JP4758397B2 - Module for optical communication - Google Patents

Module for optical communication Download PDF

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JP4758397B2
JP4758397B2 JP2007156654A JP2007156654A JP4758397B2 JP 4758397 B2 JP4758397 B2 JP 4758397B2 JP 2007156654 A JP2007156654 A JP 2007156654A JP 2007156654 A JP2007156654 A JP 2007156654A JP 4758397 B2 JP4758397 B2 JP 4758397B2
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optical
housing
metal plate
transmitter
optical transmitter
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JP2008309960A (en
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真吾 井上
正登 日野
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Sumitomo Electric Device Innovations Inc
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Sumitomo Electric Device Innovations Inc
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本発明は、光通信用モジュールに関し、より詳細には、光学部品を固定した光通信用モジュールに関する。   The present invention relates to an optical communication module, and more particularly to an optical communication module in which optical components are fixed.

小型化を指向してきた光通信装置の分野では、通信装置がモジュール化され、光学部品等をケースに収納するモジュール(特許文献1参照)が知られている。光学部品として、発光素子を内部に備えた光送信部であるTOSA(Transmitter Optical Sub-Assembly)や受光素子を内部に備えた光受信部であるROSA(Receive Optical Sub-Assembly)等が用いられている。   In the field of optical communication devices that have been aimed at miniaturization, a communication device is modularized, and a module (see Patent Document 1) in which an optical component or the like is housed in a case is known. As optical components, TOSA (Transmitter Optical Sub-Assembly), which is an optical transmission unit provided with a light emitting element, and ROSA (Receive Optical Sub-Assembly), which is an optical reception unit provided with a light receiving element, are used. Yes.

近年、モジュール化において重要な事項として消費電力を小さくすることが挙げられる。特に光送信部の内部には、レーザーの動作温度を制御するTEC(Thermo Electric Cooler)が搭載されており、光送信部の放熱性が悪いと、レーザーを所望の温度にするために必要なTECの電力が増大し、結果として、光通信用モジュール全体の消費電力が増大してしまう。
特開2005−249892号公報
In recent years, reducing power consumption is an important matter in modularization. In particular, a TEC (Thermo Electric Cooler) that controls the operating temperature of the laser is mounted inside the optical transmission unit. If the heat transmission property of the optical transmission unit is poor, the TEC required to bring the laser to a desired temperature. As a result, the power consumption of the entire optical communication module increases.
JP 2005-249892 A

従来、光送信部で発生した熱を放熱させる方法としては、光送信部と筐体とをシリコン樹脂等を介在して接続させることで、光送信部で発生した熱を筐体に放熱させている。しかしながら、シリコン樹脂等は熱伝導率が低いため、光送信部で発生した熱を十分に放熱させることが難しい。   Conventionally, as a method of dissipating the heat generated in the optical transmitter, the heat generated in the optical transmitter can be dissipated to the housing by connecting the optical transmitter and the housing via silicon resin or the like. Yes. However, since silicon resin or the like has low thermal conductivity, it is difficult to sufficiently dissipate the heat generated in the optical transmitter.

本発明は、上記課題に鑑みなされたものであり、光送信部で発生した熱を効率よく放熱させることができ、消費電力を抑制することが可能な光通信用モジュールを提供することを目的とする。   The present invention has been made in view of the above problems, and an object of the present invention is to provide an optical communication module that can efficiently dissipate heat generated in an optical transmission unit and can suppress power consumption. To do.

本発明は、発光素子と前記発光素子の温度を制御するTECとを内部に備えた光送信部と、受光素子を内部に備えた光受信部と、前記光送信部との間および前記光受信部との間に間隔を有するように設けられ、前記光送信部と前記光受信部とを並ぶように収納する筐体と、前記間隔に設けられ、前記光送信部と前記筐体との間から前記光受信部と前記筐体との間にまで延在する金属板と、前記光送信部および前記光受信部と前記金属板との間に設けられ、前記光送信部を構成する平坦な面と接し、前記光送信部と前記筐体との間から前記光受信部と前記筐体との間にまで延在する、前記光送信部および前記光受信部の機械的公差を吸収すると共に前記金属板よりも熱伝導率の小さい第1接続材と、前記筐体と前記金属板との間に設けられ、前記光送信部と前記筐体との間から前記光受信部と前記筐体との間にまで延在する、前記光送信部および前記光受信部の機械的公差を吸収すると共に前記金属板よりも熱伝導率の小さい第2接続材と、を具備し、前記光送信部および前記光受信部と前記筐体とは、前記第1接続材、前記金属板、および前記第2接続材を介して熱的に接続していることを特徴とする光通信用モジュールである。本発明によれば、熱伝導率の高い金属板を介して光送信部と筐体とが熱的に接続しているため、光送信部で発生した熱を効率よく筐体に放熱させることができる。このため、光通信用モジュールの消費電力を抑制することが可能となる。 The present invention provides an optical transmitter that includes a light emitting element and a TEC that controls the temperature of the light emitting element, an optical receiver that includes a light receiving element therein, the optical transmitter, and the optical receiver. Between the optical transmission unit and the housing, and a housing that houses the optical transmission unit and the optical reception unit in a line, and is provided at the interval. A flat metal plate extending between the optical receiver and the housing, and provided between the optical transmitter and the optical receiver and the metal plate to constitute the optical transmitter While absorbing a mechanical tolerance of the optical transmitter and the optical receiver, which is in contact with a surface and extends from between the optical transmitter and the casing to the optical receiver and the casing. Provided between the first connecting member having a lower thermal conductivity than the metal plate, the housing and the metal plate; Extending from between the optical transmitter and the housing to between the optical receiver and the housing, absorbs mechanical tolerances of the optical transmitter and the optical receiver, and more than the metal plate A second connecting member having a low thermal conductivity, and the light transmitting unit, the light receiving unit, and the housing are disposed via the first connecting member, the metal plate, and the second connecting member. An optical communication module characterized by being thermally connected. According to the present invention, since the optical transmitter and the housing are thermally connected via the metal plate having high thermal conductivity, the heat generated in the optical transmitter can be efficiently radiated to the housing. it can. For this reason, it becomes possible to suppress the power consumption of the module for optical communication.

上記構成において、前記金属板の面積は前記光送信部の面積より大きい構成とすることができる。この構成によれば、光送信部で発生した熱をより効率よく筐体に放熱させることができる。 The said structure WHEREIN: The area of the said metal plate can be set as the structure larger than the area of the said optical transmission part. According to this configuration, the heat generated in the optical transmitter can be radiated to the housing more efficiently.

上記構成において、前記第1接続材の厚さは前記第2接続材の厚さより薄い構成とすることができる。この構成によれば、光送信部で発生した熱をより効率よく筐体に放熱させることができる。   The said structure WHEREIN: The thickness of a said 1st connection material can be set as the structure thinner than the thickness of a said 2nd connection material. According to this configuration, the heat generated in the optical transmitter can be radiated to the housing more efficiently.

本発明によれば、光送信部と筐体とを熱伝導率の高い金属板を介して熱的に接続させることで、光送信部で発生した熱を効率よく筐体に放熱させることができる。このため、消費電力を抑制することが可能な光通信用モジュールを得ることができる。   According to the present invention, the heat generated in the optical transmitter can be efficiently radiated to the casing by thermally connecting the optical transmitter and the casing via the metal plate having high thermal conductivity. . For this reason, the module for optical communication which can suppress power consumption can be obtained.

以下、図面を参照に本発明の実施例について説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図1(a)は実施例1に係る光通信用モジュールにおいて、カバーを透視した場合の上面図であり、図1(b)は図1(a)のA−A間の断面図である。   FIG. 1A is a top view of the optical communication module according to the first embodiment when the cover is seen through, and FIG. 1B is a cross-sectional view taken along a line AA in FIG.

図1(a)および図1(b)を参照に、発光素子を内部に備えたTOSAである光送信部12と、受光素子を内部に備えたROSAである光受信部14と、は並ぶように筐体10に収納されている。光送信部12および光受信部14(以下、光送受信部15)はステンレス等の金属材料からなり、筐体10は亜鉛ダイカスト等の金属材料からなる。光送受信部15はそれぞれ光ファイバに接続するレセプタクル16を有している。また、光送信部12の内部にはTECが搭載されている。筐体10には回路基板24がネジ28を用いネジ止めされている。回路基板24下には送受信回路(不図示)が設けられている。送受信回路は光送信部12に電気信号を送信し、光送信部12から光ファイバに光を送信するための回路、及び光ファイバから光を受信した光受信部14から出力される電気信号を受信するための回路である。光送信部12内の発光素子および光受信部14内の受光素子と送受信回路とを接続し電気信号を入出力するケーブル30が設けられている。なお、図1(a)および図1(b)並びに図3において、ケーブル30の図示を省略している。   With reference to FIG. 1A and FIG. 1B, an optical transmitter 12 that is a TOSA having a light emitting element therein and an optical receiver 14 that is a ROSA having a light receiving element therein are aligned. Is housed in a housing 10. The optical transmitter 12 and the optical receiver 14 (hereinafter referred to as optical transmitter / receiver 15) are made of a metal material such as stainless steel, and the casing 10 is made of a metal material such as zinc die cast. Each optical transceiver 15 has a receptacle 16 connected to an optical fiber. A TEC is mounted inside the optical transmitter 12. A circuit board 24 is screwed to the housing 10 using screws 28. A transmission / reception circuit (not shown) is provided under the circuit board 24. The transmission / reception circuit transmits an electrical signal to the optical transmission unit 12, and receives an electrical signal output from the optical reception unit 14 that receives light from the optical fiber and a circuit for transmitting light from the optical transmission unit 12 to the optical fiber. It is a circuit for doing. A cable 30 is provided for connecting the light emitting element in the optical transmitter 12 and the light receiving element in the optical receiver 14 and the transmission / reception circuit to input / output an electric signal. In addition, illustration of the cable 30 is abbreviate | omitted in Fig.1 (a), FIG.1 (b), and FIG.

光送受信部15と筐体10との間には0.83mmの間隔11が存在する。間隔11にはAl(アルミニウム)からなり厚さ0.60mmの金属板18と、シリコーングリースからなり厚さ0.115mmの第1接続材20および第2接続材22と、が設けられている。第1接続材20は光送受信部15と金属板18との間に設けられ、第2接続材22は筐体10と金属板18との間に設けられている。これにより、光送受信部15と筐体10とは、第1接続材20、金属板18および第2接続材22を介して熱的に接続している。光送受信部15および回路基板24上にカバー26が設けられており、光送受信部15および回路基板24はカバー26により保護されている。   An interval 11 of 0.83 mm exists between the optical transceiver 15 and the housing 10. The spacing 11 is provided with a metal plate 18 made of Al (aluminum) and having a thickness of 0.60 mm, and a first connecting material 20 and a second connecting material 22 made of silicone grease and having a thickness of 0.115 mm. The first connecting member 20 is provided between the optical transceiver 15 and the metal plate 18, and the second connecting member 22 is provided between the housing 10 and the metal plate 18. Thereby, the optical transmitter / receiver 15 and the housing 10 are thermally connected via the first connecting member 20, the metal plate 18, and the second connecting member 22. A cover 26 is provided on the optical transceiver 15 and the circuit board 24, and the optical transceiver 15 and the circuit board 24 are protected by the cover 26.

次に、図2(a)から図3を用い、実施例1に係る光通信用モジュールにおいて、筐体10に光送受信部15を搭載する方法を説明する。なお、回路基板24については図示を省略している。図2(a)を参照に、固定冶具27を用い光送信部12および光受信部14が互いに並ぶように固定する。金属板18の一方の面に第1接続材20を塗布する。金属板18の第1接続材20が塗られた面を光送受信部15に接続させる。これにより、図2(b)に示すように、光送受信部15と金属板18とは、第1接続材20を介して熱的に接続される。   Next, a method for mounting the optical transceiver 15 in the housing 10 in the optical communication module according to the first embodiment will be described with reference to FIGS. The circuit board 24 is not shown. Referring to FIG. 2A, the fixing device 27 is used to fix the optical transmitter 12 and the optical receiver 14 so that they are aligned with each other. The first connecting material 20 is applied to one surface of the metal plate 18. The surface of the metal plate 18 coated with the first connecting material 20 is connected to the optical transceiver 15. Thereby, as shown in FIG. 2 (b), the optical transceiver 15 and the metal plate 18 are thermally connected via the first connecting member 20.

図3を参照に、筐体10には孔部32が設けられている。光送受信部15それぞれのレセプタクル16を孔部32に嵌め込むことで、筐体10と光送受信部15とを固定する。また、金属板18と筐体10との間の筐体10に第2接続材22が塗布されており、これにより、筐体10と金属板18とは第2接続材22を介して熱的に接続している。よって、光送受信部15と筐体10とは、第1接続材20、金属板18、第2接続材22を介して熱的に接続している。このようにして、光送受信部15は筐体10に搭載される。   With reference to FIG. 3, a hole 32 is provided in the housing 10. The housing 10 and the optical transceiver 15 are fixed by fitting the receptacle 16 of each optical transceiver 15 into the hole 32. Further, the second connecting material 22 is applied to the housing 10 between the metal plate 18 and the housing 10, whereby the housing 10 and the metal plate 18 are thermally connected via the second connecting material 22. Connected to. Therefore, the optical transmitter / receiver 15 and the housing 10 are thermally connected via the first connection member 20, the metal plate 18, and the second connection member 22. In this way, the optical transmission / reception unit 15 is mounted on the housing 10.

図4に、実施例1および比較例1において、筐体10の温度を一定に保つ為に必要なTECの電力についての測定結果を示す。比較例1に係る光通信用モジュールは、光送受信部15と筐体10との間に金属板18を設けていない場合、つまり、光送受信部15と筐体10との間にシリコーングリースからなる接続材のみ設けられている場合であり、その他の構成については実施例1と同じである。図4を参照に、筐体10の温度が50℃以上の高温になると、筐体10を一定の温度に保つ為に必要なTECの電力が、比較例1に比べ実施例1は少なくて済むことが確認できる。   In FIG. 4, the measurement result about the electric power of TEC required in order to keep the temperature of the housing | casing 10 constant in Example 1 and the comparative example 1 is shown. The optical communication module according to Comparative Example 1 is made of silicone grease when the metal plate 18 is not provided between the optical transceiver 15 and the housing 10, that is, between the optical transceiver 15 and the housing 10. This is the case where only the connecting material is provided, and the other configurations are the same as those in the first embodiment. Referring to FIG. 4, when the temperature of the housing 10 reaches a high temperature of 50 ° C. or higher, the TEC power required to keep the housing 10 at a constant temperature is less in the first embodiment than in the first comparative example. I can confirm that.

比較例1は、図5に示すように、光送信部12と筐体10との間に設けたシリコーングリースを介して、光送信部12と筐体10とを熱的に接続させている。光送信部12で発生した熱を放熱させる観点からは、光送信部12を筐体10に直接接続させる場合が好ましい。しかしながら、光送信部12のレセプタクル16は光ファイバに接続するため、光送信部12のレセプタクル16の光軸を光ファイバの光軸と合わせる必要がある。光送信部12のレセプタクル16の光軸は、光送信部12内のレンズ等による機械的公差により偏芯が生じる場合がある。よって、機械的公差を吸収でき、光送信部12のレセプタクル16と光ファイバとの光軸を合わせることができるよう、光送信部12を筐体10に直接接続させずに、シリコーングリースを介して接続させている。また、機械的公差の理由以外にも、光送受信部15や筐体10等に汎用性を求めると、光送受信部15と筐体10との間に、少なからず間隔が生じてしまう。このため、光送受信部15と筐体10との間隔をシリコーングリースで埋めることで、光送受信部15と筐体10とを接続させている。さらに、光送受信部15を筐体10に収納する際の組み付け時の作業性を向上させるという理由からも、光送受信部15と筐体10とを直接接続させていない。   In Comparative Example 1, as shown in FIG. 5, the light transmitting unit 12 and the housing 10 are thermally connected via silicone grease provided between the light transmitting unit 12 and the housing 10. From the viewpoint of dissipating the heat generated in the optical transmitter 12, it is preferable to connect the optical transmitter 12 directly to the housing 10. However, since the receptacle 16 of the optical transmission unit 12 is connected to the optical fiber, it is necessary to match the optical axis of the receptacle 16 of the optical transmission unit 12 with the optical axis of the optical fiber. The optical axis of the receptacle 16 of the optical transmission unit 12 may be decentered due to mechanical tolerance due to a lens or the like in the optical transmission unit 12. Therefore, the optical transmitter 12 is not directly connected to the housing 10 so that the mechanical tolerance can be absorbed and the optical axis of the receptacle 16 of the optical transmitter 12 and the optical fiber can be aligned. Connected. Further, in addition to the reason for mechanical tolerance, when versatility is required for the optical transceiver 15 and the housing 10, there is a considerable space between the optical transceiver 15 and the housing 10. For this reason, the optical transmission / reception part 15 and the housing | casing 10 are connected by filling the space | interval of the optical transmission / reception part 15 and the housing | casing 10 with silicone grease. Furthermore, the optical transmission / reception unit 15 and the housing 10 are not directly connected for the reason of improving workability during assembly when the optical transmission / reception unit 15 is housed in the housing 10.

しかしながら、シリコーングリースは熱伝導率が2.5W/mKと低いため放熱性が悪い。このため、光送信部12と筐体10との間の熱抵抗が大きくなり、図4に示すように、比較例1は、高温でのTECの消費電力が大きくなる。   However, since silicone grease has a low thermal conductivity of 2.5 W / mK, heat dissipation is poor. For this reason, the thermal resistance between the optical transmission part 12 and the housing | casing 10 becomes large, and as shown in FIG. 4, the power consumption of TEC at high temperature becomes large in the comparative example 1. FIG.

一方、図6に示すように、実施例1は光送信部12と筐体10との間にAlからなる金属板18とシリコーングリースからなる第1接続材20および第2接続材22が設けられている。このため、光送信部12と筐体10とは、第1接続材20、金属板18、第2接続材22を介して熱的に接続している。Alである金属板18は熱伝導率が238W/mKと高いため放熱性に優れている。また、金属板18の厚さ分、第1接続材20および第2接続材22の厚さを薄くすることができる。このため、光送信部12と筐体10との間の熱抵抗を抑制することができる。よって、光送信部12で発生した熱を効率よく筐体10に放熱させることができ、図4に示すように、TECの消費電力を抑制することができる。したがって、実施例1に係る光通信用モジュールは、光通信用モジュール全体の消費電力を抑制することが可能となる。   On the other hand, as shown in FIG. 6, in the first embodiment, a metal plate 18 made of Al and a first connecting material 20 and a second connecting material 22 made of silicone grease are provided between the optical transmitter 12 and the housing 10. ing. For this reason, the optical transmitter 12 and the housing 10 are thermally connected via the first connecting member 20, the metal plate 18, and the second connecting member 22. Since the metal plate 18 made of Al has a high thermal conductivity of 238 W / mK, the heat dissipation is excellent. Further, the thickness of the first connecting member 20 and the second connecting member 22 can be reduced by the thickness of the metal plate 18. For this reason, the thermal resistance between the optical transmission part 12 and the housing | casing 10 can be suppressed. Therefore, the heat generated in the optical transmitter 12 can be efficiently dissipated to the housing 10, and the power consumption of the TEC can be suppressed as shown in FIG. Therefore, the optical communication module according to the first embodiment can suppress the power consumption of the entire optical communication module.

特に、光送信部12内のレンズ等による機械的公差が大きい場合は、光送信部12と筐体10との間隔11が狭い場合や広い場合が生じる。光送信部12と筐体10との間隔11が狭い場合は、比較例1のように光送信部12と筐体10との間にシリコーングリース等の接続材を設けることで、光送信部12の熱を効率よく放熱できる。しかしながら、光送信部12と筐体10との間隔11が広い場合は、比較例1の構造では、接続材の厚さが厚くなり、光送信部12の放熱性が悪くなる。一方、実施例1の構造では、第1接続材20および第2接続材22の厚さを薄くしたまま、金属板18の厚さを厚くすることで対処できる。このため、光送信部12の放熱性の悪化を抑制できる。これらより、実施例1によれば、機械的公差が大きい場合でも、金属板18の厚さを変えることで、光送信部12の放熱性を悪化させずに対処することができる。特に、光送信部12と筐体10との間隔11が狭い場合は、光送信部12と筐体10との間に、金属板18を設けず、接続材のみを設ける場合が好ましい。   In particular, when the mechanical tolerance due to the lens or the like in the optical transmission unit 12 is large, there are cases where the distance 11 between the optical transmission unit 12 and the housing 10 is narrow or wide. When the distance 11 between the optical transmission unit 12 and the housing 10 is narrow, a connecting material such as silicone grease is provided between the optical transmission unit 12 and the housing 10 as in Comparative Example 1, so that the optical transmission unit 12 is provided. Can efficiently dissipate heat. However, when the distance 11 between the optical transmission unit 12 and the housing 10 is wide, in the structure of Comparative Example 1, the thickness of the connecting material is increased, and the heat dissipation of the optical transmission unit 12 is deteriorated. On the other hand, in the structure of the first embodiment, this can be dealt with by increasing the thickness of the metal plate 18 while keeping the thicknesses of the first connecting member 20 and the second connecting member 22 thin. For this reason, the deterioration of the heat dissipation of the optical transmission part 12 can be suppressed. Thus, according to the first embodiment, even when the mechanical tolerance is large, the thickness of the metal plate 18 can be changed to cope with the deterioration without deteriorating the heat radiation property of the optical transmitter 12. In particular, when the distance 11 between the optical transmission unit 12 and the housing 10 is narrow, it is preferable to provide only the connecting material without providing the metal plate 18 between the optical transmission unit 12 and the housing 10.

また、光送信部12および光受信部14と金属板18との間に設けた第1接続材20の厚さを、筐体10と金属板18との間に設けた第2接続材22の厚さより薄くする場合が好ましい
Further, the thickness of the first connecting member 20 provided between the light transmitting unit 12 and the light receiving unit 14 and the metal plate 18 is set to the thickness of the second connecting member 22 provided between the housing 10 and the metal plate 18. It is preferable to make it thinner than the thickness .

さらに、金属板18の面積を光送信部12の面積より大きくすることでも、光送信部12のパッケージが大きくなった場合と熱的に同一視することができ、光送信部12で発生した熱をより効率よく放熱させることができる。   Furthermore, even if the area of the metal plate 18 is made larger than the area of the optical transmission unit 12, it can be identified thermally when the package of the optical transmission unit 12 is large, and the heat generated in the optical transmission unit 12 Can be radiated more efficiently.

さらに、光受信部14を光送信部12に並ぶように筐体10に収納し、金属板18を光受信部14と筐体10との間まで延在させることで、光送信部12で発生した熱を、光受信部14を介して放熱させることが可能となる。これは、光受信部14はほとんど発熱しないためである。   Further, the optical receiver 14 is accommodated in the housing 10 so as to be aligned with the optical transmitter 12, and the metal plate 18 extends between the optical receiver 14 and the housing 10, thereby generating in the optical transmitter 12. It is possible to dissipate the heat that has been generated through the optical receiver 14. This is because the optical receiver 14 hardly generates heat.

実施例1において、光送信部12および光受信部14と金属板18との間に第1接続材20が設けられ、筐体10と金属板18との間に第2接続材22が設けられている場合を示したがこれに限られない。少なくとも、光送信部12および光受信部14と筐体10との間に接続材が設けられていれば、光送信部12および光受信部14内のレンズ等による機械的公差を吸収することができ、光ファイバとの光軸を合わせることができる。   In the first embodiment, the first connecting member 20 is provided between the optical transmitter 12 and the optical receiver 14 and the metal plate 18, and the second connecting member 22 is provided between the housing 10 and the metal plate 18. However, the present invention is not limited to this. If at least a connecting material is provided between the optical transmission unit 12 and the optical reception unit 14 and the housing 10, mechanical tolerances due to lenses in the optical transmission unit 12 and the optical reception unit 14 can be absorbed. It is possible to align the optical axis with the optical fiber.

また、金属板18はAlに限られず、熱伝導率の高い材料であればその他の材料でもよい。さらに、第1接続材20および第2接続材22はシリコーングリースに限られず、光送信部12および光受信部14内のレンズ等による機械的公差を吸収でき、光送信部12および光受信部14を筐体10に熱的に接続可能な材料であればその他の材料でもよい。特に、熱伝導率の高い材料が好ましい。   Further, the metal plate 18 is not limited to Al, and may be any other material as long as it has a high thermal conductivity. Further, the first connecting member 20 and the second connecting member 22 are not limited to silicone grease, and can absorb mechanical tolerances due to the lenses in the light transmitting unit 12 and the light receiving unit 14, and the light transmitting unit 12 and the light receiving unit 14. Other materials may be used as long as the material can be thermally connected to the housing 10. In particular, a material having high thermal conductivity is preferable.

以上、本発明の実施例について詳述したが、本発明は係る特定の実施例に限定されるものではなく、特許請求の範囲に記載された本発明の要旨の範囲内において、種々の変形・変更が可能である。
Although the embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications and changes can be made within the scope of the gist of the present invention described in the claims. It can be changed.

図1(a)は実施例1に係る光通信用モジュールの上面図であり、図1(b)は図1(a)のA−A間の断面図である。FIG. 1A is a top view of the optical communication module according to the first embodiment, and FIG. 1B is a cross-sectional view taken along a line AA in FIG. 図2(a)および図2(b)は光送信部および光受信部を筐体に搭載させる方法を説明するための斜視図(その1)である。FIGS. 2A and 2B are perspective views (No. 1) for explaining a method of mounting the optical transmission unit and the optical reception unit on the casing. 図3は光送信部および光受信部を筐体に搭載させる方法を説明するための斜視図(その2)である。FIG. 3 is a perspective view (No. 2) for explaining a method of mounting the optical transmitter and the optical receiver on the housing. 図4は筐体の温度を一定に保つために必要なTECの電力を測定した図である。FIG. 4 is a diagram in which the TEC power necessary to keep the temperature of the casing constant is measured. 図5は比較例1に係る光通信用モジュールの課題を説明するための図である。FIG. 5 is a diagram for explaining the problem of the optical communication module according to Comparative Example 1. 図6は実施例1に係る光通信用モジュールの効果を説明するための図である。FIG. 6 is a diagram for explaining the effect of the optical communication module according to the first embodiment.

符号の説明Explanation of symbols

10 筐体
11 間隔
12 光送信部
14 光受信部
15 光送受信部
16 レセプタクル
18 金属板
20 第1接続材
22 第2接続材
24 回路基板
26 カバー
27 固定冶具
28 ネジ
30 ケーブル
32 孔部
DESCRIPTION OF SYMBOLS 10 Case 11 Space | interval 12 Optical transmission part 14 Optical reception part 15 Optical transmission / reception part 16 Receptacle 18 Metal plate 20 1st connection material 22 2nd connection material 24 Circuit board 26 Cover 27 Fixing jig 28 Screw 30 Cable 32 Hole

Claims (3)

発光素子と前記発光素子の温度を制御するTECとを内部に備えた光送信部と、
受光素子を内部に備えた光受信部と、
前記光送信部との間および前記光受信部との間に間隔を有するように設けられ、前記光送信部と前記光受信部とを並ぶように収納する筐体と、
前記間隔に設けられ、前記光送信部と前記筐体との間から前記光受信部と前記筐体との間にまで延在する金属板と、
前記光送信部および前記光受信部と前記金属板との間に設けられ、前記光送信部を構成する平坦な面と接し、前記光送信部と前記筐体との間から前記光受信部と前記筐体との間にまで延在する、前記光送信部および前記光受信部の機械的公差を吸収すると共に前記金属板よりも熱伝導率の小さい第1接続材と、
前記筐体と前記金属板との間に設けられ、前記光送信部と前記筐体との間から前記光受信部と前記筐体との間にまで延在する、前記光送信部および前記光受信部の機械的公差を吸収すると共に前記金属板よりも熱伝導率の小さい第2接続材と、を具備し、
前記光送信部および前記光受信部と前記筐体とは、前記第1接続材、前記金属板、および前記第2接続材を介して熱的に接続していることを特徴とする光通信用モジュール。
An optical transmitter internally including a light emitting element and a TEC for controlling the temperature of the light emitting element ;
A light receiving unit having a light receiving element therein;
A housing that is provided so as to have an interval between the optical transmitter and the optical receiver, and that accommodates the optical transmitter and the optical receiver in a line;
A metal plate provided in the interval and extending from between the optical transmitter and the housing to the optical receiver and the housing;
Provided between the optical transmission unit and the optical reception unit and the metal plate, in contact with a flat surface constituting the optical transmission unit, between the optical transmission unit and the housing, the optical reception unit A first connecting member that extends between the housing and absorbs mechanical tolerances of the optical transmitter and the optical receiver and has a lower thermal conductivity than the metal plate;
The optical transmitter and the light, which are provided between the casing and the metal plate and extend from between the optical transmitter and the casing to between the optical receiver and the casing. A second connecting member that absorbs mechanical tolerances of the receiver and has a lower thermal conductivity than the metal plate;
The optical transmitter, the optical receiver, and the housing are thermally connected to each other through the first connecting member, the metal plate, and the second connecting member. module.
前記金属板の面積は前記光送信部の面積より大きいことを特徴とする請求項1記載の光通信用モジュール。   The optical communication module according to claim 1, wherein an area of the metal plate is larger than an area of the optical transmission unit. 前記第1接続材の厚さは前記第2接続材の厚さより薄いことを特徴とする請求項2記載の光通信用モジュール。   The optical communication module according to claim 2, wherein a thickness of the first connection member is smaller than a thickness of the second connection member.
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