JP4674314B2 - エア・デフレクタ手段を含むカード・ガイドおよび冷却カード・ガイド用のエア・デフレクタ手段 - Google Patents
エア・デフレクタ手段を含むカード・ガイドおよび冷却カード・ガイド用のエア・デフレクタ手段 Download PDFInfo
- Publication number
- JP4674314B2 JP4674314B2 JP2000550314A JP2000550314A JP4674314B2 JP 4674314 B2 JP4674314 B2 JP 4674314B2 JP 2000550314 A JP2000550314 A JP 2000550314A JP 2000550314 A JP2000550314 A JP 2000550314A JP 4674314 B2 JP4674314 B2 JP 4674314B2
- Authority
- JP
- Japan
- Prior art keywords
- card
- air deflector
- card guide
- assembly
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title abstract description 11
- 238000001125 extrusion Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 12
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 238000005266 casting Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims 2
- 230000000712 assembly Effects 0.000 abstract description 11
- 238000000429 assembly Methods 0.000 abstract description 11
- 230000000116 mitigating effect Effects 0.000 abstract description 3
- 230000008901 benefit Effects 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 238000007599 discharging Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000010420 art technique Methods 0.000 description 1
- 230000005465 channeling Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1424—Card cages
- H05K7/1425—Card cages of standardised dimensions, e.g. 19"-subrack
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
- H05K7/1418—Card guides, e.g. grooves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Motor Or Generator Cooling System (AREA)
- Looms (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US8562798P | 1998-05-15 | 1998-05-15 | |
| US60/085,627 | 1998-05-15 | ||
| US09/094,179 US6381147B1 (en) | 1998-05-15 | 1998-06-09 | Card guide including air deflector means |
| US09/094,179 | 1998-06-09 | ||
| PCT/US1999/009445 WO1999060834A1 (en) | 1998-05-15 | 1999-04-30 | Card guide including air deflector means and air deflector means for a cooling card guide |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002516494A JP2002516494A (ja) | 2002-06-04 |
| JP2002516494A5 JP2002516494A5 (enExample) | 2006-06-22 |
| JP4674314B2 true JP4674314B2 (ja) | 2011-04-20 |
Family
ID=26772922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000550314A Expired - Fee Related JP4674314B2 (ja) | 1998-05-15 | 1999-04-30 | エア・デフレクタ手段を含むカード・ガイドおよび冷却カード・ガイド用のエア・デフレクタ手段 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1078560B1 (enExample) |
| JP (1) | JP4674314B2 (enExample) |
| AT (1) | ATE244499T1 (enExample) |
| AU (1) | AU3873999A (enExample) |
| CA (1) | CA2330640C (enExample) |
| DE (1) | DE69909289T2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9485851B2 (en) * | 2014-03-14 | 2016-11-01 | Sandisk Technologies Llc | Thermal tube assembly structures |
-
1999
- 1999-04-30 CA CA002330640A patent/CA2330640C/en not_active Expired - Fee Related
- 1999-04-30 JP JP2000550314A patent/JP4674314B2/ja not_active Expired - Fee Related
- 1999-04-30 DE DE69909289T patent/DE69909289T2/de not_active Expired - Lifetime
- 1999-04-30 EP EP99921555A patent/EP1078560B1/en not_active Expired - Lifetime
- 1999-04-30 AU AU38739/99A patent/AU3873999A/en not_active Abandoned
- 1999-04-30 AT AT99921555T patent/ATE244499T1/de not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| AU3873999A (en) | 1999-12-06 |
| DE69909289T2 (de) | 2004-02-12 |
| EP1078560B1 (en) | 2003-07-02 |
| JP2002516494A (ja) | 2002-06-04 |
| DE69909289D1 (de) | 2003-08-07 |
| CA2330640A1 (en) | 1999-11-25 |
| EP1078560A1 (en) | 2001-02-28 |
| ATE244499T1 (de) | 2003-07-15 |
| CA2330640C (en) | 2007-06-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6381147B1 (en) | Card guide including air deflector means | |
| US6377470B1 (en) | Card guide including air deflector means and air deflector means for a cooling card guide | |
| KR100478571B1 (ko) | 커넥터 | |
| US10797417B2 (en) | High performance stacked connector | |
| CN108738278B (zh) | 用于电连接器组件的散热器 | |
| CN107454794B (zh) | 用于笼状电连接器组件的热扩散件 | |
| US10321607B2 (en) | Receptacle assembly and transceiver module assembly | |
| CN102073360B (zh) | 服务器机柜及其服务器 | |
| US7993147B2 (en) | Card edge module connector assembly | |
| US5544006A (en) | Computer chassis having flexible card guide for expansion card insertion and removal | |
| US7280356B2 (en) | Air cooling architecture for orthogonal board architectures | |
| US9209539B2 (en) | Backplane or midplane communication system and connector | |
| CN105830283B (zh) | 连接器 | |
| US8630087B1 (en) | Airflow system, cable access system, and cable management system based on midplane having holes, side access of chassis, and card configuration | |
| US6457949B1 (en) | Fan tray apparatus and method | |
| JP2015149283A (ja) | 高電流密度を有する薄型電力コネクタ | |
| US10568207B2 (en) | Printed circuit board assembly and assembling method thereof | |
| CN108574176B (zh) | 电连接器 | |
| CN111129875B (zh) | 用于通信系统的通信连接器 | |
| US11735846B2 (en) | Stacked card edge connector having inner contact assembly and outer contact assembly | |
| CN110062719A (zh) | 多媒体控制单元的散热装置 | |
| US20140268569A1 (en) | Method And System For Providing A Customized Storage Container | |
| CN219574765U (zh) | 一种服务器导风罩及服务器 | |
| JP4674314B2 (ja) | エア・デフレクタ手段を含むカード・ガイドおよび冷却カード・ガイド用のエア・デフレクタ手段 | |
| US7637777B1 (en) | Connector assembly having a noise-reducing contact pattern |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20020411 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060427 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060427 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080121 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080418 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20080521 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20080819 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080918 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20081010 |
|
| A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20081114 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20100430 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101029 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20101220 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101221 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20101224 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20101220 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101221 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140204 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| LAPS | Cancellation because of no payment of annual fees |