JP4805114B2 - Laser processing equipment - Google Patents

Description

  The present invention relates to a laser processing apparatus that performs desired processing by irradiating a workpiece with laser light.

  There is a laser processing apparatus as a processing apparatus for irradiating a workpiece with a laser beam to perform cutting processing, drilling processing, welding, scoring, or the like. In this type of laser processing apparatus, various laser processing is performed by changing the output and irradiation position of the laser light irradiated to the workpiece.

  By the way, in the recent market, in order to perform high-precision and high-speed processing, a laser processing apparatus capable of outputting higher-power laser light is desired. For example, Patent Document 1 below uses a plurality of laser light sources in order to achieve both high processing accuracy and high output of laser light. Has been concluded that this is effective, and a laser processing apparatus having a plurality of laser light sources is disclosed.

JP 2002-049002 A

  However, the laser processing apparatus disclosed in Patent Document 1 has a problem that the manufacturing cost and the maintenance cost increase due to the configuration having a plurality of laser light sources. In this type of laser processing apparatus, for example, when a series of processing operations are performed over a wide output range from low output (for example, scoring) to high output (for example, drilling, cutting), a plurality of processing operations are performed. Regardless of whether the laser light source is used or not, they must be kept in a usable (standby) state at all times, and there is a problem in terms of energy saving or device life.

  The present invention has been made in view of the above, and provides a laser processing apparatus that realizes high output without having a plurality of laser light sources and suppressing an increase in manufacturing cost and maintenance cost. With the goal.

  In order to solve the above-described problems and achieve the object, a laser processing apparatus according to the present invention includes a laser oscillator that outputs laser light, a power supply apparatus that supplies excitation power to the laser oscillator, and an output from the laser oscillator. An output detection means for detecting the output of the laser beam to be output, and a machining condition including at least an output command are input, and an input current input by the power supply device to supply a required excitation power to the laser oscillator is used as the output command. And a calculation unit that calculates a control voltage based on the input current and outputs the calculated control voltage to the power supply device. A first calculation unit that processes an output output command, and a second calculation unit that processes a high-output output command in which the output command exceeds a predetermined value. To.

  According to the laser processing apparatus of the present invention, the power supply device determines the input current to be input to the laser oscillator based on the output command, calculates the control voltage based on the input current, and outputs the control voltage to the power supply device. An arithmetic means and a second arithmetic means are provided, the first arithmetic means processes a low output command in which the output command is equal to or less than a predetermined value, and the second arithmetic means is a high output in which the output command exceeds the predetermined value. Since the output command is processed, it is possible to achieve an effect of achieving high output without having a plurality of laser light sources and suppressing an increase in manufacturing cost and maintenance cost.

  A laser processing apparatus according to a preferred embodiment of the present invention will be described below in detail with reference to the drawings. In addition, this invention is not limited by this embodiment.

  First, the overall configuration of the laser processing apparatus according to the present invention will be described. FIG. 1 is a diagram showing an overall configuration of a laser processing apparatus according to a preferred embodiment of the present invention. The laser processing apparatus shown in FIG. 1 includes a laser oscillator 12 that generates laser light, a cooling device 11 that cools the laser oscillator 12, a power supply device 10 that supplies excitation power to the laser oscillator 12, and a laser processing machine that actually performs laser processing. 15 and a control device 8 for controlling these devices and the like. The power supply device 10 may be incorporated into the laser oscillator 12 or may be configured integrally with the laser oscillator 12. Further, the control device 8 may be incorporated in a numerical control device (hereinafter referred to as “NC device”) that issues an output command to the laser processing device, or may be incorporated in the power supply device 10.

  Next, the operation of the laser processing apparatus shown in FIG. 1 will be described. In the figure, a laser beam 13 generated by a laser oscillator 12 is guided to a machining head 16 of a laser beam machine 15 through several laser beam transmission mirrors 14. The laser beam 13 guided to the processing head 16 is focused on the workpiece 18 by the condenser lens 17 of the processing head 16 and irradiated to the workpiece 18, and the control device 8 controls the processing head 16 and the workpiece 18. The relative positional relationship is controlled, and desired processing including cutting, drilling, ruled writing, and the like is performed. The cooling device 11 dissipates and cools the heat generated by the operation of the laser oscillator 12, and the control device 8 controls the cooling device 11 and the laser oscillator 12 in addition to the laser processing machine 15. To control the overall behavior of

  Next, the structure of the laser oscillator will be described. FIG. 2-1 is a cross-sectional view showing an internal structure of a laser oscillator constituting the laser processing apparatus, and FIG. 2-2 is a cross-sectional view taken along line XX in FIG. 2-1. In these drawings, unlike FIG. 1, the configuration in the case where the cooling device is built in the laser oscillator is shown as an example.

  2A and 2B, the laser oscillator includes a laser resonator 20, a blower 24, a heat exchanger 25, a power sensor 38, and the like. The laser resonator 20 includes a laser resonator main body 33 and laser light reflecting means 30 and 31 provided at both ends in the optical axis direction of the laser light 32 propagating through the optical path 39 therein. Here, the laser resonator body 33 is provided with a pair of discharge electrodes 21 on both sides (upper and lower) sandwiching the optical path 39, and both ends of the laser resonator body 33 are connected to the entrance and exit of the laser beam 32. Openings 34 and 35 are provided. The laser resonator main body 33 is installed on the upper side of the housing 23 that houses each component of the laser oscillator, and the blower 24 and the heat exchanger 25 are installed on the lower end of the housing 23. ing. On the other hand, the laser beam reflecting means 30 and 31 are on the optical path of the laser beam 32 passing through the openings 34 and 35 provided at both ends of the laser resonator body 33 and on the outer periphery of the housing 23. Are provided respectively. The laser beam reflecting means 30 and 31 are respectively configured as components having a function of totally reflecting the laser beam 32 from the laser resonator body 33 or outputting it to the outside (laser processing machine). Includes a total reflection mirror 26 and a partial reflection mirror 28, and the laser beam reflecting means 31 includes a total reflection mirror 27 and a partial reflection mirror 29. In addition, a laser medium 22 having a pressure of about 1/10 of the atmospheric pressure is sealed inside the housing 23, and the laser medium 22 is interposed between the laser resonator body 33 and the heat exchanger 25. A duct 36 is provided for circulation.

  Here, the operation of the laser oscillator shown in FIGS. 2-1 and 2-2 will be described. The laser light 32 output from the laser resonator main body 33 is totally reflected by the total reflection mirrors 26 and 27 of the laser light reflection means 30 and 31, and then externally (through the partial reflection mirror 28 of the laser light reflection means 30). Output to the laser processing machine side). The power sensor 38 monitors the leakage light of the partial reflection mirror 29, and the monitor output at this time is output to a control device (not shown). Further, the laser medium 22 enclosed in the housing 23 is sent to the laser resonator main body 33 by the blower 24. The heat generated in the laser resonator main body 33 is conveyed to the heat exchanger 25 by the laser medium 22 through the duct 36 and radiated to the outside.

  In the configuration of FIG. 2A, the laser light reflecting means 30 and 31 and the power sensor 38 are provided outside the housing 23, but the configuration is not limited to this configuration, and the inside of the housing 23 is not limited thereto. Of course, it is good also as a structure provided. Further, the configurations of the laser resonator main body 33, the blower 24, and the heat exchanger 25 are not limited to FIGS. 2-1 and 2-2.

  Next, a control system for controlling the input power to the laser oscillator shown in FIGS. FIG. 3 is a diagram showing a configuration of a control system for controlling the input power to the laser oscillator.

  3, each of arithmetic units 42a and 42b, analog / digital converters (hereinafter abbreviated as “A / D”) 61 and 62, and digital / analog converters (hereinafter abbreviated as “D / A”) 63 and 64, respectively. In the configuration shown in FIG. 1, the configuration unit is a configuration unit mounted on the control device 8. In FIG. 3, a calculation unit 42a, which is a first calculation unit, includes an F / F (feed forward) control unit 51a, an F / B (feedback) control unit 52a, and a current value calculation unit 53a. The calculation unit 42b is also provided with F / F (feed forward) control means 51b, F / B (feedback) control means 52b, and current value calculation means 53b, which are the same components as the calculation unit 42a.

  Further, the following units are connected as shown in FIG. 3 with the arithmetic units 42a and 42b as the center. That is, in FIG. 3, the output of the output command means (NC device) 41 is output from the arithmetic unit 42a (F / F control unit 51a, F / B control unit 52a) and the arithmetic unit 42b (F / F) through A / Ds 61 and 62, respectively. F control means 51b and F / B control means 52b) are input to the respective components, and the outputs of the calculation unit 42a (current value calculation unit 53a) and calculation unit 42b (current value calculation unit 53b) are respectively D / The power is input to the power supply device 55 through A 63 and 64, and the output (input power) of the power supply device 55 is input to the laser oscillator 56. Further, the laser oscillator 56 includes a power sensor 58, and the output of the power sensor 58 obtained by monitoring the output of the laser oscillator 56 is input to the calculation unit 42a and the calculation unit 42b through the A / Ds 65 and 66, respectively. Is done.

  Next, the operation of one of the two control systems shown in FIG. 3 (for example, the control system including the calculation unit 42a) will be described. In FIG. 3, the output command (analog signal) of the output command means 41 is converted into a digital signal by the A / D 61. The output command converted into the digital signal is input to the current value calculation means 53a via the F / F control means 51a. The current value calculation means 53a generates an oscillator input current command (digital signal) based on the input output command. The oscillator input current command is converted into an analog signal by the D / A 63 and then input to the power supply device 55. The power supply device 55 determines the oscillator input current based on the oscillator input current command (analog signal) and outputs it to the laser oscillator 56. On the other hand, the output of the laser oscillator 56 is monitored by the power sensor 58, and the monitored output is input to the F / B control means 52a via the amplifier 71 and the A / D 65. In the F / B control means 52a, a difference value between the output command (digital signal) of the output command means 41 and the monitor output (digital signal) of the power sensor 58 is calculated, and the current value calculation means 53a has a difference value of zero. The power supply device 55 is controlled so that As a result, laser light with an output that matches the output command of the output command means 41 is obtained from the laser oscillator 56.

  The operation described above is the same for the other control systems shown in FIG. 3 (the control system including the calculation unit 42b), and the oscillator input current is determined based on the oscillator input current command, and the laser oscillator From 56, a laser beam having power matching the output command is output.

  FIG. 4 is a graph for explaining switching conditions when two control systems are switched and used. In the figure, the vertical axis represents the oscillator input current command, the horizontal axis represents the output command (power), and the graph shows two input current commands corresponding to the machining conditions. For example, when the maximum value of the output power (laser output) of the laser oscillator is 1000 W or less, the oscillator input current command (given by the control voltage value) output from the arithmetic unit to the power supply device is the processing condition 1 in FIG. Given according to the straight line. For example, when the maximum value of the output of the D / A converter is 5 V and the maximum value of the laser output is 1000 W or less, a control voltage value of 20 W (5 V / 1000 W) per 0.1 V is given. On the other hand, for example, when the maximum value of the laser output exceeds 1000 W, the control voltage value is given according to the straight line of the processing condition 2 in FIG. 4 and is 100 W (5 V / 5000 W) per 0.1 V under the same conditions as the processing condition 1. Is given.

  Here, the first control system that performs control based on the machining condition 1 in FIG. 4 includes the calculation unit 42b, and the second control system that performs control based on the machining condition 2 includes the calculation unit 42a. And At this time, for example, considering the case where the calculation unit 42a processes a 100 W output command, the oscillator input current command output from the calculation unit 42a to the power supply device 55 is 0.1 V, and the A / D converter to be used Depending on the accuracy (resolution), the S / N is low and the control is not stable. On the other hand, when the same processing is performed by the calculation unit 42b, the oscillator input current command output from the calculation unit 42b to the power supply device 55 is 0.5 V, which is a case where a general-purpose A / D converter is used. However, it is possible to obtain an S / N ratio at which the control is stable. In this way, by switching the control system according to the processing conditions, it becomes possible to finely control the output at the time of low output, and even when the maximum output power becomes large, it is expensive and highly accurate. It is possible to stabilize the output at low output without using an A / D converter.

  Next, when the switching condition of FIG. 4 is given, the selection operation of the control system when the two control systems are switched and used will be described with reference to FIGS. FIG. 5 is a flowchart showing the selection operation of the control system when the machining conditions of FIG. 4 are given. FIG. 6 shows the machining conditions output from the output command means (NC device) to each arithmetic unit. It is a figure which shows an example. The control system including the calculation unit 42a is referred to as control system A, and the control system including the calculation unit 42b is referred to as control system B.

  First, for example, machining information as shown in FIG. 6 is output from the NC device, and the calculation units 42a and 42b (hereinafter referred to as “each calculation unit”) read the machining information (step S101). Each arithmetic unit determines whether the processing command of the machining information output from the NC device is for itself, but the processing command output from the NC device is, for example, as shown in (1) of FIG. If it is for A (step S102, Yes), processing by the control system A (arithmetic unit 42a) is performed (step S103). On the other hand, for example, as shown in FIG. 6 (3), if the processing command output from the NC device is for the control system B (No in step S102), the processing by the control system B (calculation unit 42b) is performed ( Step S104).

  In the above processing, the processing information output from the NC device includes information (processing command) on which processing unit should be processed, and each processing unit makes a determination based on the information on the processing command. However, the processing may be such that each arithmetic unit itself determines. For example, when the cutting process shown in (2) of FIG. 6 is performed, since the laser output is 5000 W, the calculation unit 42a determines that it is a processing command for itself, and the control system A including the calculation unit 42a The process will be executed by.

  Further, in the above-described embodiment, the case where processing is performed by switching between two control systems has been described. However, the control system has three or more control systems and the control systems are controlled based on the processing command output from the NC device. You may make it process by switching. For example, as shown in FIG. 7, processing condition 1 (when the maximum value of laser output is 500 W or less), processing condition 2 (when the maximum value of laser output exceeds 500 W and 1500 W or less) or processing condition 3 According to (when the maximum value of the laser output exceeds 1500 W), the three control systems may be switched and processed.

  For the oscillator input current command with respect to the output command, the machining conditions 2 and 3 shown in FIG. 7 are changed to, for example, the machining condition 2 ′ and the machining condition 3 ′ shown in FIG. It may be changed as follows. For example, the processing condition 2 'means that only a difference component exceeding 500 W in the laser output (the output command from the NC device and the monitor output of the power sensor) is A / D converted. By performing such A / D conversion processing, the substantial resolution of the A / D converter can be increased, so that not only the output on the low output side is stabilized, but also the output on the high output side is more stable. Can be

  By the way, in the above-described embodiment, an example in which the threshold value of the laser output when switching between the two control systems is set to 1000 W has been described. However, it is preferable to consider the case of processing near this threshold value. . For example, when cutting mild steel having a plate pressure of 1 mm to 3.2 mm or cutting stainless steel having a plate pressure of about 1.5 mm, a laser output of about 1000 W is used.

  On the other hand, since the output of the power sensor for measuring the output of the laser oscillator is small, it is necessary to amplify the output of the power sensor by arranging an amplifier as shown in FIG. Specifically, an amplifier having a gain of about 1000 times is used. On the other hand, since the power sensor receives the leaked light from the partial reflector into the integrating sphere and further receives the leaked light, the transmittance of the partial reflector and the reflectance of the integrating sphere vary. A variation of about 20% occurs due to a variation in sensitivity of the power sensor. These variations can be corrected by measuring the actual laser output and adjusting the gain of the amplifier. Even in such a case, in view of the accumulation effect of these variations, the temperature characteristics of the amplifier, etc., 5 It is preferable to consider a variation (variation range) of about%.

  For this reason, in the above embodiment, it is preferable to consider the following two points.

  First, let us consider a case where in the configuration shown in FIG. 3, each calculation unit determines whether or not it should process itself based on output information from the NC device. For example, when processing near 1000 W, in the example of FIG. 4, the calculation unit 42 b performs calculation processing, but when the monitor output of the power sensor fluctuates to 1050 W, for example, the calculation unit 42 b interrupts the processing. Therefore, there is a concern that the processing process cannot be performed normally. Therefore, for example, when a series of processing such as drilling and cutting is being performed, it is preferable to perform control so that the processing unit being processed continuously performs the processing.

  Further, in the A / D converter that performs A / D conversion on the monitor output of the power sensor, if the monitor output of the power sensor exceeds the maximum output of the A / D converter, the output of the laser oscillator is correctly detected. I can't. Therefore, it is preferable to design the maximum output of the A / D converter to be an upper limit value in consideration of the fluctuation range of the monitor output of the power sensor.

  For the oscillator input current command in response to the output command, the machining condition 1 shown in FIG. 4 is changed to, for example, the machining condition 1 ″ shown in FIG. 9 (the machining condition 2 ″ is the same as the machining condition 2). May be. In FIG. 9, as indicated by the bold line on the graph of FIG. 9, the threshold value when switching from machining condition 1 ″ to machining condition 2 ″ is 950 W. On the other hand, the A / D converter means that it is designed so as to be able to cope with a laser output of 1000 W under the processing condition 1 ″. By setting such processing conditions, it is possible to ensure stabilization of the output at low output when the maximum output power is increased without using an expensive, high-precision A / D converter. Even when the monitor output of the power sensor fluctuates, it is possible to ensure smooth processing in each control system when the control system is switched and used.

  Further, the processing condition 2 ″ shown in FIG. 9 is a laser output (NC device) like the processing condition 2 ′ ″ shown in FIG. 10 (the processing condition 1 ′ ″ is the same as the processing condition 1 ″). Only the differential component exceeding 950 W in the output command from the power sensor and the monitor output of the power sensor) may be A / D converted, or the actual A / D converter connected to the arithmetic unit on the side that controls the high output The resolution can be increased, and not only the output on the low output side can be stabilized, but also the output on the high output side can be further stabilized.

  As described above, the present invention is preferably applied to various laser processing apparatuses that perform desired processing by irradiating a workpiece with laser light.

It is a figure which shows the whole structure of the laser processing apparatus concerning suitable embodiment of this invention. It is sectional drawing which shows the internal structure of the laser oscillator which comprises a laser processing apparatus. It is sectional drawing of the XX line part attached | subjected to FIGS. It is a figure which shows the structure of the control system which controls the input electric power to a laser oscillator. It is a graph for demonstrating the switching conditions in the case of switching and using two control systems. It is a flowchart which shows the selection operation | movement of a control system when the process conditions of FIG. 4 are given. It is a figure which shows an example of the process conditions output to each calculating part from an output command means (NC device). It is a graph for demonstrating the switching conditions in the case of switching and using three control systems. It is a graph which shows other switching conditions different from Drawing 7 in the case of switching and using three control systems. It is a graph which shows the switching conditions which considered the fluctuation | variation of the laser output at the time of switching and using two control systems. It is a graph which shows the other switching conditions different from FIG. 9 which considered the fluctuation | variation of the laser output.

Explanation of symbols

8 Control device 10, 55 Power supply device 11 Cooling device 12, 56 Laser oscillator 13, 32 Laser light 14 Laser light transmission mirror 15 Laser processing machine 16 Processing head 17 Condensing lens 18 Work piece 20 Laser resonator 21 Discharge electrode 22 Laser Medium 23 Housing 24 Blower 25 Heat exchangers 26 and 27 Total reflection mirrors 28 and 29 Partial reflection mirrors 30 and 31 Laser light reflecting means 33 Laser resonator main body 34 and 35 Opening 36 Duct 38 and 58 Power sensor 39 Optical path 41 Output command means (NC device)
42a, 42b Calculation units 51a, 51b F / F control means 52a, 52b F / B control means 53a, 53b Current value calculation means 55 Power supply devices 61, 62, 65, 66 A / D
63,64 D / A
71,72 amplifier

Claims (5)

A laser oscillator that outputs laser light, a power supply device that supplies excitation power to the laser oscillator, output detection means that detects the output of laser light output from the laser oscillator, and processing conditions including at least an output command are input. And determining an input current to be input by the power supply device to supply the required excitation power to the laser oscillator based on the output command, and calculating a control voltage based on the input current and outputting the calculated control voltage to the power supply device. A laser processing apparatus comprising:
The computing means is
A first calculation unit that processes a low-output output command in which the output command is a predetermined value or less;
A second arithmetic unit that processes a high-output output command in which the output command exceeds a predetermined value;
Have
A first A / D converter that converts a detection output of the output detection means into a digital signal and outputs the digital signal to the first arithmetic unit;
A second A / D converter that converts a detection output of the output detection means into a digital signal and outputs the digital signal to the second arithmetic unit;
With
A laser processing apparatus, wherein an A / D converter having an equivalent resolution is used as each of the first A / D converter and the second A / D converter.   A processing command for determining whether the first arithmetic unit performs processing or the second arithmetic unit performs processing is included in the machining condition, and the first arithmetic unit and the second arithmetic unit are included. The laser processing apparatus according to claim 1, wherein the laser processing apparatus is transmitted to each part.   2. The laser according to claim 1, wherein each of the first arithmetic unit and the second arithmetic unit determines whether or not the processing content is to be processed by itself based on the output command. Processing equipment. A laser oscillator that outputs laser light, a power supply device that supplies excitation power to the laser oscillator, output detection means that detects the output of laser light output from the laser oscillator, and processing conditions including at least an output command are input. And determining an input current to be input by the power supply device to supply the required excitation power to the laser oscillator based on the output command, and calculating a control voltage based on the input current and outputting the calculated control voltage to the power supply device. In a laser processing apparatus, comprising: an arithmetic unit that performs an operation; and an A / D converter that converts a detection output of the output detection unit into a digital signal and outputs the digital signal.
The calculation means is provided for each output range that is set in plural between the minimum value and the maximum value of the output command, and has a plurality of calculation units that process the output command included in the output range,
A plurality of the A / D converters are provided corresponding to the plurality of arithmetic units, and each of the plurality of A / D converters has an equivalent resolution. Among previous SL plurality of operation portions, between the lower output computing unit and the high-output-side operation portion to which the output range are adjacent, a portion of the range of the lower output calculation unit can process the output command, 5. The laser processing apparatus according to claim 4, wherein the laser processing apparatus is set so as to overlap a part of a range of an output command that can be processed by the high output side arithmetic unit.

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