JP4816439B2 - Disk unit - Google Patents

Description

  The present invention relates to a disk device. In detail, by providing a turbulent flow generating part in the heat radiating part of the accommodating part, the wind generated by the rotation of the disk is changed to turbulent flow, and the electronic components transferred to the disk accommodating part via the heat transfer part The present invention relates to a disk device that efficiently radiates heat.

  In recent years, the performance of electronic devices such as personal computers has improved, and the amount of heat generated inside the housing has been reduced due to the speedup of electronic components such as CPU (Central Processing Unit) and LSI (Large Scale Integration) built into the housing. It is increasing.

  In order to avoid problems such as malfunction, failure or destruction of electronic devices due to heat generation of electronic components, various methods for dissipating heat from the electronic components incorporated in the housing have been proposed and provided. For example, a heat dissipating structure has been proposed in which a blade body (blower disk) is provided in a disk device, and the heat of a heat-generating component is cooled and dissipated by rotating the blade body (see Patent Document 1 and Patent Document 2). ). In addition, there has been proposed a disk device that improves the heat dissipation effect by circulating the wind generated by rotation in the casing through the ventilation port provided in the casing (see Patent Document 3).

JP 2002-230962 A JP 2000-106496 A JP 2000-231782 A

However, in the heat dissipating methods described in Patent Documents 1 and 2, since a fan must be mounted inside the housing, the structure of the disk device may be complicated and the manufacturing cost may increase.
Further, in the heat dissipation method described in Patent Document 3, a plurality of ventilation holes are formed in the tray in order to circulate the wind generated by the rotation of the disk inside the housing. Are provided in different areas, there is a concern whether the targeted heat dissipation effect can be actually obtained.
Therefore, a heat dissipation method different from those in Patent Documents 1 to 3 that can surely obtain the targeted heat dissipation effect is desired.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a disk device that can easily and effectively dissipate heat generated from an electronic component provided inside the housing. .

In order to solve the above-described problems, the disk device of the present invention includes an upper storage portion that stores a disk-shaped recording medium, and the disk-shaped recording medium that is rotationally driven and is located below the upper storage portion. A rotation drive unit housed in a lower housing part partitioned from a part , a heat dissipating part provided in the upper housing part and provided in at least a part of a region through which wind generated by the rotation of the disk-shaped recording medium flows A heat transfer part for transferring heat generated from an electronic component to the heat dissipation part provided in the lower housing part, and a wind generated by the rotation of the disk-shaped recording medium flowing in the heat dissipation part is changed into a turbulent flow The electronic component is attached to the lower housing portion in a two-stage configuration, and a heat dissipation sheet is provided on the upper surface of the upper electronic component, and the heat transfer portion is disposed on the heat dissipation sheet. Provided Characterized in that that.

  Further, the turbulent flow generation section can be provided upstream of the contact section of the heat transfer section that is in contact with the heat radiating section with respect to the rotation direction of the disc-shaped recording medium.

  In the storage unit in which the disc-shaped recording medium is accommodated, the disc-shaped recording medium can be rotated by the rotation driving unit, and the rotation of the disc-shaped recording medium generates wind that flows in the rotation direction of the disc-shaped recording medium. . At this time, a boundary layer (laminar flow boundary layer) is generated on the surface of the storage portion (a heat radiating portion described later) at a position facing the stored disk-shaped recording medium. Therefore, the flow speed in the rotational direction is substantially zero on the surface of the housing portion.

  Heat radiated from an electronic component such as an LSI built in the casing of the electronic device is transferred to the heat radiating portion of the housing portion in which the disk-shaped recording medium is housed via the heat conducting portion. The heat dissipating part is a position facing the disk-shaped recording medium or the surface of the accommodating part around it. Since the heat transfer unit transfers heat of the electronic component to the heat dissipation unit, the heat dissipated can be efficiently applied to the wind generated by the rotation of the disk-shaped recording medium and dissipated. However, as described above, a sufficient heat dissipation effect cannot be obtained due to the influence of the boundary layer on the surface of the housing portion. In the present invention, since a turbulent flow generating portion that changes laminar flow into turbulent flow is provided in the heat radiating portion, the boundary layer on the surface of the heat radiating portion is turbulent from laminar flow when the wind in the rotational direction hits the turbulent flow generating portion To change. The heat transferred to the heat radiating portion is efficiently radiated into the housing by the turbulent flow.

  According to the present invention, by providing the heat transfer section, the heat generated from the electronic component is efficiently transferred to the storage section of the disk-shaped recording medium. Moreover, since the laminar flow of the boundary layer on the surface of the accommodating portion is changed to turbulent flow by providing the turbulent flow generating portion, the heat transferred is efficiently radiated. Thereby, compared with the past, heat dissipation efficiency can be improved and the temperature of the whole inside of a housing | casing can be maintained at low temperature. As a result, malfunction, failure or destruction of the electronic device due to heat generation of the electronic component can be prevented. In addition, unlike the prior art, there is no need to install a fan or the like inside the housing, so that it is possible to provide an electronic device that is reduced in size and weight.

[First Embodiment]
Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1A is a cross-sectional view showing a configuration of a disk device 10 according to an embodiment of the present invention, and FIG. 1B is an enlarged view of a main part of a one-dot chain line region T shown in FIG. . FIG. 2 is a perspective view showing a schematic configuration of the disk device in which the protrusion 28 is formed. FIG. 3A is a diagram showing a boundary layer of a gap between the disk 22 and the chassis 14, and FIG. 3B is a graph showing a velocity distribution at that time. 4A is a cross-sectional view taken along the line II ′ of the disk device shown in FIG. 2, and FIG. 4B is a graph showing the velocity distribution in the gap between the disk 22 and the chassis 14. . In the velocity distribution graph used in the present embodiment, the vertical axis indicates the height of the gap between the disk 22 and the chassis 14, and the horizontal axis indicates the speed of the wind generated by the rotation.

  A disk device 10 according to the present embodiment includes a CD (compact disk), a DVD (Digital Versatile Disk), an MD (mini disk), a CD-ROM (CD read-only memory), an HD (Hard Disk), etc. A disk-shaped recording medium).

  As shown in FIG. 1, the disk device 10 includes an electronic device such as a housing 12, a motor 18 that constitutes an example of a rotational drive unit that rotationally drives the disk 22, and a driver integrated circuit 16 built in the housing 12. A heat transfer unit 26 that transfers heat generated from the components to the heat dissipation unit 14a of the housing 12 and a turbulent flow generation unit 28 that changes wind in the rotational direction flowing through the heat dissipation unit 14a into turbulent flow are provided.

  The housing 12 has a substantially rectangular parallelepiped shape, and a flat plate-like chassis 14 is mounted in the housing 12 in the horizontal direction, and the inside of the housing 12 is configured by the chassis 14 so as to have an upper housing portion 50 and a lower housing portion. 52. In this example, the disk 22 is accommodated in the upper accommodating portion 50, and the motor 18 and the driver integrated circuit 16 described later are accommodated in the lower accommodating portion 52. The chassis 14 constitutes a part of the housing portion, and is made of a metal material such as iron or a plastic injection molding resin.

  The motor 18 is attached to the chassis 14, and the rotating shaft O of the motor 18 passes through the chassis 14, and the tip of the motor 18 projects into the upper housing portion 50. A disc-shaped turntable 20 on which the disk 22 is placed is fixed to the tip of the rotating shaft O. A disc chuck 54 that holds the disc 22 placed on the turntable 20 is fixed to the center of the turntable 20. Then, the disk 22 is mounted on the turntable 20 while being held by the disk chuck 54.

  A circuit board 42 on which the driver integrated circuit 16 for controlling the rotation of the motor 18 is mounted is attached to the lower housing portion 52. In this example, the circuit board 42 is attached to the lower housing portion 52 in a two-stage configuration, and a plurality of driver integrated circuits 16 are mounted on the upper circuit board 42. On the upper surface of the driver integrated circuit 16, a heat radiation sheet 24 is attached to suppress the thermal resistance between the driver integrated circuit 16 and the heat transfer section 26 disposed on the upper surface.

  The heat transfer section 26 is composed of a plate member made of copper, aluminum, or the like, or a conductive member such as a heat pipe or a graphite device. In this example, a copper plate bent in a crank shape is used as the heat transfer section 26, and one piece thereof is in contact with the heat dissipation sheet 24 on the driver integrated circuit 16. The other piece of the heat transfer portion 26 is in contact with the back surface 14b of the facing surface 14a (heat radiation portion) of the chassis 14 facing the disk surface of the disk 22. In this example, the surface of the heat transfer section 26 that contacts the back surface 14b of the chassis 14 is referred to as a contact section 26A. The contact portion 24A is disposed at a position (back surface 14b) where the overlapping area with the disk 22 becomes large and is selected to have a predetermined shape (rectangular shape in this example), and is placed on the opposing surface 14a via the contact portion 24A. Heat transfer is easy to hit the wind in the direction of rotation to improve heat dissipation efficiency. In addition, the heat from the driver integrated circuit 16 may be efficiently radiated by radiation by applying black coating to the above-described facing surface 14a and the back surface 14b.

  As shown in FIG. 1B and FIG. 2, the turbulent flow generation portion is composed of a plurality of protrusions 28 having a triangular pyramid shape in this example. The protrusion 28 is provided on the facing surface 14a (heat dissipating part) of the upper housing part 50 immediately below the disk surface facing the disk surface of the disk 22 mounted on the turntable 20 (position overlapping the disk surface in plan view). . The plurality of protrusions 28 are arranged on the straight line at equal intervals. At this time, the plurality of protrusions 28 may be formed in a direction (radial direction) orthogonal to the rotation direction of the disk 22 or may be formed in a predetermined inclination direction with respect to the rotation direction. In this way, by forming an array on the straight line with a gap therebetween, the area where the wind generated by the rotation of the disk 22 hits the projection 28 is increased, and turbulence can be generated more effectively. Further, as shown in FIG. 2, the heat transfer section 26 is provided on the downstream side of the protrusion 28 with respect to the rotation of the disk 22 in the direction of arrow A. That is, the heat transfer section 26 is provided at a position downstream of the protrusion 28 with respect to the wind flow in the rotation direction A generated by the rotation of the disk 22.

Next, a heat radiation operation when the disk 22 is rotated in a predetermined direction will be described.
First, an example in which the protruding portion 28 is not formed on the facing surface 14a of the upper accommodating portion 50 will be described. As shown in FIG. 3A, when the disk 22 rotates during data reproduction / recording, wind (swirl flow) flowing in the rotation direction of the disk 22 is generated. Here, the contact portion 26A of the heat transfer portion 26 is brought into contact with the upper surface of the lower accommodating portion 52 and heat is transferred to the facing surface 14a side of the upper accommodating portion 50, and a heat radiation effect is obtained from the wind in the rotation direction. However, a boundary layer is generated by the wind generated by the rotation of the disk 22 on the facing surface 14 a of the upper housing portion 50. In the boundary layer, as shown in FIG. 3B, the opposing surface 14a of the upper accommodating portion 50 does not have a sliding speed, so that the velocity gradient at the opposing surface 14a becomes substantially zero. Therefore, even if heat is transferred to the facing surface 14a of the upper housing part 50 via the heat transfer part 26, the thermoelectric efficiency is reduced by the boundary layer, and a sufficient heat dissipation effect cannot be obtained.

  Therefore, in the present embodiment, as shown in FIGS. 1 and 2, the protruding portion 28 is provided on the facing surface 14 a of the upper accommodating portion 50. The wind in the direction of arrow A generated by the rotation of the disk 22 hits the protrusion 28 as shown in FIG. As a result, as shown in FIG. 4B, the boundary layer around the protrusion 28 (opposing surface 14a) changes from laminar flow to turbulent flow, and accordingly, the laminar boundary in a region away from the opposing surface 14a. The laminar flow also changes from laminar flow to turbulent flow. As shown in FIG. 2, this turbulent flow is caused to flow downstream from the protrusions 28 by wind in the rotational direction. As described above, the heat of the driver integrated circuit 16 is transferred to the opposing surface 14a on the downstream side of the protrusion 28 via the contact portion 26A of the heat transfer portion 26, and this heat flows in the downstream direction. It is efficiently dissipated into the upper housing part 50 by the flow. Thereby, the heat generated from the electronic components such as the driver integrated circuit 16 is effectively radiated to the entire inside of the housing 12.

According to the present embodiment, by providing the heat transfer section 26, heat generated from electronic components such as the driver integrated circuit 16 can be efficiently radiated to the upper housing section 50 of the disk 22. Furthermore, by providing the projecting portion 28 on the facing surface 14a, the boundary layer of the facing surface 14a is changed to turbulent flow, so that the heat transferred as described above can be efficiently radiated. Thereby, compared with the past, heat dissipation efficiency can be improved, and the temperature inside the housing 12 can be maintained at a low temperature. As a result, it is possible to prevent malfunction, failure, and destruction of the electronic device due to the heat generated by the driver integrated circuit 16.
Further, unlike the prior art, since it is not necessary to install a fan or the like inside the housing 12, it is possible to provide an electronic device in which the disk device electronic device is reduced in size and weight.

[Second Embodiment]
Embodiments of the present invention will be described below with reference to the drawings. This embodiment is different from the above-described first embodiment in the configuration of the turbulent flow generation unit. The other configuration of the disk device 10 is the same as that of the first embodiment described above, and therefore, the same reference numerals are given to the common components, and detailed description thereof is omitted.

  FIG. 5A is a perspective view showing a schematic configuration of the disk device 10 in which the groove portion 30 is formed, and FIG. 5B is a cross section taken along the line II-II ′ of the disk device 10 shown in FIG. FIG. 5C is a graph showing the velocity distribution in the gap between the disk 22 and the chassis 14.

  As shown in FIG. 5 (a), the turbulent flow generating portion formed in the chassis 14 is constituted by a groove portion 30 having an elongated rectangular shape, and the longitudinal direction of the groove portion 30 is substantially orthogonal to the rotational direction B of the disk 22. Thus, it is formed on the facing surface 14a. Further, the groove portion 30 is disposed on the upstream side of the contact portion 26 </ b> A of the heat transfer portion 26 with respect to the rotation direction B of the disk 22.

  Also in this embodiment, the same operational effects as those of the first embodiment described above can be achieved. That is, the groove part 30 is provided downstream of the heat transfer part 26 with respect to the rotation of the disk 22 in the direction of arrow B. Therefore, as shown in FIGS. 5B and 5C, the wind generated by the rotation of the disk 22 hits the wall surface of the groove 30 and the boundary layer around the groove 30 (opposing surface 14a) changes from laminar flow to turbulent flow. To do. As a result, the heat of the driver integrated circuit transferred through the heat transfer unit 26 can be efficiently dissipated into the housing 12 by turbulent flow.

[Third Embodiment]
Embodiments of the present invention will be described below with reference to the drawings. This embodiment is different from the above-described first embodiment in the configuration of the turbulent flow generation unit. The other configuration of the disk device 10 is the same as that of the first embodiment described above, and therefore, the same reference numerals are given to the common components, and detailed description thereof is omitted.

  6A is a perspective view showing a schematic configuration of the disk device 10 in which the groove 32 is formed, and FIG. 6B is a cross-sectional view taken along the line III-III ′ of the disk device 10 shown in FIG. FIG. 6C is a graph showing the velocity distribution in the gap between the disk 22 and the chassis 14.

  As shown in FIG. 6A, the turbulent flow generating portion is composed of an elongated rectangular groove portion 32 formed in the chassis 14, and the longitudinal direction of the groove portion 32 is substantially the rotational direction C of the disk 22. An array is formed so as to be parallel. Moreover, the groove part 32 is arrange | positioned in the opposing surface 14a so that it may overlap with the contact part 26A of the heat-transfer part 26 in planar view in the longitudinal direction.

  Also in this embodiment, the same operational effects as those of the first embodiment described above can be achieved. That is, the groove part 32 mentioned above is provided in the position which overlaps with the heat-transfer part 26 by planar view. Therefore, as shown in FIGS. 6B and 6C, the wind generated by the rotation of the disk 22 hits the wall surface of the groove 32, and the boundary layer around the groove 32 (opposing surface 14a) changes from laminar flow to turbulent flow. To do. As a result, the heat of the driver integrated circuit transferred through the heat transfer unit 26 can be efficiently dissipated into the housing 12 by turbulent flow.

[Fourth Embodiment]
Embodiments of the present invention will be described below with reference to the drawings. This embodiment is different from the above-described first embodiment in the configuration of the turbulent flow generation unit. The other configuration of the disk device 10 is the same as that of the first embodiment described above, and therefore, the same reference numerals are given to the common components, and detailed description thereof is omitted.

  FIG. 7A is a perspective view showing a schematic configuration of the disk device 10 in which the uneven portion 34 is formed, and FIG. 7B is along the IV-IV ′ line of the disk device 10 shown in FIG. FIG. 7C is a cross-sectional view, and FIG. 7C is a graph showing the velocity distribution in the gap between the disk 22 and the chassis 14.

  As shown in FIGS. 7A and 7B, the turbulent flow generation portion is a concavo-convex portion 34 composed of a groove portion 34a and a projection portion 34b formed in the chassis 14 and having an elongated rectangular shape. The concavo-convex portion 34 is formed on the facing surface 14 a so that the longitudinal direction thereof is substantially orthogonal to the rotational direction D. The uneven portion 34 is disposed on the upstream side of the contact portion 26 </ b> A of the heat transfer portion 26 with respect to the rotation direction D of the disk 22.

  Also in this embodiment, the same operational effects as those of the first embodiment described above can be achieved. That is, the uneven portion 34 described above is provided downstream of the heat transfer portion 26 with respect to the rotation of the disk 22 in the direction of arrow D. Therefore, as shown in FIGS. 7B and 7C, the wind generated by the rotation of the disk 22 hits the wall surface of the uneven portion 34, and the boundary layer around the uneven portion 34 (opposing surface 14a) is turbulent from laminar flow. To change. As a result, the heat of the driver integrated circuit transferred through the heat transfer unit 26 can be efficiently dissipated into the housing 12 by turbulent flow.

[Fifth Embodiment]
Embodiments of the present invention will be described below with reference to the drawings. This embodiment is different from the above-described first embodiment in the configuration of the turbulent flow generation unit. The other configuration of the disk device 10 is the same as that of the first embodiment described above, and therefore, the same reference numerals are given to the common components, and detailed description thereof is omitted.

  FIG. 8A is a perspective view showing a schematic configuration of the disk device 10 in which the protrusions 36 are formed, and FIG. 8B is along the line VV ′ of the disk device 10 shown in FIG. FIG. 8C is a graph showing the velocity distribution in the gap between the disk 22 and the chassis 14.

  The turbulent flow generating portion is configured by a plurality of cylindrical protrusions 36 formed on the chassis 14. As shown in FIG. 8A, the plurality of protrusions 36 are arranged on a straight line in a direction substantially orthogonal to the rotation direction E, and contact portions of the heat transfer unit 26 with respect to the rotation direction E It arrange | positions upstream from 26A.

  Also in this embodiment, the same operational effects as those of the first embodiment described above can be achieved. That is, the above-described heat transfer section 26 is provided on the downstream side of the protrusion 36 with respect to the rotation of the disk 22 in the direction of arrow E. Therefore, as shown in FIGS. 8B and 8C, the wind generated by the rotation of the disk 22 hits the protrusion 36, and the boundary layer around the protrusion 36 (opposing surface 14a) changes from laminar flow to turbulent flow. To do. As a result, the heat of the driver integrated circuit transferred through the heat transfer unit 26 can be efficiently dissipated into the housing 12 by turbulent flow.

[Sixth Embodiment]
Embodiments of the present invention will be described below with reference to the drawings. This embodiment is different from the above-described first embodiment in the configuration of the turbulent flow generation unit. The other configuration of the disk device 10 is the same as that of the first embodiment described above, and therefore, the same reference numerals are given to the common components, and detailed description thereof is omitted.

  FIG. 9A is a perspective view showing a schematic configuration of the disk device 10 in which the protrusions 38 are formed, and FIG. 9B is along the VI-VI ′ line of the disk device 10 shown in FIG. 9A. FIG. 9C is a cross-sectional view, and FIG. 9C is a graph showing the velocity distribution in the gap between the disk 22 and the chassis 14.

  The turbulent flow generation part is composed of a plurality of protrusions 38 forming a quadrangular prism formed in the chassis 14. As shown in FIG. 9A, the plurality of protrusions 38 are arrayed on a straight line in a direction substantially orthogonal to the rotation direction F, and contact portions of the heat transfer unit 26 with respect to the rotation direction F. It arrange | positions upstream from 26A.

  Also in this embodiment, the same operational effects as those of the first embodiment described above can be achieved. That is, the heat transfer section 26 described above is provided on the downstream side of the protrusion 38 with respect to the rotation of the disk 22 in the direction of arrow F. Therefore, as shown in FIGS. 9B and 9C, the wind generated by the rotation of the disk 22 hits the protrusion 38, and the boundary layer around the protrusion 38 (opposing surface 14a) changes from laminar flow to turbulent flow. To do. As a result, the heat of the driver integrated circuit transferred through the heat transfer unit 26 can be efficiently dissipated into the housing 12 by turbulent flow.

[Seventh Embodiment]
Embodiments of the present invention will be described below with reference to the drawings. This embodiment is different from the above-described first embodiment in the configuration of the turbulent flow generation unit. The other configuration of the disk device 10 is the same as that of the first embodiment described above, and therefore, the same reference numerals are given to the common components, and detailed description thereof is omitted.

  FIG. 10A is a perspective view showing a schematic configuration of the disk device 10 in which the protrusions 40 are formed, and FIG. 10B is along the VII-VII ′ line of the disk device 10 shown in FIG. FIG. 10C is a graph showing the velocity distribution in the gap between the disk 22 and the chassis 14.

  The turbulent flow generating portion is composed of a plurality of protrusions 40 formed of a hemispherical cylinder with a tip formed on the chassis 14. As shown in FIG. 10A, the plurality of protrusions 40 are arrayed on a straight line in a direction substantially orthogonal to the rotation direction G and contact portions of the heat transfer unit 26 with respect to the rotation direction G. It arrange | positions upstream from 26A.

  Also in this embodiment, the same operational effects as those of the first embodiment described above can be achieved. That is, the heat transfer section 26 described above is provided on the downstream side of the protrusion 40 with respect to the rotation of the disk 22 in the direction of arrow G. Therefore, as shown in FIGS. 10B and 10C, the wind generated by the rotation of the disk 22 hits the protrusion 40, and the boundary layer around the protrusion 40 (opposing surface 14 a) is efficiently converted from laminar flow to turbulent flow. Thus, heat can be dissipated inside the housing 12.

[Eighth Embodiment]
Next, a configuration and a heat dissipation result when the above-described protrusion 60 or groove 80 is formed in the second chassis 64 of the disk device 100 will be described. FIG. 11A is a diagram showing the configuration of the disk accommodating portion 82 of the disk device 100, and FIG. 11B is an enlarged view of the main part of the protrusion 60 formed on the second chassis 64. FIG. 12A is a diagram showing a configuration of the disk accommodating portion 82 of the disk device 100, and FIG. 12B is an enlarged view of a main portion of the groove portion 80 formed in the second chassis 64. FIG.

First, the case where the protrusion 60 is formed will be described.
As shown in FIG. 11A, a drive motor 66 is disposed at a substantially central portion of the disk housing portion 82 of the disk device 100. A turntable 68 having a disk chuck is attached to the rotating shaft of the drive motor 66. A first chassis 62 made of a substantially U-shaped copper plate is provided on the outer periphery of the turntable 68, and a second chassis 64 made of a substantially L-shaped injection molding resin is provided on the right side of the first chassis 62. Provided. A disc (not shown) is mounted on the turntable 68.

The heat transfer section 70 is in contact with the substantially central portion of the back surface of the second chassis 64, and heat generated from electronic components such as a driver integrated circuit is transferred to the second chassis 64 via the heat transfer section 70. It is. On the surface of the second chassis 64, a plurality of protrusions 60 are arranged at equal intervals along the upper side of the heat transfer unit 70. The plurality of protrusions 60 are formed on the upstream side of the heat transfer unit 70 with respect to the wind flow direction (arrow H direction) due to the rotation of the disk. In addition, since the injection molding resin is used as the material of the second chassis 64, the protrusion 60 can be formed simultaneously with the molding of the second chassis 64. As shown in FIG. 11B, the width of the protrusion 60 is preferably 1.8 mm, and the interval between adjacent protrusions 60 is preferably 1 mm. Further, the height of the projection 60 is preferably 1 mm to 1.5 mm, more preferably 1 mm. Thereby, a turbulent flow can be efficiently generated without bringing the protrusion 60 into contact with the disk.
Next, the case where the groove part 80 is formed will be described. Since the basic configuration is the same as that of the disk device 100 described above, a description of common parts is omitted.

  As shown in FIG. 12A, a plurality of groove portions 80 are provided at equal intervals along the upper side of the heat transfer portion 70 on the surface of the second chassis 64. The plurality of groove portions 80 are formed on the upstream side of the heat transfer portion 70 with respect to the wind flow direction (arrow I direction) due to the rotation of the disk. As shown in FIG. 12B, the width of the groove 80 is preferably 1.8 mm, and the interval between adjacent grooves 80 is preferably 1 mm. Further, the depth of the groove 80 is preferably 1 mm to 1.5 mm, more preferably 1 mm.

  Next, a simulation result of the temperature distribution of the disk housing portion of the disk device 100 in which the protrusion 60 or the groove 80 described above is formed and the conventional disk device 200 in which the protrusion 60 and the groove 80 are not formed will be compared.

  FIG. 13 is a diagram showing a simulation result of the temperature distribution of the disk housing portion of the conventional disk device 200, and FIG. 14 is a simulation result of the temperature distribution of the disk housing portion when the protrusion 60 shown in FIG. 11 is formed. FIG. 15 is a simulation result of the temperature distribution of the disk housing portion when the groove 80 shown in FIG. 12 is formed.

  When the protrusion 60 is formed, as shown in FIG. 14, the disk device 200 shown in FIG. 13 is provided on the opposing surface 64a of the second chassis 64 downstream of the protrusion 60 with respect to the disk rotation direction. It can be seen that the region exhibiting a high temperature is smaller and the heat dissipation effect is higher than the opposite surface 202a.

  When the groove portion 80 is formed, as shown in FIG. 15, the disk device 200 shown in FIG. 13 is formed on the opposing surface 64a of the second chassis 64 on the downstream side of the groove portion 80 with respect to the disk rotation direction. It can be seen that the region showing high temperature is smaller than that of the opposite surface 202a, and the heat dissipation effect is enhanced as in the case where the protrusions 60 are formed.

  As described above, when the protruding portion 60 or the groove portion 80 is formed on the facing surface 64a of the second chassis 64, the boundary layer generated on the facing surface 64a can be changed to turbulent flow, thereby improving the thermoelectric efficiency. Thus, a sufficient heat dissipation effect can be obtained.

  Next, when no measures are taken with respect to the temperature of the LSI (Large-scale Integration, electronic component) built in the disk device 100 when the protrusion 60 and the groove 80 described above are formed, only the heat transfer section 70 is used. A description will be made in comparison with the case where the above is provided.

  FIG. 16 is a graph showing the temperature distribution of an LSI (electronic component) built in the disk device 100. In FIG. 16, the vertical axis represents the LSI temperature, and the horizontal axis represents the LSI type. As shown in FIG. 16, for example, when the protrusion 60 and the heat transfer unit 70 are provided by LSI_A, the temperature is lowered by about 1.5 ° C. compared to when no countermeasure is taken, and only the heat transfer unit 70 is provided. It can be seen that the temperature is lowered by about 1 ° C. compared to the time. It can be seen that the other LSI_B to LSI_G can achieve the same effect as LSI_A. As described above, it can be seen that the heat transferred from the driver integrated circuit 16 is efficiently radiated from the facing surface 64a of the disk accommodating portion 82 by providing the protrusion 60 and the heat transfer portion 70. Moreover, even when the groove part 80 and the heat transfer part 70 are provided, as shown in FIG. 16, the same effect as that obtained when the protrusion part 60 and the heat transfer part 70 are provided can be obtained.

It is a figure which shows the structure of the disc apparatus which concerns on one Embodiment of this invention. It is a figure which shows the thermal radiation operation | movement at the time of forming a projection part in the disk accommodating part surface. It is a figure for demonstrating a boundary layer. It is a figure for demonstrating the turbulent flow layer at the time of forming a projection part in the disk accommodating part surface. It is a figure which shows the structure of the disc apparatus which concerns on the 2nd Embodiment of this invention. It is a figure which shows the structure of the disc apparatus which concerns on the 3rd Embodiment of this invention. It is a figure which shows the structure of the disc apparatus based on the 4th Embodiment of this invention. It is a figure which shows the structure of the disc apparatus which concerns on the 5th Embodiment of this invention. It is a figure which shows the structure of the disc apparatus based on the 6th Embodiment of this invention. It is a figure which shows the structure of the disc apparatus based on the 7th Embodiment of this invention. It is a figure which shows the structure of the disc accommodating part of the disc apparatus which concerns on 8th Embodiment of this invention (the 1). It is a figure which shows the structure of the disk accommodating part of a disk apparatus (the 2). It is a figure which shows the simulation result of the temperature distribution of the conventional disc accommodating part. It is a figure which shows the simulation result of the temperature distribution of the disc accommodating part at the time of forming a projection part. It is a figure which shows the simulation result of the temperature distribution of the disc accommodating part at the time of forming a groove part. It is a graph which shows the temperature of LSI built in a disk apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Disk apparatus, 12 ... Housing, 14 ... Chassis, 14a ... Opposite surface, 16 ... Driver integrated circuit, 18 ... Motor, 22 ... Disk, 26 ... Heat transfer portion, 26A ... contact portion, 28 ... projection portion, 30 ... groove portion, 32 ... groove portion, 34 ... uneven portion, 36 ... projection portion, 38 ... projection 40 ... projection, 50 ... upper housing, 52 ... lower housing, 60 ... projection, 62 ... first chassis, 64 ... second chassis, 66 ... Drive motor, 70 ... Heat transfer part, 80 ... Groove part, 82 ... Disk housing part, 100 ... Disk device, O ... Rotary shaft

Claims (9)

An upper accommodating portion for accommodating a disk-shaped recording medium;
A rotational drive unit that rotationally drives the disk-shaped recording medium and is housed in a lower housing part that is below the upper housing part and partitioned from the upper housing part ;
A heat dissipating part provided in at least a part of a region where the wind generated by rotation of the disc-shaped recording medium is provided in the upper housing part ;
A heat transfer section for transferring heat generated from an electronic component to the heat dissipation section provided in the lower housing section ; and
A turbulent flow generating section that changes the wind generated by the rotation of the disk-shaped recording medium that has flowed through the heat radiating section into turbulent flow ,
The electronic component is attached to the lower housing portion in a two-stage configuration, a heat dissipation sheet is provided on the upper surface of the upper electronic component, and the heat transfer portion is provided on the heat dissipation sheet. apparatus.   The turbulent flow generation unit is provided upstream of a contact portion of the heat transfer unit that is in contact with the heat dissipation unit with respect to a rotation direction of the disc-shaped recording medium. The disk device described. The disk device according to claim 1, wherein the upper electronic component is a plurality of driver integrated circuits .   The disk device according to claim 1, wherein the heat radiating portion is a surface of the housing portion at a position facing the disk-shaped recording medium. The turbulent flow generation part is a protrusion,
2. The disk device according to claim 1, wherein the height of the protrusion is 1.0 mm to 1.5 mm. The turbulent flow generation part is a groove part,
2. The disk device according to claim 1, wherein the groove has a depth of 1.0 mm to 1.5 mm.   The disk device according to claim 1, wherein the heat transfer section is made of copper or aluminum.   The disk device according to claim 1, wherein the heat transfer unit is a heat pipe.   The disk apparatus according to claim 1, wherein the heat transfer unit is a graphite device.

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