JP4647815B2 - Release sheet for prepreg material molding - Google Patents

Release sheet for prepreg material molding Download PDF

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Publication number
JP4647815B2
JP4647815B2 JP2001095094A JP2001095094A JP4647815B2 JP 4647815 B2 JP4647815 B2 JP 4647815B2 JP 2001095094 A JP2001095094 A JP 2001095094A JP 2001095094 A JP2001095094 A JP 2001095094A JP 4647815 B2 JP4647815 B2 JP 4647815B2
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Prior art keywords
resin
film
release sheet
heat
prepreg material
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JP2002292800A (en
Inventor
真一 橋本
裕志 榎並
稔 中原
隆志 渡辺
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Panac Co Ltd
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Panac Co Ltd
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  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Laminated Bodies (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、円筒形、コの字型やH字型など各種形状の炭素繊維強化プラスチックを連続加熱成形するのに好適に使用できるプリプレグ材料成型用離型シートに関するものである。
【従来の技術】
炭素繊維やガラス繊維等の補強材にエポキシ樹脂やフェノール樹脂等の熱硬化性樹脂を含浸させたプリプレグ材料を加熱成形して任意の断面形状を持つ成型品を連続的に得ているが、これまでのところ、プリプレグ材料と金型間の離型シートとして、フッ素シートやポリメチルペンテン系樹脂シート(TPXを含む)、あるいはポリメチルペンテン系樹脂シートとポリエチレンテレフタレート(PET)を貼り合わせた複合シートが用いられてきた。しかしながら、フッ素シートを用いると、成形品へのフッ素の移行が接着性を落とすなどその後の加工性に悪影響を及ぼしたり、高コストになるとの難点があり、一方、ポリメチルペンテン系樹脂シートを用いると、加熱時の曲げ弾性や引っ張り強度などの機械的特性が不足するという欠点があった。
これに対して、機械的強度を補うためにPETとポリメチルペンテン系樹脂シートと貼り合わせた積層シートを用いると、機械的強度は改善されるが、加熱時にPETから析出するオリゴマーや擦過粉によって金型が汚染されると言う新たな欠点が生じた。
【0002】
【発明が解決しようとする課題】
本発明は、機械的強度に優れるとともに、加熱成型時に離型シートから析出するオリゴマーや擦過粉によって金型が汚染されることのないプリプレグ材料成型用離型シートを提供することを目的とする。
【0003】
【課題を解決するための手段】
本発明は、ポリメチルペンテン系樹脂シートなどの耐熱性と離型性を有するポリオレフィン樹脂フィルムとポリエステル樹脂フィルムなどの樹脂フィルムとの積層体に、さらにポリフェニレンサルファイドフィルムなどの骨格内にフェニル基を有する耐熱性エンジニリアリングプラスチックフィルムを上記樹脂フィルム、特にポリエステル樹脂フィルム上に設けて積層させると、上記課題を効率的に解決できるとの知見に基づいてなされたのである。
すなわち、本発明は、耐熱性と離型性を有するポリオレフィン樹脂フィルム、樹脂フィルム及び骨格内にフェニル基を有する耐熱性エンジニリアリングプラスチックフィルムがこの順序で積層されてなることを特徴とするプリプレグ材料成型用離型シートを提供する。
本発明は、又、上記離型シートの耐熱性と離型性を有するポリオレフィン樹脂フィルム層上にプリプレグ材料を配置し、加熱加圧成型し、次いで離型シートを剥離することを特徴とするプリプレグ材料の成型方法を提供する。
【0004】
【発明の実施の形態】
本発明で用いる耐熱性と離型性を有するポリオレフィン樹脂フィルムとしては、耐熱性を有し、かつプリプレグ材料に対して離型性を有するものである。具体的には、ポリメチルペンテン系樹脂フィルムやシクロオレフィン系樹脂フィルムなどがあげられる。これらのうち、ポリメチルペンテン系樹脂フィルムが好ましく、特に、4-メチル-1-ペンテン系樹脂フィルムが好ましい。これらは、三井化学株式会社製のオピュランTPXとして容易に入手することができる。厚みは任意であるが、10〜150μmであるのが好ましく、より好ましくは15〜100μmである。
本発明では、上記ポリオレフィン樹脂フィルムフィルムとして片面若しくは両面に(好ましくは片面に)、コロナ処理、プラズマ処理、ブラスト処理などの易接着処理、好ましくはコロナ処理が施されているものを用いるのが好ましい。
本発明で用いる樹脂フィルムとしては、特に制限無く用いることができ、ポリエチレンテレフタレート(PET)、ポリブチレンテレフタレ−ト、ポリカーボネート、アクリル系樹脂などのフィルムがあげられる。このうち、ポリエチレンテレフタレート(PET)、ポリブチレンテレフタレートなどのポリエステル樹脂フィルムが好ましく、特にPETが好ましい。これらは、東レ株式会社製のルミラーなどとして容易に入手可能である。厚みは任意であるが、500μm未満であるのが好ましく、より好ましくは5〜120μmである。
【0005】
本発明で用いる耐熱性エンジニリアリングプラスチックフィルムとしては加熱時のオリゴマー析出量が低く、加熱時の機械特性に優れるものが良い。このようなものとしては、ポリフェニレンサルファイドフィルムが好ましく、東レ株式会社製のトレリナなどがあげられる。厚みは任意であるが、100μm未満であるのが好ましく、より好ましくは5〜20μmである。
本発明では、耐熱性と離型性を有するポリオレフィン樹脂フィルム、樹脂フィルム及び骨格内にフェニル基を有する耐熱性エンジニリアリングプラスチックフィルムを、この順序で積層させる。この際、耐熱性を有するプラスチックフィルムの易接着処理された面が、ポリエステル系樹脂フィルムに対面するように積層するのがよい。又、積層法としては積層された離型シートに耐熱性を与えるものであれば特に制限無く用いることができ、接着剤を用いない場合は、超音波融着法、熱融着法がある。特に各接着フィルム間に接着剤層を施して行うのが好ましい。
【0006】
ここで耐熱性を有するプラスチックフィルムの易接着処理された面と樹脂フィルムとの接着には、ポリエステル系樹脂、ウレタン系樹脂、ポリエステル−ポリウレタン系樹脂、アクリル−ポリオール系樹脂、ポリオレフィン系樹脂、ポリイソシアネート系樹脂などを任意に組み合わせて用いることができるが、特にポリエステルポリオール系樹脂とポリイソシアネート系樹脂を組み合わせて用いるのが好ましい。一方ポリエステル系樹脂フィルムと耐熱性エンジニリアリングプラスチックフィルムとの接着にもポリエステル系樹脂、ウレタン系樹脂、ポリエステル−ポリウレタン系樹脂、アクリル−ポリオール系樹脂、ポリオレフィン系樹脂、ポリイソシアネート系樹脂などを任意に組み合わせて用いることができるが特にポリエステルポリオール系樹脂とポリイソシアネート系樹脂を組み合わせて用いるのが好ましい。具体的には、イソシアネート系樹脂として脂肪族系イソシアネートが好ましい。特にHDI系イソシアネートが望ましい。
【0007】
より具体的には、ポリエステル樹脂フィルムとポリフェニレンサルファイドフィルムとの接着には、ポリエステルポリオール系樹脂とポリイソシアネート系樹脂よりなる接着剤組成物を用いるのが好ましい。
ポリイソシアネート系樹脂として、脂肪族系ポリイソシアネートなどを用いるのがよく、特にHDI系ポリイソシアネートが好ましい。
本発明では、特に、接着剤を溶解又は分散した溶液を用い、該溶液を樹脂フィルムの片面に塗布し、溶媒を乾燥させ、次いで被接着体フィルムを重ねて接着させるのがよい。
このような溶液状の接着剤は、常法により、フィルム基材上に、マイヤーバー、アプリケーター、シルクスクリーン、コンマ、リバース、ダイレクトグラビア、マイクログラビア、ダイ、エアナイフ、バー、カーテン、スプレー、ブレード等の各種コーティング装置を用いた方法により施すことができる。
【0008】
本発明において、接着剤層の厚さは特に限定されないが、0.05〜20μm程度であるのが好ましく、より好ましくは0.1〜10μm、特に好ましくは、0.5〜5μmである。
このようにして調製される積層体としては、90°折り曲げ耐熱(180℃×2hr)で、各フィルム間に浮きが生ぜず、曲げ弾性が高く、カールしにくいものが好ましい。
本発明の積層体の厚みは任意であるが、10〜800μmであるのが好ましく、より好ましくは25〜250μmであり、さらに好ましくは100〜200μm未満である。
本発明では、上記離型シートの耐熱性と離型性を有するポリオレフィン樹脂フィルム層上にプリプレグ材料を配置し、加熱加圧成型し、次いで離型シートを剥離することをにより、プリプレグ材料を成型するのがよい。この際、上記離型シートを2枚用意し、各シートの耐熱性エンジニアリングフィルムが対面するように配置し、この間にプリプレグ材料を挟んで加熱加圧成型し、次いで離型シートを剥離してもよい。加熱加圧成型は、金型内で熱プレスを施して行うのがよいが、成形方法としては特に制限無く用いることができ、特にモールド成形更に好ましくは引き抜き成形法を用いて行うのがよい。
【0009】
ここで用いるプリプレグ材料としては、例えば、繊維強化プラスチックを形成するのに好適に使用できるものであればいずれでもよく、フェノール−エポキシ樹脂、ビスマレイミド−トリアジン樹脂、ポリイミド樹脂、エポキシ樹脂、フェノール樹脂、トリアジン樹脂、ポリアミド樹脂の単独、複合のいずれでも良く、カーボン繊維、合成繊維、ガラス繊維等と組み合わせても良い。また、多層化させるときは組み合わせても良い。これらのうち特に、エポキシ樹脂を用いたプリプレグに好適に用いることができる。
上記成型方法では、離型シートは最終成形物の形状により、1枚又はそれ以上用いても良い。
【0010】
【発明の効果】
本発明によれば、機械的特性に優れるとともに、加熱成型時に離型シートから析出するオリゴマーや擦過粉によって金型が汚染されることのないプリプレグ材料成型用離型シートが提供される。そして、この離型シート及びプリプレグを用いることにより、各種形態の強化部材を効率的に成型することができる。
次に実施例により本発明を説明する。
【0011】
【実施例】
実施例1
下記の3層構成の積層体を次のようにして調製した。
(1)最下層
耐熱性と離型性を有するポリオレフィン樹脂フィルムとして、TPX:三井化学株式会社製、オピュランTPX、X44B#50(厚み50μm)を用いた。
(2)中間層
樹脂フィルムとして、PET:東レ株式会社製、ルミラー、#100S10(厚み100μm)を用いた。
【0012】
(3)最上層
骨格内にフェニル基を有する耐熱性エンジニリアリングプラスチックフィルムとして、ポリフェニレンサルファイドフィルム(PPS:東レ株式会社製、トレリナ、#9‐3030コロナ(厚み9μm))を用いた。
先ず、固形分質量比でポリエステル−ポリオール系樹脂(アドロックRU−77、ロックペイント株式会社製)/脂肪族系ポリイソシアネート(H−7、ロックペイント株式会社製)=87/13と、希釈溶剤としてトルエン/メチルエチルケトン=1/1混合溶剤を重量比で26/74になるように撹拌溶解して調製した。これを中間層であるPETフィルムにマイヤーバーを用いて通常の方法により塗布し、乾燥させた(厚み4μm)その上にPPSフィルムを重ねて加熱圧着し2層積層体を作成した。次に、固形分質量比でポリエーテルポリウレタン樹脂(タケラックA−610、武田薬品工業株式会社製)/HMDI系イソシアネート(コロネートHL、日本ポリウレタン工業株式会社製)=87.8/12.2と、希釈溶剤として酢酸エチル/トルエン=1/1混合溶剤を重量比で26/74になるように撹拌溶解して調製した。これを先に形成した3層積層体のPETフィルム層側に、マイヤーバーを用いて通常の方法で塗布し、乾燥させた(厚み4μm)。その上にコロナの裏写りを防ぐために粘着性を有する離型フィルム(NT25、パナック株式会社製)をTPXフィルムの片面に貼り合わせて、TPXフィルム側にコロナ放電処理を行った後、TPXフィルムの処理面を重ねて加熱圧着し、粘着性を有する離型フィルムを剥がして5層積層体からなる剥離シートを調製した。
【0013】
PPS側180°折返し試験をしたところ、室温で3.82N/15mm、100℃の熱風中では、1.67N/15mmであった。
又、100℃鉤裂き評価結果は、エージング条件(45℃×2日)では、85°、エージング条件(45℃×7日)でも、85°であった。
190℃×3時間熱風中で加熱した後、PPSフィルム表面を目視にて観察し、加熱前と加熱後の表面状態を比較したところ、変化はなかった。
【0014】
実施例2
脂肪族系イソシアネート(アドロック株式会社製)の量を20重量部とした以外は、実施例1と同様にして、本発明の3層積層体からなる離型シートを調製した。
PPS側180°折返し試験をしたところ、室温で3.63N/15mm、100℃の熱風中では、1.47N/15mmであった。
又、100℃鉤裂き評価結果は、エージング条件(45℃×2日)では、90°、エージング条件(45℃×7日)でも、85°であった。
【0015】
比較例1
実施例と同様にして、最下層と中間層からなる2層積層体からなる離型シートを調製した。
190℃×3時間熱風中で加熱した後、PETフィルム表面を目視にて観察し、加熱前と加熱後の表面状態を比較したところ、中間層表面に白紛状のオリゴマーが全面に析出していた。
【0016】
実施例3
実施例1及び2で調整した剥離シートを用いてロール状の炭素繊維布を用いたエポキシプリプレグを従来公知の方法を用いて連続成型したところ、成型中は離型フィルムとプリプレグの密着が良く間に実用上及び外観上、不自由を生じる程度の大きな空気の巻き込みを起こすことなく加工することができ、一方、金型とは良好な離型性を示した。成型後、離型フィルムは成型品間から無理なく剥がすことができ、良好な離型性を示した。また、金型を汚すこともなかった。
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a release sheet for molding a prepreg material that can be suitably used for continuous heat molding of carbon fiber reinforced plastics having various shapes such as a cylindrical shape, a U-shape, and an H-shape.
[Prior art]
A prepreg material in which a reinforcing material such as carbon fiber or glass fiber is impregnated with a thermosetting resin such as epoxy resin or phenol resin is thermoformed to continuously obtain a molded product having an arbitrary cross-sectional shape. Up to now, as a release sheet between the prepreg material and the mold, a fluorine sheet, a polymethylpentene resin sheet (including TPX), or a composite sheet obtained by bonding a polymethylpentene resin sheet and polyethylene terephthalate (PET) Has been used. However, when a fluorine sheet is used, there is a problem that the transfer of fluorine to the molded product adversely affects subsequent workability such as reducing the adhesiveness, and there is a problem that the cost becomes high. On the other hand, a polymethylpentene resin sheet is used. In addition, there is a drawback that mechanical properties such as bending elasticity and tensile strength during heating are insufficient.
On the other hand, when a laminated sheet laminated with PET and a polymethylpentene resin sheet is used to supplement the mechanical strength, the mechanical strength is improved, but due to oligomers and abrasion powder precipitated from the PET during heating. A new drawback has arisen that the mold is contaminated.
[0002]
[Problems to be solved by the invention]
An object of the present invention is to provide a release sheet for molding a prepreg material, which is excellent in mechanical strength and does not contaminate the mold with oligomers and abrasion powder precipitated from the release sheet during heat molding.
[0003]
[Means for Solving the Problems]
The present invention is a laminate of a heat-resistant and releasable polyolefin resin film such as a polymethylpentene resin sheet and a resin film such as a polyester resin film, and further has a phenyl group in a skeleton such as a polyphenylene sulfide film. This is based on the knowledge that when the heat-resistant engineering plastic film is provided and laminated on the resin film, particularly the polyester resin film, the above-mentioned problems can be efficiently solved.
That is, the present invention provides a prepreg material comprising a polyolefin resin film having heat resistance and releasability, a resin film, and a heat-resistant engineering plastic film having a phenyl group in the skeleton laminated in this order. A mold release sheet is provided.
The present invention also provides a prepreg characterized by disposing a prepreg material on a polyolefin resin film layer having heat resistance and releasability of the release sheet, heat-press molding, and then peeling the release sheet. A method for molding a material is provided.
[0004]
DETAILED DESCRIPTION OF THE INVENTION
The polyolefin resin film having heat resistance and releasability used in the present invention has heat resistance and releasability with respect to the prepreg material. Specific examples include polymethylpentene resin films and cycloolefin resin films. Of these, polymethylpentene resin films are preferable, and 4-methyl-1-pentene resin films are particularly preferable. These can be easily obtained as Opyuran TPX manufactured by Mitsui Chemicals. Although thickness is arbitrary, it is preferable that it is 10-150 micrometers, More preferably, it is 15-100 micrometers.
In the present invention, it is preferable to use a polyolefin resin film that has been subjected to easy adhesion treatment such as corona treatment, plasma treatment, and blast treatment, preferably corona treatment on one or both sides (preferably on one side). .
The resin film used in the present invention can be used without particular limitation, and examples thereof include films of polyethylene terephthalate (PET), polybutylene terephthalate, polycarbonate, acrylic resin, and the like. Of these, polyester resin films such as polyethylene terephthalate (PET) and polybutylene terephthalate are preferable, and PET is particularly preferable. These are easily available as Lumirror etc. manufactured by Toray Industries, Inc. Although thickness is arbitrary, it is preferable that it is less than 500 micrometers, More preferably, it is 5-120 micrometers.
[0005]
As the heat-resistant engineering plastic film used in the present invention, those having a low oligomer precipitation amount upon heating and excellent mechanical properties upon heating are preferable. As such a film, a polyphenylene sulfide film is preferable, and Torelina manufactured by Toray Industries, Inc. is exemplified. Although thickness is arbitrary, it is preferable that it is less than 100 micrometers, More preferably, it is 5-20 micrometers.
In the present invention, a polyolefin resin film having heat resistance and releasability, a resin film, and a heat-resistant engineering plastic film having a phenyl group in the skeleton are laminated in this order. At this time, it is preferable to laminate the heat-resistant plastic film so that the surface subjected to the easy adhesion treatment faces the polyester resin film. The lamination method can be used without particular limitation as long as it gives heat resistance to the laminated release sheet. When no adhesive is used, there are an ultrasonic fusion method and a heat fusion method. In particular, it is preferable to apply an adhesive layer between the adhesive films.
[0006]
Here, for the adhesion between the heat-resistant plastic film surface and the resin film, polyester resin, urethane resin, polyester-polyurethane resin, acrylic-polyol resin, polyolefin resin, polyisocyanate The resin can be used in any combination, but it is particularly preferable to use the polyester polyol resin and the polyisocyanate resin in combination. On the other hand, polyester resin, urethane resin, polyester-polyurethane resin, acrylic-polyol resin, polyolefin resin, polyisocyanate resin, etc. can be used for adhesion between polyester resin film and heat-resistant engineering plastic film. Although it can be used in combination, it is particularly preferable to use a polyester polyol resin and a polyisocyanate resin in combination. Specifically, aliphatic isocyanate is preferable as the isocyanate resin. In particular, HDI isocyanate is desirable.
[0007]
More specifically, an adhesive composition comprising a polyester polyol resin and a polyisocyanate resin is preferably used for bonding the polyester resin film and the polyphenylene sulfide film.
As the polyisocyanate resin, aliphatic polyisocyanate or the like is preferably used, and HDI polyisocyanate is particularly preferable.
In the present invention, it is particularly preferable to use a solution in which an adhesive is dissolved or dispersed, apply the solution to one side of a resin film, dry the solvent, and then adhere the adherend film in layers.
Such a solution-like adhesive can be applied on a film substrate by a conventional method on a Mayer bar, applicator, silk screen, comma, reverse, direct gravure, microgravure, die, air knife, bar, curtain, spray, blade, etc. It can apply by the method using various coating apparatuses.
[0008]
In the present invention, the thickness of the adhesive layer is not particularly limited, but is preferably about 0.05 to 20 μm, more preferably 0.1 to 10 μm, and particularly preferably 0.5 to 5 μm.
The laminate thus prepared is preferably one that is 90 ° bent heat resistant (180 ° C. × 2 hr), does not float between the films, has high bending elasticity, and is not easily curled.
Although the thickness of the laminated body of this invention is arbitrary, it is preferable that it is 10-800 micrometers, More preferably, it is 25-250 micrometers, More preferably, it is less than 100-200 micrometers.
In the present invention, the prepreg material is formed by placing the prepreg material on the polyolefin resin film layer having heat resistance and releasability of the release sheet, molding by heating and pressing, and then peeling the release sheet. It is good to do. At this time, two release sheets are prepared, arranged so that the heat-resistant engineering films of each sheet face each other, and prepreg material is sandwiched between them to perform heat and pressure molding, and then the release sheet is peeled off. Good. The heat and pressure molding is preferably performed by hot pressing in a mold, but the molding method can be used without any particular limitation, and in particular, the molding is more preferably performed by the pultrusion method.
[0009]
The prepreg material used here may be any material that can be suitably used to form a fiber reinforced plastic, for example, phenol-epoxy resin, bismaleimide-triazine resin, polyimide resin, epoxy resin, phenol resin, Either triazine resin or polyamide resin may be used alone or in combination, and may be combined with carbon fiber, synthetic fiber, glass fiber or the like. Moreover, when making it multilayer, you may combine. Among these, it can use suitably for the prepreg using an epoxy resin especially.
In the above molding method, one or more release sheets may be used depending on the shape of the final molded product.
[0010]
【The invention's effect】
According to the present invention, there is provided a release sheet for molding a prepreg material that is excellent in mechanical properties and does not contaminate the mold with oligomers or abrasion powders precipitated from the release sheet during heat molding. And the reinforcement | strengthening member of various forms can be shape | molded efficiently by using this release sheet and prepreg.
Next, an example explains the present invention.
[0011]
【Example】
Example 1
A laminate having the following three-layer structure was prepared as follows.
(1) TPX: Mitsui Chemicals, Opulan TPX, X44B # 50 (thickness 50 μm) was used as the polyolefin resin film having the lowest layer heat resistance and releasability.
(2) As an intermediate layer resin film, PET: manufactured by Toray Industries, Inc., Lumirror, # 100S10 (thickness: 100 μm) was used.
[0012]
(3) A polyphenylene sulfide film (PPS: manufactured by Toray Industries, Inc., Torelina, # 9-3030 corona (thickness 9 μm)) was used as a heat-resistant engineering plastic film having a phenyl group in the uppermost layer skeleton.
First, polyester-polyol resin (Adlock RU-77, manufactured by Rock Paint Co., Ltd.) / Aliphatic polyisocyanate (H-7, manufactured by Rock Paint Co., Ltd.) = 87/13 in terms of solid content mass ratio, as a dilution solvent A toluene / methyl ethyl ketone = 1/1 mixed solvent was prepared by stirring and dissolving so that the weight ratio was 26/74. This was applied to a PET film as an intermediate layer by a usual method using a Meyer bar and dried (thickness: 4 μm). A PPS film was laminated thereon and heat-pressed to prepare a two-layer laminate. Next, polyether polyurethane resin (Takelac A-610, manufactured by Takeda Pharmaceutical Co., Ltd.) / HMDI-based isocyanate (Coronate HL, manufactured by Nippon Polyurethane Industry Co., Ltd.) = 87.8 / 12.2 in terms of solid content mass ratio, As a diluent solvent, a mixed solvent of ethyl acetate / toluene = 1/1 was prepared by stirring and dissolving so that the weight ratio was 26/74. This was applied to the PET film layer side of the three-layer laminate formed earlier by a usual method using a Mayer bar and dried (thickness 4 μm). On top of that, a sticky release film (NT25, manufactured by Panac Co., Ltd.) was attached to one side of the TPX film to prevent corona show-through, and after the corona discharge treatment was performed on the TPX film side, The treated surfaces were stacked and heat-pressed, and the release film having adhesiveness was peeled off to prepare a release sheet composed of a 5-layer laminate.
[0013]
When the 180 ° turn-back test was performed on the PPS side, it was 3.82 N / 15 mm at room temperature and 1.67 N / 15 mm in hot air at 100 ° C.
Moreover, the 100 ° C. tear evaluation results were 85 ° under the aging conditions (45 ° C. × 2 days) and 85 ° under the aging conditions (45 ° C. × 7 days).
After heating in hot air at 190 ° C. for 3 hours, the surface of the PPS film was visually observed, and the surface state before and after heating was compared.
[0014]
Example 2
A release sheet composed of the three-layer laminate of the present invention was prepared in the same manner as in Example 1 except that the amount of aliphatic isocyanate (manufactured by Adlock Co., Ltd.) was 20 parts by weight.
When the 180 ° turn-back test on the PPS side was performed, it was 3.63 N / 15 mm at room temperature and 1.47 N / 15 mm in hot air at 100 ° C.
Moreover, the 100 ° C. tear evaluation result was 90 ° under the aging condition (45 ° C. × 2 days) and 85 ° under the aging condition (45 ° C. × 7 days).
[0015]
Comparative Example 1
In the same manner as in the examples, a release sheet composed of a two-layer laminate composed of the lowermost layer and an intermediate layer was prepared.
After heating in hot air at 190 ° C. for 3 hours, the surface of the PET film was visually observed, and the surface state before and after heating was compared. As a result, white powder-like oligomers were deposited on the entire surface of the intermediate layer. It was.
[0016]
Example 3
When an epoxy prepreg using a roll-shaped carbon fiber cloth is continuously molded using a conventionally known method using the release sheet prepared in Examples 1 and 2, the release film and the prepreg are closely adhered to each other during molding. In addition, it could be processed without entrainment of air that would cause inconvenience in practical use and appearance, while exhibiting good mold releasability. After molding, the release film could be removed without difficulty from between the molded products, showing good release properties. Also, the mold was not soiled.

Claims (3)

耐熱性と離型性を有するポリオレフィン樹脂フィルム、ポリエステル樹脂フィルム及びポリフェニレンサルファイドフィルムがこの順序で積層されてなることを特徴とするプリプレグ材料成型用離型シート。A release sheet for molding a prepreg material, wherein a polyolefin resin film, a polyester resin film, and a polyphenylene sulfide film having heat resistance and releasability are laminated in this order. ポリオレフィン樹脂フィルムが、片面に易接着処理が施されたものである請求項1記載の離型シート。  The release sheet according to claim 1, wherein the polyolefin resin film is subjected to easy adhesion treatment on one side. 各フィルム間が、接着剤で接着されている請求項1又は2記載の離型シート。The release sheet according to claim 1 or 2 , wherein each film is bonded with an adhesive.
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US8922024B2 (en) 2012-05-04 2014-12-30 Samsung Electronics Co., Ltd. Semiconductor packages including molding layers

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JP4529565B2 (en) * 2004-07-07 2010-08-25 東レ株式会社 Circuit board manufacturing method
US10308000B2 (en) * 2016-05-24 2019-06-04 The Boeing Company Method for pre-preg manufacturing

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2000272055A (en) * 1999-03-26 2000-10-03 Sumitomo Bakelite Co Ltd Mold release type multilayer film

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JP3080259B2 (en) * 1992-03-16 2000-08-21 東レ株式会社 Release laminated sheet and method of using the same

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Publication number Priority date Publication date Assignee Title
JP2000272055A (en) * 1999-03-26 2000-10-03 Sumitomo Bakelite Co Ltd Mold release type multilayer film

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8922024B2 (en) 2012-05-04 2014-12-30 Samsung Electronics Co., Ltd. Semiconductor packages including molding layers

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