JP2008254241A - Optical molding apparatus - Google Patents

Optical molding apparatus Download PDF

Info

Publication number
JP2008254241A
JP2008254241A JP2007096413A JP2007096413A JP2008254241A JP 2008254241 A JP2008254241 A JP 2008254241A JP 2007096413 A JP2007096413 A JP 2007096413A JP 2007096413 A JP2007096413 A JP 2007096413A JP 2008254241 A JP2008254241 A JP 2008254241A
Authority
JP
Japan
Prior art keywords
modeling
recoater
scraper
dipper
control unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007096413A
Other languages
Japanese (ja)
Inventor
Kanichi Izumi
勘一 泉
Original Assignee
Hitachi Kokusai Electric Inc
株式会社日立国際電気
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Kokusai Electric Inc, 株式会社日立国際電気 filed Critical Hitachi Kokusai Electric Inc
Priority to JP2007096413A priority Critical patent/JP2008254241A/en
Publication of JP2008254241A publication Critical patent/JP2008254241A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/106Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • B29C64/129Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
    • B29C64/135Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources

Abstract

PROBLEM TO BE SOLVED: To detect a modeling defect in a conventional optical modeling apparatus, there are problems that the apparatus is expensive, difficult to install, or weak to resin shaking, and is inexpensive and easy to operate and attach. Thus, an optical modeling apparatus is provided that has an excellent modeling defect detection mechanism that is not affected by the shaking of the resin surface, and that reduces the running cost of the apparatus and increases the efficiency of the optical modeling process.
SOLUTION: A deposit sensing means 9 for sensing adhesion of a non-laminated resin cured product to a dipper, scraper or recoater is provided, and the deposit sensing means 9 detects a non-laminated resin cured product adhering to the dipper, scraper or recoater. In this case, the control unit 1 is an optical modeling apparatus that stops the modeling operation.
[Selection] Figure 1

Description

  The present invention relates to an optical modeling apparatus that forms a three-dimensional model by irradiating a photocurable resin with laser light, and is particularly inexpensive and resistant to shaking of the liquid surface of the resin. It is related with the optical modeling apparatus which can aim at the reduction of this and the improvement of the efficiency of an optical modeling process.

[Description of Prior Art]
The stereolithography apparatus is used when a shape model is formed from three-dimensional CAD data, and is a technology that can produce a shape model in a short period of time.
Stereolithography technology is a shape model by repeating curing and laminating by irradiating photocurable resin with laser light such as ultraviolet rays according to the contour data converted by cutting the shape data of 3D CAD in the horizontal direction. Is to shape.
As a prior art of the optical modeling apparatus, there is JP-B-2-33901 (Patent Document 1).

In optical modeling equipment, a stage is provided in a tank containing a photocurable resin that is cured by laser light such as ultraviolet rays. After the stage is lowered by the stacking thickness, the resin is uniformly applied to form the modeling surface. Is generated, and a resin corresponding to a predetermined cross-sectional shape is formed by irradiating a laser beam and curing the resin of the irradiated portion based on the contour line data generated from the three-dimensional CAD data.
Then, when forming the next layer, the stage is lowered again and the above operation is repeated to perform modeling. The optical modeling apparatus is provided with a control unit that controls the raising and lowering of the stage and the irradiation position of the laser beam.
In order to form the shape model with high accuracy, it is necessary to uniformly apply a photocurable resin having a predetermined thickness to the modeling surface and scan the laser beam. In order to apply the resin uniformly, the optical modeling apparatus includes a mechanism called a dipper and a scraper.

[Configuration of recoater: Fig. 7]
Some stereolithography apparatuses include a recoater in which a dipper and a scraper are integrated as a mechanism for applying a photocurable resin to form a modeling surface.
The configuration of the recoater will be described with reference to FIG. FIG. 7 is a schematic explanatory diagram illustrating a configuration example of the recoater.
As shown in FIG. 7, the recoater 7 includes a dipper portion 17 ′ and a scraper portion (knife) 18 ′, and moves, for example, from right to left on the shape model 16 being formed on the stage 15. Then, the resin 14 is applied, the surface is smoothed by the scraper portion 18 'to form a modeling surface, and after laser irradiation, the next layer moves from left to right to form the modeling surface.
The dipper portion 17 ′ of the recoater 7 sucks and applies the resin 14 by surface tension.

The stacking pitch of the modeling model is generally very small, 0.05 to 0.2 mm, in order to express a smooth curve, etc., and the height of the dipper and scraper or recoater is adjusted to generate a good modeling surface. Requires strict accuracy. The adjustment is a major factor that affects the accuracy of forming the shape model in the optical modeling apparatus.
In the example of FIG. 7, the distance between the liquid level and the scraper part (knife) 18 ′ is 0.15 mm, and the distance between the liquid level and the dipper part 17 ′ is 0.6 mm.

[Mechanism of formation failure: Fig. 8]
By the way, a modeling defect may occur during shape model modeling by the optical modeling apparatus. A mechanism of generation of modeling failure will be described with reference to FIG. FIG. 8A to FIG. 8E are schematic cross-sectional explanatory views showing a mechanism of formation failure in the optical modeling apparatus.
As shown in FIG. 8A, the protrusion 10 may be generated due to deformation due to shrinkage in the curing stage of the photo-curing resin. In addition to this, the generation of the protrusion 10 may occur when a small resin cured product that has been floating in the photocurable resin 14 before the modeling is entangled or when the laser beam is not correctly irradiated. It is conceivable that protrusions are generated or the function of the support for supporting the shape model being shaped is insufficient and a part of the shape model is damaged.
And as shown to Fig.8 (a), the scraper 18 in operation | movement may be caught on the protrusion 10 which generate | occur | produced for some reason, and may be caught.
When the scraper 18 is forcibly moved, the projection 10 comes into contact with the upper surface of the shape model 16 under modeling as shown in FIG. 8B, and the upper surface portion 16 'is scraped off. Thereby, the distance between the shape model 16 ″ after being scraped off and the resin liquid surface becomes larger than a predetermined stacking pitch.

  When the laser beam is irradiated in this state, only the surface layer of the resin is cured and cannot be cured to the depth of the shape model 16 ″ after being scraped off. Therefore, as shown in FIG. A non-laminated resin cured product 11 in a state is generated.

  Once the non-laminated resin cured product 11 is generated, the next layer and the subsequent layers are in a non-laminated state. Therefore, the non-laminated resin cured product 11 floating in the tank is repeatedly formed as shown in FIG. As shown in FIG. 7, it adheres to the scraper 18 (or the recoater 7) or adheres to the dipper 17 as shown in FIG. And in the conventional optical modeling apparatus, it was operating until the program completion of the optical modeling process in this state.

  When a large amount of the non-laminated resin cured product 11 is generated in this way, a large amount of expensive resin is wasted. Moreover, enormous effort and time are required to remove the non-laminated resin cured product 11 from the resin tank.

As technologies for detecting modeling defects, there are JP-A-2004-9574 (Patent Document 2) and JP-A-11-254542 (Patent Document 3).
Patent Document 2 describes a photo-curing modeling apparatus that detects irregularities on the surface of a photo-curable resin, that is, protrusions, using an optical sensor or a spatial frequency characteristic measuring device.
Patent Document 3 describes a stereolithography apparatus monitoring system that includes a measurement system for measuring various data representing the operation state of the apparatus and records the data as time-series operation monitoring data for each layer of resin.

[Prior art documents]
Japanese Patent Publication No. 2-333901 (Patent Document 1) Japanese Patent Laying-Open No. 2004-9574 (Patent Document 2) Japanese Patent Laid-Open No. 11-254542 (Patent Document 3)

  However, in the technology for detecting modeling defects in the conventional optical modeling apparatus, the apparatus is very expensive, specialized knowledge and technical skills are required for its operation, and the mounting position is a resin liquid for each modeling. There is a problem that it is difficult to mount because it needs to be matched to the surface, and it is vulnerable to resin shaking that occurs when the dipper goes up and down.

  The present invention has been made in view of the above circumstances, is inexpensive, easy to operate and attach, and has an excellent modeling defect detection mechanism that is not affected by shaking of the resin surface, reducing the running cost of the apparatus and An object of the present invention is to provide an optical modeling apparatus that improves the efficiency of the optical modeling process.

  The present invention for solving the problems of the conventional example described above is to irradiate the upper part of the lifting table arranged in the photocurable resin in the tank with a laser beam to cure the photocurable resin in the irradiated part. In the optical modeling apparatus that performs the modeling operation while laminating and molding a modeling model of a predetermined shape, when the non-laminated resin cured product is generated due to poor modeling, the non-laminated resin cured product adhered to the dipper, scraper or recoater It is characterized by having an adhering matter sensing means for sensing this, and a control unit for stopping the modeling operation by the sensing.

  According to the present invention, when the adhering matter sensing means senses that a non-laminated resin cured product generated due to modeling failure has adhered to the dipper, scraper or recoater, the control unit is an optical modeling apparatus that stops the modeling operation. Therefore, it is simple, inexpensive, easy to mount and align, is not affected by shaking of the resin liquid level, quickly detects modeling defects, reduces running costs, and improves the efficiency of the optical modeling process. There is an effect that can be improved.

[Summary of Invention]
Embodiments of the present invention will be described with reference to the drawings.
The stereolithography apparatus according to an embodiment of the present invention includes a sensing unit that detects adhesion of a non-laminated resin cured product to a dipper, a scraper, or a recoater, and the non-laminated resin cured that has adhered to the dipper, scraper, or recoater by the sensing unit. When an object is detected, it is judged as a modeling failure, an alarm is output or the modeling operation is stopped, and the modeling failure is reliably detected with a simple configuration to improve the efficiency of the optical modeling process It is something that can be done.

[Schematic Configuration of Stereolithography Apparatus of the Present Invention: FIG. 1]
A schematic configuration of an optical modeling apparatus according to an embodiment of the present invention will be described with reference to FIG. FIG. 1 is a schematic explanatory view showing a schematic configuration of an optical modeling apparatus (this apparatus) according to an embodiment of the present invention.
As shown in FIG. 1, this apparatus includes a control unit 1, a storage unit 2, a UV laser 3, a scanner mirror 4, a stage (table) 5, an elevator device 6, a recoater 7, and a tank 8. The adhering matter detecting means 9 is a characteristic part of the apparatus.

The control unit 1 controls the entire apparatus. The control unit 1 includes a CPU and the like, and includes processing means that activates a processing program stored in the storage unit 2 and performs various processes. Specifically, the control unit 1 controls the UV laser 3, the scanner mirror 4, the elevator device 6, the recoater 7, and the adhering matter detection means 9.
In particular, when the controller 1 of the present apparatus inputs a signal from the adhering matter detection means 9 and detects the presence of adhering matter, the controller 1 outputs an alarm or performs control to stop the optical modeling operation. An alarm output unit that outputs an alarm is not shown. The configuration and operation of the control unit 1 will be described later.

The storage unit 2 stores various data necessary for performing optical modeling such as a processing program in the control unit 1 and input contour line data. Furthermore, as a feature of the present apparatus, data necessary for detecting the deposit is stored. These data will be described later.
The UV laser 3 outputs laser light such as an ultraviolet laser in response to an instruction from the control unit 1.
The scanner mirror 4 controls the beam direction of the laser light so that the laser light scans a predetermined pattern based on the contour line data.
The stage 5 is a table that is provided in the tank 8 and on which a modeled object (shape model) is modeled and mounted.
The elevator device 6 controls the raising and lowering of the stage 5 based on an instruction from the control unit 1.

The recoater 7 applies a photocurable resin to form the next layer on the surface of the modeled object, and forms a uniform modeled surface. Instead of the recoater 7, a configuration having a dipper and a scraper may be used.
The tank 8 is a container for storing a photocurable resin.
The adhering matter detecting means 9 is a characteristic part of this apparatus and can be considered as various mechanisms. A signal indicating whether or not a non-laminated resin cured product is adhering to the recoater 7 or the dipper or scraper is sent to the control unit 1. Output.
The mechanism used as the adhering matter detection means 9 will be described in order in the following embodiments.

[Operation of stereolithography: Fig. 1]
Stereolithography using the apparatus having the above-described configuration will be briefly described with reference to FIG.
First, three-dimensional CAD data of a desired shape model is created by a data creation device (not shown) such as a personal computer, and STL (Stereo Lithography) data is generated based on the three-dimensional CAD data. The STL data is data representing a solid by covering the surface of a solid model (solid model of a desired shape model) with a triangular patch.
Next, the data creation device generates contour line data (cross-section data) by rounding the STL data at a predetermined pitch. Then, contour line data is input to this apparatus.

The apparatus stores the input contour line data in the storage unit 2, and the control unit 1 controls the UV laser 3, the scanner mirror 4, the elevator apparatus 6, and the recoater 7 based on the contour line data, The photocurable resin is cured into a desired shape and stacked on the stage 5 in 8 to form a shape model.
Then, when the stereolithography process is completed, the shape model is taken out from the tank 8, and finishing such as removing the support formed together with the shape model is performed to complete the shape model.
Thus, optical modeling is performed.

A plurality of stereolithography apparatuses according to an embodiment of the present invention will be specifically described.
The configuration of the stereolithography apparatus described below is the same as that of the apparatus described with reference to FIG. 1, but is stored in the configuration of the deposit sensing means 9, the operation of the control unit 1, and the storage unit 2. Some data is different. For simplicity, only parts different from those in FIG. 1 are illustrated and described, and the same parts as those in FIG. 1 are not illustrated and described.
In the following embodiments, only a mechanism using a dipper and a scraper will be described as a mechanism for applying a photocurable resin. However, a recoater may be used, and similar effects can be obtained. The recoater is not shown.

[First Embodiment: FIG. 2]
An optical modeling apparatus according to the first embodiment of the present invention will be described with reference to FIG. FIG. 2 is a plan view showing a schematic configuration of the optical modeling apparatus (first apparatus) according to the first embodiment of the present invention.
In FIG. 2, in the first stereolithography apparatus, the photocurable resin 14 is contained in the tank 8, and the table 15 (corresponding to the “stage 5” shown in FIG. 1) has a shape model under modeling. 16 is mounted, and the dipper 17 and the scraper 18 are in the origin position.

  As shown in FIG. 2, in the first apparatus, between the dipper 17 and the scraper 18 at the origin position and a space corresponding to the upper part of the table 15 (hereinafter referred to as “the upper part of the table 15”), A laser sensor 19 is installed in parallel with the dipper 17. When the recoater 7 (not shown) is used, the laser sensor 19 is installed in parallel with the recoater 7 between the recoater 7 and the upper portion of the table 15. The laser sensor 19 corresponds to the deposit sensing means 9 shown in FIG.

  The first apparatus uses the laser sensor 19 to determine whether or not a non-laminated resin cured product exists between the dipper 17 and the scraper 18 and the upper portion of the table 15 or between the recoater 7 and the upper portion of the table 15. It is something to perceive.

  The laser sensor 19 includes a light emitting unit and a light receiving unit (both not shown), and is mounted on the edge portion of the tank 8 in FIG. The light receiving unit receives the laser light output from the light emitting unit and outputs an electrical signal. When there is an obstacle, the light receiving unit prevents light reception and no electrical signal is generated.

  In optical modeling, the modeling area of the model to be modeled is smaller than the table area. When normal modeling is performed, nothing exists between the dipper 17 and the scraper 18, or between the recoater 7 and the upper portion of the table 15, but a modeling defect occurs and FIG. When the state shown in e) is reached, the unlaminated resin cured product is present in this region.

  Therefore, in the first apparatus, laser detection is performed at the timing when the dipper 17 and the scraper 18 or the recoater 7 come to the origin position. If there is no non-laminated resin cured product, a normal signal associated with light reception is output from the receiving unit of the laser sensor 19, but if there is an unlaminated resin cured product, a normal signal is output from the receiving unit of the laser sensor 19. An abnormality is detected without being output.

[Functional configuration and operation of first apparatus]
The first apparatus is provided with a laser sensor 19 as the adhering matter detecting means 9 and a detecting means as the processing means of the control unit 1.
As described above, the laser sensor 19 outputs laser light from a light emitting unit (not shown) at the timing when the dipper 17 and the scraper 18 or the recoater 7 come to the origin position, and the light receiving unit (not shown). The laser beam is received and an electric signal is output to the control unit 1. The timing of laser detection is preset according to the movement of the dipper 17, the scraper 18, or the recoater 7, and is instructed from the control unit 1.
The detection means of the control unit 1 inputs a signal from the laser sensor 19 and detects the presence of an adhering substance when, for example, the reception level from the laser sensor 19 at a predetermined timing is less than a predetermined value set in advance. If detected, a detection signal is output.
Based on this detection signal, the control unit 1 performs control such as outputting an alarm or stopping the modeling operation.

[Another configuration example]
As another configuration example of the first device, the laser sensor 19 may be provided on the side opposite to the normal origin position with respect to the table 15. In this case, laser detection is performed at the timing when the dipper 17 and the scraper 18 or the recoater 7 are moved to the opposite side of the origin position to detect a non-laminated resin cured product.
Furthermore, the laser sensor 19 may be provided on both the origin position side and the opposite side so that detection is performed at both timings.

Further, the laser sensor 19 may be provided at a position opposite to the table 15 when viewed from the scraper 18 or the recoater 7 at the origin position. In this case, the non-laminated resin cured product adhering to the scraper 18 or the recoater 7 is detected. In this example, in order to secure a space for installing the laser sensor 19, the tank 8 has a shape that is somewhat widened by the width on the laser sensor 19 side.
It is also possible to provide a laser sensor 19 at the edge of the tank 8 facing the above example with the table 15 in between to detect whether there is any deposit on the scraper 18 or the recoater 7 on the side opposite to the origin position. It is. Moreover, the structure provided with both may be sufficient.

[Contact sensor]
Furthermore, as another configuration example of the first device, a contact sensor can be used as the deposit sensing means 9 instead of the laser sensor.
Specifically, a contact sensor is provided between the dipper 17 and the scraper 18 or the recoater 7 at the origin position and the upper portion of the table 15.
The contact sensor is a structure in which a sensing member such as a wire is mounted between two struts installed on the edge of the tank 8 so that it can be raised and lowered. When the sensing member comes into contact with something, the impact is detected. Thus, an electric signal is output.

The sensing member of the contact sensor is held at a position higher than the height of the dipper 17, the scraper 18, or the recoater 7 so as not to contact when the dipper 17, the scraper 18, or the recoater 7 is operating. When the dipper 17, the scraper 18, or the recoater 7 comes to the origin position, the dipper 17, the scraper 18, or the recoater 7 moves in the reverse direction. It goes up before you start and is held high enough.
The contact sensor may be provided on the opposite side to the origin position, or may be provided on both the origin position side and the opposite side.

[Effect of the first embodiment]
According to the stereolithography apparatus according to the first embodiment of the present invention, the dipper 17, the scraper 18, or the recoater is disposed between the dipper 17, the scraper 18, or the recoater 7 and the space corresponding to the upper portion of the table 15. 7 is installed in parallel, and when the dipper 17, scraper 18, or recoater 7 comes to the origin position, laser detection is performed, and the laser is interrupted, the detection means of the control unit 1 is not used. Since it detects that there is a laminated resin cured product and the control unit 1 outputs an alarm and stops the molding operation, the apparatus is stopped immediately when a molding failure occurs, and the resin is wasted. This eliminates unnecessary consumption, minimizes the scattering of the non-laminated resin cured product into the tank 8, reduces the time required for removal, and improves the working efficiency of the modeling process.

  Further, in the first apparatus, the laser sensor 19 is fixed to the edge portion of the tank, and the adhering matter to the dipper 17, the scraper 18, or the recoater 7 is detected, so an abnormality in the resin liquid level is directly detected. Compared to the above, it is inexpensive, easy to align and attach, and is not affected even when the liquid level fluctuates.

  In the first apparatus, instead of the laser sensor 19, a contact sensor that can be moved up and down is installed, and the sensing member is normally held at a high position, and the dipper 17, the scraper 18, or the recoater 7 is at the origin position. When the sensing member is lowered to near the liquid level of the photo-curing resin at the timing of coming, and when it comes into contact with a foreign substance, the sensing means of the control unit 1 detects that the non-laminated resin cured product is attached and controls it. Since the part 1 outputs a warning and stops the modeling operation, when a modeling defect occurs, the apparatus is immediately stopped to improve the working efficiency of the modeling process, and the resin liquid Compared to direct detection of surface abnormalities, it is cheaper, easier to align and install, less affected by liquid level fluctuations, and can accurately detect molding defects. is there.

[Second Embodiment]
Next, an optical modeling apparatus according to a second embodiment of the present invention will be described with reference to FIG.
In the second apparatus, a weight measuring mechanism is provided as the adhering matter detecting means 9, a weight input means, a weight comparing means, and an abnormality detecting means are provided in the control unit 1, and the storage unit 2 further includes Normal weight data is stored (not shown).

The weight measuring mechanism measures the weight of the dipper 17 and the scraper 18 or the recoater 7 and outputs weight data to the control unit 1.
For example, the weight measurement mechanism measures the weight applied to the dipper mechanism unit that drives the dipper 17, the scraper mechanism unit that drives the scraper 18, and the recoater mechanism unit (not shown) that drives the recoater 7.
The maximum value of the weight applied to the dipper mechanism during normal operation is a value obtained by adding the weight of the dipper 17 and the weight of the resin corresponding to the dipper capacity, and the maximum value of the weight applied to the scraper mechanism or the recoater mechanism is , The weight of the scraper 18 and the recoater 7.

In the second apparatus, the maximum value of the weight applied to each mechanism unit is stored in the storage unit 2 as normal weight data. The normal weight data is a value stored by the control unit 1 based on an input from the operation unit (not shown).
Here, since the normal weight data of the dipper mechanism section varies depending on the type of resin, when the type of resin changes, the normal weight data is changed and stored.

Each processing means of the control unit 1 will be described.
The weight input unit sets normal weight data of the dipper mechanism unit, the scraper mechanism unit, or the recoater mechanism unit in the storage unit 2 in accordance with an instruction from the operator.
The weight comparison unit compares each weight data of the dipper mechanism unit, the scraper mechanism unit, or the recoater mechanism unit input from the weight measurement mechanism with the corresponding normal weight data stored in the storage unit 2, and results Is output to the abnormality detection means.
The anomaly detection means outputs a detection signal when the comparison result from the weight comparison means detects the presence of the deposit when the weight data input from the weight measuring mechanism exceeds the normal weight data.
Based on this detection signal, the control unit 1 performs control such as outputting an alarm or stopping the modeling operation.
The weight measurement by the weight measuring mechanism may be in a state where the dipper 17, the scraper 18, or the recoater 7 is operating or in a stopped state.

  In the second apparatus, the weight comparison unit of the control unit 1 compares the weight data input from the weight measurement mechanism with the normal weight data of the storage unit 2, and the abnormality detection unit determines whether there is an abnormality based on the comparison result. In the case of abnormality, a detection signal is output, and the control unit 1 stops the alarm output and the modeling operation.

[Effect of the second embodiment]
The stereolithography apparatus according to the second embodiment of the present invention includes a weight measurement mechanism that measures the weight applied to the dipper mechanism unit, the scraper mechanism unit, or the recoater mechanism unit. The maximum weight applied to each mechanism unit is stored as normal weight data, and the control unit 1 compares the weight data of each mechanism unit input from the weight measurement mechanism with the normal weight data, If the weight data is heavier, it detects that there is a non-laminated resin cured product, outputs an alarm, and stops the molding operation. Stopping, eliminating unnecessary consumption of resin, minimizing the scattering of unlaminated resin cured material in the tank 8, reducing the time and effort of removal, and improving the working efficiency of the molding process There is.

Further, the weight measuring mechanism may be configured to measure the load of the motor of the arm instead of the weight itself of each mechanism unit, and the weight can be detected based on the measured weight.
Furthermore, the weight measuring mechanism can be simplified in structure as a structure for measuring the weight of one of the dipper 17 and the scraper 18.
In addition, the second device detects deposits regardless of the resin liquid level, so it is inexpensive, easy to align and attach, and is not affected by liquid level fluctuations. There is an effect that can be detected accurately.

[Third Embodiment: FIG. 3]
An optical modeling apparatus according to a third embodiment of the present invention will be described with reference to FIG. FIG. 3A is a plan view showing a schematic configuration of an optical modeling apparatus (third apparatus) according to the third embodiment of the present invention, and FIG. 3B is a cross-sectional view.
As shown in FIG. 3, the third apparatus includes a laser sensor 21 that measures the distance to the dipper 17, the scraper 18, or the recoater 7 as the adhering matter detection means 9. The laser sensor 21 is installed at a position (for example, the edge of the tank 8 facing the origin position) facing the dipper 17, the scraper 18, or the recoater 7 at the origin position with the table 15 in between, as shown in FIG. As described above, the laser beam is output toward the dipper 17, the scraper 18, or the recoater 7 on the origin position side, the laser beam reflected by the dipper 17, the scraper 18, or the recoater 7 is received, Measure distance.

In the case of the scraper 18 or the recoater 7, the measurement is performed at the timing at the origin position, and the timing of the dipper 17 is set so as to measure the position rising from the resin liquid level instead of the origin position.
If the non-laminated resin cured product adheres to the dipper 17, the scraper 18, or the recoater 7, the measured distance becomes shorter than that in the normal state, so that it is possible to detect the presence of the adhered material.

[Functional Configuration and Operation of Third Device]
The third apparatus includes the above-described laser sensor 21 as the adhering matter detection means 9, and includes a distance input means, a distance comparison means, and an abnormality detection means as the processing means of the control unit 1, and a storage unit. 2 stores normal distance data (not shown).

  The laser sensor 21 measures the distance to the dipper 17, the scraper 18, or the recoater 7 at a predetermined timing, and outputs the measured distance data to the control unit 1.

Each processing means of the control unit 1 will be described.
The distance input means sets normal distance data between the laser sensor 21 and the dipper 17, the scraper 18, or the recoater 7 in the storage unit 2 in accordance with an instruction from the operator.
The distance comparison means compares the distance data input from the laser sensor 21 to the dipper 17, the scraper 18, or the recoater 7 with the corresponding normal distance data stored in the storage unit 2, and detects the result as an abnormality. Output to the means.
Based on the comparison result from the distance comparison means, the abnormality detection means detects the presence of the deposit when the distance data input from the laser sensor 21 is smaller than the normal distance data by a certain amount or more. Output.
Based on the detection signal, the control unit 1 controls output of an alarm and stop of the modeling operation.
The laser sensor 21 may be configured to measure the distance with respect to either the dipper 17 or the scraper 18.

  In the third device, the distance comparison unit of the control unit 1 compares the distance data input from the laser sensor 21 with the normal distance data of the storage unit 2, and the abnormality detection unit determines whether there is an abnormality based on the comparison result. In the case of abnormality, a detection signal is output, and the control unit 1 stops the alarm output and the modeling operation.

[Another configuration example of the third apparatus: FIG. 4]
4A and 4B are schematic plan views showing another configuration example of the third device.
As shown in FIG. 4A, in another configuration example of the third device, the laser sensor 22 is provided to face the laser sensor 21.
When the dipper 17, scraper 18, or recoater 7 is on the origin side, the laser sensor 21 measures the distance, and when the dipper 17, scraper 18, or recoater 7 moves to the opposite side of the origin, the laser sensor 21 measures the distance. Set the timing. The normal distance data in the storage unit 2 stores both the laser sensor 21 and the laser sensor 22.
As a result, it is possible to check the presence or absence of deposits on both sides of the dipper 17, the scraper 18, or the recoater 7, and the deposits can be detected with high sensitivity.

  Further, as shown in FIG. 4B, the laser sensor 23 can be provided outside the tank 8. In this case, it is possible to check both the case of being on the origin side and the case of being on the opposite side with one laser sensor 23. Also in this case, normal distance data different between the origin side and the opposite side is stored.

[Effect of the third embodiment]
The stereolithography apparatus according to the third embodiment of the present invention includes the laser sensor 21 that measures the distance to the dipper 17, the scraper 18, or the recoater 7 on the origin position side. The distance to each part at the time of operation is stored as normal distance data, and the distance of each part measured by the control unit 1 comparing the distance data to each part input from the laser sensor 21 with the normal distance data. When the data is shorter, it detects that a non-laminated resin cured product has adhered, outputs an alarm, and stops the molding operation. This prevents the wasteful consumption of resin, prevents the unlaminated resin cured product from scattering in the tank 8, eliminates the trouble of removal, and improves the working efficiency of the molding process. is there
In addition, the third device detects deposits irrespective of the liquid level of the resin, so it is inexpensive, easy to align and attach, and is not affected by fluctuations in the liquid level. Can be detected with high accuracy.

[Fourth Embodiment: FIG. 5]
Next, a shining modeling apparatus according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 5 is a schematic explanatory diagram showing a schematic configuration of an optical modeling apparatus (fourth apparatus) according to the fourth embodiment of the present invention.
As shown in FIG. 5, the fourth device includes a dipper 17, a scraper 18, or a camera 24 that captures an image of the recoater 7 as the adhering matter detection means 9, and the dipper 17 acquired at a specific timing, The image of the scraper 18 or the recoater 7 is compared with an image in a normal state to determine whether or not a non-laminated resin cured product is attached.

[Functional Configuration and Operation of Fourth Device]
The fourth apparatus includes a camera 24 as the adhering matter detection means 9, and includes an image input means, an image comparison means, and an abnormality determination means as processing means of the control unit 1, and further stores in the storage unit 2. Stores normal image data (not shown).

For example, when the dipper 17, the scraper 18, or the recoater 7 comes to the origin position, the camera 24 captures an image and outputs it to the control unit 1. The image captured by the camera 24 may not be the entire apparatus, and may be only the dipper 17, the scraper 18, or the recoater 7 at the origin position.
The camera 24 may shoot a still image or a moving image (video).

The image input means of the control unit 1 stores the image of the dipper 17, scraper 18, or recoater 7 at the origin position when operating normally as normal image data in the storage unit 2.
The image comparison unit compares the image data input from the camera 24 with the normal image data stored in the storage unit 2 and outputs the result to the abnormality determination unit.
The abnormality determination unit determines that the image is abnormal when the difference between the images is equal to or greater than a predetermined amount based on the comparison result from the image comparison unit, and outputs a detection signal.
The control unit 1 controls output of an alarm and stop of the modeling operation based on the detection signal.

In the fourth apparatus, the image comparison unit of the control unit 1 compares the image data input from the camera 24 with the normal image data of the storage unit 2, and the abnormality determination unit determines whether there is an abnormality based on the comparison result. In the case of abnormality, a detection signal is output, and the control unit 1 stops the alarm output and the modeling operation.
Note that an image may be taken with the camera 24 on the side opposite to the origin position, or a plurality of images may be provided.

[Effect of the fourth embodiment]
The stereolithography apparatus according to the fourth embodiment of the present invention includes the camera 24 that captures an image of the dipper 17, the scraper 18, or the recoater 7 at the origin, and the storage unit 2 has a normal operation time. The image of the dipper 17, the scraper 18, or the recoater 7 is stored as normal image data, and the control unit 1 compares the image data input from the camera 24 with the normal image data, and the difference is a fixed amount. When it is above, it detects that the non-laminated resin cured product has adhered, outputs an alarm, and stops the modeling operation. Stopping, eliminating wasteful consumption of resin, preventing scattering of the unlaminated resin cured product into the tank 8, eliminating the labor of removal, and improving the working efficiency of the modeling process .

Also, a plurality of cameras 24 are installed on the opposite side of the origin position, near the center of the tank, etc., and normal image data corresponding to each camera is stored in the storage unit 2 and compared with the acquired image data. May be. Thereby, the non-laminated resin hardened | cured material by modeling defect can be detected quickly.
In addition, since the fourth device detects an adhering substance by directly taking an image of the dipper 17, the scraper 18, or the recoater 7 regardless of the liquid level, it is inexpensive and easy to align and attach. Even if the surface is shaken, there is an effect that it is possible to accurately detect a molding defect without being affected.

[System for collectively monitoring a plurality of stereolithography apparatuses: Fig. 6]
Next, an optical modeling system that collectively monitors a plurality of optical modeling apparatuses will be described with reference to FIG. FIG. 6 is a configuration block diagram of an optical modeling system that collectively monitors a plurality of optical modeling apparatuses.
As shown in FIG. 6, the stereolithography system includes a plurality of stereolithography apparatuses 31-1 to 31-n and a control device 30. This is a configuration for centralized control.

The stereolithography apparatuses 31-1 to 31-n are provided with an adhering matter detecting means for detecting that an unlaminated resin cured product is adhering to the dipper 17, the scraper 18, or the recoater 7. The mechanism for realizing the deposit sensing means may be any of the mechanisms provided in the first to fifth devices described above.
Each stereolithography apparatus 31 is provided with a transmission / reception unit (not shown), and the adhering matter detection means is that the non-laminated resin cured product is attached to the dipper 17, the scraper 18, or the recoater 7. When detected, an ID of each device is attached and a detection signal is transmitted to the control device 30.

The control device 30 includes the function of the control unit 1 of the first to fourth devices described above, and controls the modeling operation of the plurality of optical modeling devices 31. Further, when a detection signal indicating abnormality detection is received from the connected optical modeling apparatus 31, the control apparatus 30 identifies the optical modeling apparatus 31 in which an abnormality has occurred based on the received ID, and To output an instruction to stop the modeling operation. In addition, the operator is notified by the display and voice that a modeling defect has occurred in the apparatus.
As a result, the plurality of stereolithography apparatuses 31 can be collectively controlled by one control apparatus 30.

  In addition, data indicating the operation status may be periodically transmitted from each stereolithography apparatus 31, and the operation status of the plurality of stereolithography apparatuses 31 may be collectively displayed in the control device 30.

Further, when the control device 30 detects the adhesion of a non-laminated resin cured product in an optical modeling device 31-x and stops the modeling operation, the control device 30 inputs the same contour line data to the optical modeling device 31-y. And it is also possible to make it model from the beginning with the optical modeling apparatus 31-y.
Thereby, there exists an effect which can aim at shortening of modeling time.

  According to this stereolithography system, the stereolithography apparatus 31 is provided with the adhering matter sensing means, and when the adhering of the non-laminated resin cured product is detected, a detection signal is output to the control device 30, and when the control device 30 receives the detection signal. Since the stereolithography apparatus 31 is instructed to stop the modeling operation, and the occurrence of a modeling defect is notified by display or voice, a plurality of stereolithography apparatuses can be monitored and controlled in a lump. There is an effect of improving the property.

  INDUSTRIAL APPLICABILITY The present invention is suitable for an optical modeling apparatus that is inexpensive, strong against shaking of the resin liquid surface, can quickly detect modeling defects, and can reduce running costs and improve the efficiency of the optical modeling process.

1 is a schematic explanatory diagram illustrating a schematic configuration of an optical modeling apparatus (this apparatus) according to an embodiment of the present invention. It is a top view which shows schematic structure of the optical modeling apparatus (1st apparatus) which concerns on the 1st Embodiment of this invention. (A) is a top view which shows schematic structure of the optical modeling apparatus (3rd apparatus) which concerns on the 3rd Embodiment of this invention, (b) is sectional drawing. (A) (b) is a schematic plan view which shows another structural example of a 3rd apparatus. It is a schematic explanatory drawing which shows schematic structure of the optical modeling apparatus (4th apparatus) which concerns on the 4th Embodiment of this invention. It is a block diagram of a stereolithography system using a plurality of this apparatus. It is a schematic explanatory drawing which shows the structural example of a recoater. (A)-(e) is a schematic cross-section explanatory drawing which shows the mechanism of modeling defect generation | occurrence | production in an optical modeling apparatus.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Control part, 2 ... Memory | storage part, 3 ... UV laser, 4 ... Scanner mirror, 5 ... Stage (table), 6 ... Elevator apparatus, 7 ... Recoater, 8 ... Tank, 9 ... Adherence detection means, 10 ... Protrusion 11 ... unstacked cured resin, 14 ... photo-curable resin, 15 ... table, 16 ... shape model, 17 ... dipper, 18 ... scraper, 19 ... laser sensor, 21, 22, 23 ... laser sensor, 24 ... camera 30 ... Control device, 31 ... Stereolithography device

Claims (1)

  1. A laser beam is irradiated to the upper part of the lifting table arranged in the photocurable resin in the tank, and the modeling operation of laminating while curing the photocurable resin of the irradiated part is performed, and a modeling model of a predetermined shape is obtained. In the optical shaping apparatus to be molded
    When a non-laminated resin cured product due to modeling failure occurs, an adhering matter sensing means for sensing that the non-laminated resin cured product has adhered to a dipper, scraper or recoater;
    An optical modeling apparatus comprising: a control unit that stops the modeling operation by the sensing.
JP2007096413A 2007-04-02 2007-04-02 Optical molding apparatus Pending JP2008254241A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007096413A JP2008254241A (en) 2007-04-02 2007-04-02 Optical molding apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007096413A JP2008254241A (en) 2007-04-02 2007-04-02 Optical molding apparatus
PCT/JP2008/053485 WO2008120516A1 (en) 2007-04-02 2008-02-28 Photofabrication apparatus

Publications (1)

Publication Number Publication Date
JP2008254241A true JP2008254241A (en) 2008-10-23

Family

ID=39808101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007096413A Pending JP2008254241A (en) 2007-04-02 2007-04-02 Optical molding apparatus

Country Status (2)

Country Link
JP (1) JP2008254241A (en)
WO (1) WO2008120516A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013067036A (en) * 2011-09-21 2013-04-18 Keyence Corp Three-dimensional shaping apparatus
JP2015196383A (en) * 2014-03-31 2015-11-09 ゼロックス コーポレイションXerox Corporation System for detecting inoperative inkjet by using optical sensor and reversible heat-sensitive substrate during printing three-dimensional object
WO2016042794A1 (en) * 2014-09-16 2016-03-24 株式会社東芝 Laminate shaping apparatus and laminate shaping method
WO2016042610A1 (en) * 2014-09-17 2016-03-24 富士機械製造株式会社 Method for identifying three-dimensional molding
JP2016533925A (en) * 2013-08-07 2016-11-04 マサチューセッツ インスティテュート オブ テクノロジー Automatic process control of additive manufacturing equipment
JP2016535690A (en) * 2013-07-19 2016-11-17 ザ・ボーイング・カンパニーThe Boeing Company Quality control of additional manufactured parts

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3089862A4 (en) * 2014-01-02 2017-02-22 United Technologies Corporation Additive manufacturing process distortion management
CN106863781B (en) * 2017-03-29 2019-03-22 湖南华曙高科技有限责任公司 Stereolithography equipment and its paving liquid device
CN108638503B (en) * 2018-04-26 2020-06-16 大族激光科技产业集团股份有限公司 Scraper leveling method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005153356A (en) * 2003-11-26 2005-06-16 Fuji Photo Film Co Ltd Apparatus and method for photo-fabrication
JP4487636B2 (en) * 2004-05-26 2010-06-23 パナソニック電工株式会社 Manufacturing method of three-dimensional shaped object
JP4773110B2 (en) * 2005-03-03 2011-09-14 三星ダイヤモンド工業株式会社 Stereolithography equipment

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013067036A (en) * 2011-09-21 2013-04-18 Keyence Corp Three-dimensional shaping apparatus
US10183329B2 (en) 2013-07-19 2019-01-22 The Boeing Company Quality control of additive manufactured parts
JP2016535690A (en) * 2013-07-19 2016-11-17 ザ・ボーイング・カンパニーThe Boeing Company Quality control of additional manufactured parts
CN108357106A (en) * 2013-08-07 2018-08-03 麻省理工学院 The automation process of increasing material manufacturing equipment controls
AU2017265050B2 (en) * 2013-08-07 2019-05-30 Massachusetts Institute Of Technology Automatic process control of additive manufacturing device
JP2016533925A (en) * 2013-08-07 2016-11-04 マサチューセッツ インスティテュート オブ テクノロジー Automatic process control of additive manufacturing equipment
JP2015196383A (en) * 2014-03-31 2015-11-09 ゼロックス コーポレイションXerox Corporation System for detecting inoperative inkjet by using optical sensor and reversible heat-sensitive substrate during printing three-dimensional object
WO2016042794A1 (en) * 2014-09-16 2016-03-24 株式会社東芝 Laminate shaping apparatus and laminate shaping method
JPWO2016042610A1 (en) * 2014-09-17 2017-07-06 富士機械製造株式会社 Method for identifying 3D objects
WO2016042610A1 (en) * 2014-09-17 2016-03-24 富士機械製造株式会社 Method for identifying three-dimensional molding

Also Published As

Publication number Publication date
WO2008120516A1 (en) 2008-10-09

Similar Documents

Publication Publication Date Title
US10562288B2 (en) Additive manufacturing system with ultrasonic inspection and method of operation
CA2919508C (en) Automatic process control of additive manufacturing device
US10639879B2 (en) Selective laser solidification apparatus and method
EP2988921B1 (en) Hybrid support systems and methods of generating a hybrid support system using three dimensional printing
Wits et al. Porosity testing methods for the quality assessment of selective laser melted parts
JP6733654B2 (en) Three-dimensional structure manufacturing apparatus and structure manufacturing method
US20190291345A1 (en) Sensor fusion for powder bed manufacturing process control
US20180035080A1 (en) Verification and adjustment systems and methods for additive manufacturing
Su et al. An automated flank wear measurement of microdrills using machine vision
KR101787510B1 (en) Method and device for monitoring a laser machining operation to be performed on a workpiece and laser machining head having such a device
US20180169948A1 (en) System and method for ensuring consistency in additive manufacturing using thermal imaging
JP2018108730A (en) Method and system for x-ray backscatter inspection of additive manufactured parts
EP2188115B1 (en) Methods and systems for automated ply boundary and orientation inspection
JP2017207478A (en) Metal am process with in situ inspection
KR101295463B1 (en) Method of evaluating substrate quality and apparatus thereof
zur Jacobsmühlen et al. High resolution imaging for inspection of laser beam melting systems
JP6374934B2 (en) Additive manufacturing system including an imaging device and method of operating such a system
US9827717B2 (en) Statistical predictive modeling and compensation of geometric deviations of 3D printed products
US20160039150A1 (en) Three-dimensional printer with force detection
US7495758B2 (en) Apparatus and methods for two-dimensional and three-dimensional inspection of a workpiece
US20190022946A1 (en) An additive manufacturing method and apparatus
US20180143147A1 (en) Optical-coherence-tomography guided additive manufacturing and laser ablation of 3d-printed parts
US6909502B2 (en) Method and apparatus for measuring ripple and distortion in a transparent material
US20160283833A1 (en) Printer monitoring
JP2012045610A (en) Apparatus and method for determining shape of end of bead