R ′ each independently represents a hydrogen atom or an arbitrary substituent), but at least one of X and Y represents a group other than an oxygen atom. When both X and Y are oxygen atoms, there is a problem that the maximum absorption wavelength is shortened and it is not suitable for laser welding or is colored.

RおよびR’は、好ましくは置換基を有していても良いアルキル基又はアリール基を表すが、特に好ましくは炭素数1〜8なかでも炭素数1〜4の直鎖状もしくは分岐鎖状のアルキル基である。炭素数1〜4の直鎖状もしくは分岐鎖状のアルキル基の具体例としては、メチル基、エチル基、プロピル基、またはブチル基が挙げられる。
X及びYは、吸収波長の点から少なくとも何れか一方が=C(CN)であるのが好ましく、特にX及びYがいずれもC-(CN)であるのが特に好ましい。
R and R ′ preferably represent an alkyl group or an aryl group which may have a substituent, and particularly preferably a linear or branched chain having 1 to 8 carbon atoms or 1 to 4 carbon atoms. It is an alkyl group. Specific examples of the linear or branched alkyl group having 1 to 4 carbon atoms include a methyl group, an ethyl group, a propyl group, and a butyl group.
At least one of X and Y is preferably ═C (CN) 2 from the viewpoint of the absorption wavelength, and particularly preferably both X and Y are C— (CN) 2 .

1-3) Z及びZ’について
前記式(1)におけるZおよびZ’はそれぞれ独立に酸素原子、硫黄原子または−NR’’−(但し、R’’は水素原子または任意の置換基を表す。)を表す。R’’ は、好
ましくは置換基を有していても良いアルキル基又はアリール基を表し、特に好ましくは炭素数1〜8なかでも炭素数1〜4の直鎖状もしくは分岐鎖状のアルキル基である。炭素数1〜4の直鎖状もしくは分岐鎖状のアルキル基の具体例としては、前記と同様の基が挙げられる。
ZおよびZ’としては、好ましくは酸素原子または硫黄原子であるが、特に好ましくは酸素原子である。
1-3) Z and Z ′ In the above formula (1), Z and Z ′ each independently represent an oxygen atom, a sulfur atom or —NR ″ — (where R ″ represents a hydrogen atom or an arbitrary substituent) .) R ″ preferably represents an alkyl group or an aryl group which may have a substituent, and particularly preferably a linear or branched alkyl group having 1 to 8 carbon atoms and 1 to 4 carbon atoms. It is. Specific examples of the linear or branched alkyl group having 1 to 4 carbon atoms include the same groups as described above.
Z and Z ′ are preferably an oxygen atom or a sulfur atom, and particularly preferably an oxygen atom.

1−4)特に好ましい化合物について
上記一般式(1)で示されるジオキサジナフトペンタセン系化合物のうち、前記一般式(1)におけるX及びYが=C(CN)である下記一般式(2)で示される化合物が、吸収波長及び分子吸光係数の点で特に好ましい。
1-4) Particularly Preferred Compounds Among the dioxadinaphthopentacene-based compounds represented by the above general formula (1), the following general formula (X) wherein X and Y in the general formula (1) are = C (CN) 2 The compound represented by 2) is particularly preferred in terms of absorption wavelength and molecular extinction coefficient.

Figure 0004857887
Figure 0004857887

(式中、R〜Rは、それぞれ独立に水素原子、アルキル基、ハロアルキル基、アルコキシ基、アルコキシアルコキシ基、ハロゲン原子、水酸基、カルボキシル基、アルキルカルボニルまたはアルコキシカルボニル基を表すか、又はRとR、RとR、RとRおよびRとRの少なくとも一部がそれぞれ結合して環を形成する。RおよびR10はそれぞれ独立に水素原子、ハロゲン原子またはアルキル基を表す。ZおよびZ’は各々独立に酸素原子または硫黄原子を表す。)
一般式(2)におけるR〜Rで表されるアルキル基、ハロアルキル基、アルコキシ基、アルコキシアルコキシ基、ハロゲン原子、アルキルカルボニル及びアルコキシカルボニル基としては、前記一般式(1)における環A、B、C、D及びEの置換基として記載したアルキル基、ハロアルキル基、アルコキシ基、アルコキシアルコキシ基、ハロゲン原子、カルボキシル基、アルキルカルボニル基及びアルコキシカルボニル基と同様の基が挙げられ、好ましい置換基及び具体的置換基も前記と同様である。
(Wherein R 1 to R 8 each independently represents a hydrogen atom, an alkyl group, a haloalkyl group, an alkoxy group, an alkoxyalkoxy group, a halogen atom, a hydroxyl group, a carboxyl group, an alkylcarbonyl group or an alkoxycarbonyl group, or R 1 and R 2 , R 3 and R 4 , R 5 and R 6 and R 7 and R 8 are bonded to each other to form a ring, and R 9 and R 10 are each independently a hydrogen atom or a halogen atom. Or an alkyl group, and Z and Z ′ each independently represents an oxygen atom or a sulfur atom.)
As the alkyl group, haloalkyl group, alkoxy group, alkoxyalkoxy group, halogen atom, alkylcarbonyl and alkoxycarbonyl group represented by R 1 to R 8 in the general formula (2), ring A in the general formula (1), Examples of the substituents for B, C, D and E include the same groups as the alkyl groups, haloalkyl groups, alkoxy groups, alkoxyalkoxy groups, halogen atoms, carboxyl groups, alkylcarbonyl groups and alkoxycarbonyl groups. Preferred substituents The specific substituents are also the same as described above.

また、R1〜R8は、互いに同一であっても異なっていても良いが、合成の点で好ましくは同一である。
なお、RとR、RとR、RとRおよびRとRの少なくとも一部がそれぞれ結合して環を形成する場合、形成される環としては前記と同様の芳香族炭化水素環、芳香族複素環、又は脂環式炭化水素環が挙げられるが、中でもベンゼン環などの芳香族炭化水素環が好ましい。
R1 to R8 may be the same or different from each other, but are preferably the same in terms of synthesis.
In addition, when at least part of R 1 and R 2 , R 3 and R 4 , R 5 and R 6 and R 7 and R 8 are bonded to form a ring, the ring formed is the same as described above An aromatic hydrocarbon ring, an aromatic heterocyclic ring, or an alicyclic hydrocarbon ring is exemplified, and among them, an aromatic hydrocarbon ring such as a benzene ring is preferable.

また、一般式(2)におけるRおよびR10で表されるハロゲン原子及びアルキル基としては、前記一般式(1)における環A、B、C、D及びEの置換基として記載したハロゲン原子及びアルキル基が挙げられ、好ましい置換基及び具体的置換基も前記と同様である。
1−5)一般式(1)で表される化合物の物性
前記一般式(1)で表される化合物は、レーザー溶着の際に使用するレーザーに対して高い吸収能を有するのが好ましく、この点から上記化合物を クロロホルム溶媒に 0.01g/mol濃度で溶解した溶液の吸収極大が波長700〜1200nmの波長域に存在するのが好ましく、特に800〜1000の波長域に存在するのが好ましい。又、吸光係数(ε)が、10,000以上であるのが好ましい。又、目視でほとんど無彩色であるのが好ましいことから、0.01g/mol濃度のクロロホルム溶液での400〜650nmの範囲の吸光度が0.2以下であるのが好ましい。
In addition, as the halogen atom and alkyl group represented by R 9 and R 10 in the general formula (2), the halogen atom described as a substituent of the rings A, B, C, D and E in the general formula (1) And alkyl groups, and preferred substituents and specific substituents are the same as described above.
1-5) Physical properties of the compound represented by the general formula (1) The compound represented by the general formula (1) preferably has high absorptivity with respect to the laser used in laser welding. From this point, it is preferable that the absorption maximum of a solution obtained by dissolving the above compound in a chloroform solvent at a concentration of 0.01 g / mol exists in the wavelength range of 700 to 1200 nm, and particularly preferably in the wavelength range of 800 to 1000 nm. The extinction coefficient (ε) is preferably 10,000 or more. Moreover, since it is preferable that it is almost achromatic color visually, it is preferable that the light absorbency in the range of 400-650 nm in the chloroform solution of 0.01 g / mol concentration is 0.2 or less.

前記一般式(1)で表される化合物は、重量あたりの吸光度の点から、通常分子量2000以下、中でも1500以下、特に好ましくは1000以下であることが好ましい。

また、レーザー溶着用である前記一般式(1)で表される化合物は、通常、熱可塑性樹脂等の樹脂に混合してレーザー溶着用樹脂組成物として使用されるため、樹脂に対して溶解性が高いことが好ましく、逆に言えば、通常、水不溶性である。ここで「水不溶性」とは、25℃、1気圧の条件下における水に対する溶解度が、通常0.01重量%以下、好ましくは0.001重量%以下であることを言う。
The compound represented by the general formula (1) usually has a molecular weight of 2000 or less, particularly 1500 or less, particularly preferably 1000 or less, in terms of absorbance per weight.

In addition, the compound represented by the general formula (1) which is laser welding is usually mixed with a resin such as a thermoplastic resin and used as a laser welding resin composition, and is therefore soluble in the resin. Is preferably high. Conversely, it is usually water-insoluble. Here, “water-insoluble” means that the solubility in water at 25 ° C. and 1 atmosphere is usually 0.01% by weight or less, preferably 0.001% by weight or less.

1−6) 一般式(1)で表される化合物の具体例
一般式(1)で示される本発明のジオキサジナフトペンタセン系化合物の好ましい具体例としては、例えば、以下に例示されるものが挙げられる。ただし、以下の化合物に限定されるものではない。
1-6) Specific examples of compound represented by general formula (1) Preferred specific examples of the dioxadinaphthopentacene compound of the present invention represented by general formula (1) include those exemplified below. Is mentioned. However, it is not limited to the following compounds.

Figure 0004857887
Figure 0004857887

Figure 0004857887
Figure 0004857887

Figure 0004857887
Figure 0004857887

Figure 0004857887
Figure 0004857887

Figure 0004857887
Figure 0004857887

Figure 0004857887
Figure 0004857887

1−7)合成方法
上記一般式(1)で示されるジオキサジナフトペンタセン系化合物は、特開昭63−297385号公報などに記載の公知の方法に従って容易に合成できる。例えば、前記一般式(2)で示されるジオキサジナフトペンタセン系化合物は、下記一般式(3)
1-7) Synthesis Method The dioxadinaphthopentacene compound represented by the general formula (1) can be easily synthesized according to a known method described in JP-A-63-297385. For example, the dioxadinaphthopentacene compound represented by the general formula (2) is represented by the following general formula (3)

Figure 0004857887
Figure 0004857887

(式中、R〜R10、ZおよびZ’は前記一般式(2)の定義と同じ。)
で表される化合物に、クロロホルム中、ピリジン、四塩化チタンの存在下、マロンニトリル(CH(CN))を反応させることによって製造することができる。
以上に説明した本発明のレーザー溶着用レーザー吸収剤は、700〜1200nm、特に800〜1000nmの波長帯域の光を良く吸収し、大きな分子吸光係数を示す一方、400〜650nmの可視光波長領域に目立った光吸収は少ない。耐光性、耐熱性、樹脂との相溶性に優れ、製造も容易である。このようなレーザー吸収剤を含有するレーザー溶着用樹脂組成物は、レーザー吸収剤使用量が比較的少量でも低いレーザーパワーにて樹脂溶着が可能である。このレーザー吸収剤と透明な熱可塑性樹脂とを含むレーザー溶着用樹脂組成物は、レーザー吸収感度に優れる一方、肉眼ではほぼ透明とすることが可能であり、さらには他の色素の併用により自在に彩色された樹脂組成物とすることが可能である。
(In the formula, R 1 to R 10 , Z and Z ′ are the same as defined in the general formula (2).)
Can be produced by reacting malononitrile (CH 2 (CN) 2 ) with chloroform in the presence of pyridine and titanium tetrachloride.
The laser welding laser absorbent of the present invention described above absorbs light in a wavelength band of 700 to 1200 nm, particularly 800 to 1000 nm, and exhibits a large molecular extinction coefficient, while in the visible light wavelength region of 400 to 650 nm. There is little conspicuous light absorption. It is excellent in light resistance, heat resistance, compatibility with resin, and easy to manufacture. The resin composition for laser welding containing such a laser absorbent can be welded with a low laser power even if the amount of the laser absorbent used is relatively small. The laser welding resin composition containing this laser absorbent and a transparent thermoplastic resin is excellent in laser absorption sensitivity, but can be made almost transparent to the naked eye, and can be freely combined with other dyes. It is possible to make a colored resin composition.

2.レーザー溶着用樹脂組成物
本発明のレーザー溶着用樹脂組成物は、熱可塑性樹脂と前記一般式(1)で表される本発明のレーザー吸収剤を含有する。
2. Laser welding resin composition The laser welding resin composition of the present invention contains a thermoplastic resin and the laser absorbent of the present invention represented by the general formula (1).

熱可塑性樹脂としては、レーザー透過性を有する熱可塑性樹脂であれば特に制限はない。ここで、レーザー透過性を有するとは、層厚が0.4〜6mmの何れかにおいて、700〜1200nmの波長範囲またはこのスペクトル範囲の少なくとも一部のレーザー透過率が5%以上であることを意味する。レーザー透過性は、層厚が好ましくは0.5〜5mm、特に好ましくは0.6〜3.5mmで上記透過率が5%以上であることが好ましい。また、上記レーザー透過率は好ましくは10%以上であり、より好ましくは15%以上である。   The thermoplastic resin is not particularly limited as long as it is a thermoplastic resin having laser transparency. Here, having laser transparency means that at any layer thickness of 0.4 to 6 mm, the laser transmittance of at least part of the wavelength range of 700 to 1200 nm or this spectral range is 5% or more. means. The laser transmittance is preferably 0.5 to 5 mm, particularly preferably 0.6 to 3.5 mm, and the transmittance is preferably 5% or more. The laser transmittance is preferably 10% or more, more preferably 15% or more.

尚、後述の成形品及び成形品の製造方法においては、熱可塑性樹脂組成物を構成する熱可塑性樹脂として、成形品の厚みに応じて、照射されるレーザーの50%以上が透過されるようなレーザー透過率を有する熱可塑性樹脂が選択される。
本発明の熱可塑性樹脂としては、ポリエチレン、ポリプロピレン、プロピレンーエチレン共重合体等のポリオレフィン系樹脂、アクリロニトリル・ブタジエン・スチレン、アクリロニトリル・スチレン、ポリスチレン、アクリロニトリル・エチレンプロピレンゴム・スチレン等のスチレン系樹脂、ポリビニルアルコール、エチレン・酢酸ビニル共重合体鹸化物、塩化ビニル、ポリアミド(PA6 PA66など)、ポリエステル(ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレートなど)、ポリカーボネート、ポリオキシメチレン、ポリフェニレンサルファイド、ポリフェニレンエーテル、ポリエーテルエーテルケトン等が挙げられ、これらは混合物として用いても良い。又、オレフィン系熱可塑性エラストマーや、スチレン系熱可塑性エラストマーも使用できる。
In the molded product and the method for producing the molded product described later, 50% or more of the irradiated laser is transmitted as the thermoplastic resin constituting the thermoplastic resin composition, depending on the thickness of the molded product. A thermoplastic resin having a laser transmittance is selected.
Examples of the thermoplastic resin of the present invention include polyolefin resins such as polyethylene, polypropylene, and propylene-ethylene copolymers, styrene resins such as acrylonitrile / butadiene / styrene, acrylonitrile / styrene, polystyrene, acrylonitrile / ethylene propylene rubber / styrene, Polyvinyl alcohol, saponified ethylene / vinyl acetate copolymer, vinyl chloride, polyamide (PA6 PA66, etc.), polyester (polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, etc.), polycarbonate, polyoxymethylene, polyphenylene sulfide, polyphenylene ether, Examples thereof include polyether ether ketone, and these may be used as a mixture. In addition, olefin-based thermoplastic elastomers and styrene-based thermoplastic elastomers can also be used.

本発明のレーザー溶着用樹脂組成物における各成分の含有割合は、熱可塑性樹脂が、通常97重量%以上、好ましくは99.7重量%以上であり、通常99.999重量%以下である。また、レーザー吸収剤の含有割合は、通常0.001重量%以上、3重量%以下である。尚、一般式(1)で表される本願発明のレーザー吸収剤は単独で、又は2種以上を併用してもよく、2種以上のレーザー吸収剤が含まれる場合に、その比率は任意であり、通常、その合計が上記範囲に入るようにする。本願発明のレーザー吸収剤の含有量が低なすぎると、必要なレーザー吸収量が確保できず充分なレーザー溶着性が得られない可能性があり、多すぎる場合には、特に融着性能に差がないこととなる。   The content of each component in the resin composition for laser welding of the present invention is usually 97% by weight or more, preferably 99.7% by weight or more, and usually 99.999% by weight or less for the thermoplastic resin. Moreover, the content rate of a laser absorber is 0.001 to 3 weight% normally. In addition, the laser absorber of this invention represented by General formula (1) is independent, or may use 2 or more types together, and when 2 or more types of laser absorbers are contained, the ratio is arbitrary. Yes, usually the sum is within the above range. If the content of the laser absorber of the present invention is too low, the necessary laser absorption amount may not be ensured, and sufficient laser weldability may not be obtained. There will be no.

本発明のレーザー溶着用樹脂組成物は、熱可塑性樹脂と前記一般式(1)で表される本発明のレーザー吸収剤以外に、その用途に応じて各種添加剤を含有することができる。かかる添加剤としては、補助着色剤、分散剤、充填剤、安定剤、可塑剤、改質剤、UV吸収剤または光安定剤、酸化防止剤(フェノール系、リン系、硫黄系など)、帯電防止剤、滑剤、剥離剤、結晶化促進剤、核剤、難燃剤(ハロゲン系、リン系)、無機充填剤(タルク、炭酸カルシウム、ガラス繊維、炭素繊維、ウィスカー、シリカ、硫酸バリウム、ゼオライト、クレー、水酸化マグネシウム、水酸化アルミニウム、炭酸マグネシウム、カーボンナノファイバー)、耐衝撃性を改善するためのエラストマー、一重項酸素クエンチャーなどが挙げられ、その含有量は、樹脂組成物の用途に応じて公知の範囲から適宜選定される。   The resin composition for laser welding according to the present invention can contain various additives in addition to the thermoplastic resin and the laser absorbent according to the present invention represented by the general formula (1) depending on the application. Such additives include auxiliary colorants, dispersants, fillers, stabilizers, plasticizers, modifiers, UV absorbers or light stabilizers, antioxidants (phenolic, phosphorus, sulfur, etc.), charging Inhibitors, lubricants, release agents, crystallization accelerators, nucleating agents, flame retardants (halogen-based, phosphorus-based), inorganic fillers (talc, calcium carbonate, glass fibers, carbon fibers, whiskers, silica, barium sulfate, zeolite, Clay, magnesium hydroxide, aluminum hydroxide, magnesium carbonate, carbon nanofiber), elastomer for improving impact resistance, singlet oxygen quencher, etc., the content of which depends on the use of the resin composition Thus, it is appropriately selected from a known range.

本発明のレーザー溶着用樹脂組成物は、個々の成分を公知の方法に準じて混合することにより得られる。樹脂との混合は、ブレンダーやミキサーなどによる混合、ハンドブレンドなどによる固体分散後に溶融混練する方法や、溶融後の樹脂に添加する方法、マスターバッチ等で成形時に添加する方法など既知の手法を用いることが可能である。溶融混練には従来既知の装置を用いることができ、例えば内部ニーダー、単軸押出機、多軸押出機、ロール、バンバリーミキサーなどがあげられる。混合は、樹脂が熱分解せず、所定粘度が得られる温度範囲で行われる。尚、溶融コンパウンド化または溶融押し出し加工途中に、上述した添加剤を添加することも出来る。   The laser welding resin composition of the present invention can be obtained by mixing individual components according to a known method. For mixing with the resin, a known method such as mixing with a blender or mixer, solid kneading after hand blending, melt kneading, adding to the resin after melting, or adding at the time of molding with a masterbatch is used. It is possible. A conventionally known apparatus can be used for the melt-kneading, and examples thereof include an internal kneader, a single-screw extruder, a multi-screw extruder, a roll, and a Banbury mixer. The mixing is performed in a temperature range where the resin does not thermally decompose and a predetermined viscosity is obtained. In addition, the additive mentioned above can also be added in the middle of melt compounding or melt extrusion processing.

3.成形品の製造方法
本発明の成形品の製造方法は、(1)加熱源としてのレーザー光に対して透過性を有する成形部品(以下、レーザー光透過性成形部品と略することがある)と、該レーザー光に対して吸収性を有する成形部品(以下、レーザー光吸収性成形部品と略することがある)とを当接させる工程、及び、(2)該レーザー光に対して透過性を有する成形部品側から該レーザー光を照射し、両成形部品の当接面同士を加熱溶融させて接合させる工程、を有する成形品の製造方法において、該レーザー光に対して吸収性を有する成形部品が前記本発明のレーザー溶着用樹脂組成物からなる。
レーザー光透過性成形部品としては、レーザー溶着に使用される後述のレーザー光を実質的に透過する成形部品であれば特に限定されず、例えば、前述の熱可塑性樹脂、又はこれに、得られる成形部品がレーザー光を実質的に透過する範囲で任意の添加剤を含有する熱可塑性樹脂組成物を、射出成形、押し出し成形等の公知の成形方法に従って成形して得られる成形部品が挙げられる。ここで、レーザー光を実質的に透過するとは、成形部品にレーザーを照射した際(即ち、レーザー光照射の厚み方向において)、その50%以上が透過することを言う。レーザー光透過性成形部品の透過性は、好ましくは、60%以上である。
3. Manufacturing method of molded product The manufacturing method of the molded product of the present invention includes (1) a molded part that is transparent to laser light as a heating source (hereinafter, may be abbreviated as a laser light transmitting molded part). A step of abutting a molded part having absorptivity with respect to the laser light (hereinafter sometimes abbreviated as a laser light absorptive molded part), and (2) transparency to the laser light. In the manufacturing method of a molded product, the molded component having the step of irradiating the laser beam from the molded component side and heating and melting the contact surfaces of both molded components together Consists of the resin composition for laser welding of the present invention.
The laser light-transmitting molded part is not particularly limited as long as it is a molded part that substantially transmits the laser light described later used for laser welding. For example, the above-described thermoplastic resin, or molding obtained thereby Examples thereof include molded parts obtained by molding a thermoplastic resin composition containing an arbitrary additive within a range in which the part substantially transmits laser light according to a known molding method such as injection molding or extrusion molding. Here, substantially transmitting the laser beam means that 50% or more of the laser beam is transmitted when the molded part is irradiated with the laser (that is, in the thickness direction of the laser beam irradiation). The permeability of the laser light transmissive molded part is preferably 60% or more.

本発明では、レーザー光吸収性成形部品は、前記の本発明のレーザー溶着用樹脂組成物からなり、通常、前記の本発明のレーザー溶着用樹脂組成物を射出成形、押し出し成形等の公知の成形方法に従って成形して得られる。 尚、レーザー光透過性成形部品及びレーザー光吸収性成形部品を構成する熱可塑性樹脂が同一である場合、融着性が良好であるので好ましい。   In the present invention, the laser-light-absorbing molded part is composed of the above-mentioned laser welding resin composition of the present invention, and the known laser welding resin composition of the present invention is usually formed by known molding such as injection molding or extrusion molding. It is obtained by molding according to the method. Note that it is preferable that the thermoplastic resin constituting the laser light transmitting molded part and the laser light absorptive molded part are the same because the fusing property is good.

本発明の成形品の製造方法においては、上記のレーザー光吸収性成形部品とレーザー光透過性成形部品を当接させた後、レーザー光透過性成形部品側からレーザー光を照射し、両成形部品の当接面同士を加熱溶融させて接合することにより成形品を得る。尚、当接は、積層、嵌合、等の方法で被溶着部分が直接接触する状態とするがレーザー光の透過・吸収を妨げない範囲で、必要に応じて固定冶具等を用いても良い。   In the method for producing a molded product according to the present invention, after the laser light absorbing molded component and the laser light transmissive molded component are brought into contact with each other, the laser light is irradiated from the laser light transmissive molded component side, These abutting surfaces are heated and melted to form a molded product. Note that the contact is in a state where the welded portion is in direct contact by a method such as lamination or fitting, but a fixing jig or the like may be used as necessary as long as transmission and absorption of laser light are not hindered. .

加熱源として用いるレーザーの種類としては、レーザー吸収剤の吸収波長の関係から、例えば、YAG:Nd3+レーザー(レーザー光波長1060nm)や半導体レーザー(レーザー光波長500〜1000nm)等、波長が700〜1200nmの範囲にあるレーザーを用いることができる。
また、レーザーの出力、照射密度や加工速度(移動速度)などの照射条件は、樹脂の種類などに応じて適宜設定可能である。当接面に対するレーザー光の照射角度は垂直、斜めの何れであっても良い。
The type of laser used as the heating source is, for example, YAG: Nd 3 + laser (laser beam wavelength 1060 nm), semiconductor laser (laser beam wavelength 500 to 1000 nm), etc., with a wavelength of 700 to 1200 nm because of the absorption wavelength of the laser absorber. A laser in the range of can be used.
In addition, irradiation conditions such as laser output, irradiation density, and processing speed (moving speed) can be appropriately set according to the type of resin. The irradiation angle of the laser beam with respect to the contact surface may be either vertical or oblique.

以下に、実施例により本発明の実施態様を説明するが、本発明はその要旨を超えない限り、これらに限定されるものではない。
実施例1
<樹脂組成物の作製>
ポリプロピレン樹脂ペレット(日本ポリプロ社製ノバテック(登録商標)PP BC03G)に、特開昭63−297385号公報に記載の方法に準じて合成した上記表1のNo.27で表される色素(0.01g/molのクロロホルム溶液中のλmax:770nm)1%を添加しハンドブレンドした後、小型2軸押出機KZW−15(テクノベル社製)に投入し、シリンダー温度150−190℃、400rpm、吐出1.5kg/hrに設定し、溶融混練・押し出しし、水槽冷却後ストランドカットしてペレットを得た。
Embodiments of the present invention will be described below by way of examples. However, the present invention is not limited to these examples as long as the gist thereof is not exceeded.
Example 1
<Preparation of resin composition>
No. 1 in Table 1 above was synthesized in polypropylene resin pellets (Novatech (registered trademark) PP BC03G manufactured by Nippon Polypro Co., Ltd.) according to the method described in JP-A-63-297385. After adding 1% of the dye represented by No. 27 (λ max in a 0.01 g / mol chloroform solution: 770 nm) and hand blending, the mixture was charged into a small twin screw extruder KZW-15 (manufactured by Technobel) and cylinder The temperature was set to 150 to 190 ° C., 400 rpm, and the discharge was 1.5 kg / hr, melt kneading and extrusion were performed, and the strand was cut after cooling the water bath to obtain pellets.

<成形体の作製>
[レーザー吸収用試験片作成]
得られたペレットを射出成形機IS−55(東芝機械)でシリンダー温度設定150−200℃、金型温度40℃、射出時間15秒、冷却時間15秒の設定条件にて、2mm厚の平板を成形し、120mm×80mm大に切りだして試験片とした。
[レーザー透過用試験片]
ポリプロピレン樹脂ペレット(日本ポリプロ社製ノバテック(登録商標)PP BC03G)を、レーザー吸収用試験片と同様の条件設定にて射出成形および切り出しを行い、試験片とした。
<レーザー溶着実験>
上記レーザー吸収用試験片上に、上記レーザー透過用試験片を載置し、パーカーコーポレーション製 PARK LASER SYSTEM(波長 940nm)を用い、 レーザー出力30W、レーザー電流が23A、レーザー走査速度10mm/sの条件でレーザー照射し、レーザー溶着実験を行った結果、良好な溶着が確認できた。尚、当接面に対するレーザー光の照射角度は垂直で行った。
<Production of molded body>
[Laser absorption specimen creation]
The obtained pellets were formed into a 2 mm thick flat plate with an injection molding machine IS-55 (Toshiba Machine) under the setting conditions of cylinder temperature setting 150-200 ° C., mold temperature 40 ° C., injection time 15 seconds, cooling time 15 seconds. The test piece was molded and cut into a size of 120 mm × 80 mm.
[Laser transmission specimen]
Polypropylene resin pellets (Novatech (registered trademark) PP BC03G manufactured by Nippon Polypro Co., Ltd.) were injection molded and cut out under the same conditions as the laser absorption test pieces to obtain test pieces.
<Laser welding experiment>
The test piece for laser transmission is placed on the test piece for laser absorption, and a PARK LASER SYSTEM (wavelength: 940 nm) manufactured by Parker Corporation is used. The laser output is 30 W, the laser current is 23 A, and the laser scanning speed is 10 mm / s. As a result of laser irradiation and laser welding experiments, good welding was confirmed. In addition, the irradiation angle of the laser beam with respect to the contact surface was performed perpendicularly.

Claims (5)

下記一般式(1)で表されるジオキサジナフトペンタセン系化合物からなるレーザー溶着用レーザー吸収剤。
Figure 0004857887
(式中、環A、B、C、D及びEは、それぞれ独立に任意の置換基を有していてもよいベンゼン環を表すが、同一の環上の複数の置換基が連結して環A、B、C、D及びEはそれぞれ独立に縮合環を形成していてもよい。X及びYは、それぞれ独立に酸素原子、硫黄原子、=C(CN)2、=C(CN)COOR、=C(CN)CONRR’または=N−C≡
N(但し、RおよびR’はそれぞれ独立に水素原子または任意の置換基を表す)を表すが、X及びYのうち少なくとも一方は酸素原子以外の基を表す。ZおよびZ’は各々独立に酸素原子、硫黄原子または−NR’’−(但し、R’’は水素原子または任意の置換基を表す)を表す。)
A laser welding laser absorber comprising a dioxadinaphthopentacene compound represented by the following general formula (1).
Figure 0004857887
(In the formula, rings A, B, C, D and E each independently represent a benzene ring optionally having any substituent, but a plurality of substituents on the same ring are linked to form a ring. A, B, C, D and E may each independently form a condensed ring, and X and Y each independently represent an oxygen atom, a sulfur atom, = C (CN) 2 , = C (CN) COOR , = C (CN) CONRR 'or = N-C≡
N (wherein R and R ′ each independently represents a hydrogen atom or an arbitrary substituent), but at least one of X and Y represents a group other than an oxygen atom. Z and Z ′ each independently represent an oxygen atom, a sulfur atom or —NR ″ — (where R ″ represents a hydrogen atom or an arbitrary substituent). )
X及びYの少なくとも一方が=C(CN)2である請求項1に記載のレーザー溶着用レー
ザー吸収剤。
The laser absorbent for laser welding according to claim 1, wherein at least one of X and Y is = C (CN) 2 .
熱可塑性樹脂及び請求項1又は2に記載のレーザー吸収剤を含有することを特徴とするレーザー溶着用樹脂組成物。 A laser welding resin composition comprising a thermoplastic resin and the laser absorbent according to claim 1. レーザー溶着で接合された成形品であって、該成形品を構成する少なくとも1つの成形部品が請求項3に記載のレーザー溶着用樹脂組成物で構成されてなることを特徴とする、成形品。 A molded product joined by laser welding, wherein at least one molded part constituting the molded product is formed of the resin composition for laser welding according to claim 3. (1)加熱源としてのレーザー光に対して透過性を有する成形部品と、該レーザー光に対して吸収性を有する成形部品とを当接させる工程、及び、(2)該レーザー光に対して透過性を有する成形部品側から該レーザー光を照射し、両成形部品の当接面同士を加熱溶融させて接合させる工程、を有する成形品の製造方法において、該レーザー光に対して吸収性を有する成形部品が請求項4に記載のレーザー溶着用樹脂組成物からなる成形部品であることを特徴とする成形品の製造方法。 (1) a step of contacting a molded part having transparency to laser light as a heating source and a molded part having absorbency with respect to the laser light; and (2) against the laser light. In a method for manufacturing a molded product, the method includes a step of irradiating the laser beam from the side of the molded component having transparency, and joining the contact surfaces of both molded components by heating and melting each other. A method for producing a molded article, wherein the molded part has a molded part made of the laser welding resin composition according to claim 4.
JP2006121106A 2006-04-25 2006-04-25 Laser welding laser absorbent, laser welding resin composition, molded product and method for producing molded product Expired - Fee Related JP4857887B2 (en)

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