JP4695513B2 - Process for producing release film - Google Patents
Process for producing release film Download PDFInfo
- Publication number
- JP4695513B2 JP4695513B2 JP2006008878A JP2006008878A JP4695513B2 JP 4695513 B2 JP4695513 B2 JP 4695513B2 JP 2006008878 A JP2006008878 A JP 2006008878A JP 2006008878 A JP2006008878 A JP 2006008878A JP 4695513 B2 JP4695513 B2 JP 4695513B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- release
- coating
- release agent
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 30
- 239000003795 chemical substances by application Substances 0.000 claims description 81
- 238000000576 coating method Methods 0.000 claims description 66
- -1 polydimethylsiloxane Polymers 0.000 claims description 61
- 239000011248 coating agent Substances 0.000 claims description 59
- 150000001875 compounds Chemical class 0.000 claims description 47
- 239000007788 liquid Substances 0.000 claims description 26
- 229920001940 conductive polymer Polymers 0.000 claims description 25
- 239000000178 monomer Substances 0.000 claims description 24
- 229920001296 polysiloxane Polymers 0.000 claims description 22
- 229920000180 alkyd Polymers 0.000 claims description 20
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical class C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 19
- 239000002134 carbon nanofiber Substances 0.000 claims description 18
- 239000003431 cross linking reagent Substances 0.000 claims description 18
- 239000003054 catalyst Substances 0.000 claims description 15
- 239000004925 Acrylic resin Substances 0.000 claims description 14
- 229920000178 Acrylic resin Polymers 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 229920002050 silicone resin Polymers 0.000 claims description 13
- 125000000217 alkyl group Chemical group 0.000 claims description 12
- 125000000524 functional group Chemical group 0.000 claims description 10
- 229920001187 thermosetting polymer Polymers 0.000 claims description 10
- 239000007787 solid Substances 0.000 claims description 9
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 6
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 6
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 6
- 229920001197 polyacetylene Polymers 0.000 claims description 6
- 229920000123 polythiophene Polymers 0.000 claims description 6
- 229920000553 poly(phenylenevinylene) Polymers 0.000 claims description 5
- 229920000767 polyaniline Polymers 0.000 claims description 5
- 229920000128 polypyrrole Polymers 0.000 claims description 5
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 4
- 125000006038 hexenyl group Chemical group 0.000 claims description 3
- JTQAPFZZCXWQNQ-UHFFFAOYSA-N thiirene Chemical compound S1C=C1 JTQAPFZZCXWQNQ-UHFFFAOYSA-N 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 48
- 229920005989 resin Polymers 0.000 description 24
- 239000011347 resin Substances 0.000 description 24
- 239000011342 resin composition Substances 0.000 description 21
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 19
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 239000000243 solution Substances 0.000 description 14
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- 239000000203 mixture Substances 0.000 description 12
- 238000007259 addition reaction Methods 0.000 description 11
- 239000002041 carbon nanotube Substances 0.000 description 11
- 229910021393 carbon nanotube Inorganic materials 0.000 description 11
- 239000000839 emulsion Substances 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 8
- 238000001035 drying Methods 0.000 description 7
- 229920005672 polyolefin resin Polymers 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 230000002378 acidificating effect Effects 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 239000003999 initiator Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 150000007519 polyprotic acids Polymers 0.000 description 6
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 229910002804 graphite Inorganic materials 0.000 description 5
- 239000010439 graphite Substances 0.000 description 5
- 239000002048 multi walled nanotube Substances 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 238000010345 tape casting Methods 0.000 description 5
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 238000007611 bar coating method Methods 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229920001467 poly(styrenesulfonates) Polymers 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920005862 polyol Polymers 0.000 description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 description 4
- 239000004800 polyvinyl chloride Substances 0.000 description 4
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- 150000005846 sugar alcohols Polymers 0.000 description 4
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 4
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 3
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 238000010538 cationic polymerization reaction Methods 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- 230000001804 emulsifying effect Effects 0.000 description 3
- 238000007756 gravure coating Methods 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000010526 radical polymerization reaction Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 229920000265 Polyparaphenylene Polymers 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000004359 castor oil Substances 0.000 description 2
- 235000019438 castor oil Nutrition 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000004210 ether based solvent Substances 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 150000008040 ionic compounds Chemical class 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 235000019198 oils Nutrition 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 150000003058 platinum compounds Chemical class 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 239000011970 polystyrene sulfonate Substances 0.000 description 2
- 229960002796 polystyrene sulfonate Drugs 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- 239000002683 reaction inhibitor Substances 0.000 description 2
- 238000007763 reverse roll coating Methods 0.000 description 2
- WBHHMMIMDMUBKC-XLNAKTSKSA-N ricinelaidic acid Chemical compound CCCCCC[C@@H](O)C\C=C\CCCCCCCC(O)=O WBHHMMIMDMUBKC-XLNAKTSKSA-N 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 238000007127 saponification reaction Methods 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000002109 single walled nanotube Substances 0.000 description 2
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- RLUFBDIRFJGKLY-UHFFFAOYSA-N (2,3-dichlorophenyl)-phenylmethanone Chemical compound ClC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1Cl RLUFBDIRFJGKLY-UHFFFAOYSA-N 0.000 description 1
- CUXYLFPMQMFGPL-UHFFFAOYSA-N (9Z,11E,13E)-9,11,13-Octadecatrienoic acid Natural products CCCCC=CC=CC=CCCCCCCCC(O)=O CUXYLFPMQMFGPL-UHFFFAOYSA-N 0.000 description 1
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- TVYHOTUPISDNFZ-UHFFFAOYSA-N 1,5-dihydroxy-2,4-dimethylpentan-3-one Chemical compound OCC(C)C(=O)C(C)CO TVYHOTUPISDNFZ-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- GKZPEYIPJQHPNC-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO GKZPEYIPJQHPNC-UHFFFAOYSA-N 0.000 description 1
- GIMQKKFOOYOQGB-UHFFFAOYSA-N 2,2-diethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)(OCC)C(=O)C1=CC=CC=C1 GIMQKKFOOYOQGB-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- CZZVAVMGKRNEAT-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol;3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)CO.OCC(C)(C)C(O)=O CZZVAVMGKRNEAT-UHFFFAOYSA-N 0.000 description 1
- YRTNMMLRBJMGJJ-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol;hexanedioic acid Chemical compound OCC(C)(C)CO.OC(=O)CCCCC(O)=O YRTNMMLRBJMGJJ-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- UMLWXYJZDNNBTD-UHFFFAOYSA-N 2-(dimethylamino)-1-phenylethanone Chemical compound CN(C)CC(=O)C1=CC=CC=C1 UMLWXYJZDNNBTD-UHFFFAOYSA-N 0.000 description 1
- XOGPDSATLSAZEK-UHFFFAOYSA-N 2-Aminoanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(N)=CC=C3C(=O)C2=C1 XOGPDSATLSAZEK-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- YJQMXVDKXSQCDI-UHFFFAOYSA-N 2-ethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3SC2=C1 YJQMXVDKXSQCDI-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- NJRHMGPRPPEGQL-UHFFFAOYSA-N 2-hydroxybutyl prop-2-enoate Chemical compound CCC(O)COC(=O)C=C NJRHMGPRPPEGQL-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 description 1
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- HFYAEUXHCMTPOL-UHFFFAOYSA-N 3-Methyl-1-penten-3-ol Chemical compound CCC(C)(O)C=C HFYAEUXHCMTPOL-UHFFFAOYSA-N 0.000 description 1
- DVIVBQJVHLJFFS-UHFFFAOYSA-N 3-cyclopenta-1,3-dien-1-ylfuran-2,5-dione Chemical compound O=C1OC(=O)C(C=2CC=CC=2)=C1 DVIVBQJVHLJFFS-UHFFFAOYSA-N 0.000 description 1
- QOXOZONBQWIKDA-UHFFFAOYSA-N 3-hydroxypropyl Chemical group [CH2]CCO QOXOZONBQWIKDA-UHFFFAOYSA-N 0.000 description 1
- FEKWWZCCJDUWLY-UHFFFAOYSA-N 3-methyl-1h-pyrrole Chemical compound CC=1C=CNC=1 FEKWWZCCJDUWLY-UHFFFAOYSA-N 0.000 description 1
- WHNPOQXWAMXPTA-UHFFFAOYSA-N 3-methylbut-2-enamide Chemical compound CC(C)=CC(N)=O WHNPOQXWAMXPTA-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- WFHVTZRAIPYMMO-UHFFFAOYSA-N 3-octyl-1h-pyrrole Chemical compound CCCCCCCCC=1C=CNC=1 WFHVTZRAIPYMMO-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 241000219495 Betulaceae Species 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- HIBWGGKDGCBPTA-UHFFFAOYSA-N C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 Chemical compound C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 HIBWGGKDGCBPTA-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- 229930195725 Mannitol Natural products 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 235000019485 Safflower oil Nutrition 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000003926 acrylamides Chemical class 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- CUXYLFPMQMFGPL-SUTYWZMXSA-N all-trans-octadeca-9,11,13-trienoic acid Chemical compound CCCC\C=C\C=C\C=C\CCCCCCCC(O)=O CUXYLFPMQMFGPL-SUTYWZMXSA-N 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 1
- 235000020661 alpha-linolenic acid Nutrition 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 238000001241 arc-discharge method Methods 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 150000001541 aziridines Chemical class 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- QDVNNDYBCWZVTI-UHFFFAOYSA-N bis[4-(ethylamino)phenyl]methanone Chemical compound C1=CC(NCC)=CC=C1C(=O)C1=CC=C(NCC)C=C1 QDVNNDYBCWZVTI-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- KLIYQWXIWMRMGR-UHFFFAOYSA-N buta-1,3-diene;methyl 2-methylprop-2-enoate Chemical compound C=CC=C.COC(=O)C(C)=C KLIYQWXIWMRMGR-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003240 coconut oil Substances 0.000 description 1
- 235000019864 coconut oil Nutrition 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000007739 conversion coating Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 229940105990 diglycerin Drugs 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- 125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 208000028659 discharge Diseases 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 125000005678 ethenylene group Chemical group [H]C([*:1])=C([H])[*:2] 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 235000019197 fats Nutrition 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 239000012510 hollow fiber Substances 0.000 description 1
- 238000004050 hot filament vapor deposition Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 229960004488 linolenic acid Drugs 0.000 description 1
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000594 mannitol Substances 0.000 description 1
- 235000010355 mannitol Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- YPHQUSNPXDGUHL-UHFFFAOYSA-N n-methylprop-2-enamide Chemical compound CNC(=O)C=C YPHQUSNPXDGUHL-UHFFFAOYSA-N 0.000 description 1
- 239000002121 nanofiber Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 1
- LEVJVKGPFAQPOI-UHFFFAOYSA-N phenylmethanone Chemical compound O=[C]C1=CC=CC=C1 LEVJVKGPFAQPOI-UHFFFAOYSA-N 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920003209 poly(hydridosilsesquioxane) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000015 polydiacetylene Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920001384 propylene homopolymer Polymers 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229960003656 ricinoleic acid Drugs 0.000 description 1
- FEUQNCSVHBHROZ-UHFFFAOYSA-N ricinoleic acid Natural products CCCCCCC(O[Si](C)(C)C)CC=CCCCCCCCC(=O)OC FEUQNCSVHBHROZ-UHFFFAOYSA-N 0.000 description 1
- 235000005713 safflower oil Nutrition 0.000 description 1
- 239000003813 safflower oil Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
- C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
- C08G2261/32—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain
- C08G2261/322—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain non-condensed
- C08G2261/3223—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain non-condensed containing one or more sulfur atoms as the only heteroatom, e.g. thiophene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/50—Physical properties
- C08G2261/51—Charge transport
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/70—Post-treatment
- C08G2261/79—Post-treatment doping
- C08G2261/794—Post-treatment doping with polymeric dopants
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
- C09J2483/005—Presence of polysiloxane in the release coating
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Laminated Bodies (AREA)
Description
本発明は、剥離フィルム及びその製造方法に関する。さらに詳しくは、本発明は、基材フィルムの一方の面に剥離剤層を有し、かつその背面に帯電防止層を有する優れた帯電防止機能と剥離機能を兼ね備えた剥離フィルム、及びその製造方法に関するものである。 The present invention relates to a release film and a manufacturing method thereof. More specifically, the present invention relates to a release film having a release agent layer on one side of a base film and an antistatic layer on the back side thereof, which has both an excellent antistatic function and a release function, and a method for producing the release film. It is about.
剥離フィルムは、ポリウレタン樹脂、ポリアクリル樹脂、ポリ塩化ビニル樹脂などのキャスト製膜用工程フィルム、積層セラミックコンデンサのグリーンシート成形用工程フィルム、あるいは粘着製品における粘着剤の保護フィルムなどとして用いられている。
この剥離フィルムは、一般に基材フィルムの表面に、シリコーン系樹脂や、非シリコーン系樹脂である長鎖アルキル基含有化合物やオレフィン系樹脂などの剥離剤からなる層が形成されているものである。このような剥離フィルムを、前記用途に用いた後で、剥離フィルムを剥がす際に帯電が生じ、製品に異物が付着するといった好ましくない事態を招来する。
このような好ましくない事態に対処するために、剥離フィルムに帯電防止処理を施すことが行われている。
剥離フィルムの帯電防止処理には、これまで、一般に四級アンモニウム塩などのイオン性化合物が多用されてきた。しかしながら、このイオン性化合物を帯電防止層に用いた場合、その帯電防止性能は大気中の水分に大きく影響を受ける。
また、金属や金属酸化物などの導電性金属系フィラーをバインダー樹脂に分散した系も提案されているが、この場合、粒子径が大きく、フィルムの平滑性が損なわれるおそれが生じる。
一方、近年、ポリチオフェンなどの導電性高分子化合物をバインダー樹脂中に分散させた帯電防止層が提案されている(例えば、特許文献1参照)。
しかしながら、導電性高分子化合物をバインダー樹脂中に均一に分散させることは困難であることから、帯電防止性が不安定となり、安定した帯電防止性能を発現させるには、多くの添加量を必要とし、コストが高くつくのを免れない。また、高塗布量化により帯電防止性能を安定化させる場合には、帯電防止層の厚みの増加により、ブロッキングが発生するおそれがあった。
In this release film, a layer made of a release agent such as a silicone resin, a long-chain alkyl group-containing compound that is a non-silicone resin, or an olefin resin is generally formed on the surface of a base film. After such a release film is used for the above application, charging occurs when the release film is peeled off, which leads to an undesirable situation in which foreign matter adheres to the product.
In order to cope with such an unfavorable situation, an antistatic treatment is performed on the release film.
Conventionally, ionic compounds such as quaternary ammonium salts have been frequently used for antistatic treatment of release films. However, when this ionic compound is used in the antistatic layer, its antistatic performance is greatly affected by moisture in the atmosphere.
Moreover, although the system which disperse | distributed electroconductive metal type fillers, such as a metal and a metal oxide, to binder resin is also proposed, a particle diameter is large in this case, and there exists a possibility that the smoothness of a film may be impaired.
On the other hand, recently, an antistatic layer in which a conductive polymer compound such as polythiophene is dispersed in a binder resin has been proposed (see, for example, Patent Document 1).
However, since it is difficult to uniformly disperse the conductive polymer compound in the binder resin, the antistatic property becomes unstable, and a large amount of addition is required to develop a stable antistatic performance. The cost is inevitable. Further, when the antistatic performance is stabilized by increasing the coating amount, blocking may occur due to an increase in the thickness of the antistatic layer.
本発明は、このような事情のもとで、優れた帯電防止機能と剥離機能を兼ね備えた剥離フィルムであって、フィルムの平滑性が損なわれることがない上、帯電防止層の厚さが比較的薄く、しかも安定した帯電防止性能を有する剥離フィルムを提供することを目的としてなされたものである。 Under such circumstances, the present invention is a release film having an excellent antistatic function and a release function, and the smoothness of the film is not impaired, and the thickness of the antistatic layer is compared. The purpose of the present invention is to provide a release film that is thin and has stable antistatic performance.
本発明者らは、前記の好ましい性質を有する剥離フィルムを開発すべく鋭意研究を重ねた結果、基材フィルムの一方の面に剥離剤層を有すると共に、他方の面に、カーボンナノファイバー又はカーボンナノファイバーと導電性高分子化合物とを含む活性エネルギー線硬化型樹脂組成物の硬化物からなる帯電防止層を有する剥離フィルムが、その目的に適合し得ることを見出し、この知見に基づいて本発明を完成するに至った。
すなわち、本発明は、
(1)平均長さ0.8〜15μmで平均外径1〜100nmのカーボンナノファイバー、導電性高分子化合物及び分子内に2個以上の重合性不飽和基を有する紫外線重合性モノマー若しくはオリゴマーと光開始剤を含有する塗工液Iを調製し、別に、熱硬化型シリコーン樹脂に架橋剤と触媒を加えたシリコーン系剥離剤を含有する塗工液IIを調製し、基材フィルムの一方の面に、塗工液Iを塗布、乾燥して、次いで該塗膜に紫外線を照射して硬化させ、硬化物中のカーボンナノファイバーの含有量が、0.1〜30質量%であり、硬化物中の導電性高分子化合物の含有量が、0.01〜10質量%である厚さが0.01〜3μmの帯電防止層を形成すると共に、他方の面に、塗工液IIを、固形分換算塗工量として、0.01〜3g/m 2 で塗布後、加熱温度50〜120℃において加熱処理した後、紫外線を照射して、厚さが0.01〜3μmの剥離剤層を形成することを特徴とする剥離フィルムの製造方法、
(2)熱硬化型シリコーン樹脂が、ビニル基若しくはヘキセニル基を官能基とするポリジメチルシロキサンである上記(1)項記載の剥離フィルムの製造方法、
(3)平均長さ0.8〜15μmで平均外径1〜100nmのカーボンナノファイバー、導電性高分子化合物及び分子内に2個以上の重合性不飽和基を有する紫外線重合性モノマー若しくはオリゴマーと光開始剤を含有する塗工液Iを調製し、別に、アルキド樹脂系剥離剤、長鎖アルキル基含有化合物系剥離剤、アクリル樹脂系剥離剤から選択される1種以上の剥離剤及び架橋剤を質量比70:30〜10:90で含有する塗工液IIを調製し、基材フィルムの一方の面に、塗工液Iを塗布、乾燥して、次いで該塗膜に紫外線を照射して硬化させ、硬化物中のカーボンナノファイバーの含有量が、0.1〜30質量%であり、硬化物中の導電性高分子化合物の含有量が、0.01〜10質量%である厚さが0.01〜3μmの帯電防止層を形成すると共に、他方の面に、塗工液IIを塗布後、加熱処理して、厚さが0.01〜3μmの剥離剤層を形成することを特徴とする剥離フィルムの製造方法、
(4)導電性高分子化合物が、ポリアセチレン系、ポリチオフェン系、ポリアニリン系、ポリピロール系、ポリ(フェニレンビニレン)系、ポリ(ビニレンスルフィド)系、ポリ(p−フェニレンスルフィド)系及びポリ(チエニレンビニレン)系化合物の中から選ばれる少なくとも1種である上記(1)〜(3)項のいずれか1項に記載の剥離フィルムの製造方法、及び
(5)帯電防止層の表面抵抗率が、10 10 Ω/□以下である上記(1)〜(4)項のいずれか1項に記載の剥離フィルムの製造方法、
を提供するものである。
As a result of intensive studies to develop a release film having the above-mentioned preferable properties, the present inventors have a release agent layer on one side of the base film and carbon nanofibers or carbon on the other side. It has been found that a release film having an antistatic layer made of a cured product of an active energy ray-curable resin composition containing nanofibers and a conductive polymer compound can meet the purpose, and the present invention is based on this finding. It came to complete.
That is, the present invention
(1) a carbon nanofiber having an average length of 0.8 to 15 μm and an average outer diameter of 1 to 100 nm, a conductive polymer compound, and an ultraviolet polymerizable monomer or oligomer having two or more polymerizable unsaturated groups in the molecule; A coating liquid I containing a photoinitiator was prepared, and separately, a coating liquid II containing a silicone release agent obtained by adding a crosslinking agent and a catalyst to a thermosetting silicone resin was prepared, The coating liquid I is applied to the surface, dried, and then the coating film is irradiated with ultraviolet rays to be cured, and the content of carbon nanofibers in the cured product is 0.1 to 30% by mass and cured. While forming an antistatic layer having a thickness of 0.01 to 3 μm in which the content of the conductive polymer compound in the product is 0.01 to 10% by mass, the coating liquid II is formed on the other surface, as in terms of solid content coating amount, after coating with 0.01 to 3 g / m 2, heating After heat treatment at degrees 50 to 120 ° C., a method of manufacturing a release film ultraviolet was irradiated with a thickness of, and forming a release agent layer of 0.01 to 3 [mu] m,
(2) The method for producing a release film according to the above (1), wherein the thermosetting silicone resin is polydimethylsiloxane having a vinyl group or a hexenyl group as a functional group,
(3) a carbon nanofiber having an average length of 0.8 to 15 μm and an average outer diameter of 1 to 100 nm, a conductive polymer compound, and an ultraviolet polymerizable monomer or oligomer having two or more polymerizable unsaturated groups in the molecule; A coating liquid I containing a photoinitiator is prepared, and separately, one or more release agents and crosslinking agents selected from alkyd resin release agents, long-chain alkyl group-containing compound release agents, and acrylic resin release agents Is prepared at a mass ratio of 70:30 to 10:90, the coating liquid I is applied to one surface of the base film, dried, and then the coating film is irradiated with ultraviolet rays. The thickness of the carbon nanofiber in the cured product is 0.1 to 30% by mass, and the content of the conductive polymer compound in the cured product is 0.01 to 10% by mass. When an antistatic layer having a thickness of 0.01 to 3 μm is formed, In addition, after the coating liquid II is applied to the other surface, heat treatment is performed to form a release agent layer having a thickness of 0.01 to 3 μm,
( 4 ) Conductive polymer compounds are polyacetylene, polythiophene, polyaniline, polypyrrole, poly (phenylene vinylene), poly (vinylene sulfide), poly (p-phenylene sulfide) and poly (thienylene vinylene). 10) The method for producing a release film according to any one of the above items (1) to (3) , which is at least one selected from the group of compounds, and ( 5 ) the surface resistivity of the antistatic layer is 10 method for producing a release film according to any one of 10 Omega / □ or less is the above (1) to (4) of this section,
Is to provide.
本発明によれば、基材フィルムの一方の面に剥離剤層を有し、かつその背面に帯電防止層を有する優れた帯電防止機能と剥離機能を兼ね備えた剥離フィルムであって、フィルムの平滑性が損なわれることがない上、帯電防止層の厚さが比較的薄く、しかも安定した帯電防止性能を有する剥離フィルムを提供することができる。 According to the present invention, there is provided a release film having a release agent layer on one side of a base film and an antistatic layer on the back side thereof, which has an excellent antistatic function and a release function. In addition, it is possible to provide a release film that does not impair the property, has a relatively thin antistatic layer, and has stable antistatic performance.
本発明の剥離フィルムは、基材フィルムの一方の側の面に剥離剤層を有し、かつその反対側の面に帯電防止層を有する剥離フィルムである。
本発明の剥離フィルムに用いられる基材フィルムに特に制限はなく、従来剥離フィルムの基材フィルムとして使用されているものの中から、該剥離フィルムの用途に応じて適宜選択される。このような基材フィルムとしては、例えば、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレートなどのポリエステルフィルム、ポリエチレンフィルム、ポリプロピレンフィルム、ポリ塩化ビニルフィルム、ポリ塩化ビニリデンフィルム、ポリビニルアルコールフィルム、エチレン−酢酸ビニル共重合体フィルム、ポリスチレンフィルム、ポリカーボネートフィルム、ポリメチルペンテンフィルム、ポリスルホンフィルム、ポリエーテルエーテルケトンフィルム、ポリエーテルスルホンフィルム、ポリフェニレンスルフィドフィルム、ポリエーテルイミドフィルム、ポリイミドフィルム、フッ素樹脂フィルム、ポリアミドフィルム、アクリル樹脂フィルム、ノルボルネン系樹脂フィルム、シクロオレフィン樹脂フィルム等を挙げることができる。
この基材フィルムの厚さに特に制限はなく、剥離フィルムの用途に応じて適宜選定されるが、通常10〜150μm、好ましくは20〜120μmである。
また、この基材フィルムは、その表面に設けられる剥離剤層及び帯電防止層との密着性を向上させる目的で、所望により片面又は両面に、酸化法や凹凸化法などにより表面処理、あるいはプライマー処理を施すことができる。上記酸化法としては、例えばコロナ放電処理、プラズマ放電処理、クロム酸処理(湿式)、火炎処理、熱風処理、オゾン・紫外線照射処理などが挙げられ、また、凹凸化法としては、例えばサンドブラスト法、溶剤処理法などが挙げられる。これらの表面処理法は基材フィルムの種類に応じて適宜選ばれるが、一般にはコロナ放電処理法が効果及び操作性などの面から、好ましく用いられる。
The release film of the present invention is a release film having a release agent layer on one side of the base film and an antistatic layer on the opposite side.
There is no restriction | limiting in particular in the base film used for the peeling film of this invention, It selects suitably from what was conventionally used as a base film of a peeling film according to the use of this peeling film. Examples of such a base film include polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, polyethylene films, polypropylene films, polyvinyl chloride films, polyvinylidene chloride films, polyvinyl alcohol films, and ethylene-vinyl acetate. Copolymer film, polystyrene film, polycarbonate film, polymethylpentene film, polysulfone film, polyetheretherketone film, polyethersulfone film, polyphenylene sulfide film, polyetherimide film, polyimide film, fluororesin film, polyamide film, acrylic Resin film, norbornene resin film, cycloolefin It can be mentioned fat film.
There is no restriction | limiting in particular in the thickness of this base film, Although it selects suitably according to the use of a peeling film, it is 10-150 micrometers normally, Preferably it is 20-120 micrometers.
In addition, this base film is surface-treated by an oxidation method, a concavo-convex method, or the like on one or both sides as desired for the purpose of improving the adhesion between the release agent layer and the antistatic layer provided on the surface. Processing can be performed. Examples of the oxidation method include corona discharge treatment, plasma discharge treatment, chromic acid treatment (wet), flame treatment, hot air treatment, ozone / ultraviolet irradiation treatment, and the like. Examples include solvent processing methods. These surface treatment methods are appropriately selected according to the type of the base film, but generally, the corona discharge treatment method is preferably used from the viewpoints of effects and operability.
本発明において、この基材フィルムの一方の面に剥離剤層が設けられるが、この剥離剤を構成する剥離剤としては、シリコーン系剥離剤、あるいは非シリコーン系剥離剤が用いられる。これらの剥離剤は、剥離フィルムの用途に応じて適宜選択される。
前記シリコーン系剥離剤としては、付加反応型シリコーン系剥離剤が好ましく、この付加反応型シリコーン系剥離剤は、付加反応型シリコーン樹脂からなる主剤に、架橋剤と触媒とを加えたものであり、更に所望により、付加反応抑制剤、剥離調整剤、密着向上剤などを加えてもよい。また、剥離剤の塗工後の硬化プロセスで熱の他に紫外線照射を行う場合は光開始剤を添加してもよい。
シリコーン系剥離剤の種類としては、付加反応型ならば、その形態は溶剤型でもエマルション型でも無溶剤型いずれでもよいが、溶剤型が品質、取扱い易さの点で最も適している。
付加反応型シリコーン樹脂としては、特に制限はなく、従来の熱硬化付加反応型シリコーン樹脂剥離剤として慣用されているものを用いることができ、例えば分子中に、官能基としてアルケニル基を有するポリオルガノシロキサンの中から選ばれる少なくとも1種を挙げることができる。上記の分子中に官能基としてアルケニル基を有するポリオルガノシロキサンの好ましいものとしては、ビニル基を官能基とするポリジメチルシロキサン、ヘキセニル基を官能基とするポリジメチルシロキサン及びこれらの混合物などが挙げられる。
架橋剤としては、例えば一分子中に少なくとも2個のケイ素原子結合水素原子を有するポリオルガノシロキサン、具体的には、ジメチルハイドロジェンシロキシ基末端封鎖ジメチルシロキサン−メチルハイドロジェンシロキサン共重合体、トリメチルシロキシ基末端封鎖ジメチルシロキサン−メチルハイドロジェンシロキサン共重合体、トリメチルシロキシ基末端封鎖ポリ(メチルハイドロジェンシロキサン)、ポリ(ハイドロジェンシルセスキオキサン)などが挙げられる。架橋剤の使用量は、付加反応型シリコーン樹脂100質量部に対し、通常0.1〜100質量部、好ましくは0.3〜50質量部の範囲で選定される。
触媒としては、通常白金系化合物が用いられる。この白金系化合物の例としては、微粒子状白金、炭素粉末担体上に吸着された微粒子状白金、塩化白金酸、アルコール変性塩化白金酸、塩化白金酸のオレフィン錯体、パラジウム、ロジウム触媒などが挙げられる。触媒の使用量は、付加反応型シリコーン樹脂及び架橋剤の合計量に対し、白金系金属として1〜1000ppm程度である。
In the present invention, a release agent layer is provided on one surface of the base film. As the release agent constituting the release agent, a silicone release agent or a non-silicone release agent is used. These release agents are appropriately selected according to the use of the release film.
As the silicone release agent, an addition reaction type silicone release agent is preferable, and this addition reaction type silicone release agent is obtained by adding a crosslinking agent and a catalyst to a main agent composed of an addition reaction type silicone resin. Further, if desired, an addition reaction inhibitor, a release adjusting agent, an adhesion improving agent and the like may be added. Moreover, when performing ultraviolet irradiation other than a heat | fever in the hardening process after application | coating of a release agent, you may add a photoinitiator.
As the type of silicone release agent, as long as it is an addition reaction type, its form may be any of a solvent type, an emulsion type and a solventless type, but the solvent type is most suitable in terms of quality and ease of handling.
The addition reaction type silicone resin is not particularly limited, and those conventionally used as conventional thermosetting addition reaction type silicone resin release agents can be used. For example, polyorgano having alkenyl group as a functional group in the molecule. The at least 1 sort (s) chosen from siloxane can be mentioned. Preferred examples of the polyorganosiloxane having an alkenyl group as a functional group in the molecule include polydimethylsiloxane having a vinyl group as a functional group, polydimethylsiloxane having a hexenyl group as a functional group, and a mixture thereof. .
Examples of the crosslinking agent include polyorganosiloxane having at least two silicon-bonded hydrogen atoms in one molecule, specifically, a dimethylhydrogensiloxy group end-capped dimethylsiloxane-methylhydrogensiloxane copolymer, trimethylsiloxy. Examples thereof include a group-end-capped dimethylsiloxane-methylhydrogensiloxane copolymer, trimethylsiloxy group-end-capped poly (methylhydrogensiloxane), and poly (hydrogensilsesquioxane). The usage-amount of a crosslinking agent is normally selected in the range of 0.1-100 mass parts with respect to 100 mass parts of addition reaction type silicone resins, Preferably it is 0.3-50 mass parts.
As the catalyst, a platinum compound is usually used. Examples of the platinum compound include fine platinum, fine platinum adsorbed on a carbon powder carrier, chloroplatinic acid, alcohol-modified chloroplatinic acid, olefin complexes of chloroplatinic acid, palladium, rhodium catalyst, and the like. . The usage-amount of a catalyst is about 1-1000 ppm as a platinum-type metal with respect to the total amount of an addition reaction type silicone resin and a crosslinking agent.
剥離調整剤としては、例えば分子中にケイ素原子に結合したアルケニル基及び水素原子を有しないポリオルガノシロキサン、具体的には、トリメチルシロキシ基末端封鎖ポリジメチルシロキサン、ジメチルフェニルシロキシ基末端封鎖ポリジメチルシロキサンなどのシリコーン樹脂が挙げられる。
付加反応抑制剤は、該組成物に室温における保存安定性を付与するために用いられる成分であり、具体例としては、3,5−ジメチル−1−ヘキシン−3−オール、3−メチル−1−ペンテン−3−オール、3−メチル−3−ペンテン−1−イン、3,5−ジメチル−3−ヘキセン−1−イン、テトラビニルシロキサン環状体、ベンゾトリアゾールなどが挙げられる。
密着向上剤としては、ビニルトリアセトキシシラン、ビニルトリエトキシシラン、3−グリシドキシプロピルトリメトキシシラン、3−グリシドキシプロピルトリエトキシシラン、3−メタクリロキシプロピルトリメトキシシランなどが挙げられる。
光開始剤としては特に制限はなく、従来紫外線硬化型樹脂に慣用されているものの中から、任意のものを適宜選択して用いることができる。この光開始剤としては、例えばベンゾイン類、ベンゾフェノン類、アセトフェノン類、α−ヒドロキシケトン類、α−アミノケトン類、α−ジケトン類、α−ジケトンジアルキルアセタール類、アントラキノン類、チオキサントン類、その他化合物などが挙げられる。
これらの光開始剤は、単独で用いてもよく、2種以上を組み合わせて用いてもよい。また、その使用量は、前記付加反応型シリコーン樹脂及び架橋剤の合計量100質量部に対し、通常0.01〜30質量部、好ましくは0.05〜20質量部の範囲で選定される。
Examples of the release adjusting agent include polyorganosiloxane having no alkenyl group and hydrogen atom bonded to a silicon atom in the molecule, specifically, trimethylsiloxy group end-capped polydimethylsiloxane, dimethylphenylsiloxy group end-capped polydimethylsiloxane. And silicone resins.
The addition reaction inhibitor is a component used to impart storage stability to the composition at room temperature, and specific examples thereof include 3,5-dimethyl-1-hexyn-3-ol, 3-methyl-1 -Penten-3-ol, 3-methyl-3-penten-1-in, 3,5-dimethyl-3-hexen-1-in, tetravinylsiloxane cyclic, benzotriazole and the like.
Examples of the adhesion improver include vinyltriacetoxysilane, vinyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, and 3-methacryloxypropyltrimethoxysilane.
There is no restriction | limiting in particular as a photoinitiator, Arbitrary things can be suitably selected and used from what is conventionally used for the ultraviolet curable resin. Examples of the photoinitiator include benzoins, benzophenones, acetophenones, α-hydroxy ketones, α-amino ketones, α-diketones, α-diketone dialkyl acetals, anthraquinones, thioxanthones, and other compounds. Can be mentioned.
These photoinitiators may be used independently and may be used in combination of 2 or more type. Moreover, the usage-amount is normally selected in the range of 0.01-30 mass parts with respect to 100 mass parts of total amounts of the said addition reaction type silicone resin and a crosslinking agent, Preferably it is 0.05-20 mass parts.
基材フィルムの一方の面に、前記シリコーン系剥離剤から構成される剥離剤層を形成するには、まず溶剤型シリコーン系剥離剤塗工液又はエマルション型シリコーン系剥離剤塗工液を調製する。
前記溶剤型シリコーン系剥離剤塗工液では、一般にトルエン、ヘキサン、酢酸エチル、メチルエチルケトン、ヘプタン又はこれらの混合物などが希釈剤として用いられ、エマルション型剥離剤塗工液では、一般に水が希釈剤として用いられ、塗工可能な粘度に調節される。
このシリコーン系剥離剤塗工液には、必要に応じて、シリカ、帯電防止剤、染料、顔料その他の添加剤を添加してもよい。このようにして調製したシリコーン系剥離剤塗工液を、前記の基材フィルムの一方の面に、例えばグラビアコート法、バーコート法、マルチロールコート法などにより塗工する。塗工量は、固形分換算塗工量として、0.01〜3g/m2が適当であり、特に0.03〜1g/m2が好ましい。
塗工した塗工液を硬化させるには塗工機のオーブンで加熱処理するか、加熱処理した後紫外線照射を併用するか、いずれでもよいが、後者の方が基材フィルムの熱収縮しわの発生防止、シリコーンの硬化性、基材フィルムへの剥離剤の密着性の点で望ましい。
なお、紫外線照射を併用する場合は、光開始剤を添加したシリコーン系剥離剤を使用するか、塗工液調製時に光開始剤を添加することが望ましい。塗工液調製時に添加する光開始剤としては、必要に応じてシリコーン系剥離剤に添加する光開始剤として前述した光開始剤と同様のものが使用し得る。
加熱処理のみの場合、70〜160℃程度の温度範囲で、十分硬化するまでの時間、加熱するのが適当であるが、加熱・紫外線照射併用の場合は、加熱温度を50〜120℃程度と低くすることができる。
紫外線照射は、従来公知のもの、例えば高圧水銀ランプ、メタルハライドランプ、ハイパワーメタルハライドランプ、無電極ランプなどを用いることができるが、シリコーン系剥離剤の硬化性の点で優れる無電極ランプが好適である。紫外線出力としては、適宜選定すればよいが、50W/cm〜360W/cmが好ましい。
このようにして形成されたシリコーン系剥離剤層の厚さは、通常0.01〜3μm程度、好ましくは0.03〜1μmである。
In order to form a release agent layer composed of the silicone release agent on one surface of the base film, first, a solvent type silicone release agent coating solution or an emulsion type silicone release agent coating solution is prepared. .
In the solvent type silicone release agent coating solution, generally, toluene, hexane, ethyl acetate, methyl ethyl ketone, heptane or a mixture thereof is used as a diluent. In the emulsion type release agent coating solution, water is generally used as a diluent. Used and adjusted to a coatable viscosity.
If necessary, silica, an antistatic agent, a dye, a pigment and other additives may be added to the silicone-based release agent coating liquid. The silicone release agent coating liquid thus prepared is applied to one surface of the base film by, for example, a gravure coating method, a bar coating method, a multi-roll coating method, or the like. The coating amount is suitably from 0.01 to 3 g / m 2 , particularly preferably from 0.03 to 1 g / m 2 as the solid content conversion coating amount.
In order to cure the applied coating liquid, either heat treatment in the oven of the coating machine or ultraviolet irradiation after the heat treatment may be used, but the latter is more likely to cause heat shrinkage of the base film. It is desirable in terms of prevention of occurrence, silicone curability, and adhesion of the release agent to the base film.
In addition, when using ultraviolet irradiation together, it is desirable to use the silicone type release agent which added the photoinitiator, or to add a photoinitiator at the time of preparation of a coating liquid. As the photoinitiator to be added at the time of preparing the coating liquid, the same photoinitiator as that described above can be used as a photoinitiator to be added to the silicone release agent as necessary.
In the case of only heat treatment, it is appropriate to heat in the temperature range of about 70 to 160 ° C. for a time until it is sufficiently cured, but in the case of combined use of heating and ultraviolet irradiation, the heating temperature is about 50 to 120 ° C. Can be lowered.
For the ultraviolet irradiation, conventionally known ones such as a high pressure mercury lamp, a metal halide lamp, a high power metal halide lamp, and an electrodeless lamp can be used, but an electrodeless lamp that is excellent in terms of curability of the silicone-based release agent is suitable. is there. The UV output may be selected as appropriate, but is preferably 50 W / cm to 360 W / cm.
The thickness of the silicone release agent layer thus formed is usually about 0.01 to 3 μm, preferably 0.01 to 1 μm.
一方、非シリコーン系剥離剤としては、従来公知のもの、例えば長鎖アルキル基含有化合物系、アルキド樹脂系、オレフィン樹脂系、ゴム系、アクリル樹脂系などを用いることができる。
前記の長鎖アルキル基含有化合物としては、従来公知のもの、例えばポリビニルアルコール系重合体に炭素数8〜30の長鎖アルキルイソシアネートを反応させて得られたポリビニルカーバメートや、ポリエチレンイミンに前記長鎖アルキルイソシアネートを反応させて得られたアルキル尿素誘導体などを使用することができる。本発明においては、このようにして得られた長鎖アルキル基含有化合物は、融点70℃以上のものが、形成される剥離剤層における剥離性能の経時安定性の面から好適である。
また、ポリビニルアルコール系重合体に長鎖アルキルイソシアネートを反応させて得られたポリビニルカーバメートを用いる場合、前記ポリビニルアルコール系重合体のケン化度や重合度については特に制限はないが、完全ケン化タイプの方が取り扱い上有利であり、また重合度は300〜1,700程度のものが一般的に用いられる。
この長鎖アルキル基含有化合物を含む塗工液は、溶剤型、エマルション型のいずれであってもよいが、水系エマルション型が好ましい。この水系エマルション型としては、前記のようにして得られた長鎖アルキル基含有化合物を乳化処理し、水系エマルションとしたものを挙げることができる。乳化処理法については特に制限はなく、一般的な方法を採用することができる。例えば、長鎖アルキル基含有化合物の有機溶剤溶液を界面活性剤の水溶液中に撹拌混合して乳化したのち、必要に応じて有機溶剤を除去することにより、水系エマルションを得ることができる。また、有機溶剤を使用せず、長鎖アルキル基含有化合物と界面活性剤を水の存在下で加圧ニーダー、コロイドミルなどを使用して乳化分散させて、水系エマルションを得ることもできる。
このようにして得られた塗工液をロールコーター、グラビアコーター、マイヤーバーコーター、リップコーターなどの一般的な塗工装置を用いて塗布、乾燥することにより、剥離剤層を形成することができる。
乾燥条件は、80〜160℃程度の温度範囲で十分硬化するまでの時間、加熱するのが適当である。
On the other hand, as the non-silicone release agent, conventionally known ones such as a long chain alkyl group-containing compound system, an alkyd resin system, an olefin resin system, a rubber system, and an acrylic resin system can be used.
Examples of the long-chain alkyl group-containing compound include conventionally known compounds such as polyvinyl carbamate obtained by reacting a polyvinyl alcohol polymer with a long-chain alkyl isocyanate having 8 to 30 carbon atoms, and polyethyleneimine. An alkyl urea derivative obtained by reacting an alkyl isocyanate can be used. In the present invention, the long-chain alkyl group-containing compound thus obtained is preferably a compound having a melting point of 70 ° C. or higher from the viewpoint of the temporal stability of the release performance in the formed release agent layer.
Further, when using a polyvinyl carbamate obtained by reacting a polyvinyl alcohol polymer with a long-chain alkyl isocyanate, there is no particular limitation on the degree of saponification or degree of polymerization of the polyvinyl alcohol polymer, but a complete saponification type Is more advantageous in handling, and those having a polymerization degree of about 300 to 1,700 are generally used.
The coating liquid containing the long-chain alkyl group-containing compound may be either a solvent type or an emulsion type, but is preferably an aqueous emulsion type. Examples of the aqueous emulsion type include those obtained by emulsifying the long-chain alkyl group-containing compound obtained as described above to obtain an aqueous emulsion. There is no restriction | limiting in particular about an emulsification processing method, A general method is employable. For example, an aqueous emulsion can be obtained by stirring and mixing an organic solvent solution of a long-chain alkyl group-containing compound in an aqueous solution of a surfactant and emulsifying, and then removing the organic solvent as necessary. Further, an aqueous emulsion can be obtained by emulsifying and dispersing a long chain alkyl group-containing compound and a surfactant in the presence of water using a pressure kneader, a colloid mill or the like without using an organic solvent.
The release agent layer can be formed by applying and drying the coating solution thus obtained using a general coating apparatus such as a roll coater, a gravure coater, a Meyer bar coater, or a lip coater. .
As drying conditions, it is appropriate to heat for a time until it is sufficiently cured in a temperature range of about 80 to 160 ° C.
前記アルキド樹脂系剥離剤としては、一般に架橋構造を有するアルキド樹脂が用いられる。
架橋構造を有するアルキド樹脂層の形成は、例えば(X)アルキド樹脂、(Y)架橋剤及び所望により(Z)硬化触媒を含む熱硬化性樹脂組成物からなる層を加熱硬化させる方法を用いることができる。
前記(X)成分のアルキド樹脂としては特に制限はなく、従来アルキド樹脂として知られている公知のものの中から適宜選択して用いることができる。このアルキド樹脂は、多価アルコールと多塩基酸との縮合反応によって得られる樹脂であって、二塩基酸と二価アルコールとの縮合物又は不乾性油脂肪酸で変性したものである不転化性アルキド樹脂、及び二塩基酸と三価以上のアルコールとの縮合物である転化性アルキド樹脂があり、本発明においては、いずれも使用することができる。
該アルキド樹脂の原料として用いられる多価アルコールとしては、例えばエチレングリコール、ジエチレングリコール、トリエチレングリコール、プロピレングリコール、トリメチレングリコール、テトラメチレングリコール、ネオペンチルグリコールなどの二価アルコール、グリセリン、トリメチロールエタン、トリメチロールプロパンなどの三価アルコール、ジグリセリン、トリグリセリン、ペンタエリスリトール、ジペンタエリスリトール、マンニット、ソルビットなどの四価以上の多価アルコールを挙げることができる。これらは1種を単独で用いてもよく、2種以上を組み合わせて用いてもよい。
As the alkyd resin release agent, an alkyd resin having a crosslinked structure is generally used.
Formation of the alkyd resin layer having a crosslinked structure uses, for example, a method in which a layer comprising a thermosetting resin composition containing (X) an alkyd resin, (Y) a crosslinking agent, and (Z) a curing catalyst as required is heated and cured. Can do.
The alkyd resin as the component (X) is not particularly limited, and can be appropriately selected from conventionally known alkyd resins. This alkyd resin is a resin obtained by a condensation reaction between a polyhydric alcohol and a polybasic acid, and is a non-convertible alkyd which is modified with a condensate of a dibasic acid and a dihydric alcohol or a non-drying oil fatty acid. There are resins and convertible alkyd resins which are condensates of dibasic acids and trivalent or higher alcohols, and any of them can be used in the present invention.
Examples of the polyhydric alcohol used as a raw material of the alkyd resin include dihydric alcohols such as ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, trimethylene glycol, tetramethylene glycol, and neopentyl glycol, glycerin, trimethylolethane, Examples thereof include trihydric alcohols such as trimethylolpropane, and polyhydric alcohols such as diglycerin, triglycerin, pentaerythritol, dipentaerythritol, mannitol, and sorbit. These may be used individually by 1 type and may be used in combination of 2 or more type.
また、多塩基酸としては、例えば無水フタル酸、テレフタル酸、イソフタル酸、無水トリメット酸などの芳香族多塩基酸、コハク酸、アジピン酸、セバシン酸などの脂肪族飽和多塩基酸、マレイン酸、無水マレイン酸、フマル酸、イタコン酸、無水シトラコン酸などの脂肪族不飽和多塩基酸、シクロペンタジエン−無水マレイン酸付加物、テルペン−無水マレイン酸付加物、ロジン−無水マレイン酸付加物などのディールズ・アルダー反応による多塩基酸などを挙げることができる。これらは1種を単独で用いてもよく、2種以上を組み合わせて用いてもよい。
一方、変性剤としては、例えばオクチル酸、ラウリン酸、パルミチン酸、ステアリン酸、オレイン酸、リノール酸、リノレイン酸、エレオステアリン酸、リシノレイン酸、脱水リシノレイン酸、あるいはヤシ油、アマニ油、キリ油、ヒマシ油、脱水ヒマシ油、大豆油、サフラワー油及びこれらの脂肪酸などを用いることができる。これらは1種を単独で用いてもよく、2種以上を組み合わせて用いてもよい。
本発明においては、(X)成分のアルキド樹脂は1種を単独で用いてもよく、2種以上を組み合わせて用いてもよい。
前記(Y)成分の架橋剤としては、メラミン樹脂、尿素樹脂などのアミノ樹脂のほか、ウレタン樹脂、エポキシ樹脂及びフェノール樹脂を例示することができる。
本発明においては、(Y)成分の架橋剤は1種を単独で用いてもよく、2種以上を組み合わせて用いてもよい。
当該熱硬化性樹脂組成物においては、前記(X)成分と(Y)成分との割合は、固形分質量比で70:30ないし10:90の範囲が好ましい。(X)成分の割合が上記範囲より多いと硬化物は十分な架橋構造が得られず、剥離性の低下が生じる原因となる。一方、(X)成分の割合が上記範囲より少ないと硬化物は硬くて脆くなり、剥離性が低下する。(X)成分と(Y)成分のより好ましい割合は、固形分質量比で65:35ないし10:90であり、特に60:40ないし20:80の範囲が好ましい。
当該熱硬化性樹脂組成物においては、(Z)成分の硬化触媒として酸性触媒を用いることができる。この酸性触媒としては特に制限はなく、従来アルキド樹脂の架橋反応触媒として知られている公知の酸性触媒の中から適宜選択して用いることができる。このような酸性触媒としては、例えばp−トルエンスルホン酸やメタンスルホン酸などの有機系の酸性触媒が好適である。この酸性触媒は1種を単独で用いてもよく、2種以上を組み合わせて用いてもよい。また、その使用量は、前記(X)成分と(Y)成分との合計100質量部に対し、通常0.1〜40質量部、好ましくは0.5〜30質量部、より好ましくは1〜20質量部の範囲で選定される。
Examples of the polybasic acid include aromatic polybasic acids such as phthalic anhydride, terephthalic acid, isophthalic acid, and trimetic anhydride, aliphatic saturated polybasic acids such as succinic acid, adipic acid, and sebacic acid, maleic acid, Diels such as aliphatic unsaturated polybasic acids such as maleic anhydride, fumaric acid, itaconic acid, citraconic anhydride, cyclopentadiene-maleic anhydride adduct, terpene-maleic anhydride adduct, rosin-maleic anhydride adduct -The polybasic acid by Alder reaction etc. can be mentioned. These may be used individually by 1 type and may be used in combination of 2 or more type.
On the other hand, examples of the modifying agent include octylic acid, lauric acid, palmitic acid, stearic acid, oleic acid, linoleic acid, linolenic acid, eleostearic acid, ricinoleic acid, dehydrated ricinoleic acid, coconut oil, linseed oil, and kili oil. , Castor oil, dehydrated castor oil, soybean oil, safflower oil, and their fatty acids. These may be used individually by 1 type and may be used in combination of 2 or more type.
In the present invention, the alkyd resin of component (X) may be used alone or in combination of two or more.
Examples of the crosslinking agent for the component (Y) include not only amino resins such as melamine resins and urea resins, but also urethane resins, epoxy resins, and phenol resins.
In the present invention, the crosslinking agent of the component (Y) may be used alone or in combination of two or more.
In the said thermosetting resin composition, the ratio of the said (X) component and (Y) component has the preferable range of 70:30 thru | or 10:90 by solid content mass ratio. When the ratio of the component (X) is more than the above range, the cured product cannot obtain a sufficient cross-linked structure, which causes a decrease in peelability. On the other hand, if the proportion of the component (X) is less than the above range, the cured product becomes hard and brittle, and the peelability is lowered. A more preferable ratio of the component (X) to the component (Y) is 65:35 to 10:90 in terms of solid content mass ratio, and a range of 60:40 to 20:80 is particularly preferable.
In the said thermosetting resin composition, an acidic catalyst can be used as a curing catalyst of (Z) component. There is no restriction | limiting in particular as this acidic catalyst, It can select suitably from well-known acidic catalysts conventionally known as a crosslinking reaction catalyst of an alkyd resin. As such an acidic catalyst, for example, an organic acidic catalyst such as p-toluenesulfonic acid and methanesulfonic acid is suitable. This acidic catalyst may be used individually by 1 type, and may be used in combination of 2 or more type. Moreover, the usage-amount is 0.1-40 mass parts normally with respect to a total of 100 mass parts of the said (X) component and (Y) component, Preferably it is 0.5-30 mass parts, More preferably, it is 1-1. It is selected in the range of 20 parts by mass.
当該熱硬化性樹脂組成物を含むアルキド樹脂系剥離剤塗工液は、溶剤型、エマルション型のいずれでもよいが、使用上の利便性などの面から溶剤型が好ましい。この際用いられる有機溶剤としては、例えばトルエン、キシレン、メタノール、エタノール、イソブタノール、n−ブタノール、アセトン、メチルエチルケトン、テトラヒドロフランなどが挙げられる。これらは1種を単独で用いてもよく、2種以上を組み合わせて用いてもよい。
これらの有機溶剤中に、前記の(X)成分、(Y)成分、及び所望により用いられる(Z)成分や各種添加成分を、それぞれ所定の割合で加え、塗工可能な粘度に調整することにより、アルキド樹脂系剥離剤塗工液が得られる。この際用いられる添加成分としては特に制限はなく、従来アルキド樹脂の添加成分として知られている公知の添加成分の中から、適宜選択して使用することができる。例えばカチオン系界面活性剤などの帯電防止剤、可撓性や粘度調整などのためのアクリル系樹脂などの他の樹脂、レベリング剤、消泡剤、着色剤などを用いることができる。
このようにして得られたアルキド樹脂系剥離剤塗工液を、基材フィルムの一方の面に例えばバーコート法、リバースロールコート法、ナイフコート法、ロールナイフコート法、グラビアコート法、エアドクターコート法、ドクターブレードコート法など、従来公知の塗工方法により塗工し、80〜150℃程度の温度で数十秒〜数分間加熱硬化させることにより剥離剤層を形成することができる。
The alkyd resin-based release agent coating liquid containing the thermosetting resin composition may be either a solvent type or an emulsion type, but a solvent type is preferred from the viewpoint of convenience in use. Examples of the organic solvent used at this time include toluene, xylene, methanol, ethanol, isobutanol, n-butanol, acetone, methyl ethyl ketone, and tetrahydrofuran. These may be used individually by 1 type and may be used in combination of 2 or more type.
In these organic solvents, the (X) component, the (Y) component, and the (Z) component and various additive components used as required are respectively added at a predetermined ratio to adjust the viscosity to be coatable. Thus, an alkyd resin release agent coating solution is obtained. There is no restriction | limiting in particular as an additive component used in this case, From the well-known additive component conventionally known as an additive component of an alkyd resin, it can select suitably and can be used. For example, an antistatic agent such as a cationic surfactant, another resin such as an acrylic resin for adjusting flexibility and viscosity, a leveling agent, an antifoaming agent, a coloring agent, and the like can be used.
The alkyd resin release agent coating solution thus obtained is applied to one surface of the base film, for example, bar coating method, reverse roll coating method, knife coating method, roll knife coating method, gravure coating method, air doctor The release agent layer can be formed by coating by a conventionally known coating method such as a coating method or a doctor blade coating method, followed by heat curing at a temperature of about 80 to 150 ° C. for several tens of seconds to several minutes.
前記オレフィン樹脂系剥離剤としては、結晶性オレフィン系樹脂が用いられる。この結晶性オレフィン系樹脂としては、ポリエチレンや結晶性ポリプロピレン系樹脂などが好適である。結晶性ポリプロピレン系樹脂としては、アイソタクチック構造又はシンジオタクチック構造を有するプロピレン単独重合体や、プロピレン−α−オレフィン共重合体などが挙げられる。ポリエチレンとしては、高密度ポリエチレン、低密度ポリエチレン、直鎖状低蜜度ポリエチレンなどが挙げられる。これらの結晶性オレフィン系樹脂は、1種を単独で用いてもよく、2種以上を組み合わせて用いてもよい。
本発明においては、前記オレフィン樹脂系剥離剤は、一般に押出しラミネート法を採用して、基材フィルムの一方の面に剥離剤層を設けることができる。
また、ゴム系剥離剤としては、例えば以下に示すものを用いることができる。
天然ゴム系樹脂;ブタジエンゴム、イソプレンゴム、スチレン−ブタジエンゴム、メチルメタクリレート−ブタジエンゴム、アクリロニトリル−ブタジエンゴムなどの合成ゴム系樹脂;等のゴム系樹脂を用いた剥離剤を用いることができる。
As the olefin resin release agent, a crystalline olefin resin is used. As this crystalline olefin resin, polyethylene, crystalline polypropylene resin, and the like are suitable. Examples of the crystalline polypropylene resin include a propylene homopolymer having an isotactic structure or a syndiotactic structure, and a propylene-α-olefin copolymer. Examples of polyethylene include high-density polyethylene, low-density polyethylene, and linear low-concentration polyethylene. These crystalline olefin resins may be used alone or in combination of two or more.
In the present invention, the olefin resin release agent generally employs an extrusion laminating method, and a release agent layer can be provided on one surface of the substrate film.
Moreover, as a rubber-type release agent, what is shown below can be used, for example.
A release agent using a rubber resin such as a natural rubber resin; a synthetic rubber resin such as butadiene rubber, isoprene rubber, styrene-butadiene rubber, methyl methacrylate-butadiene rubber, and acrylonitrile-butadiene rubber;
前記アクリル系剥離剤としては、一般に架橋構造を有するアクリル系樹脂が用いられる。
この架橋構造を有するアクリル系樹脂からなる剥離剤層の形成は、例えば架橋性官能基を有する(メタ)アクリル酸エステル系共重合体及び架橋剤を含むアクリル系樹脂組成物からなる層を加熱硬化させる方法を用いることができる。
架橋性官能基を有する(メタ)アクリル酸エステル系共重合体としては、エステル部分のアルキル基の炭素数が1〜20の(メタ)アクリル酸エステルと、活性水素をもつ官能基を有する単量体と、所望により用いられる他の単量体との共重合体を好ましく挙げることができる。
ここで、エステル部分のアルキル基の炭素数が1〜20の(メタ)アクリル酸エステルの例としては、(メタ)アクリル酸メチル、(メタ)アクリル酸エチル、(メタ)アクリル酸プロピル、(メタ)アクリル酸ブチル、(メタ)アクリル酸ペンチル、(メタ)アクリル酸ヘキシル、(メタ)アクリル酸シクロヘキシル、(メタ)アクリル酸2−エチルヘキシル、(メタ)アクリル酸イソオクチル、(メタ)アクリル酸デシル、(メタ)アクリル酸ドデシル、(メタ)アクリル酸ミリスチル、(メタ)アクリル酸パルミチル、(メタ)アクリル酸ステアリルなどが挙げられる。これらは単独で用いてもよいし、2種以上を組み合わせて用いてもよい。
一方活性水素をもつ官能基を有する単量体の例としては、(メタ)アクリル酸2−ヒドロキシエチル、(メタ)アクリル酸2−ヒドロキシプロピル、(メタ)アクリル酸3−ヒドロキシプロピル、(メタ)アクリル酸2−ヒドロキシブチル、(メタ)アクリル酸3−ヒドロキシブチル、(メタ)アクリル酸4−ヒドロキシブチルなどの(メタ)アクリル酸ヒドロキシアルキルエステル;(メタ)アクリル酸モノメチルアミノエチル、(メタ)アクリル酸モノエチルアミノエチル、(メタ)アクリル酸モノメチルアミノプロピル、(メタ)アクリル酸モノエチルアミノプロピルなどの(メタ)アクリル酸モノアルキルアミノアルキル;アクリル酸、メタクリル酸、クロトン酸、マレイン酸、イタコン酸、シトラコン酸などのエチレン性不飽和カルボン酸などが挙げられる。これらの単量体は単独で用いてもよいし、2種以上を組み合わせて用いてもよい。
また、所望により用いられる他の単量体の例としては酢酸ビニル、プロピオン酸ビニルなどのビニルエステル類;エチレン、プロピレン、イソブチレンなどのオレフィン類;塩化ビニル、ビニリデンクロリドなどのハロゲン化オレフィン類;スチレン、α−メチルスチレンなどのスチレン系単量体;ブタジエン、イソプレン、クロロプレンなどのジエン系単量体;アクリロニトリル、メタクリロニトリルなどのニトリル系単量体;アクリルアミド、N−メチルアクリルアミド、N,N−ジメチルアクリルアミドなどのアクリルアミド類などが挙げられる。これらは単独で用いてもよいし、2種以上を組み合わせて用いてもよい。
As the acrylic release agent, an acrylic resin having a crosslinked structure is generally used.
For example, the release agent layer made of an acrylic resin having a crosslinked structure is formed by heating and curing a layer made of an acrylic resin composition containing a (meth) acrylate copolymer having a crosslinkable functional group and a crosslinking agent. Can be used.
The (meth) acrylic acid ester-based copolymer having a crosslinkable functional group includes a (meth) acrylic acid ester having an alkyl group of 1 to 20 carbon atoms and a functional group having an active hydrogen. The copolymer of a body and the other monomer used depending on necessity can be mentioned preferably.
Here, examples of the (meth) acrylic acid ester having 1 to 20 carbon atoms of the alkyl group in the ester portion include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, (meth ) Butyl acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, cyclohexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, decyl (meth) acrylate, Examples include dodecyl (meth) acrylate, myristyl (meth) acrylate, palmityl (meth) acrylate, stearyl (meth) acrylate, and the like. These may be used alone or in combination of two or more.
On the other hand, examples of the monomer having a functional group having active hydrogen include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, (meth) (Meth) acrylic acid hydroxyalkyl esters such as 2-hydroxybutyl acrylate, 3-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate; monomethylaminoethyl (meth) acrylate, (meth) acrylic Monoethylaminoethyl acid, monomethylaminopropyl (meth) acrylate, monoalkylaminoalkyl (meth) acrylate such as monoethylaminopropyl (meth) acrylate; acrylic acid, methacrylic acid, crotonic acid, maleic acid, itaconic acid And ethylenically unsaturated carboxylic acids such as citraconic acid. These monomers may be used independently and may be used in combination of 2 or more type.
Examples of other monomers used as desired include vinyl esters such as vinyl acetate and vinyl propionate; olefins such as ethylene, propylene and isobutylene; halogenated olefins such as vinyl chloride and vinylidene chloride; styrene Styrene monomers such as α-methylstyrene; diene monomers such as butadiene, isoprene and chloroprene; nitrile monomers such as acrylonitrile and methacrylonitrile; acrylamide, N-methylacrylamide, N, N- Examples include acrylamides such as dimethylacrylamide. These may be used alone or in combination of two or more.
該アクリル系樹脂組成物において、樹脂成分として用いられる(メタ)アクリル酸エステル系共重合体は、重量平均分子量30万以上が好ましい。この(メタ)アクリル酸エステル系共重合体は1種を単独で用いてもよいし、2種以上を組み合わせて用いてもよい。
このアクリル系樹脂組成物における架橋剤としては特に制限はなく、従来アクリル系樹脂において架橋剤として慣用されているものの中から、任意のものを適宜選択して用いることができる。このような架橋剤としては、例えばポリイソシアネート化合物、エポキシ樹脂、メラミン樹脂、尿素樹脂、ジアルデヒド類、メチロールポリマー、アジリジン系化合物、金属キレート化合物、金属アルコキシド、金属塩などが挙げられるが、ポリイソシアネート化合物が好ましく用いられる。この架橋剤は1種を単独で用いてもよいし、2種以上を組み合わせて用いてもよい。また、その使用量は、架橋剤の種類にもよるが、前記(メタ)アクリル酸エステル系共重合体100質量部に対し、通常0.01〜20質量部、好ましくは、0.1〜10質量部の範囲で選定される。
このアクリル系樹脂組成物には、本発明の目的が損なわれない範囲で、所望により各種添加剤、例えば酸化防止剤、紫外線吸収剤、光安定剤、軟化剤、充填剤、着色剤などを添加することができる。
このようにして得られたアクリル系樹脂組成物からなる塗工液を、基材フィルムの一方の面に、例えばバーコート法、リバースロールコート法、ナイフコート法、ロールナイフコート法、グラビアコート法、エアドクターコート法、ドクターブレードコート法など、従来公知の塗工方法により塗工し、80〜120℃程度の温度で数十秒〜数分間加熱硬化させることによりアクリル系剥離剤層を形成することができる。
In the acrylic resin composition, the (meth) acrylic acid ester copolymer used as a resin component preferably has a weight average molecular weight of 300,000 or more. This (meth) acrylic ester copolymer may be used alone or in combination of two or more.
There is no restriction | limiting in particular as a crosslinking agent in this acrylic resin composition, Arbitrary things can be suitably selected and used from what was conventionally used as a crosslinking agent in acrylic resin. Examples of such crosslinking agents include polyisocyanate compounds, epoxy resins, melamine resins, urea resins, dialdehydes, methylol polymers, aziridine compounds, metal chelate compounds, metal alkoxides, and metal salts. A compound is preferably used. This crosslinking agent may be used individually by 1 type, and may be used in combination of 2 or more type. Further, the amount used depends on the kind of the crosslinking agent, but is usually 0.01 to 20 parts by weight, preferably 0.1 to 10 parts by weight with respect to 100 parts by weight of the (meth) acrylic ester copolymer. It is selected in the range of mass parts.
Various additives such as antioxidants, ultraviolet absorbers, light stabilizers, softeners, fillers, colorants and the like are optionally added to the acrylic resin composition as long as the object of the present invention is not impaired. can do.
The coating liquid comprising the acrylic resin composition thus obtained is applied to one surface of the base film, for example, bar coating method, reverse roll coating method, knife coating method, roll knife coating method, gravure coating method. The acrylic release agent layer is formed by coating by a conventionally known coating method such as an air doctor coating method or a doctor blade coating method, and by heat curing at a temperature of about 80 to 120 ° C. for several tens of seconds to several minutes. be able to.
本発明の剥離フィルムにおいては、基材フィルムの一方の面に、前記のようにして形成された非シリコーン系剥離剤層の厚さは、通常0.01〜3μm程度、好ましくは0.03〜1μmである。
本発明の剥離フィルムにおいて、前記剥離剤層とは反対側の基材フィルム面に形成される帯電防止層は、カーボンナノファイバー及び必要に応じ導電性高分子化合物を含む活性エネルギー線硬化型樹脂組成物の硬化物からなる層である。
前記の活性エネルギー線硬化型樹脂組成物においては、活性エネルギー線硬化型重合性化合物として、分子内に2個以上の重合性不飽和基を有する活性エネルギー線重合性モノマー及び/又はオリゴマーを用いることができる。
なお、活性エネルギー線硬化型重合性化合物とは、電磁波又は荷電粒子線の中でエネルギー量子を有するもの、すなわち、紫外線又は電子線などを照射することにより、架橋、硬化する重合性化合物を指す。
活性エネルギー線が紫外線などの活性光線である場合には、前記活性エネルギー線重合性モノマー及び/又はオリゴマーと共に、通常光重合開始剤が用いられる。一方、活性エネルギー線が電子線である場合には、光重合開始剤は用いなくてもよい。本発明においては、活性エネルギー線として、紫外線などの活性光線を用いることが好ましい。したがって活性エネルギー線硬化型樹脂組成物は、(A)分子内に2個以上の重合性不飽和基を有する活性エネルギー線重合性モノマー及び/又はオリゴマーと、(B)光重合開始剤を含む光硬化型樹脂組成物であることが好ましい。
In the release film of the present invention, the thickness of the non-silicone release agent layer formed as described above on one surface of the base film is usually about 0.01 to 3 μm, preferably 0.03 to 1 μm.
In the release film of the present invention, the antistatic layer formed on the base film surface opposite to the release agent layer comprises an active energy ray-curable resin composition containing carbon nanofibers and, if necessary, a conductive polymer compound It is a layer made of a cured product.
In the active energy ray-curable resin composition, an active energy ray-polymerizable monomer and / or oligomer having two or more polymerizable unsaturated groups in the molecule is used as the active energy ray-curable polymerizable compound. Can do.
The active energy ray-curable polymerizable compound refers to a polymerizable compound having energy quanta in an electromagnetic wave or a charged particle beam, that is, a polymerizable compound that is crosslinked and cured by irradiation with ultraviolet rays or an electron beam.
When the active energy ray is an actinic ray such as ultraviolet ray, a photopolymerization initiator is usually used together with the active energy ray polymerizable monomer and / or oligomer. On the other hand, when the active energy ray is an electron beam, the photopolymerization initiator may not be used. In the present invention, it is preferable to use actinic rays such as ultraviolet rays as active energy rays. Therefore, the active energy ray-curable resin composition comprises (A) an active energy ray-polymerizable monomer and / or oligomer having two or more polymerizable unsaturated groups in the molecule, and (B) a light containing a photopolymerization initiator. A curable resin composition is preferred.
この光硬化型樹脂組成物において、(A)成分として用いられる分子内に2個以上の重合性不飽和基を有する活性エネルギー線重合性モノマーとしては、例えば、1,4−ブタンジオールジ(メタ)アクリレート、1,6−ヘキサンジオールジ(メタ)アクリレート、ネオペンチルグリコールジ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート、ネオペンチルグリコールアジペートジ(メタ)アクリレート、ヒドロキシピバリン酸ネオペンチルグリコールジ(メタ)アクリレート、ジシクロペンタニルジ(メタ)アクリレート、カプロラクトン変性ジシクロペンテニルジ(メタ)アクリレート、エチレンオキシド変性リン酸ジ(メタ)アクリレート、アリル化シクロヘキシルジ(メタ)アクリレート、イソシアヌレートジ(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレート、ジペンタエリスリトールトリ(メタ)アクリレート、プロピオン酸変性ジペンタエリスリトールトリ(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、プロピレンオキシド変性トリメチロールプロパントリ(メタ)アクリレート、トリス(アクリロキシエチル)イソシアヌレート、プロピオン酸変性ジペンタエリスリトールペンタ(メタ)アクリレート、ジペンタエリスリトールヘキサ(メタ)アクリレート、カプロラクトン変性ジペンタエリスリトールヘキサ(メタ)アクリレートなどの多官能アクリレートが挙げられる。これらの活性エネルギー線重合性モノマーは1種用いてもよいし、2種以上を組み合わせて用いてもよい。
一方、活性エネルギー線重合性オリゴマーには、ラジカル重合型とカチオン重合型があり、ラジカル重合型の活性エネルギー線重合性オリゴマーとしては、例えばポリエステルアクリレート系、エポキシアクリレート系、ウレタンアクリレート系、ポリオールアクリレート系などが挙げられる。
ここで、ポリエステルアクリレート系オリゴマーとしては、例えば多価カルボン酸と多価アルコールの縮合によって得られる両末端に水酸基を有するポリエステルオリゴマーの水酸基を(メタ)アクリル酸でエステル化することにより、あるいは、多価カルボン酸にアルキレンオキシドを付加して得られるオリゴマーの末端の水酸基を(メタ)アクリル酸でエステル化することにより得ることができる。エポキシアクリレート系オリゴマーは、例えば、比較的低分子量のビスフェノール型エポキシ樹脂やノボラック型エポキシ樹脂のオキシラン環に、(メタ)アクリル酸を反応しエステル化することにより得ることができる。ウレタンアクリレート系オリゴマーは、例えば、ポリエーテルポリオールやポリエステルポリオールとポリイソシアネートの反応によって得られるポリウレタンオリゴマーを、(メタ)アクリル酸でエステル化することにより得ることができる。さらに、ポリオールアクリレート系オリゴマーは、ポリエーテルポリオールの水酸基を(メタ)アクリル酸でエステル化することにより得ることができる。これらの活性エネルギー線重合性オリゴマーは1種用いてもよいし、2種以上を組み合わせて用いてもよい。
一方、カチオン重合型の活性エネルギー線重合性オリゴマーとしては、例えばエポキシ、オキセタン樹脂、ビニルエーテル樹脂などが挙げられる。ここで、エポキシ系樹脂としては、例えばビスフェノール樹脂やノボラック樹脂などの多価フェノール類にエピクロルヒドリンなどでエポキシ化した化合物、直鎖状オレフィン化合物や環状オレフィン化合物を過酸化物などで酸化して得られた化合物などが挙げられる。
In this photocurable resin composition, examples of the active energy ray polymerizable monomer having two or more polymerizable unsaturated groups in the molecule used as the component (A) include 1,4-butanediol di (meta ) Acrylate, 1,6-hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, neopentyl glycol adipate di (meth) acrylate, hydroxypivalate neopentyl glycol di ( (Meth) acrylate, dicyclopentanyl di (meth) acrylate, caprolactone-modified dicyclopentenyl di (meth) acrylate, ethylene oxide-modified phosphoric acid di (meth) acrylate, allylated cyclohexyl di (meth) acrylate, isocyanurate di (meth) Acrylate, trimer Roll propane tri (meth) acrylate, dipentaerythritol tri (meth) acrylate, propionic acid modified dipentaerythritol tri (meth) acrylate, pentaerythritol tri (meth) acrylate, propylene oxide modified trimethylolpropane tri (meth) acrylate, tris Examples thereof include polyfunctional acrylates such as (acryloxyethyl) isocyanurate, propionic acid-modified dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and caprolactone-modified dipentaerythritol hexa (meth) acrylate. These active energy ray polymerizable monomers may be used alone or in combination of two or more.
On the other hand, the active energy ray polymerizable oligomer includes a radical polymerization type and a cationic polymerization type. Examples of the radical polymerization type active energy ray polymerizable oligomer include a polyester acrylate type, an epoxy acrylate type, a urethane acrylate type, and a polyol acrylate type. Etc.
Here, as the polyester acrylate oligomer, for example, by esterifying hydroxyl groups of a polyester oligomer having hydroxyl groups at both ends obtained by condensation of a polyvalent carboxylic acid and a polyhydric alcohol with (meth) acrylic acid, It can be obtained by esterifying the terminal hydroxyl group of an oligomer obtained by adding alkylene oxide to a polyvalent carboxylic acid with (meth) acrylic acid. The epoxy acrylate oligomer can be obtained, for example, by reacting (meth) acrylic acid with an oxirane ring of a relatively low molecular weight bisphenol type epoxy resin or novolak type epoxy resin and esterifying it. The urethane acrylate oligomer can be obtained, for example, by esterifying a polyurethane oligomer obtained by reaction of polyether polyol or polyester polyol and polyisocyanate with (meth) acrylic acid. Furthermore, the polyol acrylate oligomer can be obtained by esterifying the hydroxyl group of the polyether polyol with (meth) acrylic acid. These active energy ray polymerizable oligomers may be used alone or in combination of two or more.
On the other hand, examples of the cationic polymerization type active energy ray polymerizable oligomer include epoxy, oxetane resin, vinyl ether resin and the like. Here, the epoxy resin is obtained by oxidizing a compound obtained by epoxidizing polyhydric phenols such as bisphenol resin or novolak resin with epichlorohydrin, etc., a linear olefin compound or a cyclic olefin compound with a peroxide or the like. And the like.
また、(B)成分の光重合開始剤としては、活性エネルギー線重合性のオリゴマーやモノマーの中でラジカル重合型の光重合性オリゴマーや光重合性モノマーに対しては、例えばベンゾイン、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインイソプロピルエーテル、ベンゾイン−n−ブチルエーテル、ベンゾインイソブチルエーテル、アセトフェノン、ジメチルアミノアセトフェノン、2,2−ジメトキシ−2−フェニルアセトフェノン、2,2−ジエトキシ−2−フェニルアセトフェノン、2−ヒドロキシ−2−メチル−1−フェニルプロパン−1−オン、1−ヒドロキシシクロヘキシルフェニルケトン、α−ヒドロキシシクロヘキシルフェニルメタノン、2−メチル−1−[4−(メチルチオ)フェニル]−2−モルフォリノ−プロパン−1−オン、4−(2−ヒドロキシエトキシ)フェニル−2(ヒドロキシ−2−プロピル)ケトン、ベンゾフェノン、p−フェニルベンゾフェノン、4,4'−ジエチルアミノベンゾフェノン、ジクロロベンゾフェノン、2−メチルアントラキノン、2−エチルアントラキノン、2−ターシャリ−ブチルアントラキノン、2−アミノアントラキノン、2−メチルチオキサントン、2−エチルチオキサントン、2−クロロチオキサントン、2,4−ジメチルチオキサントン、2,4−ジエチルチオキサントン、ベンジルジメチルケタール、アセトフェノンジメチルケタール、p−ジメチルアミン安息香酸エステルなどが挙げられる。また、カチオン重合型の光重合性オリゴマーに対する光重合開始剤としては、例えば芳香族スルホニウムイオン、芳香族オキソスルホニウムイオン、芳香族ヨードニウムイオンなどのオニウムと、テトラフルオロボレート、ヘキサフルオロホスフェート、ヘキサフルオロアンチモネート、ヘキサフルオロアルセネートなどの陰イオンとからなる化合物が挙げられる。これらは1種用いてもよいし、2種以上を組み合わせて用いてもよく、また、その配合量は、前記光重合性モノマー及び/又は光重合性オリゴマー100質量部に対して、通常0.2〜10質量部の範囲で選ばれる。 In addition, as the photopolymerization initiator of the component (B), among the active energy ray polymerizable oligomers and monomers, radical polymerization type photopolymerizable oligomers and photopolymerizable monomers include, for example, benzoin and benzoin methyl ether. , Benzoin ethyl ether, benzoin isopropyl ether, benzoin-n-butyl ether, benzoin isobutyl ether, acetophenone, dimethylaminoacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy 2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, α-hydroxycyclohexyl phenylmethanone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino Propan-1-one, 4- (2-hydroxyethoxy) phenyl-2 (hydroxy-2-propyl) ketone, benzophenone, p-phenylbenzophenone, 4,4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methylanthraquinone, 2 -Ethylanthraquinone, 2-tert-butylanthraquinone, 2-aminoanthraquinone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, benzyldimethyl ketal, acetophenone Examples thereof include dimethyl ketal and p-dimethylamine benzoate. Examples of the photopolymerization initiator for the cationic polymerization type photopolymerizable oligomer include oniums such as aromatic sulfonium ion, aromatic oxosulfonium ion, and aromatic iodonium ion, tetrafluoroborate, hexafluorophosphate, hexafluoroantimony. And compounds composed of anions such as nitrates and hexafluoroarsenates. These may be used singly or in combination of two or more, and the blending amount thereof is usually 0.1 with respect to 100 parts by mass of the photopolymerizable monomer and / or photopolymerizable oligomer. It is selected in the range of 2 to 10 parts by mass.
当該活性エネルギー線硬化型樹脂組成物に含有されるカーボンナノファイバーとしては、好ましくは、平均外径が0.5〜120nm程度で、平均長さが0.5μm程度以上の円筒状の中空繊維状物質であるカーボンナノチューブが用いられる。前記平均外径が0.5nm未満では分散が困難であり、導電性が十分に発揮されにくく、120nmを超えると平滑性が低下すると共に、導電性も低下するおそれがある。また、平均長さが0.5μm未満では導電性が低下する傾向があるが、あまり長すぎると分散性が悪くなる。好ましい平均外径は1〜100nmであり、好ましい平均長さは0.8〜15μmである。
また、帯電防止層の帯電防止性能の観点から、カーボンナノチューブに不純物として含まれる非晶カーボン粒子は、20質量%以下であることが望ましい。
本発明で用いるカーボンナノチューブは、グラファイトの1枚面を巻いて円筒状にした形状を有しており、そのグラファイト層が1層で巻いた構造を持つ単層カーボンナノチューブ、2層以上で巻いた多層カーボンナノチューブのいずれでもよいが、多層カーボンナノチューブであることが好ましい。多層カーボンナノチューブが好ましい理由とは、多層カーボンナノチューブの方がバインダー樹脂との親和性とカーボンナノチューブ自身の有する特性の両立がしやすいからである。カーボンナノチューブに活性エネルギー線硬化型樹脂組成物との親和性を持たせようとすると、酸化などの表面処理をする必要があるが、単層カーボンナノチューブには、グラファイト層が1層しかないので表面処理をすることによってグラファイト層の結晶配列が崩れ、カーボンナノチューブの優れた導電性や機械的特性を失うことが多い。この点で、2層以上のグラファイト層を有する多層カーボンナノチューブの方が好ましい。
The carbon nanofiber contained in the active energy ray-curable resin composition is preferably a cylindrical hollow fiber having an average outer diameter of about 0.5 to 120 nm and an average length of about 0.5 μm or more. A carbon nanotube which is a substance is used. When the average outer diameter is less than 0.5 nm, dispersion is difficult, and the conductivity is not sufficiently exhibited. When the average outer diameter exceeds 120 nm, the smoothness is lowered and the conductivity may be lowered. Further, when the average length is less than 0.5 μm, the conductivity tends to decrease, but when the average length is too long, the dispersibility deteriorates. A preferable average outer diameter is 1 to 100 nm, and a preferable average length is 0.8 to 15 μm.
Further, from the viewpoint of the antistatic performance of the antistatic layer, the amorphous carbon particles contained as impurities in the carbon nanotubes are desirably 20% by mass or less.
The carbon nanotube used in the present invention has a shape in which one surface of graphite is wound into a cylindrical shape, and the single-walled carbon nanotube having a structure in which the graphite layer is wound in one layer is wound in two or more layers. Any of multi-walled carbon nanotubes may be used, but multi-walled carbon nanotubes are preferred. The reason why the multi-walled carbon nanotube is preferable is that the multi-walled carbon nanotube can easily achieve both the affinity with the binder resin and the characteristics of the carbon nanotube itself. In order to give carbon nanotubes an affinity for the active energy ray-curable resin composition, surface treatment such as oxidation is required. However, single-walled carbon nanotubes have only one graphite layer, so the surface By the treatment, the crystal arrangement of the graphite layer is broken, and the excellent conductivity and mechanical properties of the carbon nanotube are often lost. In this regard, multi-walled carbon nanotubes having two or more graphite layers are preferred.
本発明で用いるカーボンナノチューブは、ゼオライトの細孔に鉄やコバルト系触媒を導入した触媒化学気相成長法(CCVD法)、気相成長法(CVD法)、レーザーアブレーション法、炭素棒・炭素繊維等を用いたアーク放電法等によって製造することができる。
カーボンナノチューブの末端形状が、必ずしも円筒状である必要はなく、例えば、円錐状等変形していても差し支えない。また、カーボンナノチューブの末端が閉じた構造でも、開いた構造のどちらでも用いることができるが、好ましくは末端が開いた構造のものがよい。カーボンナノチューブの末端が閉じた構造のものは、硝酸等化学処理をすることにより開口することができる。
本発明においては、前記カーボンナノチューブは、形成される帯電防止層中の含有量が、好ましくは0.1〜30質量%、より好ましくは0.3〜10質量%になるように、当該活性エネルギー線硬化型樹脂組成物に添加分散される。帯電防止層中のカーボンナノファイバーの含有量が、0.1質量%未満では帯電防止性能が不十分となるおそれがあり、30質量%を超えるとカーボンナノファイバーの分散性が悪くなり、帯電防止性能がむしろ低下する傾向がある。
The carbon nanotubes used in the present invention are a catalytic chemical vapor deposition method (CCVD method), a vapor deposition method (CVD method), a laser ablation method, a carbon rod / carbon fiber in which iron or a cobalt-based catalyst is introduced into the pores of zeolite. It can manufacture by the arc discharge method etc. which used etc.
The end shape of the carbon nanotube is not necessarily cylindrical, and may be deformed, for example, conical. Further, either a structure in which the end of the carbon nanotube is closed or an open structure can be used, but a structure having an open end is preferable. A carbon nanotube having a closed end can be opened by a chemical treatment such as nitric acid.
In the present invention, the carbon nanotubes have the active energy so that the content in the formed antistatic layer is preferably 0.1 to 30% by mass, more preferably 0.3 to 10% by mass. It is added and dispersed in the linear curable resin composition. If the content of the carbon nanofibers in the antistatic layer is less than 0.1% by mass, the antistatic performance may be insufficient, and if it exceeds 30% by mass, the dispersibility of the carbon nanofibers deteriorates and the antistatic property is prevented. The performance tends to be rather degraded.
当該活性エネルギー線硬化型樹脂組成物に、必要に応じて含有される導電性高分子化合物に特に制限はなく、従来公知の導電性高分子化合物の中から、任意のものを適宜選択して用いることができる。この導電性高分子化合物としては、例えばトランス型ポリアセチレン、シス型ポリアセチレン、ポリジアセチレンなどのポリアセチレン系;ポリ(p−フェニレン)やポリ(m−フェニレン)などのポリ(フェニレン)系;ポリチオフェン、ポリ(3−アルキルチオフェン)、ポリ(3−チオフェン−β−エタンスルホン酸)、ポリアルキレンジオキシチオフェンとポリスチレンスルホネートとの混合物などのポリチオフェン系;ポリアニリン、ポリメチルアニリン、ポリメトキシアニリンなどのポリアニリン系;ポリピロール、ポリ3−メチルピロール、ポリ3−オクチルピロールなどのポリピロール系;ポリ(p−フェニレンビニレン)などのポリ(フェニレンビニレン)系;ポリ(ビニレンスルフィド)系;ポリ(p−フェニレンスルフィド)系;ポリ(チエニレンビニレン)系化合物などが挙げられる。これらの中で、性能及び入手の容易さなどの観点から、ポリアセチレン系、ポリチオフェン系、ポリアニリン系、ポリピロール系及びポリ(フェニレンビニレン)系化合物が好ましい。
本発明においては、これらの導電性高分子化合物は、1種を単独で用いてもよく、2種以上を組み合わせて用いてもよい。また、この導電性高分子化合物は、帯電防止性能の向上効果及び分散性などの面から、形成される帯電防止層中の含有量が、通常0.01〜10質量%、好ましくは0.01〜5質量%、より好ましくは0.1〜3質量%になるように、当該活性エネルギー線硬化型樹脂組成物に添加される。
本発明で用いられる活性エネルギー線硬化型樹脂組成物、好ましくは光硬化型樹脂組成物は、適当な溶剤中に、前記の活性エネルギー線硬化型重合性化合物、カーボンナノファイバー、導電性高分子化合物、光重合開始剤及び所望により各種添加成分、例えば単官能活性エネルギー線重合性モノマー、酸化防止剤、紫外線吸収剤、光安定剤、レベリング剤、消泡剤、着色剤などを、それぞれ所定の割合で加え、溶解又は分散させることにより、調製することができる。
前記単官能活性エネルギー線重合性モノマーとしては、例えばシクロヘキシル(メタ)アクリレート、2−エチルヘキシル(メタ)アクリレート、ラウリル(メタ)アクリレート、ステアリル(メタ)アクリレート、イソボニル(メタ)アクリレート、N−ビニルピロリドンなどが挙げられる。
この際用いる溶剤としては、例えばヘキサン、ヘプタンなどの脂肪族炭化水素、トルエン、キシレンなどの芳香族炭化水素、塩化メチレン、塩化エチレンなどのハロゲン化炭化水素、メタノール、エタノール、プロパノール、イソプロパノール、ブタノールなどのアルコール、アセトン、メチルエチルケトン、2−ペンタノン、イソホロン、シクロヘキサノンなどのケトン、酢酸エチル、酢酸ブチルなどのエステル、エチルセロソルブなどのエーテル系溶剤、エチレングリコールモノエチルエーテルなどのグリコールエーテル系溶剤などが挙げられる。
このようにして調製された組成物の濃度、粘度としては、コーティング可能なものであればよく、特に制限されず、状況に応じて適宜選定することができる。
There is no particular limitation on the conductive polymer compound contained in the active energy ray-curable resin composition as required, and any one of conventionally known conductive polymer compounds can be appropriately selected and used. be able to. Examples of the conductive polymer compound include polyacetylene-based compounds such as trans-type polyacetylene, cis-type polyacetylene, and polydiacetylene; poly (phenylene) -based materials such as poly (p-phenylene) and poly (m-phenylene); polythiophene, poly ( 3-alkylthiophene), poly (3-thiophene-β-ethanesulfonic acid), polythiophene systems such as a mixture of polyalkylenedioxythiophene and polystyrene sulfonate; polyaniline systems such as polyaniline, polymethylaniline, polymethoxyaniline; polypyrrole Polypyrrole systems such as poly (3-methylpyrrole) and poly-3-octylpyrrole; poly (phenylene vinylene) systems such as poly (p-phenylene vinylene); poly (vinylene sulfide) systems; poly (p-phenylene sulfide) systems; (Chienile Vinylene) compounds, and the like. Of these, polyacetylene-based, polythiophene-based, polyaniline-based, polypyrrole-based, and poly (phenylene vinylene) -based compounds are preferable from the viewpoints of performance and availability.
In the present invention, these conductive polymer compounds may be used alone or in combination of two or more. In addition, the conductive polymer compound has a content in the formed antistatic layer of usually 0.01 to 10% by mass, preferably 0.01, from the viewpoint of improving the antistatic performance and dispersibility. It is added to the active energy ray-curable resin composition so as to be ˜5 mass%, more preferably 0.1 to 3 mass%.
The active energy ray-curable resin composition used in the present invention, preferably the photocurable resin composition, is prepared by mixing the active energy ray-curable polymerizable compound, carbon nanofiber, and conductive polymer compound in a suitable solvent. , Photopolymerization initiators and various optional components as desired, such as monofunctional active energy ray polymerizable monomers, antioxidants, ultraviolet absorbers, light stabilizers, leveling agents, antifoaming agents, colorants, etc. And can be prepared by dissolving or dispersing.
Examples of the monofunctional active energy ray polymerizable monomer include cyclohexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, isobornyl (meth) acrylate, N-vinylpyrrolidone and the like. Is mentioned.
Examples of the solvent used in this case include aliphatic hydrocarbons such as hexane and heptane, aromatic hydrocarbons such as toluene and xylene, halogenated hydrocarbons such as methylene chloride and ethylene chloride, methanol, ethanol, propanol, isopropanol, and butanol. Alcohols, acetone, methyl ethyl ketone, ketones such as 2-pentanone, isophorone, cyclohexanone, esters such as ethyl acetate and butyl acetate, ether solvents such as ethyl cellosolve, glycol ether solvents such as ethylene glycol monoethyl ether, etc. .
The concentration and viscosity of the composition thus prepared are not particularly limited as long as they can be coated, and can be appropriately selected according to the situation.
次に、前記基材フィルムの剥離剤層とは反対側の面に、上記組成物を、従来公知の方法、例えばバーコート法、ナイフコート法、ロールコート法、ブレードコート法、ダイコート法、グラビアコート法などを用いて、コーティングして塗膜を形成させ、所望により加熱乾燥を行った後、これに活性エネルギー線を照射して該塗膜を硬化させることにより、帯電防止層が形成される。
活性エネルギー線としては、例えば紫外線などの活性光線が好ましく挙げられる。上記紫外線は、高圧水銀ランプ、ヒュージョンHランプ、キセノンランプなどで得られ、照射量は、通常100〜500mJ/cm2である。
このようにして形成された帯電防止層の厚さは、帯電防止性能及び経済性のバランスなどの面から、通常0.01〜3μm程度、好ましくは、0.03〜1μm、より好ましくは0.03〜0.5μmである。
帯電防止層の表面抵抗率は、1013Ω/□以下、好ましくは1010Ω/□以下である。
本発明はまた、基材フィルムの一方の面に、カーボンナノファイバーを含む活性エネルギー線硬化型樹脂組成物を塗布、乾燥して塗膜を設け、次いで該塗膜に活性エネルギー線を照射して硬化させ、帯電防止層を形成すると共に、他方の面に、剥離剤を含む塗工液を塗布、乾燥して剥離剤層を形成する剥離フィルムの製造方法をも提供する。
本発明の剥離フィルムは、基材フィルムの一方の面に剥離剤層が、その背面にカーボンナノファイバー及び場合により導電性高分子化合物を含む帯電防止層が設けられており、優れた帯電防止機能と剥離機能を兼ね備えている。この剥離フィルムは、例えばポリウレタン樹脂、ポリアクリル樹脂、ポリ塩化ビニル樹脂などのキャスト製膜用工程フィルム、積層セラミックコンデンサのグリーンシート成形用工程フィルム、あるいは粘着製品における粘着剤の保護フィルムなどとして、好適に用いられる。
Next, on the surface of the base film opposite to the release agent layer, the composition is applied to a conventionally known method such as a bar coating method, a knife coating method, a roll coating method, a blade coating method, a die coating method, or a gravure. An antistatic layer is formed by coating with a coating method or the like to form a coating film, and optionally heating and drying, and then irradiating this with active energy rays to cure the coating film. .
As the active energy ray, for example, actinic rays such as ultraviolet rays are preferably exemplified. The ultraviolet rays are obtained with a high-pressure mercury lamp, a fusion H lamp, a xenon lamp or the like, and the irradiation amount is usually 100 to 500 mJ / cm 2 .
The thickness of the antistatic layer formed in this manner is usually about 0.01 to 3 μm, preferably 0.01 to 1 μm, more preferably about 0.1 to 3 μm from the viewpoint of balance between antistatic performance and economy. It is 03-0.5 micrometer.
The surface resistivity of the antistatic layer is 10 13 Ω / □ or less, preferably 10 10 Ω / □ or less.
In the present invention, an active energy ray-curable resin composition containing carbon nanofibers is applied to one surface of a base film, dried to provide a coating, and then the coating is irradiated with active energy rays. There is also provided a method for producing a release film which is cured to form an antistatic layer, and on the other side, a coating solution containing a release agent is applied and dried to form a release agent layer.
The release film of the present invention is provided with a release agent layer on one side of a base film and an antistatic layer containing carbon nanofibers and optionally a conductive polymer compound on the back side, and has an excellent antistatic function. And has a peeling function. This release film is suitable as, for example, a cast film forming process film such as polyurethane resin, polyacrylic resin or polyvinyl chloride resin, a green film forming process film for laminated ceramic capacitors, or a protective film for an adhesive in an adhesive product. Used for.
次に、本発明を実施例により、さらに詳細に説明するが、本発明は、これらの例によってなんら限定されるものではない。
なお、各例で得られた剥離フィルムの性能は以下に示す方法に従って求めた。
(1)表面抵抗率
実施例、比較例で作製した剥離フィルムを100mm×100mmサイズに裁断したサンプルを、23℃、50%RHの条件下で24時間調湿後、サンプルの帯電防止層表面について、JIS K 6911に準拠して表面抵抗率を測定した。
(2)剥離力
実施例、比較例で作製した剥離フィルムの剥離剤層に、粘着テープ[日東電工社製、商品名「31Bテープ」]を貼り合わせた。次いで、23℃、50%RH条件下で24時間調湿後、長さ150mm、幅20mmに裁断し、引張り試験機を用いて180°の角度で0.3m/分の速度で剥離フィルム側を剥離し、剥離するに必要な力(剥離力)を測定した。
(3)平滑性
JIS B 0601に準拠し、MITUTOYO社製「SURFPAK−SV」を用い、帯電防止層表面の算術平均粗さRaを測定した。
EXAMPLES Next, although an Example demonstrates this invention further in detail, this invention is not limited at all by these examples.
In addition, the performance of the peeling film obtained in each example was calculated | required according to the method shown below.
(1) Surface resistivity Samples obtained by cutting the release films prepared in Examples and Comparative Examples to 100 mm × 100 mm size were conditioned at 23 ° C. and 50% RH for 24 hours, and then the surface of the antistatic layer of the samples The surface resistivity was measured according to JIS K 6911.
(2) Release force An adhesive tape [manufactured by Nitto Denko Corporation, trade name “31B tape”] was bonded to the release agent layer of the release film prepared in Examples and Comparative Examples. Next, after conditioning for 24 hours under conditions of 23 ° C. and 50% RH, the film is cut into a length of 150 mm and a width of 20 mm, and the release film side is peeled off at a speed of 0.3 m / min at an angle of 180 ° using a tensile tester. It peeled and the force (peeling force) required for peeling was measured.
(3) Smoothness Based on JIS B 0601, the arithmetic average roughness Ra of the surface of the antistatic layer was measured using “SURFPAK-SV” manufactured by MITUTOYO.
参考例1
ジペンタエリスリトールヘキサアクリレート、ペンタエリスリトールヘキサアクリレート、N−ビニルピロリドンを質量比で45:20:10の割合で含有するアクリル系モノマー75質量部と、酢酸ブチル20質量部及びイソプロパノール30質量部を含有する溶液125質量部と、ポリエチレンジオキシチオフェンポリスチレンスルホネート(PEDT/PSS)の導電性高分子を1.3質量%の割合で含有する水溶液15.5質量部、α−ヒドロキシシクロヘキシルフェニルメタノンの光開始剤0.2質量部を混合した。さらに上記アクリル系モノマー及び導電性高分子の合計量が1質量%になるようにイソプロパノールで希釈した光硬化型樹脂組成物を調製した。
上記光硬化型樹脂組成物に、平均直径15nm、平均長さ1μmのカーボンナノファイバー[ジェムコ社製、商品名「CNF−T」、チューブ状、3質量%イソプロパノール分散型]を、全固形分(帯電防止層)中の含有量が1質量%になるように添加して、塗工液Iを調製した。
次に、前記塗工液Iを、厚さ38μmのポリエチレンテレフタレート(PET)フィルム[三菱化学ポリエステルフィルム社製、商品名「T−100」]上に、乾燥後の厚さが0.05μmとなるようにマイヤーバーで均一に塗工した。次いで、55℃の乾燥機で1分間加熱し、直ちにフュージョンHバルブ240W/cm、1灯取付けのコンベヤ式紫外線照射機により、コンベヤスピード10m/分の条件で紫外線を照射し、帯電防止層を形成した。
一方、熱硬化型シリコーン[信越化学社製、商品名「KS−847H」]100質量部及び硬化剤[信越化学社製、商品名「CAT−PL−50T」]1質量部をトルエンで希釈し、固形分1.1質量%の塗工液IIを調製した。
次に、この塗工液IIを、前記帯電防止層を設けたPETフィルムの背面に、乾燥後の厚さが0.1μmとなるように均一に塗工し、130℃の乾燥機で1分間乾燥して剥離剤層を形成し、剥離フィルムを作製した。
この剥離フィルムの性能を第1表に示す。
参考例2
光硬化型樹脂組成物として、導電性高分子水溶液(PEDT/PSS)、光開始剤(α−ヒドロキシシクロヘキシルフェニルメタノン)、アクリル系オリゴマー及びモノマーを含有する溶液(ジペンタエリスリトールヘキサアクリレート、ペンタエリスリトールヘキサアクリレート、N−ビニルピロリドン)と、それらを溶解するエチレングリコールモノエチルエーテル及びイソプロパノールからなる光硬化型コーティング剤[出光テクノファイン社製、商品名「ELコート515」]をイソプロパノールで1質量%に希釈したものを使用した以外は参考例1と同様にして剥離フィルムを作製した。
この剥離フィルムの性能を第1表に示す。
参考例3
参考例2において、帯電防止層の厚さを0.1μmとした以外は、参考例2と同様にして、剥離フィルムを作製し、その性能を評価した。結果を第1表に示す。
実施例4
参考例2において、剥離剤層を下記のようにして形成した以外は、参考例2と同様にして剥離フィルムを作製し、その性能を評価した。結果を第1表に示す。
ステアリル変性アルキド樹脂とメチル化メラミンとの混合物[日立化成ポリマー社製、商品名「テスファイン303」]100質量部及びp−トルエンスルホン酸3質量部をトルエンに加え、固形分濃度2質量部の塗工液IIを調製して塗布し、140℃で1分間乾燥して剥離剤層を形成した。
実施例5
実施例4において、帯電防止層の厚さを0.1μmとした以外は、実施例4と同様にして剥離フィルムを作製し、その性能を評価した。結果を第1表に示す。
比較例3
参考例1における塗工液Iの調製において、導電性高分子水溶液を用いず、かつカーボンナノファイバーを、全固形分(帯電防止層)中の含有量が10質量%になるように用いた以外は、参考例1と同様にして剥離フィルムを作製し、その性能を評価した。結果を第1表に示す。
比較例1
参考例1において、帯電防止層を形成しなかったこと以外は、参考例1と同様にして剥離フィルムを作製し、その性能を評価した。結果を第1表に示す。
比較例2
実施例4において、帯電防止層を形成しなかったこと以外は、実施例4と同様にして剥離フィルムを作製し、その性能を評価した。結果を第1表に示す。
Reference example 1
Contains 75 parts by mass of an acrylic monomer containing dipentaerythritol hexaacrylate, pentaerythritol hexaacrylate and N-vinylpyrrolidone in a mass ratio of 45:20:10, 20 parts by mass of butyl acetate and 30 parts by mass of isopropanol. 125 parts by mass of solution, 15.5 parts by mass of an aqueous solution containing a conductive polymer of polyethylene dioxythiophene polystyrene sulfonate (PEDT / PSS) at a ratio of 1.3% by mass, photoinitiation of α-hydroxycyclohexylphenylmethanone 0.2 parts by mass of the agent was mixed. Further, a photocurable resin composition diluted with isopropanol was prepared so that the total amount of the acrylic monomer and the conductive polymer was 1% by mass.
Carbon nanofibers having an average diameter of 15 nm and an average length of 1 μm (trade name “CNF-T”, tube shape, 3% by mass isopropanol dispersion type) with an average diameter of 15 nm and an average length of the above photocurable resin composition were added to the total solid content ( The coating solution I was prepared by adding so that the content in the antistatic layer was 1% by mass.
Next, the coating liquid I is 0.05 μm in thickness after drying on a polyethylene terephthalate (PET) film [Mitsubishi Chemical Polyester Film Co., Ltd., trade name “T-100”] having a thickness of 38 μm. So that it was evenly coated with a Meyer bar. Next, it was heated for 1 minute in a dryer at 55 ° C, and immediately irradiated with ultraviolet light at a conveyor speed of 10 m / min. did.
On the other hand, 100 parts by mass of thermosetting silicone [manufactured by Shin-Etsu Chemical Co., Ltd., trade name “KS-847H”] and 1 part by mass of a curing agent [manufactured by Shin-Etsu Chemical Co., Ltd., trade name “CAT-PL-50T”] were diluted with toluene. A coating liquid II having a solid content of 1.1% by mass was prepared.
Next, this coating solution II was uniformly applied to the back surface of the PET film provided with the antistatic layer so that the thickness after drying was 0.1 μm, and the coating solution was dried at 130 ° C. for 1 minute. A release agent layer was formed by drying to produce a release film.
The performance of this release film is shown in Table 1.
Reference example 2
As a photocurable resin composition, a conductive polymer aqueous solution (PEDT / PSS), a photoinitiator (α-hydroxycyclohexylphenylmethanone), a solution containing an acrylic oligomer and a monomer (dipentaerythritol hexaacrylate, pentaerythritol) Hexaacrylate, N-vinylpyrrolidone), a photo-curing coating agent [trade name “EL Coat 515” manufactured by Idemitsu Technofine Co., Ltd.] consisting of ethylene glycol monoethyl ether and isopropanol which dissolves them to 1% by mass with isopropanol. A release film was produced in the same manner as in Reference Example 1 except that the diluted one was used.
The performance of this release film is shown in Table 1.
Reference example 3
A release film was prepared in the same manner as in Reference Example 2 except that the thickness of the antistatic layer was changed to 0.1 μm in Reference Example 2, and its performance was evaluated. The results are shown in Table 1.
Example 4
In Reference Example 2, a release film was prepared in the same manner as in Reference Example 2 except that the release agent layer was formed as described below, and its performance was evaluated. The results are shown in Table 1.
A mixture of stearyl-modified alkyd resin and methylated melamine [manufactured by Hitachi Chemical Co., Ltd., trade name “Tesfine 303”] and 3 parts by mass of p-toluenesulfonic acid were added to toluene, and the solid content concentration was 2 parts by mass. Coating liquid II was prepared and applied, and dried at 140 ° C. for 1 minute to form a release agent layer.
Example 5
In Example 4, a release film was produced in the same manner as in Example 4 except that the thickness of the antistatic layer was changed to 0.1 μm, and its performance was evaluated. The results are shown in Table 1.
Comparative Example 3
In the preparation of the coating liquid I in Reference Example 1, a conductive polymer aqueous solution was not used, and carbon nanofibers were used so that the content in the total solid content (antistatic layer) was 10% by mass. Produced a release film in the same manner as in Reference Example 1 and evaluated its performance. The results are shown in Table 1.
Comparative Example 1
In Reference Example 1, a release film was prepared in the same manner as in Reference Example 1 except that the antistatic layer was not formed, and its performance was evaluated. The results are shown in Table 1.
Comparative Example 2
In Example 4, a release film was produced in the same manner as in Example 4 except that the antistatic layer was not formed, and the performance was evaluated. The results are shown in Table 1.
本発明の剥離フィルムは、基材フィルムの一方の面に剥離剤層を有し、かつその背面に帯電防止層を有する優れた帯電防止機能と剥離機能を兼ね備えており、例えばポリウレタン樹脂、ポリアクリル樹脂、ポリ塩化ビニル樹脂などのキャスト製膜用工程フィルム、積層セラミックコンデンサのグリーンシート成形用工程フィルム、あるいは粘着製品における粘着剤の保護フィルムなどとして、好適に用いられる。 The release film of the present invention has a release agent layer on one side of a base film and an antistatic layer having an antistatic layer on the back side, and has an excellent antistatic function and a release function. It is suitably used as a process film for cast film formation such as a resin or a polyvinyl chloride resin, a process film for green sheet molding of a multilayer ceramic capacitor, or a protective film for an adhesive in an adhesive product.
Claims (5)
The surface resistivity of the antistatic layer, the production method of the release film according to any one of claims 1-4 is 10 10 Ω / □ or less.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006008878A JP4695513B2 (en) | 2006-01-17 | 2006-01-17 | Process for producing release film |
US11/653,049 US7947361B2 (en) | 2006-01-17 | 2007-01-12 | Release film and process for producing the film |
KR1020070004061A KR101393232B1 (en) | 2006-01-17 | 2007-01-15 | Release film and process for producing the film |
TW96101531A TWI437074B (en) | 2006-01-17 | 2007-01-16 | Release film and process for producing the film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006008878A JP4695513B2 (en) | 2006-01-17 | 2006-01-17 | Process for producing release film |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007190716A JP2007190716A (en) | 2007-08-02 |
JP4695513B2 true JP4695513B2 (en) | 2011-06-08 |
Family
ID=38446783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006008878A Active JP4695513B2 (en) | 2006-01-17 | 2006-01-17 | Process for producing release film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4695513B2 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009022714A1 (en) * | 2007-08-13 | 2009-02-19 | Parker Corporation | Resin molded body |
JP5254698B2 (en) * | 2007-10-04 | 2013-08-07 | ユニチカ株式会社 | Release sheet |
JP5128334B2 (en) * | 2008-03-25 | 2013-01-23 | リンテック株式会社 | Method for producing release film and green sheet |
JP5702047B2 (en) * | 2008-10-23 | 2015-04-15 | 富士フイルム株式会社 | Radiation conversion sheet and radiation image detector |
KR101644652B1 (en) | 2009-03-10 | 2016-08-01 | 아라까와 가가꾸 고교 가부시끼가이샤 | Conductive composition, conductive film and their producing methods |
KR101427617B1 (en) * | 2009-11-06 | 2014-08-07 | 미쓰비시 쥬시 가부시끼가이샤 | Double-sided pressure-sensitive adhesive sheet with release sheets |
JP5554120B2 (en) * | 2010-03-31 | 2014-07-23 | リンテック株式会社 | Release film |
DE102010025938A1 (en) * | 2010-07-02 | 2012-01-05 | Huhtamaki Forchheim Zweigniederlassung Der Huhtamaki Deutschland Gmbh & Co. Kg | Release film with permanent antistatic effect |
CN104661816A (en) * | 2012-10-15 | 2015-05-27 | 尤尼吉可株式会社 | Anti-static film |
JP6586375B2 (en) * | 2016-02-17 | 2019-10-02 | リンテック株式会社 | Peeling film for ceramic green sheet manufacturing process and manufacturing method thereof |
JP6565799B2 (en) * | 2016-06-13 | 2019-08-28 | 三菱ケミカル株式会社 | Film for photosensitive resin substrate |
WO2018037991A1 (en) * | 2016-08-25 | 2018-03-01 | 東レフィルム加工株式会社 | Mold-releasing film |
JP6725032B2 (en) * | 2019-04-12 | 2020-07-15 | 三菱ケミカル株式会社 | Polyester film for photosensitive resin substrate |
KR20240075124A (en) | 2022-11-21 | 2024-05-29 | 삼성전기주식회사 | Sheet for manufacturing electronic components |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH106459A (en) * | 1996-06-25 | 1998-01-13 | Toyobo Co Ltd | Release film |
JPH106443A (en) * | 1996-06-26 | 1998-01-13 | Mitsubishi Materials Corp | Carrier film for molding ceramics green sheet |
JP2003145685A (en) * | 2001-11-07 | 2003-05-20 | Toyobo Co Ltd | Release film roll for manufacturing thin ceramic sheet |
JP2005153250A (en) * | 2003-11-25 | 2005-06-16 | Lintec Corp | Mold release film having antistatic properties and its manufacturing method |
JP2005336341A (en) * | 2004-05-27 | 2005-12-08 | Mitsubishi Rayon Co Ltd | Composition containing carbon nanotube, composite material having coating film made thereof and method for producing the same |
-
2006
- 2006-01-17 JP JP2006008878A patent/JP4695513B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH106459A (en) * | 1996-06-25 | 1998-01-13 | Toyobo Co Ltd | Release film |
JPH106443A (en) * | 1996-06-26 | 1998-01-13 | Mitsubishi Materials Corp | Carrier film for molding ceramics green sheet |
JP2003145685A (en) * | 2001-11-07 | 2003-05-20 | Toyobo Co Ltd | Release film roll for manufacturing thin ceramic sheet |
JP2005153250A (en) * | 2003-11-25 | 2005-06-16 | Lintec Corp | Mold release film having antistatic properties and its manufacturing method |
JP2005336341A (en) * | 2004-05-27 | 2005-12-08 | Mitsubishi Rayon Co Ltd | Composition containing carbon nanotube, composite material having coating film made thereof and method for producing the same |
Also Published As
Publication number | Publication date |
---|---|
JP2007190716A (en) | 2007-08-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4695513B2 (en) | Process for producing release film | |
KR101393232B1 (en) | Release film and process for producing the film | |
JP4721914B2 (en) | Process for producing release film | |
WO2017098956A1 (en) | Release film for ceramic green sheet production process | |
JP5842309B2 (en) | Release agent composition, release sheet and adhesive | |
WO2016158592A1 (en) | Releasing film for ceramic green sheet production step | |
JP2010105384A (en) | Release film, ceramic component sheet, method of manufacturing them, and method of manufacturing ceramic component | |
WO2014141571A1 (en) | Release film for green sheet manufacturing, and method for manufacturing release film for green sheet manufacturing | |
JP6586376B2 (en) | Peeling film for ceramic green sheet manufacturing process and manufacturing method thereof | |
KR20180020945A (en) | Release film for ceramic green sheet production process | |
JP2019166706A (en) | Release film for ceramic green sheet production process | |
JP2024009900A (en) | release film | |
JP6950760B2 (en) | Release film for manufacturing ceramic green sheets | |
JP5531712B2 (en) | Release film and method for producing the same | |
JP2018130877A (en) | Release film for transferring photosensitive resin layer, roll-like article of the same, photosensitive resin layer-laminated film, and roll-like article of the same | |
JP5128334B2 (en) | Method for producing release film and green sheet | |
TWI462121B (en) | Zinc oxide conductive laminate and manufacturing method thereof | |
KR20170096966A (en) | Release film for ceramic green sheet manufacturing process and method for manufacturing the same | |
JP5554120B2 (en) | Release film | |
JP4890778B2 (en) | Process film for manufacturing laminated circuit boards | |
JP2007106856A (en) | Peeling agent composition and peelable sheet | |
JP2018161829A (en) | Release film for photosensitive conductive layer transfer | |
JP2006281488A (en) | Process film for manufacturing laminated circuit board | |
JP2018058270A (en) | Laminated polyester film | |
JPWO2018163924A1 (en) | Release film for green sheet formation |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20081023 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20101014 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101022 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101221 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110208 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110225 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140304 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4695513 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |