JP4691623B2 - Circuit board inspection method and apparatus - Google Patents

Circuit board inspection method and apparatus Download PDF

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JP4691623B2
JP4691623B2 JP26633999A JP26633999A JP4691623B2 JP 4691623 B2 JP4691623 B2 JP 4691623B2 JP 26633999 A JP26633999 A JP 26633999A JP 26633999 A JP26633999 A JP 26633999A JP 4691623 B2 JP4691623 B2 JP 4691623B2
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Prior art keywords
integrated circuit
circuit board
electric field
stage
magnetic pole
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JP2001091560A (en
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砂土詩 椚
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アヅサテック株式会社
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【0001】
【発明の属する技術分野】
本発明は、回路基板の検査方法及び装置、特に回路基板の検査部分に非接触で電流を供給し、この回路基板への集積回路の接続状態を検査できるようにした回路基板の検査方法及び装置に関するものである。
【0002】
【従来の技術】
プリント基板などの回路基板にICやLSIなどの集積回路を実装するに当たっては、これらの集積回路が正しくプリント基板の回路パターンにハンダ付けなどによって接続されたか否かを検査する必要があり、そのために集積回路を実装した後に回路基板の検査が行なわれる。このような回路基板の検査技術の従来例としては、例えば図3に示すようなものがある。この従来例においては、集積回路1が実装されたプリント基板2の回路パターンのうち、上記集積回路1の入力側に導通する入力側回路パターン3に検査用の電流を供給する電源装置4を接続する一方、集積回路1の出力側に導通する出力側回路パターン5にセンサー6を接続し、電源装置4から所定の電流を供給して、出力側のセンサー6が電気出力を検知するか否かを調べ、センサー6が作動すれば、集積回路1の実装(接続)は正しく行なわれている一方、センサー6が作動しなければ、集積回路1とプリント基板2との接続には欠陥があると判断している。なお、プリント基板2の入力側回路パターン3への電源装置4の接続、或いは出力側回路パターン5へのセンサー6の接続は検査装置の駆動機構を使って行なわれる。
【0003】
【発明が解決しようとする課題】
しかしながら、上記従来の回路基板の検査方法においては、集積回路1の入力側において電源装置4の端子をプリント基板2の入力側回路パターン3に接続し、なお且つセンサー6の端子をプリント基板2の出力側回路パターン5に接続しなければならないうえ、それぞれの端子とパターン3、5との接続は正確に行なわなければ電流の入力に対して、集積回路1の出力は得られないから、操作の上でのミス、或いは動作のズレによって誤った検査結果が現れるという不具合があった。また、実装した集積回路1に対して外部から電流を供給するから、何らかの原因で電源装置4から過大な電流が集積回路1に供給されることがあり、もし電源装置4が過大な電流を集積回路1に供給した場合、その過大電流のために集積回路1は破壊されるという虞もあった。
【0004】
本発明は、上記従来の問題点に鑑みてなされたもので、その第1の目的は、被検査回路基板のパターンと、検査する側の各種構成要素の端子との接続個所を出来る限り減らして、回路基板の検査における接続操作上の確実性を向上させることである。
【0005】
本発明の第2の目的は、実装された集積回路自らが電流を発生するようにし、外部からの過大な電流により集積回路が損傷を受けないようにすることである。
【0006】
【課題を解決するための手段】
本発明は上記目的を達成するため、回路基板の検査方法として、プリント基板に実装された集積回路を磁界または電界の中に配置し、この集積回路を磁界または電界の方向に対して交差する方向へ移動させ、或いは集積回路は移動させないで磁界または電界の方向を切り替えことにより、前記集積回路に起電力を発生させ、この起電力を集積回路に導通するプリント基板の端子に接続されたセンサーにより検知して集積回路のプリント基板への接続状態を検出するようにしたことを要旨とするものである。
【0007】
また、本発明は、回路基板の検査装置として、所定の間隔をあけて配置された二つの磁極部材を有しこれらの磁極部材間に磁界を発生させる磁界発生手段と、この磁界発生手段の二つの磁極部材間に、磁界の方向に対して交差する方向へ移動可能なステージと、このステージを移動させる駆動部材と、集積回路に導通するプリント基板の端子に接続されたセンサーとにより構成したことを要旨とする。そして、この構成により前記駆動部材によりステージを移動させて前記集積回路に起電力を発生させ、この起電力を前記センサーにより検知して集積回路のプリント基板への接続状態を検出するようにしたことを要旨とするものである。またかかる磁界を発生させる検査装置と同様な構成を持ち、電界を発生させて回路検査を行なう回路基板検査装置としてもよい。
【0008】
また、ステージは移動させないで固定しておき、磁極発生手段または電極発生手段の前記二つの極部材間の極性を交互に切り替える極切替え部材を設け、前記極切替え部材により二つの極部材間の磁極または電極を交互に切り替えることにより前記集積回路に起電力を発生させ、この起電力を前記センサーにより検知して集積回路のプリント基板への接続状態を検出するようにしてもよい。
【0009】
さらに本発明では、所定の電気回路により電界を発生させ、この電界の中に集積回路を実装したプリント基板を移動可能に設置し、上記集積回路を電界の中で移動させたり、或いは集積回路を電界の中に固定設置して電界の方向を切り替えることにより集積回路に起電力を生成するようにしたことを要旨とする。
【0010】
【発明の実施の形態】
(実施の形態1)
図1は本発明の第1の実施の形態に係る回路基板の検査装置の概略構成を示す斜視図である。この実施の形態に係る検査装置は、所定の間隔をあけて配置された二つの磁極部材11、12と、これらの磁極部材11、12間に磁界を発生させる磁界発生手段としての電磁石13と、上記二つの磁極部材11、12間に配置されたステージ14とから構成されている。この実施の形態において、二つの磁極部材11、12のうち上側の磁極部材11はN極用の磁極部材であり、また下側の磁極部材12はS極用の磁極部材である。そして、電磁石13はこれらの磁極部材11、12に決められた磁極を生じさせるためにそれぞれコイル15、16が巻かれ、これらのコイル15、16には直流の電源装置17が接続されている。ステージ14は、磁極部材11、12間において、磁界または電界の方向に対して交差する方向へ移動可能に配置されている。そのために、ステージ14は、例えば図1中矢印Aの方向へ延びたレール18の上に載置され、このレール18に沿って移動できるようになっている。さらにステージ14には、このステージ14を移動させるべく駆動するステージ駆動部材19に作動連結されている。そしてステージ駆動部材19を動作させることによりステージ14が矢印Aの方向へ往復移動(運動)するようになっている。ステージ14の上には集積回路20を実装した、被検査電気回路であるプリント基板21が載置され、このプリント基板21の、集積回路20に導通する端子(パターン)にはセンサー22が接続される。
【0011】
かかる構成を有する回路基板の検査装置の動作について以下説明する。まず、集積回路20を実装したプリント基板21を回路基板検査装置のステージ14の上に載置する。そして、電源装置17に電流を導通することにより上側磁極部材11にN極を生成させるとともに、下側磁極部材12にS極を生成させる。次に、ステージ駆動部材19によりステージ14をレール18に沿って往復移動させる。集積回路20が上側磁極部材11と下側磁極部材12との間に発生した磁界の中をこの磁界の方向に対してほぼ直交する方向(交差する方向)へ移動することにより、当該集積回路20にはフレミングの法則(右手の法則)による起電力が生じる。したがって、上記集積回路20に発生した起電力をセンサー22により検知して集積回路20のプリント基板21への接続状態を検出する。
【0012】
このようにして、集積回路20とプリント基板21のパターン間における接続状況を検査すれば、集積回路20に外部から電流を供給するのではなく、集積回路20自身により生成された電流を使用するため、電流供給のための集積回路20への端子接続が不要になって操作がし易いのみならず、検査のための回路構成がより簡潔になる。また、外部から過大な電流が集積回路20に供給されて集積回路20を破損するといった不都合も起こらない。
【0013】
(実施の形態2)
図2は本発明の第2の実施の形態に係る回路基板の検査装置の概略構成を示す斜視図である。この実施の形態に係る検査装置は、基本的には上記第1の実施の形態に係る検査装置と同様な構成を有する。そして、第1の実施の形態に係る検査装置と異なる点は、ステージ14が可動ではなくて固定されている点と、二つの磁極部材11、12はN極用、S極用と固定的に決められているのではなくて、二つの磁極部材11、12間でN極、S極を交互に、且つ互いに反対の磁極になるように設定されていることである。このようなN極、S極を交互に発生させるために、コイル15、16には直流電源装置17の代わりに交流電源装置25が接続されている。
【0014】
この実施の形態における動作では、集積回路20を実装したプリント基板21を固定されたステージ14の上に載置する。そして、AC電源装置25に電流を導通することにより上側磁極部材11および下側磁極部材12にN極およびS極を交互に、且つ互いに反対の磁極になるように生成させる。このように上側磁極部材11および下側磁極部材12にN極およびS極を交互に生成することにより、集積回路20にとっては互いに反対方向へ磁力線が延びる磁界が短い時間間隔で交互に発生することになり、見かけ上、集積回路20が上側磁極部材11と下側磁極部材12との間に発生した一定の磁界の中をこの磁界の方向に対してほぼ直交する方向(交差する方向)へ移動するのと同じ状況になる。これにより、当該集積回路20にはフレミングの法則(右手の法則)による起電力が生じる。したがって、上記集積回路20に発生した起電力をセンサー22により検知して集積回路20のプリント基板21への接続状態を検出する。
【0015】
このようにして、集積回路20とプリント基板21のパターン間における接続状況を検査すれば、集積回路20に外部から電流を供給するのではなく、集積回路20自身により生成された電流を使用するため、電流供給のための集積回路20への端子接続が不要になって操作がし易いのみならず、検査のための回路構成がより簡潔になる。また、外部から過大な電流が集積回路20に供給されて集積回路20を破損するといった不都合も起こらない。
【0016】
なお、上記第1および第2の実施の形態においては、電磁石13により磁界を発生させる方式を採用して集積回路20に起電力を生成させているが、これとは異なり、上記対になった磁極を電極の対に置き換え、所定の電気回路により電極間に電界を発生させ、この電界の中に集積回路20を実装したプリント基板21を移動可能に設置し、上記集積回路20を電界の中で移動させたり、或いは集積回路20を電界の中に固定設置して電界の方向を切り替えることにより集積回路20に起電力を発生させるようにしてもよい。このような構成および作用、効果は上述した第1および第2の実施の形態とほぼ同様な形態で行なうことができるものである。
【0017】
さらに別の態様として、上記磁極等の代わりに被検査回路を組み込んだ熱電対を構成し、集積回路または集積回路以外の接合点に所定の熱を加えることによって熱起電力を発生させ、この熱起電力を測定することにより集積回路がプリント基板に正しく接続されているか否かを判定するようにしてもよい。
【0018】
また、磁極、電極或いは熱電対のいずれを使用する場合においても、上記実施の形態で述べた集積回路のプリント基板への接続状態のみならず、プリント基板そのものの配線パターンの良否、さらにはリード線の接続の良否を判定することもできる。
【0019】
【発明の効果】
以上説明したように、本発明によれば、プリント基板に実装された集積回路を磁界または電界の中に配置し、この集積回路を磁界または電界の方向に対して交差する方向へ移動させ、或いは集積回路は移動させないで磁界または電界の方向を切り替えことにより、前記集積回路に起電力を発生させ、この起電力を集積回路に導通するプリント基板の端子に接続されたセンサーにより検知して集積回路のプリント基板への接続状態や、各種回路の接続の良否を検出するようにしたため、電流供給のための集積回路への端子接続が不要になって操作がし易いのみならず、検査のための回路構成がより簡潔になる。また、外部から過大な電流が集積回路に供給されて集積回路を破損するといった不都合も起こらないという効果が得られる。
【0020】
また、所定の電気回路により電界を発生させ、この電界の中に集積回路を実装したプリント基板を移動可能に設置し、上記集積回路を電界の中で移動させたり、或いは集積回路を電界の中に固定設置して電界の方向を切り替えることにより集積回路に起電力を生成するようにし、同様な検査を行なうこともできる。
【0021】
また熱電対を用いて集積回路のプリント基板への接続状態や、各種回路の接続の良否を検出することもできる。
【図面の簡単な説明】
【図1】本発明を具体化した実施の形態1の回路基板の検査装置の斜視図である。
【図2】本発明を具体化した実施の形態2の回路基板の検査装置の斜視図である。
【図3】従来の回路基板の検査装置の一例を示す平面図である。
【符号の説明】
11 (上側)磁極部材
12 (下側)磁極部材
13 電磁石
14 ステージ
15、16 コイル
17 DC電源装置
18 レール
19 駆動部材
20 集積回路
21 プリント基板
22 センサー
23 パターン
25 AC電源装置
[0001]
BACKGROUND OF THE INVENTION
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board inspection method and apparatus, and more particularly to a circuit board inspection method and apparatus for supplying a current in a non-contact manner to a circuit board inspection portion and inspecting the connection state of an integrated circuit to the circuit board. It is about.
[0002]
[Prior art]
When mounting an integrated circuit such as an IC or LSI on a circuit board such as a printed circuit board, it is necessary to inspect whether or not these integrated circuits are correctly connected to the circuit pattern of the printed circuit board by soldering or the like. After the integrated circuit is mounted, the circuit board is inspected. A conventional example of such a circuit board inspection technique is shown in FIG. In this conventional example, among the circuit patterns of the printed circuit board 2 on which the integrated circuit 1 is mounted, the power supply device 4 that supplies the inspection current is connected to the input side circuit pattern 3 that is conducted to the input side of the integrated circuit 1. On the other hand, whether or not the sensor 6 on the output side detects an electrical output by connecting the sensor 6 to the output side circuit pattern 5 that is conducted to the output side of the integrated circuit 1 and supplying a predetermined current from the power supply device 4. If the sensor 6 operates, the integrated circuit 1 is correctly mounted (connected), but if the sensor 6 does not operate, the connection between the integrated circuit 1 and the printed circuit board 2 is defective. Deciding. The connection of the power supply device 4 to the input side circuit pattern 3 of the printed circuit board 2 or the connection of the sensor 6 to the output side circuit pattern 5 is performed using a driving mechanism of the inspection device.
[0003]
[Problems to be solved by the invention]
However, in the above conventional circuit board inspection method, the terminal of the power supply device 4 is connected to the input side circuit pattern 3 of the printed circuit board 2 on the input side of the integrated circuit 1 and the terminal of the sensor 6 is connected to the printed circuit board 2. Since it must be connected to the output side circuit pattern 5 and the connection between each terminal and the patterns 3 and 5 must be made accurately, the output of the integrated circuit 1 cannot be obtained for the current input. There is a problem that an erroneous inspection result appears due to an error in the above or a deviation in operation. Further, since a current is supplied from the outside to the integrated circuit 1 mounted, an excessive current may be supplied to the integrated circuit 1 from the power supply device 4 for some reason. If the power supply device 4 integrates an excessive current. When supplied to the circuit 1, the integrated circuit 1 may be destroyed due to the excessive current.
[0004]
The present invention has been made in view of the above-described conventional problems. The first object of the present invention is to reduce the number of connection points between the circuit board pattern to be inspected and the terminals of various components on the inspection side as much as possible. It is to improve the reliability of the connection operation in the inspection of the circuit board.
[0005]
A second object of the present invention is to make the mounted integrated circuit itself generate a current, and to prevent the integrated circuit from being damaged by an excessive current from the outside.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a method for inspecting a circuit board, in which an integrated circuit mounted on a printed circuit board is placed in a magnetic field or electric field, and the integrated circuit intersects the direction of the magnetic field or electric field. By switching the direction of the magnetic field or electric field without moving the integrated circuit, the electromotive force is generated in the integrated circuit, and this electromotive force is generated by a sensor connected to the terminal of the printed circuit board that is conducted to the integrated circuit. The gist is that the connection state of the integrated circuit to the printed circuit board is detected.
[0007]
Further, the present invention provides, as a circuit board inspection apparatus, a magnetic field generating means that has two magnetic pole members arranged at a predetermined interval and generates a magnetic field between these magnetic pole members, and two magnetic field generating means. A stage that can move between two magnetic pole members in a direction that intersects the direction of the magnetic field, a drive member that moves the stage, and a sensor that is connected to the terminal of the printed circuit board that is connected to the integrated circuit Is the gist. With this configuration, the stage is moved by the driving member to generate an electromotive force in the integrated circuit, and the electromotive force is detected by the sensor to detect the connection state of the integrated circuit to the printed circuit board. Is a summary. Moreover, it is good also as a circuit board test | inspection apparatus which has the structure similar to the test | inspection apparatus which generate | occur | produces this magnetic field, and performs a circuit test | inspection by generating an electric field.
[0008]
Further, the stage is fixed without being moved, and a pole switching member for alternately switching the polarity between the two pole members of the magnetic pole generating means or the electrode generating means is provided, and the magnetic pole between the two pole members is provided by the pole switching member. Alternatively, an electromotive force may be generated in the integrated circuit by alternately switching electrodes, and the electromotive force may be detected by the sensor to detect the connection state of the integrated circuit to the printed circuit board.
[0009]
Further, in the present invention, an electric field is generated by a predetermined electric circuit, and a printed circuit board on which the integrated circuit is mounted is movably installed in the electric field, and the integrated circuit is moved in the electric field, or the integrated circuit is The gist is that an electromotive force is generated in an integrated circuit by switching the direction of the electric field fixedly installed in the electric field.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
(Embodiment 1)
FIG. 1 is a perspective view showing a schematic configuration of a circuit board inspection apparatus according to a first embodiment of the present invention. The inspection apparatus according to this embodiment includes two magnetic pole members 11 and 12 arranged at a predetermined interval, an electromagnet 13 as a magnetic field generating means for generating a magnetic field between the magnetic pole members 11 and 12, The stage 14 is disposed between the two magnetic pole members 11 and 12. In this embodiment, of the two magnetic pole members 11 and 12, the upper magnetic pole member 11 is a magnetic pole member for N pole, and the lower magnetic pole member 12 is a magnetic pole member for S pole. The electromagnet 13 has coils 15 and 16 wound around the magnetic pole members 11 and 12 to generate the determined magnetic poles, respectively, and a DC power supply device 17 is connected to the coils 15 and 16. The stage 14 is disposed between the magnetic pole members 11 and 12 so as to be movable in a direction intersecting the direction of the magnetic field or electric field. For this purpose, the stage 14 is placed on, for example, a rail 18 extending in the direction of arrow A in FIG. 1 and can move along the rail 18. Further, the stage 14 is operatively connected to a stage driving member 19 that drives the stage 14 to move. The stage 14 is reciprocated (moved) in the direction of arrow A by operating the stage drive member 19. A printed circuit board 21, which is an electric circuit to be inspected, on which an integrated circuit 20 is mounted is mounted on the stage 14, and a sensor 22 is connected to a terminal (pattern) that is connected to the integrated circuit 20 of the printed circuit board 21. The
[0011]
The operation of the circuit board inspection apparatus having such a configuration will be described below. First, the printed circuit board 21 on which the integrated circuit 20 is mounted is placed on the stage 14 of the circuit board inspection apparatus. Then, the current is passed through the power supply device 17 to cause the upper magnetic pole member 11 to generate an N pole and to cause the lower magnetic pole member 12 to generate an S pole. Next, the stage 14 is reciprocated along the rail 18 by the stage driving member 19. By moving the integrated circuit 20 in the magnetic field generated between the upper magnetic pole member 11 and the lower magnetic pole member 12 in a direction substantially perpendicular to (intersecting with) the direction of the magnetic field, the integrated circuit 20 Generates an electromotive force according to Fleming's law (right-hand rule). Therefore, the electromotive force generated in the integrated circuit 20 is detected by the sensor 22 to detect the connection state of the integrated circuit 20 to the printed board 21.
[0012]
In this way, if the connection state between the pattern of the integrated circuit 20 and the printed circuit board 21 is inspected, the current generated by the integrated circuit 20 itself is used instead of supplying current to the integrated circuit 20 from the outside. The terminal connection to the integrated circuit 20 for supplying current is not necessary and the operation is easy, and the circuit configuration for inspection becomes simpler. Further, there is no inconvenience that an excessive current is supplied to the integrated circuit 20 from the outside and the integrated circuit 20 is damaged.
[0013]
(Embodiment 2)
FIG. 2 is a perspective view showing a schematic configuration of a circuit board inspection apparatus according to the second embodiment of the present invention. The inspection apparatus according to this embodiment basically has the same configuration as the inspection apparatus according to the first embodiment. The difference from the inspection apparatus according to the first embodiment is that the stage 14 is not movable and is fixed, and the two magnetic pole members 11 and 12 are fixed for the N pole and the S pole. Rather than being determined, the N and S poles are set alternately between the two magnetic pole members 11 and 12 so as to be opposite to each other. In order to alternately generate such N poles and S poles, an AC power supply device 25 is connected to the coils 15 and 16 instead of the DC power supply device 17.
[0014]
In the operation in this embodiment, the printed circuit board 21 on which the integrated circuit 20 is mounted is placed on the fixed stage 14. Then, current is passed through the AC power supply device 25 to cause the upper magnetic pole member 11 and the lower magnetic pole member 12 to generate N poles and S poles alternately and opposite to each other. In this way, by alternately generating the N pole and the S pole in the upper magnetic pole member 11 and the lower magnetic pole member 12, the magnetic field in which the magnetic field lines extend in opposite directions to each other is generated alternately in a short time interval for the integrated circuit 20. Apparently, the integrated circuit 20 moves in a certain magnetic field generated between the upper magnetic pole member 11 and the lower magnetic pole member 12 in a direction substantially perpendicular to the direction of the magnetic field (crossing direction). It becomes the same situation as you do. As a result, an electromotive force is generated in the integrated circuit 20 according to Fleming's law (right-hand law). Therefore, the electromotive force generated in the integrated circuit 20 is detected by the sensor 22 to detect the connection state of the integrated circuit 20 to the printed board 21.
[0015]
In this way, if the connection state between the pattern of the integrated circuit 20 and the printed circuit board 21 is inspected, the current generated by the integrated circuit 20 itself is used instead of supplying current to the integrated circuit 20 from the outside. The terminal connection to the integrated circuit 20 for supplying current is not necessary and the operation is easy, and the circuit configuration for inspection becomes simpler. Further, there is no inconvenience that an excessive current is supplied to the integrated circuit 20 from the outside and the integrated circuit 20 is damaged.
[0016]
In the first and second embodiments, an electromotive force is generated in the integrated circuit 20 by adopting a method in which a magnetic field is generated by the electromagnet 13. The magnetic poles are replaced with electrode pairs, an electric field is generated between the electrodes by a predetermined electric circuit, and the printed circuit board 21 on which the integrated circuit 20 is mounted is movably installed in the electric field. Alternatively, the integrated circuit 20 may be fixed in the electric field and the direction of the electric field may be switched to generate an electromotive force in the integrated circuit 20. Such a configuration, operation, and effect can be performed in substantially the same manner as the first and second embodiments described above.
[0017]
As yet another aspect, a thermocouple in which a circuit to be inspected is incorporated instead of the magnetic pole or the like, and a thermoelectromotive force is generated by applying a predetermined heat to an integrated circuit or a junction other than the integrated circuit. You may make it determine whether an integrated circuit is correctly connected to the printed circuit board by measuring an electromotive force.
[0018]
In addition, when using any of magnetic poles, electrodes or thermocouples, not only the state of connection of the integrated circuit to the printed circuit board described in the above embodiment, but also the quality of the wiring pattern of the printed circuit board itself, and further the lead wire It is also possible to determine whether or not the connection is good.
[0019]
【The invention's effect】
As described above, according to the present invention, an integrated circuit mounted on a printed circuit board is placed in a magnetic field or electric field, and the integrated circuit is moved in a direction crossing the direction of the magnetic field or electric field, or An integrated circuit generates an electromotive force in the integrated circuit by switching the direction of a magnetic field or an electric field without moving the integrated circuit, and the electromotive force is detected by a sensor connected to a terminal of a printed circuit board that is conducted to the integrated circuit. The connection status to the printed circuit board and the quality of various circuit connections are detected, which eliminates the need for terminal connection to the integrated circuit for supplying current and facilitates operation, as well as for inspection. The circuit configuration becomes simpler. Further, there is an effect that an inconvenience that an excessive current is supplied to the integrated circuit from the outside and the integrated circuit is damaged does not occur.
[0020]
In addition, an electric field is generated by a predetermined electric circuit, and a printed circuit board on which the integrated circuit is mounted is movably installed in the electric field, and the integrated circuit is moved in the electric field, or the integrated circuit is moved in the electric field. A similar test can be performed by generating an electromotive force in the integrated circuit by switching the direction of the electric field by fixedly installing to the circuit.
[0021]
Further, it is possible to detect the connection state of the integrated circuit to the printed circuit board and the connection of various circuits using a thermocouple.
[Brief description of the drawings]
FIG. 1 is a perspective view of a circuit board inspection apparatus according to a first embodiment of the present invention.
FIG. 2 is a perspective view of a circuit board inspection apparatus according to a second embodiment of the present invention.
FIG. 3 is a plan view showing an example of a conventional circuit board inspection apparatus.
[Explanation of symbols]
11 (Upper) Magnetic pole member 12 (Lower) Magnetic pole member 13 Electromagnet 14 Stages 15 and 16 Coil 17 DC power supply 18 Rail 19 Driving member 20 Integrated circuit 21 Printed circuit board 22 Sensor 23 Pattern 25 AC power supply

Claims (1)

所定の間隔をあけて配置された二つの電極部材を有しこれらの電極部材間に電界を発生させる電界発生手段と、この電界発生手段の二つの電極部材間に、電界の方向に対して交差する方向へ移動可能に配置され、集積回路が実装されたプリント基板を支持する被測定物支持用のステージと、このステージを前記電界の方向に対して交差する方向へ移動させる駆動部材と、集積回路に導通するプリント基板の端子に接続されたセンサーとを備え、前記駆動部材によりステージを移動させることにより前記集積回路に電圧を発生させ、この電圧を前記センサーにより検知して集積回路のプリント基板への接続状態を検出するようにしたことを特徴とする回路基板の検査装置。An electric field generating means having two electrode members arranged at a predetermined interval and generating an electric field between these electrode members, and an electric field direction between the two electrode members of the electric field generating means. movably disposed in the direction of the stage for the measured object support for supporting the printed circuit board Integrated circuit is mounted, and a drive member for moving in a direction intersecting the stage with respect to the direction of the field, and a sensors connected to terminals of the printed circuit board to be electrically connected to the integrated circuit, the voltage is generated on the integrated circuit by moving the stage by the driving member, the printed integrated circuit this voltage is detected by the sensor A circuit board inspection apparatus characterized in that a connection state to a board is detected.
JP26633999A 1999-09-20 1999-09-20 Circuit board inspection method and apparatus Expired - Lifetime JP4691623B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26633999A JP4691623B2 (en) 1999-09-20 1999-09-20 Circuit board inspection method and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26633999A JP4691623B2 (en) 1999-09-20 1999-09-20 Circuit board inspection method and apparatus

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JP4691623B2 true JP4691623B2 (en) 2011-06-01

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