JP4635326B2 - Antenna mounting structure and radio apparatus including the same - Google Patents

Antenna mounting structure and radio apparatus including the same Download PDF

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Publication number
JP4635326B2
JP4635326B2 JP2000332914A JP2000332914A JP4635326B2 JP 4635326 B2 JP4635326 B2 JP 4635326B2 JP 2000332914 A JP2000332914 A JP 2000332914A JP 2000332914 A JP2000332914 A JP 2000332914A JP 4635326 B2 JP4635326 B2 JP 4635326B2
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Prior art keywords
electrode
ground
antenna
substrate
formed
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JP2000332914A
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JP2002141740A (en
Inventor
茂一 伊藤
一也 川端
恒 秋山
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株式会社村田製作所
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Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a wireless device and an antenna mounting structure provided in the wireless device.
[0002]
[Prior art]
FIG. 6A schematically shows an example of a surface-mounted antenna and its mounting structure, and FIG. 6B shows a development view of the surface-mounted antenna shown in FIG. 6A. . These surface-mounted antennas 1 shown in FIGS. 6A and 6B have a rectangular parallelepiped base 2 made of a dielectric or magnetic substance, and a radiation electrode 3 is formed on the upper surface 2a of the base 2. Yes. In addition, a power supply electrode 4 is formed on the side surface 2b of the base body 2 shown in FIG. 6 so as to extend from the upper surface 2a side toward the mounting bottom surface 2f side. The ground connection electrodes 5 (5a) and 6 (6a) are formed to extend from the upper surface 2a side to the mounting bottom surface 2f side, respectively.
[0003]
Further, on the side surface 2d of the substrate 2, the ground connection electrode 5b is located at a position almost opposite to the ground connection electrode 5a on the side surface 2b, and the ground connection electrode 6b is on the ground connection electrode 6a on the side surface 2b. Are extended from the upper surface 2a side toward the mounting bottom surface 2f side.
[0004]
The power supply electrode 4 is formed so as to wrap around the mounting bottom surface 2 f of the substrate 2, and a bottom electrode 7 is formed on the mounting bottom surface 2 f of the substrate 2 almost entirely across the power supply electrode 4.
[0005]
Further, as shown in FIGS. 6 (a) and 6 (b), the end portions on the upper surface side of the electrodes 4, 5a, 5b, 6a, 6b are formed with a gap from the radiation electrode 3, respectively. Each of the electrodes 4, 5 a, 5 b, 6 a, 6 b is configured to have a capacity between the radiation electrode 3.
[0006]
In the example shown in FIG. 6, the ground connection electrodes 5 a and 5 b and the ground connection electrodes 6 a and 6 b that are diagonally connected to each other have the same distance between the upper surface side end and the radiation electrode 3. The distance between the electrode 5a (5b) and the radiation electrode 3 is different from the distance between the ground connection electrode 6a (6b) and the radiation electrode 3.
[0007]
As shown in FIG. 6A, such a surface-mounted antenna 1 is mounted on a mounting region set on a mounting substrate (for example, a circuit substrate of a wireless device) 8 with the bottom surface 2f of the base 2 as a mounting surface. . In such a mounting state, the power supply electrode 4 is connected to a signal supply source 11 formed on a circuit board of a wireless device, for example, via a wiring pattern 10 formed on the mounting board 8 and a through hole (not shown). The ground connection electrodes 5a, 5b, 6a, and 6b are connected to a ground electrode 12 that is a ground conductor portion equivalent to the ground formed on the mounting substrate 8 (grounded). )
[0008]
As described above, when the surface-mounted antenna 1 is mounted on the mounting substrate 8, each pattern of the wiring pattern 10 and the ground electrode 12 is arranged so that the feeding electrode 4 is not directly connected to the ground electrode 12. The shape is designed.
[0009]
In such a mounted state, for example, when a signal is supplied from the signal supply source 11 to the power supply electrode 4, a signal is supplied from the power supply electrode 4 to the radiation electrode 3 by electric field coupling via a capacitor. The radiation electrode 3 is excited to perform antenna operation. In the example shown in FIG. 6, as described above, the distance between the ground connection electrode 5a (5b) and the radiation electrode 3 and the distance between the ground connection electrode 6a (6b) and the radiation electrode 3 are different. The capacitance between the ground connection electrode 5a (5b) and the radiation electrode 3 and the capacitance between the ground connection electrode 6a (6b) and the radiation electrode 3 are different. Due to the difference in capacitance, the radiation electrode 3 becomes circularly polarized. Transmit or receive radio waves.
[0010]
[Problems to be solved by the invention]
By the way, the surface mount antenna 1 includes, for example, a portable telephone communication system, GPS (Global Positioning System), VICS (Vehicle Information and Communication System), ETC (Electronic Toll Collection). Automatic fee collection system)) and DAB (Digital Audio Broadcasting (stationary satellite mobile information communication service system))) and the like can be incorporated into various wireless communication systems.
[0011]
However, since the various systems as described above have different frequency bands for radio communication radio waves, the size of the base 2 of the surface mount antenna 1 and the base 2 are made of a dielectric according to the specifications of the various systems. If so, the surface mount antenna 1 dedicated to various systems is manufactured by designing the dielectric constant of the substrate 2, the size of the radiation electrode 3, the length and thickness of the ground connection electrodes 5 and 6, and the like. There was a need to do. The surface-mounted antenna 1 requires a lot of time to design, and the surface-mounted antenna 1 dedicated to various systems must be manufactured as described above, resulting in an increase in equipment cost. The problem arises that the prices of
[0012]
The present invention has been made to solve the above-described problems, and the object thereof is to make it possible to make a surface mount antenna common to various systems, and to facilitate the cost reduction of the surface mount antenna. It is an object to provide an antenna mounting structure and a radio apparatus including the antenna mounting structure.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, the present invention has the following configuration as means for solving the above problems. That is, the antenna mounting structure of the first invention is an antenna mounting structure in which a surface-mounted antenna is mounted on a mounting substrate on which a ground conductor portion is formed, wherein the surface-mounted antenna includes a base; A radiation electrode formed on the upper surface of the substrate and disposed in a non-conducting state with the ground conductor; and an electric field coupling through the capacitance disposed on the substrate and disposed at an interval for imparting a capacitance to the radiation electrode. A power supply electrode for supplying a signal to the radiation electrode; a ground connection electrode having one end disposed and formed on the base via a space having a capacity between the radiation electrode and the other end serving as a substrate side connection; A bottom electrode formed on substantially the entire mounting bottom surface of the substrate; and the mounting substrate includes the ground conductor portion equivalent to the ground; the substrate-side connection portion of the ground connection electrode; A connection path for high-frequency connection to the ground conductor portion, and the connection path for high-frequency connection includes a polarization mode and resonance of the transmission and reception radio waves of the radiation electrode. Provide one or both of inductance and capacity to control the frequency And a gap is formed between the bottom electrode of the substrate of the surface mount antenna and the mounting substrate, and the mounting substrate includes at least a portion facing the bottom electrode of the substrate via the gap A ground conductor portion is formed on the radiating electrode, and a high-frequency capacitance between the bottom electrode of the surface mount antenna and the ground conductor portion is given to the radiation electrode. The configuration serves as means for solving the above-described problems.
[0016]
First 2 The antenna mounting structure of the present invention is the above first or first. 2 It has the configuration of the invention, and the radiation electrode is formed on the upper surface of the substrate, and the ground connection electrode is formed on the side surface of the substrate.
[0017]
First 3 The wireless device of the invention is the first device. Or second The antenna mounting structure of the invention Made It is configured to be provided.
[0018]
In the invention of the above configuration, the mounting substrate Is provided with a grounding conductor portion equivalent to the ground and a connection path for connecting the ground-side electrode-side connection portion provided on the substrate of the surface mount antenna to the grounding conductor portion at a high frequency. The connection path for high-frequency connection has a configuration in which one or both of an inductance and a capacity for controlling the polarization mode and the resonance frequency of the transmission / reception radio wave of the radiation electrode of the surface mount antenna are given. Because No By varying the conductance or capacitance, the frequency band (resonance frequency) of the radio wave of the radiation electrode And polarization form It is possible to vary the antenna characteristics. From this, for example, the inductance or capacity that can obtain the antenna characteristics set according to the system without designing the surface mount antenna for each system such as the mobile phone, GPS, ETC, etc. Connection path for high-frequency connection of the substrate-side connection portion of the ground connection electrode to the ground conductor portion The surface mount antenna can transmit or receive radio waves suitable for the system.
[0019]
In other words, it will be possible to share the surface-mounted antenna, eliminate the hassle of having to design the surface-mounted antenna for each system, and reduce equipment costs, Cost reduction of the surface mount antenna is facilitated.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments according to the present invention will be described below with reference to the drawings.
[0021]
FIG. 1 (a) schematically shows a characteristic antenna mounting structure in the wireless device of the first embodiment, and FIG. 1 (b) shows the antenna mounting from the upper side shown in FIG. 1 (a). A plan view of the structure is shown, and FIG. 1C shows a cross-sectional view of the AA portion shown in FIG. The wireless device has various configurations according to the communication system. In the first embodiment, the configuration of the wireless device other than the specific surface-mounted antenna and the mounting structure described below is various. Any of these configurations may be provided, and description of the configuration of the wireless device other than the surface-mounted antenna and its mounting structure is omitted here. In the description of the first embodiment, the same components as those in the conventional example are denoted by the same reference numerals, and overlapping description of the common portions is omitted.
[0022]
A characteristic of the antenna mounting structure shown in the first embodiment is that the mounting substrate 8 is provided with means for adjusting the characteristics of the surface-mounted antenna 1.
[0023]
That is, as shown in FIGS. 1A to 1C, a mounting substrate (for example, a circuit board of a wireless device) 8 on which the surface mounting antenna 1 is mounted is provided with a surface mounting antenna as in the conventional example. A wiring pattern 10 that is connected to one power supply electrode 4 is provided, a wiring pattern 13 (13a) that is connected to the ground connection electrode 5a, and a wiring pattern 14 (14a) that is connected to the ground connection electrode 6a. A wiring pattern (13b) communicating with the ground connection electrode 5b and a wiring pattern 14 (14b) communicating with the ground connection electrode 6b are formed.
[0024]
In the first embodiment, a ground electrode 12 that is a ground conductor portion on the mounting substrate 8 is provided with a distance from each of the wiring patterns 10, 13, and 14. In other words, each of the wiring patterns 10, 13, 14 and the ground electrode 12 has the power supply electrode 4 and the ground connection electrodes 5 a, 5 b when the surface mount antenna 1 is mounted on the mounting region set on the mounting substrate 8. , 6a, 6b have a pattern shape that does not directly connect to the ground electrode 12. In addition, the code | symbol 18 shown in FIG.1 (c) represents the solder which is a connection means for mounting the surface mount type antenna 1 in the mounting board | substrate 8. FIG.
[0025]
In the first embodiment, a chip component 15, which is a high-frequency connection portion, is provided on the mounting substrate 8 across the wiring patterns 13 a, 13 b, 14 a, 14 b and the ground electrode 12. Each of these chip components 15 is constituted by a chip inductor component or a chip capacitor component, and electrically connects the wiring patterns 13 and 14 and the ground electrode 12 in a high frequency manner.
[0026]
Thus, in the first embodiment, the radiation electrode 3 of the surface mount antenna 1 includes the capacitance between the radiation electrode 3 and the ground connection electrodes 5a, 5b, 6a, 6b, and the ground connection electrodes. It is grounded to the ground (ground electrode 12) in high frequency via 5a, 5b, 6a, 6b and the chip component 15.
[0027]
By the way, as shown in the first embodiment, when a plurality of ground connection electrodes are arranged so as to surround the radiation electrode 3, the inductance or capacitance of the chip component 15 can be varied. By doing so, it is possible to variably control the resonance frequency of the radiation electrode 3 of the surface-mounted antenna 1 and the form of radio waves (for example, circularly polarized wave or direct polarized wave). Therefore, in the first embodiment, the chip component for enabling the radiation electrode 3 of the surface mount antenna 1 to transmit or receive a radio wave in a frequency band and a radio wave form according to specifications, for example. 15 inductances or capacities are obtained by experiments, simulations, etc., and each chip component 15 having the obtained inductances or capacities is mounted on the mounting substrate 8 as described above.
[0028]
In the surface mount antenna 1 shown in the first embodiment, the distance (capacitance) between the radiation electrode 3 and the ground connection electrodes 5a and 5b, and the radiation electrode 3 and the ground connection electrodes 6a and 6b. The interval (capacity) between them is different. Conventionally, with such a configuration, the form of the radio wave of the radiation electrode 3 is circularly polarized. On the other hand, in this first embodiment, the radio wave form of the radiation electrode 3 can be made circularly polarized by setting the inductance or capacitance of each chip component 15 appropriately. As described above, the distance (capacitance) between the radiation electrode 3 and the ground connection electrodes 5a and 5b is different from the distance (capacitance) between the radiation electrode 3 and the ground connection electrodes 6a and 6b. In addition, the radio wave form of the radiation electrode 3 can be linearly polarized.
[0029]
Even when the distances between the radiation electrode 3 and the ground connection electrodes 5a, 5b, 6a, and 6b are almost all equal, the configuration of the first embodiment provides the inductance or By appropriately setting the capacities, the radio wave form of the radiation electrode 3 can be linearly polarized or circularly polarized.
[0030]
As described above, the wiring patterns 13 and 14 and the chip component 15 electrically connect the ground connection electrodes 5 and 6 of the surface mount antenna 1 and the ground electrode 12 of the mounting substrate 8 in a high-frequency manner. The connection means with the antenna characteristic adjusting function is configured to variably control the antenna characteristic by variably controlling the inductance or the capacitance of the antenna.
[0031]
As described above, there are various methods for obtaining the inductance or capacity of each chip component 15 for obtaining the frequency band and radio wave form according to the specifications. In the first embodiment, any one of them is used. A technique may also be used, and the description thereof is omitted.
[0032]
In the first embodiment, as shown in FIGS. 1A to 1C, the ground electrode 12 is also formed in the mounting region of the surface mount antenna 1. In the first embodiment, as shown in FIG. 1C, the surface-mounted antenna 1 is mounted on the mounting board 8 using the solder 18, so that it inevitably depends on the thickness of the solder. A gap is generated between the bottom electrode 7 of the surface mount antenna 1 and the ground electrode 12 of the mounting substrate 8. Since the bottom electrode 7 is connected to the ground connection electrodes 5 and 6 as described above, the bottom electrode 7 is electrically connected to the ground electrode 12 through the solder 18, the wiring patterns 13 and 14, and the chip components 15. However, the bottom electrode 7 and the ground electrode 12 have different potentials in terms of high frequency, and a capacitance is generated between the bottom electrode 7 and the ground electrode 12. The capacitance between the bottom electrode 7 and the ground electrode 12 is given to the radiation electrode 3 and becomes one of the determinants of the resonance frequency of the radiation electrode 3.
[0033]
Depending on how the solder 18 is applied, the surface mount antenna 1 may be inclined with respect to the mounting substrate 8 and the bottom electrode 7 and the ground electrode 12 may be in direct contact with each other. Since a constant of distribution is generated at the contact portion, the bottom electrode 7 and the ground electrode 12 are at different potentials in terms of high frequency as described above, and the bottom electrode 7 and the ground electrode 12 are partly in direct contact with each other. In this case, as in the case where the bottom electrode 7 and the ground electrode 12 are not in contact with each other, the capacitance of the gap between the bottom electrode 7 and the ground electrode 12 is given to the radiation electrode 3 to determine the resonance frequency of the radiation electrode 3. Will be involved.
[0034]
According to the first embodiment, the means for adjusting the characteristics of the surface-mounted antenna 1, that is, the wiring patterns 13 and 14 and the chip component 15 are provided on the mounting substrate 8. Instead of changing the design of the surface-mounted antenna 1, the surface-mounted antenna 1 can be obtained simply by mounting each chip component 15 having an inductance or a capacity for satisfying the specified antenna characteristic condition on the mounting substrate 8. Radio waves can be transmitted or received with a frequency band and radio wave form that satisfy the requirements.
[0035]
Thereby, for example, the trouble of changing the design of the surface mount antenna 1 according to the specification can be eliminated. In the first embodiment, the surface mount antenna 1 can be used in common with various systems, and it is not necessary to manufacture a wide variety of surface mount antennas 1 dedicated to each system. Costs can be reduced, and the cost of the surface mount antenna 1 can be reduced.
[0036]
less than, reference An example will be described.
[0037]
This is shown in FIG. reference In the example, a plan view of a characteristic antenna mounting structure is shown, and FIG. 2B is a cross-sectional view of the antenna mounting structure of the AA portion shown in FIG. In addition, this reference In the description of the examples, the same components as those in the first embodiment are denoted by the same reference numerals, and the overlapping description of the common portions is omitted.
[0038]
this reference In the example, as shown in FIGS. 2A and 2B, the ground electrode 12 is formed so as to avoid the mounting area of the surface-mounted antenna 1. Other configurations are the same as those of the first embodiment.
[0039]
this reference According to the example, like the first embodiment, the wiring patterns 13 and 14 and the chip component 15 which are means for adjusting the characteristics of the surface-mounted antenna 1 are provided on the mounting substrate 8. The same effect as that of the first embodiment, that is, the effect that the surface-mounted antenna 1 can be shared and the cost of the surface-mounted antenna 1 can be easily reduced can be obtained.
[0040]
By the way, as described in the first embodiment, the ground electrode 12 formed on the antenna mounting surface (that is, the upper surface in the example of FIG. 1) of the mounting substrate 8 and the bottom electrode 7 are arranged to face each other. If there is, a capacitance is generated between the bottom electrode 7 and the ground electrode 12 on the top surface side. Since the opposed area between the bottom electrode 7 and the ground electrode 12 is large and the gap between the bottom electrode 7 and the ground electrode 12 on the upper surface side is very small, it occurs between the bottom electrode 7 and the ground electrode 12 on the upper surface side. The capacitance is large, and this greatly contributes to the determination of the resonance frequency of the radiation electrode 3.
[0041]
In contrast, this reference In the example, since the ground electrode 12 is formed on the mounting substrate 8 while avoiding the mounting area of the surface mount antenna 1, the bottom electrode 7 of the surface mount antenna 1 is the ground electrode 12 on the top surface side of the mount substrate 8. No capacitance is generated between the ground electrode 12 and the ground electrode 12 formed on the bottom surface of the mounting substrate 8. A capacitance is generated between the ground electrode 12 on the bottom surface side and the bottom electrode 7. Naturally, the distance between the ground electrode 12 on the upper surface side and the bottom electrode 7 is naturally larger than the distance between the ground electrode 12 on the upper surface side and the bottom electrode 7. Therefore, the capacitance between the ground electrode 12 on the bottom surface side and the bottom electrode 7 is shown in the first embodiment. The capacitance between the ground electrode 12 on the upper surface side and the bottom electrode 7 is smaller. Therefore, the capacitance between the ground electrode 12 on the bottom surface side and the bottom electrode 7 is relatively small in determining the resonance frequency of the radiation electrode 3 as compared with the capacitance between the ground electrode 12 on the top surface side and the bottom electrode 7. It will not be involved. As a result, the inductance or capacitance of the chip component 15 is greatly involved in determining the resonance frequency of the radiation electrode 3 as compared with the configuration of the first embodiment. For this reason, it is possible to widen the variable range width of the resonance frequency of the radiation electrode 3 with respect to the variable control of the inductance or capacitance of the chip component 15.
[0042]
This has been confirmed by the inventors' experiments. The experimental results are shown in the graph of FIG. In the graph of FIG. 3, the horizontal axis represents the capacitance of the chip capacitor component that is each chip component 15, and the vertical axis represents the resonance frequency of the radiation electrode 3. reference The change of the resonant frequency of the radiation electrode 3 with respect to the capacitance change of each chip component 15 in the antenna mounting structure specific to the example is shown. A solid line α shown in FIG. 3 is a case where the ground electrode 12 is formed on the upper surface of the mounting substrate 8 so as to face the bottom electrode 7 as shown in the first embodiment. reference As shown in the example, the ground electrode 12 is formed on the upper surface of the mounting substrate 8 while avoiding the mounting area of the surface-mounted antenna 1. In this experiment, the four chip components 15 are performed under the condition that they all have the same capacity.
[0043]
As is apparent from the graph of FIG. 3, when the bottom electrode 7 and the ground electrode 12 on the upper surface side are opposed to each other as shown in the first embodiment, radiation with respect to the capacitance change of each chip component 15 is achieved. While the change in the resonance frequency of the electrode 3 is small, reference As shown in the example, when the ground electrode 12 on the upper surface side is not opposed to the bottom electrode 7, it can be seen that the resonance frequency of the radiation electrode 3 changes greatly with respect to the capacitance change of each chip component 15.
[0044]
The inventor has also conducted a similar experiment when the chip component 15 is a chip inductance component, and the experimental result is similar to the above result, that is, this reference When the example has a specific configuration, the result is that the change in the resonance frequency of the radiation electrode 3 with respect to the change in the inductance of the chip component 15 is larger than that in the configuration of the first embodiment.
[0045]
As shown in the experimental results above, this reference By providing a unique configuration in the example, the variable control range of the resonance frequency of the radiation electrode 3 by variable control of the inductance or capacitance of each chip component 15 can be expanded.
[0046]
In the configuration in which the top surface side ground electrode 12 is disposed opposite to the bottom surface electrode 7 as in the first embodiment, this is the case. reference The change in the resonance frequency of the radiation electrode 3 with respect to the change in inductance or capacitance of the chip component 15 is smaller than in the configuration in which the upper surface side ground electrode 12 is not opposed to the bottom electrode 7 as in the example. That is, in the configuration of the first embodiment, it can be said that fine adjustment of the resonance frequency of the radiation electrode 3 by the chip component 15 is easy. From this, when it is required to adjust the resonance frequency of the radiation electrode 3 to the set frequency with higher accuracy, reference By adopting the configuration shown in the first embodiment rather than the configuration shown in the example, the resonance frequency of the radiation electrode 3 is finely adjusted by the chip component 15, and the resonance frequency of the radiation electrode 3 is variably controlled. If you need to do this reference It is preferable to adjust the resonance frequency of the radiation electrode 3 by the chip component 15 by adopting the configuration of the example.
[0047]
The present invention is Real The present invention is not limited to the embodiments, and various embodiments can be adopted. For example, on Real In the embodiment, the configuration in which the chip component 15 is provided as the high-frequency connection portion has been described. For example, instead of the chip component 15, as shown in FIG. The circuit pattern 16 may be provided. The circuit pattern 16 has a pattern shape (that is, an inductor pattern or a capacitor pattern) having an inductance or a capacitance required for obtaining a frequency band and a radio wave form according to specifications. The inductor pattern or the capacitor pattern constituting the circuit pattern 16 has various pattern shapes. Here, any pattern shape can be adopted according to the above specifications, and the description of the pattern shape is omitted. .
[0048]
As described above, when the circuit pattern 16 of the inductor pattern or the capacitor pattern is formed as the high frequency connection portion, the high frequency connection portion (circuit pattern 16) is formed simultaneously with the wiring patterns 13 and 14 by the film formation technique. Therefore, the manufacturing process can be simplified.
[0049]
Furthermore, on Real In the embodiment, the radiation electrode 3 has a rectangular shape. However, the shape of the radiation electrode 3 is not limited to the square shape, and various forms can be adopted. For example, the radiation electrode 3 may be circular. Further, for example, as shown in FIG. 5, the radiation electrode 3 may be degenerately separated. In the case of the form shown in FIG. 5, the radio wave of the radiation electrode 3 is in the form of circular polarization.
[0050]
Furthermore, on Real In the embodiment, the chip component 15 is provided as the high-frequency connection portion, but the high-frequency connection portion may be configured by a combination of a chip inductor component, a chip capacitor component, an inductor pattern, and a capacitor pattern. Good.
[0051]
Furthermore, on Real In the embodiment, the base body 2 has a rectangular parallelepiped shape, but the shape of the base body 2 is not limited to a rectangular parallelepiped shape. For example, the base body 2 may have a cylindrical shape other than the rectangular parallelepiped shape. Furthermore, on Real In the embodiment, the ground connection electrodes are provided at four locations, but the number of ground connection electrodes is not limited to the number. In addition, the ground connection electrode is Real It is not limited to the arrangement position shown in the embodiment.
[0052]
【The invention's effect】
According to the present invention, the mounting substrate Is provided with a grounding conductor portion equivalent to the ground and a connection path for connecting the ground-side electrode-side connection portion provided on the substrate of the surface mount antenna to the grounding conductor portion at a high frequency. The connection path for high-frequency connection is provided with one or both of an inductance and a capacity for controlling the polarization mode and the resonance frequency of the transmission / reception radio wave of the radiation electrode of the surface mount antenna. The above configuration Provided to the connection path for connecting the substrate side connection portion of the ground connection electrode to the ground conductor portion at a high frequency. The surface mount antenna can transmit or receive radio waves according to various systems without changing the design of the surface mount antenna simply by changing the inductance or capacitance. In other words, it is possible to share the surface-mounted antenna, and the trouble of designing the surface-mounted antenna for each system can be eliminated. Since it is not necessary to manufacture the equipment, the equipment cost can be reduced, and the cost of the surface mount antenna can be reduced.
[0053]
For this reason, in the wireless device having the characteristic antenna mounting structure in the present invention, it is possible to provide an inexpensive and easy-to-design wireless device by reducing the cost of the surface-mounted antenna as described above. Is possible.
[0054]
In the present invention A grounding conductor portion is formed on the mounting substrate in a region including at least a portion facing the bottom electrode of the surface mount antenna with a gap. Because A capacitance is generated at a high frequency between the bottom electrode and the ground conductor, and is applied to the radiation electrode. Since the capacitance greatly affects the determination of the resonance frequency of the radiation electrode, the inductance or capacitance given to the connection path for connecting the substrate-side connection portion of the ground connection electrode to the ground conductor portion at a high frequency. The variable control range width of the resonance frequency of the radiation electrode with respect to the variable control becomes small, and fine adjustment of the resonance frequency of the radiation electrode by the variable control of the inductance or capacitance becomes easy. For this reason, it becomes possible to set the resonance frequency of the radiation electrode to a set frequency with high accuracy.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram showing a characteristic antenna mounting structure in a first embodiment;
[Figure 2] reference It is explanatory drawing which shows the mounting structure of the characteristic antenna in an example.
FIG. 3 is a graph showing a result of an experiment in which a change in resonance frequency of the radiation electrode with respect to a change in capacitance of chip parts is examined.
FIG. 4 is an explanatory diagram showing another example of a high-frequency connection unit.
FIG. 5 is a model diagram showing another embodiment of the radiation electrode.
FIG. 6 is a model diagram showing a conventional example of an antenna mounting structure.
[Explanation of symbols]
1 Surface mount antenna
2 Base
3 Radiation electrode
5,6 Ground connection electrode
7 Bottom electrode
8 Mounting board
13, 14 Wiring pattern
12 Ground electrode
15 Chip parts
16 circuit patterns

Claims (3)

  1. In an antenna mounting structure in which a surface mount antenna is mounted on a mounting substrate on which a ground conductor portion is formed, the surface mount antenna includes a base; and is formed on an upper surface of the base and is not in contact with the ground conductor. A radiation electrode disposed in a conductive state; a power supply electrode formed on the substrate and disposed through an interval for imparting a capacity to the radiation electrode, and supplying a signal to the radiation electrode by electric field coupling through the capacity; and one end A ground connection electrode which is disposed and formed on the base body with a gap between the radiation electrode and the radiation side and having the other end side on the substrate side connection portion; and formed on substantially the entire mounting bottom surface of the base body. A ground electrode portion equivalent to a ground; and a substrate-side connection portion of the ground connection electrode for high-frequency connection to the ground conductor portion. Contact And a connection path for high-frequency connection is one or both of an inductance and a capacity for controlling the polarization form and resonance frequency of the transmission / reception radio wave of the radiation electrode. And a gap is formed between the bottom electrode of the substrate of the surface mount antenna and the mounting substrate, and the mounting substrate is a portion facing the bottom electrode of the substrate via the gap An antenna mounting characterized in that a ground conductor portion is formed in a region including at least, and a high-frequency capacity between the bottom electrode of the surface mount antenna and the ground conductor portion is provided to the radiation electrode. Construction.
  2. The radiation electrode is formed on the upper surface of the substrate mounting structure according to claim 1 Symbol mounting antenna was characterized by the ground connection electrode is formed on the side surface of the base member.
  3. A radio apparatus comprising the antenna mounting structure according to claim 1 .
JP2000332914A 2000-10-31 2000-10-31 Antenna mounting structure and radio apparatus including the same Active JP4635326B2 (en)

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JP4103936B2 (en) * 2005-05-13 2008-06-18 株式会社村田製作所 Antenna structure and wireless communication device including the same
JP4900186B2 (en) * 2007-10-17 2012-03-21 株式会社村田製作所 Mounting structure of coil parts
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