JP4655523B2 - Epoxy resin composition for display element substrate and plastic substrate for display element - Google Patents
Epoxy resin composition for display element substrate and plastic substrate for display element Download PDFInfo
- Publication number
- JP4655523B2 JP4655523B2 JP2004197904A JP2004197904A JP4655523B2 JP 4655523 B2 JP4655523 B2 JP 4655523B2 JP 2004197904 A JP2004197904 A JP 2004197904A JP 2004197904 A JP2004197904 A JP 2004197904A JP 4655523 B2 JP4655523 B2 JP 4655523B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- display element
- substrate
- resin composition
- element substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
本発明は、耐熱性および透明性に優れた表示素子基板用エポキシ樹脂組成物および表示素子用プラスチック基板に関する。 The present invention relates to an epoxy resin composition for a display element substrate and a plastic substrate for a display element that are excellent in heat resistance and transparency.
近年、液晶表示素子には薄膜化、軽量化、大型化、曲面表示対応などの高度な要求がある。特に携帯機器については軽量化、高耐久性が強く要求され、これらの利用が拡大されるにつれて、従来のガラス基板に代わり軽くて割れ難い、透明プラスチックを基板とする液晶表示パネルが検討され一部で実用化され始めた。
表示素子用プラスチック基板に用いられる樹脂は例えば特許文献１には脂環式エポキシ樹脂、酸無水物系硬化剤、アルコール、硬化触媒からなる組成物、特許文献２には脂環式エポキシ樹脂、アルコールで部分エステル化した酸無水物系硬化剤、硬化触媒からなる樹脂組成物が、特許文献３には脂環式エポキシ樹脂、カルボン酸を有する酸無水物系硬化剤、硬化触媒からなる樹脂組成物が、また特許文献４にはｏ−クレゾールノボラック型エポキシ樹脂、酸無水物系硬化剤からなる樹脂組成物が示されている。しかしながらこれらの文献に示さる従来の表示素子基板用樹脂は、透明性は高いもののガラス転移温度が２００℃以下であり高温プロセスを必要とする場合には高温での基板の強度や弾性率が不十分で基板が変形するおそれがあった。また、ガラス転移温度が２００℃以上のエポキシ樹脂も公知であるが表示素子用プラスチック基板として用いるには透明性が不十分であった。
In recent years, liquid crystal display elements have high demands such as thinning, lightening, large size, and curved display. Especially for portable devices, weight reduction and high durability are strongly demanded, and as these uses are expanded, liquid crystal display panels using transparent plastic substrates instead of conventional glass substrates are being studied. It began to be put into practical use.
Resin used for the plastic substrate for display elements is, for example, a composition comprising an alicyclic epoxy resin, an acid anhydride curing agent, alcohol and a curing catalyst in Patent Document 1, and an alicyclic epoxy resin and alcohol in Patent Document 2. A resin composition comprising an acid anhydride-based curing agent partially esterified with a curing catalyst and a curing catalyst, Patent Document 3 discloses a resin composition comprising an alicyclic epoxy resin, an acid anhydride-based curing agent having a carboxylic acid, and a curing catalyst. However, Patent Document 4 discloses a resin composition comprising an o-cresol novolac type epoxy resin and an acid anhydride curing agent. However, the conventional resins for display element substrates shown in these documents have high transparency, but have a glass transition temperature of 200 ° C. or lower, and when the high temperature process is required, the strength and elastic modulus of the substrate at high temperatures are poor. There was a possibility that the substrate was sufficiently deformed. An epoxy resin having a glass transition temperature of 200 ° C. or higher is also known, but its transparency is insufficient for use as a plastic substrate for a display element.
本発明は耐熱性および透明性が高い表示素子用プラスチック基板を提供することを目的とする。 An object of this invention is to provide the plastic substrate for display elements with high heat resistance and transparency.
本発明者らは上記課題を達成すべく鋭意検討した。その結果、エポキシ樹脂（ａ）およびカチオン系硬化触媒（ｂ）からなり、硬化物のガラス転移温度が２００℃以上であり、かつ４００ｎｍにおける光線透過率が８０％以上であるエポキシ樹脂組成物が液晶表示素子、カラーフィルター、有機ＥＬ表示素子、電子ペーパー、タッチパネル等の表示素子に好適に利用できることを見出し本発明を完成するに至った。 The present inventors diligently studied to achieve the above problems. As a result, an epoxy resin composition comprising an epoxy resin (a) and a cationic curing catalyst (b), the cured product having a glass transition temperature of 200 ° C. or higher, and a light transmittance at 400 nm of 80% or higher is a liquid crystal. The present invention has been completed by finding that it can be suitably used for display elements such as display elements, color filters, organic EL display elements, electronic paper, and touch panels.
すなわち本発明は
（１） 少なくともエポキシ樹脂（ａ）およびカチオン系硬化触媒（ｂ）からなり、硬化物のガラス転移温度が２００℃以上であり、かつ４００ｎｍにおける光線透過率が８０％以上である表示素子基板用エポキシ樹脂組成物。
（２） 前記エポキシ樹脂（ａ）が下記化学式（１）で示される脂環式エポキシ樹脂を主成分とする（１）記載の表示素子基板用エポキシ樹脂組成物。
成物、
（５） （１）〜（４）の表示素子基板用エポキシ樹脂組成物からなる表示素子用プラスチック基板、
である。
That is, the present invention is (1) a display comprising at least an epoxy resin (a) and a cationic curing catalyst (b), a cured product having a glass transition temperature of 200 ° C. or higher and a light transmittance of 80% or higher at 400 nm. Epoxy resin composition for element substrate.
(2) The epoxy resin composition for a display element substrate according to (1), wherein the epoxy resin (a) is mainly composed of an alicyclic epoxy resin represented by the following chemical formula (1).
(5) A plastic substrate for display elements comprising the epoxy resin composition for display element substrates of (1) to (4),
It is.
本発明のエポキシ樹脂組成物からなる表示素子用プラスチック基板は耐熱性、及び透明性に優れ、液晶表示素子用プラスチック基板、カラーフィルター用基板、有機ＥＬ用基板、電子ペーパー、タッチパネルなどに好適に利用できる。 The plastic substrate for display elements comprising the epoxy resin composition of the present invention is excellent in heat resistance and transparency, and is suitably used for plastic substrates for liquid crystal display elements, color filter substrates, organic EL substrates, electronic paper, touch panels, etc. it can.
以下、本発明を詳細に説明する。
本発明の表示素子基板用エポキシ樹脂組成物は、硬化後の厚み３００μｍのシートで波長４００ｎｍの光線透過率が８０％以上であり、さらに好ましくは、８５％以上である。厚み３００μｍのシートで波長４００ｎｍの光線透過率が８０％以下の場合は、着色が認められる傾向にあり好ましくない。また、本発明の、表示素子基板用エポキシ樹脂組成物の硬化後のガラス転移温度は、２００℃以上であり、好ましくは２２０℃以上、より好ましくは２５０℃以上である。ガラス転移温度が２００℃以下であると高温プロセスにおいて、高温での基板の強度や弾性率が不十分で基板が変形するおそれがある。
本発明に用いられるエポキシ樹脂（ａ）としては硬化後に硬化物のガラス転移温度が２００℃以上でかつ４００ｎｍにおける光線透過率が８０％以上となるものであれば特に限定されないが、高耐熱性で良好な透明性を有することから脂環式エポキシ樹脂、脂環構造を有する多官能エポキシ樹脂、トリグリシジルイソシアヌレート型エポキシ樹脂などが好ましい。中でも一般式（１）で表される脂環式エポキシ樹脂、一般式（２）で表される水
添ビフェニル型脂環式エポキシ樹脂、一般式（３）で表される脂環構造を有する多官能エポキシ樹脂がより好ましく、一般式（１）でＸが−Ｃ(ＣＨ3)2−である２，２−ビス（３’，４’−エポキシシクロヘキシル）プロパンおよび一般式（２）で表される水添ビフェニル型エポキシ樹脂が最も好ましい。
Hereinafter, the present invention will be described in detail.
The epoxy resin composition for a display element substrate of the present invention is a sheet having a thickness of 300 μm after curing, and has a light transmittance at a wavelength of 400 nm of 80% or more, more preferably 85% or more. A sheet having a thickness of 300 μm and a light transmittance at a wavelength of 400 nm of 80% or less is not preferable because coloring tends to be observed. Moreover, the glass transition temperature after hardening of the epoxy resin composition for display element substrates of this invention is 200 degreeC or more, Preferably it is 220 degreeC or more, More preferably, it is 250 degreeC or more. If the glass transition temperature is 200 ° C. or lower, the substrate may be deformed due to insufficient strength and elastic modulus of the substrate at a high temperature in a high temperature process.
The epoxy resin (a) used in the present invention is not particularly limited as long as the glass transition temperature of the cured product is 200 ° C. or higher and the light transmittance at 400 nm is 80% or higher after curing. An alicyclic epoxy resin, a polyfunctional epoxy resin having an alicyclic structure, a triglycidyl isocyanurate type epoxy resin and the like are preferable because of having good transparency. Among them, an alicyclic epoxy resin represented by the general formula (1), a hydrogenated biphenyl type alicyclic epoxy resin represented by the general formula (2), and a polycyclic compound having an alicyclic structure represented by the general formula (3). A functional epoxy resin is more preferable, and is represented by 2,2-bis (3 ′, 4′-epoxycyclohexyl) propane having the general formula (1) and X being —C (CH 3 ) 2 — and the general formula (2). Most preferred is a hydrogenated biphenyl type epoxy resin.
本発明で用いられるカチオン系硬化触媒（ｂ）としては、加熱によりカチオン重合を開始させる物質を放出する開始剤や活性エネルギー線によってカチオン重合を開始させる物質を放出させる開始剤などがあげられるが、耐熱性が高い硬化物が得られることから加熱によりカチオン重合を開始する物質を放出する開始剤、すなわち熱カチオン系硬化触媒が好ましい。 Examples of the cationic curing catalyst (b) used in the present invention include an initiator that releases a substance that initiates cationic polymerization by heating, an initiator that releases a substance that initiates cationic polymerization by active energy rays, and the like. Since a cured product having high heat resistance is obtained, an initiator that releases a substance that initiates cationic polymerization by heating, that is, a thermal cationic curing catalyst is preferable.
好ましい熱カチオン硬化触媒としては、芳香族スルホニウム塩、芳香族ヨードニウム塩
、アルミニウムキレートなどがある。具体的な例としては、芳香族スルホニウム塩としては三新化学工業製のＳＩ−６０Ｌ、ＳＩ−８０Ｌ、ＳＩ−１００Ｌ、旭電化工業製のＳＰ−１７０やＳＰ−１５０（変更：ＣＰ−６６やＣＰ−７７）などがあり、アルミニウムキレートとしては、ダイセル化学工業製ＤＡＩＣＡＴ ＥＸ−１などがあげられる。
Preferred thermal cation curing catalysts include aromatic sulfonium salts, aromatic iodonium salts, aluminum chelates and the like. Specific examples of the aromatic sulfonium salt include SI-60L, SI-80L, SI-100L manufactured by Sanshin Chemical Industry, SP-170 and SP-150 manufactured by Asahi Denka Kogyo (change: CP-66, CP-77) and the like, and examples of the aluminum chelate include DAICAT EX-1 manufactured by Daicel Chemical Industries.
本発明の表示素子基板用エポキシ樹脂組成物を、液晶表示素子用基板、カラーフィルター用基板、有機ＥＬ表示素子用プラスチック基板、電子ペーパー用基板、太陽電池基板、タッチパネル等として用いる場合は、基板の厚さが５０〜２０００μｍであることが好ましい。基板の厚さがこの範囲内にあれば、平坦性に優れ、ガラス基板と比較して、基板の軽量化を図ることができる。 When the epoxy resin composition for a display element substrate of the present invention is used as a substrate for a liquid crystal display element, a substrate for a color filter, a plastic substrate for an organic EL display element, a substrate for electronic paper, a solar cell substrate, a touch panel, etc. The thickness is preferably 50 to 2000 μm. If the thickness of the substrate is within this range, the flatness is excellent, and the weight of the substrate can be reduced as compared with the glass substrate.
以下、本発明の内容を実施例により詳細に説明するが、本発明は、その要旨を越えない限り以下の例に限定されるものではない。 Hereinafter, the contents of the present invention will be described in detail by way of examples. However, the present invention is not limited to the following examples unless it exceeds the gist.
（実施例１）
水添ビフェニル型脂環式エポキシ樹脂（ダイセル化学工業製、Ｅ−ＢＰ）１００重量部に芳香族スルホニウム系熱カチオン触媒（三新化学工業製、ＳＩ−１００Ｌ）１重量部を溶融混合し、８０℃／２ｈ、２００℃／２ｈ硬化し厚さ３００μｍのシートを得た。
（実施例２）
水添ビフェニル型脂環式エポキシ樹脂（ダイセル化学製、Ｅ−ＢＰ）１００重量部にアルミニウムキレート系熱カチオン触媒（ダイセル化学工業製、ＤＡＩＣＡＴ ＥＸ−１ Ａ剤／Ｂ剤＝１／３）２重量部を溶融混合し、８０℃／２ｈ、２００℃／２ｈ硬化し厚さ３００μｍのシートを得た。
（実施例３）
２，２−ビス（３’，４’−エポキシシクロヘキシル）プロパン（ダイセル化学工業製、Ｅ−ＤＯＡ）１００重量部に芳香族スルホニウム系熱カチオン触媒（三新化学工業製、ＳＩ−１００Ｌ）１重量部を溶融混合し、８０℃／２ｈ、２５０℃／２ｈ硬化し厚さ３００μｍのシートを得た。
Example 1
80 parts by weight of a hydrogenated biphenyl-type alicyclic epoxy resin (Daicel Chemical Industries, E-BP) and 1 part by weight of an aromatic sulfonium thermal cation catalyst (Sanshin Chemical Industries, SI-100L) are melt-mixed, 80 C./2h and 200.degree. C./2h were cured to obtain a sheet having a thickness of 300 .mu.m.
(Example 2)
100 parts by weight of a hydrogenated biphenyl type alicyclic epoxy resin (manufactured by Daicel Chemical Industries, E-BP) and 2 parts by weight of an aluminum chelate-based thermal cation catalyst (manufactured by Daicel Chemical Industries, DAICAT EX-1 A agent / B agent = 1/3) The parts were melt mixed and cured at 80 ° C./2 h and 200 ° C./2 h to obtain a sheet having a thickness of 300 μm.
(Example 3)
1,100 parts by weight of 2,2-bis (3 ′, 4′-epoxycyclohexyl) propane (Daicel Chemical Industries, E-DOA) and 1 weight of an aromatic sulfonium-based thermal cation catalyst (Sanshin Chemical Industries, SI-100L) The parts were melt mixed and cured at 80 ° C./2 h and 250 ° C./2 h to obtain a sheet having a thickness of 300 μm.
（比較例１）
ビスフェノールＡ型エポキシ樹脂樹脂（ＪＥＲ（株）製、エピコート８２８）１００重量部、メチルヘキサヒドロフタル酸（新日本理化株式会社製、ＭＨ−７００）７８重量部、テトラフェニルホスホニウムブロマイド（北興化学工業製、ＴＰＰ−ＰＢ）１重量部を溶融混合し１００℃／２ｈ、２００℃／２ｈ硬化し厚さ３００μｍのシートを得た。
（比較例２）脂環式エポキシ樹脂（ダイセル化学工業製、ＣＥＬ−２０２１Ｐ）１００重量部、メチルヘキサヒドロフタル酸（新日本理化株式会社製、ＭＨ−７００）１１４重量部、テトラフェニルホスホニウムブロマイド（北興化学工業製、ＴＰＰ−ＰＢ）１重量部を溶融混合し１００℃／２ｈ、２００℃／２ｈ硬化し厚さ３００μｍのシートを得た。
以上のようにして作製した光学シートについて、下記に示す評価方法により、各種特性を測定した。
(Comparative Example 1)
100 parts by weight of bisphenol A type epoxy resin (manufactured by JER Corporation, Epicoat 828), 78 parts by weight of methylhexahydrophthalic acid (manufactured by Shin Nippon Rika Co., Ltd., MH-700), tetraphenylphosphonium bromide (manufactured by Hokuko Chemical Industries) , TPP-PB) 1 part by weight was melt-mixed and cured at 100 ° C./2 h and 200 ° C./2 h to obtain a sheet having a thickness of 300 μm.
Comparative Example 2 Alicyclic epoxy resin (Daicel Chemical Industries, CEL-2021P) 100 parts by weight, Methylhexahydrophthalic acid (manufactured by Shin Nippon Rika Co., Ltd., MH-700) 114 parts by weight, tetraphenylphosphonium bromide ( 1 part by weight of TPP-PB) manufactured by Hokuko Chemical Co., Ltd. was melt-mixed and cured at 100 ° C / 2h and 200 ° C / 2h to obtain a sheet having a thickness of 300 µm.
About the optical sheet produced as mentioned above, various characteristics were measured by the evaluation method shown below.
実施例、比較例の配合及び結果を表１、表２にそれぞれ示す。
ａ）耐熱性（Ｔｇ）
セイコー電子（株）製ＤＭＳ―２１０型粘弾性測定装置で測定し、１Ｈｚでのｔａｎδの最大値をガラス転移温度（Ｔｇ）とした。
ｂ）光線透過率
分光光度計Ｕ３２００（島津製作所製）で４００ｎｍ及び５５０ｎｍの光線透過率を測定した。
The formulations and results of Examples and Comparative Examples are shown in Tables 1 and 2, respectively.
a) Heat resistance (Tg)
Measured with a DMS-210 viscoelasticity measuring device manufactured by Seiko Electronics Co., Ltd., and the maximum value of tan δ at 1 Hz was defined as the glass transition temperature (Tg).
b) Light transmittance The light transmittance at 400 nm and 550 nm was measured with a spectrophotometer U3200 (manufactured by Shimadzu Corporation).
実施例１〜３の表示素子基板用エポキシ樹脂組成物からなるシートはガラス転移温度が２００℃でかつ光線透過率も８０％で以上であり、耐熱性、透明性ともに優れており、表示素子用プラスチック基板として好適に用いることができる。 Sheets comprising the epoxy resin compositions for display element substrates of Examples 1 to 3 have a glass transition temperature of 200 ° C. and a light transmittance of 80% or more, and are excellent in both heat resistance and transparency. It can be suitably used as a plastic substrate.
本発明のエポキシ樹脂組成物は液晶表示素子用プラスチック基板、カラーフィルター用基板、有機ＥＬ表示素子用プラスチック基板、電子ペーパー用基板、タッチパネル、等に好適に利用できる。 The epoxy resin composition of the present invention can be suitably used for a liquid crystal display element plastic substrate, a color filter substrate, an organic EL display element plastic substrate, an electronic paper substrate, a touch panel, and the like.
Claims (3)
前記エポキシ樹脂（ａ）が、下記化学式（１）または（２）で示される脂環式エポキシ樹脂を主成分とする表示素子基板用エポキシ樹脂組成物（硬化促進剤を含むものを除く）。
（式中、Ｘは酸素原子、硫黄原子、−ＳＯ−、−ＳＯ２−、−ＣＨ２−、−ＣＨ（ＣＨ３）−、−Ｃ（ＣＨ ３ ） ２ − の２価の基である。）
The epoxy resin (a) is an epoxy resin composition for a display element substrate (excluding one containing a curing accelerator) whose main component is an alicyclic epoxy resin represented by the following chemical formula (1) or (2).
(In the formula, X is an oxygen atom, sulfur atom, —SO—, —SO 2 —, —CH 2 —, —CH (CH 3 ) —, —C (CH 3 ) 2 — ) . )
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004197904A JP4655523B2 (en) | 2003-07-07 | 2004-07-05 | Epoxy resin composition for display element substrate and plastic substrate for display element |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003192618 | 2003-07-07 | ||
| JP2003426409 | 2003-12-24 | ||
| JP2004197904A JP4655523B2 (en) | 2003-07-07 | 2004-07-05 | Epoxy resin composition for display element substrate and plastic substrate for display element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005240004A JP2005240004A (en) | 2005-09-08 |
| JP4655523B2 true JP4655523B2 (en) | 2011-03-23 |
Family
ID=35022059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004197904A Expired - Fee Related JP4655523B2 (en) | 2003-07-07 | 2004-07-05 | Epoxy resin composition for display element substrate and plastic substrate for display element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4655523B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4742538B2 (en) * | 2004-08-25 | 2011-08-10 | 住友ベークライト株式会社 | Resin composition and semiconductor product |
| JP2013167868A (en) * | 2011-12-01 | 2013-08-29 | Sumitomo Bakelite Co Ltd | Image display device |
| JP2015030839A (en) * | 2013-08-06 | 2015-02-16 | 東京応化工業株式会社 | Method for manufacturing cured product |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0728043A (en) * | 1993-05-12 | 1995-01-31 | Nitto Denko Corp | Transparent resin substrate for liquid crystal display element |
| JPH1054979A (en) * | 1996-08-12 | 1998-02-24 | Nitto Denko Corp | Liquid crystal display element substrate |
| JP2001172367A (en) * | 1999-12-17 | 2001-06-26 | Daicel Chem Ind Ltd | Curable resin composition, color filter protection film using the same, color filter, and liquid crystal display |
| JP2002338659A (en) * | 2001-05-14 | 2002-11-27 | Daicel Chem Ind Ltd | Liquid epoxy resin composition and use thereof |
| JP2003048293A (en) * | 2001-08-07 | 2003-02-18 | Sumitomo Bakelite Co Ltd | Multi-layer resin sheet |
| JP2004307846A (en) * | 2003-03-24 | 2004-11-04 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for substrate of display element |
-
2004
- 2004-07-05 JP JP2004197904A patent/JP4655523B2/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0728043A (en) * | 1993-05-12 | 1995-01-31 | Nitto Denko Corp | Transparent resin substrate for liquid crystal display element |
| JPH1054979A (en) * | 1996-08-12 | 1998-02-24 | Nitto Denko Corp | Liquid crystal display element substrate |
| JP2001172367A (en) * | 1999-12-17 | 2001-06-26 | Daicel Chem Ind Ltd | Curable resin composition, color filter protection film using the same, color filter, and liquid crystal display |
| JP2002338659A (en) * | 2001-05-14 | 2002-11-27 | Daicel Chem Ind Ltd | Liquid epoxy resin composition and use thereof |
| JP2003048293A (en) * | 2001-08-07 | 2003-02-18 | Sumitomo Bakelite Co Ltd | Multi-layer resin sheet |
| JP2004307846A (en) * | 2003-03-24 | 2004-11-04 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for substrate of display element |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005240004A (en) | 2005-09-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101766259B1 (en) | Liquid crystal aligning agent, liquid crystal alignment film, process for producing phase difference film, the phase difference film, and liquid crystal display device | |
| JP6610253B2 (en) | Thermosetting resin composition, cured film, substrate with cured film, and electronic component | |
| JP3797288B2 (en) | Resin composition and protective film | |
| JP5284586B2 (en) | Epoxy resin, epoxy resin composition and cured product thereof | |
| US20180361719A1 (en) | Scratch repair film | |
| CN109996841A (en) | Hard coat film | |
| JP5163847B2 (en) | Curable resin composition, protective film and method for forming the same | |
| JP5302496B2 (en) | Cationic curable epoxy resin composition | |
| KR100919743B1 (en) | Particle, Composition and Protecting Film | |
| KR20180040591A (en) | Curable composition and its cured product | |
| KR20050000331A (en) | Curable Resin Composition, Protective Film and Process for Forming the Same | |
| JP2012241118A (en) | Thermosetting resin composition and optical element | |
| TW200909552A (en) | Optical adhesive for substrate bonding and optical adhesive cured body for substrate bonding | |
| WO2014181787A1 (en) | Curable epoxy resin composition and cured product thereof, diolefin compound and production method therefor, and production method for diepoxy compound | |
| JP2004285125A (en) | Epoxy resin composition and its cured product | |
| JP4655523B2 (en) | Epoxy resin composition for display element substrate and plastic substrate for display element | |
| JP2006176746A (en) | Copolymer, resin composition, protecting film and method for forming protecting film | |
| JP5224030B2 (en) | Thermosetting resin composition, protective film and method for forming protective film | |
| JP2006176586A (en) | Transparent composite composition and optical sheet and plastic substrate for display device | |
| KR20180081038A (en) | The long-chain alkylene group-containing epoxy resin composition | |
| JP3788199B2 (en) | Polyfunctional oxetane compound and method for producing the same, and cationic curable composition comprising the oxetane compound | |
| JP2004307846A (en) | Epoxy resin composition for substrate of display element | |
| JP5310690B2 (en) | Epoxy resin composition and cured epoxy resin | |
| KR20180102081A (en) | Composition for forming a flexible device substrate | |
| JP7164526B2 (en) | Resin composition for forming hard coat layer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070604 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100212 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A132 Effective date: 20100601 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100802 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20101130 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20101213 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140107 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| LAPS | Cancellation because of no payment of annual fees |