JP4841523B2 - Double-molded insert-molded product and method for producing the same - Google Patents

Description

  The present invention relates to a double-molded insert-molded product in which a first molded body and a second molded body are formed on both surfaces of a conductive film, for example, for use in flip covers of mobile phones and personal computers, and a method for manufacturing the same. More specifically, the present invention relates to an electrical connection structure and connection method between the conductive film and an external circuit.

  Conventionally, the thing of various structures is known as what electrically connects an external circuit to the said electroconductive film, for example, there exists what was disclosed by patent document 1 (Unexamined-Japanese-Patent No. 2003-168558).

In Patent Document 1, a contact pin erected on an external circuit board is elastically placed through a through hole formed in an upper case on a conductive film disposed between an upper case and a decorative film of an outer case. Thus, a structure for electrically connecting a conductive film and an external circuit is disclosed.
JP 2003-168558 A

  However, in the above-mentioned Patent Document 1, since the contact pin is elastically placed on the conductive film through the through hole, the conductive film is deformed by the pressing by the elastic force of the contact pin, the impact due to the friction of the contact pin, There is a possibility that the conductive film and the decorative film may be damaged due to wear.

  As a means for avoiding this, it may be possible to reinforce the strength by providing a protective plate on the surface of the decorative film. However, in this case, even if it can prevent the conductive film and the decorative film from being damaged by the protective plate, for example, the tip of the contact pin moves so as to slide on the surface of the conductive film due to external impact or vibration, There is a problem that the electrical connection between the conductive film and the external circuit becomes unstable.

  Accordingly, an object of the present invention is to solve the above-described problem, and to stabilize the electrical connection between the conductive film having the first formed body and the second formed body on both sides and an external circuit. An object of the present invention is to provide a double-molded insert-molded article and a method for producing the same.

In order to achieve the above object, the present invention is configured as follows.
According to the first aspect of the present invention, there is provided a double molded insert molded article in which a first molded body and a second molded body are formed on both surfaces of a conductive film having a conductive film layer provided on the surface of a support film. And
The shaft portion of the conductive pin having a larger cross-sectional area perpendicular to the axial direction than the shaft portion is held by both the shaft portion through the conductive film and the first molded body and exposed to the outside. A double-molded insert-molded article provided such that a lower part of the head adjacent to the shaft part is in contact with the conductive film layer, and an upper part of the head adjacent to the lower part is in contact with the second molded body. provide.

  In the present invention, double molding refers to manufacturing a resin molded body by injecting molten resin into a plurality of times using a plurality of molds having different cavity shapes. The resin molded body to be manufactured is referred to as a first molded body and a second molded body. In addition, when secondary molding is performed in a state where the first molded body molded by the primary molding die is inserted into the secondary molding die, one of the following methods is performed. The present invention includes both methods. First, as a first method, in the primary molding die and the secondary molding die, one of the combined dies is a common die and the other is an exchange die. In this case, the first molded body is held in the common mold of the primary molding mold, and the other mold is replaced with a secondary molding mold. The second method is a case where a common mold is not used for the primary molding die and the secondary molding die. In this case, the first molded body is taken out from the primary molding die and fitted into the secondary molding die, and then secondary molding is performed.

  According to the 2nd aspect of this invention, the front-end | tip part of the said axial part protrudes from the said 1st molded object, and provides the double-molding insert molded product as described in a 1st aspect.

  According to the third aspect of the present invention, there is provided the double-molded insert-molded product according to the first or second aspect, wherein there is no sharp part at the upper part of the head.

  According to a fourth aspect of the present invention, there is provided the double molded insert molded product according to the first or second aspect, wherein the upper portion of the head is substantially hemispherical.

  According to a fifth aspect of the present invention, there is provided the double molded insert molded product according to the first or second aspect, wherein the upper part of the head is substantially flat.

  According to the sixth aspect of the present invention, the shaft portion of the conductive pin has a retaining groove or protrusion into which the first molded body is fitted into a portion that is held through the first molded body. The double molded insert molded article according to any one of the first to fifth aspects is provided.

According to the seventh aspect of the present invention, the surface of the support film is formed using a primary molding die for molding the primary molded body and a secondary molding die for molding the secondary molded body, which are configured to be openable and closable. A double-molded insert-molded product in which the conductive film is coated with a primary molded body and a secondary molded body by injecting molten resin in a state where the conductive film provided with the conductive film layer is disposed in the cavity. A method of manufacturing
After passing through the conductive film so that the head of the conductive pin having a larger cross-sectional area perpendicular to the axial direction than the shaft is in contact with the conductive film layer, the mold for primary molding Insert the tip of the shaft portion into the pin shaft portion storage recess provided at a predetermined position on the cavity side,
A molten resin constituting the primary molded body by closing the primary molding die is injected between the cavity side of the primary molding die and the support film, and the primary molded body and the conductive material are injected. After the functional film is integrated, the primary molding die is opened,
The integrated primary molded body and the conductive film are arranged in the secondary molding die so that the conductive film is exposed on the cavity side of the secondary molding die,
Closing the mold for secondary molding, injecting a molten resin constituting the secondary molded body, and covering the conductive film with the primary molded body and the secondary molded body,
A method for producing a double-molded insert-molded article is provided.

According to the 8th aspect of this invention, it is comprised so that opening and closing is possible, and the surface of a support film is used for the surface of a support film using the mold for primary molding which shape | molds a primary molded object, and the mold for secondary molding which shape | molds a secondary molded object. A double-molded insert-molded product in which the conductive film is coated with a primary molded body and a secondary molded body by injecting molten resin in a state where the conductive film provided with the conductive film layer is disposed in the cavity. A method of manufacturing
After passing through the conductive film so that the head of the conductive pin having a larger cross-sectional area perpendicular to the axial direction than the shaft is in contact with the conductive film layer, the mold for primary molding Insert the tip end of the shaft into the first pin shaft housing recess provided at a predetermined position on the cavity side,
A molten resin constituting the primary molded body by closing the primary molding mold is injected between the cavity side of the primary molding mold and the conductive film layer, and the primary molded body and the After integrating the conductive film, open the mold for primary molding,
The integrated primary molded body and the conductive film are arranged in the secondary molding die so that the conductive film is exposed on the cavity side of the secondary molding die, and Inserting the tip of the shaft into the second pin shaft housing recess provided at a predetermined position on the cavity side of the secondary molding die;
The conductive film is injected by injecting a molten resin constituting the secondary molded body by closing the secondary molding die between the cavity side of the secondary molding die and the support film. Covering with the primary molded body and the secondary molded body,
A method for producing a double-molded insert-molded article is provided.

According to the ninth aspect of the present invention, there is provided a primary molding die for molding a primary molded body and a secondary molding die for molding a secondary molded body, each having a plurality of molds configured to be openable and closable. The conductive film is covered with the primary molded body and the secondary molded body by injecting the molten resin in a state where the conductive film having the conductive film layer provided on the surface of the support film is disposed in the cavity. A method for producing a double-molded insert-molded article, comprising:
The conductive film is arranged so that the support film of the conductive film is exposed on the cavity side of the primary molding die,
A molten resin constituting the primary molded body by closing the primary molding die is injected between the cavity side of the primary molding die and the support film, and the primary molded body and the conductive material are injected. After the functional film is integrated, the primary molding die is opened,
The conductive pin having a larger cross-sectional area perpendicular to the axial direction than the shaft portion of the head portion is integrated with the conductive film layer, the support film, and the primary molded body in this order from the tip portion of the shaft portion. After penetrating the conductive film and the primary molded body, the tip end portion of the shaft portion is inserted into the pin shaft portion storage recess provided at a predetermined position on the cavity side of the secondary molding die,
The molten resin constituting the secondary molded body by closing the secondary molding die is injected between the cavity side of the secondary molding die and the conductive film layer, and the conductive Covering the film with the primary molded body and the secondary molded body,
A method for producing a double-molded insert-molded article is provided.

  According to the double molded insert molded product of the present invention, the shaft portion of the conductive pin penetrates the conductive film and the first molded body and is held by both, and is more orthogonal to the axial direction than the shaft portion. Since the upper part of the head of the conductive pin having a large cross-sectional area is in contact with the second molded body, the conductive pin does not move in any direction even when an external impact or vibration is applied. Moreover, since the lower part of the said head is in contact with the conductive film layer of the conductive film in this state, the electrical connection between the conductive pin and the conductive film is stabilized. Therefore, the electrical connection between the conductive film and the external circuit can be stabilized via the conductive pin by connecting the tip of the shaft portion penetrating the first molded body to the external circuit.

  Moreover, if it comprises so that the front-end | tip part of the said axial part may protrude from a 1st molded object and it may expose outside, the electrical connection of an electroconductive pin and an external circuit will become easy. On the other hand, at the time of molding the first molded body, by fixing the protruding portion at a predetermined position of a mold for molding the first molded body, the conductive pin is caused by the pressure of the molten resin constituting the first molded body. It is possible to improve the positioning accuracy of the conductive pin while suppressing problems such as bending. Thereby, productivity can be improved and electrical connection between the conductive pin and the external circuit can be stabilized.

  Moreover, if it comprises so that there may not be an acute angle part in the upper part of the said head, at the time of shaping | molding of a 2nd molded object, the flow of the molten resin which comprises a 2nd molded object will not be inhibited, but the said molten resin is 2nd shaping | molding. Between the body and the conductive film layer and the upper part of the head of the conductive pin, it is filled with no gap. Thereby, even if the impact and vibration from the outside are added, the movement of the conductive pin can be eliminated more reliably, and the electrical connection between the conductive film and the external circuit can be stabilized.

  In addition, if the upper part of the head is formed in a substantially hemispherical shape, the flow of the molten resin constituting the second molded body is not hindered when the second molded body is molded, and the molten resin is electrically conductive with the second molded body. Between the membrane layer and the upper part of the head of the conductive pin, the gap is filled with no gap. Furthermore, since it becomes the structure which relieves the pressure of the molten resin which comprises the 2nd molded object added to a conductive pin, malfunctions, such as a bending of a conductive pin, can be suppressed and the positioning accuracy of a conductive pin can be improved. As a result, productivity can be improved and the movement of the conductive pins can be eliminated more reliably even when an external impact or vibration is applied, and the electrical connection between the conductive film and the external circuit can be established. Can be stabilized.

  If the upper part of the head is configured to be substantially flat, the molten resin constituting the second molded body may enter between the conductive film layer and the head of the conductive pin when the second molded body is molded. However, since the molten resin has a structure in which the head is pressed toward the first molded body, the contact resistance between the conductive film layer and the conductive pin is reduced. Thereby, electrical performance can be improved.

  Moreover, if it comprises so that the part by which the said shaft part penetrates and hold | maintains a 1st molded object may be equipped with the groove | channel or protrusion for retaining, it will become a structure where the said shaft part is firmly fixed to a 1st molded object. . For this reason, even if the impact and vibration from the outside are added, the movement of the conductive pin can be eliminated more reliably, and the electrical connection between the conductive film and the external circuit can be stabilized.

Before continuing the description of the present invention, the same parts are denoted by the same reference numerals in the accompanying drawings.
The best mode for carrying out the present invention will be described below with reference to the drawings.

<< First Embodiment >>
An electronic apparatus using the double-molded insert-molded product according to the first embodiment of the present invention as a flip cover will be described.
1A and 1B are perspective views showing an external configuration of an electronic device using a double-molded insert-molded product according to the first embodiment of the present invention as a flip cover, and FIG. 1A shows a state in which the flip cover is opened. FIG. 1B shows a state in which the flip cover is closed.

  The electronic device 1 according to the first embodiment can be used as, for example, a PDA. 1A and 1B, the electronic device 1 has a configuration in which a flip cover 2 that is a double-molded insert product is hinged to the upper end of a main body 3 by a hinge portion 4. When the flip cover 2 is coupled using the hinge portion 4, the flip cover 2 is in an opened state where the flip cover 2 is raised with respect to the main body 3 as shown in FIG. 1A and a closed state where the flip cover 2 is stacked on the main body 3 as shown in FIG. Can be opened and closed between states.

  A display 5 such as liquid crystal and operation buttons 6 are provided on the surface 3a of the main body 3, and these are exposed to the outside when the flip cover 2 is opened. Therefore, when the flip cover 2 is opened, the operation can be performed by directly pressing the operation button 6 or the like.

  Further, the flip cover 2 is transparent in a normal usage pattern, and as shown in FIG. 1B, the liquid crystal display 5 and the operation buttons 6 can be visually recognized through the flip cover 2 in a closed state. Further, as will be described later, the flip cover 2 is provided so that the conductive film layer is covered with a transparent synthetic resin, and the flip cover 2 has an electrostatic capacity when the conductive film layer is energized. It is configured to be used as a switch or a communication antenna.

  FIG. 2 is a perspective view showing a configuration in which the flip cover 2 used in the electronic apparatus 1 of FIG. 1A is connected to a circuit sheet 10 which is an example of an external circuit. The circuit sheet 10 has a configuration in which a circuit pattern is provided on a flexible or rigid base for guiding electrodes to the outside when the flip cover 2 is used as a capacitance switch or a communication antenna by means such as printing.

FIG. 3 is an enlarged cross-sectional view of the flip cover 2 of FIG. 2 along the line XX. The flip cover 2 is an insert molded product manufactured by double insert molding as will be described later.
In the flip cover 2, a first molded body 22 and a second molded body 23 are provided on both surfaces of the conductive film 21, and conductive pins 24 are provided so as to penetrate the conductive film 21 and the first molded body 22. It has the structure which was made.

The conductive film 21 is formed in a substantially rectangular shape, and has a laminated structure of a transparent support film 21a and a transparent metal film layer 21b that is an example of a conductive film layer provided on the surface thereof.
The support film 21a is made of a resin sheet such as a polypropylene resin, a polyethylene resin, a polyamide resin, a polyester resin, a polyacrylic resin, or a polyvinyl chloride resin. The thickness dimension of the support film 21a can be set to, for example, about 40 μm.

  In the first embodiment, the transparent metal film layer 21b formed on the surface of the support film 21a is made of various conductive metal materials such as aluminum, chromium, gold, silver, copper, and zinc in a mesh pattern (mesh pattern). A metal film formed in a shape). The thickness dimension of the metal film layer 21b can be set to about 5 μm, for example. The metal film layer 21b may be composed of a single-layer metal film or a plurality of metal films. The metal film layer 21b may be a metal film layer provided on the entire surface of the support film 21a instead of the mesh pattern metal film layer. In addition to the above metal materials, the metal film layer 21b includes, for example, transparent metal oxides such as indium oxide, tin oxide, indium tin oxide, and zinc oxide, conductive polymers such as polyaniline and polyacetylene, and conductive carbon. It can also be composed of Moreover, the metal film layer 21b can also be comprised with the conductive ink layer containing these conductors.

  Examples of the formation method in the case where the metal film layer 21b is composed of the metal material and the transparent metal oxide include methods such as a vacuum deposition method, a sputtering method, a photolithography method, and a plating method. Moreover, as a formation method in case the metal film layer 21b is comprised with the said conductive ink layer, methods, such as various printing methods and a roll coat method, are mentioned.

  The 1st molded object 22 and the 2nd molded object 23 are arrange | positioned so that the conductive film 21 may be coat | covered over substantially the whole region and the edge of the conductive film 21 may be coat | covered completely. Thereby, the conductive film 21 is not exposed at all to the outside, the metal film layer 21b provided on the surface of the conductive film 21 is prevented from being directly touched from the outside, and the metal film layer 21b is not damaged. (For example, it does not oxidize). In other words, even if the metal film layer 21b is formed in a mesh pattern of an ultra-thin band (for example, 50 μm or less), the function as a capacitance switch or a communication antenna is not deteriorated.

  Further, in the first embodiment, the first molded body 22 and the second molded body 23 are made of a general-purpose resin such as an acrylic resin, a polystyrene resin, a polyolefin resin, an ABS resin, an AS resin, or an AN resin. Has been. The first molded body 22 and the second molded body 23 may be general-purpose engineering resins such as polycarbonate resins and polyacetal resins, or super engineering resins such as polysulfone resins, polyimide resins, liquid crystal polyester resins, and polyallyl heat resistant resins. Can also be configured. Furthermore, the 1st molded object 22 and the 2nd molded object 23 can also be comprised with the composite resin which added reinforcing materials, such as glass fiber and an inorganic filler.

  The conductive pin 24 has a shaft portion 24a that is longer than the total thickness of the conductive film 21 and the first molded body 22, and a large cross-sectional area in a direction orthogonal to the axial direction (longitudinal direction) of the shaft portion 24a. And a head 24b. For example, the shaft portion 24a is configured with a shaft diameter of 0.3 to 1.5 mmΦ, and the head portion 24b is configured with an outer diameter of 0.5 to 2.5 mmΦ. The shaft diameter of the shaft portion 24a and the outer diameter of the head portion 24b are the number of conductive pins 24 required according to the application for which the flip cover 2 is used (for example, one for an antenna, 15 to 15 for a capacitance sensor). It may be set appropriately according to 20). As a material of the conductive pin 24, a conductive member such as a metal is used. In this conductive pin 24, the shaft portion 24a penetrates the conductive film 21 and the first molded body 22 and is held by both, and the lower portion of the head portion 24b adjacent to the shaft portion 24a is in contact with the metal film layer 21b. The upper part of the head 24 b adjacent to the lower part is provided so as to contact the second molded body 23. Here, the “lower portion” refers to a portion that contacts the metal film layer 21b of the head portion 24b while facing the metal film layer 21b, and the “upper portion” refers to a portion other than the lower portion of the head portion 24b, that is, a portion that does not contact the metal film 21b. . The tip portion of the shaft portion 24 a is electrically connected to the circuit sheet 10 via the conductive adhesive 11. As a result, the metal film layer 15 can be energized from the circuit sheet 10 via the conductive adhesive 11 and the conductive pins 24, and the metal film layer 21b can function as a capacitance switch or a communication antenna. . For example, NCF (Non Conductive Film) or ACF (Anisotropic Conductive Film) can be used as the conductive adhesive 11.

  In addition, it is preferable that the front-end | tip part of the axial part 24a protrudes from the surface of the 1st molded object 22, as shown in FIG. This facilitates electrical connection between the conductive pins 24 and the circuit sheet 10. On the other hand, as will be described later, when the first molded body 22 is molded, the protruding tip portion is inserted into the pin shaft portion storage recess provided at a predetermined position of the mold for molding the first molded body 22. The positioning accuracy of the conductive pin 24 can be improved by suppressing problems such as bending of the conductive pin 24 due to the pressure of the molten resin constituting the first molded body 22. Thereby, while being able to improve productivity, the electrical connection of the electroconductive pin 24 and the circuit sheet 10 can be stabilized.

  Further, the connecting portion between the tip portion of the shaft portion 24a of the conductive pin 24 and the circuit sheet 10 is concealed from the outside by another member, for example, the hinge portion 4 when the flip cover 2 is incorporated in the electronic device 1. It is preferable to do so.

  When the shape of the head 24b is a shape that prevents the flow of the molten resin constituting the second molded body 23 during the molding of the second molded body 23, problems such as generation of welds and loosening of the conductive pins 24 May happen. For this reason, the shape of the head 24b is preferably a shape that can reduce the pressure load due to the flow of the molten resin. Such shapes include, for example, a dish shape (see FIG. 4B), a round dish shape (see FIG. 4A), a round flat shape, a round head shape (see FIG. 3), or a binding shape as defined by JIS or ISO standards. , Truss shape, cheese shape, prismatic shape and the like.

  Moreover, it is preferable that there is no sharp part (step) in the upper part of the head 24 b of the conductive pin 24. Examples of the shape of such a conductive pin 24 include a plate shape, a round plate shape, a round flat shape, a round head shape, a bind shape, a truss shape, a cheese shape, a prism shape, etc., as defined by the JIS standard or ISO standard. Is mentioned. If comprised in this way, at the time of shaping | molding of the 2nd molded object 23, the flow of the molten resin which comprises the 2nd molded object 23 will not be inhibited, but the said molten resin becomes the 2nd molded object 23, the metal film layer 21b, and electroconductivity. The space between the head 24b of the pin 24 and the pin 24 is filled with no gap. Thereby, even if the impact and vibration from the outside are added, the movement of the conductive pin 24 can be eliminated more reliably, and the electrical connection between the conductive film 21 and the circuit sheet 10 can be stabilized. . The portion where there is no sharp step at the interface is in the vicinity of the connection portion between the second molded body 23, the metal film layer 21b, and the head 24b. For example, the head for screwing the conductive pin 24 is used. A screw recess (not shown, for example, a screwdriver insertion hole) provided in the portion 24b is removed.

  Moreover, it is preferable that the upper part of the head 24b of the conductive pin 24 is substantially hemispherical. It is preferable that the axial height is low as shown in FIG. 4A. Examples of the shape of the conductive pin 24 include shapes such as a round plate shape, a round flat shape, a round head shape, a bind shape, a truss shape, and a cheese shape defined by the JIS standard or the ISO standard. If comprised in this way, at the time of shaping | molding of the 2nd molded object 23, the molten resin which comprises the 2nd molded object 23 will be between the 2nd molded object 23, the metal film layer 21b, and the head 24b of the electroconductive pin 24. It will be filled without gaps. Further, since the pressure of the molten resin constituting the second molded body 23 applied to the conductive pin 24 is reduced, problems such as bending of the conductive pin 24 are suppressed, and the positioning accuracy of the conductive pin 24 is improved. be able to. As a result, productivity can be improved, and even when an external impact or vibration is applied, the movement of the conductive pin 24 can be eliminated more reliably, and the electrical connection between the conductive film 21 and the circuit sheet 10 can be eliminated. Connection can be stabilized.

  More preferably, the upper part of the head 24b of the conductive pin 24 is substantially flat as shown in FIG. 4B. As an example of the shape of such a conductive pin 24, there is a shape such as a dish shape defined by the ISO standard. If comprised in this way, at the time of shaping | molding of the 2nd molded object 23, the molten resin which comprises the 2nd molded object 23 does not enter between the metal film layer 21b and the head 24b of the electroconductive pin 24, and the said Since the molten resin has a structure that presses the head portion 24b toward the first molded body 22, the contact resistance between the metal film layer 21b and the conductive pin 24 is reduced. Thereby, electrical performance can be improved. Further, as will be described later, there is also an advantage that it is not necessary to form a pin head housing recess in accordance with the shape of the head 24b in the mold for molding the primary molded body 23.

  The head 24b of the conductive pin 24 is preferably used in the preferred shape from the beginning, but the present invention is not limited to this. For example, before the second molded body 23 is molded, it may be deformed by hitting the head 24b of the conductive pin 24 or the like to obtain the preferred shape.

The shape of the cross section orthogonal to the axial direction of the shaft portion 24a is not particularly limited, and may be circular or polygonal.
Further, in the portion of the shaft portion 24b that is held through the first molded body 22, the retaining groove 25 into which the first molded body is fitted as shown in FIG. 5A, or as shown in FIG. 5B. A stop projection 26 is preferably formed. The depth of the groove 25 or the height of the protrusion 26 is, for example, 0.3 mm. Since the conductive pin 24 is firmly fixed to the first molded body 22 by providing the groove portion 25 or the protrusion 26, the conductive pin 24 is more surely applied even when an external impact or vibration is applied. Can be eliminated, and the electrical connection between the conductive film 21 and the circuit sheet 10 can be stabilized. In addition, as shown to FIG. 5A and 5B, the groove part 25 and the processus | protrusion 26 are not limited to providing any one, Both may be provided.

Next, a method for manufacturing the flip cover 2 according to the first embodiment of the present invention by insert molding will be described. 6A to 6E are views showing a process of manufacturing the flip cover 2 shown in FIG.
The manufacturing method shown in FIGS. 6A to 6E uses a first mold 100 for primary molding that molds the primary molded body 50 and a second mold 200 for secondary molding that molds the secondary molded body 60. . The first mold 100 is composed of a fixed mold 110 and a movable mold 120, and the second mold 200 is composed of a fixed mold 110 and a movable mold 220, both of which can be opened and closed. The fixed mold 110 used for the first mold 100 and the second mold 200 is a common mold, and the movable molds 120 and 220 are combined with the common fixed mold 110 so that the first mold 100 and the second mold 110 are combined. A mold 200 is configured. In the first embodiment, the primary molded body 50 constitutes the first molded body 22, and the secondary molded body 60 constitutes the second molded body 23.

6A, first, the conductive pin 24 is passed through the conductive film 21 in the order of the metal film layer 21b and the support film 21a from the tip of the shaft portion 24a. At this time, a hole for penetrating conductive pins may be provided in advance in the conductive film 21.
Thereafter, the tip end portion of the shaft portion 24a is inserted into the pin shaft portion storing recess 112 provided at a predetermined position on the cavity 111 side of the fixed die 110 of the first die 100, and the conductive pin 24 is fixed. Position and fix to the mold 110.

Next, as shown in FIG. 6B, the fixed mold 110 and the movable mold 120 are closed, and the conductive film 21 is sucked from the outside through the suction holes 122 provided in the movable mold 120 to adsorb the conductive film 21. Hold. At this time, the head 24 b is fitted and aligned with the pin head storage recess 123 provided in the movable mold 120 according to the shape of the head 24 b of the conductive pin 24.
Next, as shown in FIG. 6C, the molten resin constituting the primary molded body 50 is injected from an injection gate 121 provided in the movable mold 120, and the molten resin is injected into the cavity 111 side of the fixed mold 110, the support film 21a, and the like. Fill between. The filled molten resin is solidified by cooling in the first mold 100 to become the primary molded body 50, and the primary molded body 50 and the conductive film 21 are integrated.

Thereafter, suction from the suction hole 122 is stopped, and the movable mold 120 is moved to open the mold. At this time, since the primary molded body 50 remains on the fixed mold 110 side and suction from the suction hole 122 is stopped, the conductive film 21 comes off the movable mold 120 and moves to the primary molded body 50 side.
Next, as shown in FIG. 6D, the movable mold 220 of the second mold 200 is positioned so as to face the fixed mold 110. The movable mold 220 of the second mold 200 is provided with a cavity 221 for molding the secondary molded body 60.

  Next, as shown in FIG. 6E, after closing the fixed mold 110 and the movable mold 220, the molten resin constituting the secondary molded body 60 is injected from the injection gate 222 provided in the movable mold 220, Molten resin is filled between the cavity 221 side of the movable mold 220 and the metal film layer 21b. The filled molten resin is solidified by cooling in the second mold 200 to become the secondary molded body 60, and is integrated with the primary molded body 50 and the conductive film 21. Thereafter, the second mold 200 is opened. Thus, the flip cover 2 in which both surfaces of the conductive film 21 are covered with the primary molded body 50 and the secondary molded body 60 is manufactured.

  As described above, according to the double molded insert molded product according to the second embodiment of the present invention, the shaft portion 24a of the conductive pin 24 penetrates the conductive film 21 and the first molded body 22 and is held by both. At the same time, since the upper part of the head 24b of the conductive pin 24 having a larger cross-sectional area perpendicular to the axial direction than the shaft part 24a is in contact with the second molded body 23, it is conductive even if external impact or vibration is applied. The sex pin 24 does not move in any direction. Moreover, since the lower part of the head 24b is in contact with the metal film layer 21b of the conductive film 21 in this state, the electrical connection between the conductive pin 24 and the conductive film 21 is stabilized. Therefore, the electrical connection between the conductive film 21 and the circuit sheet 10 is stabilized via the conductive pins 24 by connecting the tip portion of the shaft portion 24b penetrating the first molded body 22 to the circuit sheet 10. be able to.

  In addition, since the primary molded body 50 is formed in a state where the tip portion of the shaft portion 24a is inserted into the pin shaft portion storage recess 112 of the fixed mold 110, the molten resin wraps around the tip portion of the shaft portion 24a, and the tip portion There is no fear that the portion is covered with the primary molded body 50. That is, the tip end portion of the shaft portion 24a can be more reliably protruded and exposed from the primary molded body 50, and the electrical connection between the conductive pin 24 and the circuit sheet 10 can be stabilized.

  In addition, this invention is not limited to the said embodiment, It can implement with another various aspect.

<< Second Embodiment >>
7A to 7E are views showing a method for manufacturing a double-molded insert-molded product (here, flip cover 2) according to the second embodiment of the present invention.
The manufacturing method shown in FIGS. 7A to 7E uses a first mold 100A for primary molding that molds the primary molded body 60A and a second mold 200A for secondary molding that molds the secondary molded body 50A. . The first mold 100A is composed of a movable mold 110A and a fixed mold 120A, and the second mold 200A is composed of a movable mold 210A and a fixed mold 120A, both of which can be opened and closed. The fixed mold 120A used for the first mold 100A and the second mold 200A is a common mold, and each of the movable molds 110A and 210A is combined with the common fixed mold 120A, whereby the first mold 100A and the second mold 120A are combined. A mold 200A is configured. In the second embodiment, the primary molded body 60A constitutes the second molded body 23, and the secondary molded body 50A constitutes the first molded body 22.

In FIG. 7A, first, the conductive pin 24 is passed through the conductive film 21 in the order of the metal film layer 21b and the support film 21a from the tip of the shaft portion 24a.
Thereafter, the tip of the shaft portion 24a is inserted into the first pin shaft portion housing recess 111A provided at a predetermined position of the movable die 110A of the first mold 100A, and the conductive pin 24 is moved to the movable die 110A. Secure to.

Next, as shown in FIG. 7B, the movable mold 110A and the fixed mold 120A are closed, and the conductive film 21 is sucked from the outside through the suction holes 112A provided in the movable mold 110A to adsorb the conductive film 21. Hold.
Next, as shown in FIG. 7C, the molten resin constituting the primary molded body 60A is injected from an injection gate 121A provided in the fixed mold 120A, and the molten resin is injected into the cavity 122A side of the fixed mold 120A and the metal film layer 21b. Fill between. The filled molten resin is solidified by cooling in the first mold 100A to form a primary molded body 60A, and the primary molded body 60A and the conductive film 21 are integrated.

  Thereafter, suction from the suction hole 112A is stopped, and the movable mold 110A is moved to open the mold. At this time, the primary molded body 50A remains on the fixed mold 120A side, and the suction from the suction hole 112A is stopped, so that the conductive film 21 moves away from the movable mold 110A and moves to the primary molded body 60A side.

Next, as shown in FIG. 7D, the movable mold 210A of the second mold 200A is positioned so as to face the fixed mold 120A. The movable mold 210A of the second mold 200A is provided with a cavity 211A for molding the primary molded body 50A and a second pin shaft portion accommodating recess 212A.
Next, as shown in FIG. 7E, the fixed mold 120A and the movable mold 210A are closed so that the tip of the shaft portion 24a of the conductive pin 24 is inserted into the second pin shaft portion storage recess 212A, and then the movable pin 210A is movable. The molten resin constituting the secondary molded body 50A is injected from an injection gate 213A provided in the mold 210A, and the molten resin is filled between the cavity 211A side of the movable mold 210A and the support film 21a. The filled molten resin is solidified by cooling in the second mold 200 </ b> A to become a secondary molded body 50 </ b> A, and is integrated with the primary molded body 60 </ b> A and the conductive film 21. Thereafter, the second mold 200A is opened. Thereby, the flip cover 2 which coat | covered both surfaces of the electroconductive film 21 with the primary molded object 60A and the secondary molded object 50A is manufactured.

  According to the second embodiment of the present invention, it is not necessary to provide the pin head housing recess 123 according to the shape of the head 24b of the conductive pin 24 in the first mold 100A, so that compared to the first embodiment. Thus, the mold can be easily manufactured, and versatility is improved. Furthermore, the burden of aligning the pin head storage recess 123 and the head 24b can be eliminated.

<< Third Embodiment >>
8A to 8E are views showing a method for manufacturing a double-molded insert-molded product (here, flip cover 2) according to the third embodiment of the present invention.
The manufacturing method shown in FIGS. 8A to 8E uses a first mold 100B for primary molding that molds the primary molded body 50B and a second mold 200B for secondary molding that molds the secondary molded body 60B. . The first mold 100B is composed of movable molds 110B and 120B, and the second mold 200B is composed of movable molds 210B and 220B, both of which can be opened and closed. In the third embodiment, the primary molded body 50B constitutes the first molded body 22, and the secondary molded body 60B constitutes the second molded body 23.

  8A, first, the conductive film 21 is disposed in the first mold 100B so that the support film 21a of the conductive film 21 is exposed on the cavity 111B side of the movable mold 110B.

  Next, as shown in FIG. 8B, the movable molds 110B and 120B are closed, and the conductive film 21 is stored in the conductive film storage recess 121B provided in the movable mold 120B, and the movable mold 120B is provided. The conductive film 21 is sucked from the outside through the suction hole 122B, and the conductive film 21 is sucked and held. At this time, by storing the conductive film 21 in the conductive film storing recess 121 </ b> B, the conductive film 21 is sucked and held so as not to be displaced.

  In this state, the molten resin constituting the primary molded body 50B is injected from the injection gate 112B provided in the movable mold 110B, and the molten resin is filled between the cavity 111B side of the movable mold 110B and the support film 21a. . The filled molten resin is solidified by cooling in the first mold 100B to become the primary molded body 50B, and the primary molded body 50B and the conductive film 21 are integrated.

Thereafter, suction from the suction hole 122B is stopped, and the movable molds 110B and 120B are moved to open the mold. At this time, since the suction from the suction hole 122 is stopped, the conductive film 21 is detached from the movable molds 110B and 120B.
Next, as shown in FIG. 8C, the integrated primary molded body 50B and the conductive film 21 are disposed between the movable mold 210B and the movable mold 220B of the second mold 200B, and the conductive pins 24 are disposed. The metal film layer 21b, the support film 21a, and the primary molded body 50B are penetrated in this order from the tip of the shaft portion 24a. Thereby, the front-end | tip part of the axial part 24a of the electroconductive pin 24 is protruded so that it may be exposed outside from the primary molded object 50B. At this time, the conductive pin 24 may be formed in a screw shape, screwed into the conductive film 21 and the primary molded body 50B, and penetrate therethrough. Further, in order to provide a hole through which the shaft portion 24a of the conductive pin 24 penetrates the conductive film 21 and the primary molded body 50B in advance before the insertion of the conductive pin 24, the movable die 120B has the same shape as the shaft portion 24a. You may provide the protrusion part.
Thereafter, as shown in FIG. 8D, the tip portion of the shaft portion 24a is inserted into a pin shaft portion storage recess 212B provided at a predetermined position of the movable die 210B, so that the conductive pin 24 is movable. After fixing to 210B, molds 210B and 220B are closed. The movable mold 220B of the second mold 200B is provided with a cavity 221B for molding the secondary molded body 60B.

  Next, as shown in FIG. 8E, the molten resin constituting the secondary molded body 60B is injected from an injection gate 222B provided in the movable mold 220B, and the molten resin is injected into the cavity 221B side of the movable mold 220B and the metal film layer. It fills between 21b. The filled molten resin is solidified by cooling in the first mold 100 to become the secondary molded body 60B, and the secondary molded body 60B and the conductive film 21 are integrated. Thereafter, the second mold 200B is opened. Thereby, the flip cover 2 which coat | covered both surfaces of the electroconductive film 21 with the primary molded object 50B and the secondary molded object 60B is manufactured.

  According to the third embodiment of the present invention, since it is not necessary to provide the pin head housing recess 123 according to the shape of the head 24b of the conductive pin 24 in the first mold 100B, compared to the first embodiment. Thus, the mold can be easily manufactured, and versatility is improved. Furthermore, the burden of aligning the pin head storage recess 123 and the head 24b can be eliminated.

  The double-molded insert-molded product according to the present invention can stabilize the electrical connection between the conductive film having the first formed body and the second formed body formed on both surfaces and the external circuit. It is useful for double-molded insert molded products used as flip covers for telephones and personal computers.

In the electronic device using the double-molded insert-molded product according to the first embodiment of the present invention as a flip cover, FIG. 1B is a perspective view showing an external configuration of the electronic device of FIG. 1A in a state where a flip cover is closed. FIG. It is a perspective view which shows the external appearance structure of the flip cover used for the electronic device of FIG. 1A. It is XX sectional drawing of FIG. It is a schematic cross section which shows the example of preferable arrangement | positioning of an electroconductive pin. It is a schematic cross section which shows the preferable example of arrangement | positioning of the conductive pin different from FIG. 4A. It is a schematic cross section which shows the preferable example of a shape of the axial part of an electroconductive pin. It is a schematic cross section which shows the preferable example of a shape of the axial part of the electroconductive pin different from FIG. 5A. It is a schematic diagram which shows the process of manufacturing the double-molding insert molded article concerning 1st Embodiment of this invention. It is a figure which shows the process of following FIG. 6A. It is a figure which shows the process of following FIG. 6B. It is a figure which shows the process of following FIG. 6C. It is a figure which shows the process of following FIG. 6D. It is a schematic diagram which shows the process of manufacturing the double-molding insert molded product concerning 2nd Embodiment of this invention. It is a figure which shows the process of following FIG. 7A. It is a figure which shows the process of following FIG. 7B. It is a figure which shows the process of following FIG. 7C. It is a figure which shows the process of following FIG. 7D. It is a schematic diagram which shows the process of manufacturing the double-molding insert molded product concerning 3rd Embodiment of this invention. It is a figure which shows the process of following FIG. 8A. It is a figure which shows the process of following FIG. 8B. It is a figure which shows the process of following FIG. 8C. It is a figure which shows the process of following FIG. 8D.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic device 2 Flip cover 3 Main body 4 Hinge part 5 Display 6 Operation button 10 Circuit sheet 11 Conductive adhesive 21 Conductive film 21a Support film 21b Metal film layer 22 1st molded object 23 2nd molded object 24 Conductive pin 24a Shaft portion 24b Head 50, 60A, 50B Primary molded body 60, 50A, 60B Secondary molded body 100, 100A, 100B First mold 200, 200A, 200B Second mold

Claims (9)

A double-molded insert-molded product in which a first molded body and a second molded body are formed on both surfaces of a conductive film provided with a conductive film layer on the surface of a support film,
The shaft portion of the conductive pin having a larger cross-sectional area perpendicular to the axial direction than the shaft portion is held by both the shaft portion through the conductive film and the first molded body and exposed to the outside. A double-molded insert-molded article provided such that a lower portion of the head adjacent to the shaft portion is in contact with the conductive film layer, and an upper portion of the head adjacent to the lower portion is in contact with the second molded body.   The double-molded insert-molded product according to claim 1, wherein a tip portion of the shaft portion protrudes from the first molded body and is exposed to the outside.   The double-molded insert-molded product according to claim 1 or 2, wherein there is no acute angle portion at the upper part of the head.   The double-molded insert-molded article according to claim 1 or 2, wherein the upper part of the head is substantially hemispherical.   The double-molded insert-molded article according to claim 1 or 2, wherein the upper portion of the head is substantially flat.   The shaft portion of the conductive pin includes a retaining groove or a protrusion that fits the first molded body in a portion that is held through the first molded body. The double molded insert molded article according to any one of the above. A conductive film that is configured to be openable and closable, and that has a conductive film layer on the surface of a support film, using a primary mold for forming a primary molded body and a secondary mold for molding a secondary molded body Is a method for producing a double-molded insert-molded product in which the conductive film is coated with a primary molded body and a secondary molded body by injecting a molten resin in a state where is disposed in a cavity,
After passing through the conductive film so that the head of the conductive pin having a larger cross-sectional area perpendicular to the axial direction than the shaft is in contact with the conductive film layer, the mold for primary molding Insert the tip of the shaft portion into the pin shaft portion storage recess provided at a predetermined position on the cavity side,
A molten resin constituting the primary molded body by closing the primary molding die is injected between the cavity side of the primary molding die and the support film, and the primary molded body and the conductive material are injected. After the functional film is integrated, the primary molding die is opened,
The integrated primary molded body and the conductive film are arranged in the secondary molding die so that the conductive film is exposed on the cavity side of the secondary molding die,
Closing the mold for secondary molding, injecting a molten resin constituting the secondary molded body, and covering the conductive film with the primary molded body and the secondary molded body,
Manufacturing method of double molded insert molded product. A conductive film that is configured to be openable and closable, and that has a conductive film layer on the surface of a support film, using a primary mold for forming a primary molded body and a secondary mold for molding a secondary molded body Is a method for producing a double-molded insert-molded product in which the conductive film is coated with a primary molded body and a secondary molded body by injecting a molten resin in a state where is disposed in a cavity,
After passing through the conductive film so that the head of the conductive pin having a larger cross-sectional area perpendicular to the axial direction than the shaft is in contact with the conductive film layer, the mold for primary molding Insert the tip end of the shaft into the first pin shaft housing recess provided at a predetermined position on the cavity side,
A molten resin constituting the primary molded body by closing the primary molding mold is injected between the cavity side of the primary molding mold and the conductive film layer, and the primary molded body and the After integrating the conductive film, open the mold for primary molding,
The integrated primary molded body and the conductive film are arranged in the secondary molding die so that the conductive film is exposed on the cavity side of the secondary molding die, and Inserting the tip of the shaft into the second pin shaft housing recess provided at a predetermined position on the cavity side of the secondary molding die;
The conductive film is injected by injecting a molten resin constituting the secondary molded body by closing the secondary molding die between the cavity side of the secondary molding die and the support film. Covering with the primary molded body and the secondary molded body,
Manufacturing method of double molded insert molded product. A conductive film that is configured to be openable and closable, and that has a conductive film layer on the surface of a support film, using a primary mold for forming a primary molded body and a secondary mold for molding a secondary molded body Is a method for producing a double-molded insert-molded product in which the conductive film is coated with a primary molded body and a secondary molded body by injecting a molten resin in a state where is disposed in a cavity,
The conductive film is arranged so that the support film of the conductive film is exposed on the cavity side of the primary molding die,
A molten resin constituting the primary molded body by closing the primary molding die is injected between the cavity side of the primary molding die and the support film, and the primary molded body and the conductive material are injected. After the functional film is integrated, the primary molding die is opened,
The integrated conductive film and the primary molded body so that the head portion of the conductive pin having a larger cross-sectional area perpendicular to the axial direction than the shaft portion is in contact with the conductive film layer. After penetrating, insert the tip end portion of the shaft portion into the pin shaft portion storage recess provided at a predetermined position on the cavity side of the secondary molding die,
The molten resin constituting the secondary molded body by closing the secondary molding die is injected between the cavity side of the secondary molding die and the conductive film layer, and the conductive Covering the film with the primary molded body and the secondary molded body,
Manufacturing method of double molded insert molded product.

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