JP4656855B2 - Laser processing head - Google Patents

Laser processing head Download PDF

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JP4656855B2
JP4656855B2 JP2004112938A JP2004112938A JP4656855B2 JP 4656855 B2 JP4656855 B2 JP 4656855B2 JP 2004112938 A JP2004112938 A JP 2004112938A JP 2004112938 A JP2004112938 A JP 2004112938A JP 4656855 B2 JP4656855 B2 JP 4656855B2
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side blow
blow gas
workpiece
processing head
laser processing
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JP2005296967A (en
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功明 塩地
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Amada Co Ltd
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Amada Co Ltd
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Description

本発明はレーザ加工ヘッドに関する。   The present invention relates to a laser processing head.

レーザ光による金属板などの切断加工においては、板金材等の被加工材の切断開始点にレーザ光が通過可能な下穴を設けてそこから切断を開始するか、または、被加工材の端面から切断を開始する。   In cutting processing of a metal plate or the like by laser light, a pilot hole through which laser light can pass is provided at the cutting start point of the work material such as sheet metal material, and cutting is started from there, or the end surface of the work material Start cutting from.

切断開始点に下穴をあける方法として、高出力のレーザ光をレーザ加工ヘッドに内蔵した集光レンズにより切断開始点の微小な面積に集光照射すると同時に、レーザ光と同軸のアシストガスノズルからアシストガス(酸素ガス)を噴射させて瞬時に下穴をあける、いわゆるピアシング加工が行われている(例えば、特許文献1に記載の従来技術「図14」参照)。   As a method of drilling a pilot hole at the cutting start point, high-power laser light is focused and irradiated on a small area at the cutting start point by a condensing lens built in the laser processing head, and at the same time, an assist gas nozzle coaxial with the laser light assists. A so-called piercing process is performed in which a pilot hole is instantaneously made by injecting gas (oxygen gas) (see, for example, the conventional technique “FIG. 14” described in Patent Document 1).

上述のピアシング加工によるピアス穴は、一般的にほかの方法によるピアス穴より穴径が大きくなると共に、特に厚板金属加工では、貫通穴の体積分に相当する多量の溶融金属が短時間にワークの表面に噴出し、この溶融金属がピアス穴表面の周囲に付着する。そのため、切断工程に移行した際に、ノズル先端と凝固した溶融金属とが干渉してノズルを損傷したり、バーニングなどの不良切断が発生しやすくなる傾向がある。   The pierced hole by the piercing process described above generally has a larger hole diameter than the pierced hole by other methods, and in particular, in the processing of a thick plate metal, a large amount of molten metal corresponding to the volume of the through hole is formed in a short time. This molten metal adheres around the surface of the pierced hole. For this reason, when shifting to the cutting process, the nozzle tip and the solidified molten metal interfere with each other and the nozzle is damaged, or defective cutting such as burning tends to occur.

これらの問題を解消するために、上述の如き厚板のピアシング加工を行うときには、ピアス穴の周囲から溶融金属を水平方向に吹き飛ばすための空気を用いたサイドブローを行う例もある(例えば、特許文献1の図5参照)。
特開平9−206975号公報
In order to solve these problems, when performing the piercing processing of the thick plate as described above, there is an example in which side blowing using air for blowing the molten metal in the horizontal direction from the periphery of the piercing hole is performed (for example, patents) (See FIG. 5 of Document 1).
JP-A-9-206975

しかし、上述の如くピアス穴の手前の切断方向側から被加工材の表面に沿ってピアス穴上を通過するように噴射して溶融金属を飛散させるようにした場合には、溶融金属が急速に冷却されて、被加工材の表面への付着を促進してしまうことがあった。   However, as described above, when the molten metal is sprayed from the cutting direction side before the pierced hole so as to pass over the pierced hole along the surface of the workpiece, the molten metal rapidly Cooling may promote adhesion to the surface of the workpiece.

上述の水平方向へのサイドブローを行うためには、ノズルと被加工材との間の距離を一定に保持できる加工ヘッドにサイドブロー用の噴出口を設けることが望ましいが、そうすると噴出口が加工点に近くなり、サイドブローを使用しない切断加工を行う場合には、溶融金属粒が噴出口に付着したり噴出口内に侵入するなどの問題がある。   In order to perform the side blow in the horizontal direction described above, it is desirable to provide a side blow jet outlet in the processing head that can maintain a constant distance between the nozzle and the workpiece. When cutting is performed without using a side blow, there is a problem that the molten metal particles adhere to the injection port or enter the injection port.

なお、サイドブローをピアス穴の中心に向けて行うと、アシストガス(酸素ガス)の濃度を低下させてピアシング加工ができなくなったり、溶融金属がより強く吹き上がり、ノズルに溶着したりノズルを損傷したりする原因となる。   If the side blow is directed toward the center of the pierced hole, the concentration of assist gas (oxygen gas) will be reduced and piercing will not be possible, or the molten metal will blow up more strongly and will adhere to the nozzle or damage the nozzle. Cause it.

本発明は上述の如き問題を解決するためになされたものであり、本発明の課題は、ピアシング加工時に、特に厚板金属加工時に被加工材表面上に飛散する溶融金属がピアス穴の周囲に付着するのを防止すると共に、ノズル口やサイドブロー噴出口への付着を防止したレーザ加工ヘッドを提供することである。   The present invention has been made to solve the above-described problems. The object of the present invention is to provide molten metal that scatters on the surface of a workpiece during piercing processing, particularly when processing a thick plate metal, around the piercing hole. An object of the present invention is to provide a laser processing head which prevents adhesion and prevents adhesion to a nozzle opening and a side blow outlet.

上述の課題を解決する手段として請求項1に記載のレーザ加工ヘッドは、レーザ集光用光学系と該レーザ集光用光学系の光軸と同軸にアシストガスを噴射するノズルとを備えたレーザ加工ヘッドにおいて、該レーザ加工ヘッドに被加工材の表面方向へサイドブローガスを噴出させるサイドブローガス噴出口を設けると共に、該サイドブローガス噴出口から噴出したサイドブローガス流の方向を変更させる角度可変のサイドブローガス衝突板を設け、前記サイドブローガス流の流線(FL)と前記光軸との交差位置(P)が前記被加工材表面から−10mm〜20mmの高さの範囲になるよう調整可能に設け、被加工材の上方に飛散した溶融金属粒子を前記サイドブローガス流により冷却して凝固させると共に、前記サイドブローガス衝突板が前記サイドブローガス噴出口への侵入を阻止する保護機能を果たしていることを要旨とするものである。 The laser processing head according to claim 1, as means for solving the above-described problem, includes a laser condensing optical system and a nozzle that ejects an assist gas coaxially with the optical axis of the laser condensing optical system. In the processing head, the laser processing head is provided with a side blow gas jet port for jetting side blow gas in the direction of the surface of the workpiece, and an angle for changing the direction of the side blow gas flow jetted from the side blow gas jet port A variable side blow gas impingement plate is provided, and an intersection position (P) between the stream line (FL) of the side blow gas flow and the optical axis is in a range of −10 mm to 20 mm from the surface of the workpiece. The molten metal particles scattered above the workpiece are cooled and solidified by the side blow gas flow, and the side blow gas collision plate is The gist of the invention is that it has a protective function of preventing entry into the id blow gas outlet .

本発明によれば、ピアシング加工時に、特に厚板金属のピアシング加工時に被加工材表面上に飛散する多量の溶融金属がピアス穴の周囲に付着するのを防止することができる。   According to the present invention, it is possible to prevent a large amount of molten metal scattered on the surface of a workpiece during piercing processing, particularly during piercing processing of a thick plate metal, from adhering around the piercing hole.

これにより、ピアシング加工から切断工程に移行した際に、ノズル先端と凝固した溶融金属とが干渉してノズルを損傷したり、バーニングなどの不良切断を生じることが防止できる。   Thereby, when it transfers to a cutting process from a piercing process, it can prevent that a nozzle front-end | tip and the solidified molten metal interfere, and a nozzle is damaged or defective cuttings, such as burning, arise.

以下、本発明の実施の形態を図面によって説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図1は本発明に係るレーザ加工ヘッドの説明図である。図1において、レーザ加工ヘッド1の内部には、図示省略のレーザ光集光用の光学系として、例えば、集光レンズまたは凹面鏡などが設けてあり、炭酸ガスレーザなどのレーザ光源(図示省略)からのレーザ光を被加工材Wの表面へ集光することができるようになっている。   FIG. 1 is an explanatory view of a laser processing head according to the present invention. In FIG. 1, for example, a condensing lens or a concave mirror is provided inside the laser processing head 1 as an optical system for condensing laser light (not shown), and from a laser light source (not shown) such as a carbon dioxide laser. The laser beam can be condensed on the surface of the workpiece W.

また、前記レーザー加工ヘッド1の下端部には、酸素ガスなどのアシストガスをレーザ加工部へ噴射するため噴射口を備えたアシストガス噴射ノズル3が設けてある。このアシストガス噴射ノズル3の噴射口は前記レーザ光集光用の光学系の光軸Oと同軸に設けてあり、アシストガスと共に集光されたレーザ光LBが通過可能に設けてある。   Further, an assist gas injection nozzle 3 having an injection port for injecting an assist gas such as oxygen gas to the laser processing portion is provided at the lower end of the laser processing head 1. The injection port of the assist gas injection nozzle 3 is provided coaxially with the optical axis O of the optical system for condensing the laser light, and is provided so that the laser light LB condensed with the assist gas can pass therethrough.

前記レーザー加工ヘッド1の側部には、被加工材Wの方向へ垂下したサイドブローガス衝突板支持体5が設けてあり、このサイドブローガス衝突板支持体5にサイドブローガス衝突板7が被加工材Wの表面に対して、前記サイドブローガス衝突板支持体5に軸支された枢軸9を軸として回動調節可能に設けてある。   A side blow gas collision plate support 5 that hangs down in the direction of the workpiece W is provided on the side of the laser processing head 1, and a side blow gas collision plate 7 is provided on the side blow gas collision plate support 5. With respect to the surface of the workpiece W, it is provided so as to be able to rotate and rotate about a pivot 9 supported on the side blow gas collision plate support 5.

前記サイドブローガス衝突板7の角度調整範囲は、サイドブローガス衝突板7の表面と前記被加工材Wの表面とがなす角度θを、0度以上45度以下の範囲において回動調節可能に設けてある。   The angle adjustment range of the side blow gas collision plate 7 is such that the angle θ formed by the surface of the side blow gas collision plate 7 and the surface of the workpiece W can be adjusted in a range of 0 degrees to 45 degrees. It is provided.

また、前記サイドブローガス衝突板7の上方のレーザー加工ヘッド1には、サイドブローガスSGの噴出口11が設けてあり、この噴出口11は管路13を介して図示しないサイドブローガスSGの供給源に接続してある。なお、サイドブローガスSGには圧力0.1〜0.5MPaの空気またはアシストガス等を使用する。   The laser processing head 1 above the side blow gas impingement plate 7 is provided with a side blow gas SG outlet 11, which is connected to a side blow gas SG (not shown) via a conduit 13. Connected to the source. For the side blow gas SG, air having a pressure of 0.1 to 0.5 MPa or assist gas is used.

上述の図1の説明図は、被加工材Wにピアシング加工を行っている図を示したものであり、噴出口11から噴出したサイドブローガスSGが傾斜角度θを0度以上45度未満の範囲に調節したサイドブローガス衝突板7に衝突して、図1におては右方斜め下方に流れて行くようになり、このときのサイドブローガスSGの流線FLと集光レンズの光軸Oとの交差位置Pが被加工材Wの表面の上方Hで交差するように調節してある。なお、前記交差位置Pは、前記被加工材表面から−10mm〜20mmの高さ(H)の範囲で適宜な値に調節する。また、高さは被加工材Wの表面を基準とし、表面の上方を「+」下面方向を「−」とする。   The above-described explanatory view of FIG. 1 shows a view in which the workpiece W is pierced, and the side blow gas SG ejected from the ejection port 11 has an inclination angle θ of 0 degree or more and less than 45 degrees. 1 collides with the side blow gas collision plate 7 adjusted to the range, and flows to the right obliquely downward in FIG. 1, and the streamline FL of the side blow gas SG at this time and the light of the condenser lens The crossing position P with the axis O is adjusted so as to cross the upper part H of the surface of the workpiece W. The intersection position P is adjusted to an appropriate value within a range of -10 mm to 20 mm in height (H) from the workpiece surface. In addition, the height is based on the surface of the workpiece W, and “+” is defined above the surface and “−” is directed toward the bottom surface.

上述の交差位置Pを−10mm〜20mmの範囲のなかで、適宜な値(図1ではH>0)に調節した場合、被加工材Wから上方に飛散した溶融金属粒子15は、サイドブローガスSGの流れにより、被加工材Wの上方において、サイドブローガスSGの流れFLに沿って流されると同時に冷却され、凝固した金属粒子として被加工材Wの表面に落下するので被加工材Wにはほとんど付着することがない。   When the above-mentioned intersection position P is adjusted to an appropriate value (H> 0 in FIG. 1) within the range of −10 mm to 20 mm, the molten metal particles 15 scattered upward from the workpiece W become side blow gas. Due to the flow of SG, the workpiece W is cooled along with the flow FL of the side blow gas SG above the workpiece W, and is cooled and solidified as metal particles that fall onto the surface of the workpiece W. Hardly adheres.

さらに、ピアシング加工が進行した状態を図2に示してある。図2に示すように、ピアシング加工の進行途中では被加工材Wの上方に飛散した溶融金属粒子15は、サイドブローガスSGの流れFLに沿って流されると同時に冷却され、凝固した金属粒子として被加工材Wの表面に落下するが、えぐられたピアシング穴17の周囲には、サイドブローガスSGにより冷却されずに残った流動性を保持した溶融金属15’が環状に盛り上がるようにして成長する。   Further, FIG. 2 shows a state where the piercing process has progressed. As shown in FIG. 2, the molten metal particles 15 scattered above the workpiece W during the piercing process are cooled along with the flow FL of the side blow gas SG and simultaneously cooled and solidified as metal particles. Although it falls on the surface of the workpiece W, it grows around the piercing hole 17 so that the molten metal 15 ′ that retains fluidity without being cooled by the side blow gas SG rises in a ring shape. To do.

さらにピアシング加工が進行してピアス穴17が貫通した状態を図3に示してある。図3に示すように、ピアス穴17が貫通すると、ピアス穴17を通過するアシストガスに引かれて前記溶融金属15’はピアス穴17内に引き込まれて下方に落下していき、図4に示すようにピアシング加工が完了した状態では、被加工材Wの表面には箔状に付着した箔状付着物15”としてしか残らない。   FIG. 3 shows a state in which the piercing process has further progressed and the piercing hole 17 has penetrated. As shown in FIG. 3, when the piercing hole 17 penetrates, the molten metal 15 ′ is drawn into the piercing hole 17 by the assist gas passing through the piercing hole 17, and falls downward. As shown, in the state where the piercing process is completed, the surface of the workpiece W remains only as a foil-like deposit 15 ″ attached in the form of a foil.

なお、前記サイドブローガス衝突板7は、サイドブローを使用しないピアス加工や通常の切断加工時においてサイドブローを止めていても、加工時に発生する溶融金属粒(スパッター)が噴出口11に侵入を阻止する保護機能も果たしている。   The side blow gas impingement plate 7 prevents the molten metal particles (sputter) generated during processing from entering the ejection port 11 even if the side blow is stopped at the time of piercing or normal cutting without using the side blow. It also plays a protective function to prevent it.

さらに、噴出口11から噴出したサイドブローガスSGが傾斜角度θを0度以上45度未満の範囲に調節したサイドブローガス衝突板7に衝突して、図1におては右方斜め下方に流れて行くときには、サイドブローガス衝突板7の背後(図1において左側)から空気19を巻き込んで流出するので、サイドブローの流量を増加させて溶融金属の吹き飛ばし効果を高めている。   Further, the side blow gas SG ejected from the ejection port 11 collides with the side blow gas collision plate 7 whose inclination angle θ is adjusted to a range of 0 degree or more and less than 45 degrees, and in FIG. When flowing, the air 19 is drawn in and flows out from behind the side blow gas collision plate 7 (left side in FIG. 1), so that the flow rate of the side blow is increased to enhance the effect of blowing molten metal.

また、サイドブローガス衝突板7の背後(図1において左側)が開放されているので、サイドブローガス衝突板7と噴出口11との間隙に溶融金属粒(スパッター)が侵入したとしても、そのまま背後に通過し、噴出口11に付着堆積することがないメリットもある。   In addition, since the back side (left side in FIG. 1) of the side blow gas collision plate 7 is open, even if molten metal particles (sputter) enter the gap between the side blow gas collision plate 7 and the jet port 11 There is also a merit that it does not pass through the back and deposit on the spout 11.

なお、上述のサイドブローガスSGの圧力(または流量)を周知の数値制御装置または手動で制御調節できるように設けてあると共に、サイドブローガスSGのオンオフのタイミングも同様に数値制御装置で制御できるようになっている。   The pressure (or flow rate) of the side blow gas SG is provided so as to be controlled and adjusted by a known numerical control device or manually, and the on / off timing of the side blow gas SG can be similarly controlled by the numerical control device. It is like that.

その結果、加工状態を監視しながらサイドブローガスSGの噴出効果を高めることができる。加えて、サイドブローガスSGのオンオフのタイミングを数値制御装置で制御することで、例えば、ピアス加工開始時はアシストガスをピアス加工点に集中させるため、サイドブローガスSGの供給を遅延させることが可能である。   As a result, it is possible to enhance the side blow gas SG ejection effect while monitoring the machining state. In addition, by controlling the on / off timing of the side blow gas SG with a numerical control device, for example, the supply of the side blow gas SG can be delayed in order to concentrate the assist gas at the piercing point at the start of piercing. Is possible.

本発明に係るレーザ加工ヘッドの説明図。Explanatory drawing of the laser processing head which concerns on this invention. 図1の状態からピアシング加工が進行した状態の説明図。Explanatory drawing of the state which the piercing process advanced from the state of FIG. 図2の状態からピアシング加工が進行してピアス穴が貫通した状態の説明図。Explanatory drawing of the state which the piercing hole penetrated from the state of FIG. 2, and the piercing hole penetrated. ピアシング加工が完了した状態の説明図。Explanatory drawing of the state which completed the piercing process.

符号の説明Explanation of symbols

1 レーザ加工ヘッド
3 アシストガス噴射ノズル
5 サイドブローガス衝突板支持体
7 サイドブローガス衝突板
9 枢軸
11 サイドブローガスSGの噴出口
13 管路
15 溶融金属粒子
15’ 流動性を保持した溶融金属
15” 箔状付着物
17 ピアス穴
19 空気
FL サイドブローガスSGの流線
O 光軸
P 流線FLと集光レンズの光軸Oとの交差位置
SG サイドブローガス
W 被加工材
DESCRIPTION OF SYMBOLS 1 Laser processing head 3 Assist gas injection nozzle 5 Side blow gas collision board support body 7 Side blow gas collision board 9 Axis 11 Side blow gas SG outlet 13 Pipe line 15 Molten metal particle 15 'Molten metal 15 which maintained fluidity ”Foil-like deposit 17 Pierce hole 19 Air FL Stream line of side blow gas SG O Optical axis P Crossing position of stream line FL and optical axis O of condenser lens SG Side blow gas W Work material

Claims (1)

レーザ集光用光学系と該レーザ集光用光学系の光軸と同軸にアシストガスを噴射するノズルとを備えたレーザ加工ヘッドにおいて、該レーザ加工ヘッドに被加工材の表面方向へサイドブローガスを噴出させるサイドブローガス噴出口を設けると共に、該サイドブローガス噴出口から噴出したサイドブローガス流の方向を変更させる角度可変のサイドブローガス衝突板を設け、前記サイドブローガス流の流線(FL)と前記光軸との交差位置(P)が前記被加工材表面から−10mm〜20mmの高さの範囲になるよう調整可能に設け、被加工材の上方に飛散した溶融金属粒子を前記サイドブローガス流により冷却して凝固させると共に、前記サイドブローガス衝突板が前記サイドブローガス噴出口への侵入を阻止する保護機能を果たしていることを特徴とするレーザ加工ヘッド。 In a laser processing head comprising a laser focusing optical system and a nozzle for injecting an assist gas coaxially with the optical axis of the laser focusing optical system, a side blow gas is applied to the laser processing head toward the surface of the workpiece. And a side blow gas impingement plate of variable angle for changing the direction of the side blow gas flow ejected from the side blow gas jet port, and a streamline of the side blow gas flow ( FL) and the optical axis crossing position (P) can be adjusted so as to be in a range of −10 mm to 20 mm from the surface of the workpiece, and the molten metal particles scattered above the workpiece are It is cooled and solidified by the side blow gas flow, and the side blow gas impingement plate performs a protective function to prevent entry into the side blow gas jet port. A featured laser processing head.
JP2004112938A 2004-04-07 2004-04-07 Laser processing head Expired - Fee Related JP4656855B2 (en)

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CN107931838A (en) * 2017-12-16 2018-04-20 洛阳鹏起实业有限公司 Laser soldering device and its side-blown gas shielded structure, position regulating part
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JPH11320171A (en) * 1998-05-13 1999-11-24 Matsushita Electric Ind Co Ltd Method and device for boring by laser irradiation
JP2000084686A (en) * 1998-09-09 2000-03-28 Tanaka Seisakusho Kk Laser piercing method, laser machining nozzle and laser cutting device
JP2001038473A (en) * 1999-07-27 2001-02-13 Amada Co Ltd Dust collector
JP2001287076A (en) * 2000-04-10 2001-10-16 Tanaka Engineering Works Ltd Piercing device for laser cutting machine

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Publication number Priority date Publication date Assignee Title
JPH06337200A (en) * 1993-04-01 1994-12-06 Mitsubishi Heavy Ind Ltd Thrusting apparatus for missile
JPH08290285A (en) * 1995-04-19 1996-11-05 Mitsubishi Electric Corp Laser machining method
JPH09277071A (en) * 1996-04-18 1997-10-28 Nisshinbo Ind Inc Method and device for laser beam machining
JPH11123578A (en) * 1997-10-22 1999-05-11 Isuzu Motors Ltd Laser machining head
JPH11320171A (en) * 1998-05-13 1999-11-24 Matsushita Electric Ind Co Ltd Method and device for boring by laser irradiation
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JP2001038473A (en) * 1999-07-27 2001-02-13 Amada Co Ltd Dust collector
JP2001287076A (en) * 2000-04-10 2001-10-16 Tanaka Engineering Works Ltd Piercing device for laser cutting machine

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