JP4679383B2 - Thermally conductive damping material - Google Patents
Thermally conductive damping material Download PDFInfo
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- JP4679383B2 JP4679383B2 JP2006032635A JP2006032635A JP4679383B2 JP 4679383 B2 JP4679383 B2 JP 4679383B2 JP 2006032635 A JP2006032635 A JP 2006032635A JP 2006032635 A JP2006032635 A JP 2006032635A JP 4679383 B2 JP4679383 B2 JP 4679383B2
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- 238000013016 damping Methods 0.000 title claims description 39
- 239000000463 material Substances 0.000 title claims description 23
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 18
- 239000000347 magnesium hydroxide Substances 0.000 claims description 18
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 18
- 229920000642 polymer Polymers 0.000 claims description 18
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 16
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 14
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 8
- -1 acrylate ester Chemical class 0.000 claims description 6
- 239000000178 monomer Substances 0.000 claims description 5
- 230000000379 polymerizing effect Effects 0.000 claims description 5
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 3
- 239000000194 fatty acid Substances 0.000 claims description 3
- 229930195729 fatty acid Natural products 0.000 claims description 3
- 150000004665 fatty acids Chemical class 0.000 claims description 3
- 238000010306 acid treatment Methods 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 19
- 230000002349 favourable effect Effects 0.000 description 4
- 230000002776 aggregation Effects 0.000 description 3
- 238000004220 aggregation Methods 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000033444 hydroxylation Effects 0.000 description 1
- 238000005805 hydroxylation reaction Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 1
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Description
本発明は、音響機器、情報関連機器、情報伝達機器等に使用される制振材に関し、詳しくは、制振性に加えて熱伝導性も具備した熱伝導性制振材に関する。 The present invention relates to a vibration damping material used for an acoustic device, an information-related device, an information transmission device, and the like, and more particularly, to a heat conductive vibration damping material having thermal conductivity in addition to vibration damping properties.
近年、ＣＤ−ＲＯＭ、ミニディスク、ＤＶＤ等の光ディスクや光磁気ディスクが汎用されており、また情報機器の普及に伴ってハードディスクの需要も増大している。これらの機器は機構上、振動に弱いため振動を減衰させる制振材が装着されている。制振材としてシリコーン系の樹脂を使用すると、シロキサンガスが発生して電子機器に悪影響を与える可能性があるため望ましくない。そこで、アクリル系樹脂に、金属水酸化物，赤燐，及び無機フィラーを含有させてなる制振材が提案されている（例えば、特許文献１参照）。 In recent years, optical disks and magneto-optical disks such as CD-ROMs, minidisks, and DVDs have been widely used, and the demand for hard disks has increased with the spread of information equipment. Since these devices are mechanically susceptible to vibrations, they are equipped with damping materials that attenuate the vibrations. Use of a silicone-based resin as a vibration damping material is not desirable because siloxane gas is generated and may adversely affect electronic equipment. Therefore, a vibration damping material in which a metal hydroxide, red phosphorus, and an inorganic filler are contained in an acrylic resin has been proposed (see, for example, Patent Document 1).
また、この種の制振材では、ＣＤ−ＲＯＭ等で発生する熱を筐体等のヒートシンクとなる部材に放熱するため、制振材に熱伝導性を付与することが要請されている。アクリル系の熱伝導材としては、アクリル重合体に、ハロゲン不含難燃剤及び水和金属化合物を含有させてなる熱伝導性シートが提案されている（例えば、特許文献２参照）。
ところが、制振性と熱伝導性とを両立した素材は、これまで存在しなかった。そこで、本発明は、良好な制振性と良好な熱伝導性とを兼ね備えた熱伝導性制振材を提供することを目的としてなされた。 However, there has never been a material that has both vibration damping and thermal conductivity. Then, this invention was made | formed for the purpose of providing the heat conductive damping material which had favorable vibration damping property and favorable heat conductivity.
上記目的を達するためになされた本発明の熱伝導性制振材は、アクリル酸エステルを含むモノマーを重合してなるポリマーに、平均粒径５０〜１００μｍの炭化ケイ素、及び、平均粒径０．５〜１．０μｍの水酸化マグネシウムを含有させたことを特徴としている。 In order to achieve the above object, the thermally conductive vibration damping material of the present invention comprises a polymer obtained by polymerizing a monomer containing an acrylate ester, silicon carbide having an average particle diameter of 50 to 100 μm, and an average particle diameter of 0.1 mm. It is characterized by containing 5-1.0 μm magnesium hydroxide.
水酸化マグネシウムは、制振性を付与するためのフィラーとして使用される場合があるが、この水酸化マグネシウムは基材中で凝集する傾向がある。本発明では、水酸化マグネシウムと共に、比較的硬い炭化ケイ素を含有させているので、この炭化ケイ素が水酸化マグネシウムの凝集を妨げて基材中に分散させる作用をする。このため、ポリマーの粘性が上昇し、制振性が向上すると共に厚手のシートが容易に成形可能となる。また、炭化ケイ素は良好な熱伝導フィラーでもあり、炭化ケイ素を含有させることによりポリマーの熱伝導性も向上させることができる。従って、本発明の熱伝導性制振材は、良好な制振性と良好な熱伝導性とを兼ね備えることができる。更に、本発明の熱伝導性制振材は、水酸化マグネシウムを含有しているため、難燃性も兼ね備えている。 Magnesium hydroxide may be used as a filler for imparting vibration damping properties, but this magnesium hydroxide tends to aggregate in the substrate. In the present invention, since relatively hard silicon carbide is contained together with magnesium hydroxide, the silicon carbide acts to prevent aggregation of magnesium hydroxide and disperse it in the substrate. For this reason, the viscosity of the polymer is increased, the vibration damping property is improved, and a thick sheet can be easily formed. Silicon carbide is also a good thermal conductive filler, and the thermal conductivity of the polymer can be improved by containing silicon carbide. Therefore, the thermally conductive damping material of the present invention can have both good damping properties and good thermal conductivity. Furthermore, since the thermally conductive damping material of the present invention contains magnesium hydroxide, it also has flame retardancy.
なお、上記炭化ケイ素の平均粒径が５０μｍ未満であると、水酸化マグネシウムの凝集を充分に防止することができず、また、良好な熱伝導性も得られない。また、炭化ケイ素の平均粒径が１００μｍを超えると、本発明の熱伝導性制振材をシート状に加工する際に、炭化ケイ素の粒子がシートから脱落する可能性がある。 When the average particle diameter of the silicon carbide is less than 50 μm, aggregation of magnesium hydroxide cannot be sufficiently prevented, and good thermal conductivity cannot be obtained. If the average particle size of silicon carbide exceeds 100 μm, silicon carbide particles may fall off the sheet when the thermally conductive vibration damping material of the present invention is processed into a sheet shape.
水酸化マグネシウムの平均粒径が０．５μｍ未満であると、ポリマーへの充填性が悪く、良好な難燃性，制振性が得られない。また、水酸化マグネシウムの平均粒径が１．０μｍを超えると、ポリマーの粘性を充分に上昇させることができず、厚手のシートの成形が困難になる。 When the average particle size of magnesium hydroxide is less than 0.5 μm, the filling property into the polymer is poor, and good flame retardancy and vibration damping properties cannot be obtained. On the other hand, if the average particle diameter of magnesium hydroxide exceeds 1.0 μm, the viscosity of the polymer cannot be sufficiently increased, and it becomes difficult to form a thick sheet.
また、本発明は、水酸化マグネシウムの形状を特に限定するものではないが、上記水酸化マグネシウムが、六角板状で、かつ、高級脂肪酸処理されたものである場合、一層良好に粘性を向上させて一層良好な制振性を得ることができる。 Further, the present invention does not particularly limit the shape of magnesium hydroxide, but when the magnesium hydroxide is a hexagonal plate and is treated with a higher fatty acid, the viscosity is improved more favorably. Better vibration damping can be obtained.
また、上記ポリマーに、更に、水酸化アルミニウムを含有させた場合、その水酸化アルミニウムによってポリマーに良好な難燃性を付与することもできる。従って、この場合、熱伝導性と制振性と難燃性とを良好に兼ね備えたシート等を得ることができる。 Moreover, when the said polymer is further made to contain aluminum hydroxide, favorable flame retardance can also be provided to a polymer with the aluminum hydroxide. Therefore, in this case, it is possible to obtain a sheet having good thermal conductivity, vibration damping properties, and flame retardancy.
また、本発明の熱伝導性制振材において、アスカーＣ硬度が２５以下で、２Ｗ／ｍ・Ｋ以上の熱伝導率を有する場合、一層良好な制振性及び熱伝導性が得られ、用途範囲が一層広くなる。 Further, in the thermally conductive damping material of the present invention, when the Asker C hardness is 25 or less and the thermal conductivity is 2 W / m · K or more, better vibration damping and thermal conductivity can be obtained. The range becomes even wider.
更に、本発明の熱伝導性制振材において、損失係数（ｔａｎδ）が０．８以上である場合、一層良好な制振性が得られ、用途範囲が一層広くなる。 Furthermore, in the thermally conductive vibration damping material of the present invention, when the loss coefficient (tan δ) is 0.8 or more, a better vibration damping property can be obtained and the application range becomes wider.
次に、本発明の実施の形態を、図面と共に説明する。本願出願人は、アクリル酸エステルを含むモノマーを重合してなるポリマー１００重量部に、平均粒径５０〜１００μｍの炭化ケイ素１００〜２００重量部、平均粒径０．５〜１．０μｍの水酸化マグネシウム５０〜１００重量部、水酸化アルミニウム１００〜２００重量部、を含有させ、シート状に成形した。なお、シートに難燃性が要求されない場合は、水酸化アルミニウムは省略してもよい。その結果、２ｍｍ以上の厚膜のシートが容易に製造でき、熱伝導性は２Ｗ／ｍ・Ｋ以上の高い熱伝導性が得られ、半値幅法による制振性の測定結果は０．８以上の高い損失係数（ｔａｎδ）が得られた。また、アスカーＣ硬度は２５以下と低く、難燃性はＶＴＭ−０と良好な難燃性が得られた。 Next, embodiments of the present invention will be described with reference to the drawings. The applicant of the present application is that 100 parts by weight of a polymer obtained by polymerizing a monomer containing an acrylate ester, 100 to 200 parts by weight of silicon carbide having an average particle diameter of 50 to 100 μm, and hydroxylation having an average particle diameter of 0.5 to 1.0 μm. 50 to 100 parts by weight of magnesium and 100 to 200 parts by weight of aluminum hydroxide were contained and formed into a sheet shape. In addition, when the flame retardance is not requested | required of a sheet | seat, you may abbreviate | omit aluminum hydroxide. As a result, a sheet with a thickness of 2 mm or more can be easily manufactured, and a thermal conductivity of 2 W / m · K or higher can be obtained. The measurement result of vibration damping by the half-width method is 0.8 or more. A high loss factor (tan δ) was obtained. Moreover, Asker C hardness was as low as 25 or less, and flame retardance was VTM-0 and favorable flame retardance was obtained.
上記のように高い制振性が得られた理由としては、図１に模式的に示すように、ポリマー１に含有された比較的硬い炭化ケイ素３が、水酸化マグネシウム５の凝集を妨げてポリマー１中に分散させる作用をするためと考えられる。すなわち、この作用により、ポリマー１の粘性が上昇し、制振性が向上すると共に厚手のシートが容易に成形可能となるのである。また、炭化ケイ素３は良好な熱伝導フィラーでもあり、炭化ケイ素３を含有させることによりポリマー１の熱伝導性も向上させることができる。更に、水酸化マグネシウム５及び水酸化アルミニウム７は、難燃性を付与する効果も備えている。 The reason why the high vibration damping property is obtained as described above is that, as schematically shown in FIG. 1, the relatively hard silicon carbide 3 contained in the polymer 1 prevents aggregation of the magnesium hydroxide 5 and the polymer. This is thought to be due to the action of dispersing in 1. That is, by this action, the viscosity of the polymer 1 is increased, vibration damping is improved, and a thick sheet can be easily formed. Silicon carbide 3 is also a good thermal conductive filler, and the thermal conductivity of polymer 1 can be improved by including silicon carbide 3. Further, the magnesium hydroxide 5 and the aluminum hydroxide 7 also have an effect of imparting flame retardancy.
なお、本実施の形態において、上記ポリマーとしては、アクリル酸エステルを含むモノマーを重合してなるポリマーであれば種々のものを使用することができ、例えば、エチル（メタ）アクリレート、ｎ−プロピル（メタ）アクリレート、ｉ−プロピル（メタ）アクリレート、ｎ―ブチル（メタ）アクリレート、ｉ―ブチル（メタ）アクリレート、２−エチルヘキシル（メタ）アクリレート、ｎ−ヘキシル（メタ）アクリレート、ｎ−アミル（メタ）アクリレート、ｉ−アミル（メタ）アクリレート、オクチル（メタ）アクリレート、ｉ−オクチル（メタ）アクリレート、ｉ−ミリスチル（メタ）アクリレート、ラウリル（メタ）アクリレート、ノニル（メタ）アクリレート、ｉ―ノニル（メタ）アクリレート、ｉ―デシル（メタ）アクリレート、トリデシル（メタ）アクリレート、ステアリル（メタ）アクリレート、ｉ―ステアリル（メタ）アクリレート等のアクリル系モノマーを重合または共重合したものを使用することができる。なお、上記（共）重合する際に使用するアクリル酸エステルは、単独で用いる他、２種類以上併用してもよい。また、水酸化マグネシウムとしては、六角板状のものの他、球状等の各種形状のものを使用することができる。 In the present embodiment, various polymers can be used as the polymer as long as the polymer is obtained by polymerizing a monomer containing an acrylate ester. For example, ethyl (meth) acrylate, n-propyl ( (Meth) acrylate, i-propyl (meth) acrylate, n-butyl (meth) acrylate, i-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-hexyl (meth) acrylate, n-amyl (meth) Acrylate, i-amyl (meth) acrylate, octyl (meth) acrylate, i-octyl (meth) acrylate, i-myristyl (meth) acrylate, lauryl (meth) acrylate, nonyl (meth) acrylate, i-nonyl (meth) Acrylate, i-decyl (meth) acrylate DOO, can be used tridecyl (meth) acrylate, stearyl (meth) acrylate, those obtained by polymerizing or copolymerizing an acrylic monomer such as i- stearyl (meth) acrylate. In addition, the acrylic ester used in the (co) polymerization may be used alone or in combination of two or more. Moreover, as magnesium hydroxide, the thing of various shapes, such as spherical shape other than a hexagonal plate shape, can be used.
次に、本願出願人は、上記のように難燃性を有する熱伝導性制振材としての熱伝導性制振難燃シートを次のように実際に製造し、従来のシートとその特性を比較した。先ず、実施例として、アクリルポリマー（日本触媒製）１００重量部に対し、０．５〜１μｍの高級脂肪酸処理をされた水酸化マグネシウム（商品名「マグシリーズＳ」神島化学工業製：平均粒径０．９μｍ，モース硬度２．５）を７４重量部、炭化ケイ素（商品名「グリーンデンシック」昭和電工製：平均粒径８０μｍ，モース硬度１３）を１４８重量部、水酸化アルミニウム（日本軽金属製の高白色タイプ：平均粒径８μｍ）を１４８重量部、それぞれ含有させてコーターにより成形することにより、厚さ０．２ｍｍの熱伝導性制振難燃シートを得た。 Next, the applicant of the present application actually manufactured a thermally conductive damping flame retardant sheet as a thermally conductive damping material having flame retardancy as described above, and compared the conventional sheet and its characteristics. Compared. First, as an example, magnesium hydroxide (trade name “Mag Series S” manufactured by Kamishima Chemical Industries, Ltd .: average particle diameter, treated with a higher fatty acid of 0.5 to 1 μm per 100 parts by weight of an acrylic polymer (manufactured by Nippon Shokubai). 74 parts by weight of 0.9 μm, Mohs hardness 2.5), 148 parts by weight of silicon carbide (trade name “Green Densic” Showa Denko: average particle size 80 μm, Mohs hardness 13), aluminum hydroxide (Nippon Light Metal) 148 parts by weight of high white type: average particle size of 8 μm) and molded by a coater to obtain a thermally conductive vibration-damping flame-retardant sheet having a thickness of 0.2 mm.
このシートの物性を測定したところ、熱伝導性：２Ｗ／ｍ・Ｋ以上、半値幅法によって測定した損失係数：０．８以上、アスカーＣ硬度：２５以下、難燃性：ＶＴＭ−０といった、良好な熱伝導性，制振性，低硬度，及び難燃性が得られた。 When the physical properties of this sheet were measured, thermal conductivity: 2 W / m · K or more, loss coefficient measured by half width method: 0.8 or more, Asker C hardness: 25 or less, flame retardancy: VTM-0, Good thermal conductivity, vibration damping, low hardness, and flame retardancy were obtained.
１…ポリマー ３…炭化ケイ素
５…水酸化マグネシウム ７…水酸化アルミニウム
DESCRIPTION OF SYMBOLS 1 ... Polymer 3 ... Silicon carbide 5 ... Magnesium hydroxide 7 ... Aluminum hydroxide
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| JP2006032635A JP4679383B2 (en) | 2006-02-09 | 2006-02-09 | Thermally conductive damping material |
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| JP2006032635A JP4679383B2 (en) | 2006-02-09 | 2006-02-09 | Thermally conductive damping material |
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| JP2007211141A JP2007211141A (en) | 2007-08-23 |
| JP4679383B2 true JP4679383B2 (en) | 2011-04-27 |
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| JP2006032635A Active JP4679383B2 (en) | 2006-02-09 | 2006-02-09 | Thermally conductive damping material |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10287472B2 (en) | 2013-06-27 | 2019-05-14 | Kitagawa Industries Co., Ltd. | Thermally conductive material |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5001122B2 (en) * | 2007-11-29 | 2012-08-15 | 京セラケミカル株式会社 | High thermal conductive molding material |
| DE102010005020B4 (en) * | 2010-01-19 | 2019-12-12 | Continental Automotive Gmbh | Use of a shaped body made of a thermally conductive composite material for heat dissipation |
| JP5223149B2 (en) * | 2010-06-28 | 2013-06-26 | 北川工業株式会社 | Thermal conductivity material |
| JP6038049B2 (en) * | 2012-01-20 | 2016-12-07 | 協和化学工業株式会社 | Thermal conductivity improver |
| JP6148902B2 (en) * | 2013-05-24 | 2017-06-14 | 住友理工株式会社 | High damping rubber composition for vibration control damper and vibration control damper using the same |
| JP6324801B2 (en) * | 2014-05-12 | 2018-05-16 | ブリヂストンケービージー株式会社 | Vibration and heat dissipation composite structure |
| EP3214150B1 (en) * | 2014-10-31 | 2019-05-29 | Kitagawa Industries Co., Ltd. | Thermally-conductive material |
| JP6710828B2 (en) * | 2016-04-06 | 2020-06-17 | 北川工業株式会社 | HEAT CONDUCTIVE SHEET, AND METHOD FOR MANUFACTURING HEAT CONDUCTIVE SHEET |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000233924A (en) * | 1998-12-14 | 2000-08-29 | Kyowa Chem Ind Co Ltd | Magnesium hydroxide particle and its production |
| WO2005042612A1 (en) * | 2003-11-04 | 2005-05-12 | Soken Chemical & Engineering Co., Ltd. | Polymerizable composition and (meth)acrylic thermally conductive sheet |
| JP2006016476A (en) * | 2004-06-30 | 2006-01-19 | Pentel Corp | Oily ink composition for ballpoint pen |
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2006
- 2006-02-09 JP JP2006032635A patent/JP4679383B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000233924A (en) * | 1998-12-14 | 2000-08-29 | Kyowa Chem Ind Co Ltd | Magnesium hydroxide particle and its production |
| WO2005042612A1 (en) * | 2003-11-04 | 2005-05-12 | Soken Chemical & Engineering Co., Ltd. | Polymerizable composition and (meth)acrylic thermally conductive sheet |
| JP2006016476A (en) * | 2004-06-30 | 2006-01-19 | Pentel Corp | Oily ink composition for ballpoint pen |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10287472B2 (en) | 2013-06-27 | 2019-05-14 | Kitagawa Industries Co., Ltd. | Thermally conductive material |
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|---|---|
| JP2007211141A (en) | 2007-08-23 |
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