JP4708748B2 - Method for producing low thermal expansion linear body - Google Patents
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- JP4708748B2 JP4708748B2 JP2004266418A JP2004266418A JP4708748B2 JP 4708748 B2 JP4708748 B2 JP 4708748B2 JP 2004266418 A JP2004266418 A JP 2004266418A JP 2004266418 A JP2004266418 A JP 2004266418A JP 4708748 B2 JP4708748 B2 JP 4708748B2
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Description
本発明は、低熱膨張線状体の製造方法に関するものである。 The present invention relates to a method for producing a low thermal expansion linear body.
従来、本願発明者らは低熱膨張線状体として、正の線膨張特性を持つ導電性材料と負の線膨張特性を持つ有機材料との複合構造化を図り、熱膨張を極力抑えることができる低熱膨張線状体を下記特許文献１として提案している。
しかしながら、上記した従来の低熱膨張線状体では、ザイロン（登録商標）のプリプレグシートなどの有機材料と銅などの金属をエポキシ樹脂などにより接着することで複合化していたが、接着による複合化は、接着強度やエポキシ樹脂の耐熱性などの点で問題がある。
本発明は、上記状況に鑑みて、有機系新材料と銅などの導電性金属を複合化するのに、接着剤を使用せずに、有機系新材料に導電性金属をめっきすることにより複合強度と耐熱性を高めることができる低熱膨張線状体の製造方法を提供することを目的とする。
However, in the conventional low thermal expansion linear body described above, an organic material such as a prepreg sheet of Zylon (registered trademark) and a metal such as copper are bonded by an epoxy resin or the like. There are problems in terms of adhesive strength and heat resistance of the epoxy resin.
In view of the above situation, the present invention combines a new organic material and a conductive metal such as copper by plating the new organic material with a conductive metal without using an adhesive. It aims at providing the manufacturing method of the low thermal expansion linear body which can improve intensity | strength and heat resistance.
本発明は、上記目的を達成するために、
〔１〕低熱膨張線状体の製造方法において、芯材として、低熱膨張特性乃至負の線膨張係数を有する繊維材料を用意し、この繊維材料上に前記低熱膨張特性乃至負の線膨張係数を有する繊維材料よりは大きな線膨張係数で正の線膨張特性を持つ導電性材料をめっきを行い、前記めっきは、無電解めっきを行った後に、電気めっきを行うことを特徴とする。
In order to achieve the above object, the present invention provides
[1] In the method for producing a low thermal expansion linear body, a fiber material having a low thermal expansion characteristic or a negative linear expansion coefficient is prepared as a core material, and the low thermal expansion characteristic or the negative linear expansion coefficient is provided on the fiber material. A conductive material having a positive linear expansion characteristic with a larger linear expansion coefficient than that of the fiber material is plated, and the plating is performed after electroless plating and then electroplating.
〔２〕上記〔１〕記載の低熱膨張線状体の製造方法において、前記繊維材料としてザイロンを用いることを特徴とする。
〔３〕上記〔１〕記載の低熱膨張線状体の製造方法において、前記繊維材料としてダイニーマを用いることを特徴とする。
〔４〕上記〔１〕記載の低熱膨張線状体の製造方法において、前記繊維材料を撚った後に、前記めっきを施すことを特徴とする。
[2] In the method for producing a low thermal expansion linear body according to [1], zylon is used as the fiber material.
[3] The method for producing a low thermal expansion linear body according to [1], wherein a dyneema is used as the fiber material.
[4] The method for producing a low thermal expansion linear body according to [1], wherein the plating is performed after the fiber material is twisted.
本発明によれば、有機系新材料と導電性金属を複合化する際に接着剤を使用せずに、有機系新材料に導電性金属をめっきすることにより複合化し、複合強度と耐熱性を高めることができる。 According to the present invention, when an organic new material and a conductive metal are combined, the composite is formed by plating the conductive organic metal on the organic new material without using an adhesive, thereby improving the composite strength and heat resistance. Can be increased.
低熱膨張線状体の製造方法において、芯材として、低熱膨張特性乃至負の線膨張係数を有する繊維材料を用意し、この繊維材料上に前記低熱膨張特性乃至負の線膨張係数を有する繊維材料よりは大きな線膨張係数で正の線膨張特性を持つ導電性材料をめっきを行い、前記めっきは、無電解めっきを行った後に、電気めっきを行う。よって、複合強度と耐熱性を高めることができる。 In the method for producing a low thermal expansion linear body, a fiber material having a low thermal expansion characteristic or a negative linear expansion coefficient is prepared as a core material, and the fiber material having the low thermal expansion characteristic or the negative linear expansion coefficient on the fiber material A conductive material having a positive linear expansion characteristic with a larger linear expansion coefficient is plated, and the plating is performed after electroless plating. Therefore, the composite strength and heat resistance can be increased.
以下、本発明の実施の形態について詳細に説明する。
図１は本発明の第１実施例を示す低熱膨張線状体の断面図である。
この図において、１は負の線膨張係数を有する芯材としての繊維材料であり、例えばザイロンまたはダイニーマを用いることができる。５はその繊維材料１にめっきされる正の線膨張特性を持つ導電性材料であり、例えば銅である。
Hereinafter, embodiments of the present invention will be described in detail.
FIG. 1 is a cross-sectional view of a low thermal expansion linear body showing a first embodiment of the present invention.
In this figure, 1 is a fiber material as a core material having a negative linear expansion coefficient, and for example, xylon or dyneema can be used. 5 is a conductive material having a positive linear expansion characteristic plated on the
ここに、本発明に用いられるザイロン、ダイニーマと従来の芯材として用いられているスチールの諸特性を表１に示す。 Table 1 shows various characteristics of the xylon and dyneema used in the present invention and steel used as a conventional core material.
（１）図２（ａ）に示すように、負の線膨張係数を有する繊維材料１（例えば、ザイロンまたはダイニーマ）に撚りをかけて芯材として用意する。
(1) As shown in FIG. 2A, a
（２）次に、図２（ｂ）に示すように、その繊維材料１をめっき槽２に浸して、正の線膨張特性を持つ導電性材料５（例えば、銅）をめっきする。めっき槽２では、電着させようとする金属３（ここでは銅の板状体）と繊維材料１を電解液４中に浸す。ついで、この繊維材料１を陰極とし、金属３を陽極として、直流電流を流すと、図２（ｃ）に示すように、繊維材料１上に導電性材料５（ここでは銅）をめっきすることができる。
(2) Next, as shown in FIG. 2 (b), the
ここで、めっきの条件としては、電流密度を０．５〜３．０Ａ／ｄｍ2 とする。
なお、めっきは、無電解めっきを行った後に、電気めっきを行うようにしている。その無電解めっきは、例えば、イオン交換樹脂を原料にした前処理剤をスプレーで繊維材料１上に塗布し、イオン交換により繊維材料１上に金属イオンを付着させてめっきする。
その無電解めっきにおける前処理について説明する。
Here, as a condition for the plating, the current density and 0.5~3.0A / dm 2.
In addition, electroplating is performed after performing electroless plating. In the electroless plating, for example, a pretreatment agent made of an ion exchange resin as a raw material is applied onto the
The pretreatment in the electroless plating will be described.
（１）まず、被めっき材料を、脱脂剤（コンディショナー）により脱脂処理を施す。すなわち、低熱膨張線状体に付着している汚れを除去する工程が脱脂である。無電解めっき前処理としてはアルカリ系脱脂剤が多く使用されており、アルカリによる鹸化作用と界面活性剤の乳化分散作用により、油、指紋などを除去する。また、キレート剤を添加することにより、金属酸化物をキレート化して溶解し、めっき表面の洗浄とともにぬれ性を与える。脱脂液には、後述する触媒付与工程の塩化パラジウム、塩化第１すずのコロイド浴または錯塩の吸着を高めるための添加剤も加えられている。 (1) First, the material to be plated is degreased with a degreasing agent (conditioner). That is, degreasing is a process of removing dirt adhering to the low thermal expansion linear body. Alkaline degreasing agents are often used as a pretreatment for electroless plating, and oil, fingerprints and the like are removed by a saponification action with an alkali and an emulsifying and dispersing action of a surfactant. Further, by adding a chelating agent, the metal oxide is chelated and dissolved, and wettability is given along with cleaning of the plating surface. Additives for enhancing adsorption of palladium chloride, colloidal bath of first tin chloride or complex salt in the catalyst application step described later are also added to the degreasing liquid.
（２）次に、予備浸漬処理を施す。次工程の触媒付与浴は、塩化パラジウム（ＰｄＣｌ2 ）、塩化第１すず（ＳｎＣｌ2 ）のコロイド浴または錯塩でできている。この触媒付与液に被めっき材料（または低熱膨張線状体）の水洗水が混入すると、触媒付与液が分解する原因となるため、あらかじめ被めっき材料（または低熱膨張線状体）を塩素系イオン含有液に浸漬させる必要があり、このための液が予備浸漬液である。これにより触媒付与液の安定性が向上し、めっき品質も安定するようになる。 (2) Next, a preliminary immersion treatment is performed. The catalyst application bath in the next step is made of a colloidal bath or a complex salt of palladium chloride (PdCl 2 ) and first tin chloride (SnCl 2 ). If washing water of the material to be plated (or low thermal expansion linear body) is mixed into this catalyst application liquid, it will cause the catalyst application liquid to decompose. Therefore, the material to be plated (or low thermal expansion linear body) should be chlorinated ions in advance. It is necessary to immerse in the containing liquid, and the liquid for this is a preliminary immersion liquid. As a result, the stability of the catalyst application liquid is improved and the plating quality is also stabilized.
（３）次いで、触媒付与処理を施す。この触媒は、ＰｄＣｌ2 −ＳｎＣｌ2 （コロイドまたは錯塩）が使用されている。この触媒無電解めっき前の被めっき材料表面に吸着し、無電解めっきの核として作用する。
（４）次いで、活性化処理を施す。活性化処理は、触媒付与処理された被めっき材料表面への無電解めっきの析出を促進させるために重要な工程である。この作用は、塩化第１すずおよび塩化パラジウムよりなる、加水分解生成物として吸着されている触媒を活性金属パラジウムに変え、また過剰の塩化第１すずを除くことにある。この処理は、無電解めっきの密着性向上の面からも重要である。
(3) Next, a catalyst application treatment is performed. This catalyst uses PdCl 2 —SnCl 2 (colloid or complex salt). It adsorbs on the surface of the material to be plated before the catalyst electroless plating and acts as a nucleus of electroless plating.
(4) Next, activation processing is performed. The activation process is an important process for promoting the deposition of electroless plating on the surface of the material to be plated that has been subjected to the catalyst application process. This action is to convert the catalyst adsorbed as a hydrolysis product, consisting of stannous chloride and palladium chloride, to active metal palladium and to remove excess stannous chloride. This treatment is also important from the viewpoint of improving the adhesion of electroless plating.
図３は本発明にかかる無電解めっきにおける前処理の作用を示す模式図である。
ここで、より具体的な無電解めっきにおける前処理の作用について図３を参照しながら説明する。繊維材料１を基材とした場合について説明する。
（１）図３（ａ）に示すように、繊維材料１表面は、水和反応により表面水融基を有し負に荷電している。
FIG. 3 is a schematic view showing the effect of pretreatment in electroless plating according to the present invention.
Here, the action of the pretreatment in more specific electroless plating will be described with reference to FIG. A case where the
(1) As shown in FIG. 3A, the surface of the
（２）次に、脱脂処理では、図３（ｂ）に示すように、カチオン界面活性剤の吸着により、繊維材料１表面の負電荷の中和が行われる。
（３）次に、触媒付与処理では、図３（ｃ）に示すように、Ｐｄ−Ｓｎ（合金核）コロイド粒子の吸着が行われる。
（４）次に、水洗処理では、図３（ｄ）に示すように、加水分解によりＳｎ+4はＳｎ（ＯＨ）4 となり、Ｐｄ−Ｓｎ合金核を覆う。
(2) Next, in the degreasing treatment, as shown in FIG. 3B, the negative charge on the surface of the
(3) Next, in the catalyst application process, as shown in FIG. 3C, adsorption of Pd—Sn (alloy core) colloidal particles is performed.
(4) Next, in the water washing treatment, as shown in FIG. 3D, Sn +4 becomes Sn (OH) 4 by hydrolysis and covers the Pd—Sn alloy core.
（５）次いで、活性化処理においては、図３（ｅ）に示すように、Ｓｎ（ＯＨ）4 層を溶解除去し、活性なＰｄ−Ｓｎ核を表面に露出させる。
（６）次に、図３（ｆ）に示すように、無電解めっきの析出初期では、析出する導電性材料（ここでは銅）がＰｄ−Ｓｎ核を中心にアイランド状に析出させる。
なお、上記実施例では、負の熱膨張係数の有機線状体を用いるように説明したが、本発明はそれに限定さるものではなく、低熱膨張係数の線状体であれば、負の熱膨張係数を有するものでなくともよい。かかる低い熱膨張係数の線状体としては、インバーなどの金属やカーボンなどを挙げることができる。ただし、低熱膨張係数の線状体の熱膨張係数が被着される導電性線状体の熱膨張係数より小さいことが条件となる。
(5) Next, in the activation treatment, as shown in FIG. 3E, the Sn (OH) 4 layer is dissolved and removed to expose active Pd—Sn nuclei on the surface.
(6) Next, as shown in FIG. 3 (f), at the initial stage of deposition of electroless plating, the deposited conductive material (here, copper) is deposited in an island shape around the Pd—Sn nucleus.
In the above-described embodiment, the organic linear body having a negative thermal expansion coefficient is used. However, the present invention is not limited to this, and a negative thermal expansion is possible as long as the linear body has a low thermal expansion coefficient. It does not have to have a coefficient. Examples of such a linear body having a low coefficient of thermal expansion include metals such as invar and carbon. However, it is a condition that the thermal expansion coefficient of the linear body having a low thermal expansion coefficient is smaller than the thermal expansion coefficient of the conductive linear body to be deposited.
また、上記実施例では、繊維材料１に撚りをかけた。これは、繊維材料に撚りをかけるとめっき特性を向上させることができるためである。
このように、この実施例では、低熱膨張線状体の製造方法として、低熱膨張特性乃至負の線膨張係数を有する、芯材としての繊維材料を用意し、この繊維材料上に前記低熱膨張特性乃至負の線膨張係数を有する繊維材料よりは大きな線膨張係数で正の線膨張特性を持つ導電性材料をめっきを行い、前記めっきは、無電解めっきを行った後に、電気めっきを行う。
Moreover, in the said Example, the
Thus, in this embodiment, as a method for producing a low thermal expansion linear body, a fiber material as a core material having a low thermal expansion characteristic or a negative linear expansion coefficient is prepared, and the low thermal expansion characteristic is provided on the fiber material. A conductive material having a positive linear expansion characteristic with a linear expansion coefficient larger than that of a fiber material having a negative linear expansion coefficient is plated, and the plating is performed after electroless plating.
このように構成することにより、複合強度と耐熱性の高い低熱膨張線状体を得ることができる。特に、スチールの場合には腐食や酸化を防止することができる。
なお、本発明は上記実施例に限定されるものではなく、本発明の趣旨に基づき種々の変形が可能であり、これらを本発明の範囲から排除するものではない。
By comprising in this way, the low thermal expansion linear body with high composite strength and heat resistance can be obtained. In particular, in the case of steel, corrosion and oxidation can be prevented.
In addition, this invention is not limited to the said Example, Based on the meaning of this invention, a various deformation | transformation is possible and these are not excluded from the scope of the present invention.
本発明の低熱膨張線状体の製造方法は、トロリ線、ちょう吊線、電線、ケーブルやレールなどに用いる線状体の製造方法として利用可能である。 The manufacturing method of the low thermal expansion linear body of this invention can be utilized as a manufacturing method of the linear body used for a trolley wire, a hanging line, an electric wire, a cable, a rail, etc.
１ 繊維材料（ザイロン、ダイニーマ）
２ めっき槽
３ 電着させようとする金属
４ 電解液
５ 導電性材料
1 Textile materials (Zylon, Dyneema)
2
Claims (4)
（ｂ）該繊維材料上に前記低熱膨張特性乃至負の線膨張係数を有する繊維材料よりは大きな線膨張係数で正の線膨張特性を持つ導電性材料をめっきを行い、
（ｃ）前記めっきは、無電解めっきを行った後に、電気めっきを行うことを特徴とする低熱膨張線状体の製造方法。 (A) As a core material, a fiber material having a low thermal expansion characteristic or a negative linear expansion coefficient is prepared,
(B) plating a conductive material having a positive linear expansion characteristic with a larger linear expansion coefficient than the low thermal expansion characteristic or the fiber material having a negative linear expansion coefficient on the fiber material;
(C) The method for producing a low thermal expansion linear body, wherein the plating is performed after electroless plating.
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| JP2009081028A (en) * | 2007-09-26 | 2009-04-16 | Railway Technical Res Inst | Manufacturing method for low thermal expansion linear body |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62116314U (en) * | 1986-01-10 | 1987-07-24 | ||
| JPH10321050A (en) * | 1997-05-16 | 1998-12-04 | Furukawa Electric Co Ltd:The | Composite strand and lightweight, low dip overhead wire using the same |
| JP2003183980A (en) * | 2001-12-14 | 2003-07-03 | Mitsubishi Materials Corp | Metal coated fiber body and method for producing the same |
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| JPS62116314A (en) * | 1985-11-15 | 1987-05-27 | Toyota Motor Corp | Hinge shaft confining method for fuel lid |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS62116314U (en) * | 1986-01-10 | 1987-07-24 | ||
| JPH10321050A (en) * | 1997-05-16 | 1998-12-04 | Furukawa Electric Co Ltd:The | Composite strand and lightweight, low dip overhead wire using the same |
| JP2003183980A (en) * | 2001-12-14 | 2003-07-03 | Mitsubishi Materials Corp | Metal coated fiber body and method for producing the same |
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