JP4808510B2 - Substrate crack detection device and substrate processing device - Google Patents

Description

  The present invention incorporates a substrate crack detection device suitable for a substrate processing apparatus that performs various processes while conveying a substrate such as a glass substrate for a liquid crystal display device (LCD) or a plasma display device (PDP), and the substrate crack detection device. The present invention relates to a substrate processing apparatus.

Conventionally, various devices for detecting cracks, chips, etc. (hereinafter simply referred to as cracks) generated on a substrate to be processed have been considered. For example, Patent Document 1 discloses a projector and a light receiver. A substrate crack that detects whether or not a crack has occurred in a substrate based on a change in a light receiving level of a light receiver when a piece (shard) of a semiconductor substrate passes through the optical path of the sensor using the optical sensor provided A detector is disclosed.
Japanese Patent No. 2953850

  In recent years, in processing apparatuses such as LCD and PDP glass substrates, various processes have been performed while transporting the substrate from the viewpoint of efficiency. In this type of apparatus, the substrate is cracked. As a result, transportation troubles will cause equipment failure, or wasteful processing will be performed on unusable substrates, so it will be early before substrate processing begins, that is, when the substrate is loaded into the processing equipment from the previous process. It is preferable to detect the cracked substrate and line out. In addition, cracks may occur during processing. In such a case, it is desirable to quickly prevent the substrate from moving to the next process.

  Therefore, in order to be able to detect a crack in the substrate efficiently and with a simple configuration before the substrate is carried into the processing apparatus or before being carried out to the next process, for example, an optical type as disclosed in Patent Document 1. Although it is possible to detect the crack of a board | substrate using a sensor, the said patent document 1 is not disclosed about the specific structure in such a case. Note that, as in Patent Document 1, if an optical sensor is used to detect a crack while the substrate is being transported, for example, if the substrate transport speed is fast or the crack is fine, it corresponds to the crack. Detection of cracks becomes difficult because the change in the received light level is fine (short in time). For example, in relation to the sampling period (detection period) of the received light signal, if the change in the received light level becomes finer, the change may not be detected. In this case, cracks cannot be detected. Is also not disclosed in Patent Document 1.

  The present invention has been made to solve the above-described problems. For a substrate immediately before being transferred to the next process after the substrate is loaded into the substrate processing apparatus or the like, the substrate is cracked. An object of the present invention is to make it possible to detect (breaks, chips, etc.) more efficiently and more reliably with a simple configuration.

In order to solve the above-mentioned problem, the present invention is a substrate crack detection device arranged at the transfer start position of a device that transfers a substrate from a predetermined transfer start position to a transfer stop position along a transfer path, A first unit that outputs a signal based on the light receiving state of the light received by the light receiving unit, including an irradiating unit capable of irradiating light on the front end in the transport direction with respect to the substrate set at the transport start position. A signal output unit; an irradiation unit capable of irradiating light to a rear end portion in the transport direction with respect to the substrate set at the transport start position; and a light receiving unit for the light. A second signal output means for outputting a signal based on the first and second signal output means, and an irradiation means for irradiating light toward the substrate set at the transfer start position; Means, Yes third signal output means for outputting a signal based on a light receiving state of light, and a crack detector for detecting a crack in the substrate based on the signal output from the first and second signal output means by the receiving means The first signal output means has an output signal larger than a minimum time width that can be processed by the crack detection means when the light receiving state of the light receiving means changes from a state without a substrate to a state with a substrate. as a signal having a time width, always all SANYO for a certain period delayed signal output corresponding to the change, the third signal output means, said irradiation means irradiation position of by said first signal output The crack detection means detects the trailing edge of the substrate based on the signal output from the third signal output means. Rutotomoni, after the transport of the substrate which is set in the transport start position is started, a shall be terminated process crack detection with respect to the substrate based on the detection of the rear end (claim 1).

According to this apparatus, the substrate is set from the outside with respect to the conveyance start position, and further, the crack detection means based on the output signal of each signal output means until the substrate is unloaded from the conveyance start position along the conveyance path. Cracks are detected. That is, when the substrate is set from the outside to the transfer start position, the output signal of each signal output means changes from the state without the substrate to the state with the substrate, but at that time, when the substrate is cracked Since the corresponding output signal does not change, the crack detecting means detects the crack at the front end portion or the rear end portion of the substrate. Also, if there is a crack in the middle part of the substrate (the middle part of the substrate in the transport direction), after the substrate transport is started, the output signal from the first signal output means temporarily changes to the state without the substrate and the substrate is again In order to return to the existing state, the crack detecting means detects a crack at the midway portion. At this time, the first signal output means delays the signal output for a certain period so that the output signal becomes a signal having a time width larger than the minimum time width that can be processed by the crack detection means. Even if the crack is fast or the crack is extremely fine, the crack detection means can reliably detect the crack based on the output signal.
Particularly in this configuration, third signal output means is provided separately from the first and second signal output means, and the crack detection means detects the rear end of the substrate based on the signal output from the third signal output means. As described in detail in the embodiments of the present invention, the substrate is transported in an oblique state with respect to the transport direction. It is possible to effectively avoid erroneous detection and improve crack detection reliability.

Another substrate crack detection device of the present invention is a substrate crack detection device disposed at the transport start position of a device that transports a substrate from a predetermined transport start position to a transport stop position along a transport path, An irradiating unit capable of irradiating light on the front end in the transport direction with respect to the substrate set at the transport start position and a light receiving unit for the light, and outputs a signal based on a light receiving state of the light by the light receiving unit; 1 signal output means, an irradiation means capable of irradiating light to a rear end portion in the transport direction with respect to the substrate set at the transport start position, and a light receiving means for the light, and a light receiving state by the light receiving means A second signal output means for outputting a signal based on the first and second signal output means, an irradiation means for irradiating light toward the substrate set at the transfer start position, and the light Including light receiving means Yes third signal output means for outputting a signal based on a light receiving state of light by the light receiving unit, and a crack detector for detecting a crack in the substrate based on the signal output from the first and second signal output means The first signal output means has a time width that is always larger than the minimum time width that can be processed by the crack detection means when the light receiving state of the light receiving means changes from a state without a substrate to a state with a substrate. der outputs the signal having the is, the third signal output means, in the substrate transfer direction from the irradiation position of the light by the irradiation unit of the irradiation position of the light by the irradiation means the first signal output means Set on the upstream side, the crack detection means detects the rear end of the substrate based on the signal output from the third signal output means, and transports the substrate set at the transport start position. After being started, it is shall be terminated process crack detection with respect to the substrate based on the detection of the rear end (claim 2).

In the case of this apparatus as well, cracks are detected by the crack detection means based on the output signals of the signal output means. That is, when the substrate is set from the outside to the transfer start position, the light receiving state of each signal output means changes from the state without the substrate to the state with the substrate, so the crack detection means responds to this. Based on whether or not the output signal is output from each signal output means, a crack at the front end or rear end of the substrate is detected. Also, if there is a crack in the middle part of the substrate (the middle part of the substrate in the transport direction), after the transport of the substrate is started, the output signal from the first signal output means once changes to the state without the substrate and again. In order to return to the state with the substrate, a signal corresponding to this is output from the first signal output means, and cracks are detected by the crack detection means based on this signal. At that time, the first signal output means is configured to output a signal having a time width that is always larger than the minimum time width that can be processed by the crack detection means. Even if it is extremely fine, the crack detection means can reliably detect a crack based on the signal.
Also in this configuration, the third signal output means is provided separately from the first and second signal output means, and the crack detection means is provided on the back of the substrate based on the signal output from the third signal output means. Since the edge is detected, it is possible to effectively avoid erroneous detection of cracks at the rear edge of the substrate when so-called oblique conveyance occurs, and to improve crack detection reliability.

  In these substrate crack detection devices, each of the first and second signal output means includes a plurality of signal output means, and the irradiation position of the irradiation means of the first and second signal output means is: It is preferable that the substrate is set at a position including at least both ends in the width direction of the substrate perpendicular to the substrate transport direction.

  That is, since the corner portion of the substrate is likely to be cracked, according to the configuration in which the light irradiation position of the irradiation means in each signal output means is set to a position including at least both ends in the width direction of the substrate as described above. It becomes possible to quickly detect such a crack at the corner.

Further, the present invention is a substrate crack detection device that is disposed at the transport stop position of a device that transports a substrate from a predetermined transport start position to a transport stop position along a transport path, and is set at the transport stop position. A first 'signal output means for outputting a signal based on the light receiving state of the light by the light receiving means; It includes an irradiating means capable of irradiating light to the rear end portion in the transport direction with respect to the substrate set at the transport stop position, and a light receiving means for the light, and outputs a signal based on the light receiving state of the light receiving means. Irradiation means provided separately from the second 'signal output means and the first' and second 'signal output means and capable of irradiating light toward the substrate while the substrate is stopped at the transport stop position And the light receiving means See, for detecting the third 'signal output means and said first' cracking of the substrate on the basis of the signals output from the and the second 'signal outputting means for outputting a signal based on a light receiving state of light by the light receiving means cracking And the second 'signal output means has a minimum time width that can be processed by the crack detection means when the light receiving state of the light receiving means changes from a state with a substrate to a state without a substrate. der outputs the signal with always greater duration than is, the third 'signal output means, the irradiation position of the light by the irradiation unit is the second' by light the irradiation unit of the signal output means It is set downstream of the irradiation position in the substrate transport direction, and the crack detection means detects the tip of the substrate based on the signal output from the third 'signal output means, and the tip of the substrate being transported Based on the detection is shall be start processing the crack detection of the substrate (claim 4).

According to this apparatus, the crack detecting means detects the crack based on the output signals of the signal output means until the substrate is set at the transport stop position while being transported. That is, if there is a crack in the middle or rear end of the substrate, the light receiving state of the second 'signal output means is not changed from the state with the substrate until the substrate is set at the conveyance stop position. Since the state changes and a signal corresponding to the state is output from the second 'signal output means, the crack detection means detects the crack. In addition, since the 2 'signal output means always outputs a signal having a time width that is larger than the minimum time width that can be processed by the crack detection means, the substrate is transported at a high speed or the crack is extremely fine. Even so, the crack detection means can reliably detect a crack based on the signal. When the substrate is further conveyed and the substrate completely reaches the conveyance stop position, the output signal of the first 'signal output means changes from the state without the substrate to the state with the substrate. In some cases, the corresponding output signal does not change, so that the crack detection means detects a crack at the tip of the substrate.
In particular, in this configuration, 3 'signal output means is provided separately from the 1' and 2 'signal output means, and the crack detection means is based on the signal output from the 3' signal output means. Since the front end is detected, as described in detail in the embodiments of the invention, the substrate is transported in an oblique state with respect to the transport direction. It is possible to effectively avoid crack detection and improve crack detection reliability.

Further, another substrate crack detection device of the present invention is a substrate crack detection device arranged at the transport stop position of a device that transports a substrate from a predetermined transport start position to a transport stop position along a transport path. , Including an irradiating means capable of irradiating light on the front end in the transport direction with respect to the substrate set at the transport stop position and a light receiving means for the light, and outputting a signal based on the light receiving state of the light receiving means A first 'signal output means; an irradiating means capable of irradiating the rear end of the substrate in the transport direction with respect to the substrate set at the transport stop position; and a light receiving means for the light. The second 'signal output means for outputting a signal based on the light receiving state and the first' and second 'signal output means are provided separately from each other and are directed to the substrate while the substrate is stopped at the transport stop position. Can be illuminated And a light receiving means means and the light, 'and the signal output means, the first' third to output a signal according to a light receiving state of light by the light receiving means and the signal output from the and the second 'signal outputting means And the second 'signal output means outputs an output signal when the light receiving state by the light receiving means changes from a state without a substrate to a state with a substrate. There all SANYO for a certain period delayed signal output corresponding to the always the change as a signal having a larger time width than processible minimum time width by the crack detection unit, the third 'signal output means The light irradiation position by the irradiation means is set downstream of the light irradiation position by the irradiation means of the second ′ signal output means in the substrate transport direction, and the crack detection means outputs the third ′ signal output. With detecting the leading edge of the substrate on the basis of a signal output from the stage, a shall be start processing the crack detection of the substrate based on the detection of the leading end of the substrate being transported (claim 5).

Also in this apparatus, the crack detection means detects the crack based on the output signal of each signal output means until the substrate is set to the transfer stop position while being transferred. That is, if there is a crack in the middle part of the substrate, the output signal from the second 'signal output means changes to the state with the substrate before the substrate is set at the conveyance stop position, and then the substrate temporarily Since the state is changed to the state without a substrate and the substrate is returned to the state with the substrate again, the crack detecting means detects the crack. In addition, at that time, the second 'signal output means always changes the output signal so that the output signal becomes a signal having a time width larger than the minimum time width that can be processed by the crack detection means (ie, from the no substrate state to the present state). In order to delay the signal output corresponding to (change) for a certain period, the crack detection means reliably detects the crack based on the output signal even if the substrate transport speed is high or the crack is extremely fine. It becomes possible. When the substrate further moves and the substrate is set at the conveyance stop position, the output signal of the first 'signal output means changes from the state without the substrate to the state with the substrate, but there is a crack at the tip of the substrate. In this case, since the corresponding output signal does not change, the crack detection means detects a crack at the tip of the substrate.
Also in this configuration, a third 'signal output means is provided separately from the first' and second 'signal output means, and the crack detection means is used as a signal output from the third' signal output means. Since the front end of the substrate is detected based on this, it is possible to effectively avoid the erroneous detection of the crack at the front end of the substrate when so-called oblique conveyance occurs, and to improve the detection reliability of the crack.

These substrate crack detection devices include a plurality of signal output means as the first 'and second' signal output means, respectively, and the light of the irradiation means of the first 'and second' signal output means. It is preferable that the irradiation position is set to a position including at least both ends in the width direction of the substrate orthogonal to the substrate transport direction (Claim 6 ).

  That is, since the corner portion of the substrate is likely to be cracked, according to the configuration in which the light irradiation position of the irradiation means in each signal output means is set to a position including at least both ends in the width direction of the substrate as described above. It becomes possible to quickly detect such a crack at the corner.

  In addition, in the description of the above-mentioned claim, “including the irradiation unit capable of irradiating light to the substrate and the light receiving unit” refers to receiving reflected light while irradiating the substrate with light from the irradiation unit. This means both a structure for receiving light by the means and a structure for receiving the transmitted light while irradiating the substrate with light from the irradiation means.

On the other hand, a substrate processing apparatus according to the present invention includes a substrate transport path, a processing unit that performs a predetermined process on the substrate transported along the transport path, and a substrate transported along the transport path. A substrate processing apparatus including a substrate crack detection device that detects a crack, wherein the substrate crack detection device is disposed at a substrate transfer start position in the transport path, and the substrate crack detection device is the above (claim) The substrate crack detection device according to any one of Items 1 to 3 is provided (Claim 7 ).

  According to this configuration, it is possible to detect a crack in the substrate and line it out immediately before processing by the processing means.

Another substrate processing apparatus according to the present invention is transported along the transport path of the substrate, processing means for performing a predetermined process on the substrate transported along the transport path, and the transport path. A substrate processing apparatus including a substrate crack detection device for detecting a substrate crack, wherein the substrate crack detection device is disposed at a substrate transport stop position in the transport path, and the substrate crack detection device is described above. A substrate crack detection device according to any one of claims 4 to 6 is provided (claim 8 ).

  According to this configuration, after the processing by the processing means, it is possible to detect a crack in the substrate and quickly line out the substrate before the substrate is carried out to the next process apparatus.

According to the substrate crack detection device according to claims 1 to 3 of the present invention, the substrate is set from the outside with respect to the transport start position, and further, the substrate is unloaded from the transport start position along the transport path. It is possible to detect a crack of the substrate satisfactorily using the gap. In addition, since the first and second signal output means each having the irradiation means and the light receiving means for irradiating light to the substrate are provided and the crack of the substrate is detected based on the signal output state, the crack of the substrate can be realized with a simple configuration. Can be detected. In addition, since the first signal output means outputs a signal having a time width that is always larger than the minimum time width that can be processed by the crack detection means as a signal corresponding to the crack of the substrate, the crack of the substrate is prevented. It is also possible to detect with high accuracy.

Further, according to the substrate crack detection apparatus according to claims 4 to 6 of the present invention, it is possible to satisfactorily detect the crack of the substrate by using the time until the substrate is set at the transport stop position while being transported. In addition, since the first 'and second' signal output means each having irradiation means for irradiating light to the substrate and light receiving means are provided, and cracking of the substrate is detected based on the signal output state, the substrate can be configured with a simple configuration. Can be detected. In addition, the second 'signal output means outputs a signal having a time width that is always larger than the minimum time width that can be processed by the crack detection means as a signal corresponding to the crack of the board. It is also possible to detect cracks with high accuracy.

In addition, according to the substrate processing apparatus according to claim 7 or claim 8 of the present invention, since the above-described substrate crack detection device is provided, the substrate is quickly cracked at the transport start position or the transport stop position. It is possible to detect and line out. For this reason, it is possible to prevent the occurrence of troubles and the like due to subsequent processing of the substrate with cracks.

  Embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 schematically shows a substrate processing apparatus according to the present invention (a substrate processing apparatus incorporating a substrate crack detection apparatus according to the present invention).

  As shown in the figure, the substrate processing apparatus 1 includes a substrate introduction unit 2, a processing unit 3 (corresponding to the processing means according to the present invention) and a substrate lead-out unit 4 in series, and a transport mechanism that transports the substrate B. The substrate B introduced into the substrate introduction unit 2 is subjected to various processes in the processing unit 3 while being transported by the transport mechanism, and is then derived from the substrate lead-out unit 4 to the next process. Has been. In addition, the conveyance mechanism is comprised from the roller conveyor 5, for example, and the conveyance path which concerns on this invention is comprised by this roller conveyor 5. FIG.

  An upstream takeover device 10 and an upstream crack detection device 11 are arranged in the substrate introduction part 2. The upstream transfer device 10 introduces the substrate B into the substrate introduction unit 2 and has, for example, a robot hand and is configured to support the substrate B by the robot hand and place it on the conveyor 5. . A lift pin is provided on the conveyor 5 side so as to be able to go up and down (up and down), and after the substrate B is transferred from the robot hand onto the lift pin, the lift pin is lowered to be placed on the conveyor 5. It has become so.

  The upstream crack detection device 11 (corresponding to the substrate crack detection device according to the present invention) detects a crack in the substrate B introduced into the substrate introduction unit 2, and is a predetermined transfer start position P1, that is, the robot hand. The substrate B is fixedly arranged below the loading position of the substrate B, more specifically below the conveyor 5, and detects a crack (including a chip) of the substrate B loaded into the conveyance start position P1 in a non-contact manner. It is configured as follows. The upstream crack detection device 11 will be described in detail later.

  In the present embodiment, the processing unit 3 is composed of a chemical washing unit 3A, a water washing unit 3B, and a drying unit 3C. These units 3A to 3C are arranged in this order on the upstream side in the transport direction of the substrate B (hereinafter simply upstream). (Referred to as “side”).

  The chemical washing section 3A is for supplying a predetermined chemical solution to the front and back of the substrate B conveyed by the conveyor 5 to wash the substrate B (chemical washing), and a plurality of chemical solution supply nozzles on both upper and lower sides of the conveyor 5 21 and a brush 22 for brushing processing.

  The washing unit 3B supplies washing water to the substrate B transported by the conveyor 5 for washing (washing), and the inside thereof is sequentially from the upstream side, the low-pressure water supply unit 24, the high-pressure water supply unit 25, and the ultrasonic wave. The water is divided into a cleaning water supply unit 26 and a pure water supply unit 27, and nozzles 24 a to 27 a for supplying cleaning water and the like are arranged on the upper and lower sides of the conveyor 5 in each of the supply units 24 to 27.

  The drying unit 3C performs a drying process on the substrate B derived from the water washing unit 3B (pure water supply unit 27), and a pair of upper and lower air knives 28 are arranged inside the conveyor 5 so as to sandwich the conveyor 5. Yes.

  In the substrate processing apparatus 1 of the present embodiment, the processing unit 3 is configured to mainly clean and dry the substrate B, but the specific configuration of the processing unit 3 is not limited to this, Other processing may be performed.

  A downstream takeover device 14 and a downstream crack detection device 15 are disposed in the substrate lead-out portion 4. The downstream hand-over device 14 leads the substrate B to the substrate lead-out unit 4, and has a robot hand like the upstream hand-over device 10, and picks up the substrate B on the conveyor 5 by this robot hand for the next process. It is configured to be carried out. In the substrate lead-out unit 4, lift pins are provided on the conveyor 5 so that the lift pins can be raised and lowered. The substrate B is first lifted up from the conveyor 5 by the lift pins rising, and then lifted from the lower side by the robot hand. It is picked up from the conveyor 5 in a supported state.

  The downstream crack detection device 15 (corresponding to the substrate crack detection device according to the present invention) detects a crack in the substrate B led out from the drying unit 3C to the substrate lead-out unit 4, and includes an upstream crack detection device 11 and It is similar. The downstream crack detection device 15 is fixedly disposed below a predetermined transfer stop position P2, that is, below the pickup position of the substrate B by the robot hand, specifically below the conveyor 5, and is processed by the processing unit 3. After that, it is configured to detect a crack (including a chip) of the substrate B carried into the transport stop position P2 in a non-contact manner. The downstream crack detection device 15 will be described in detail later.

  In the substrate processing apparatus 1 as described above, the substrate B introduced into the substrate introduction unit 2 (conveyance start position P1) is conveyed by the conveyor 5, and is subjected to the chemical washing process in the chemical washing unit 3A and the water washing unit 3B. After the water washing process and the drying process in the drying unit 3C are sequentially performed, the substrate is transported from the substrate introduction unit 2 (transport stop position P2) to the next process. In such a series of processes, when a crack is detected while detecting a crack in the substrate B by the upstream crack detection device 11 in the substrate introduction unit 2 and the downstream crack detection device 15 in the substrate lead-out unit 4. Immediately informs the operator and causes the substrate B to be lined out.

  Next, details of the upstream crack detection device 11 and the downstream crack detection device 15 will be described. In the following description, the positional relationship in the transport direction is “upstream” with respect to the transport direction of the substrate B. , “Downstream side” is used, and for the substrate B, the downstream side in the transport direction is referred to as the front end, and the upstream side is referred to as the rear end. For the substrate B and the transport path, the direction orthogonal to the transport direction is referred to as the width direction.

<Upstream crack detection device 11>
FIG. 2 is a block diagram showing the configuration of the upstream crack detection device 11 provided in the substrate introduction part 2. As shown in this figure, the upstream crack detection device 11 includes a first tip sensor 30A, a second tip sensor 30B, a first rear end sensor 30C, a second rear end sensor 30D, an end sensor 30E, and a control unit 38A. is doing.

  Each of the sensors 30A to 30E has a sensor amplifier 36 (appropriately using reference numerals 36a to 36e) and a sensor head 32 (appropriately using reference numerals 32a to 32e) connected to the sensor amplifier 36 via an optical fiber 35, respectively. 5 is configured to receive the reflected light while irradiating the substrate B conveyed by 5, respectively, and to output a predetermined signal corresponding to the light receiving state to the control unit 38A.

  FIG. 3 shows a specific configuration of each of the sensors 30A to 30E. As shown in the figure, the sensor amplifier 36 of each of the sensors 30A to 30E is provided with a light emitting unit 40 and a light receiving unit 42 made up of LEDs (Light Emitting Diodes) or the like. The substrate B is irradiated while being guided to the sensor head 32 via the optical fiber 35, and the reflected light reflected by the substrate B is again guided to the light receiving part 42 via the sensor head 32 and the optical fiber 35 to receive the light. It is configured.

  The sensor head 32 of each of the sensors 30 </ b> A to 30 </ b> E has a fiber head portion 33 so that the light guided from the light emitting portion 40 is irradiated onto the substrate B on the conveyor 5 from directly below. . In particular, for each of the sensor heads 32a and 32b of the tip sensors 30A and 30B, as shown in the figure, a spot lens 34 is provided at the tip of the fiber head portion 33, and a pinpoint (in this embodiment, a light projection spot) is provided. The substrate B is irradiated with light with a diameter of about 0.5 mm. This is because, as will be described later, the tip sensors 30A and 30B detect cracks in the substrate B along with the movement after the start of conveyance, and it is necessary to improve the detection accuracy. The sensor heads 32c to 32e of the other sensors 30C to 30E may be configured to be provided with the spot lens 34.

  The arrangement of the sensor heads 32a to 32e of each sensor 30A to 30E is as shown in FIG. That is, in a state where the substrate B is set at the transfer start position P1, that is, in a state where the substrate B is loaded by the robot hand and the substrate B is placed on the conveyor 5 by the lowering of the lift pins, the tip sensors 30A, 30B Each of the sensor heads 32a and 32b is arranged at the front end of the substrate B and arranged in a line in the width direction at positions corresponding to both ends in the width direction. In addition, the sensor heads 32c and 32d of the rear end sensors 30C and 30D are arranged at the rear end of the substrate B and arranged in a line in the width direction at positions corresponding to both ends in the width direction. Thereby, the irradiation position of each light of the sensor heads 32a to 32d is positioned at the corner portion of the substrate B. The sensor head 32e of the end sensor 30E is in the center of the tip of the substrate B and slightly upstream of the sensor heads 32a and 32b of the tip sensors 30A and 30B in the transport direction of the substrate B (left side in FIG. 2). Is arranged.

  Returning to FIG. 3, the signal amplifier 46 is further provided in the sensor amplifier 36 of each of the sensors 30 </ b> A to 30 </ b> E. The signal output unit 46 outputs a signal to the control unit 38A according to the light receiving state of the light receiving unit 42.

  Here, among the sensors 30A to 30E, the sensor amplifiers 36 of the rear end sensors 30C and 30D and the end sensor 30E are turned on when the light receiving level of the light receiving unit 42 is lower than a preset light receiving level. The signal output unit 46 is configured to output and output an off signal when the light reception level is exceeded. That is, as shown in FIG. 4 (signal output (no timer)), an ON signal is output when the substrate B does not exist at a position facing the sensor head 32, and OFF when the substrate B exists. A signal is output.

  On the other hand, for the sensor amplifiers 36 of the tip sensors 30A and 30B, an off-delay timer 48 is incorporated in the signal output unit 46, and is turned on when the light receiving level of the light receiving unit 42 is lower than a preset light receiving level. It is the same as the other in that it outputs a signal and outputs an off signal when it exceeds the light reception level, but unlike other ones, it only delays the change from the on signal to the off signal for a certain period. It is configured. That is, as shown in FIG. 4 (signal output (off delay timer)), when the substrate B does not exist at a position facing the sensor head 32, an ON signal is output, and when the substrate B exists. While the off signal is output, when the substrate B changes from the non-existing state to the existing state, the signal output timing is delayed by a predetermined period T1. Note that this fixed period T1, that is, the timer set value of the off-delay timer 48, is set so that the time width of the signal output when the substrate B breaks is larger than the minimum time width that can be processed by the control unit 38A. In this embodiment, for example, the time width is set to be larger than the signal sampling period (detection period) in the processing unit 38.

  That is, in this embodiment, the front end sensors 30A and 30B correspond to the first signal output means according to the present invention, and the rear end sensors 30C and 30D correspond to the second signal output means according to the present invention. The end sensor 30E corresponds to the third signal output unit according to the present invention. In the following description, signals output from the sensor amplifiers 36 of the rear end sensors 30C and 30D and the end sensor 30E are called timer non-output signals, and are output from the sensor amplifiers 36 of the front end sensors 30A and 30B. The signal will be called a timer-equipped output signal.

  The control unit 38A controls the upstream crack detection device 11 and is composed of a well-known CPU or the like that executes a logical operation, and the signals output from the sensors 30A to 30E are set in a preset sampling cycle. By detecting at (detection cycle), it is configured to detect cracks in the substrate B. That is, in this embodiment, this control part 38A is equivalent to the crack detection means which concerns on this invention.

  Although not shown, the control unit 38A is connected to a controller that comprehensively controls the substrate processing apparatus 1, and when a crack in the substrate B is detected, a signal to that effect (break detection signal) is sent to the controller. It is designed to output. In this case, the controller controls the driving of the conveyor 5 to stop the conveyance of the substrate B, and controls the driving of an alarm device (not shown) to notify the operator.

  Next, substrate crack detection control by the control unit 38A of the upstream crack detection device 11 will be described with reference to the flowchart of FIG.

  First, after waiting for the substrate B to be carried into the upper transfer start position P1 of the substrate introduction unit 2 by the robot hand of the upstream side transfer device 10, when the substrate B is carried in, the off-delay of the tip sensors 30A and 30B is performed. Waiting for the timer set value (predetermined time T1) of the timer 48, using that time, a predetermined loading completion confirmation, for example, a robot hand retraction or a lifting pin lowering completion confirmation is performed (steps S1, S2). When the time is completed, monitoring of cracks in the substrate B (that is, crack detection processing) is started in a stationary state (step S3). Specifically, detection of signals output from the front end sensors 30A and 30B and the rear end sensors 30C and 30D is started at the sampling period.

  Then, it is determined whether or not the output signals of the sensors 30A to 30D are all off signals (step S4). If NO is determined here, it is determined that the corner portion of the substrate B is cracked (step S9). ), And proceeds to step S11 to output a crack detection signal to the controller. Thereby, the conveyance of the substrate B is stopped and various alarm devices are operated to notify the operator.

  On the other hand, if YES is determined in step S4, the monitoring of the breakage of the substrate B in the stationary state is finished, the drive of the conveyor 5 is waited, and the monitoring of the breakage of the substrate B in the transfer state is started. (Step S5).

  Then, it is determined whether or not at least one of the timer-equipped output signals of the front end sensors 30A and 30B is an ON signal (step 6). If NO is determined here, the rear end of the substrate B is further the end sensor 30E. Whether or not the sensor no. Output signal of the end sensor 30E has changed from an off signal to an on signal (step S7). The monitoring of B is terminated (step S8).

  On the other hand, if YES is determined in step S6, it is determined that the substrate B has a crack (step S10), that is, it is determined that there is a crack in the portion other than the corner of the substrate B, step S11. To output a crack detection signal to the controller.

  Next, a specific example of the crack detection operation based on the control of the control unit 38A will be described together with the function and effect with reference to FIGS.

  FIG. 6 is a timing chart showing signal output states of the front end sensors 30A and 30B and the rear end sensors 30C and 30D when a normal substrate B without cracks is set at the transfer start position P1 by the robot hand.

  As shown in this figure, when the substrate B is normal, when the substrate B is carried into the transfer start position P1, the timer non-output signals of the rear end sensors 30C and 30D are turned off from the ON signal substantially simultaneously. It changes to a signal (at time t1). Then, the output signal with the timers of the tip sensors 30A and 30B changes from the ON signal to the OFF signal almost simultaneously after a predetermined time T1 (at time t2), and thereafter, any output signal is turned OFF until the substrate B is transferred. Maintained. Therefore, when the substrate B is set at the conveyance start position P1 and crack monitoring is started after the set time has elapsed (step S2 in FIG. 5), since any output signal is an off signal as described above, the control unit In 38A, it is determined that the corner portion of the substrate B is not cracked.

  On the other hand, when the substrate B is cracked, for example, as shown in FIG. 7A, the tip is a corner on one side thereof (the sensor head 32b side of the second tip sensor 30B). When the substrate B, which is a rear end and has a crack at one corner (on the sensor head 32c side of the first rear end sensor 30C), is carried into the transfer start position P1, the state shown in FIG. As shown, both the timer presence output signal of the second front end sensor 30B and the timer non-output signal of the first rear end sensor 30C remain the on signal without changing to the off signal. That is, since the light is not reflected due to the crack, the ON signal is output as it is for the second front end sensor 30B and the first rear end sensor 30C. Therefore, the control unit 38A determines that there is a crack in the front corner portion (sensor head 32b side) and the rear end corner portion (sensor head 32c side) of the substrate B.

  Next, FIG. 8 is a timing chart showing signal output states of the front end sensors 30A and 30B and the end sensor 30E after the start of transport of a normal substrate B without cracks set at the transport start position P1. It is.

  After the substrate B is set at the transfer start position P1, when the transfer is started at time t3, the substrate B moves to the downstream side, and the output signals of the end sensor 30E and the tip sensors 30A, 30B are accompanied by this movement. The switch from the off signal to the on signal is sequentially performed (at time t4 and t5), and when the output signal of the end sensor 30E is changed to the on signal, the control unit 38A ends the crack monitoring (time t4).

  During this time (from time t3 to time t4), the output signal does not change from the off signal to the on signal. Therefore, the control unit 38A determines that there are no cracks in portions other than the corners of the substrate B. . When the transfer of the substrate B is started at time t3, the timer non-output signals of the rear end sensors 30C and 30D change from the off signal to the on signal as the substrate B moves, but are omitted in the figure.

  On the other hand, for example, as shown in FIG. 9A, the substrate B has a crack in the middle thereof and at one end in the width direction (on the sensor head 32 b side of the second tip sensor 30 </ b> B). As shown in FIG. 9 (b), after the transfer of the substrate B is started, when the cracked portion passes the position of the sensor head 32b, the timer output signal of the second tip sensor 30B is It changes according to the crack (time t4 to t6). In other words, as a result of the reflected light being reduced due to cracking, the light receiving level of the light receiving unit 42 temporarily decreases. As a result, the output signal with timer of the second substrate detection sensor 30B changes from the off signal to the on signal, and then the off signal again. Thus, the control unit 38 determines that there is a crack in the middle portion of the substrate B.

  At this time, the second tip sensor 30B is configured to delay the signal output timing by a predetermined period T1 as described above when the substrate B is changed from the non-existing state to the existing state. Since the time period T1 is set so that the time width (time t4 to t6) of the signal output along with the crack of B is larger than the minimum time width that can be processed by the control unit 38A, the control unit 38A Even if the crack is fine or the substrate B is transported at a high speed, the output signal with timer (ON signal) is surely detected. Therefore, the crack in the middle part of the substrate B is reliably detected. Will be.

  In addition, the time t5 in the figure has shown the time of the crack part of the board | substrate B passing with respect to the sensor head 32b of the 2nd front-end | tip sensor 30B.

  As described above, when the substrate B set at the transfer start position P1 by the upstream takeover device 10 (robot hand) is accompanied by a crack, the upstream side crack detection device 11 is first in a stationary state. It is configured to detect a crack at a corner portion of B and then detect a crack at a portion other than the corner portion as the substrate B is transported. When a crack is detected, a crack detection signal is output to the controller of the substrate processing apparatus 1 to stop the conveyance of the substrate B, and the alarm device is activated to notify the operator, thereby causing the processing unit 3 to be notified. When the board | substrate B carried in is a thing accompanied by a crack, the said board | substrate B can be detected at an early stage and can be lined out.

<Downstream crack detection device 15>
FIG. 10 is a block diagram showing the configuration of the downstream crack detection device 15 provided in the substrate lead-out unit 4.

  As shown in this figure, the downstream crack detection device 15 includes a first front end sensor 30F, a second front end sensor 30G, a first rear end sensor 30H, a second rear end sensor 30I, a start sensor 30J, and a control unit 38B. The upstream crack detection device 11 is similar in configuration.

  The configuration of each of the sensors 30F to 30J is basically the same as that of each of the sensors 30A to 30E of the upstream crack detection device 11, but the configuration is different in the following points (in the following description, In order to avoid duplication of explanation, components that are common to the components of the upstream crack detection device 11 are given the same reference numerals and explanation thereof is omitted).

  Furthermore, in the downstream crack detection device 15, as shown in FIG. 11, no timer is incorporated in the signal output unit 46 (sensor amplifier 36) of the tip sensors 30F, 30G, and each tip sensor 30F, 30G A simple timerless signal, that is, an ON signal is output when the substrate B is not present at a position facing the sensor head 32, and an OFF signal is output when the substrate B is present. (See signal output (no timer) in FIG. 4). Moreover, the spot lens 34 is not provided in the sensor heads 32f and 32g of the tip sensors 30F and 30G.

  On the other hand, a one-shot timer 49 is incorporated in the signal output unit 46 (sensor amplifier 36) of the rear end sensors 30H and 30I, and normally outputs an off signal, and the light receiving level of the light receiving unit 42 is preset. The ON signal is output only for a certain period only when the state changes from a higher state to a lower state than the received light receiving level. That is, as shown in FIG. 4 (signal output (one-shot timer)), the predetermined pulse width T2 only when the state where the substrate B exists at a position facing the sensor head 32 is switched to the state where the substrate B does not exist. The on signal is output. The timer set value of the one-shot timer 49, that is, the pulse width T2 is set to a time width larger than the minimum time width that can be processed by the control unit 38B. In this embodiment, at least the signal sampling in the control unit 38B is performed. The pulse width is set larger than the period (detection period).

  The rear end sensors 30H and 30I of the downstream side crack detection device 15 detect the cracks as the substrate B moves as will be described later. Therefore, the sensor heads 32h, A spot lens 34 is provided at 32i.

  The arrangement of the sensor heads 32f to 32j of the sensors 30F to 30J is as shown in FIG. That is, in the state where the substrate B is set at the transport stop position P2, that is, the substrate B that has been processed in the processing unit 3 is transported to the transport stop position P2 and is stationary, the sensor heads of the tip sensors 30F and 30G. 32f and 32g are the front ends of the substrate B, and are arranged in a line in the width direction at positions corresponding to both ends in the width direction. In addition, the sensor heads 32h and 32i of the rear end sensors 30H and 30I are arranged in a line in the width direction at positions corresponding to both ends of the width direction of the substrate B. Thereby, the irradiation position of each light of the sensor heads 32f to 32i is positioned at the corner portion of the substrate B. Further, the sensor head 32j of the start sensor 30J is in the center of the rear end of the substrate B and is slightly downstream in the transport direction of the substrate B (right side in FIG. 10) than the sensor heads 32h and 32i of the rear end sensors 30H and 30I. ).

  In this embodiment, the front end sensors 30F and 30G correspond to the first 'signal output means according to the present invention, the rear end sensors 30H and 30I correspond to the second' signal output means according to the present invention, and the start sensor. 30J corresponds to the 3 'signal output means according to the present invention.

  The control unit 38B controls the substrate processing apparatus 12 and includes a well-known CPU or the like that executes a logical operation in the same manner as the upstream crack detection apparatus 11 and outputs signals output from the sensors 30F to 30J. By detecting at a preset sampling period (detection period), the substrate B is detected to be cracked.

  Next, substrate crack detection control by the control unit 38B of the downstream crack detection device 15 will be described with reference to the flowchart of FIG.

  First, when the substrate B that has been cleaned and dried is transferred from the processing unit 3 to the substrate introducing unit 2, the control unit 38B determines that the timer non-output signal of the start sensor 32J changes from an on signal to an off signal. After waiting, monitoring of the substrate B for cracking is started in the transport state (steps S21 to S23).

  First, it is determined whether or not at least one of the timer output signals of the rear end sensors 30H and 30I is an ON signal (step S24). If YES is determined here, the portion other than the front corner portion of the substrate B is determined. Is determined to have a crack (step S29), and the process proceeds to step S31 to output a crack detection signal to the controller. Thereby, the conveyance of the substrate B is stopped and various alarm devices are operated to notify the operator.

  On the other hand, if NO is determined in step S24, it waits for at least one of the timer non-output signals of the tip sensors 30F and 30G to change to an off signal, that is, the substrate B is moved to the transport stop position P2. Waiting for complete loading, the monitoring of the cracks in the substrate B in the transport state is terminated, and the monitoring of the cracks in the substrate B in the stationary state is started (step S26).

  Then, it is determined whether or not the timer non-output signals of both tip sensors 30F and 30G are both OFF signals (step S27). If YES is determined in this step, the substrate B is detected after a predetermined time has elapsed. Monitoring is terminated (step S28).

  On the other hand, if NO is determined in step S27, it is determined that there is a crack at the tip of the substrate B (step S30), that is, it is determined that the tip corner portion of the substrate B has a crack. In step S31, a crack detection signal is output to the controller.

  Next, a specific example of the crack detection operation based on the control of the control unit 38B will be described together with the function and effect with reference to FIGS.

  FIG. 13 is a timing chart showing signal output states of the sensors 30F to 30J when a normal substrate B without cracks is conveyed from the processing unit 3.

  As shown in this figure, when the substrate B is normal, when the front end of the substrate B reaches the transfer stop position P2 as the substrate B is transferred, the timer non-output signal of the start sensor 30J is first turned on. To an OFF signal, and the monitoring of the crack by the control unit 38 is thereby started (at time t2). In addition, t1 time in the same figure shows the time when the front-end | tip of the board | substrate B passed the position of the sensor heads 32h and 32i of each rear-end sensor 30H and 30I.

  Then, when the substrate B is further transported and the substrate B is completely loaded into the transport stop position P2, the timer non-output signals of the tip sensors 30F and 30G change from the ON signal to the OFF signal almost simultaneously (at time t3). After the preset time, the monitoring of cracks by the control unit 38A ends (at time t4).

  During this time (from time t2 to time t4), in the normal substrate B, the output signals with the timers of the rear end sensors 30H and 30I do not change from the off signal to the on signal, and at the time t4, the front end sensors 30F and 30G Since all the timer non-output signals are switched to the off signal, the control unit 38B determines that the substrate B is not cracked.

  When the substrate B at the transport stop position P2 is subsequently picked up by the robot hand of the substrate processing apparatus 14 (at time t5), the output signals with the timers of the rear end sensors 30H and 30I are changed from the OFF signal to the ON signal at that time. However, since the monitoring of the crack has been completed at this point, the control unit 38B ignores the signal. Therefore, it is not erroneously detected that there is a crack.

  On the other hand, for example, as shown in FIG. 14 (a), the substrate B has a crack in the middle thereof and at one end in the width direction (on the sensor head 32i side of the second rear end sensor 30I). As shown in FIG. 14B, after the transfer of the substrate B is started, when the cracked portion passes the position of the sensor head 32b, the output signal with the timer of the second rear end sensor 30I is output. It changes according to the said crack (time t3-t5). That is, as a result of the reflected light being reduced due to cracking, the light receiving level of the light receiving unit 42 temporarily decreases, and as a result, the output signal with the timer of the second rear end sensor 30I changes to an ON signal (at time t3 to t5). The controller 38B determines that there is a crack in the middle part of the substrate B. At this time, since the pulse width T2 of the output signal with timer (ON signal) is set to a value larger than the sampling period of the processing unit 38 as described above, when the crack is fine or the transport speed of the substrate B is Even if it is fast, the control unit 38B reliably detects the output signal with the timer (ON signal), and therefore, the crack in the intermediate portion of the substrate B is reliably detected.

  In the figure, the time point t4 indicates the time point when the cracked portion of the substrate B passes the sensor head 32b of the second tip sensor 30B, and the time point t6 indicates the time point when the control unit 38B ends the monitoring.

  As another example, for example, as shown in FIG. 15A, a substrate B having a crack at the tip of the substrate B and having one end in the width direction (on the sensor head 32f side of the first tip sensor 30F) has been transported. In this case, as shown in FIG. 15B, the timer non-output signal of the first tip sensor 30F is switched to the off signal even when the substrate B is completely carried into the transport stop position P2 (time t2). Regardless of this, the control unit 38A determines that there is a crack at the tip corner of the substrate B. In addition, the time t3 in the figure has shown the monitoring end time by the control part 38B.

  As described above, when the substrate B transported from the processing unit 3 to the substrate lead-out unit 4 (conveyance stop position P2) is accompanied by a crack, the downstream side crack detection device 15 is first in the transport state. A crack other than the front end corner of the substrate B is detected, and then the front corner is detected when the substrate B is completely loaded into the transport stop position P2. When a crack is detected, a crack detection signal is output to the controller of the substrate processing apparatus 1 to stop the conveyance of the substrate B, and the alarm device is activated to notify the operator, thereby causing the processing unit 3 to If the substrate B is cracked after the processing, the substrate B can be detected at an early stage and lined out.

  As described above, in the substrate processing apparatus 1 described above, when the upstream crack detection device 11 is provided in the substrate introduction unit 2 and the downstream crack detection device 15 is provided in the substrate lead-out unit 4, and the substrate B is cracked. In such a case, it is possible to detect the crack and make an early line-out. Therefore, a situation in which the substrate B accompanied by a crack is carried into the processing unit 3 or the substrate B that has been cracked during the processing in the processing unit 3 is carried out to the next process in advance. It is possible to prevent the occurrence of troubles such as processing being performed on the substrate B or causing equipment failure.

  In particular, as described above, each of the crack detection devices 11 and 15 is configured to detect a crack in the substrate B based on the signal output state from the optical sensors (sensors 30A to 30E and sensors 30F to 30J). In addition, since both the upstream side crack detection device 11 and the downstream side crack detection device 15 can detect cracks in almost the entire substrate B, the cracks in the substrate B can be efficiently detected with a relatively simple configuration. There is an advantage that you can.

  In addition, during transfer of the substrate B, a signal having a time width larger than the minimum time width that can be processed by the control units 38A and 38B is always output as a signal corresponding to the crack of the substrate B. Even when the conveying speed is high or the crack is fine, the control units 38A and 38B are configured so that the crack can be reliably detected, so that there is an advantage that the crack of the substrate can be detected with high accuracy.

  The upstream side crack detection device 11 is provided with the end sensor 30E as described above, and the monitoring of the crack by the control unit 38A is ended based on the detection of the rear end of the substrate by the sensor 30E, while the downstream side crack detection device 15 is provided. Since the start sensor 30J is provided as described above and the monitoring of the crack by the control unit 38B is started based on the detection of the front end of the substrate by the sensor 30E, the crack at the front and rear ends of the substrate B is configured. There is also an advantage that false detection can be effectively avoided.

  That is, when the substrate introduction unit 2 transports the substrate B from the transport start position P1, there is a case where so-called oblique transport occurs in which the substrate B is transported in a slightly inclined posture. In this case, assuming that the upstream side crack detection device 11 is not provided with the end sensor 30E, the timing at which the rear end of the substrate B passes through the sensor heads 32a and 32b of the front end sensors 30A and 30B is deviated. It is conceivable that the control unit 38A erroneously recognizes that there is a crack at the rear end. On the other hand, according to the configuration in which the termination sensor 30E is provided and the monitoring of the crack by the control unit 38A is terminated based on the detection of the rear end of the substrate by the termination sensor 30E, the substrate B is assumed to be tilted in advance. Before the rear end passes through one of the sensor heads 32a and 32b of the front end sensors 30A and 30B, the position of the sensor head 32e is adjusted so that the rear end of the substrate always passes through the sensor head 32e of the end sensor 30E. By offsetting the sensor heads 32a and 32b to the upstream side, it is possible to effectively prevent the erroneous detection of cracks at the rear end of the substrate accompanying the oblique conveyance of the substrate B as described above. Similarly, when the substrate B is carried into the substrate lead-out unit 4 (conveyance stop position P2), if the substrate B is being transported obliquely, the front end of the substrate B is the sensor head 32h of each of the rear end sensors 30H and 30I. , 32i may be misaligned, and as a result, the control unit 38B may mistakenly recognize that there is a crack at the tip of the substrate B. However, the start sensor 30J is assumed on the assumption of the inclination of the substrate B that may occur in advance. By setting this position, it becomes possible to effectively prevent erroneous detection of cracks at the front end of the substrate accompanying the oblique conveyance of the substrate B.

  As for the upstream side crack detection device 11, the substrate B is monitored as a result of the sensor head 32e of the end sensor 30E being offset to the upstream side in the transport direction with respect to the sensor heads 32a and 32b of the tip sensors 30A and 30B. An unmonitored portion is generated at the rear end of the substrate B from the end to the time when the rear end of the substrate passes the position of each of the sensor heads 32a and 32b (for example, from time t4 to time t5 in FIG. 8). Similarly, in the downstream crack detection device 15, the sensor head 32j of the start sensor 30J is offset to the downstream side in the transport direction with respect to the sensor heads 32j and 32i of the rear end sensors 30H and 30I. An unmonitored portion is generated at the front end of the substrate B after passing through the positions of the sensor heads 32j and 32i (for example, from time t1 to time t2 in FIG. 13) until the monitoring of the substrate B is started. Become. However, in the upstream side crack detection device 11, the rear end of the substrate B can be detected by the rear end sensors 30C and 30D, and in the downstream side crack detection device 15, the front end of the substrate B can be detected by the front end sensors 30F and 30G. Therefore, there is no substantial effect.

  The substrate processing apparatus 1 described above is an example of a preferred embodiment of the substrate processing apparatus 1 according to the present invention (a substrate processing apparatus to which the substrate cracking detection apparatus according to the present invention is applied). The configuration can be appropriately changed without departing from the gist of the present invention. For example, it is possible to adopt the following configuration.

  (1) In the upstream crack detection device 11 and the downstream crack detection device 15 of the embodiment, the sensor heads 32 of the sensors 30A to 30D and the sensors 30F to 30I are arranged at locations corresponding to the corner portions of the substrate B. However, in view of the fact that many of the cracks of the substrate B occur at the corner portions, the cracks of the substrate B can be efficiently detected with a small number of sensors. Therefore, more sensors may be provided, and these sensor heads 32 may be densely arranged in the width direction of the substrate B.

  (2) In the embodiment, reflective sensors are used as the sensors 30A to 30E of the upstream crack detection device 11 and the sensors 30F to 30J of the downstream crack detection device 15. May be used.

  (3) In the embodiment, as the tip sensors 30A and 30B of the upstream side crack detection device 11, the one that incorporates the off-delay timer 48 in the signal output unit 46 is used. When the substrate B is present, the off signal is output, and when the substrate B is changed from the non-existing state to the existing state, the signal output timing is delayed by a certain period. Instead of the off-delay timer 48, a one-shot timer may be incorporated in the signal output unit 46 of the tip sensors 30A and 30B. That is, when switching from the state in which the substrate B does not exist to the state in which the substrate B exists, an ON signal having a predetermined pulse width, that is, a pulse signal having a time width larger than the minimum time width that can be processed by the control unit 38A is output. You may comprise.

  However, according to the configuration in which the off-delay timer 48 is incorporated as in the above-described embodiment, when the substrate B has a crack, the timer output signal immediately switches from the off signal to the on signal at the cracked portion ( FIG. 9B is advantageous in terms of responsiveness. Therefore, as the signal output unit 46 of each of the tip sensors 30A and 30B of the upstream side crack detection device 11, the one incorporating the off-delay timer 48 is effective.

  (4) In the embodiment, as the rear end sensors 30H and 30I of the downstream side crack detection device 15, the one in which the one-shot timer 49 is incorporated in the signal output unit 46 is used. When switching to a state where B does not exist, an ON signal having a predetermined pulse width T2, that is, a signal having a time width larger than the minimum time width that can be processed by the control unit 38B is output. , 30I incorporates an off-delay timer in place of the one-shot timer 49 to output an on signal when the substrate B is not present and an off signal when the substrate B is present. When the substrate B changes from the non-existing state to the existing state, the signal output timing is delayed by a certain period. To in terms of the configuration, the time width of the signal output with the cracking of the substrate B may be set the delay period to be larger than the processable minimum time width by the control unit 38B.

  (5) Although not specifically described in the above embodiment, the sensor amplifiers 36 of the sensors 30A to 30E of the upstream side crack detection device 11 and the sensors 30F to 30J of the downstream side crack detection device 15 are connected to, for example, a light receiving unit. An arithmetic circuit for calculating the amount of change (differential value) of the received light level 42 is incorporated, and when the amount of change exceeds a certain value, a fixed pulse signal, that is, the minimum time width that can be processed by the processing units 38A and 38B. Alternatively, a pulse signal having a larger time width may be output. That is, if light is irradiated to a damaged part that has not been completely cracked or chipped, such as a crack, the light receiving level changes greatly in a short time. It becomes possible to improve detection accuracy.

  (6) In the above embodiment, the signal corresponding to the breakage of the substrate B is a signal for outputting a signal as described above, that is, a signal having a time width larger than the minimum time width that can be processed by the processing units 38A and 38B. Although the off-delay timer 48 and the one-shot timer 49 are incorporated in the output unit 46, for example, a similar signal may be output by incorporating an on-delay timer in the signal output unit 46.

  (7) The output signals of the sensors 30A to 30E, 30F, 30G, 30J, etc. in the above embodiment are logically set so as to output an on signal without the substrate B and an off signal with the substrate B, respectively. However, of course, the reverse logic setting may be used. That is, an on signal may be output in the presence of a substrate, and an off signal may be output in the absence of a substrate.

  (8) Each of the sensors 30A, 30B, 30H, 30I of the above embodiment includes the spot lens 34 in the sensor head 32 (32a, 32b, 32h, 32i), but this is not essential. However, as described above, it is preferable to provide the spot lens 34 in order to detect a fine crack more reliably.

  (9) In the above embodiment, the control unit 38A of the upstream crack detection device 11 and the control unit 38B of the downstream crack detection device 15 and the controller of the substrate processing apparatus 1 have different configurations. The controller of the substrate processing apparatus 1 may also serve as the functions of the control units 38A and 38B. In other words, the controller may function as the crack detection means of the present invention.

It is a schematic diagram which shows the substrate processing apparatus (The substrate processing apparatus provided with the substrate crack detection apparatus which concerns on this invention) concerning this invention. It is a block diagram which shows the structure of an upstream crack detection apparatus. It is a block diagram (detail drawing) which shows the structure of an upstream crack detection apparatus. It is a timing chart which shows the output signal from a sensor. It is a flowchart which shows an example of the crack detection operation | movement control by a control part. It is a timing chart which shows the signal output state from each sensor when the board | substrate without a crack is set to the conveyance start position. (A) is a top view which shows an example of a board | substrate with a crack, (b) is a timing chart which shows the signal output state from each sensor when the board | substrate shown to (a) is set to the conveyance start position. . It is a timing chart which shows the signal output state of each sensor when a board | substrate without a crack is conveyed from a conveyance start position (board | substrate conveyance state). (A) is a top view which shows an example of the board | substrate with a crack, (b) is a timing chart which shows the signal output state from each sensor when the board | substrate shown to (a) is conveyed. It is a block diagram which shows the structure of a downstream crack detection apparatus. It is a block diagram (detail drawing) which shows the structure of a downstream crack detection apparatus. It is a flowchart which shows an example of the crack detection operation | movement control by a control part. It is a timing chart which shows the signal output state from each sensor when the board | substrate without a crack is conveyed from a process part to a board | substrate derivation | leading-out part (conveyance stop position). (A) is a plan view showing an example of a substrate having cracks, (b) is a signal output state from each sensor when the substrate shown in (a) is conveyed to the substrate lead-out portion (conveyance stop position). It is a timing chart which shows. (A) is a plan view showing an example of a substrate having cracks, (b) is a signal output state from each sensor when the substrate shown in (a) is conveyed to the substrate lead-out portion (conveyance stop position). It is a timing chart which shows.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Substrate introduction part 3 Processing part 4 Substrate lead-out part 11 Upstream crack detection apparatus 30A (30F) First tip sensor 30B (30G) Second tip sensor 30C (30H) First rear end sensor 30D (30I) Second rear end sensor 30E End sensor 30J Start sensor 32 (32a to 32J) Sensor head 36 Sensor amplifier 38 Control unit 40 Light emitting unit 42 Light receiving unit 46 Signal output unit 48 Off delay timer 49 One shot timer B Substrate

Claims (8)

A substrate crack detection device disposed at the transfer start position of a device that transfers a substrate from a predetermined transfer start position to a transfer stop position along a transfer path,
An irradiating means capable of irradiating light on the front end in the transport direction with respect to the substrate set at the transport start position and a light receiving means for the light, and outputs a signal based on a light receiving state of the light by the light receiving means; 1 signal output means;
It includes an irradiating means capable of irradiating light to the rear end portion in the transport direction with respect to the substrate set at the transport start position and a light receiving means for the light, and outputs a signal based on the light receiving state of the light receiving means. Second signal output means;
Light receiving means for receiving light by the light receiving means, which is provided separately from the first and second signal output means, includes an irradiating means for irradiating light toward the substrate set at the transfer start position, and a light receiving means for the light. Third signal output means for outputting a signal based on the state;
Crack detecting means for detecting cracks in the substrate based on the signals output from the first and second signal output means,
The first signal output means has a time width that is larger than a minimum time width that can be processed by the crack detection means when the light receiving state of the light receiving means changes from a state without a substrate to a state with a substrate. as a signal having a Ri always der those signals output corresponding to the change for a predetermined period of time delay,
In the third signal output means, the light irradiation position by the irradiation means is set upstream of the light irradiation position by the irradiation means of the first signal output means in the substrate transport direction,
The crack detection means detects the rear end of the substrate based on a signal output from the third signal output means, and detects the rear end after the transfer of the substrate set at the transfer start position is started. substrate breakage detecting device which is characterized that you end the process of crack detection for the substrate based on. A substrate crack detection device disposed at the transfer start position of a device that transfers a substrate from a predetermined transfer start position to a transfer stop position along a transfer path,
An irradiating unit capable of irradiating light on the front end in the transport direction with respect to the substrate set at the transport start position and a light receiving unit for the light, and outputs a signal based on a light receiving state of the light by the light receiving unit; 1 signal output means;
It includes an irradiating means capable of irradiating light to the rear end portion in the transport direction with respect to the substrate set at the transport start position, and a light receiving means for the light, and outputs a signal based on the light receiving state of the light receiving means. Second signal output means;
Light receiving means for receiving light by the light receiving means, which is provided separately from the first and second signal output means, includes an irradiation means for irradiating light toward the substrate set at the transfer start position Third signal output means for outputting a signal based on the state;
Crack detecting means for detecting cracks in the substrate based on the signals output from the first and second signal output means,
The first signal output means has a time width that is always greater than the minimum time width that can be processed by the crack detection means when the light receiving state of the light receiving means changes from a state without a substrate to a state with a substrate. all SANYO for outputting the signal;
In the third signal output means, the light irradiation position by the irradiation means is set upstream of the light irradiation position by the irradiation means of the first signal output means in the substrate transport direction,
The crack detection means detects the rear end of the substrate based on a signal output from the third signal output means, and detects the rear end after the transfer of the substrate set at the transfer start position is started. substrate breakage detecting device which is characterized that you end the process of crack detection for the substrate based on. In the board | substrate crack detection apparatus of Claim 1 or 2,
Each of the first and second signal output means includes a plurality of signal output means,
The substrate crack detection apparatus characterized in that the irradiation position of the light of the irradiation means of the first and second signal output means is set to a position including at least both ends in the width direction of the substrate perpendicular to the substrate transport direction. . A substrate crack detection device arranged at the transfer stop position of a device that transfers a substrate from a predetermined transfer start position to a transfer stop position along a transfer path,
An irradiating means capable of irradiating light on the front end in the carrying direction with respect to the substrate set at the carrying stop position and a light receiving means for the light, and outputs a signal based on the light receiving state of the light by the light receiving means; 1 'signal output means;
It includes an irradiating means capable of irradiating light to the rear end portion in the transport direction with respect to the substrate set at the transport stop position, and a light receiving means for the light, and outputs a signal based on the light receiving state of the light receiving means. Second 'signal output means;
The first ', second' the signal output means provided separately, before Symbol irradiating means capable of irradiating light toward the said substrate with the substrate is stopped at the feeding-stop position and the light receiving unit of the light 3 ' signal output means for outputting a signal based on the light receiving state of the light receiving means ,
Crack detecting means for detecting cracks in the substrate based on the signals output from the first 'and second' signal output means,
The second 'signal output means has a time width that is always larger than the minimum time width that can be processed by the crack detection means when the light receiving state of the light receiving means changes from a state with a substrate to a state without a substrate. Output the signal having,
The third 'signal output means, the irradiation position of the light by the irradiation unit is the second' is set on the lower stream side in the substrate conveying direction than the light irradiation position of by the irradiation unit of the signal output means,
The crack detection unit is configured to detect a preceding end of the substrate on the basis of a signal output from the third 'signal output means, starts processing of crack detection of the substrate based on the detection of the destination end of the substrate during transport A substrate crack detection device characterized by: A substrate crack detection device arranged at the transfer stop position of a device that transfers a substrate from a predetermined transfer start position to a transfer stop position along a transfer path,
An irradiating means capable of irradiating light on the front end in the carrying direction with respect to the substrate set at the carrying stop position and a light receiving means for the light, and outputs a signal based on the light receiving state of the light by the light receiving means; 1 'signal output means;
It includes an irradiating means capable of irradiating light to the rear end portion in the transport direction with respect to the substrate set at the transport stop position, and a light receiving means for the light, and outputs a signal based on the light receiving state of the light receiving means. Second 'signal output means;
Provided separately from the first 'and second' signal output means, an irradiating means capable of irradiating light toward the substrate while the substrate is stopped at the transport stop position, and a light receiving means for the light And 3 'signal output means for outputting a signal based on the light receiving state of the light by the light receiving means,
Crack detecting means for detecting cracks in the substrate based on the signals output from the first 'and second' signal output means,
The second 'signal outputting means, when the light receiving state of light by the light receiving unit is changed to the state of presence from the state without the substrate, larger listening than processible minimum time width by the output signal wherein the crack detection means Ri shall der always a certain period delayed signal output corresponding to the change so that even One signal time width,
In the third 'signal output means, the light irradiation position by the irradiation means is set downstream of the light irradiation position by the irradiation means of the second' signal output means in the substrate transport direction,
The crack detection unit is configured to detect the leading edge of the substrate on the basis of a signal output from the third 'signal output means, you begin processing crack detection of the substrate based on the detection of the leading end of the substrate being transported A substrate cracking detection device characterized by that. In the substrate crack detection device according to claim 4 or 5,
Each of the first 'and second' signal output means comprises a plurality of signal output means,
Substrate crack the light irradiation position of the irradiation means of the first 'and second' signal output means, characterized in Rukoto the widthwise ends of the substrate perpendicular to the substrate conveying direction is set to at least include a position Detection device. A substrate transport path, a processing unit that performs a predetermined process on the substrate transported along the transport path, and a substrate crack detection device that detects cracks in the substrate transported along the transport path. A substrate processing apparatus,
The substrate crack detection device is disposed at a substrate transfer start position in the transport path, and the substrate crack detection device is provided with the substrate crack detection device according to any one of claims 1 to 3. A substrate processing apparatus. A substrate transport path, a processing unit that performs a predetermined process on the substrate transported along the transport path, and a substrate crack detection device that detects cracks in the substrate transported along the transport path. A substrate processing apparatus,
The substrate crack detection device is disposed at a substrate transport stop position in the transport path, and the substrate crack detection device is provided with the substrate crack detection device according to any one of claims 4 to 6. A substrate processing apparatus.

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