JP4656735B2 - デュアルレーザ衝撃ピーニング - Google Patents

デュアルレーザ衝撃ピーニング Download PDF

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Publication number
JP4656735B2
JP4656735B2 JP2001020886A JP2001020886A JP4656735B2 JP 4656735 B2 JP4656735 B2 JP 4656735B2 JP 2001020886 A JP2001020886 A JP 2001020886A JP 2001020886 A JP2001020886 A JP 2001020886A JP 4656735 B2 JP4656735 B2 JP 4656735B2
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Japan
Prior art keywords
laser
spot
spots
article
processing plane
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Expired - Fee Related
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JP2001020886A
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English (en)
Japanese (ja)
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JP2001293583A (ja
JP2001293583A5 (https=
Inventor
マイケル・エバンス・グラハム
ジョン・デニス・ジャクソン
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General Electric Co
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General Electric Co
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    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D10/00—Modifying the physical properties by methods other than heat treatment or deformation
    • C21D10/005—Modifying the physical properties by methods other than heat treatment or deformation by laser shock processing

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Knitting Machines (AREA)
JP2001020886A 2000-01-31 2001-01-30 デュアルレーザ衝撃ピーニング Expired - Fee Related JP4656735B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/494,715 US6479790B1 (en) 2000-01-31 2000-01-31 Dual laser shock peening
US09/494715 2000-01-31

Publications (3)

Publication Number Publication Date
JP2001293583A JP2001293583A (ja) 2001-10-23
JP2001293583A5 JP2001293583A5 (https=) 2008-03-13
JP4656735B2 true JP4656735B2 (ja) 2011-03-23

Family

ID=23965666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001020886A Expired - Fee Related JP4656735B2 (ja) 2000-01-31 2001-01-30 デュアルレーザ衝撃ピーニング

Country Status (8)

Country Link
US (1) US6479790B1 (https=)
EP (1) EP1122321B1 (https=)
JP (1) JP4656735B2 (https=)
BR (1) BRPI0100222B1 (https=)
DE (1) DE60131482T2 (https=)
PL (1) PL196802B1 (https=)
SG (1) SG91326A1 (https=)
TR (1) TR200003699A2 (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6759626B2 (en) * 2001-08-01 2004-07-06 L&P Technologies, Inc. System for laser shock processing objects to produce enhanced stress distribution profiles
US6664506B2 (en) 2001-08-01 2003-12-16 Lsp Technologies, Inc. Method using laser shock processing to provide improved residual stress profile characteristics
US6875953B2 (en) 2002-07-29 2005-04-05 Lsp Technologies, Inc. Method using laser shock processing to provide improved residual stress profile characteristics
GB2398034B (en) 2003-02-04 2005-08-10 Rolls Royce Plc Laser shock peening
US6969821B2 (en) * 2003-06-30 2005-11-29 General Electric Company Airfoil qualification system and method
US7109436B2 (en) * 2003-08-29 2006-09-19 General Electric Company Laser shock peening target
US7148448B2 (en) * 2003-10-31 2006-12-12 General Electric Company Monitored laser shock peening
US8049137B2 (en) * 2004-02-13 2011-11-01 Boston Scientific Scimed, Inc. Laser shock peening of medical devices
US8132460B1 (en) 2004-09-27 2012-03-13 Lsp Technologies, Inc. Laser induced bond delamination
US7897895B2 (en) * 2006-05-01 2011-03-01 General Electric Company System and method for controlling the power level of a laser apparatus in a laser shock peening process
US8330070B2 (en) * 2006-05-11 2012-12-11 Kabushiki Kaisha Toshiba Laser shock hardening method and apparatus
FR2921448A1 (fr) * 2007-09-24 2009-03-27 Snecma Sa Procede de formation de reliefs pertubateurs de couche limite
US7509876B1 (en) 2007-10-17 2009-03-31 Lsp Technologies, Inc. Laser bond inspection using annular laser beam
DE102007056502B4 (de) 2007-11-22 2010-07-29 Eads Deutschland Gmbh Verfahren und Vorrichtung zum Aufbau von Eigenspannungen in einem metallischen Werkstück
US8359924B1 (en) 2010-07-01 2013-01-29 The Boeing Company Bond interface testing
WO2014055538A1 (en) * 2012-10-01 2014-04-10 United Technologies Corporation Methods for testing laser shock peening
US9764422B2 (en) 2013-03-15 2017-09-19 United Technologies Corporation Sequencing of multi-pass laser shock peening applications
US10434603B2 (en) * 2014-06-21 2019-10-08 Apple Inc. Forming a textured pattern using a laser
CN104862468B (zh) * 2015-06-11 2017-03-22 温州大学 基于激光双面冲击技术提高涡轮叶片寿命的方法
CN106112268B (zh) * 2016-07-22 2017-09-19 广东工业大学 一种带筋壁板激光喷丸成形系统及方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6160290A (ja) * 1984-08-31 1986-03-27 Toyota Motor Corp レ−ザを用いたワ−クの処理方法
US4638143A (en) * 1985-01-23 1987-01-20 Gmf Robotics Corporation Robot-laser system
US5072091A (en) * 1989-04-03 1991-12-10 The Local Government Of Osaka Prefecture Method and apparatus for metal surface process by laser beam
US4987044A (en) * 1989-05-31 1991-01-22 E. I. Du Pont De Nemours And Company Method and apparatus for maintaining desired exposure levels
US4937421A (en) * 1989-07-03 1990-06-26 General Electric Company Laser peening system and method
JPH03281083A (ja) * 1990-03-29 1991-12-11 Fanuc Ltd Ｃｎｃレーザ加工機の姿勢制御方式
JPH0437496A (ja) * 1990-05-31 1992-02-07 Fanuc Ltd レーザ加工機のノズル移動方式
US5268554A (en) 1992-06-29 1993-12-07 General Electric Co. Apparatus and system for positioning a laser beam
US5340962A (en) * 1992-08-14 1994-08-23 Lumonics Corporation Automatic control of laser beam tool positioning
US5492447A (en) * 1994-10-06 1996-02-20 General Electric Company Laser shock peened rotor components for turbomachinery
US6215097B1 (en) * 1994-12-22 2001-04-10 General Electric Company On the fly laser shock peening
US5591009A (en) * 1995-01-17 1997-01-07 General Electric Company Laser shock peened gas turbine engine fan blade edges
US5569018A (en) * 1995-03-06 1996-10-29 General Electric Company Technique to prevent or divert cracks
US5531570A (en) * 1995-03-06 1996-07-02 General Electric Company Distortion control for laser shock peened gas turbine engine compressor blade edges
US5674329A (en) * 1996-04-26 1997-10-07 General Electric Company Adhesive tape covered laser shock peening
US5822211A (en) * 1996-11-13 1998-10-13 International Business Machines Corporation Laser texturing apparatus with dual laser paths having an independently adjusted parameter
US5911890A (en) * 1997-02-25 1999-06-15 Lsp Technologies, Inc. Oblique angle laser shock processing
JP3213882B2 (ja) * 1997-03-21 2001-10-02 住友重機械工業株式会社 レーザ加工装置及び加工方法
US5904869A (en) * 1997-05-01 1999-05-18 Snk Corporation Automatic laser beam machining apparatus and performing automatic laser beam machining method
KR100446052B1 (ko) * 1997-05-15 2004-10-14 스미도모쥬기가이고교 가부시키가이샤 다수의갈바노스캐너를사용한레이저빔가공장치
US6068728A (en) * 1997-08-28 2000-05-30 Seagate Technology, Inc. Laser texturing with reverse lens focusing system
US5911891A (en) * 1997-09-11 1999-06-15 Lsp Technologies, Inc. Laser shock peening with tailored multiple laser beams
US6144012A (en) * 1997-11-05 2000-11-07 Lsp Technologies, Inc. Efficient laser peening
US6005219A (en) * 1997-12-18 1999-12-21 General Electric Company Ripstop laser shock peening
US5932120A (en) * 1997-12-18 1999-08-03 General Electric Company Laser shock peening using low energy laser
US6002706A (en) * 1997-12-30 1999-12-14 General Electric Company Method and apparatus for controlling the size of a laser beam
US6292584B1 (en) * 1998-04-08 2001-09-18 Lsp Technologies, Inc. Image processing for laser peening
US6075593A (en) * 1999-08-03 2000-06-13 General Electric Company Method for monitoring and controlling laser shock peening using temporal light spectrum analysis
US6296448B1 (en) * 1999-09-30 2001-10-02 General Electric Company Simultaneous offset dual sided laser shock peening

Also Published As

Publication number Publication date
BRPI0100222B1 (pt) 2017-04-25
PL344732A1 (en) 2001-08-13
US6479790B1 (en) 2002-11-12
EP1122321A3 (en) 2003-11-05
JP2001293583A (ja) 2001-10-23
SG91326A1 (en) 2002-09-17
TR200003699A2 (tr) 2001-09-21
EP1122321B1 (en) 2007-11-21
DE60131482D1 (de) 2008-01-03
BR0100222A (pt) 2001-09-18
PL196802B1 (pl) 2008-02-29
EP1122321A2 (en) 2001-08-08
DE60131482T2 (de) 2008-09-18

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