JP4831504B2 - Thermoplastic sheet molding equipment - Google Patents

Description

  The present invention relates to a facility for molding a thermoplastic resin sheet. More specifically, the present invention relates to a thermoplastic resin sheet molding facility including a heating device that heat-softens a thermoplastic resin sheet and a molding device that molds the heat-softened resin sheet.

Conventionally, in a molding apparatus that molds a rectangular sheet-shaped thermoplastic resin material, in a molding apparatus that grips and molds each side of a resin sheet, a clamp frame that includes a clamp that holds each side of the resin sheet is used in the frame, There is a method in which after holding a resin sheet with a clamp in the clamp frame, the clamp frame is sent to a heating device, and after heating the resin sheet, the clamp frame is conveyed to a molding device and molded.
In order to improve productivity, multiple clamp frames are used, and while the resin sheet held by one clamp frame is being molded, the process of supplying, heating, and taking out resin sheets to other clamp frames is performed. There is a need to do.
For example, two resin sheet conveyance jigs that alternate between a heating device (heating station) and a molding device (molding station) are provided, and the conveyance path of the resin sheet conveyance jig is separated from the conveyance path of each resin sheet conveyance jig. There is a method in which the height difference is given to each other so as to pass each other (Patent Document 1).
Further, there is a method of circulating by providing a circulation device for a clamp frame (resin sheet conveyance frame) before and after the heating / molding device (Patent Document 2).
However, in the method of alternately replacing the clamp frames described in Patent Document 1, since the heating device and the molding device pass from the same height, a passing space is required, and the heating device and the molding device are separated from each other. When the material extends and protrudes downward from the clamp frame, the material held by the clamp frame that passes above when passing each other must have a large height so that it does not hit the clamp frame that passes below, In the method of providing the circulation device as in Patent Document 2, a space for the circulation device is required separately, and there is a problem that the device becomes large.
Further, the cables cannot be attached to the clamp frame because of the circulation method, and there is a problem in controlling internal mechanisms such as an opening / closing mechanism inside the clamp frame. That is, the clamp frame cannot be circulated in a state where cables for controlling the mechanism for holding the material are attached to the clamp frame.
Also, in these methods, the upper and lower molds move toward the clamp frame for molding, so the lifting mechanism for the lower molds in particular requires an output that can withstand the weight and pressure of the upper and lower molds, resulting in a larger device. There is a problem that requires a lot of energy. As a countermeasure to this problem, there is an apparatus for fixing the lower mold and lowering the transport mechanism and the upper mold (Patent Document 3).
Therefore, the apparatus of Patent Document 3 is a system in which two sides of a material are gripped and transported by a transport chain. This material is inserted into the nails of an endless roller chain and gripped at both side positions, and then the upper and lower sides are moved. It is carried between the molds, and the material is lowered to the lower mold together with the endless roller chain.
Here, as a method of transporting the material, there is a method of gripping and transporting two opposite sides of the material as in the apparatus of Patent Document 3. This method simplifies the mechanism and is advantageous in terms of cost and maintainability. However, since the materials on the two sides that are not gripped are pulled and pulled during heating, the material yield must be increased accordingly, and the material yield is increased. There remains a problem that it tends to be lowered, and it is difficult to achieve molding conditions because it is difficult to obtain molding conditions because the elongation method during molding changes depending on the side that is not clamped, and it is difficult to improve moldability.

Japanese Patent Publication No. 5-54808, FIG. Japanese Patent Application Laid-Open No. 11-314234, FIG. Japanese Patent Publication No. 7-20659, FIG.

  An object of the present invention is to provide a molding facility for a thermoplastic resin sheet that can improve material yield and moldability, and can reduce the size of the facility.

  Moving between a heating device that heats and softens the thermoplastic resin sheet to a predetermined temperature, a molding device that molds the heat-softened thermoplastic resin sheet using an upper and lower mold, and the inside of the heating device and the inside of the molding device A thermoplastic resin sheet molding facility comprising an upper sheet transport device, wherein the sheet transport device is disposed from an upper position inside the heating device to an upper position inside the molding device; A lower conveyance mechanism disposed from a lower position inside the heating apparatus to a lower position inside the molding apparatus, and two sheet clamp frame mechanisms movable along the upper conveyance mechanism and the lower conveyance mechanism, respectively. The sheet clamp frame mechanism that holds each side of the thermoplastic resin sheet inside the heating device is lifted from the upper conveyance mechanism, and the conveyance mechanism and the sheet clamp frame After releasing the holding of the structure, the first elevating mechanism that moves down to transfer to the lower conveyance mechanism and the sheet clamp frame mechanism transferred to the lower conveyance mechanism are moved from the heating device to the molding device, and After lifting the sheet clamp frame mechanism from the lower conveyance mechanism and releasing the holding of the conveyance mechanism and the sheet clamp frame mechanism, the sheet clamp frame mechanism is lowered toward the molding surface of the lower mold and the upper mold is lowered. After finishing the molding of the thermoplastic resin sheet, a second lifting mechanism that lifts the sheet clamp frame mechanism that has released the resin sheet and moves it to the upper transport mechanism; the upper transport mechanism; and the lower transport mechanism A thermoplastic resin sheet molding facility comprising a mechanism, a sheet clamp frame mechanism, a first lifting mechanism, a second lifting mechanism, and a control device that controls the operation of the upper mold.

According to the present invention, the sheet clamp frame mechanism is lowered toward the lower mold while gripping each side around the material, and the sheet is molded to improve the material yield by gripping each side of the material, The effect of improving moldability can be obtained.
By pulling the material while holding each side of the material, it can be formed without creating wrinkles, and when vacuum forming is performed, the material can be pressed against the mold so that air does not escape . For this reason, moldability improves.

  In addition, according to the present invention, the sheet clamp frame mechanism is circulated using the two upper and lower transport mechanisms, and the lower one of the two sheet clamp frame mechanisms that pass the sheet clamp frame mechanism that holds the heated resin sheet. It is not necessary to provide a clearance for avoiding the resin sheet between the upper and lower sheet clamp frame mechanisms, and the height of the apparatus can be reduced, and the sheet clamp frame mechanism is between the heating device and the molding device. Since it is not necessary to provide a moving distance for passing each other, the distance between the heating device and the molding device is reduced, and the equipment can be reduced.

  Also, by taking the wiring to the sheet clamp frame mechanism from the other side for each sheet clamp frame mechanism, the wiring does not interfere with the wiring of the transport mechanism and other sheet clamp frame mechanisms, so the sheet clamp frame remains connected. The mechanism can be circulated, and the gripping mechanism in the sheet clamp frame mechanism can be freely determined.

  Furthermore, since the upper and lower transport mechanisms operate separately, the two sheet clamp frame mechanisms can be moved to the heating side or the molding side, so there is no sheet clamp frame mechanism in either the molding part or the heating part. Since the space is freed up, the workability during mold change and maintenance is improved.

  The molding equipment in the present invention is provided with two upper and lower transport mechanisms between the heating device and the molding device, and the upper transport mechanism moves the sheet clamp frame mechanism from the molding device to the heating device. The sheet clamp frame mechanism is moved up and down by the lifting mechanism of the sheet clamp frame mechanism, and the sheet clamp frame mechanism is transferred from the upper conveyance mechanism to the lower conveyance mechanism. The frame mechanism is lowered to the molding surface of the lower mold by the lifting mechanism of the sheet clamp frame mechanism of the molding apparatus and pressed by the upper mold from above, thereby forming the lower mold without moving. After the molding, the sheet clamp frame mechanism is transferred to the upper transport mechanism while leaving the resin sheet in the lower mold, and after the resin sheet is supplied, the movement to the heating device is repeated.

  In the present invention, the sheet clamp frame mechanism is for gripping and transporting a resin sheet, and its internal structure or the like is not limited. For example, as shown in FIG. 2, it has a rectangular frame shape, and each side of the resin sheet is held by the sheet gripping mechanism S in the four-side frame, but this is not restrictive. In the description of the present invention, a single plate is used to simplify the drawing.

Hereinafter, the thermoplastic resin sheet molding equipment of the present invention will be described with reference to the accompanying drawings.
FIG. 1 is a schematic front view showing the basic configuration of a thermoplastic resin sheet molding facility according to the present invention.
A molding facility according to an embodiment of the present invention includes a heating device B that heats and softens a thermoplastic resin sheet (not shown) to a predetermined temperature, and upper and lower molds A3 and A2 that heat and soften the thermoplastic resin sheet. This can be applied to a molding facility for a thermoplastic resin sheet, which includes a molding apparatus A that molds the sheet, and a sheet conveying apparatus K that can move between the inside of the heating apparatus B and the inside of the molding apparatus A.
The sheet conveying device K includes an upper conveying mechanism U, a lower conveying mechanism L, two sheet clamp frame mechanisms Ca and Cb movable along the upper conveying mechanism U and the lower conveying mechanism L, and the heating device. A first lifting mechanism B4 that lifts and lowers the sheet clamp frame mechanisms Ca and Cb, a second lifting mechanism A6 that lifts and lowers the sheet clamp frame mechanisms Ca and Cb by the molding apparatus, the upper transport mechanism U, the lower transport mechanism L, A sheet clamp frame mechanism Ca, Cb, a first lifting mechanism B4, a second lifting mechanism A6, and a control device (not shown) for controlling the operation of the upper mold.
The upper transport mechanism U is disposed from an upper position inside the heating apparatus B to an upper position inside the molding apparatus A.
The lower conveyance mechanism L is disposed from a lower position inside the heating apparatus B to a lower position inside the molding apparatus A.
The sheet clamp frame mechanisms Ca and Cb are movable along the upper transport mechanism U and the lower transport mechanism L.
The first elevating mechanism B4 lifts and releases the sheet clamp frame mechanisms Ca and Cb gripping each side of the thermoplastic resin sheet inside the heating device B from the upper transport mechanism U, and then descends to Transfer to the lower transport mechanism L.
The second elevating mechanism moves the sheet clamp frame mechanism transferred to the lower conveyance mechanism L from the heating device B to the molding apparatus A, and lifts the sheet clamp frame mechanisms Ca and Cb from the lower conveyance mechanism L. After releasing the holding of the lower conveyance mechanism L and the sheet clamp frame mechanisms Ca and Cb, the thermoplastic resin sheet descends toward the molding surface of the lower mold A2 and descends the upper mold A3. After the molding is finished, the sheet clamp frame mechanisms Ca and Cb released from the gripping of the resin sheet are lifted and transferred to the upper transport mechanism U.
The control device controls operations of the upper transport mechanism U, the lower transport mechanism L, the sheet clamp frame mechanisms Ca and Cb, the first lift mechanism B4, the second lift mechanism A6, and the upper mold A3.

More specifically, this equipment is divided into a forming apparatus A and a heating apparatus B, and an upper transport mechanism U and a lower transport mechanism L for transporting the sheet clamp frame mechanisms Ca and Cb are arranged between the frame A1 of the forming apparatus and the heating apparatus. It is fixed to the frame B1.
The molding apparatus A includes a lower molding die A2 and an upper molding die A3, and the upper molding die A3 moves up and down when the upper molding die lifting cylinder A5 moves on the upper molding die table A4 to which the upper molding die A3 is fixed. On the left and right sides of the forming apparatus A, there is a second lifting mechanism A6 for lifting and lowering the sheet clamp frame mechanism, whereby the sheet clamp frame mechanism is relocated to the upper and lower stages and lowered to the molding position.
The heating device B includes an upper heater B2, a lower heater B3, and a first elevating mechanism B4 that overheat the material. The lower heater B3 is fixed to the first elevating frame B5 and is raised and lowered by the first elevating cylinder B6. The first elevating mechanism elevates and lowers the sheet clamp frame mechanism by the first elevating frame B5 and the first elevating cylinder B6.
The two sheet clamp frame mechanisms Ca and Cb are provided with cable connection brackets C4a and C4b at positions on both sides with respect to the traveling direction of the sheet clamp frame mechanisms Ca and Cb. One end of the cable guide member C5a is fixed to the upper portion N of the cable connection bracket C4a, and the other end is fixed to the frame B1 of the heating device. One end of a cable guide member C5b is fixed to the upper portion N of the cable connection bracket C4b, and the other end is fixed to the frame B1 of the heating device. Since the cable guide members C5a and C5b are arranged at the positions on both sides of the frame B1 of the heating device, the sheet clamp frame mechanisms Ca and Cb can be circulated while avoiding interference between the connecting brackets. As a result, power and signals are supplied to the gripping mechanisms S of the sheet clamp frame mechanisms Ca and Cb. It is easy to understand with reference to FIG.

FIG. 3 is a schematic side view of the thermoplastic resin sheet molding equipment according to the present invention as viewed from the right side of FIG. FIG. 4 is an enlarged view of the portion shown in FIG. 3D.
The upper transport mechanism U and the lower transport mechanism L include upper and lower straight traveling portions U2 and L2, upper and lower transport hook receiving portions U1 and L1 connected to the upper and lower straight traveling portions, and the upper and lower transport mechanisms. And a drive mechanism P that moves the transport hook receiving portions U1 and L1 along the upper and lower straight running portions.
The drive mechanism P includes upper and lower transport pinions U4 and L4, upper and lower transport racks U5 and L5, and upper and lower transport motors U3 and L3.

  The upper and lower transport hook receiving portions U1 and L1 are respectively provided with sheet clamp frame mechanisms Ca and Cb, and the upper transport pinion U4 engaged with the upper transport rack U5 fixed to the upper transport hook receiving portion U1 is formed in the molding apparatus. When the upper conveyance driving motor U3 fixed to the frame A1 is rotated, the upper conveyance hook receiving portion U1 moves back and forth between the heating device B and the molding device A along the upper linear traveling portion U2, and the lower conveyance hook receiving portion L1. When the lower conveyance drive motor L3 fixed to the frame A1 of the molding apparatus rotates the lower conveyance pinion L4 meshed with the lower conveyance rack L5 fixed to the lower conveyance rack L5, the lower conveyance hook receiving portion L1 is moved along the lower linear movement portion L2. Go back and forth between the heating device B and the molding device A.

The upper transport mechanism U is located above the sheet clamp frame mechanisms Ca and Cb, and is disposed within the width of the sheet clamp frame mechanism (width in a direction perpendicular to the transport direction of the sheet clamp frame mechanism). The upper conveyance hook receiving portion U1 receives and holds the upper conveyance hook C1 at the upper side of the clamp frame mechanism, and the lower linear traveling portion L2 in the lower conveyance mechanism L is outside the sheet clamp frame mechanisms Ca and Cb. The lower transport hook receiving portion L1 receives and holds the lower transport hook C2 on the side surfaces of the clamp frame mechanisms Ca and Cb.
As shown in FIGS. 3 and 7, the cable connection brackets C4a and C4b of the two sheet clamp frame mechanisms Ca and Cb are on the right side (back) in the sheet clamp frame mechanism Ca, and on the left side in the sheet clamp frame mechanism Cb ( In FIG. 1, the front side and the other side are connected to each other to avoid interference between the connecting brackets.
Further, since the upper transport mechanism U is inside the cable connection brackets C4a and C4b and the lower transport mechanism L is outside, there is also interference between the upper and lower transport mechanisms U and L and the cable connection brackets C4a and C4b. Avoid. With this configuration, the sheet clamp frame mechanism can be circulated with the cable connected.
In addition, the connecting brackets C4a and C4b are made of a structure having a height so that the cables do not interfere with the lower conveyance mechanism or the like even when the sheet clamp frame mechanism is lowered to the lower mold height during molding (FIG. 22). In the upper part N, the cable guide members C5a and C5b are connected. As the shape of the structure, a base portion is connected to the end portions of the sheet clamp frame mechanisms Ca and Cb, there is a vertical portion that rises vertically from the base portion, and there is a horizontal portion that protrudes horizontally above the vertical portion. They are all hollow so that the cable can pass through.
Cables for transmitting power and signals to the gripping mechanism S of the sheet clamp frame mechanisms Ca and Cb are cable guide members from the sheet clamp frame mechanism to the inside of the cable connection brackets C4a and C4b and from the upper part N of the cable connection bracket. It is connected to a control device (not shown) through C5a and C5b.
The control device includes an operation of the upper transport mechanism U, an operation of the lower transport mechanism L, a gripping mechanism S of the sheet clamp frame mechanisms Ca and Cb, a lift of the first lift mechanism B4, a lift of the second lift mechanism A6, and an upper mold. Controls the elevation of A3.

  FIG. 5 shows the relationship between the upper conveyance hook C1 that holds the sheet clamp frame mechanism Cb in the upper conveyance mechanism U and the upper conveyance hook receiving portion U1, and the relationship between the second elevating mechanism A6 and the elevation receiving portion C3 of the sheet clamp frame mechanism Cb. FIG. 6 shows the relationship between the lower conveyance hook C2 that holds the sheet clamp frame mechanism Cb in the lower conveyance mechanism L and the lower conveyance receiver L1, and the relationship between the second elevation mechanism A6 and the elevation receiver C3 of the sheet clamp frame mechanism Cb. It is the figure which showed the relationship. On the side surface of the sheet clamp frame mechanism, there are an upper conveyance hook C1, a lower conveyance hook C2, and a lift receiving portion C3. The upper conveyance hook C1 is an upper conveyance hook receiving portion U1 of the upper conveyance mechanism U and a lower conveyance hook C2 is a lower conveyance. The lower conveyance hook receiving portion L1 of the mechanism L and the lift receiving portion C3 are engaged with the second lift mechanism A6 or the first lift frame B5. Each part is provided with a groove or a pin, and positioning is performed by fitting these parts together. 5 and 6 show only the second lifting mechanism A6, the same applies to the first lifting mechanism B4 on the heating device side.

Hereinafter, the movement when these configurations are used will be described. In the description of the present invention, the sheet clamp frame mechanism is expressed as a single plate for simplification of the drawings.
FIG. 7 shows the positional relationship between the upper / lower transport mechanism and the sheet clamp frame mechanism. The operation starts from the state shown in FIGS. A material is supplied to the sheet clamp frame mechanism Ca by a material supply device (not shown). The sheet clamp frame mechanism Cb on the heating side is in a state where the material is gripped and the material has been heated.

First, by the upper and lower transport mechanisms U and L, the sheet clamp frame mechanism Ca on the molding apparatus A side is directed to the heating apparatus B side in the direction 6, and the sheet clamp frame mechanism Cb on the heating apparatus B side is directed to the direction 7. To the molding apparatus A side. FIG. 9 shows a state in which the sheet clamp frame mechanism is rubbed during movement. After the movement of the sheet clamp frame mechanism is completed, as shown in FIGS. 9 to 10 and FIGS. 13 to 14, the first lifting mechanism A6 and the first lifting mechanism B4 are each in the direction 1 for releasing the engagement between the hook and the receiving portion, 3 and lifts the sheet clamp frame mechanisms Cb and Ca, respectively (FIGS. 10 and 14). Lifting will disengage each hook from the receiving part. FIG. 20A shows the engagement between the upper hook receiver of the upper conveyance mechanism and the upper hook of the sheet clamp frame mechanism, and the engagement is released as shown in FIG. Similarly, the lower transport mechanism is disengaged from FIG. 21 (a) as shown in FIG. 21 (b). After disengagement of the conveyance mechanism and the sheet clamp frame mechanism, the upper conveyance hook receiving portion U1 is directed in the direction 5 and the lower conveyance hook receiving portion L1 is directed in the direction as shown in FIGS. 10, 15, 20 (c) and 21 (c). 8 to a position where it does not interfere with the sheet clamp frame mechanism.
When the hook has come to a position where it does not interfere, the second elevating mechanism A6 starts to descend in the direction 4, the sheet clamp frame mechanism Cb is lowered to the molding position, and the upper mold elevating cylinder A5 is also operated to operate the upper mold. Lowering in the direction 9 to perform molding. The hook receiving portions U1 and L1 of the transport mechanism do not stop after moving for avoiding interference, and move to the standby position for the next process at the same time in the upper and lower stages. 11, 16, and 22 show the state during molding.

When molding is completed, the sheet clamp frame mechanism Cb releases the molded resin sheet and leaves the resin sheet in the lower mold A2, and the sheet clamp frame mechanism Cb and the upper mold rise together, and the sheet clamp frame mechanism Cb It moves to the replacement height beyond the upper transport mechanism U. At this time, the upper conveyance hook receiving portion U1 stands by before the holding position so as not to interfere with the upper conveyance hook C1 of the sheet clamp frame mechanism Cb (standby position). Upon completion of heating, the sheet clamp frame mechanism Ca on the heating side is lowered in the direction 2 by the first elevating mechanism B4, held on the lower conveyance hook receiving portion L1, and detached from the first elevating mechanism B4 (FIGS. 12 and 17).
As shown in FIG. 17, after the sheet clamp frame mechanism Cb has been raised to the direction 3 by the second lifting mechanism A6, the upper conveyance hook receiving portion U1 is directed to below the upper conveyance hook C1 of the sheet clamp frame mechanism. 5 (FIG. 18), and the second lifting mechanism A6 descends in the direction 4 so that the sheet clamp frame mechanism Cb is held by the upper transport mechanism (FIG. 19). Thereafter, the resin sheet molded from the lower mold A2 is taken out, and the resin sheet is supplied to the sheet clamp frame mechanism Cb.
Production is continuously performed by repeating this series of operations by replacing the sheet clamp frame mechanism Ca and the sheet clamp frame mechanism Cb. The movements of the sheet clamp frame mechanisms Ca and Cb, the first and second elevating mechanisms B4 and A6, and the upper and lower transport mechanisms U and L can be easily understood by referring to FIGS. The resin sheet is supplied on the molding device A side, but can be supplied on the heating device B side.

  According to the present invention, in a molding facility for molding a thermoplastic resin sheet, two sheet clamp frame mechanisms for gripping a resin sheet are circulated between a molding apparatus and a heating apparatus by using a two-stage upper and lower transport mechanism, and a sheet clamp Since the molding is performed by lowering the frame mechanism and the upper mold to the lower mold, the apparatus is reduced in size because the distance between the molding apparatus and the heating apparatus is reduced, and the lower mold is molded without raising and lowering. Thus, the energy for operating the lower mold can be suppressed, and the molding apparatus can be miniaturized because the lower mold does not have an elevating mechanism.

  In the present invention, the sheet clamp frame mechanism and the upper mold are individually lowered and pressed, but the lower mold is adjusted by synchronizing the lowering of the sheet clamp frame mechanism and the upper mold and adjusting the respective lowering speeds. The contact timing of the mold and the resin sheet, and the upper mold and the resin sheet can be adjusted. By this adjustment, the resin sheet can be pressure-molded under optimum conditions.

  The heating unit elevating mechanism simultaneously elevates and lowers the lower heater and the sheet clamp frame mechanism. By separating the elevating mechanism of the sheet clamp frame mechanism and the elevating mechanism of the lower heater, the upper and lower heaters and the seat are separated. The distance of the resin sheet in the clamp frame mechanism can be arbitrarily adjusted, and optimal heating can be performed together with the adjustment of the heater output.

  Furthermore, the upper and lower transport mechanisms can be formed not only between the heating device and the molding device but also by extending the rails and providing a resin sheet supply unit or the like beside the heating device or the molding device.

  Furthermore, as shown in FIG. 23, the sheet clamp frame mechanism is reduced to one, and the apparatus is further reduced in size by adopting a configuration in which the heating device and the molding device are alternately moved and molded by one conveyance mechanism. You can also. In FIG. 23, the lower conveyance device L is used as the conveyance device and Ca is used as the sheet clamp frame mechanism. However, the upper conveyance device U and the sheet clamp frame mechanism Cb may be used, and the present invention is not limited thereto.

It is the front schematic which showed the basic composition of the molding equipment of the thermoplastic resin sheet by this invention. It is a figure which shows an example of the sheet clamp frame used for this invention. FIG. 2 is a schematic side view of the apparatus of FIG. 1 as viewed from the right side. FIG. 4 is an enlarged view of a portion D in the schematic side view of FIG. 3. It is a perspective view which shows the connection / holding method of an upper stage conveyance mechanism, a raising / lowering mechanism, and a sheet clamp frame mechanism. It is a perspective view which shows the connection / holding method of a lower stage conveyance mechanism, a raising / lowering mechanism, and a sheet clamp frame mechanism. It is a perspective view which shows the motion of two sheet clamp frame mechanisms and conveyance / raising / lowering mechanism in production, and is the state after completion of resin sheet supply and heating. FIG. 8 is a perspective view of FIG. 7 in a state where the upper and lower sheet clamp frame mechanisms are passing each other. In the schematic front view of FIG. 1, the sheet clamp frame mechanism is moved to a heating device and a forming device. In the schematic front view of FIG. 1, the sheet clamp frame mechanism is transferred from the upper and lower transport mechanisms to the lifting mechanism. In the schematic front view of FIG. 1, the sheet clamp frame mechanism of the molding apparatus is a state in which the sheet clamp frame mechanism of the molding / heating apparatus has been heated and transferred to the lower conveyance mechanism. In the schematic front view of FIG. 1, molding is completed and the sheet clamp frame mechanism is transferred to the upper transport mechanism. In the perspective view of FIG. 7, it is a figure of the state which the sheet clamp frame mechanism moved to the heating apparatus and the shaping | molding apparatus. In the perspective view of FIG. 7, the sheet clamp frame mechanism raising / lowering mechanism is a figure of the state which lifted the sheet clamp frame mechanism. FIG. 8 is a perspective view of FIG. 7 in a state where the transport hook receiving portions of the upper and lower transport mechanisms are moved and the sheet clamp frame mechanism is opened. In the perspective view of FIG. 7, the sheet clamp frame mechanism of the forming apparatus is lowered to the forming position, and the transport hook of the transport mechanism is moved to the next process position. In the perspective view of FIG. 7, the sheet clamp frame mechanism of the heating device is transferred to the lower conveyance mechanism, and the sheet clamp frame mechanism of the molding apparatus is in a transfer position to the upper conveyance mechanism. In the perspective view of FIG. 7, it is a figure of the state which the upper stage conveyance hook moved to the holding position of the sheet clamp frame mechanism. In the perspective view of FIG. 7, the sheet clamp frame mechanism of the forming apparatus leaves the lifting mechanism and is transferred to the upper transport mechanism. (A) It is a partial expansion perspective view which shows the meshing of a sheet clamp frame mechanism and an upper stage conveyance mechanism. (B) It is a partial expansion perspective view which shows the engagement of a sheet clamp frame mechanism and an upper stage conveyance mechanism, and is the state which the sheet clamp frame mechanism was lifted. (C) is a partially enlarged perspective view showing the engagement between the sheet clamp frame mechanism and the upper conveyance mechanism, in a state where the sheet clamp frame mechanism is lifted and the conveyance hook receiving portion is moved and disconnected. (A) It is a partial expansion perspective view which shows the operation | movement of removal from the lower stage conveyance mechanism of a sheet clamp frame mechanism. (B) It is a partial expansion perspective view which shows the operation | movement of removal from the lower stage conveyance mechanism of a sheet clamp frame mechanism, and is the state which the sheet clamp frame mechanism was lifted. (C) is a partially enlarged perspective view showing the removal operation from the lower conveyance mechanism of the sheet clamp frame mechanism, in a state where the sheet clamp frame mechanism is lifted and the conveyance hook receiving portion is moved and disconnected. FIG. 4 is a diagram of a state during molding in the schematic side view of FIG. 3. FIG. 10 is a diagram illustrating one conveyance mechanism and one sheet clamp frame mechanism according to another embodiment of the present invention.

A molding equipment
A1 Frame of molding apparatus A2 Lower mold A3 Upper mold A4 Upper mold table A5 Upper mold lifting cylinder A6 Second lifting mechanism B Heating device
B1 Heating device frame B2 Upper heater B3 Lower heater B4 First elevating mechanism B5 First elevating frame B6 First elevating cylinder K Sheet conveying device U Upper conveying mechanism
U1 Upper transport hook receiver U2 Upper linear travel unit U3 Upper transport drive motor U4 Upper transport pinion U5 Upper transport rack U6 Upper transport drive shaft U7 Pulley & belt L Lower transport mechanism
L1 Lower conveyance hook receiving portion L2 Lower linear traveling portion L3 Lower conveyance driving motor L4 Lower conveyance pinion L5 Lower conveyance rack L6 Lower conveyance driving shaft Ca, Cb Sheet clamp frame mechanism C1 Upper conveyance hook C2 Lower conveyance hook C3 Lift receiving portion C4a Cable Connection bracket 1
C4b Cable connection bracket 2
C5a Cable guide member 1
C5b Cable guide member 2
N Cable connection bracket upper part E Cable S Sheet gripping mechanism 1 Direction in which the first lifting mechanism is raised 2 Direction in which the first lifting mechanism is lowered 3 Direction in which the second lifting mechanism is raised 4 Direction in which the second lifting mechanism is lowered 5 Upper stage Direction 6 for moving the transport mechanism hook receiving portion toward the molding device 6 Direction for moving the upper transport mechanism hook receiving portion toward the heating device 7 Direction 8 for moving the lower transport mechanism hook receiving portion toward the molding device 8 Lower transport mechanism hook receiving portion 9 for moving the upper mold lifting / lowering cylinder 10 direction for lowering the upper mold lifting / lowering cylinder 10

Claims (5)

A heating device for heating and softening the thermoplastic resin sheet to a predetermined temperature;
A molding apparatus for molding the heat-softened thermoplastic resin sheet with an upper and lower mold;
A thermoplastic resin sheet molding facility comprising a sheet conveying device capable of moving between the inside of the heating device and the inside of the molding device,
The sheet conveying device is
An upper conveyance mechanism disposed from an upper position inside the heating apparatus to an upper position inside the molding apparatus;
A lower conveyance mechanism disposed from a lower position inside the heating apparatus to a lower position inside the molding apparatus;
Two sheet clamp frame mechanisms that are respectively movable along the upper transport mechanism and the lower transport mechanism;
The sheet clamp frame mechanism that holds each side of the thermoplastic resin sheet inside the heating device is lifted from the upper transport mechanism, released from the lower transport mechanism and the sheet clamp frame mechanism, and then lowered. A first elevating mechanism to be transferred to the lower transport mechanism;
The sheet clamp frame mechanism transferred to the lower conveyance mechanism is moved from the heating device to the molding device, the sheet clamp frame mechanism is lifted from the lower conveyance mechanism, and the holding of the conveyance mechanism and the sheet clamp frame mechanism is released. After that, the sheet clamp frame mechanism that descends toward the molding surface of the lower molding die and lowers the upper molding die to finish molding the thermoplastic resin sheet, and then releases the holding of the resin sheet. A second lifting mechanism that moves up and transfers to the upper transport mechanism;
A thermoplastic resin sheet molding facility comprising the upper transport mechanism, the lower transport mechanism, the sheet clamp frame mechanism, the first lifting mechanism, the second lifting mechanism, and a control device that controls the operation of the upper mold. The upper-stage transport mechanism and the lower-stage transport mechanism move a pair of linear travel parts arranged opposite to each other, a transport hook receiving part connected to the linear travel part, and the transport hook receiving part along the straight travel part. The thermoplastic resin sheet molding equipment according to claim 1, further comprising a drive mechanism, wherein the sheet clamp frame mechanism includes a conveyance hook portion placed on the conveyance hook receiving portion. After the control device transfers the sheet clamp frame mechanism that moves to the heating device from the upper transport mechanism to the lower transport mechanism, the control device moves the transport hook receiving portion of the upper transport mechanism to the molding device and the molding device. 2. A receiving portion moving circuit for moving a sheet hook frame portion of the lower conveyance mechanism to the heating device after transferring a sheet clamp frame mechanism moving to the apparatus from the lower conveyance mechanism to the upper conveyance mechanism. The molding equipment of the thermoplastic resin sheet of 2. The upper transport mechanism is located above the two sheet clamp frame mechanisms, and is disposed within the width of the sheet clamp frame mechanism, and the linear travel unit in the lower transport mechanism includes the two sheet clamp frame mechanisms. The thermoplastic resin sheet molding equipment according to claim 1, 2 or 3, which is disposed outside the sheet clamp frame mechanism. Of the two sheet clamp frame mechanisms, a cable guide member provided in one sheet clamp frame mechanism and a cable guide member provided in the other sheet clamp frame mechanism are disposed to face each other, and the cable guide One end of the member is fixed to the cable connection bracket fixed to the side end of the sheet clamp frame mechanism, the other end is fixed to the frame, and the upper connection mechanism and the lower stage are fixed when the cable connection bracket is molded. 5. The thermoplastic resin sheet molding equipment according to claim 1, wherein the thermoplastic resin sheet has a structure that does not interfere with the transport mechanism.