JP4816984B2 - Topping material adhesion device - Google Patents

Description

  The present invention relates to a topping material attaching device for attaching a topping material to a solid food, and more particularly to a topping material attaching device for attaching a molten topping material to a solid food.

  Conventionally, a method is known in which a topping material such as a flaky processed oil and fat food is attached to a solid food such as snack snacks typified by potato chips (see Patent Document 1). For example, in the method described in Patent Document 1, high-temperature potato chips coming out of a fryer are transported by a conveyor, and a flaky processed oily food containing cheese is sprinkled over the potato chips transported by the conveyor. The The processed oily food sprinkled on the potato chips is melted by the heat of the potato chips and adheres to the potato chips. Next, the potato chips are cooled, and the melted processed oily food is solidified.

JP-A-5-64546 (see paragraph 0019)

  In the conventional method described above, the flaky processed oil and fat food may not be sprinkled uniformly. For example, before a flaky processed oily food is melted by the heat of potato chips, the potato chips may roll off. Moreover, when the potato chips currently conveyed by the conveyor have overlapped, a fat processed food may not be sprinkled on the lower potato chips. In that case, the ratio of the potato chips to which the processed oil / fat food is attached decreases. Although it is not necessary for all the potato chips to have the processed fat food, it is preferable that the ratio of the potato chips to which the processed fat food is adhered is large.

  Moreover, if the flaky processed oily food is sprinkled on a portion where there is no potato chips, the processed oily food may adhere to the conveyor. In this case, after finishing the production of potato chips, it is necessary to remove the processed fat and oil food from the conveyor.

Accordingly, a first object of the present invention is to provide a topping material adhering device that can increase the proportion of solid food to which a meltable topping material adheres.
A second object of the present invention is to provide a topping material adhering device that can recover a meltable topping material that has not adhered to a solid food.

  In order to achieve the first object, a topping material adhering apparatus according to the present invention is a topping material adhering apparatus for adhering a meltable topping material to a solid food in a granular form, and supplying the melted topping material. A material supply unit, a topping material discharge unit for discharging the topping material supplied from the topping material supply unit downward and in a linear form, and a solid food discharging unit for attaching the topping material to the solid food A solid food moving part that moves to the adhesion area below, and the topping material discharged downward in a linear form breaks down while dropping and granulates, and then granulates and then reaches the adhesion area It is a feature.

  According to the topping material adhering apparatus of the present invention configured as described above, the molten topping material is supplied to the topping material discharge unit by the topping material supply unit, and is discharged downward and linearly from the topping material discharge unit. The topping material discharged in a linear shape is interrupted and granulated while dropping due to its viscosity, and then reaches the adhesion region. The granulated topping material adheres to the solid food moved to the adhesion region by the solid food moving unit.

  In the prior art, flaky processed oil (topping material) was attached to potato chips (solid food), so the topping material might roll off from the solid food before it was melted by the heat of the solid food. On the other hand, the topping material adhering apparatus of the present invention attaches the melted and granulated topping material to the solid food, so that the topping material easily adheres to the solid food. As a result, the ratio of the solid food to which the topping material is attached can be increased.

  In order to achieve the second object, in the topping material adhering apparatus according to the present invention, preferably, the solid food moving unit is released to the adhering region and a releasing unit for releasing the solid food to the adhering region. And a receiving unit for receiving the solid food.

  In the topping material adhering device configured as described above, when the solid food is released to the adhering region, the solid food that has been transported in an overlapping manner can be shifted. Thereby, the opportunity for the topping material to adhere to the solid food is increased. As a result, the ratio of the solid food to which the topping material is attached can be increased. Moreover, the topping material which did not adhere to the solid food passes through the opposite side of the solid food. Thereby, it becomes possible to collect the topping material adhering to the conveyor or the like in the prior art on the opposite side of the solid food.

  In the topping material adhering apparatus according to the present invention, preferably, the topping material supply unit is configured to receive a topping material discharged from the topping material discharge unit, and a reservoir disposed below the topping material discharge unit; And a pump for supplying the topping material from the reservoir to the topping material discharge section.

  In the topping material adhering apparatus configured as described above, a single pump is used to supply a new topping material in the reservoir to the topping material discharge unit and to supply the recovered topping material to the topping material discharge unit. Can be done.

  In the topping material adhering apparatus according to the present invention, the diameter of the granulated topping material is preferably 1 to 10 mm.

According to the topping material adhering apparatus according to the present invention, it is possible to increase the ratio of the solid food to which the topping material adheres.
Moreover, according to the topping material adhering device according to the present invention, the topping material that has not adhered to the solid food can be recovered.

  Hereinafter, with reference to FIG.1 and FIG.2, embodiment of the topping material adhesion apparatus by this invention is described. FIG. 1 is a schematic overall view of a topping material adhering apparatus according to an embodiment of the present invention, and FIG. 2 is a bottom view of a topping material discharge portion that discharges the topping material. In the embodiment described below, as an example, a solid food is described as potato chips.

  As shown in FIG. 1, the topping material adhering apparatus 1 discharges the topping material supply unit 2 that supplies the molten topping material F and the topping material F that is supplied from the topping material supply unit 2 downward and linearly. A topping material discharging unit 4 for causing the potato chips P to adhere to the potato chips P, and a solid food moving unit 6 for moving the potato chips P to the adhesion region A below the topping material discharging unit. .

  The topping material supply unit 2 accommodates the molten topping material F and is disposed below the reservoir 2a, the pipe 2b connected to the reservoir 2a, and the topping material F in the reservoir 2a connected to the pipe 2b. Is supplied to the topping material discharge part 4 and a pipe 2d extending from the pump 2c to the topping material discharge part 4 is provided. The reservoir 2a is disposed below the topping material discharge unit 4 so as to receive the topping material F discharged from the topping material discharge unit 4, and has an upward opening 2e facing the topping material discharge unit 4 in the vertical direction. Have. The opening may be provided with a mesh 2f for preventing potato chips or the like from entering the reservoir. Preferably, a topping material melted in a melting kettle 8 provided separately from the topping material supply unit 2 is supplied into the reservoir 2a. The pump 2c is preferably a screw pump or a gear pump for viscous liquid. The pump 2c is disposed below, and the pipe 2d is preferably connected to the topping material discharge unit 4 after extending upward from the pump 2c and U-turning to extend downward.

  The topping material is preferably a material that can be solidified in an arbitrary range of 0 to 50 ° C. and become a granule having a diameter of preferably 0.1 to 10 mm, more preferably 1.0 to 10 mm when melted. It is. Further, the topping material is a material having a property of being interrupted and granulated while being dropped when discharged downward in a linear form.

  Moreover, a topping material is the fats and oils processed food containing fats and oils, for example. The fats and oils may be vegetable fats and oils, animal fats and oils, or a mixture thereof. Vegetable oils are, for example, rapeseed oil, soybean oil, sunflower seed oil, peanut oil, rice bran oil, corn oil, safflower oil, olive oil, kabok oil, sesame oil, evening primrose oil, palm oil, shea fat, monkey fat, chocolate Are cocoa butter, coconut oil, palm kernel oil, and animal fats are, for example, milk fat, beef tallow, lard, fish oil, whale oil. In addition, the processed fats and oils may be processed fats and oils obtained by curing, fractionating and transesterifying these fats and oils, and may contain one or more of sugars, milk powders, amino acids and emulsifiers. Further, the topping material may be any food material that can be melted and discharged from the nozzle. For example, the topping material may be a food containing fats and oils, specifically chocolate or the like. The softening point of the oil / fat processed food by the ring and ball method based on JIS-K2207 or the food containing the oil / fat is preferably 25 to 50 ° C., more preferably 30 to 45 ° C.

  The topping material discharge part 4 has a main body part 4a constituting a hollow space and a plurality of openings 4c provided in the lower surface 4b of the main body part. As shown in FIG. 2, the opening 4c is circular and preferably has a diameter of 1 to 10 mm. The flow rate of the topping material F discharged from one opening 4c is preferably 1 to 100 g / min, and more preferably 5 to 25 g / min.

  The molten kettle 8, the topping material supply unit 2, and the topping material discharge unit 4 are preferably heated by a hot water jacket or the like in order to keep the topping material F in a molten state.

  The solid food moving unit 6 includes an electromagnetic feeder 6a for supplying the potato chips P, a discharge chute 6b disposed on the downstream side of the electromagnetic feeder 6a for discharging the potato chips P to the adhesion area A, and an adhesion area. It has a receiving chute 6c for receiving the potato chips P discharged to A, and a carry-out conveyor 6e provided at the downstream outlet 6d of the receiving chute 6c. The adhesion area A is determined so as to reach the adhesion area A after the topping material FL ejected linearly from the topping material ejection part 4 is interrupted and granulated. A sizer portion 10 is preferably provided between the electromagnetic feeder 6a and the discharge chute 6b in order to remove the potato chips pieces crushed in the electromagnetic feeder 6a. The sizer portion 10 has a hole 10a through which only crushed potato chips pieces pass. It is preferable that a receiving portion 12 for receiving the potato chips piece that has passed through the hole 10a is provided below the sizer portion 10.

  Next, operation | movement of the topping material adhesion apparatus which is embodiment of this invention is demonstrated.

  For example, potato chips P fried by a fryer (not shown) are supplied to the electromagnetic feeder 6a and conveyed by the electromagnetic feeder 6a. The multi-layered potato chips P are shifted by the electromagnetic feeder 6a and approach one layer. The broken potato chips pieces are collected in the receiving part 12 through the hole 10 a of the sizer part 10. The potato chips P fall obliquely toward the adhesion area A in the order in which they reach the discharge chute 6b. When the potato chips P that have overlapped fall from the discharge chute 6b, the position thereof is further shifted and the potato chips P are further in a state.

  Also, the molten topping material F in the reservoir 2 a is pumped by the pump 2 c through the pipes 2 b and 2 d and supplied to the topping material discharge unit 4. The topping material F supplied to the topping material discharge part 4 is continuously discharged from the hole 4c of the lower surface 4b. The topping material discharged from the hole 4c is linear as indicated by the symbol FL in FIG. The topping material FL discharged in a linear shape is interrupted and granulated while dropping due to its viscosity, and then reaches the adhesion region A.

  The granulated topping material F hits the potato chips P in the adhesion region A, so that the topping material F adheres to the potato chips P. The topping material F that has not adhered to the potato chips P passes through the potato chips P and returns to the reservoir 2a. The potato chip pieces that have fallen toward the reservoir 2A are caught by the mesh 2f and are prevented from being mixed into the reservoir 2a.

  The potato chips P to which the topping material F adheres are received by the receiving chute 6c, moved from the downstream outlet 6d to the carry-out conveyor 6e, and carried out.

  The topping material adhering apparatus 1 according to the embodiment of the present invention can relatively increase the diameter of the granulated topping material. The diameter of the granulated topping material is preferably 0.1 to 10 mm, and more preferably 1 to 10 mm.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the invention described in the claims. Needless to say, these are also included within the scope of the present invention.
In the said embodiment, although demonstrated that the solid food was a potato chip, as long as it is a solid food to which a topping material adheres, other snacks etc. may be sufficient.
Moreover, in the said embodiment, although the solid food moving part was set as the structure containing the discharge chute 6b and the receiving chute 6c, and the arrangement | positioning area | region A was provided in space, a granular topping material is applied to solid foods, such as potato chips P, etc. In order to make it adhere, a solid food transfer part may be a tumbler and a conveyance conveyor, and an adhesion area | region may be an area | region on them.

1 is a schematic overall view of a topping material adhering apparatus according to an embodiment of the present invention. It is a bottom view of the topping material discharge part of the apparatus of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Topping material adhesion apparatus 2 Topping material supply part 2a Reservoir 2c Pump 4 Topping material discharge part 6 Solid food movement part 6b Release chute 6c Receipt chute A Adhesion area | region F Topping material FL Linear topping material P Potato chips

Claims (4)

A topping material attaching device for attaching a meltable topping material to a solid food in a granular form,
A topping material supply unit for supplying the melted topping material;
A topping material discharge section for discharging the topping material supplied from the topping material supply section downward and linearly;
A solid food moving unit that moves the solid food to an adhesion region below the topping material discharge unit in order to adhere the topping material to the solid food,
A topping material adhering apparatus characterized in that the topping material discharged downward in a linear form is interrupted and granulated while dropping, and then reaches the adhering region.   The topping material adhesion according to claim 1, wherein the solid food moving unit includes a discharge unit that discharges the solid food to the adhesion region and a receiving unit that receives the solid food discharged to the adhesion region. apparatus.   The topping material supply unit is configured to receive a topping material discharged from the topping material discharge unit, a reservoir disposed below the topping material discharge unit, and a topping material from the reservoir to the topping material discharge unit. The topping material deposition apparatus according to claim 1, further comprising: a pump for feeding.   The diameter of the granulated topping material is 1-10 mm, The topping material adhesion apparatus of any one of Claims 1-3 characterized by the above-mentioned.

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