JP4835441B2 - Electronic keyboard instrument exterior structure - Google Patents

Description

  The present invention relates to an exterior structure of an electronic keyboard instrument, and in particular, a lower case having a bottom plate on which a keyboard portion is mounted, an upper plate covering the upper side of the lower case, and an operation portion provided on the upper surface of the upper plate. The present invention relates to an exterior structure of an electronic keyboard instrument which has a case and is formed by overlapping the upper case on the upper side of the lower case.

  As an example of the electronic keyboard instrument described above, for example, one described in Patent Document 1 has been proposed. The casing of this electronic keyboard instrument is composed of two parts, a casing body and a casing rear. The housing body has a bottom plate (bottom plate) on which the keyboard is mounted, and openings are provided on the upper side and the back (back) side. The housing rear portion is provided with a roof plate portion (upper plate) that covers the upper opening of the housing body portion and a back plate portion that covers the rear opening of the housing body portion. The main circuit board is attached to the back plate at the rear of the housing with screws or the like in a standing state.

  An operation unit such as an operation button is provided on the upper surface of the roof plate at the rear of the housing. The wiring portion drawn out from the operation portion is routed on the lower surface of the roof plate portion and connected to the main circuit board. This wiring part may be wired so as to straddle the vicinity of the upper part of the heat sink provided on the main circuit board on the lower surface of the roof plate part. For this reason, the heat | fever from a heat sink radiated toward the wiring part, and the problem that the malfunction that the coating | cover of a wiring part melt | dissolves with the heat from a heat radiating plate has arisen.

JP 2004-171038 A Japanese Patent Laid-Open No. 10-12615

  Accordingly, the present invention focuses on the above-described problems, and an object of the present invention is to provide an exterior structure of an electronic keyboard instrument that prevents a problem from occurring in a wiring board due to the influence of heat from a heat sink.

  The exterior structure of the electronic keyboard musical instrument according to claim 1, which has been made to solve the above-described problem, is drawn out from the operation unit, the first board with the heat sink provided along with the keyboard part provided between the upper case and the lower case. A wiring portion that is routed at least on the lower surface of the upper plate so as to straddle the upper vicinity of the heat sink, and a second substrate attached to the upper plate, and the wiring portion is between the upper plate and the second substrate. The second substrate is provided in a portion of the wiring portion that is routed near the upper portion of the heat dissipation plate.

  The exterior structure of the electronic keyboard instrument according to claim 2 is the exterior structure of the electronic keyboard instrument according to claim 1, wherein the operation unit has a substrate for an operation unit provided on the lower surface of the upper plate in the spreading direction of the upper plate, and the second substrate is After the perforation is formed in the operation portion substrate and formed integrally, it is separated from the perforation.

  As described above, according to the first aspect of the present invention, the second substrate attached to the upper plate with the wiring portion sandwiched between the upper plate and the upper portion of the wiring portion is routed near the upper portion of the heat sink. Since it is provided in the portion, the heat from the heat sink can be blocked by the second substrate, so that it is possible to prevent the wiring portion from being defective due to the heat from the heat sink.

  According to the second aspect of the present invention, since the second substrate is formed integrally with the operation unit substrate by placing a perforation, the second substrate is provided separately from the perforation. If the substrate is integrated until it is attached to the case, the second substrate can be prevented from being lost.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1A is a perspective view of an upper case 20 constituting the exterior structure of the electronic keyboard instrument of the present invention as viewed from below, and FIG. 1B is a lower view of the exterior structure of the electronic keyboard instrument of the present invention. It is the oblique view which looked at case 10 from the upper side. FIG. 2 is a partially enlarged oblique view of the lower case 10 shown in FIG. FIG. 3 is a partially enlarged oblique view with the sound system circuit analog board 51 disposed in the lower case 10 shown in FIG. 1 removed. 4 is a cross-sectional view of the electronic keyboard instrument incorporating the upper case 20 and the lower case 10 taken along the line IV-IV shown in FIG. In the drawing, the arrow Y1 is the player side in the front-rear direction, the arrow Y2 is the side away from the player in the front-rear direction, the arrow Y3 is the player left side in the key arrangement direction, and the arrow Y4 is the key arrangement The arrow Y5 indicates the up and down direction.

  As shown in FIG. 1, the exterior structure of the electronic keyboard instrument includes a lower case 10 having a bottom plate 11 on which a keyboard portion 30 (see FIG. 4) is mounted on a player side Y1, and an upper plate 21 covering the upper side of the lower case 10. And an upper case 20 having an operation portion 22 provided on the upper surface of the upper plate 21. As shown in FIG. 4, the exterior structure of the electronic keyboard instrument is formed by a tying structure in which the upper case 20 is stacked from the upper side of the lower case 10.

  In the upper case 20 and the lower case 10 described above, as shown in FIG. 1, the analog board 51 (first board with a heat sink) and a digital board 52 on which a music signal forming circuit including a sound source is mounted are accommodated. Has been. The analog board 51 and the digital board 52 are arranged upright so as to be parallel to the vertical direction Y5. Further, the analog board 51 and the digital board 52 are arranged so that the extending direction Y6 of the edge E1 in the vertical direction Y5 is parallel to the key arrangement directions Y3 and Y4.

  First, the configuration of the lower case 10 will be described. As shown in FIG. 1B, the lower case 10 includes a rear rising portion 12, a front rising portion 13, and a left and right rising portion 14. The rear rising portion 12 is provided to rise from the edge portion of the side Y2 away from the performer of the bottom plate 11. The front rising portion 13 is provided to rise from the edge of the bottom plate 11 on the player side Y1. The left and right rising portions 14 are provided to rise from the edges of the bottom plate 11 in the key arrangement direction Y3 and Y4.

  The bottom plate 11 of the lower case 10 is provided with a pair of substrate first holding portions 151R and 151L, a pair of substrate first holding portions 152R and 152L, and a lower boss 16. The first substrate holding portions 151R and 151L are provided to sandwich the lower edge E1 of the analog substrate 51, and are provided apart from each other and aligned in the key arrangement directions Y3 and Y4. The first substrate holding portions 152R and 152L are provided to sandwich the lower edge E1 of the digital substrate 52, and are provided apart from each other and aligned in the key arrangement directions Y3 and Y4.

  As shown in FIG. 3, each of the substrate first holding portions 151 </ b> R includes a first lower protrusion 15 </ b> A (lower protrusion), two second lower protrusions 15 </ b> B (lower protrusion), and positioning. The wall 15C and the connecting wall 15D (connecting portion) are integrally formed. The first substrate holding portions 151L, 152R, and 152L have the same configuration as the first substrate holding portion 151R, and a detailed description thereof will be omitted.

  The first and second lower protrusions 15A and 15B are respectively located on the bottom plate 11 on the side Y2 that is farther from the player than the keyboard portion 30, in other words, on the bottom plate 11 between the keyboard portion 30 and the rear rising portion 12. Projecting toward the case 20. The first and second lower projections 15A and 15B are provided with a first lower slit SL11 and a second lower slit SL12 that are open on the upper case 20 side and penetrate in the key arranging directions Y3 and Y4, respectively. Yes. The slit widths of the first and second lower slits SL <b> 11 and SL <b> 12 are substantially the same as the thicknesses of the analog substrate 51 and the digital substrate 52. Further, the first lower protrusion 15A is provided such that the height from the bottom plate 11 is higher than that of the second lower protrusion 15B. Accordingly, the opening of the first lower slit SL11 is provided on the upper case 20 side than the opening of the second lower slit SL12.

  Of the pair of board first holding parts 151R and 151L, 152R and 152L, the board first holding parts 151R and 152R arranged on the player's right side Y4 are positioned from the player's right side Y4 to the positioning wall 15C and the first lower side projection. The portions 15A and the second lower protrusion 15B are arranged in the key arrangement direction Y3, Y4 (that is, the extending direction Y6 of the upper and lower edges E1) in this order. Of the pair of substrate first holders 151R and 151L, 152R and 152L, the substrate first holders 151L and 152L arranged on the player's left side Y3 are positioned from the player's left side Y3 to the positioning wall 15C and the first lower side. The side protrusions 15A and the second lower protrusions 15B are arranged in the order of the key arrangement directions Y3 and Y4.

  The first lower slit SL11 provided in the first lower protrusion 15A and the two second lower slits SL12 provided in the two lower protrusions 15B are arranged in the key arrangement direction Y3, Y4. Are arranged side by side. Further, a pair of connecting walls 15D are provided so as to connect the positioning wall 15C, the first lower protrusion 15A, and the second lower protrusion 15B. Of the two second lower protrusions 15B, the protrusion provided on the first lower protrusion 15A side extends from the connecting wall 15D in the front-rear direction and constitutes a reinforcing rib that reinforces the bottom plate 11. To do.

  Further, the positioning wall 15C is provided so as to sandwich the key arrangement directions Y3 and Y4 of the analog board 51 and the digital board 52, that is, the extending direction Y6. Then, the positioning wall 15C contacts the edge portion E2 in the key arrangement direction Y3, Y4 of the analog board 51 and the digital board 52, and positions the key arrangement directions Y3, Y4 of the analog board 51 and the digital board 52.

  Each of the first and second lower protrusions 15A and 15B is provided with a pair of tapers T provided facing each other in the front-rear direction. The pair of tapers T is provided above the first and second lower slits SL11 and SL12. A pair of taper T is provided so that it may mutually approach as it goes below. The distance between the pair of tapers T is set to be larger than the thickness of the analog substrate 51 or the digital substrate 52.

  The lower boss 16 projects from the bottom plate 11 toward the upper case 20. The lower boss 16 is formed with a screw hole h1 penetrating in the vertical direction Y5. Further, six lower bosses 16 are arranged in the key arrangement direction Y3, Y4.

  Next, the upper case 20 will be described. As shown in FIG. 1A, the upper case 20 is provided with a rear falling portion 23, a front falling portion 24, and left and right falling portions 25. The upper plate 21 is provided with a keyboard part opening 21A for exposing the keyboard part 30 and a speaker opening 21B for exposing a speaker (not shown). The rear falling part 23 is provided so as to fall from the edge of the side Y2 away from the performer of the upper plate 21. The front falling portion 24 is provided so as to fall from the edge of the player side Y1 of the upper plate 21. The left and right falling portions 25 are provided so as to rise from the edge portions of the upper plate 21 in the key arrangement direction Y3, Y4.

  The lower case 10 is also provided with substrate second holding portions 261 and 262 and an upper boss 26. The board second holding part 261 is provided to sandwich the upper edge E1 of the analog board 51, and is provided so as to be separated from each other and aligned in the key arrangement direction Y3, Y4. The substrate second holding portion 262 is provided to sandwich the lower edge portion of the digital substrate 52, and is provided so as to be separated from each other and aligned in the key arrangement directions Y3 and Y4.

  As shown in FIGS. 1 and 4, each of the substrate second holding portions 261 has an upper protrusion 26A and an upper slit 26B provided in the upper protrusion 26A. The substrate second holding unit 262 has the same configuration as the substrate second holding unit 261, and thus detailed description thereof is omitted. Each of the upper protrusions 26A faces the lower case 10 on the upper plate 21 on the side Y2 that is farther from the performer than the keyboard portion 30, in other words, on the upper plate 21 between the keyboard portion 30 and the rear falling portion 23. It is protruding. Each of the upper slits 26B is provided so that the lower case 10 side of the upper protrusion 26A is an opening and penetrates in the key arranging directions Y3 and Y4. The width of the upper slit 26 </ b> B is set to be approximately equal to the thickness of the analog substrate 51 and the digital substrate 52.

  The upper boss 26 projects from the upper plate 21 toward the lower case 10. The upper boss 26 is provided at a position overlapping the lower boss 16 when the upper case 20 and the lower case 10 are overlapped. The upper boss 26 is provided with a screw hole h2.

  Next, the analog board 51 and the digital board 52 accommodated in the upper case 20 and the lower case 10 having the above-described configuration will be described. Each of the analog substrate 51 and the digital substrate 52 is provided in a flat plate shape having a rectangular shape when viewed from the front. As shown in FIGS. 2 and 4, a heat radiating plate 55 is attached to the analog substrate 51.

  The heat radiating plate 55 is made of a metal plate, and as shown in FIG. 2, the concavo-convex portions are alternately arranged in the key arranging directions Y3 and Y4. The uneven portion is provided by bending a metal plate. The heat radiating plate 55 is disposed on the side Y <b> 2 away from the performer of the analog substrate 51. The heat radiating plate 55 is overlapped and fixed to the analog substrate 51 so that a through hole 60 penetrating in the vertical direction Y5 is provided between the analog substrate 51 and the uneven portion. Thereby, the heat sink 55 is arrange | positioned so that the board surface B may face the side Y2 away from the player.

  Further, the bottom plate 11 and the rear rising portion 12 near the analog substrate 51 are provided with a plurality of heat radiation holes 17 for radiating heat generated from the analog substrate 51 to the outside of the upper case 20 and the lower case 10. That is, the heat radiating hole 17 is provided in the rear rising portion 12 facing the board surface B of the heat radiating plate 55.

  The analog substrate 51 and the substrate first holding portions 151R, 151L, 152R and 152L of the digital substrate 52, and the portions sandwiched between the substrate second holding portions 261 and 262 are tapes (elastic means) 70 each made of an elastic member. Is pasted.

  Next, the operation portion substrate 53 accommodated in the upper case 20 and the lower case 10 having the above-described configuration will be described. The operation unit 22 includes an operation unit substrate 53. The operation portion substrate 53 is attached to the lower surface of the upper plate 21 with screws parallel to the upper plate 21. As shown in FIG. 1A, the wiring portion L drawn from the operation portion 22 is routed on the lower surface of the upper plate 21 and connected to the analog substrate 51 and the digital substrate 52, respectively. That is, as shown in FIG. 4, the wiring portion L is routed so as to straddle the upper vicinity of the heat radiating plate 55. A portion of the wiring portion L straddling the vicinity of the upper portion of the heat dissipation plate 55 is affected by heat from the analog substrate 51 flowing from the bottom to the top in the through hole 60, and a problem occurs.

  Therefore, a heat-resistant substrate 54 (second substrate) is provided in the portion of the wiring portion L that is routed near the upper portion of the heat dissipation plate 55 so that the wiring portion L is not affected by heat. The heat-resistant substrate 54 is screwed to the upper plate 21 with the wiring portion L sandwiched between it and the upper plate 21. As a result, the wiring portion L is attached to the upper plate 21. The heat-resistant substrate 54 is formed of a surplus substrate that is formed integrally with the operation unit substrate 53 by perforating and then separated by the perforation.

  Next, the keyboard part 30 accommodated in the upper case 20 and the lower case 10 having the above-described configuration will be described. As shown in FIG. 4, the keyboard unit 30 includes a black key 31 and a white key 32, and a switch board 33. A plurality of black keys 31 and white keys 32 are arranged in the key arrangement directions Y3 and Y4. The switch board 33 is mounted with a switch that is turned on when the black key 31 and the white key 32 are pressed.

  Next, a procedure for assembling the electronic keyboard instrument having the above-described configuration will be described below. First, in the state where the wiring portion L previously drawn out from the operation portion 22 is routed along the lower surface of the upper plate 21, an integrated substrate in which the heat-resistant substrate 54 and the operation portion substrate 53 are integrally formed is the upper plate 21. Secure to the underside of the screw with screws. At this time, the integrated substrate is fixed with screws so that the wiring portion L is sandwiched between the upper plate 21 and the upper plate 21. Thereafter, the integrated substrate is cut along the perforation to separate the heat-resistant substrate 54 and the operation portion substrate 53.

  Further, the heat radiating plate 55 is overlapped and fixed to the analog substrate 51 so that a through hole 60 penetrating in the vertical direction Y5 is provided between the analog substrate 51 and the uneven portion of the heat radiating plate 55. In addition, the tape 70 is attached to the portions of the analog substrate 51 and the digital substrate 52 that are sandwiched between the substrate first holding portions 151R, 151L, 152R, and 152L and the substrate second holding portions 261 and 262. Thereafter, the upper edge E1 of the analog substrate 51 and the digital substrate 52 is inserted into the upper slit 26B provided in the upper protrusion 26A and is sandwiched by the upper protrusion 26A. At this time, the upper edge E1 of the analog board 51 is held by the upper protrusion 26A so that the heat radiating plate 55 attached to the analog board 51 is on the side Y2 away from the performer.

  Next, the lower edge E1 of the analog substrate 51 and the digital substrate 52 is inserted into the first lower slit SL11 and the second lower slit SL12, and the analog substrate 51 and the digital substrate 52 are inserted between the positioning walls 15C. As described above, the upper case 20 is overlapped on the upper side of the lower case 10. The analog board 51 and the digital board 52 are first inserted into the first lower slit SL11 and are held between the first lower protrusions 15A (temporary locking). At this time, when the analog substrate 51 and the digital substrate 52 are inserted along the taper T provided on the first lower protrusion 15A, the analog substrate 51 and the digital substrate 52 are guided to the first lower slit SL11.

  Thereafter, the analog substrate 51 and the digital substrate 52 are inserted into the second lower slit SL12 and are held between the second lower protrusions 15B. At this time, when the analog substrate 51 and the digital substrate 52 are inserted along the taper T provided on the second lower protrusion 15B, the analog substrate 51 and the digital substrate 52 are guided to the second lower slit SL21.

  Next, screws (fixing means) are inserted into the screw hole h1 of the lower boss 16 and the screw hole h2 of the upper boss 26 from the lower side of the lower case 10, and the upper case 20 and the lower case 10 are fixed with screws. Complete.

  According to the above-described exterior structure of the electronic keyboard instrument, the edge portions E1 of the analog board 51 and the digital board 52 are inserted into the first and second lower slits SL11 and SL12 and the upper slit 26B, respectively. The upper case 20 and the lower case 10 are fixed with screws in a state where the upper case 20 is stacked on the upper side of the lower case 10 so as to be held between the lower protrusions 15A and 15B and the upper protrusion 26A. Yes. As a result, the analog board 51 and the digital board 52 can be sandwiched and held from the up and down direction Y5 by the upper case 20 and the lower case 10, so that the analog board 51 and the digital board 52 are attached to the upper case 20 and the lower case 10. No need for screwing. In addition, the analog substrate 51 and the digital substrate 52 can be attached to the upper case 20 and the lower case 10 when the upper case 20 is attached to the lower case 10. For this reason, assembly work can be performed easily. In addition, the analog substrate 51 and the digital substrate 52 are reinforced in the vertical direction Y5 of the upper case 20 and the lower case 10, and deformation due to an external force of the upper case 20 and the lower case 10 can be prevented. In addition, since the upper and lower edges E1 of the analog board 51 and the digital board 52 are held between the first and second lower protrusions 15A and 15B and the upper protrusion 26A, the analog board 51 and the digital board 52 are arranged in the front-rear direction. And is firmly fixed in the upper case 20 and the lower case 10.

  Further, according to the exterior structure of the electronic keyboard instrument described above, the heat radiating plate 55 is arranged on the side Y2 away from the performer of the analog board 51, and the board surface B of the heat radiating plate 55 is directed to the side Y2 away from the performer. Therefore, it is possible to prevent heat from being accumulated in the keyboard unit 30. For example, when the heat radiating plate 55 is disposed between the analog substrate 51 and the keyboard part 30, heat is trapped in the frame (resin) of the keyboard part 30, and an imbalance of heat distribution occurs in the keyboard (resin) frame. As a result, the frame of the keyboard unit 30 is twisted, and the uniformity of the touch response for each key is deteriorated and the performance of the keyboard (not a flat keyboard) is lowered. It is possible to prevent heat from being accumulated, and it is possible to prevent deterioration of touch response uniformity for each key and deterioration of keyboard performance due to heat from the analog substrate 51.

  Further, according to the above-described exterior structure of the electronic keyboard instrument, the heat radiating hole 17 is provided in the rear rising portion 12 facing the heat radiating plate 55. Thereby, the heat dissipation effect can be increased.

  Further, according to the above-described exterior structure of the electronic keyboard instrument, the heat radiating plate 55 is overlapped with the analog substrate 51 so that the through hole 60 penetrating in the vertical direction Y5 is provided between the analog substrate 51 and the concavo-convex portion. Since it is fixed, the heat radiating plate 55 serves as a reinforcement for the analog substrate 51. For this reason, the analog substrate 51 can further reinforce the upper case 20 and the lower case 10, and can prevent the upper case 20 and the lower case 10 from being deformed by an external force. And since the passage of air is made in the up-down direction Y5 by the through-hole 60, the heat dissipation effect can be further increased.

  Further, according to the exterior structure of the electronic keyboard instrument described above, the analog substrate 51 and the digital substrate 52 are inserted by providing the opening of the first lower slit SL11 on the upper case 20 side than the opening of the second lower slit SL12. Sometimes it is provided to be inserted first into the first lower slit SL11 and then into the second lower slit SL12. As described above, the analog substrate 51 and the digital substrate 52 can be smoothly mounted on the lower case 10 by the first lower slit SL11 and the second lower slit SL12 that can be inserted with a time difference. Further, the first lower slit SL11 and the second lower slit SL12 cooperate to perform the alignment operation in the front-rear direction (plate thickness direction) of the analog substrate 51 and the digital substrate 52.

  In addition, according to the exterior structure of the electronic keyboard instrument described above, the first lower slit SL11 and the second lower slit SL12 are provided side by side in the key arrangement direction Y3, Y4, so that the analog board 51 is smoother. The digital board 52 can be attached to the lower case 10. Further, according to the exterior structure of the electronic keyboard instrument described above, since the second lower protrusion 15B and the second lower slit SL12 are provided, that is, a plurality of the lower slits SL12, the analog board 51 and the digital board can be made even more smoothly. 52 can be attached to the lower case 10. Also, since the two second lower slits SL12 are provided side by side in the extending direction Y6 (key arrangement direction Y3, Y4), the analog board 51 and the digital board 52 can be attached to the lower case 10 more smoothly. can do.

  Further, according to the exterior structure of the electronic keyboard instrument described above, the analog substrate 51 and the digital substrate 52 are attached to the analog substrate 51 and the digital substrate 52, so that the analog substrate 51 and the digital substrate 52 have the first lower slit SL11 and the second lower slit SL12. There is no shakiness inside and it can be firmly fixed. For this reason, it is possible to prevent the mechanical noise from being generated in the musical sound and to prevent the generation of a rattling sound.

  Further, according to the above-described exterior structure of the electronic keyboard instrument, the positioning of the analog board 51 and the digital board 52 in the key arrangement directions Y3 and Y4 can be performed by the positioning wall 15C. In addition, the positioning wall 15C and the first and second lower protrusions 15A and 15B are reinforced by being connected to the first lower protrusion 15A and the second lower protrusion 15B by the connecting wall 15D. be able to.

  Further, according to the exterior structure of the electronic keyboard instrument described above, the heat-resistant substrate 54 attached to the upper plate 21 with the wiring portion L sandwiched between the upper plate 21 and the heat sink 55 of the wiring portion L is located near the upper portion. Since it is provided in the routed portion, heat from the heat sink 55 can be cut off by the heat-resistant substrate 54, so that a problem occurs in the wiring portion L due to the heat from the heat sink 55. Can be prevented.

  Further, according to the exterior structure of the electronic keyboard instrument described above, since the heat-resistant substrate 54 is formed integrally with the operation portion substrate 53 with the perforations, the operation substrate 53 is separated and provided at the perforations. If the partial substrate 53 and the heat-resistant substrate 54 are integrated until they are attached to the upper case 20 and the lower case 10, it is possible to prevent the heat-resistant substrate 54 from being lost.

  In addition, according to embodiment mentioned above, although the back case 12 was provided in the lower case 10, this invention is not limited to this. For example, an opening may be provided on the side Y2 away from the performer of the lower case 10 and a back plate portion may be provided on the upper case 20 to cover the opening of the side Y2 away from the performer of the lower case 10. Good. That is, if the lower case 10 has at least the bottom plate 11, the upper case 20 has at least the upper plate 21, and the upper case 20 is attached in an overlapping manner from above the lower case 10, the shape of the case Is not limited to the embodiment described above.

  Moreover, according to embodiment mentioned above, although the upper case 20 was piled up and attached from the upper side of the lower case 10, this invention is not limited to this. For example, the upper case 20 may be attached to the lower case 10 by sliding toward the performer.

  Further, according to the above-described embodiment, the analog substrate 51 and the digital substrate 52 are arranged in parallel in the vertical direction Y5, but the present invention is not limited to this. The analog substrate 51 and the digital substrate 52 may be disposed horizontally with the upper plate 21 and the bottom plate 11.

  Further, according to the above-described embodiment, the heat-resistant substrate 54 is formed integrally with the operation portion substrate 53 by placing the perforation, and then separated by the perforation. It is not limited. The heat-resistant substrate 54 and the operation unit substrate 53 may be provided separately.

  In addition, according to the above-described embodiment, the bottom plate 11 is provided with the first lower protrusion 15A and the second lower protrusion 15B, and the first lower protrusion 15A and the second lower protrusion 15B have the first. Although the lower slit SL11 and the second lower slit SL12 are provided, the present invention is not limited to this. If the bottom plate 11 has a thickness, the first and second lower slits SL11 and SL12 may be provided directly on the bottom plate 11 without providing the first and second lower protrusions 15A and 15B.

  Further, according to the embodiment described above, the upper protrusion 26A is provided on the upper plate 21, and the upper slit 26B is provided on the upper protrusion 26A. However, the present invention is not limited to this. If the upper plate 21 is thick, it is also conceivable to provide the upper slit 26B directly on the upper plate 21 without providing the upper protrusion 26A.

  Further, according to the above-described embodiment, the radiator plate 55 is attached to the side Y2 away from the performer of the analog board 51 so that the board surface B faces the side Y2 away from the performer. It is not limited to. The shape and arrangement position of the heat sink 55 are not limited to the above-described embodiment.

  Further, according to the above-described embodiment, each of the first substrate holding portions 151R, 151L, 152R, and 152L is provided with the two second lower protrusions 15B and the two second lower slits SL12. However, the present invention is not limited to this. For example, only one second lower protrusion 15B and second lower slit SL12 may be provided, or three or more may be provided.

  Further, according to the above-described embodiment, the substrate first holding portions 151R, 151L, 152R, and 152L are provided with the second lower protrusion 15B and the second lower slit SL12, respectively. It is not limited to this. For example, it is also conceivable that the second lower protrusion 15B and the second lower slit SL12 are not provided in the substrate first holding portions 151R, 151L, 152R, and 152L, similarly to the substrate first holding portion.

  Further, according to the above-described embodiment, the positioning wall 15C, the first lower protrusion 15A, and the second lower protrusion 15B are connected by the connection wall 15D, but the present invention is not limited to this. Absent. If each of the positioning wall 15C, the first lower protrusion 15A, and the second lower protrusion 15B has strength, it is not necessary to be connected by the connection wall 15D.

  Further, according to the above-described embodiment, the first substrate holding portions 151R, 151L, 152R, and 152L are each provided with the positioning wall 15C, but the present invention is not limited to this. For example, it is also conceivable that the positioning walls 15C are not provided in the substrate first holding portions 151R, 151L, 152R, and 152L, similarly to the substrate first holding portion.

  Further, according to the embodiment described above, the tape 70 as the elastic means is attached to the analog substrate 51 and the digital substrate 52, but the present invention is not limited to this. For example, it is also conceivable to attach the tape 70 inside the first lower slit SL11, the second lower slit SL12, and the upper slit 26B.

  Further, the substrate first holding portions 151R, 151L, 152R and 152L, and the substrate second holding portions 261 and 262 are not limited to the above-described embodiments. For example, the thickness direction of the analog board 51 and the digital board 52 may be held between at least one of the first and second lower protrusions 15A and 15B and the upper protrusion 26A. At this time, the first and second lower protrusions 15A and 15B are provided with a taper so that the slit width becomes narrower in the downward direction, and the slit width becomes narrower in the upper protrusion 26A in the upward direction. A taper is provided. Then, if the analog board 51 and the digital board 52 are press-fitted into the first and second lower slits SL11 and SL12 and the upper slit 26B, it is possible to prevent a rattling sound at the time of music generation without providing elastic means (tape 70). be able to.

  In the above-described embodiment, the analog substrate 51 and the digital substrate 52 have the edge E1 in the vertical direction Y5 in contact with the bottom surfaces of the first and second lower slits SL11 and SL12 and the bottom surface of the upper slit 26B, respectively. However, the present invention is not limited to this. For example, the analog substrate 51 and the digital substrate 52 are separated from the bottom surfaces of at least one of the first and second lower slits SL11 and SL12 and the upper slit 26B, and the thickness direction of the analog substrate 51 and the digital substrate 52 is set to The second lower protrusions 15A and 15B and the upper protrusion 26A may be held and held. At this time, a rubber adhesive is poured into the gap formed between the analog substrate 51 and the digital substrate 52 and the bottom surfaces of the first and second lower slits SL11 and SL12 and the upper slit 26B. 2 The backlash of the analog board 51 and the digital board 52 in the lower slits SL11 and SL12 and the upper slit 26B can be prevented to prevent rattling noises when music is generated.

  Further, the above-described embodiments are merely representative forms of the present invention, and the present invention is not limited to the embodiments. That is, various modifications can be made without departing from the scope of the present invention.

(A) is the oblique view which looked at the upper case which comprises the exterior structure of the electronic keyboard instrument of this invention from the lower side, (B) is the lower case which comprises the exterior structure of the electronic keyboard instrument of this invention It is the oblique view seen from the upper side. FIG. 2 is a partially enlarged oblique view of the lower case shown in FIG. 1. FIG. 2 is a partially enlarged oblique view of the lower case shown in FIG. 1. It is sectional drawing when the electronic keyboard instrument incorporating the upper case and the lower case was cut along the IV-IV line shown in FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Lower case, 11 ... Bottom plate, 20 ... Upper case, 21 ... Upper plate, 22 ... Operation part, 30 ... Keyboard part, 51 ... Analog board (1st board | substrate with a heat sink), 53 ... Operation part board, 54 ... Heat resistant substrate (second substrate), 55 ... Heat sink, L ... Wiring part

Claims (2)

A lower case having a bottom plate for mounting a keyboard portion; an upper plate covering an upper side of the lower case; and an upper case having an operation unit provided on an upper surface of the upper plate; and the upper case on an upper side of the lower case Is an exterior structure of an electronic keyboard instrument formed by overlapping
A first board with a heat sink provided in combination with the keyboard portion provided between the upper case and the lower case;
A wiring portion that is drawn out from the operation portion and is routed so as to straddle the upper vicinity of the heat sink on at least the lower surface of the upper plate;
A second substrate attached to the upper plate,
The wiring part is sandwiched and held between the upper plate and the second substrate,
An exterior structure of an electronic keyboard instrument, wherein the second substrate is provided in a portion of the wiring portion that is routed near the upper portion of the heat dissipation plate. The operation unit has a substrate for an operation unit provided on the lower surface of the upper plate in the spreading direction of the upper plate; and
2. The exterior of the electronic keyboard instrument according to claim 1, wherein the second board is formed integrally with the operation unit board by placing a perforation and then separated by the perforation. Construction.

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