JP4824417B2 - Laser chip manufacturing method and laser chip - Google Patents

Laser chip manufacturing method and laser chip Download PDF

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JP4824417B2
JP4824417B2 JP2006024209A JP2006024209A JP4824417B2 JP 4824417 B2 JP4824417 B2 JP 4824417B2 JP 2006024209 A JP2006024209 A JP 2006024209A JP 2006024209 A JP2006024209 A JP 2006024209A JP 4824417 B2 JP4824417 B2 JP 4824417B2
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core
end side
laser chip
surface coating
coating
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JP2007202746A (en
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辰男 山口
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Totoku Electric Co Ltd
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本発明は、レーザーチップの製造方法およびレーザーチップに関し、さらに詳しくは、一端側から他端側へ向けて細くなった管形状の高品質のレーザーチップを容易に製造できるレーザーチップの製造方法および一端側から他端側まで適正な強度を有するレーザーチップに関する。   The present invention relates to a laser chip manufacturing method and a laser chip. More specifically, the present invention relates to a laser chip manufacturing method and one end capable of easily manufacturing a tube-shaped high-quality laser chip that narrows from one end to the other end. The present invention relates to a laser chip having appropriate strength from the side to the other end side.

従来のレーザーチップ（またはレーザープローブ）は、金属パイプの内面を研磨した後、その研磨した内面に金や銀の薄膜をめっきして製造されている（例えば、特許文献１，２参照。）。
他方、電鋳めっき法による細管の製造方法が知られている（例えば、特許文献３参照。）。
特許第３５３５６８５号公報（［００１６］） 特許第２６５９４８１号公報（［０００６］［０００７］） 特許第３５１７２３２号公報 A conventional laser chip (or a laser probe) is manufactured by polishing an inner surface of a metal pipe and then plating a gold or silver thin film on the polished inner surface (see, for example, Patent Documents 1 and 2).
On the other hand, a method for manufacturing a thin tube by electroforming plating is known (for example, see Patent Document 3).
Japanese Patent No. 3535685 ([0016]) Japanese Patent No. 2659481 ([0006] [0007]) Japanese Patent No. 3517232

従来のレーザーチップでは、一端側から他端側へ向けて細くなった管形状の金属パイプを用いた場合、他端側の内径が小さくなると、内面を研磨する工程や内面にめっきする工程が難しくなる。このため、一端側から他端側へ向けて細くなった管形状の高品質のレーザーチップを製造しにくい問題点があった。
他方、従来のレーザーチップでは、金属パイプの厚さが一端側から他端側まで均等であったため、一端側から他端側へ向けて細くなった管形状にした場合、一端側の強度が適正になる厚さにすると他端側の強度が不足し、他端側の強度が適正になる厚さにすると一端側の強度が過剰になる問題点があった。
そこで、本発明の目的は、一端側から他端側へ向けて細くなった管形状の高品質のレーザーチップを容易に製造できるレーザーチップの製造方法および一端側から他端側まで適正な強度を有するレーザーチップを提供することにある。 In a conventional laser chip, when a pipe-shaped metal pipe that is thinned from one end to the other end is used, if the inner diameter of the other end is small, the process of polishing the inner surface or the process of plating the inner surface is difficult. Become. For this reason, there is a problem that it is difficult to manufacture a tube-shaped high-quality laser chip that is narrowed from one end side to the other end side.
On the other hand, with the conventional laser chip, the thickness of the metal pipe is uniform from one end to the other, so that when the tube shape is narrowed from one end to the other, the strength at one end is appropriate. If the thickness is such that the strength on the other end side is insufficient, the strength on the other end side becomes insufficient, and the strength on the one end side becomes excessive.
Accordingly, an object of the present invention is to provide a laser chip manufacturing method capable of easily manufacturing a tube-shaped high-quality laser chip that narrows from one end side to the other end side, and an appropriate strength from one end side to the other end side. It is in providing the laser chip which has.

第１の観点では、本発明は、一端側から他端側へ向けて細くなった母型の表面に内面被覆材を電解めっきし内面被覆を形成する内面被覆形成工程と、前記内面被覆の表面に芯材をめっきし少なくとも１層の芯を形成する芯形成工程と、前記母型を引き抜く引抜工程と、前記内面被覆および芯の他端側に開口を形成する開口形成工程と、前記芯の表面に外面被覆材をめっきし外面被覆を形成する外面被覆形成工程とを有することを特徴とするレーザーチップの製造方法を提供する。
上記第１の観点によるレーザーチップの製造方法では、母型の表面を平滑にしておけば、平滑な内面のレーザーチップを製造できる。すなわち、金属パイプの内面を研磨したり、金属パイプの内面にめっきする必要がなくなる。また、母型の表面を平滑にするのは、金属パイプの内面を研磨するより容易であり、表面粗さをより小さく出来る。よって、一端側から他端側へ向けて細くなった管形状の、高品質のレーザーチップを製造できる。なお、従来の金属パイプでは形状の自由度が低いのに対して、本発明では、母型の形状の自由度が高いため、レーザーチップの内面の自由度が高くなる利点もある。
なお、芯材を１種とし１層の芯としてもよいが、用途に合わせて芯材を２種以上とし２層以上の芯としてもよい。 In a first aspect, the present invention provides an inner surface coating forming step of forming an inner surface coating by electrolytic plating an inner surface coating material on a surface of a mother die that is narrowed from one end side to the other end side, and the surface of the inner surface coating. A core forming step of plating the core material to form at least one layer of core, a drawing step of pulling out the mother die, an opening forming step of forming an opening in the other end side of the inner surface coating and the core, An outer surface coating forming step of plating an outer surface coating material on the surface to form an outer surface coating is provided.
In the laser chip manufacturing method according to the first aspect, a laser chip having a smooth inner surface can be manufactured if the surface of the mother die is smooth. That is, it is not necessary to polish the inner surface of the metal pipe or to plate the inner surface of the metal pipe. Further, smoothing the surface of the matrix is easier than polishing the inner surface of the metal pipe, and the surface roughness can be further reduced. Therefore, it is possible to manufacture a high-quality laser chip having a tube shape that is narrowed from one end side to the other end side. Note that the conventional metal pipe has a low degree of freedom in shape, whereas the present invention has a high degree of freedom in the shape of the mother die, and therefore has the advantage of increasing the degree of freedom of the inner surface of the laser chip.
In addition, although it is good also as a 1-type core material and a 1-layer core, it is good also considering a core material as 2 or more types and a 2-layer or more core according to a use.

第２の観点では、本発明は、一端側から他端側へ向けて細くなった管形状の芯と、前記芯の全面を覆う被覆とからなるレーザーチップであって、前記芯の厚さは一端側から他端側へ向けて厚くなっていることを特徴とするレーザーチップを提供する。
上記第２の観点によるレーザーチップでは、一端側から他端側へ向けて細くなった管形状の芯の厚さを一端側から他端側へ向けて厚くしているため、一端側から他端側まで過不足のない適正な強度になる。 In a second aspect, the present invention is a laser chip comprising a tube-shaped core that narrows from one end side to the other end side, and a coating that covers the entire surface of the core, and the thickness of the core is Provided is a laser chip characterized in that the thickness increases from one end side to the other end side.
In the laser chip according to the second aspect, the thickness of the tube-shaped core that is thinned from one end side to the other end side is increased from one end side to the other end side. Appropriate strength without excess or deficiency.

本発明のレーザーチップの製造方法によれば、一端側から他端側へ向けて細くなった管形状の高品質のレーザーチップを製造できる。
本発明のレーザーチップによれば、一端側から他端側まで過不足のない適正な強度になる。 According to the laser chip manufacturing method of the present invention, it is possible to manufacture a tube-shaped high-quality laser chip that narrows from one end side to the other end side.
According to the laser chip of the present invention, an appropriate strength with no excess or deficiency is obtained from one end side to the other end side.

以下、図に示す実施の形態により本発明をさらに詳細に説明する。なお、これにより本発明が限定されるものではない。   Hereinafter, the present invention will be described in more detail with reference to embodiments shown in the drawings. Note that the present invention is not limited thereby.

図１は、実施例１にかかるレーザーチップの製造方法を示す工程フロー図である。
ステップＳ１では、図２に示すごとき母型治具Ｍの尖頭母型部Ｈの表面を研磨し、表面を平滑にする。例えば、０.０１μｍの研磨材で１２０秒間研磨し、表面粗さ０.５μｍ以下とする。
図２に示すように、尖頭母型部Ｈは、一端側から他端側へ直線的に細くなった円錐形である。
尖頭母型部Ｈの材料は、ステンレスや黄銅のような加工性に優れた金属や、導電性を付与した絶縁材料を用いることが出来る。
基部Ｂは、尖頭母型部Ｈと同一材料でもよく、別の材料でもよい。 FIG. 1 is a process flow diagram illustrating the laser chip manufacturing method according to the first embodiment.
In step S1, the surface of the pointed master mold portion H of the master jig M as shown in FIG. 2 is polished to smooth the surface. For example, it is polished for 120 seconds with a 0.01 μm abrasive so that the surface roughness is 0.5 μm or less.
As shown in FIG. 2, the pointed matrix part H has a conical shape that linearly narrows from one end side to the other end side.
As the material of the pointed matrix part H, a metal excellent in workability such as stainless steel or brass, or an insulating material imparted with conductivity can be used.
The base B may be the same material as the pointed matrix part H, or may be a different material.

ステップＳ２では、尖頭母型部Ｈの脱脂および酸活性を行う。例えば、６０℃のアルカリ脱脂液に１２０秒間浸漬し、３０℃の１０％塩酸水溶液に６０秒間浸漬する。
ステップＳ３では、尖頭母型部Ｈの表面に光沢ニッケルめっきを行い、表面をさらに平滑にする。なお、このステップＳ３を省略してもよい。
ステップＳ４では、尖頭母型部Ｈの表面（光沢ニッケルめっきした場合はその表面）に離型処理を行う。例えば、１０％水酸化ナトリウム溶液中で、６Ｖ、３０秒間、逆電流処理を行う。 In step S2, the pointed matrix part H is degreased and acid-activated. For example, it is immersed in an alkaline degreasing solution at 60 ° C. for 120 seconds and immersed in a 10% hydrochloric acid aqueous solution at 30 ° C. for 60 seconds.
In step S3, bright nickel plating is performed on the surface of the pointed matrix part H to further smooth the surface. Note that step S3 may be omitted.
In step S4, a mold release process is performed on the surface of the sharpened master part H (the surface in the case of bright nickel plating). For example, reverse current treatment is performed in a 10% sodium hydroxide solution at 6 V for 30 seconds.

ステップＳ５では、図３に示すように尖頭母型部Ｈに内面被覆材を電解めっきし、内面被覆１を形成する。例えば１Ａ／ｄｍ2で２０分間の電解金めっきを行う。尖頭母型部Ｈが一端側から他端側へ直線的に細くなった円錐形であるため、電解めっきすると、内面被覆１の厚さは、一端側から他端側へ向けて厚くなる。内面被覆１の厚さは、一端側で例えば２μｍとする。
内面被覆材としては、金、銀、ロジウム、白金、銅、アルミニウム、ニッケル、コバルト、鉄またはそれらの合金を用いる。好適なのは、レーザーの反射率が良い金属、例えば金、銀、ロジウムまたはそれらの合金である。特に、耐食性に優れ、傷付きにくい硬質金合金、例えば金／コバルト、金／ニッケル、金／鉄が好ましい。 In step S5, as shown in FIG. 3, the inner surface coating 1 is formed by electroplating the inner surface coating material on the pointed matrix portion H. For example, electrolytic gold plating is performed at 1 A / dm 2 for 20 minutes. Since the pointed matrix part H has a conical shape that is linearly thinned from one end side to the other end side, when electrolytic plating is performed, the thickness of the inner surface coating 1 increases from one end side toward the other end side. The thickness of the inner surface coating 1 is, for example, 2 μm on one end side.
As the inner surface covering material, gold, silver, rhodium, platinum, copper, aluminum, nickel, cobalt, iron or an alloy thereof is used. Preferred are metals with good laser reflectivity, such as gold, silver, rhodium or their alloys. In particular, a hard gold alloy having excellent corrosion resistance and being hardly damaged, such as gold / cobalt, gold / nickel, and gold / iron, is preferable.

ステップＳ６では、図４に示すように内面被覆１に芯材を電解めっきし、芯２を形成する。例えば４Ａ／ｄｍ2〜１０Ａ／ｄｍ2で所望のめっき厚になるまで電解ニッケルめっきを行う。尖頭母型部Ｈが一端側から他端側へ直線的に細くなった円錐形であるため、電解めっきすると、芯２の厚さは、一端側から他端側へ向けて厚くなる。芯２の厚さは、例えば一端側で５０μｍ〜１００μｍとする。
芯材としては、ニッケル、銅、鉄、コバルト、モリブデン、タングステンまたはそれらの合金を用いる（但し、被覆材より硬い材料を用いる）。好適なのは、ニッケルである。特に、スルファミン酸ニッケルめっきが適している。 In step S6, the core material is electrolytically plated on the inner surface coating 1 to form the core 2 as shown in FIG. For example up to at 4A / dm 2 ~10A / dm 2 at the desired plating thickness performing electroless nickel plating. Since the pointed matrix part H has a conical shape that is linearly thinned from one end side to the other end side, the thickness of the core 2 increases from one end side to the other end side when electrolytic plating is performed. The thickness of the core 2 is, for example, 50 μm to 100 μm on one end side.
As the core material, nickel, copper, iron, cobalt, molybdenum, tungsten, or an alloy thereof is used (however, a material harder than the coating material is used). Preferred is nickel. In particular, nickel sulfamate plating is suitable.

ステップＳ７では、図５に示すように母型治具Ｍを引き抜く。引き抜いた母型治具Ｍは、ステップＳ１に戻って繰り返し再使用する。   In step S7, the mother jig M is pulled out as shown in FIG. The extracted master jig M is repeatedly reused after returning to step S1.

ステップＳ８では、図６に示すように内面被覆１および芯２の頭部ｈを研磨し、レーザ出射口ｘを開口する。精密研磨により研磨量を制御することにより、レーザ出射口ｘを調整できる。   In step S8, as shown in FIG. 6, the inner surface coating 1 and the head h of the core 2 are polished, and the laser emission port x is opened. The laser emission port x can be adjusted by controlling the polishing amount by precision polishing.

ステップＳ９では、図７に示すように芯２に被覆材をめっきし、外面被覆３を形成する。例えば芯材をニッケルとするとき、置換金めっきする。外面被覆３の厚さは、例えば０.０５μｍ以上とする。
外面被覆材は、耐食性に優れ、傷付きにくい材料が好ましく、例えば金、白金、ロジウム、パラジウムまたはそれらの合金を用いる。
以上により、図７に示すごときレーザーチップ１０を製造することが出来る。
このレーザーチップ１０のレーザ出射口ｘの径は例えば０.００５ｍｍから２.０ｍｍであり、レーザ入射口ｎの径は例えば０.５ｍｍ以上である。 In step S9, a coating material is plated on the core 2 as shown in FIG. For example, when nickel is used as the core material, substitution gold plating is performed. The thickness of the outer surface coating 3 is, for example, 0.05 μm or more.
The outer surface covering material is preferably a material that is excellent in corrosion resistance and hardly scratches. For example, gold, platinum, rhodium, palladium, or an alloy thereof is used.
As described above, the laser chip 10 as shown in FIG. 7 can be manufactured.
The diameter of the laser exit x of the laser chip 10 is, for example, 0.005 mm to 2.0 mm, and the diameter of the laser entrance n is, for example, 0.5 mm or more.

実施例１のレーザーチップの製造方法によれば、従来のように金属パイプの内面を研磨したり、金属パイプの内面にめっきする必要がなくなる。また、尖頭母型部Ｈの表面を平滑にするのは、金属パイプの内面を研磨するより容易であり、表面粗さをより小さく出来る。よって、一端側から他端側へ向けて細くなった管形状の高品質のレーザーチップ１０を製造できる。なお、従来の金属パイプでは形状の自由度が低いのに対して、本発明では、母型の形状の自由度が高いため、レーザーチップ１０の内面形状の自由度が高くなる利点もある。
実施例１のレーザーチップ１０によれば、内側被覆１および芯２の厚さを一端側から他端側へ向けて厚くしているため、一端側から他端側まで過不足のない適正な強度になる。 According to the laser chip manufacturing method of the first embodiment, there is no need to polish the inner surface of the metal pipe or to plate the inner surface of the metal pipe as in the prior art. Further, it is easier to smooth the surface of the pointed matrix part H than to polish the inner surface of the metal pipe, and the surface roughness can be made smaller. Therefore, it is possible to manufacture a high-quality laser chip 10 having a tubular shape that narrows from one end side to the other end side. The conventional metal pipe has a low degree of freedom in shape, whereas the present invention has a high degree of freedom in the shape of the mother die, and therefore has an advantage that the degree of freedom in the inner shape of the laser chip 10 is increased.
According to the laser chip 10 of the first embodiment, since the thickness of the inner coating 1 and the core 2 is increased from one end side to the other end side, appropriate strength from one end side to the other end side is sufficient. become.

実施例２にかかるレーザーチップの製造方法では、３層の芯２を形成する。
ステップＳ１〜Ｓ５までは、実施例１と同じである。 In the laser chip manufacturing method according to the second embodiment, the three-layer core 2 is formed.
Steps S1 to S5 are the same as those in the first embodiment.

ステップＳ６では、図８に示すように内面被覆１に第１の芯材を電解めっきし、芯第１層２１を形成する。芯材としては例えばニッケルを用いる。次に、図９に示すように芯第１層２１に第２の芯材を電解めっきし、芯第２層２２を形成する。芯材としては例えば銅を用いる。次に、図１０に示すように芯第２層２２に第３の芯材を電解めっきし、芯第３層２３を形成する。芯材としては例えばニッケルを用いる。かくして、３層の芯２を形成する。   In step S <b> 6, as shown in FIG. 8, the first core material is electrolytically plated on the inner surface coating 1 to form the first core layer 21. For example, nickel is used as the core material. Next, as shown in FIG. 9, the second core material is electrolytically plated on the first core layer 21 to form the second core layer 22. For example, copper is used as the core material. Next, as shown in FIG. 10, the third core material is electrolytically plated on the second core layer 22 to form the third core layer 23. For example, nickel is used as the core material. Thus, the three-layer core 2 is formed.

ステップＳ７では、図１１に示すように母型治具Ｍを引き抜く。引き抜いた母型治具Ｍは、ステップＳ１に戻って繰り返し再使用する。   In step S7, the master jig M is pulled out as shown in FIG. The extracted master jig M is repeatedly reused after returning to step S1.

ステップＳ８では、図１２に示すように内面被覆１および芯２の頭部ｈを研磨し、レーザ出射口ｘを開口する。   In step S8, as shown in FIG. 12, the inner surface coating 1 and the head h of the core 2 are polished, and the laser emission port x is opened.

ステップＳ９では、図１３に示すように芯２に被覆材をめっきし、外面被覆３を形成する。例えば金を無電解めっきする。
以上により、図１３に示すごときレーザーチップ２０を製造することが出来る。 In step S9, a coating material is plated on the core 2 as shown in FIG. For example, gold is electrolessly plated.
Thus, the laser chip 20 as shown in FIG. 13 can be manufactured.

実施例２のレーザーチップの製造方法によれば、従来のように金属パイプの内面を研磨したり、金属パイプの内面にめっきする必要がなくなる。また、尖頭母型部Ｈの表面を平滑にするのは、金属パイプの内面を研磨するより容易であり、表面粗さをより小さく出来る。よって、一端側から他端側へ向けて細くなった管形状の高品質のレーザーチップ２０を製造できる。
実施例２のレーザーチップ２０によれば、内側被覆１および芯２の厚さを一端側から他端側へ向けて厚くしているため、一端側から他端側まで過不足のない適正な強度になる。また、芯第２層２２を銅にしているため、ニッケルだけで芯２を構成する場合より柔らかくすることが出来る。また、芯第１層２１および芯第２層２３をニッケルにしているから内側被覆１および外側被覆３の金との密着性が良好になる。 According to the laser chip manufacturing method of the second embodiment, there is no need to polish the inner surface of the metal pipe or to plate the inner surface of the metal pipe as in the prior art. Further, it is easier to smooth the surface of the pointed matrix part H than to polish the inner surface of the metal pipe, and the surface roughness can be made smaller. Therefore, it is possible to manufacture a high-quality laser chip 20 having a tubular shape that is narrowed from one end side to the other end side.
According to the laser chip 20 of the second embodiment, since the thickness of the inner coating 1 and the core 2 is increased from one end side to the other end side, appropriate strength from one end side to the other end side is sufficient. become. Further, since the core second layer 22 is made of copper, the core 2 can be made softer than the case where the core 2 is composed of nickel alone. Further, since the core first layer 21 and the core second layer 23 are made of nickel, the adhesion of the inner coating 1 and the outer coating 3 to gold is improved.

本発明のレーザーチップの製造方法およびレーザーチップは、医科医・歯科医等で使用されるレーザーメスに利用できる。   The laser chip manufacturing method and laser chip of the present invention can be used for a laser scalpel used by a medical doctor, a dentist or the like.

実施例１に係るレーザーチップの製造方法を示す工程フロー図である。FIG. 3 is a process flow diagram illustrating a method for manufacturing a laser chip according to Example 1. 母型治具の一例を示す正面図および側面図である。It is the front view and side view which show an example of a mother die jig. 内面被覆形成工程後の状態を示す一部断面側面図である。It is a partial cross section side view which shows the state after an inner surface coating formation process. 実施例１に係る芯形成工程後の状態を示す一部断面側面図である。It is a partial cross section side view which shows the state after the core formation process which concerns on Example 1. FIG. 実施例１に係る引抜工程後の状態を示す一部断面側面図である。It is a partial cross section side view which shows the state after the drawing process which concerns on Example 1. FIG. 実施例１に係る開口工程後の状態を示す一部断面側面図である。It is a partial cross section side view which shows the state after the opening process which concerns on Example 1. FIG. 実施例１に係る外面被覆形成工程後の状態を示す一部断面側面図である。It is a partial cross section side view which shows the state after the outer surface coating | coated formation process which concerns on Example 1. FIG. 実施例２に係る芯第１層形成工程後の状態を示す一部断面側面図である。It is a partial cross section side view which shows the state after the core 1st layer formation process which concerns on Example 2. FIG. 実施例２に係る芯第２層形成工程後の状態を示す一部断面側面図である。It is a partial cross section side view which shows the state after the core 2nd layer formation process which concerns on Example 2. FIG. 実施例２に係る芯第３層形成工程後の状態を示す一部断面側面図である。It is a partial cross section side view which shows the state after the core 3rd layer formation process which concerns on Example 2. FIG. 実施例２に係る引抜工程後の状態を示す一部断面側面図である。It is a partial cross section side view which shows the state after the drawing process which concerns on Example 2. FIG. 実施例２に係る開口工程後の状態を示す一部断面側面図である。It is a partial cross section side view which shows the state after the opening process which concerns on Example 2. FIG. 実施例２に係る外面被覆形成工程後の状態を示す一部断面側面図である。It is a partial cross section side view which shows the state after the outer surface coating | coated formation process which concerns on Example 2. FIG.

符号の説明Explanation of symbols

１ 内面被覆
２ 芯
３ 外面被覆
１０ レーザーチップ
２１ 芯第１層
２２ 芯第２層
２３ 芯第３層
Ｈ 尖塔母型
Ｍ 母型治具 DESCRIPTION OF SYMBOLS 1 Inner surface coating 2 cores 3 Outer surface coating 10 Laser chip 21 Core 1st layer 22 Core 2nd layer 23 Core 3rd layer H Spire mother mold M Mother mold jig

Claims (2)

一端側から他端側へ向けて細くなった母型の表面に内面被覆材を電解めっきし内面被覆を形成する内面被覆形成工程と、前記内面被覆の表面に芯材をめっきし少なくとも１層の芯を形成する芯形成工程と、前記芯が表面に形成された内面被覆の内面から前記母型を一端側へ向けて引き抜く引抜工程と、前記内面被覆および芯の他端側のみに開口を形成する開口形成工程と、前記芯の表面に外面被覆材をめっきし外面被覆を形成する外面被覆形成工程とを有することを特徴とするレーザーチップの製造方法。 An inner surface coating forming step of forming an inner surface coating by electrolytic plating an inner surface coating material on the surface of the mother die that narrows from one end side to the other end side; and a core material is plated on the surface of the inner surface coating to form at least one layer A core forming step for forming a core, a drawing step for pulling out the matrix toward one end side from the inner surface of the inner surface coating on which the core is formed, and an opening is formed only on the inner surface coating and the other end side of the core. A method for manufacturing a laser chip, comprising: an opening forming step for forming an outer surface coating; and an outer surface coating forming step for plating an outer surface coating material on the surface of the core to form an outer surface coating. 一端側から他端側へ向けて細くなった管形状の芯と、前記芯の全面を覆う被覆とからなるレーザーチップであって、前記芯はニッケル層で銅層を挟んだ３層構造であり、前記芯の厚さは一端側から他端側へ向けて厚くなっていることを特徴とするレーザーチップ。 A laser chip comprising a tube-shaped core that narrows from one end to the other end and a coating that covers the entire surface of the core , the core having a three-layer structure in which a copper layer is sandwiched between nickel layers The laser chip is characterized in that the thickness of the core increases from one end side to the other end side.
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