JP4773110B2 - Stereolithography equipment - Google Patents

Description

  The present invention relates to an optical modeling apparatus that models a three-dimensional object by irradiating a predetermined photocurable resin with light such as laser light, and more particularly to an optical modeling apparatus suitable for modeling an object having a micron-order size.

  For a certain three-dimensional object, the photo-curing resin is cured in accordance with the shape of the slice cross-section sequentially for all slice cross-sections, thereby realizing an optical modeling technique for modeling the three-dimensional solid and this Stereolithography apparatuses are already known (for example, see Patent Documents 1 to 3). Various methods for modeling have been proposed. In any case, for example, in the irradiation range determined by the cross-sectional shape data obtained from solid shape data (for example, CAD data) representing a three-dimensional object, for example, a laser. It is almost common in that a three-dimensional object is formed by irradiating light such as light to a predetermined photocurable resin and sequentially laminating a cured resin layer corresponding to each cross section. is doing.

JP 2004-249508 A JP 2002-316363 A Japanese Patent No. 3294833

  The stereolithography technique is a technique that has been conventionally used in various product prototyping scenes because the model can be modeled relatively easily from design data. In recent years, the object of modeling has become smaller, and research on applying the technology to so-called micromachining has become active.

  In the case of micromachining, since the size required as the overall size of the modeled object is about several hundreds μm at the maximum, the component part is required to be modeled with a size that is at least one order smaller. In order to realize this, it is necessary to realize a modeling accuracy of several tens of μm or less, more preferably about 10 to 20 μm or less.

  In the optical modeling apparatus, the thickness accuracy of the resin layer to be laminated is one of the factors that influence the modeling accuracy, and it is considered necessary to increase the accuracy of the resin layer forming process. In the case of a so-called stacked stack type optical modeling apparatus in which a resin is supplied each time a resin layer is formed and cured, the process for forming the resin layer includes the process of supplying the resin to the modeling surface and the supplied resin. In the latter case, it is necessary that a clean state be realized when smoothing means called a recoater or squeegee smoothes. For example, if the resin scraped off during the previous layer formation adheres, it becomes a factor that hinders smoothing during the formation of a new resin layer.

  Patent Document 1 discloses a stereolithography apparatus having an aspect in which an exposure light irradiation source is fixed and the stage side is moved, but there is no disclosure regarding a specific aspect of forming a resin layer. .

  In the apparatus disclosed in Patent Document 2, exposure is performed by scanning the irradiation means, but nothing is disclosed regarding the smoothing of the resin layer.

  Patent Document 3 discloses a so-called free liquid level apparatus that performs modeling by repeating exposure of the liquid level and lowering of the stage in a tank filled with resin in advance. Even in such a device, there is a doctor blade as a smoothing means, but in this system, since the smoothing means is always immersed in the liquid surface of the resin in the first place, the problem related to the adhesion of the resin is Does not occur.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a stereolithography apparatus suitable for micromachining, in which high-precision resin layers are realized.

In order to solve the above-mentioned problems, the invention of claim 1 is to sequentially form a plurality of flat resin layers by curing a predetermined resin, and sequentially stack the resin layers each time the resin layers are formed. By doing so, it is an optical modeling device that models a predetermined three-dimensional modeled object, and a modeling unit in which the three-dimensional modeled product is modeled, a storage unit that is provided outside the modeling unit, and stores the resin, respectively A supply means for supplying a predetermined amount of the resin from the storage portion to the modeling portion each time the resin layer is formed, and a smoothing member having at least a tip portion having a substantially flat plate shape , Smoothing means for smoothing the supplied resin, and the light emitted from the light source has a plurality of micromirrors, and the reflection of each micromirror is turned on / off by changing the attitude of each micromirror Set individually Similar capacity modulation means, after is reflected by the ON / OFF state corresponding to the molding shape formed on the resin layer, irradiating means for irradiating the smoothed on the shaping part resin, predetermined drive means A cleaning unit that cleans the smoothing unit by wiping the tip portion with a wiping member that is movable along the smoothing member, and the modeling unit is movably provided in a horizontal direction A horizontal drive mechanism , wherein the supply means, the smoothing means, and the irradiation means are provided at separate positions in substantially the same horizontal plane, and the modeling unit includes the supply means and the smoothing The horizontal driving mechanism can be moved horizontally below the fixed position of the means and the irradiation means, and the supply means, the smoothing means, and the light source are directly below the fixed position. By facing in the unit, formed by enabling the supply of the resin and irradiating the light to the smoothing and the resin of the resin, characterized in that.

Invention of Claim 2 is the optical modeling apparatus of Claim 1 , Comprising: The said cleaning means moves along the said smoothing member, pressing the press-contact surface of the said wiping member to the said front-end | tip part. It is characterized by cleaning.

A third aspect of the present invention, an optical shaping apparatus according to claim 2, wherein the wiping member is a porous member, it is characterized.

A fourth aspect of the present invention, an optical shaping apparatus according to claim 2, wherein the wiping member is a member made with a random three-dimensional network structure, characterized in that.

The invention according to claim 5 is the optical modeling apparatus according to claim 2 , wherein the wiping member is a laminate formed by laminating and bonding a predetermined nonwoven fabric material.

According to the invention of claims 1 to 5, it is possible to reliably remove the resin adhered to the end of the smoothing member, in a state in which uncured resin adhering during the previous smoothed remained The next smoothing process is not performed . Therefore, the resin does not fall on the smoothed resin layer, or the adhesion of the applied resin to the smoothing means is not promoted, so the variation in the thickness of the resin layer in modeling is increased. Can be prevented.

In particular, according to the invention of claims 3 to 5, it is possible to reliably remove the resin in a single cleaning operation.

In particular, according to the inventions of claims 4 and 5 , a force sufficient to pull the resin away from the smoothing member at the time of wiping can be applied substantially uniformly, and the removed resin is held inside. Therefore, the resin once removed is not attached again to the smoothing member.

  FIG. 1 is a schematic cross-sectional view schematically showing a configuration of an optical modeling apparatus 100 according to the present embodiment. The optical modeling apparatus 100 repeats exposure based on shape data on a photo-curing resin (hereinafter, also simply referred to as “resin”) applied to a predetermined thickness in a predetermined application region, along with the lamination of the resins, It is an apparatus that can form a three-dimensional object by a so-called additive manufacturing method. The optical modeling apparatus 100 includes a light source unit 10, an illumination optical system 20, a projection optical system 30, an image plane observation system 40, a modeling unit 50, a supply unit 60, a smoothing unit 70, and a cleaning unit 80. The vacuum fixing unit 90 and the control computer PC are mainly provided. Note that FIG. 1 merely schematically shows the configuration of each part, and the magnitude relationship of each component does not necessarily reflect the actual state.

  The light source unit 10 emits exposure light from a predetermined light source 11 via a heat ray cut filter 12. The kind of the light source 11 is not specifically limited, For example, an appropriate thing can be used in the range which can harden resin used for modeling, such as a laser, a lamp | ramp, and LED. That is, light having an appropriate wavelength such as UV light, visible light, or infrared light can be used as the exposure light. Moreover, the aspect formed so that several types of light sources can be switched may be sufficient. The exposure light emitted from the light source 11 is guided to the illumination optical system 20 by the optical fiber 13.

  Although the detailed illustration of the illumination optical system 20 is omitted, the exposure light from the light source is appropriately reflected and irradiated to a modulation means 21 such as a DMD (digital mirror device), and the reflected light is illustrated. The light is incident on the projection optical system 30 while adjusting with a predetermined lens group.

Here, the case where DMD is used as the modulation means 21 will be outlined. In the DMD, unit blocks in which minute mirrors are two-dimensionally arranged are arranged one-dimensionally, and a drive memory cell corresponding to each mirror is provided, and an ON to the drive memory cell is provided. / by in accordance with the OFF write state to change the orientation of each mirror, the switching of the oN / OFF of incidence of the exposure light to the projection optical system 30 is made to be in the mirror unit. Since the presence or absence of irradiation of the exposure light in the minute area can be set corresponding to each mirror, the modeling unit 50 described later performs exposure with the irradiation range of the reflected light from each mirror as an exposure unit. I can do it. Then, by setting ON / OFF of writing to the drive memory cell corresponding to each mirror according to the content of the cross-sectional shape data representing each slice cross-section, the irradiation area of the exposure light can be determined according to the data. since a Turkey determined according to the cross-sectional shape which is expressed can be, it is possible to expose only the range defined in accordance with the cross-sectional shape. When such a DMD is used, for example, an exposure size area of 1024 pixels × 768 pixels can be exposed.

  The modulation means 21 is not limited to one that performs two-dimensional control such as DMD, but one that performs one-dimensional control such as a liquid crystal shutter or one that controls a point beam. The mode to be used may be used. However, it goes without saying that two-dimensional control such as DMD is preferable from the viewpoint of exposure efficiency.

  The projection optical system 30 is responsible for the exposure process using the exposure light incident from the modulation means 21. The projection optical system 30 irradiates the exposure light from the objective lens 34 onto the modeling base 51 of the modeling unit 50 in a focused state while adjusting the exposure light with the predetermined lens group 31 and the mirror group 32. The reflected light from the modeling unit 50 is received by the objective lens 34, branched by the beam splitter 33 provided on the optical path of the projection optical system 30, and guided to the image plane observation system 40.

  In the optical modeling apparatus 100 according to the present embodiment, the objective lens 34 is fixed to the base 1 and arranged so as to irradiate exposure light vertically downward. That is, exposure is performed with the direct irradiation source fixed. In this mode, compared to the case where exposure is performed by moving or scanning the irradiation source, the focus state is stabilized by fixing the optical path length, the amount of light fluctuation caused by movement, etc. It has advantages such as low vibration. If a method of moving or scanning the irradiation source is adopted, if the stacking thickness is 20 μm or less and the planar resolution is 5 μm or less, the scanning deviation of the exposure light affects the modeling accuracy, and the accuracy is further improved. I can't expect. That is, the arrangement mode of the projection optical system 30 according to the present embodiment is a mode that contributes to the improvement of the planar resolution during modeling.

  Furthermore, as will be described later, the optical modeling apparatus 100 has a modeling unit 50 in which a resin is smoothly applied to the modeling substrate 51 in another place, which is arranged immediately below the objective lens 34 by the horizontal drive mechanism 54. It is configured to perform the above exposure. That is, since no other components are interposed between the objective lens 34 and the modeling substrate 51, exposure is performed with the exposure target surface on the modeling substrate 51 sufficiently close to the objective lens 34. Is done. Preferably, the distance between them is 20 μm or less.

  The image plane observation system 40 receives the light from the beam splitter 33, that is, the reflected light from the modeling unit 50 by the CCD camera 42 while adjusting the predetermined lens group 41, and displays the received image on the monitor 43. . As a result, when exposure is performed with exposure light, the reflected light is received so that the state during exposure (modeling state) can be directly observed.

  The modeling unit 50 is a place where a three-dimensional object is modeled. In the modeling part 50, the modeling tank 53 which has the stage 52 which can fix the modeling base material 51 used as the base member in the case of modeling inside is provided. As the modeling substrate 51, a glass substrate or other appropriate flat plate member can be used. It may be selected and used as appropriate depending on the type of resin, the structure and size of the shaped article. The modeling area in the modeling substrate 51 varies depending on the configuration of the modulation unit 21 and the projection optical system 30, but if a DMD having an exposure area of 1024 pixels × 768 pixels is used for the modulation unit 21, for example, Modeling is possible in an area of 15 cm × 15 cm.

  FIG. 2 is a diagram illustrating the state of modeling in the optical modeling apparatus 100. In modeling, based on the cross-sectional shape data, by repeating the application and exposure of the resin layer on the modeling substrate 51, the modeling object 53, which is a laminate of resin layers cured by exposure, is formed in the modeling tank 53. The uncured portion of the resin P is accumulated step by step. When the viscosity of the resin is low, the cured portion is immersed in the resin liquid collected in the modeling tank 53. In any case, the three-dimensional object formed on the modeling substrate 51 can be obtained by lifting the modeling object M from the modeling tank 53 together with the modeling substrate 51 when the processing for all the cross sections is completed. Become. In this case, uncured resin may adhere to the periphery of the three-dimensional object, but these are removed by a predetermined cleaning means or the like.

  The modeling tank 53 is movable in the horizontal direction (preferably in the XY biaxial direction) by the horizontal drive mechanism 54. In the optical modeling apparatus 100 according to the present embodiment, the supply unit 60 responsible for supplying the resin to the modeling unit 50, the smoothing unit 70 responsible for smoothing the supplied resin, and the smoothed resin The objective lens 34 responsible for the exposure is provided at different positions, and the modeling unit 50 is sequentially moved by the horizontal drive mechanism 54 to perform the respective processes. Therefore, the modeling part 50 is configured to be movable between these parts by the horizontal drive mechanism 54. The horizontal drive mechanism 54 can be realized by a known drive mechanism such as a ball screw. Preferably, the driving accuracy by the horizontal driving mechanism 54 is ± 0.5 μm or less. The stage 52 can be moved in the vertical direction (Z-axis direction) in the modeling tank 53 by a vertical drive mechanism (elevator) 55. It is preferable that the vertical drive mechanism 55 can realize precise positioning with a drive accuracy of ± 0.2 μm. This is possible by using a known linear scale, for example.

  In the modeling part 50, it respond | corresponds to the cross-sectional shape according to cross-sectional shape data with respect to the photocurable resin apply | coated by the predetermined thickness on this modeling base material 51 by the effect | action of the supply part 60 and the smoothing part 70 which are mentioned later By irradiating from the objective lens 34 the exposure light whose irradiation range is determined, only the irradiation range of the resin is cured, thereby realizing a partial cross section with the three-dimensional object to be modeled. The formed resin layer is formed. Strictly speaking, when a resin layer is already formed, a new resin is applied on the resin layer. However, in the present embodiment, for the sake of simplicity of expression, a resin layer is formed “on the modeling substrate 51” or “on the modeling substrate 51” for these aspects including the case described above. Or an expression such as irradiating exposure light.

  When such exposure is performed, the vertical drive mechanism 55 lowers the stage 52 together with the resin laminate formed thereon by a predetermined distance, and the same processing is performed on the next cross section. By repeating this process from the lowermost part to the uppermost end of the three-dimensional object by a predetermined step, a three-dimensional object is obtained.

  The supply unit 60 is responsible for supplying a predetermined amount of photocurable resin to the modeling unit 50 during such modeling. Specifically, a predetermined amount of modeling resin stored in the pressurized tank 62 is supplied in a state where the horizontal driving mechanism 54 is driven and the modeling unit 50 is disposed at a position directly below the dispenser nozzle 61. Through the dispenser nozzle 61 fixed to the base body 1, the material is supplied onto the modeling substrate 51 of the modeling unit 50. The supply amount of the resin for one supply can be adjusted by controlling and controlling the pressurization state in the pressurization tank 62 and the opening and closing of the dispenser valve 64 by the dispenser controller 65. The pressurized tank 62 preferably has a stirring function, and can perform a stirring operation in response to a predetermined operation instruction. Thereby, the state of the resin in the pressurized tank 62 can be kept more uniform. In addition, since no other constituent elements are interposed between the dispenser nozzle 61 and the modeling substrate 51 when supplying the resin, the resin in a state where the dispenser nozzle 61 and the modeling substrate 51 are sufficiently close to each other. Supply is realized. Moreover, the supply mode of the resin in performing modeling for one cross section can be appropriately determined according to the type of resin, the shape of the cross section to be modeled, and the like. Accordingly, the supply amount is determined as appropriate.

  The smoothing unit 70 performs a process of smoothing the resin supplied from the supply unit 60 by the recoater 71 provided on the base 1. The recoater 71 is also called a squeegee, a knife edge, or the like. For example, the recoater 71 is a member having a substantially flat plate shape at least at the tip.

  The smoothing of the resin in the smoothing unit 70 is performed by moving the modeling unit 50 after the resin is supplied onto the modeling substrate 51 by the supply unit 60 to a position directly below the smoothing unit 70 by the horizontal drive mechanism 54. Done. When the recoater 71 provided so as to be able to advance and retreat is moved from one end above the modeling substrate 51 to the other end by the action of a predetermined driving means (not shown) after the arrangement relationship is realized, the modeling substrate The resin applied on 51 is made uniform by being scraped off by the recoater 71 or the like. The excess resin scraped off is discharged to a discharge unit (not shown).

  At this time, the distance between the recoater 71 and the modeling base 51 (or the resin layer cured immediately before) when the recoater 71 moves defines the thickness when the applied resin is subjected to exposure. However, in the optical modeling apparatus 100 according to the present embodiment, the stage 52 (that is, the modeling substrate 51) can be precisely positioned by the vertical drive mechanism 55 as described above, and at the time of smoothing. Since no other components are interposed between the recoater 71 and the modeling substrate 51, smoothing in a state where the recoater 71 and the modeling substrate 51 are sufficiently close to each other is realized. Preferably, a state in which the distance between the two is about 10 μm is realized. After the exposure of the resin layer, the vertical drive mechanism 55 lowers the stage 52 (that is, the modeling substrate 51) by a distance corresponding to the thickness prior to the application of the next resin. As a result of repeated application of this resin, exposure, and lowering of the stage 52, the optical modeling apparatus 100 according to the present embodiment is about 10 μm in thickness, which is very fine compared to the conventional optical modeling apparatus. The resin layer can be formed with a thickness of.

  Here, the meaning of the arrangement relationship of the objective lens 34 (projection optical system 30), the modeling unit 50, the supply unit 60, and the smoothing unit 70 described above will be described. In general, from the viewpoint of improving modeling accuracy in an optical modeling apparatus, it is necessary to accurately align the focus of the exposure light with the resin surface. For this purpose, the distance between the objective lens 34 and the irradiation position is made as short as possible. Is preferred. In order to improve the accuracy of coating thickness of the resin, it is preferable that the supply means for supplying the resin and the smoothing means for smoothing the supplied resin are as close as possible to the modeling surface.

  Temporarily, if a mechanism that moves the projection optical system of exposure light while fixing the modeling part is adopted, the supply means and smoothing means operate between the modeling part and the projection optical system when supplying and smoothing the resin. Need to be made. In that case, the arrangement of the supply means and the smoothing means is greatly restricted. It is possible to employ a mechanism that retracts the projection optical system during the operation of the supply means and the smoothing means, and conversely retracts the supply means and the smoothing means at the time of exposure. Of course, the exposure accuracy of the exposure light is inferior to that of the aspect in which the projection optical system is fixed, which is not preferable from the viewpoint of improving the modeling accuracy.

  On the other hand, in the optical modeling apparatus 100 shown in FIG. 1, the supply part 60 for supplying resin, the smoothing part 70 which smoothes the supplied resin, and exposure to the smoothed resin is performed. The objective lens 34 to be performed is provided at a separate position in substantially the same horizontal plane, and a modeling unit 50 on which modeling is performed is configured to be movable by a horizontal drive mechanism 54 below these units. Become. And in the process in each part, it has the aspect which moves the modeling part 50 to the part directly under each part sequentially by this horizontal drive mechanism 54, and arranges it facing each. Thereby, in the optical modeling apparatus 100, as described above, in the processes of resin supply, smoothing, and exposure, the components responsible for other processes are provided between the modeling unit 50 and the respective units responsible for the respective processes. Each process is performed in the state which made the modeling part 50 as close as possible to each part, without interposing. This is one of the reasons why high modeling accuracy is realized in the optical modeling apparatus 100 as compared with the conventional art.

  The cleaning unit 80 is responsible for cleaning the recoater 71 that has smoothed the resin. The uncoated resin that has been scraped off may remain attached to the recoater 71 after the smoothing process. If the next resin layer is smoothed while this is left as it is, the resin adhering to the recoater 71 falls on the smoothed resin layer or the applied resin to the recoater 71 is dropped. It may happen that the adhesion is promoted to increase the thickness variation of the resin layer to be smoothed. In order to prevent such a situation from occurring, the cleaning unit 80 cleans the recoater 71 when smoothing and removes the adhering resin. The cleaning may be performed after the recoater performs the smoothing process, or may be performed before a new smoothing process. Further, if there is no problem in variation in the thickness of the resin layer, it is not always necessary to perform the smoothing of each layer. In addition, in FIG. 1, although the cleaning part 80 has illustrated the case where it attaches to the modeling part 50, in that case, it will move to the cleaning position by driving the horizontal drive mechanism 54. Instead of this, the cleaning unit 80 may be provided separately and moved by an independent driving unit.

  FIG. 3 is a diagram illustrating the configuration of the cleaning unit 80 and a state in which the cleaning unit 80 is disposed at a predetermined position for cleaning the recoater 71. The cleaning unit 80 illustrated in FIG. 3 includes a wiping member 81 that sweeps the resin adhering to the vicinity of the lower end 71e of the recoater 71 during the smoothing process, a holding member 82 that holds the wiping member 81, A ball screw 84 that is inserted through the holding member 82 and moves the holding member 82 together with the wiping member 81 by driving the motor 83, and a discharge tank 85 that discharges the wiped resin are provided.

  The cleaning process by the cleaning unit 80 is performed by further giving a cleaning start instruction after realizing the arrangement shown in FIG. 3 in response to a predetermined instruction from the control computer PC. When a start instruction is issued, the holding member 82 moves substantially horizontally as indicated by the arrow by the operation of the ball screw 84 driven by the motor 83. As a result, the wiping member 81 held by the holding member 82 moves while maintaining a state of being pressed against the vicinity of the lower end portion 71e of the recoater 71. Accordingly, the recoater 71, particularly the lower end portion 71e thereof, is moved. The resin adhering to the surface is swept away and removed. Of course, the arrangement position of the cleaning unit 80 is adjusted in advance so that such pressure contact is realized. Further, the removed resin is discharged to the discharge tank 85.

  The wiping member 81 is preferably made of a material that can reliably remove the resin from the recoater 71 by a single cleaning operation (moving operation in the direction of the arrow shown in FIG. 3). There is no particular limitation as long as it has enough elasticity to maintain the state and does not deteriorate (damage, corrode, etc.) the function of the recoater 71. From this point of view, a porous object, for example, a foam or absorbent body such as a sponge can be used. The wiping member 81 may be selected according to the type of resin used for modeling.

  However, in order to prevent the resin once removed from reattaching to the recoater 71, it is more preferable that the removed resin is quickly discharged from the discharge tank 85 without remaining in the interior. That is, it is preferable that a sufficient wiping function and a discharging function are compatible. When viewed microscopically, it is considered that the former needs to apply a force sufficient to pull the resin away from the recoater 71 during wiping, and the latter holds the removed resin inside. It is considered that it is necessary to have a structure in which the resin removed from the recoater 71 is discharged immediately. From such a point of view, for example, a laminate (hereinafter referred to as a nonwoven fabric) obtained by laminating and bonding a nonwoven fabric material made of synthetic fibers having a thickness of about several tens of μm to an appropriate thickness, as the wiping member 81 Is preferred. In such a nonwoven fabric, a random three-dimensional network structure is realized by the nonwoven fabric material. FIG. 4 is a diagram illustrating the pressure contact surface of such a nonwoven fabric body to the recoater 71. Note that it is possible to obtain the same wiping member 81 having a random three-dimensional network structure by using a foam made of polyurethane or the like.

  By cleaning the recoater 71 by the cleaning unit 80 provided with such a wiping member 81, the recoater 71 is maintained in a clean state. Thereby, a uniform resin layer surface is always formed during smoothing. That is, it can be said that the aspect of the cleaning part 80 as mentioned above contributes to the high precision of the thickness of the resin layer in formation of a molded article.

  The vacuum fixing unit 90 is provided for adsorbing and fixing the modeling substrate 51 to the stage 52. FIG. 5 is a conceptual diagram illustrating such suction fixation. In the stereolithography apparatus 100 according to the present embodiment, the vacuum pump 91 is provided with a plurality of suction holes 94 (not shown in FIG. 1) provided in the stage 52 by an exhaust pipe 93 provided with a solenoid valve 92 on the way. (FIG. 5A). When the vacuum pump 91 is operated and the solenoid valve 92 is opened while the modeling base 51 is placed on the stage 52, the modeling base 51 is fixed to the stage 52 by the negative pressure in the suction hole 94.

  Further, when the area of the modeling surface 51 s of the modeling substrate 51 is smaller than the area of the mounting surface 52 s of the stage 52, depending on the modeling substrate 51, all the suction holes of the stage 52 cannot be closed. The fixing cannot be realized simply by placing the modeling substrate 51 on the stage 52 as shown in FIG. In this case, as shown in FIG. 5B, a mask 95 is prepared by hollowing out the central portion according to the size of the modeling base material 51 (or the same state can be obtained by combination). The mask 95 is placed around and the suction hole 94 that cannot be covered by the modeling substrate 51 is closed by the mask 95, thereby fixing the modeling substrate 51.

  In addition, as a mode of fixing the modeling substrate 51 with respect to the stage 52, a mode in which a fixing tool such as a fixing claw or a sandwiching member is provided on the stage and a fixing frame, a mode in which the model 52 is fixed by a magnetic force of a magnet, etc. It is done. However, in the former case, the flatness in the center portion is not sufficiently obtained particularly when the modeling base material is on the sheet, and the fixing tool and the fixing frame interfere with the operation of the recoater 71 when the recoater 71 is operated. This is not preferable because there is a possibility that the fixing tool or the fixing frame needs to be moved according to the size of the modeling base material, and there are problems such as troublesome operation and insufficient positional accuracy. Furthermore, in the latter case, if the modeling substrate needs to be a magnetic material, or if the photocurable resin used for modeling contains a magnetic material, the dispersion state and orientation of the magnetic material in the presence of magnetic force There is a problem that the characteristics are biased, which is not preferable because the cost increases.

  On the other hand, in the optical modeling apparatus 100 according to the present embodiment, the mask 95 is made of any material as long as it is flat and thinner than the modeling substrate 51 and can cover the stage 52. However, the modeling substrate 51 can be reliably fixed without causing interference with the recoater 71. That is, even when the size of the modeling substrate 51 is smaller than the stage 52, the modeling substrate 51 can be reliably fixed to the stage 52 simply and inexpensively.

  The control computer PC is provided for controlling the operation of each part of the optical modeling apparatus 100. A general-purpose personal computer can be used as the control computer PC. The control computer PC gives a predetermined operation signal to the control target element responsible for controlling the operation of each unit described above according to a predetermined control program (not shown), and receives a response signal from each unit, whereby the optical modeling apparatus 100 Realize the modeling process. For example, cross-sectional shape data representing a slice cross section of a three-dimensional object to be modeled, which has been created in advance by the control computer PC or another computer not shown, is acquired, and modulation means is obtained based on the data relating to each cross section The control computer PC is responsible for various operation controls including the processing of setting the ON / OFF state of the exposure light in 21 and performing exposure according to the cross-sectional shape.

  By using the optical modeling apparatus 100 having such a configuration, as illustrated in FIG. 8, it is possible to realize high-precision modeling with a laminated thickness of 10 μm and a planar resolution of 2 μm. That is, the optical modeling apparatus according to the present embodiment is a suitable apparatus for micromachining.

  In the optical modeling apparatus 100, the modeling unit 50 is provided so as to be horizontally movable, and the objective lens 34 (projection optical system 30), the supply unit 60, and the smoothing unit 70 are independently and substantially in the same horizontal plane above the modeling unit 50. Since it is arranged, when maintenance of each part becomes necessary, it becomes possible to easily access the target part simply by retracting the modeling part 50 from the position. In the optical modeling apparatus according to the present embodiment, including that the apparatus configuration is simple, an improvement in maintainability is realized.

<Modification>
In FIG. 1, the smoothing unit 70, the objective lens 34, and the supply unit 60 are arranged in order from the left in substantially the same horizontal plane above the horizontal movement region of the modeling unit 50, but this is essential in the present invention. This is not an aspect. That is, as long as the modeling part 50 is an aspect in which these parts can be individually approached, the arrangement of the parts may be different from the aspect of FIG. For example, the arrangement order of each part may be changed, and the aspect arrange | positioned two-dimensionally in the substantially the same horizontal surface may be sufficient.

  Preferably, a beam observation unit (not shown) for observing the state of the exposure light emitted from the objective lens 34 may be provided. The beam observing unit preferably uses a predetermined observing means (not shown) at a predetermined observation position on the optical path of the exposure light (for example, an exposure imaging position immediately below the objective lens), a light intensity distribution, a light amount distribution, etc. Observe. Such a beam observation unit may be configured to be attached to the modeling unit 50 and arranged to an observation position by driving the horizontal drive mechanism 54, or to be movable by an independent drive unit. It may be. Alternatively, it may be configured to be detachable from the modeling unit 50, attached only when necessary, and removable at other times. In this case, the unused observation means can be protected from contamination. Regardless of which mode is used, the exposure light actually used for exposure is directly observed at the position where the exposure is performed. Therefore, when performing modeling, the state of the exposure light used can be accurately grasped. I can do it.

  Moreover, the aspect of the cleaning part 80 is not restricted to what is shown in the above-mentioned embodiment. 6 and 7 are diagrams illustrating another aspect of the cleaning unit 80. FIG. Also by these, the resin adhering to the recoater 71 can be removed.

  In FIG. 6, the wiping member 81 is constituted by a plurality of brushes, which are arranged in pressure contact with each other in the vicinity of the lower end 71e along the longitudinal direction of the recoater 71, and each brush is driven by a predetermined drive source (not shown). FIG. 6 is a diagram illustrating a cleaning unit 80 in a mode of removing resin from the recoater 71 by rotating as indicated by an arrow shown in the figure.

  In FIG. 7, instead of providing the wiping member 81, an injection nozzle 86 is provided, and a predetermined cleaning liquid 87 is injected from the injection nozzle 86 toward the vicinity of the lower end portion 71e of the recoater 71 at a predetermined injection pressure. It is a figure which illustrates the cleaning part 80 comprised so that resin might be removed.

  FIG. 8 is an SEM (scanning electron microscope) image of a modeling sample created using the optical modeling apparatus 100 according to the above-described embodiment. Modeling was performed using laser light having a wavelength of 405 nm as a light source and using an acrylate-based resin (viscosity of 1500 to 2500 mPa · s at 25 ° C.) as a photocurable resin. Such a modeling sample is formed to a height of about 70 μm by stacking seven resin layers each having a bottom surface of 26 μm square and a top part of 5 μm square and a thickness of about 10 μm on a solid surface. Is. Although detailed illustration is omitted, the modeling error from the design data is about 2 μm or less.

  That is, in the stereolithography apparatus 100 according to the present embodiment, a stacking thickness of 10 μm and a planar resolution of 2 μm could be realized.

It is a cross-sectional schematic diagram which shows schematically the structure of the optical modeling apparatus 100 which concerns on this Embodiment. It is a figure which illustrates about the mode of modeling in the optical modeling apparatus. It is a figure which illustrates about the state by which the structure of the cleaning part 80 and the cleaning part 80 are arrange | positioned in the predetermined position for cleaning the recoater 71. It is a figure which illustrates the press-contact surface to the recoater 71 of a nonwoven fabric body. It is a conceptual diagram explaining adsorption fixation. It is a figure which shows the modification of the cleaning part 80 in which the wiping member 81 is comprised by the some brush. It is a figure which shows the modification of the cleaning part 80 comprised so that the washing | cleaning liquid 87 may be injected from the injection nozzle 86. FIG. It is a figure which shows the SEM image of the modeling sample created using the optical modeling apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base | substrate 10 Light source part 11 Light source 20 Illumination optical system 21 Modulation means 30 Projection optical system 33 Beam splitter 34 Objective lens 40 Image surface observation system 42 CCD camera 43 Monitor 50 Modeling part 51 Modeling base material 52 Stage 53 Modeling tank 54 Horizontal drive mechanism DESCRIPTION OF SYMBOLS 55 Vertical drive mechanism 60 Supply part 61 Dispenser nozzle 70 Smoothing part 71 Recoater 80 Cleaning part 81 Cleaning member 82 Holding member 86 Injection nozzle 87 Cleaning liquid 90 Vacuum fixing part 91 Vacuum pump 94 Adsorption hole 95 Mask 100 Stereolithography apparatus M Modeling object P resin PC control computer

Claims (5)

Light for forming a predetermined three-dimensional structure by sequentially forming a plurality of flat resin layers by curing a predetermined resin and sequentially stacking the resin layers each time the resin layer is formed A modeling device,
A modeling part where a three-dimensional model is modeled,
A storage part that is provided outside the modeling part and stores the resin;
Supply means for supplying a predetermined amount of the resin from the storage portion to the modeling portion each time each of the resin layers is formed ;
A smoothing means comprising a smoothing member having at least a tip part of a substantially flat plate shape, and smoothing the resin supplied by the supply means;
The light emitted from the light source has a plurality of micro mirrors, and similar modulation means capable of setting individually ON / OFF of the reflection in each of the micro mirrors by changing the posture of each of the micromirrors, the resin after having is reflected by the oN / OFF state corresponding to the molding shape to form the layer, and irradiating means for irradiating the smoothed resin on the molding section,
A cleaning means for cleaning the smoothing means by wiping the tip portion with a wiping member which is movable along the smoothing member by a predetermined driving means ;
A horizontal drive mechanism provided so as to be movable in the horizontal direction in the modeling part;
With
The supply means, the smoothing means, and the irradiation means are provided at separate positions in substantially the same horizontal plane,
The shaping unit is horizontally movable by the horizontal drive mechanism below the fixed position of the supply means, the smoothing means, and the irradiation means, and is directly below the fixed position. By being disposed opposite to the means, the smoothing means, and the irradiation means, it is possible to supply the resin, smooth the resin, and irradiate the resin with the light.
An optical modeling apparatus characterized by that. The optical modeling apparatus according to claim 1,
The cleaning means performs cleaning by moving along the smoothing member while pressing the pressure contact surface of the wiping member against the tip portion.
An optical modeling apparatus characterized by that. The optical modeling apparatus according to claim 2,
The wiping member is a porous member;
An optical modeling apparatus characterized by that. The optical modeling apparatus according to claim 2 ,
The wiping member is a member having a random three-dimensional network structure ,
An optical modeling apparatus characterized by that. The stereolithography apparatus according to claim 2 or 3, wherein
The wiping member is a laminate formed by laminating and bonding a predetermined nonwoven material ,
An optical modeling apparatus characterized by that.