JP4657530B2 - Air conditioning system for high temperature and high humidity - Google Patents

Air conditioning system for high temperature and high humidity Download PDF

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Publication number
JP4657530B2
JP4657530B2 JP2001271514A JP2001271514A JP4657530B2 JP 4657530 B2 JP4657530 B2 JP 4657530B2 JP 2001271514 A JP2001271514 A JP 2001271514A JP 2001271514 A JP2001271514 A JP 2001271514A JP 4657530 B2 JP4657530 B2 JP 4657530B2
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Prior art keywords
air
humidity
temperature
chamber
section
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JP2003083570A (en
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道久 末安
通丈 塩川
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Takasago Thermal Engineering Co Ltd
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Takasago Thermal Engineering Co Ltd
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Description

【0001】
【発明の属する技術分野】
本発明は,例えばフィルム基板を保管する室や,その他きのこ類を栽培する際にも適用可能な高温高湿室の空調システムに関するものである。
【0002】
【従来の技術】
例えばフィルム基板を保管する室においては,温度が30℃±2℃,相対湿度が60%±2%の温湿度状態が必要とされている。これは適当な湿度条件とすることで,静電気の発生を抑えるためである。またそのような基板の保管には,清浄度の高い環境が必要とされ,例えばクラス100,000程度の清浄度が必要となっている。またそのようなフィルム基板の保管室は,クリーンルーム内に別途設置されている場合が多い。
【0003】
そして前記条件を満たすため,従来は,機械室をクリーンルーム外に別途設置し,この機械室に高温高湿室専用の空調機器を設置していた。すなわち,クリーンルーム外から取り入れた外気に対して冷却することで一旦所定の湿度まで減湿処理するための冷却器,及び冷却後の外気に対して加熱する加熱器,加熱直後の外気に対して加湿処理する加湿器を有する空調機器を前記機械室に設置するようにしていた。
【0004】
【発明が解決しようとする課題】
しかしながらそのように取り入れた外気に対して一旦冷却して減湿処理した後に再び加湿処理するのでは,エネルギーを多く消費してしまう。また設置スペースは小さくすることが求められ,既成の製品では入手困難(容量の小さいコンプレッサを備える必要があるため)な専用の冷却器(直膨コイル)を必要とする等の問題があった。
【0005】
本発明はかかる点に鑑みてなされたものであり,省エネルギ性に優れ,かつ専用の冷却器を不要とした高温高湿室用の空調システムを提供して問題の解決を図ることをその目的としている。
【0006】
【課題を解決するための手段】
前記目的を達成するため,本発明の高温高湿用空調システムは,目的室を所定の高温高湿度に維持するためのシステムであって,前記目的室の下方に設けられた還気部と,目的室上方に設けられた給気部と,前記目的室において前記給気部とは異なった面に設けられた排気部と,前記還気部から前記目的室の空気を導入するための送風機と,導入した空気に対して加熱する加熱部と,加熱後の空気に対して加湿する加湿部とを有する処理チャンバと,前記処理チャンバにおける加熱部の上流側にクリーンルーム内の空気を導入する空調空気導入部とを有し,前記還気部と空調空気導入部には,取り入れる空気の量を調整するためのダンパが各々設けられており,前記目的室内における少なくとも温度又は湿度に基づいて,前記各ダンパが制御されるように構成されている。
この場合,給気部が目的室下方に設けられ,還気部が目的室上方に設置されていてもよい。これによっていわゆる置換還気が円滑に行える。
また前記目的室において前記給気部とは異なった面に排気部を設けるとは,例えば給気部が目的室の一側壁に設けられている場合,排気部は,当該一側壁とは違う,他の側壁に設けたり,天井面に設けたりすることである。また給気部が例えば床面に設定されている場合には,排気部を天井面あるいは側壁に設けることなどもこれに該当する。
【0007】
本発明が対象としている高温高湿室は,既述したように,温度が30℃±2℃,相対湿度が60%±2%の室や,あるいはそれ以上の温湿度状態の室である。一方,クリーンルームは一般的に温度,相対湿度とも,高温高湿室よりも低く,かつ所定の範囲に調整されている。したがって,このような温湿度状態にあるクリーンルームの空気をそのまま利用すれば,温度が30℃±2℃,相対湿度が60%±2%の室や,あるいはそれ以上の温湿度状態(例えばしいたけ栽培では温度が27℃,相対湿度が90%以上)を実現する場合,格別減湿の必要はない。したがって,前記処理チャンバの加熱部の上流側にクリーンルーム内の空気を導入して目的室からの還気と混合して使用することで,専用の冷却器は不要となり,単純に加熱,加湿するだけでよい。それに伴って省エネルギー性も優れたものとなる。
【0008】
本発明においては,加熱部の上流側にてクリーンルーム内の空気と目的室からの還気と混合された後,加熱部において必要な温度にまで加熱され,その後加湿部によって必要な湿度に加湿された後の空気は給気部から目的室へと供給される。また目的室の排気部からは,室内空気の一部が排気される。
【0009】
目的室がフィルム基板の保管室の場合には,通常負荷は一定なので,クリーンルームから導入する空気と還気との混合比率は一定となる。例えば50:50として一定の混合比率で使用すればよい。
【0010】
また目的室の負荷が変動するような場合(きのこ類,菌類の生育環境など)には,必要に応じて還気の比率を高めたり,クリーンルームからの空気の導入比率を高くするようにすればよい。すなわち,両者の混合比率を変更すればよい。
【0011】
また本発明では,還気部と空調空気導入部に,取り入れる空気の量を調整するためのダンパを各々設け,前記目的室内における少なくとも温度又は湿度に基づいて,前記各ダンパを制御するように構成しているので,負荷の変動に応じてダンパを調整することで,負荷の変動に応じて還気とクリーンルームからの空気との混合比率を自動的に制御することができる。
【0012】
【発明の実施の形態】
以下に,本発明の好ましい実施の形態を図面に基いて説明する。図1は,本実施の形態に空調システムの概要を示しており,クリーンルーム1には,建物内の機械室に設置された空調機器2から,所定温度,例えば22℃,所定湿度,例えば55%の相対湿度をもった清浄空気(例えばクラス100,000)が給気口3を通じて供給されている。この空調機器2は,ファン,冷却コイル,加熱コイル,加湿器,中性脳フィルタを有し,外気取入口4から導入した外気と吸込口5からの排気の一部を還気として前記外気と混合して所定の温湿度調整を行い,高性能フィルタ(図示せず)を介して,給気口3からクリーンルーム1内に供給する機能を有している。なお排気は排気口6を通じて排気される。また動力盤等は,クリーンルーム1の階下に設けられている1階機械室7に設置されている。
【0013】
目的室となる高温高湿室Rは,このクリーンルーム1内にパネル等の壁体で区画されて設置されている。そして壁体の一側壁の下方に還気部,同上方に給気部を備えている。壁体と天井,床は気密に形成されている。このクリーンルーム1内には,高温高湿室Rに隣接して,機械室11,前室12が設置されており,処理チャンバ21は,機械室11内に設置されている。前室12は,非清浄・温湿度非管理ゾーンとのあいだのいわば緩衝帯として機能し,本例では,高温高湿室Rよりも負圧に維持され,高温高湿室Rの調整された雰囲気を乱さないようにしている。また機械室11は,クリーンルーム1内に,パネルで区画されている。ただし,発塵や音,振動などの程度や,室内の使用環境により,機械室11自体を形成せず,空調機器2をそのままクリーンルーム1内に設置してもよい。
【0014】
クリーンルーム1における機械室11側の壁面には吸込口13が設けられ,この吸込口13と処理チャンバ21との間には,空調空気導入部を構成するダクト14が設けられている。ダクト14には,ダンパD1が介装されている。
【0015】
処理チャンバ21内には,上流側から順に,インバータ制御されるファン22,電気式ヒータ23,水滴を受け止めるためのパン24,電熱式蒸気加湿器25の加湿部25a,サランフィルタ26,HEPAフィルタ27が設けられている。電気式ヒータ23は,高温高湿室R内に設置された温度センサ28の検出信号に基づいて,室内が所定温度,例えば30℃±2℃となるようにサイリスタ23aによって制御されるようになっている。また電熱式蒸気加湿器25は,高温高湿室R内に設置された湿度センサ29の検出信号に基づいて,室内が所定の相対湿度,例えば60%±5%となるように制御されるようになっている
【0016】
処理チャンバ21の下方には,前記ダクト14に通ずる導入口15,及び高温高湿室Rの下方に設定されている還気口31からの還気を取り入れる還気導入部32が各々,ファン22の上流側に設定されている。還気導入部32には,ダンパD2が介装されている。
【0017】
処理チャンバ21の上部(最下流側)には,給気部30が設けられており,処理チャンバ21で処理された後の所定温湿度の清浄空気を,ダクト33,給気口34を通じて,高温高湿室Rの上部に供給するようになっている。
【0018】
また高温高湿室Rの上部付近であって,前記給気口34が設定されている壁面とは異なった壁面には,差圧ダンパ35を有する排気口36が設けられており,高温高湿室Rの上部付近の空気を排気口36から前室12へと排気するようになっており,さらに前室12の上部付近には,排気ファン37を有する排気口38が設定されている。これによって前室12内の空気は,外部へと排気されるようになっている。
【0019】
本実施の形態にかかる空調システムは以上のように構成されており,高温高湿室Rを所定の温湿度,例えば温度が30℃±2℃,湿度が60%±5%となるように運転する場合,処理チャンバ21のファン22を作動させることで,クリーンルーム1内の空気,例えば温度が22℃,湿度が55%の空気が,吸込口13,ダクト14,導入口15を通じて処理チャンバ21のファン22の上流側に導入され,一方高温高湿室Rからの還気が還気導入部32を通じて処理チャンバ21のファン22の上流側に導入され,混合された後,電気式ヒータ23,加湿部25aによって,所定の温湿度に調整された後,給気部30,ダクト33,給気口34から高温高湿室Rの上部に供給される。
【0020】
以上の例で示した高温高湿室Rからの還気とクリーンルーム1内の空気との混合空気を,処理チャンバ21で加熱,加湿処理したときの温湿度の変化を図2の空気線図に示した。
【0021】
ここで還気と混合される空気は,クリーンルーム1内の空気であるから,湿度についていえば予め一定湿度(55%)に調整されており,従来のように一旦冷却して減湿する必要がなく,加湿部25aによって加湿するだけでよい。したがって,従来のような専用の直膨コイル等の冷却器は必要がなく,別途外気を導入する必要もない。また温度についても,クリーンルーム1内の空気は22℃に調整されているので,電気式ヒータ23による加熱処理で済む。そして空気の清浄度についても,クリーンルーム1内空気は,予め,所定の清浄度が確保されているから,サランフィルタ26やHEPAフィルタ27の負荷が軽減され,メンテナンスや保守のサイクルが長くとれる。
【0022】
本実施の形態における前記高温高湿室Rは,例えば静電気を嫌う基板の保管庫として想定しているので,温湿度負荷はほぼ一定であり,そのためクリーンルーム1内の空気と高温高湿室Rからの還気との混合比は,一定,例えば50:50とすれば足りる。したがって,ダンパD1,D2の開度も一定にしておけばよいが,例えばきのこ類や植物の栽培,細菌類等の繁殖目的など,必要に応じて負荷が変動したり,温湿度条件が変化するものについては,ダンパD1,D2の開度調整を行って,両者の混合比率を変化させればよい。この場合,温度センサ28,湿度センサ29の検出結果に基づいて,ダンパD1,D2の開度を自動的に調整する制御装置を別途設置することで,かかる際の必要な混合比率の変更を自動的に行うことができる。このような混合比率の変更は,例えばダンパD1,D2にモータダンパを使用し,ダンパD1,D2の開度の関係を,逆比例の関係で制御するようにすればよい。
【0023】
前記実施の形態では,温度センサ28は,高温高湿室R内に設置されていたが,例えばかかる温度センサ28を処理チャンバ21内,例えば電気式ヒータ23の下流側の適当な位置に設けて制御してもよい。この場合,目標温度は,例えば「室温−2℃」程度に設定して制御するようにしてもよい。すなわち高温高湿室R内には,適宜照明器具が設けられていたり,また作業員が居て,それらからの熱負荷を考慮すると,例えば「室温−2℃」程度(例えば高温高湿室Rを30℃に設定する場合には,28℃)にして給気を吹き出すことにより,高温高湿室Rを所定の温度に維持することができる。
【0024】
なお前記実施の形態では,高温高湿室Rは,クリーンルーム1の内部に設置されていたが,これに限らず,例えばクリーンルーム1に隣接して設けたり,近接して設けてもよい。その場合,クリーンルーム1からの空気は,適宜のダクトを通じて導入すればよい。
【0025】
なお前記実施の形態では,給気口34が高温高湿室Rの上方に設置され,還気口31が高温高湿室Rの下方に設置されていたが,処理チャンバ21の構成を上下逆にして,給気部30を下方に設定し,還気導入部32を上方に設定し,それに伴って各々給気口34を高温高湿室Rの下方に設定し,還気口31を高温高湿室Rの上方に設定してもよい。それによってさらに,置換還気が円滑に行えるという効果が得られる。
【0026】
【発明の効果】
本発明によれば,減湿を行うための専用の冷却器を必要とすることなく,所定の高温高湿度条件を目的室に実現でき,従来よりも省エネルギー性が優れる。また必要な設備機器も少なくてよい。また屋外器と冷却器を結ぶ冷媒管もなくなり,材料費,工事費が低減する。
【図面の簡単な説明】
【図1】 本発明の実施の形態にかかる空調システムの構成の概略を示す説明図である。
【図2】 本発明の実施の形態にかかる空調システムの運転例の空気線図である。
【符号の説明】
1 クリーンルーム
2 空調機
11 機械室
13 吸込口
14 ダクト
15 導入口
21 処理チャンバ
22 ファン
23 電気式ヒータ
25 電熱式蒸気加湿器
27 HEPAフィルタ
28 温度センサ
29 湿度センサ
30 給気部
31 還気口
32 還気導入部
34 給気口
R 高温高湿室
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an air conditioning system for a high-temperature and high-humidity chamber that can be applied to, for example, a room for storing a film substrate and other mushrooms.
[0002]
[Prior art]
For example, in a room for storing a film substrate, a temperature and humidity state in which the temperature is 30 ° C. ± 2 ° C. and the relative humidity is 60% ± 2% is required. This is to suppress the generation of static electricity by setting the humidity conditions appropriately. In addition, the storage of such a substrate requires an environment with a high cleanliness, for example, a cleanliness of about class 100,000. Such film substrate storage rooms are often separately installed in clean rooms.
[0003]
In order to satisfy the above conditions, conventionally, a machine room has been separately installed outside the clean room, and air conditioning equipment dedicated to the high temperature and high humidity room has been installed in this machine room. That is, a cooler that once dehumidifies to a predetermined humidity by cooling the outside air taken from outside the clean room, a heater that heats the outside air after cooling, and humidifies the outside air immediately after heating An air conditioner having a humidifier to be processed was installed in the machine room.
[0004]
[Problems to be solved by the invention]
However, if the outside air thus taken is once cooled and dehumidified and then humidified again, a lot of energy is consumed. Also, the installation space is required to be small, and there are problems such as requiring a dedicated cooler (direct expansion coil) that is difficult to obtain with existing products (because it is necessary to provide a compressor with a small capacity).
[0005]
The present invention has been made in view of the above points, and an object of the present invention is to provide an air conditioning system for a high-temperature and high-humidity chamber that is excellent in energy saving and does not require a dedicated cooler to solve the problem. It is said.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, an air conditioning system for high temperature and high humidity according to the present invention is a system for maintaining a target room at a predetermined high temperature and high humidity, and a return air unit provided below the target room, An air supply unit provided above the target chamber, an exhaust unit provided on a surface different from the air supply unit in the target chamber, and a blower for introducing the air in the target chamber from the return air unit; , A processing chamber having a heating section for heating the introduced air, a humidification section for humidifying the heated air, and conditioned air for introducing the air in the clean room upstream of the heating section in the processing chamber Each of the return air unit and the conditioned air introduction unit is provided with a damper for adjusting the amount of air to be taken in, based on at least the temperature or humidity in the target chamber. Damper controlled And it is configured to be.
In this case, the air supply unit may be provided below the target chamber, and the return air unit may be installed above the target chamber. As a result, so-called replacement return can be performed smoothly.
Further, providing the exhaust unit on a surface different from the air supply unit in the target chamber means that, for example, when the air supply unit is provided on one side wall of the target chamber, the exhaust unit is different from the one side wall. It is to be provided on other side walls or on the ceiling surface. For example, when the air supply unit is set on the floor surface, the exhaust unit is provided on the ceiling surface or the side wall.
[0007]
As described above, the high-temperature and high-humidity chamber targeted by the present invention is a chamber having a temperature of 30 ° C. ± 2 ° C. and a relative humidity of 60% ± 2%, or a chamber having a higher temperature and humidity. On the other hand, in a clean room, both temperature and relative humidity are generally lower than that of a high-temperature and high-humidity chamber and adjusted to a predetermined range. Therefore, if the air in a clean room in such a temperature and humidity state is used as it is, a room having a temperature of 30 ° C. ± 2 ° C. and a relative humidity of 60% ± 2% or higher (for example, shiitake cultivation) In the case of realizing a temperature of 27 ° C. and a relative humidity of 90% or more), no special dehumidification is necessary. Therefore, by introducing the air in the clean room to the upstream side of the heating part of the processing chamber and mixing it with the return air from the target room, a dedicated cooler is not required, and it is simply heated and humidified. It's okay. Along with this, energy saving properties are also improved.
[0008]
In the present invention, the air in the clean room and the return air from the target room are mixed on the upstream side of the heating unit, and then heated to the required temperature in the heating unit, and then humidified to the required humidity by the humidifying unit. After that, the air is supplied from the supply section to the target room. A part of the room air is exhausted from the exhaust part of the target room.
[0009]
When the target chamber is a film substrate storage chamber, since the load is usually constant, the mixing ratio of air and return air introduced from the clean room is constant. For example, it may be used at a constant mixing ratio of 50:50.
[0010]
If the load on the target room fluctuates (mushrooms, fungal growth environment, etc.), increase the ratio of return air or increase the ratio of air introduced from the clean room as necessary. Good. That is, what is necessary is just to change the mixing ratio of both.
[0011]
Further, in the present invention, the return air unit and the conditioned air introduction unit are each provided with a damper for adjusting the amount of air taken in, and each damper is controlled based on at least the temperature or humidity in the target chamber. Therefore, by adjusting the damper according to the load variation, the mixing ratio of the return air and the air from the clean room can be automatically controlled according to the load variation.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows an outline of an air conditioning system according to the present embodiment. A clean room 1 has a predetermined temperature, for example, 22 ° C., a predetermined humidity, for example, 55% from an air conditioner 2 installed in a machine room in a building. Clean air having a relative humidity of (for example, class 100,000) is supplied through the air supply port 3. The air conditioner 2 includes a fan, a cooling coil, a heating coil, a humidifier, and a neutral brain filter. The outside air introduced from the outside air intake 4 and a part of the exhaust from the suction port 5 are returned to the outside air. It has a function of mixing and adjusting a predetermined temperature and humidity and supplying the clean room 1 from the air supply port 3 through a high performance filter (not shown). The exhaust is exhausted through the exhaust port 6. The power panel and the like are installed in a first floor machine room 7 provided below the clean room 1.
[0013]
The high-temperature and high-humidity chamber R serving as the target room is installed in the clean room 1 by being partitioned by a wall such as a panel. A return air section is provided below one side wall of the wall body, and an air supply section is provided above the wall. The walls, ceiling, and floor are airtight. In the clean room 1, a machine room 11 and a front room 12 are installed adjacent to the high-temperature and high-humidity room R, and a processing chamber 21 is installed in the machine room 11. The front chamber 12 functions as a buffer zone between the non-clean and temperature / humidity non-control zone. In this example, the front chamber 12 is maintained at a negative pressure rather than the high temperature / humidity chamber R, and the high temperature / humidity chamber R is adjusted. I try not to disturb the atmosphere. The machine room 11 is partitioned by a panel in the clean room 1. However, the air conditioner 2 may be installed in the clean room 1 as it is without forming the machine room 11 itself depending on the degree of dust generation, sound, vibration, or the indoor use environment.
[0014]
A suction port 13 is provided on the wall surface on the machine room 11 side in the clean room 1, and a duct 14 constituting an conditioned air introduction unit is provided between the suction port 13 and the processing chamber 21. A damper D1 is interposed in the duct 14.
[0015]
In the processing chamber 21, an inverter-controlled fan 22, an electric heater 23, a pan 24 for receiving water droplets, a humidifying portion 25 a of an electric heating steam humidifier 25, a salan filter 26, and a HEPA filter 27 are sequentially arranged from the upstream side. Is provided. The electric heater 23 is controlled by the thyristor 23a based on the detection signal of the temperature sensor 28 installed in the high temperature and high humidity chamber R so that the room has a predetermined temperature, for example, 30 ° C. ± 2 ° C. ing. Further, the electrothermal steam humidifier 25 is controlled so that the room has a predetermined relative humidity, for example, 60% ± 5%, based on the detection signal of the humidity sensor 29 installed in the high temperature and high humidity chamber R. It has become [0016]
Below the processing chamber 21, a return air introduction section 32 that takes in return air from the introduction port 15 that communicates with the duct 14 and a return air port 31 that is set below the high-temperature and high-humidity chamber R, respectively. Is set on the upstream side. A damper D <b> 2 is interposed in the return air introduction part 32.
[0017]
An air supply unit 30 is provided in the upper part (downstream side) of the processing chamber 21, and clean air having a predetermined temperature and humidity after being processed in the processing chamber 21 is heated to a high temperature through the duct 33 and the air supply port 34. The high humidity chamber R is supplied to the upper part.
[0018]
In addition, an exhaust port 36 having a differential pressure damper 35 is provided near the upper portion of the high-temperature and high-humidity chamber R and on the wall surface different from the wall surface on which the air supply port 34 is set. Air in the vicinity of the upper portion of the chamber R is exhausted from the exhaust port 36 to the front chamber 12, and an exhaust port 38 having an exhaust fan 37 is set near the upper portion of the front chamber 12. As a result, the air in the front chamber 12 is exhausted to the outside.
[0019]
The air conditioning system according to the present embodiment is configured as described above, and the high temperature and high humidity chamber R is operated at a predetermined temperature and humidity, for example, a temperature of 30 ° C. ± 2 ° C. and a humidity of 60% ± 5%. In this case, by operating the fan 22 of the processing chamber 21, the air in the clean room 1, for example, air having a temperature of 22 ° C. and a humidity of 55%, is supplied to the processing chamber 21 through the suction port 13, the duct 14, and the introduction port 15. On the other hand, the return air from the high-temperature and high-humidity chamber R is introduced to the upstream side of the fan 22 of the processing chamber 21 through the return air introduction part 32 and mixed, and then the electric heater 23 and the humidification are introduced. After being adjusted to a predetermined temperature and humidity by the unit 25a, the air is supplied from the air supply unit 30, the duct 33, and the air supply port 34 to the upper portion of the high temperature and high humidity chamber R.
[0020]
The change in temperature and humidity when the mixed air of the return air from the high temperature and high humidity chamber R shown in the above example and the air in the clean room 1 is heated and humidified in the processing chamber 21 is shown in the air diagram of FIG. Indicated.
[0021]
Here, the air mixed with the return air is the air in the clean room 1, so the humidity is adjusted to a constant humidity (55%) in advance, and it is necessary to cool and reduce the humidity as before. Instead, it only needs to be humidified by the humidifying unit 25a. Therefore, there is no need for a conventional cooler such as a direct expansion coil, and there is no need to introduce outside air separately. As for the temperature, since the air in the clean room 1 is adjusted to 22 ° C., the heat treatment by the electric heater 23 is sufficient. As for the cleanliness of the air, since the predetermined cleanliness of the air in the clean room 1 is secured in advance, the load on the Saran filter 26 and the HEPA filter 27 is reduced, and the maintenance and maintenance cycle can be extended.
[0022]
Since the high temperature and high humidity chamber R in the present embodiment is assumed to be, for example, a substrate storage that dislikes static electricity, the temperature and humidity load is substantially constant. Therefore, from the air in the clean room 1 and the high temperature and high humidity chamber R, It is sufficient that the mixing ratio with the return air is constant, for example, 50:50. Therefore, the opening degree of the dampers D1 and D2 may be kept constant. However, for example, cultivation of mushrooms and plants, breeding purpose of bacteria, etc., the load fluctuates and temperature and humidity conditions change as necessary. What is necessary is just to adjust the opening degree of dampers D1 and D2, and to change the mixing ratio of both. In this case, a necessary control of the mixing ratio is automatically performed by separately installing a control device that automatically adjusts the opening degree of the dampers D1 and D2 based on the detection results of the temperature sensor 28 and the humidity sensor 29. Can be done automatically. In order to change the mixing ratio, for example, a motor damper may be used for the dampers D1 and D2, and the relationship between the opening degrees of the dampers D1 and D2 may be controlled in an inversely proportional relationship.
[0023]
In the above-described embodiment, the temperature sensor 28 is installed in the high-temperature and high-humidity chamber R. For example, the temperature sensor 28 is provided in an appropriate position in the processing chamber 21, for example, downstream of the electric heater 23. You may control. In this case, the target temperature may be set and controlled to, for example, about “room temperature−2 ° C.”. That is, in the high-temperature and high-humidity chamber R, lighting fixtures are appropriately provided, and there are workers, and considering the heat load from them, for example, about “room temperature-2 ° C.” (for example, the high-temperature high-humidity chamber R When the temperature is set to 30 ° C., the high-temperature and high-humidity chamber R can be maintained at a predetermined temperature by blowing out the air supply at 28 ° C.).
[0024]
In the embodiment described above, the high-temperature and high-humidity chamber R is installed inside the clean room 1. However, the present invention is not limited to this, and may be provided adjacent to the clean room 1, for example. In that case, the air from the clean room 1 may be introduced through an appropriate duct.
[0025]
In the above embodiment, the air supply port 34 is installed above the high temperature / humidity chamber R and the return air port 31 is installed below the high temperature / humidity chamber R. However, the configuration of the processing chamber 21 is turned upside down. Thus, the air supply unit 30 is set downward, the return air introduction unit 32 is set upward, and accordingly the air supply port 34 is set below the high temperature and high humidity chamber R, and the return air port 31 is set at a high temperature. It may be set above the high humidity chamber R. As a result, the effect of smooth replacement air can be obtained.
[0026]
【The invention's effect】
According to the present invention, a predetermined high-temperature and high-humidity condition can be realized in the target room without requiring a dedicated cooler for dehumidification, and energy saving is superior to the conventional one. Also, less equipment is required. Also, there is no refrigerant pipe connecting the outdoor unit and the cooler, reducing material costs and construction costs.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram showing an outline of a configuration of an air conditioning system according to an embodiment of the present invention.
FIG. 2 is an air diagram of an operation example of the air conditioning system according to the embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Clean room 2 Air conditioner 11 Machine room 13 Suction port 14 Duct 15 Inlet port 21 Processing chamber 22 Fan 23 Electric heater 25 Electric heat steam humidifier 27 HEPA filter 28 Temperature sensor 29 Humidity sensor 30 Air supply part 31 Return air port 32 Return Air inlet 34 Air supply port R High temperature and humidity room

Claims (2)

目的室を所定の高温高湿度に維持するためのシステムであって,
前記目的室の下方に設けられた還気部と,上方に設けられた給気部と,前記目的室において前記給気部とは異なった面に設けられた排気部と,
前記還気部から前記目的室の空気を導入するための送風機と,導入した空気に対して加熱する加熱部と,加熱後の空気に対して加湿する加湿部とを有する処理チャンバと,
前記処理チャンバにおける加熱部の上流側にクリーンルーム内の空気を導入する空調空気導入部と,を有し,
前記還気部と空調空気導入部には,取り入れる空気の量を調整するためのダンパが各々設けられており,前記目的室内における少なくとも温度又は湿度に基づいて,前記各ダンパが制御されるように構成されたことを特徴とする,高温高湿用空調システム。
A system for maintaining a target room at a predetermined high temperature and high humidity,
A return air portion provided below the target chamber, an air supply portion provided above, and an exhaust portion provided on a different surface from the air supply portion in the target chamber;
A blower for introducing the air of the target chamber from the return air unit, a heating unit that heats the introduced air, and a processing chamber that humidifies the heated air; and
An conditioned air introduction section for introducing air in a clean room upstream of the heating section in the processing chamber,
The return air section and the conditioned air introduction section are each provided with a damper for adjusting the amount of air taken in, and the damper is controlled based on at least temperature or humidity in the target chamber. A high-temperature, high-humidity air-conditioning system that is configured .
目的室を所定の高温高湿度に維持するためのシステムであって,
前記目的室の上方に設けられた還気部と,下方に設けられた給気部と,前記目的室において前記給気部とは異なった面に設けられた排気部と,
前記還気部から前記目的室の空気を導入するための送風機と,導入した空気に対して加熱する加熱部と,加熱後の空気に対して加湿する加湿部とを有する処理チャンバと,
前記処理チャンバにおける加熱部の上流側にクリーンルーム内の空気を導入する空調空気導入部と,を有し
前記還気部と空調空気導入部には,取り入れる空気の量を調整するためのダンパが各々設けられており,前記目的室内における少なくとも温度又は湿度に基づいて,前記各ダンパが制御されるように構成されたことを特徴とする,高温高湿用空調システム。
A system for maintaining a target room at a predetermined high temperature and high humidity,
A return air section provided above the target chamber, a supply section provided below, and an exhaust section provided on a different surface from the supply section in the target chamber;
A blower for introducing the air of the target chamber from the return air unit, a heating unit that heats the introduced air, and a processing chamber that humidifies the heated air; and
An conditioned air introduction section for introducing air in a clean room upstream of the heating section in the processing chamber ,
The return air section and the conditioned air introduction section are each provided with a damper for adjusting the amount of air taken in, and the damper is controlled based on at least temperature or humidity in the target chamber. A high-temperature, high-humidity air-conditioning system that is configured .
JP2001271514A 2001-09-07 2001-09-07 Air conditioning system for high temperature and high humidity Expired - Fee Related JP4657530B2 (en)

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JP4578572B1 (en) * 2010-02-26 2010-11-10 日揮株式会社 Processing equipment
CN105864923A (en) * 2015-01-20 2016-08-17 绿源霖节能科技(天津)有限公司 Energy-saving clean workshop system and air conditioning method for clean workshop
CN107726421B (en) * 2017-11-07 2023-07-04 江苏久禾生物科技发展有限公司 Steam type fruiting room heat supply system and application method thereof
WO2021186927A1 (en) * 2020-03-18 2021-09-23 日本スピンドル製造株式会社 Humidity adjustment device

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JPH0484963A (en) * 1990-07-27 1992-03-18 Yokohamashi High-temperature high-humidity type bioclean sickroom for treating scald
JPH0593542A (en) * 1991-10-01 1993-04-16 Matsushita Electric Ind Co Ltd Air conditioner
JPH08193727A (en) * 1995-01-19 1996-07-30 Kumagai Gumi Co Ltd Controlling equipment of indoor environment
JPH08296876A (en) * 1995-04-24 1996-11-12 Takasago Thermal Eng Co Ltd Local clean-space
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Publication number Priority date Publication date Assignee Title
JPH0484963A (en) * 1990-07-27 1992-03-18 Yokohamashi High-temperature high-humidity type bioclean sickroom for treating scald
JPH0593542A (en) * 1991-10-01 1993-04-16 Matsushita Electric Ind Co Ltd Air conditioner
JPH08193727A (en) * 1995-01-19 1996-07-30 Kumagai Gumi Co Ltd Controlling equipment of indoor environment
JPH08296876A (en) * 1995-04-24 1996-11-12 Takasago Thermal Eng Co Ltd Local clean-space
JPH09152153A (en) * 1995-11-30 1997-06-10 Takasago Thermal Eng Co Ltd Local cleaning space
JPH10148383A (en) * 1996-11-19 1998-06-02 Hitachi Ltd Air conditioner

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