JP4741896B2 - Ultrasonic probe - Google Patents

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JP4741896B2
JP4741896B2 JP2005210627A JP2005210627A JP4741896B2 JP 4741896 B2 JP4741896 B2 JP 4741896B2 JP 2005210627 A JP2005210627 A JP 2005210627A JP 2005210627 A JP2005210627 A JP 2005210627A JP 4741896 B2 JP4741896 B2 JP 4741896B2
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flexible sheet
flexible
bent
flexible substrate
ultrasonic probe
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JP2007021038A (en
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正弘 新海
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Description

本発明は、超音波素子を揺動又は回転させて3次元断層画像を得るために超音波素子を構成する複数の圧電素子の各電極を可撓性基板(フレキシブルプリント基板)を介して駆動回路基板に接続する超音波探触子に関する。   The present invention relates to a drive circuit for connecting each electrode of a plurality of piezoelectric elements constituting an ultrasonic element via a flexible substrate (flexible printed circuit board) in order to obtain a three-dimensional tomographic image by swinging or rotating the ultrasonic element. The present invention relates to an ultrasonic probe connected to a substrate.

図5は従来の超音波探触子を示す。超音波素子1は図面の紙面と直交する方向に複数の圧電素子(不図示)が配列されて圧電素子の表面には共通電極(不図示)が、裏面には各駆動電極(不図示)が形成されて構成され、この構成により、圧電素子の配列方向と超音波送受信方向の2次元断層画像を得ることができる。さらに、超音波素子1を左右方向に揺動又は回転させることにより3次元断層画像を得ることができ、超音波素子1を揺動又は回転させるために、圧電素子の各電極を駆動回路基板2に接続する配線として可撓性基板(フレキシブルプリント基板)(Flexible Printed Circuit:以下FPC)3を用い、FPC3を回動部などの周辺部品4に当接して破損しないように周辺部品4の回りに略S字状に屈曲させて配置している。   FIG. 5 shows a conventional ultrasonic probe. In the ultrasonic element 1, a plurality of piezoelectric elements (not shown) are arranged in a direction orthogonal to the paper surface of the drawing, a common electrode (not shown) is provided on the surface of the piezoelectric element, and each drive electrode (not shown) is provided on the back surface. With this configuration, a two-dimensional tomographic image in the arrangement direction of the piezoelectric elements and the ultrasonic transmission / reception direction can be obtained. Further, a three-dimensional tomographic image can be obtained by swinging or rotating the ultrasonic element 1 in the left-right direction. In order to swing or rotate the ultrasonic element 1, each electrode of the piezoelectric element is connected to the drive circuit board 2. A flexible printed circuit (Flexible Printed Circuit) (hereinafter referred to as FPC) 3 is used as wiring to be connected to the peripheral part 4 so that the FPC 3 is not in contact with the peripheral part 4 such as a rotating part and is not damaged. It is bent and arranged in a substantially S shape.

ところで、下記の特許文献1には、体腔内に挿入する可撓性管の先端に超音波プローブが取り付けられた超音波内視鏡において、可撓性管の内部に配設されたフレキシブル基板の配線が可撓性管の屈曲により断線しないようにするために略同じ幅の可撓性シートをフレキシブル基板に重ね合わせる方法が開示されている。また、単に可撓性シートをフレキシブル基板に重ね合わせるだけでは剛性が増大して曲がりにくくなるので、これを防止するために、下記の特許文献2にはフレキシブル基板と接触する可撓性シートの面を梨地状に形成する方法が開示されている。
特開2002−153468号公報(要約書) 特開2003−111758号公報(要約書)
By the way, in the following Patent Document 1, in an ultrasonic endoscope in which an ultrasonic probe is attached to the distal end of a flexible tube to be inserted into a body cavity, a flexible substrate disposed inside the flexible tube is disclosed. A method is disclosed in which a flexible sheet having substantially the same width is superposed on a flexible substrate so that the wiring is not disconnected by bending of the flexible tube. Moreover, since the rigidity is increased and the bending becomes difficult by simply superimposing the flexible sheet on the flexible substrate, in order to prevent this, the following patent document 2 describes the surface of the flexible sheet in contact with the flexible substrate. Has been disclosed.
JP 2002-153468 A (abstract) JP2003-111758 (abstract)

しかしながら、従来の超音波探触子では、FPC3を周辺部品4に当接しないように周辺部品4の回りに略S字状に屈曲させて配置しているものの、FPC3の各部位での可撓性のばらつき(図6の1〜4枚目のFPC3)により周辺部品4に当接しやすいものもあるので、この場合にはFPC3を周辺部品4の回りに配置する前にFPC3の屈曲形状を手作業で長時間かけて略S字状に修正(整形)する必要があるという問題点がある。また、手作業による修正ではFPC3の屈曲形状にばらつきが発生したり、FPC3を修正後に周辺部品4の回りに配置しても形状が元に戻り、周辺部品4に当接することがあるという問題点がある。   However, in the conventional ultrasonic probe, the FPC 3 is bent in a substantially S shape around the peripheral component 4 so as not to contact the peripheral component 4, but the flexibility at each part of the FPC 3 In some cases, the bent shape of the FPC 3 may be changed before the FPC 3 is arranged around the peripheral component 4 because there is a tendency to contact the peripheral component 4 due to the variation in the characteristics (the first to fourth FPC 3 in FIG. 6). There is a problem that it is necessary to correct (shape) it into a substantially S-shape over a long period of time. Further, in the manual correction, there is a variation in the bent shape of the FPC 3, and even if the FPC 3 is arranged around the peripheral component 4 after the correction, the shape may return to the original and may contact the peripheral component 4. There is.

そこで、特許文献2のように可撓性シートをFPC3に重ね合わせるとともに、FPC3と接触する可撓性シートの面を梨地状などの特殊加工を施す方法が考えられる。しかしながら、FPC3を周辺部品4の回りに略S字状に屈曲させて配置する構成では、FPC3は長手方向に曲がりが大きく荷重が大きい部分とそうでない部分があるので、特許文献2のような方法を適用してもFPC3は所望の屈曲形状にならないという問題点がある。また、FPC3と接触する可撓性シートのすべての面に特殊加工を施すと高価になるという問題点がある。   Therefore, a method is conceivable in which a flexible sheet is superposed on the FPC 3 as in Patent Document 2 and the surface of the flexible sheet in contact with the FPC 3 is subjected to special processing such as a satin finish. However, in the configuration in which the FPC 3 is bent and arranged in a substantially S shape around the peripheral component 4, the FPC 3 has a portion that is bent in the longitudinal direction and has a large load, and a portion that is not so. However, there is a problem that the FPC 3 does not have a desired bent shape even if the above is applied. In addition, there is a problem that if special processing is applied to all surfaces of the flexible sheet that comes into contact with the FPC 3, it becomes expensive.

本発明は上記従来例の問題点に鑑み、圧電素子の各電極を駆動回路基板に接続する配線として可撓性基板を周辺部品の回りに略S字状に屈曲させて配置する場合に、可撓性基板を周辺部品に当接して破損しない屈曲形状にすることができる超音波探触子を提供することを目的とする。   In view of the above-described problems of the conventional example, the present invention is possible when a flexible substrate is bent around a peripheral component in a substantially S shape as a wiring for connecting each electrode of a piezoelectric element to a drive circuit substrate. An object of the present invention is to provide an ultrasonic probe that can be bent so that the flexible substrate is not damaged by being brought into contact with peripheral components.

本発明は上記目的を達成するために、3次元断層画像を得るために揺動又は回転する超音波素子と、
記超音波素子を構成する複数の圧電素子の各電極を駆動回路基板接続し、前記超音波素子の揺動又は回転させる回動部を含む周辺部品の周りに略S字状に屈曲して配置された可撓性基板と、
前記可撓性基板と略同じ幅で前記可撓性基板の面に沿うように配置される可撓性シートとを備え、
前記可撓性シートは、前記略S字状に屈曲した部分のうち前記超音波素子の揺動又は回転により前記可撓性基板に最も荷重がかかる最大荷重点とその近傍とを、他の部分より相対的に弾性力を小さく形成した構成とした。
また、前記最大荷重点は、前記圧電素子から引き出された前記可撓性基板の最初と2番目に凸状に曲げられた部分であることを特徴とする。
また、前記可撓性シートの所定部位の弾性力が相対的に他の部分より小さい部分は、前記可撓性シートの厚みが前記他の部分より薄く形成されていることを特徴とする。
また、前記可撓性シートの所定部位の弾性力が相対的に他の部分より小さい部分は、前記可撓性シートの幅が前記他の部分より小さく形成されていることを特徴とする。
また、前記可撓性シートの所定部位の弾性力が相対的に他の部分より小さい部分には、前記可撓性シートのシート面に複数の穴が形成されていることを特徴とする。
To achieve the above object, the present invention provides an ultrasonic element that swings or rotates to obtain a three-dimensional tomographic image,
Each electrode of the plurality of piezoelectric elements constituting the front Symbol ultrasonic element connected to the driving circuit board, bent into a substantially S-shape around the peripheral parts including the pivot portion for pivoting or rotation of the ultrasonic element A flexible substrate arranged
A flexible sheet arranged to be substantially the same width as the flexible substrate and along the surface of the flexible substrate ;
The flexible sheet has a maximum load point at which the load is most applied to the flexible substrate by the swinging or rotation of the ultrasonic element in the portion bent in the substantially S shape and the vicinity thereof. The configuration is such that the elastic force is relatively small .
The maximum load point is a portion bent in a convex shape from the first and second of the flexible substrate drawn out from the piezoelectric element.
In addition, the portion where the elastic force of the predetermined portion of the flexible sheet is relatively smaller than the other portion is formed such that the thickness of the flexible sheet is thinner than that of the other portion.
In addition, the portion where the elastic force of the predetermined portion of the flexible sheet is relatively smaller than the other portion is formed such that the width of the flexible sheet is smaller than that of the other portion.
In addition, a plurality of holes are formed in a sheet surface of the flexible sheet in a portion where the elastic force of a predetermined portion of the flexible sheet is relatively smaller than other portions.

この構成により、可撓性基板と略同じ幅の可撓性シートを可撓性基板の面に沿うように配置するとともに、可撓性基板の曲がりにくい部分に対応する可撓性シートの部分の弾性力を他の部分より小さく形成したので、可撓性基板を長手方向全体にわたって同じ曲がりやすさにすることができる。   With this configuration, the flexible sheet having substantially the same width as that of the flexible substrate is arranged along the surface of the flexible substrate, and the portion of the flexible sheet corresponding to the portion of the flexible substrate that is difficult to bend. Since the elastic force is smaller than the other portions, the flexible substrate can be easily bent in the entire longitudinal direction.

本発明によれば、可撓性基板を長手方向全体にわたって同じ曲がりやすさにすることができるので、可撓性基板を周辺部品に当接して破損しない屈曲形状にすることができる。   According to the present invention, since the flexible substrate can be easily bent in the entire longitudinal direction, the flexible substrate can be bent so as not to be damaged by being in contact with peripheral components.

以下、図面を参照して本発明の実施の形態について説明する。図1は本発明に係る超音波探触子の一実施の形態を示す構成図、図2は図1の可撓性シートを詳しく示す構成図である。   Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing an embodiment of an ultrasonic probe according to the present invention, and FIG. 2 is a block diagram showing in detail the flexible sheet of FIG.

図1(a)は超音波素子1が左に傾いた状態を示し、図1(b)は超音波素子1が中立の状態を示し、図1(c)は超音波素子1が右に傾いた状態を示す。超音波素子1は図面の紙面と直交する方向に複数の圧電素子(不図示)が配列されて圧電素子の表面には共通電極(不図示)が、裏面には各駆動電極(不図示)が形成されて構成され、圧電素子の各電極は駆動回路基板2に対して、回動部などの周辺部品4に当接して破損しないように周辺部品4の回りに略S字状に屈曲させて配置されたFPC3を介して接続されている。   1A shows a state where the ultrasonic element 1 is tilted to the left, FIG. 1B shows a state where the ultrasonic element 1 is neutral, and FIG. 1C shows that the ultrasonic element 1 is tilted to the right. Indicates the state. In the ultrasonic element 1, a plurality of piezoelectric elements (not shown) are arranged in a direction orthogonal to the paper surface of the drawing, a common electrode (not shown) is provided on the surface of the piezoelectric element, and each drive electrode (not shown) is provided on the back surface. Each electrode of the piezoelectric element is formed in a substantially S shape around the peripheral component 4 so as not to be damaged by contact with the peripheral component 4 such as a rotating portion with respect to the drive circuit board 2. It is connected via the arranged FPC 3.

FPC3の周辺部品4に対向する面には、図2に示すようなFPC3と略同じ幅の可撓性シート5が沿うように配置されている。ここで、超音波素子1が図1(b)に示すような中立の状態から図1(a)に示すように左に傾くと、図1(b)では略S字状のFPC3は、圧電素子から引き出されて最初に凸状に曲げられた部分が最大荷重点となるので、この部分で弾性力が他の部分と同じであると略S字状に曲がりにくくなり、周辺部品4に当接するおそれがある。また、超音波素子1が図1(b)に示すような中立の状態から図1(c)に示すように右に傾くと、図1(b)では略S字状のFPC3は、圧電素子から引き出されて2番目に凸状に曲げられた部分が最大荷重点となるので、この部分で弾性力が他の部分と同じであると略S字状に曲がりにくくなり、周辺部品4に当接するおそれがある。そこで、図2に示すように最大荷重点のような所定の部位では弾性力が他の部分より小さくなるように、可撓性シート5のこの部分5aの厚みを最大荷重点で他の部分より薄くなるように形成している。この構成により、FPC3は最大荷重点で他の部分より曲がりやすくなるので、周辺部品4に当接して破損しない屈曲形状にすることができる。   A flexible sheet 5 having substantially the same width as that of the FPC 3 as shown in FIG. 2 is arranged on the surface of the FPC 3 facing the peripheral component 4. Here, when the ultrasonic element 1 is tilted to the left as shown in FIG. 1A from the neutral state as shown in FIG. 1B, the substantially S-shaped FPC 3 in FIG. The portion that is first pulled out of the element and bent into a convex shape is the maximum load point. If the elastic force is the same as that of the other portions in this portion, it becomes difficult to bend into a substantially S shape, and it hits the peripheral component 4. There is a risk of contact. When the ultrasonic element 1 is tilted to the right as shown in FIG. 1C from the neutral state as shown in FIG. 1B, the substantially S-shaped FPC 3 in FIG. The portion that is pulled out and bent to the second convex shape becomes the maximum load point. If the elastic force at this portion is the same as that of the other portions, it becomes difficult to bend into a substantially S shape and hits the peripheral component 4. There is a risk of contact. Therefore, as shown in FIG. 2, the thickness of the portion 5a of the flexible sheet 5 is set to be larger than that of the other portion at the maximum load point so that the elastic force is smaller than that of the other portion at a predetermined portion such as the maximum load point. It is formed to be thin. With this configuration, the FPC 3 is more easily bent than the other portions at the maximum load point, and thus can be bent so as not to be damaged by being in contact with the peripheral component 4.

<他の実施の形態>
上記実施の形態では、可撓性シート5の厚みを最大荷重点で他の部分より薄くなるように形成したが、図3に示すように可撓性シート5の部分5bの幅を最大荷重点で他の部分より狭くなるように形成してもよい。また、図4に示すように可撓性シート5の最大荷重点(部分5c)で複数個の穴を開けてもよい。さらに、図2、図3、図4に示す構成を組み合わせてもよい。これにより、圧電素子の各電極を駆動回路基板に接続する配線として可撓性基板を周辺部品の回りに略S字状に屈曲させて配置する場合に、可撓性基板を周辺部品に当接して破損しない屈曲形状にすることができる。
<Other embodiments>
In the above embodiment, the flexible sheet 5 is formed so that the thickness of the flexible sheet 5 is thinner than the other parts at the maximum load point, but the width of the part 5b of the flexible sheet 5 is set to the maximum load point as shown in FIG. It may be formed so as to be narrower than other portions. Further, as shown in FIG. 4, a plurality of holes may be formed at the maximum load point (part 5 c) of the flexible sheet 5. Furthermore, the configurations shown in FIGS. 2, 3, and 4 may be combined. As a result, when the flexible substrate is arranged as a wiring connecting each electrode of the piezoelectric element to the drive circuit substrate and bent in a substantially S shape around the peripheral component, the flexible substrate is brought into contact with the peripheral component. Can be bent to prevent damage.

本発明は、圧電素子の各電極を駆動回路基板に接続する配線として可撓性基板を周辺部品の回りに略S字状に屈曲させて配置する場合に、可撓性基板を周辺部品に当接して破損しない屈曲形状にすることができるという効果を有し、超音波探触子などに利用することができる。   According to the present invention, when a flexible substrate is arranged as a wiring connecting each electrode of a piezoelectric element to a drive circuit substrate and bent in a substantially S shape around the peripheral component, the flexible substrate is applied to the peripheral component. It has the effect that it can be made into a bent shape that does not break upon contact, and can be used for an ultrasonic probe or the like.

本発明に係る超音波探触子の一実施の形態を示す構成図であり、(a)は超音波素子が左に傾いた状態、(b)は超音波素子が中立の状態、(c)は超音波素子が右に傾いた状態BRIEF DESCRIPTION OF THE DRAWINGS It is a block diagram which shows one Embodiment of the ultrasonic probe which concerns on this invention, (a) is the state in which the ultrasonic element inclined to the left, (b) is the state in which the ultrasonic element is neutral, (c). Is the state where the ultrasonic element is tilted to the right 図1の可撓性シートを詳しく示す構成図The block diagram which shows the flexible sheet | seat of FIG. 1 in detail 図1の可撓性シートの他の実施の形態を示す構成図The block diagram which shows other embodiment of the flexible sheet | seat of FIG. 図1の可撓性シートの更に他の実施の形態を示す構成図The block diagram which shows other embodiment of the flexible sheet | seat of FIG. 従来の超音波探触子を示す構成図Configuration diagram showing a conventional ultrasonic probe 従来の他の超音波探触子を示す構成図Configuration diagram showing another conventional ultrasonic probe

符号の説明Explanation of symbols

1 超音波素子
2 駆動回路基板
3 フレキシブルプリント基板(FPC)
4 周辺部品
5 可撓性シート
1 Ultrasonic Element 2 Drive Circuit Board 3 Flexible Printed Circuit Board (FPC)
4 Peripheral parts 5 Flexible sheet

Claims (5)

3次元断層画像を得るために揺動又は回転する超音波素子と、
記超音波素子を構成する複数の圧電素子の各電極を駆動回路基板接続し、前記超音波素子の揺動又は回転させる回動部を含む周辺部品の周りに略S字状に屈曲して配置された可撓性基板と、
前記可撓性基板と略同じ幅で前記可撓性基板の面に沿うように配置される可撓性シートとを備え、
前記可撓性シートは、前記略S字状に屈曲した部分のうち前記超音波素子の揺動又は回転により前記可撓性基板に最も荷重がかかる最大荷重点とその近傍とを、他の部分より相対的に弾性力を小さく形成した超音波探触子。
An ultrasonic element that swings or rotates to obtain a three-dimensional tomographic image;
Each electrode of the plurality of piezoelectric elements constituting the front Symbol ultrasonic element connected to the driving circuit board, bent into a substantially S-shape around the peripheral parts including the pivot portion for pivoting or rotation of the ultrasonic element A flexible substrate arranged
A flexible sheet arranged to be substantially the same width as the flexible substrate and along the surface of the flexible substrate ;
The flexible sheet has a maximum load point at which the load is most applied to the flexible substrate by the swinging or rotation of the ultrasonic element in the portion bent in the substantially S shape and the vicinity thereof. An ultrasonic probe with a relatively small elastic force .
前記最大荷重点は、前記圧電素子から引き出された前記可撓性基板の最初と2番目に凸状に曲げられた部分であることを特徴とする請求項1に記載の超音波探触子。2. The ultrasonic probe according to claim 1, wherein the maximum load point is a bent portion of the first and second convex portions of the flexible substrate drawn out from the piezoelectric element. 前記可撓性シートの所定部位の弾性力が相対的に他の部分より小さい部分は、前記可撓性シートの厚みが前記他の部分より薄く形成されていることを特徴とする請求項1又は2に記載の超音波探触子。 The smaller portion than the elastic force is relatively other parts of the predetermined portion of the flexible sheet, according to claim 1, characterized in that the thickness of the flexible sheet is formed thinner than the other portion or 2. The ultrasonic probe according to 2. 前記可撓性シートの所定部位の弾性力が相対的に他の部分より小さい部分は、前記可撓性シートの幅が前記他の部分より小さく形成されていることを特徴とする請求項1から3のいずれか1つに記載の超音波探触子。 Portion elastic force is smaller than the relatively other portions of the predetermined portion of the flexible sheet from claim 1, characterized in that the width of the flexible sheet is formed smaller than the other portion 4. The ultrasonic probe according to any one of 3 . 前記可撓性シートの所定部位の弾性力が相対的に他の部分より小さい部分には、前記可撓性シートのシート面に複数の穴が形成されていることを特徴とする請求項1からのいずれか1つに記載の超音波探触子。 The plurality of holes are formed in the sheet surface of the flexible sheet in a portion where the elastic force of the predetermined portion of the flexible sheet is relatively smaller than other portions. 4. The ultrasonic probe according to any one of 4 above.
JP2005210627A 2005-07-20 2005-07-20 Ultrasonic probe Expired - Fee Related JP4741896B2 (en)

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FR2949841B1 (en) * 2009-09-04 2011-12-09 Valeo Vision Sas OPTICAL MODULE FOR A MOTOR VEHICLE PROJECTOR EQUIPPED WITH AN ELECTRICAL CONNECTING MEMBER WITH REMOTE ORGANS
JP6478807B2 (en) * 2015-05-22 2019-03-06 キヤノン株式会社 Recording device
CN112512429B (en) * 2018-08-31 2024-01-16 深圳迈瑞生物医疗电子股份有限公司 Ultrasonic probe

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JPH0638962A (en) * 1992-05-27 1994-02-15 Aloka Co Ltd Ultrasonic probe for picking up three-dimensional data
JPH0964488A (en) * 1995-08-21 1997-03-07 Canon Inc Flexible printed board
JPH11138945A (en) * 1997-11-14 1999-05-25 Canon Inc Electrically carriage-connecting means and recording device equipped with the means
JP2002009231A (en) * 2000-06-20 2002-01-11 Seiko Epson Corp Semiconductor device
JP2004089532A (en) * 2002-09-02 2004-03-25 Matsushita Electric Ind Co Ltd Ultrasonic probe

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