JP4792333B2 - Electronic component supply apparatus and electronic component supply method - Google Patents

Description

  The present invention relates to an electronic component supply apparatus and an electronic component supply method for supplying a tab tape provided with an IC chip, and more particularly to an IC chip provided on a new supply tape tab tape accurately and quickly to a punching die. The present invention relates to a cueing electronic component supply apparatus and an electronic component supply method.

  As shown in FIG. 9, a conventional electronic component supply apparatus has a supply tape 60 in which a tab tape 62 in which a plurality of IC chips (not shown) are provided on a base material (not shown) and a spacer tape 61 are overlapped. The supply reel 10 is provided on the downstream side of the supply reel 10, and the spacer reel 11 that winds the spacer tape 61 peeled off from the tab tape 62 is provided. The spacer reel 61 is provided on the downstream side of the supply reel 10. A punching die 16 for punching the tab tape 62 for each IC chip, and a recovery reel 12 provided on the downstream side of the punching die 16 and winding the punched waste 68 of the tab tape 62 from which the IC chip is punched. ing.

  When a predetermined number of IC chips on the tab tape 62 are punched by the punching die 16 by such an electronic component supply device, it is necessary to replace the supply tape 60 held on the supply reel 10 with a new supply tape 60. is there. In this case, among the plurality of IC chips provided on the tab tape 62 of the new supply tape 60, it is necessary to feed the starting IC chip to the punching die 16 for cueing.

  Conventionally, however, such a cueing operation of the tab tape 62 of the new supply tape 60 is performed by the operator's visual observation. Therefore, it is considerably difficult to place the IC chip on the punching position of the punching die 16. It takes a long time. Further, it is difficult to position the IC chip at an appropriate punching position by visual inspection, and an error has occurred.

  The present invention has been made in consideration of the above points, and the IC chip at the starting end provided on the tab tape of the new supply tape is brought to an accurate punching position in a short time to be positioned, and a new supply is made. It is an object of the present invention to provide an electronic component supply apparatus and an electronic component supply method capable of accurately and quickly cueing an IC chip provided on a tab tape of a tape.

The present invention relates to a tab tape in which a plurality of IC chips are provided on a substrate, a supply reel that supplies a supply tape formed by stacking a spacer tape, and a spacer tape that is provided on the downstream side of the supply reel and is peeled from the tab tape. Are provided on the downstream side of the supply reel and a punching die for punching the tab tape with the spacer tape peeled off for each IC chip, and provided on the downstream side of the punching die. A recovery reel that winds up the punched-out tab tape, and the tab tape is composed of a current tab tape and a next tab tape joined to the current tab tape, and is disposed on the tab tape between the supply reel and the punching die. detector for detecting the width dimension of the member provided is provided, the said detector, the shape or size of the advance in an IC chip storage of Control unit is connected with the control unit, even after the IC chip of the end of the current tab tape has passed the detector, the width dimension data member that is inputted from the detector, pre-stored IC chip matching the widthwise dimension of the IC chip are compared widthwise dimension of in the first when it is determined, punching position of the punching抜金-type member that is the determination target is determined that the IC chip It is an electronic component supply device characterized by sending the head to the head.

  With such a configuration, the IC chip at the start end provided on the new supply tape tab tape (next tab tape) is positioned in a short time to the exact punching position, and the new supply tape tab tape (next tab tape) is positioned. It is possible to cue the provided IC chip accurately and quickly.

  The present invention is an electronic component supply apparatus characterized in that a joining jig for holding the current tab tape and the next tab tape is provided immediately after the supply reel.

  With such a configuration, the current tab tape can be held by the joining jig, and the working efficiency can be improved.

  In the present invention, each of the current tab tape and the next tab tape has a plurality of perforations along the longitudinal direction at the edge thereof, the joining jig includes a base, and a non-slip portion provided on the base, An electronic component supply apparatus comprising: a current tab tape; and a plurality of holding pins inserted into the perforation of the next tab tape, extending in a direction perpendicular to the base.

  With such a configuration, the current supply tape and the next supply tape can be easily arranged in an appropriate positional relationship with each other, and the next supply tape can be quickly and reliably joined to the current supply tape.

  The present invention is an electronic component supply apparatus provided with a holding jig for holding a punched piece of a tab tape from which an IC chip is punched, immediately before the collection reel.

  With such a configuration, the punched residue can be held by the holding jig, and the working efficiency can be improved.

  According to the present invention, the punched dregs have a plurality of perforations along the longitudinal direction at the edge thereof, and the holding jig is attached to the base, the anti-slip portion provided on the base, and the base An electronic component supply device comprising: a plurality of holding pins extending in a vertical direction and inserted into the perforation of a punched residue.

  With such a configuration, the punched residue can be held quickly and reliably.

  In the present invention, a punching counter that counts the number of IC chips punched from the tab tape with a punching die is connected to the control unit, and the control unit determines whether the number of IC chips input from the punching counter is It is an electronic component supply apparatus characterized by determining that the IC chip at the end of the tab tape has passed the detector.

  The present invention is provided with a tab tape end edge detecting unit for detecting the end of the current tab tape, and the control unit detects that the IC chip at the end of the current tab tape passes the detector based on the signal from the tab tape end edge detecting unit. It is an electronic component supply apparatus characterized by judging that it was carried out.

The present invention provides a supply step of supplying a current supply tape formed by superimposing a current tab tape having a plurality of IC chips on a base material and a current spacer tape by a supply reel, and a current spacer from the current tab tape of the current supply tape. A peeling process for peeling the tape, a spacer tape winding process for winding the current spacer tape peeled from the current tab tape by a spacer reel provided on the downstream side of the supply reel, and a striking provided on the downstream side of the supply reel. The punching process of punching the current tab tape from which the spacer tape has been peeled off by the punching die for each IC chip, and the removal of the current tab tape punched out of the IC chip by the recovery reel provided downstream of the punching die The next tab tape and the next spacer tape at the end of the recovery process for winding the waste and the current supply tape A joining step for joining the next supply tape, a passage judging step for judging that the IC chip at the end of the current tab tape has passed the detector, and a detection provided between the supply reel and the punching die. A detection step of detecting at least the dimension in the width direction of the member provided on the tab tape next time by the detector, and after the IC chip at the end of the current tab tape has passed the detector by the control unit, from the detector When the dimension data in the width direction of the inputted member is compared with the dimension in the width direction of the IC chip stored in advance and it is first determined that it matches the dimension in the width direction of the IC chip, it becomes a determination target. And a cueing step of determining a member to be an IC chip and sending it to the punching position of the punching die to cue the electronic component supply method.

  With such a configuration, the IC chip at the start end provided on the new supply tape tab tape (next tab tape) is positioned in a short time to the exact punching position, and the new supply tape tab tape (next tab tape) is positioned. It is possible to cue the provided IC chip accurately and quickly.

  According to the present invention, the control unit compares the shape data or dimension data input from the detector with the shape or dimension of the IC chip stored in advance, and determines the new supply tape tab tape (next time). The IC chip at the start end provided on the tab tape can be brought to an accurate punching position in a short time for positioning. For this reason, the IC chip provided on the tab tape of the new supply tape (next tab tape) can be accurately and quickly cued.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of an electronic component supply apparatus according to the present invention will be described below with reference to the drawings. Here, FIG. 1 to FIG. 7 are diagrams showing a first embodiment of the present invention.

  First, the supply tape 60 processed by the electronic component supply apparatus will be described with reference to FIGS. As shown in FIG. 3B, the supply tape 60 is configured by overlapping a tab tape 62 and a spacer tape 61. 3A and 3B, the tab tape 62 of the supply tape 60 includes a plurality of tabs 66 provided on a base material 67 and an IC chip 65 provided on the tab 66. is doing. As shown in FIG. 3A, a plurality of perforations 63 are provided at the edge of the supply tape 60 along the transport direction (longitudinal direction). As shown in FIG. 3B, the perforation 63 includes a perforation 63p provided on the spacer tape and a perforation 63q provided on the tab tape. Here, FIG. 3A is a schematic plan view of the supply tape 60, and FIG. 3B is a schematic cross-sectional view of the supply tape 60 cut along III-III in FIG. 3A.

  Next, the configuration of the electronic component supply apparatus of the present invention will be described with reference to FIG.

  As shown in FIG. 1, the electronic component supply apparatus includes a supply reel 10 that supplies a supply tape 60 in which a tab tape 62 and a spacer tape 61 are stacked, and a tab tape of the supply tape 60 that is provided downstream of the supply reel 10. 62 is provided on the downstream side of the peeling portion 10a for peeling the spacer tape 61 from the separation tape 10a, and is provided on the downstream side of the peeling portion 10a, the spacer reel 11 for winding the spacer tape 61 peeled off from the tab tape 62, The tab tape 62 from which the spacer tape 61 has been peeled is provided for each IC chip 65 (see FIGS. 3A and 3B). The punching die 16 is provided on the downstream side of the punching die 16. A recovery reel 12 is provided for winding the punched residue 68 of the punched tab tape 62.

  Further, as shown in FIGS. 1 and 2, a detector 1 for detecting at least the size of the next IC chip 65n provided on the next tab tape 62n described later is provided between the supply reel 10 and the punching die 16. Is provided.

  As shown in FIG. 2, the detector 1 is connected to the control unit 3 in which the dimension in the width direction of the IC chip 65 is stored in advance. Note that the width direction of the IC chip 65 refers to a horizontal direction orthogonal to the transport direction (longitudinal direction) of the tab tape 62.

  Further, as shown in FIG. 1, a joining jig 41 is provided immediately after the supply reel 10 to hold a current supply tape 60m and a next supply tape 60n, which will be described later.

  As shown in FIGS. 4A and 4B, the joining jig 41 includes a base 21, a non-slip portion 22 embedded on the base 21 and fixed by a fixing pin 21 p, and the base 21. A plurality of holding pins 25 extending in a direction perpendicular to the supply tape and inserted into the perforation 63 of the supply tape (that is, the perforation 63p of the spacer tape 61 and the perforation 63q of the tab tape 62 (see FIG. 3B)) are provided. Yes. The anti-slip portion 22 is made of a material having a high friction coefficient such as rubber or vinyl. Here, FIG. 4A is a schematic plan view of the joining jig 41 as viewed from above, and FIG. 4B is a cross-sectional view of the joining jig 41 taken along IV-IV in FIG. FIG.

  4A and 4B, when the current tab tape 62m and the next tab tape 62n, which will be described later, are not held by the joining jig 41, the upper cover is placed on the base 21 and the anti-slip portion 22. 29 is covered. The upper cover 29 is provided with a plurality of holes 28 corresponding to the holding pins 25.

  Further, as shown in FIGS. 4A and 4B, a magnet 27q is provided on the base 21. Further, when the upper cover 29 is placed on the base 21 and the anti-slip portion 22, the upper cover 29 faces the magnet 27 q and is attracted to the base 21 by the magnetic force of the magnet 27 q. Is provided to the base 21 and the anti-slip portion 22.

  Further, as shown in FIGS. 4A and 4B, an upper cover positioning pin 23 is provided on the base 21. The upper cover 29 is inserted into the upper cover 29 when the upper cover 29 is placed on the base 21 and the anti-slip portion 22, and the upper cover 29 is attached to the base 21 and the anti-slip portion 22. Positioning holes 24 for positioning are provided.

  Further, as shown in FIG. 1, immediately before the collection reel 12, a holding jig for holding the punched scrap 68 when the punched scrap 68 of the tab tape 62 from which the IC chip 65 has been punched is cut at a predetermined location. 42 is provided.

  The holding jig 42 has substantially the same configuration as the joining jig 41 described above. Specifically, as shown in FIGS. 5A and 5B, the holding jig 42 includes a base 31, a non-slip portion 32 embedded in the base 31, and fixed by a fixing pin 31p, and a base. And a plurality of holding pins 35 that extend in a direction perpendicular to the base 31 and are inserted into a perforation 63q (corresponding to the perforation 63q of the tab tape 62 (see FIG. 3 (b))) provided in the punched residue 68. Yes. The anti-slip portion 32 is made of a material having a high friction coefficient such as rubber or vinyl. Here, FIG. 5A is a schematic plan view of the holding jig 42 as viewed from above, and FIG. 5B is a cross-sectional view of the holding jig 42 of FIG. FIG.

  As shown in FIGS. 5 (a) and 5 (b), the upper cover 39 is placed on the base 31 and the anti-slip portion 32 when the punching piece 68 is not held by the holding jig 42. . The upper cover 39 is provided with a plurality of holes 38 corresponding to the holding pins 35.

  Further, as shown in FIGS. 5A and 5B, a magnet 37 q is provided on the base 31. When the upper cover 39 is placed on the base 31 and the anti-slip portion 32, the upper cover 39 faces the magnet 37q and is attracted to the base 31 by the magnetic force of the magnet 37q. Is provided to the base 31 and the anti-slip portion 32.

  Further, as shown in FIGS. 5A and 5B, an upper cover positioning pin 33 is provided on the base 31. The upper cover 39 is inserted into the upper cover 39 when the upper cover 39 is placed on the base 31 and the anti-slip portion 32, and the upper cover 39 is attached to the base 31 and the anti-slip portion 32. A positioning hole 34 is provided for positioning.

  As shown in FIG. 2, the control unit 3 is connected to a punching counter 5 that counts the number of IC chips 65 punched from the tab tape 62 by the punching die 16.

  Next, the operation of the present embodiment having such a configuration will be described.

  In the electronic component supply apparatus as described above, when the number of tabs 66 left on the tab tape 62 decreases, it is necessary to replace the supply tape 60 held on the supply reel 10 with a new supply tape 60. Here, the supply tape 60 that has been used until the replacement is hereinafter referred to as the current supply tape 60m, and the supply tape 60 that is newly supplied by the supply reel 10 is hereinafter referred to as the next supply tape 60n.

  Further, the tab tape constituting the current supply tape 60m will be referred to as the current tab tape 62m, the spacer tape will be referred to as the current spacer tape 61m, the IC chip will be referred to as the current IC chip 65m, and the tab will be referred to as the current tab 66m. On the other hand, the tab tape constituting the next supply tape 60n will be referred to as the next tab tape 62n, the spacer tape will be referred to as the next spacer tape 61n, the IC chip will be referred to as the next IC chip 65n, and the tab will be referred to as the next tab 66n. As shown in FIG. 2, a barcode 75 for managing lots is provided on the start edge 62s side of the next tab tape 62n.

  Hereinafter, the operation of the present embodiment will be described in the form of a combination of the current supply tape 60m and the next supply tape 60n.

  First, the supply reel 10 for supplying the current supply tape 60m formed by overlapping the current tab tape 62m and the current spacer tape 61m is rotated (supply process 81) (see FIGS. 1 and 6).

  Next, in the peeling portion 10a, the current spacer tape 61m is peeled from the current tab tape 62m of the current supply tape 60m, and the current spacer tape 61m peeled from the current supply tape 60m is wound around the spacer reel 11 (spacer tape winding). Taking step 83) (see FIGS. 1 and 6). At this time, the current tab tape 62m is conveyed to the punching die 16 side (see FIG. 1).

  Next, the current tab 66m of the current tab tape 62m that has been transported and positioned to the punching die 16 is punched by the punching die 16 (punching step 84) (FIGS. 1, 2, and FIG. 2). 6). At this time, the number of the current tabs 66m punched from the current tab tape 62m by the punching die 16 is counted by the punching counter 5.

  Next, the punched residue 68 in which the current tab 66m is punched by the punching die 16 is wound up by the recovery reel 12 (recovery step 85) (see FIGS. 1 and 6).

  Thus, when the current tabs 66m provided with the current IC chip 65m are punched by a predetermined number at the punching position of the punching die 16, the number of the current tabs 66m provided on the current tab tape 62m is reduced. Then, the current supply tape 60m is removed from the supply reel 10, and a new next supply tape 60n is attached to the supply reel 10 (replacement step 86) (see FIGS. 1 and 6).

  At this time, the perforation 63m of the current supply tape 60m is inserted into the plurality of holding pins 25 of the joining jig 41 provided immediately after the supply reel 10 (see FIGS. 1, 6, and 7A). Thus, the current supply tape 60m can be held by the joining jig 41, the current spacer tape 61m is peeled off, and the current tab tape 62m wound around the supply rotation rollers 71p, 71q, 71r, 71s is supplied to the supply rotation. It is possible to prevent the rollers 71p, 71q, 71r, 71s from coming off (see FIG. 1).

  If the current tab tape 62m is disengaged from the supply rotation rollers 71p, 71q, 71r, 71s, the current tab tape 62m must be wrapped around the supply rotation rollers 71p, 71q, 71r, 71s. (See FIG. 1). Therefore, the work efficiency can be improved by holding the current supply tape 60m with the joining jig 41 as described above.

  Next, after the perforation 63n of the next supply tape 60n is inserted into the plurality of holding pins 25 of the joining jig 41, the start edge 60s of the next supply tape 60n is joined to the current supply tape 60m by the joining tape 69 (joining) Step 87) (see FIG. 7) (see FIG. 1, FIG. 6 and FIG. 7 (b)). At this time, the tab tape 62 includes a current tab tape 62m and a next tab tape 62n joined to the current tab tape 62m.

  Here, as shown in FIGS. 4A and 4B, the joining jig 41 includes a base 21, a non-slip portion 22 that is fixed on the base 21 and made of a material having a high friction coefficient, and a base. And a plurality of holding pins 25 inserted into the perforations 63m and 63n provided on the supply tapes 60m and 60n. For this reason, the current supply tape 60m and the next supply tape 60n can be easily arranged in an appropriate positional relationship with each other. As a result, the next supply tape 60n can be quickly and reliably joined to the current supply tape 60m.

  Next, the supply process 81, the spacer tape winding process 83, the punching process 84, and the collecting process 85 are sequentially performed, and the remaining current tab 66m provided on the current tab tape 62m is punched with the punching die 16 ( Remaining tab punching step 89) (see FIGS. 1, 2 and 6).

  Next, in the control unit 3, the current IC chip 65f on the current tab 66f at the end of the current tab tape 62m determines the detector 1 based on the number of punched current tabs 66 input from the punching counter 5 to the control unit 3. It is determined that it has passed (passage determination step 91) (see FIGS. 1, 2 and 6).

Next, the detector 1, any member on the tab tape 62 (e.g., splicing tape 69, the bar code 75 or the like provided in the next tab tape 62n (see FIG. 2)) for detecting the width dimension of (Detection Step 92) (see FIGS. 1, 2 and 6).

  Thereafter, the dimension data in the width direction of the member is input from the detector 1, and the dimension data in the width direction is compared with the dimension data in the width direction of the IC chip 65 stored in advance in the control unit 3 ( Determination step 93) (see FIGS. 1, 2 and 6).

Next, the control unit 3, after passing through decision step 91, when the dimension data in the widthwise direction input from the detector 1, was first determined that matches the size of the IC chip 65 which is pre-stored, determining The target member is determined to be the next IC chip 65s (65n) on the next tab 66s (66n) provided at the beginning of the next tab tape 62n. Then, the next IC chip 65s at the start of the next tab tape 62n is sent to the punching position of the punching die 16 by the controller 3, and the next IC chip 65s at the start of the next tab tape 62n is cueed (head). Step 94) (see FIGS. 1, 2 and 6).

  Then, after punching the next tab 66s at the start of the next tab tape 62n with the punching die 16, the above-described steps are repeated for the next supply tape 60n.

As described above, according to this embodiment, the control unit 3, after determining that the current IC chip 65f on the current tab 66f of the end of the current tab tape 62m passes through the detector 1 is inputted from the detector 1 that size data, when the first determined that matches the size of the IC chip 65 which is pre-stored, member which is the determination target, the next IC chip 65s on the next tab 66s of the start of the next tab tape 62n It is judged and sent to the punching position of the punching die 16. In this way, the next IC chip 65s at the start end provided on the next tab tape 62n is positioned and positioned at an accurate punching position in a short time, so that the next IC chip 65s at the start end of the next tab tape 62n is accurately and quickly set. Can cue to

  Note that, when the scrap 68 is wound up to the allowable limit, it is necessary to remove the scrap 68 from the collection reel 12. At this time, the perforation 63q of the punched residue 68 (corresponding to the perforation 63q of the tab tape 62) is formed on the plurality of holding pins 35 of the holding jig 42 provided immediately before the recovery reel 12 (see FIGS. 3A and 3B). ) Is inserted and the punched residue 68 is held, and then the punched residue 68 is cut at a predetermined location (see FIGS. 5A and 5B). As a result, the extraction waste 68 can be held by the holding jig 42, and the extraction waste 68 wound around the collection rotation rollers 72p, 72q, 72r is prevented from being detached from the collection rotation rollers 72p, 72q, 72r. (See FIG. 1).

  Here, if the extraction waste 68 is detached from the collection rotation rollers 72p, 72q, and 72r, it is necessary to wrap the extraction waste 68 around the collection rotation rollers 72p, 72q, and 72r again, resulting in a reduction in work efficiency ( (See FIG. 1). Therefore, the work efficiency can be improved by holding the punched residue 68 with the holding jig 42 as described above.

  5A and 5B, the holding jig 42 includes a base 31, a non-slip portion 32 that is fixed on the base 31 and made of a material having a high friction coefficient, and the base 31. And a plurality of holding pins 35 that are inserted into the perforations 63q of the punched residue 68. For this reason, the punched residue 68 can be held quickly and reliably.

Modification Next, a modification of the embodiment of the present invention will be described with reference to FIG. The modification shown in FIG. 8 uses a tab tape end edge detection unit 6 that detects the end edge 62e of the current tab tape 62 instead of the punching counter 5, and the other embodiments are the same as those shown in FIGS. It is almost the same as the form.

  In the modification shown in FIG. 8, the same parts as those in the embodiment shown in FIG. 1 to FIG.

  As shown in FIG. 8, by using the tab tape end edge detection unit 6 that detects the end edge 62 e of the current tab tape 62 connected to the control unit 3, the control unit 3 outputs a signal from the tab tape end edge detection unit 6. Based on this, it can be determined that the current IC chip 65f at the end of the current tab tape 62m has passed the detector 1.

  Note that, as in the above-described embodiment and modification, it is determined using the punching counter 5 and the tab tape end edge detection unit 6 that the current IC chip 65f at the end of the current tab tape 62m has passed the detector 1. However, the operator may determine that the current IC chip 65f at the end of the current tab tape 62m has passed the detector 1 by the operator.

  In the embodiment and the modification described above, the control unit 3 in which the dimension data in the width direction of the IC chip 65 is stored in advance and the detector 1 detects the dimension in the width direction of the IC chip 65 are used. However, the present invention is not limited to this, and a mode in which the detector 1 detects the shape of the IC chip 65 using the control unit 3 in which the shape data of the IC chip 65 is stored in advance may be used.

1 is a schematic side view showing an embodiment of an electronic component supply apparatus according to the present invention. Schematic which shows embodiment of the electronic component supply apparatus by this invention. Schematic which shows the supply tape of the electronic component supply apparatus by this invention. Schematic which shows the joining jig of the electronic component supply apparatus by this invention. Schematic which shows the holding jig of the electronic component supply apparatus by this invention. The flowchart which shows embodiment of the electronic component supply method by this invention. The schematic plan view which shows the aspect which joins the present supply tape and the next supply tape with the joining jig | tool of the electronic component supply apparatus by this invention. Schematic which shows the modification of the electronic component supply apparatus by this invention. The schematic side view which shows the conventional electronic component supply apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Detector 3 Control part 5 Punching counter 6 Tab tape end edge detection part 10 Supply reel 11 Spacer reel 12 Recovery reel 16 Punching die 41 Joining jig 42 Holding jig 60 Supply tape 61 Spacer tape 62 Tab tape 62m Present tab tape 62n Next tab tape 65 IC chip 65f Current tab tape end IC chip 65s Next tab tape start end IC chip 66f Current tab tape end tab 66s Next tab tape start end tab 66 Tab 67 Base material 68 Dregs 71p, 71q, 71r, 71s Supply rotation rollers 72p, 72q, 72r Recovery rotation roller 81 Supply process 83 Spacer tape winding process 84 Punching process 85 Recovery process 86 Replacement process 87 Joining process 89 Remaining tab punching process 91 Passage determination process 92 Detection process 93 Determination process 94 Cueing process

Claims (8)

A supply reel for supplying a supply tape formed by stacking a tab tape having a plurality of IC chips on a base material and a spacer tape;
A spacer reel provided on the downstream side of the supply reel and winding the spacer tape peeled off from the tab tape;
A punching die provided on the downstream side of the supply reel and punching the tab tape from which the spacer tape is peeled for each IC chip;
Provided on the downstream side of the punching die, and a recovery reel for winding the punched-out tab tape from which the IC chip is punched,
The tab tape consists of the current tab tape and the next tab tape joined to the current tab tape.
A detector is provided between the supply reel and the punching die to detect a dimension in the width direction of a member provided on the tab tape,
A control unit in which the shape or dimensions of the IC chip is stored in advance is connected to the detector,
Control unit, even after the IC chip of the end of the current tab tape has passed the detector, the width dimension data member that is inputted from the detector, the width dimension of the pre-stored IC chip comparison When it is first determined that the width of the IC chip coincides with the dimension in the width direction, the member to be determined is determined to be an IC chip and sent to the punching position of the punching die. An electronic component supply device characterized by the above.   2. The electronic component supply apparatus according to claim 1, wherein a joining jig for holding the current tab tape and the next tab tape is provided immediately after the supply reel. Each of the current tab tape and the next tab tape has a plurality of perforations along the longitudinal direction at the edge thereof,
The joining jig is provided on the base, on the base, and a non-slip portion that stops slipping of the current tab tape and the next tab tape with respect to the base, and extends in a direction perpendicular to the base. The electronic component supply apparatus according to claim 2, further comprising a plurality of holding pins inserted into the perforations.   2. The electronic component supply apparatus according to claim 1, further comprising a holding jig that holds the punched residue of the tab tape from which the IC chip is punched immediately before the recovery reel. The punched debris has a plurality of perforations along the longitudinal direction at the edge thereof,
The holding jig is provided on the base, the anti-slip portion that stops the slip of the punched residue relative to the base, and extends in a direction perpendicular to the base, and is inserted into the perforation of the punched residue. The electronic component supply apparatus according to claim 4, further comprising a plurality of holding pins. A punching counter that counts the number of IC chips punched from the tab tape with a punching die is connected to the control unit,
2. The electronic component supply apparatus according to claim 1, wherein the control unit determines that the last IC chip at the end of the tab tape has passed the detector based on the number of IC chips input from the punching counter. A tab tape end detection unit that detects the end of the current tab tape is provided,
2. The electronic component supply apparatus according to claim 1, wherein the control unit determines that the IC chip at the end of the current tab tape has passed the detector based on a signal from the tab tape end edge detection unit. A supply step of supplying a current supply tape formed by superimposing a current tab tape having a plurality of IC chips provided on a substrate and a current spacer tape by a supply reel;
A peeling step of peeling the current spacer tape from the current tab tape of the current supply tape;
A spacer tape winding step of winding the current spacer tape peeled from the current tab tape by the spacer reel provided on the downstream side of the supply reel;
A punching step of punching the current tab tape from which the spacer tape has been peeled off for each IC chip by a punching die provided on the downstream side of the supply reel;
A recovery step of winding up the punched-out piece of the current tab tape from which the IC chip has been punched by a recovery reel provided downstream of the punching die;
Joining the next supply tape consisting of the next tab tape and the next spacer tape at the end of the current supply tape,
A passage determining step for determining that the IC chip at the end of the tab tape has passed the detector;
A detection step of detecting at least a dimension in a width direction of a member provided on the next tab tape by a detector provided between the supply reel and the punching die;
By the control unit, even after the IC chip of the end of the current tab tape has passed the detector, the width dimension data member that is inputted from the detector, the width dimension of the pre-stored IC chip When it is first determined that the size in the width direction of the IC chip matches and is determined, the member to be determined is determined as an IC chip and sent to the punching position of the punching die. Cueing process;
An electronic component supply method comprising:

Images