JP4616888B2 - 噴霧偏向を使用する噴霧冷却 - Google Patents
噴霧偏向を使用する噴霧冷却 Download PDFInfo
- Publication number
- JP4616888B2 JP4616888B2 JP2007544354A JP2007544354A JP4616888B2 JP 4616888 B2 JP4616888 B2 JP 4616888B2 JP 2007544354 A JP2007544354 A JP 2007544354A JP 2007544354 A JP2007544354 A JP 2007544354A JP 4616888 B2 JP4616888 B2 JP 4616888B2
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- JP
- Japan
- Prior art keywords
- stream
- cooling fluid
- orifice
- spray
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D5/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, using the cooling effect of natural or forced evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Special Spraying Apparatus (AREA)
Description
Claims (10)
- 冷却流体のストリームを噴射するように構成されるオリフィスを有する噴霧器と、
第1の方向での噴霧と第2の方向での噴霧との間で前記ストリームの偏向を選択的に制御するように動作可能なストリーム偏向器とを備え、
前記第1の方向は部品に向かう非遮断方向であることを特徴とする、冷却流体を使用して部品を冷却するシステム。 - 前記第2の方向で噴霧された冷却流体が前記部品に当たるのを遮るように構成される遮断物をさらに備えることを特徴とする請求項1に記載のシステム。
- 前記ストリーム偏向器は前記ストリームを2つの自由度で偏向するように構成されることを特徴とする請求項1に記載のシステム。
- 前記冷却流体のストリームを噴射するように構成されるオリフィスを有する第2の噴霧器と、
第2のストリーム偏向器であって、第2の噴霧器の第1の方向、及び第2の噴霧器の第2の方向での噴霧の間で、前記第2の噴霧器のストリームの偏向を選択的に制御するように動作可能な第2のストリーム偏向器と、
前記第1及び前記第2のストリーム偏向器の動作を制御するように構成されるコントローラとをさらに備え、
前記第2の噴霧器の前記第1及び前記第2の方向は、前記部品に向かう非遮断方向であり、
前記第1の噴霧器の前記第1の方向及び前記第2の噴霧器の前記第2の方向は両方とも、前記部品上の単一の熱位置に向かうことを特徴とする請求項1に記載のシステム。 - 前記オリフィスによって放射されている冷却流体を加熱するように構成されるヒータと、
前記ヒータを電圧印加することにより、前記ストリームが液滴に分離する前記オリフィスからの距離を制御するように構成されるコントローラとをさらに備えることを特徴とする請求項1に記載のシステム。 - 前記噴霧器のオリフィスは、冷却流体の前記ストリームを連続噴射するのに適した圧力で、冷却流体を前記オリフィスに提供するように構成されている冷却流体源と流通することを特徴とする請求項1に記載のシステム。
- 前記ストリーム偏向器は、前記オリフィスの周縁部を非対称に加熱するように構成されるヒータを含むことを特徴とする請求項6に記載のシステム。
- 前記ストリーム偏向器は、前記ストリームに接触するように構成される円形内表面を含むことを特徴とする請求項6に記載のシステム。
- 前記ストリーム偏向器は、前記ストリームを形成する前記冷却流体に接触する第1の電極と、
第2の電極であって、前記オリフィスの軸方向で前記オリフィスからスタンドオフ距離に、且つ前記オリフィスの半径方向で前記オリフィスからスタンドオフ距離に保持される第2の電極とを含むことを特徴とする請求項6に記載のシステム。 - 前記噴霧器は、制御信号に応答して冷却流体の増分ストリームを噴霧するように構成されるコントローラを有することを特徴とする請求項1に記載のシステム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/005,284 US7549298B2 (en) | 2004-12-04 | 2004-12-04 | Spray cooling with spray deflection |
PCT/US2005/039259 WO2006062624A1 (en) | 2004-12-04 | 2005-10-31 | Spray cooling with spray deflection |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008522430A JP2008522430A (ja) | 2008-06-26 |
JP4616888B2 true JP4616888B2 (ja) | 2011-01-19 |
Family
ID=36572657
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007544354A Expired - Fee Related JP4616888B2 (ja) | 2004-12-04 | 2005-10-31 | 噴霧偏向を使用する噴霧冷却 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7549298B2 (ja) |
JP (1) | JP4616888B2 (ja) |
CN (1) | CN100539095C (ja) |
WO (1) | WO2006062624A1 (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7478769B1 (en) * | 2005-03-09 | 2009-01-20 | Cray Inc. | Method and apparatus for cooling electronic components |
US7511957B2 (en) * | 2006-05-25 | 2009-03-31 | International Business Machines Corporation | Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled |
NL2002633C2 (nl) * | 2009-03-17 | 2010-09-20 | Uptime Products B V | Werkwijze en inrichting voor het bepalen van de koelluchtbalans in een geconditioneerde ruimte met ict apparatuur. |
EP2395549B1 (en) | 2010-06-10 | 2014-06-25 | Imec | Device for cooling integrated circuits |
US10051762B2 (en) * | 2011-02-11 | 2018-08-14 | Tai-Her Yang | Temperature equalization apparatus jetting fluid for thermal conduction used in electrical equipment |
US20130321531A1 (en) * | 2011-03-01 | 2013-12-05 | Peter Mardilovich | Ring-type heating resistor for thermal fluid-ejection mechanism |
US20130192794A1 (en) * | 2012-01-30 | 2013-08-01 | International Business Machines Corporation | Interchangeable cooling system for integrated circuit and circuit board |
US9038407B2 (en) * | 2012-10-03 | 2015-05-26 | Hamilton Sundstrand Corporation | Electro-hydrodynamic cooling with enhanced heat transfer surfaces |
CN105144861B (zh) * | 2013-03-29 | 2018-04-17 | 慧与发展有限责任合伙企业 | 具有冷却装置的电子装置 |
DE102013208369A1 (de) * | 2013-05-07 | 2014-11-13 | Siemens Aktiengesellschaft | Vorrichtung mit einer elektronischen Komponente und einer Kältemaschine zum Kühlen der elektronischen Komponente sowie Verfahren zum Kühlen einer elektronischen Komponente |
US9997434B2 (en) | 2014-05-19 | 2018-06-12 | Hewlett Packard Enterprise Development Lp | Substrate sprayer |
US9653378B2 (en) * | 2014-08-04 | 2017-05-16 | National Center For Advanced Packaging Co., Ltd. | Heat dissipation solution for advanced chip packages |
US10100822B2 (en) | 2015-04-20 | 2018-10-16 | Hewlett-Packard Development Company, L.P. | Pump having freely movable member |
US10684662B2 (en) | 2015-04-20 | 2020-06-16 | Hewlett-Packard Development Company, L.P. | Electronic device having a coolant |
WO2016171659A1 (en) | 2015-04-20 | 2016-10-27 | Hewlett-Packard Development Company, L.P. | Pump having freely movable member |
ES2934733T3 (es) * | 2015-12-29 | 2023-02-24 | Zuta Core Ltd | Sistema de gestión térmica basado en vacío |
CA2956668A1 (en) * | 2016-01-29 | 2017-07-29 | Systemex Energies International Inc. | Apparatus and methods for cooling of an integrated circuit |
FR3075471B1 (fr) | 2017-12-14 | 2019-11-08 | Valeo Systemes Thermiques | Dispositif de regulation de temperature d'une batterie a l'aide d'un fluide dielectrique et pack-batterie comprenant un tel dispositif |
CN113690205B (zh) * | 2021-09-26 | 2024-02-02 | 深圳市铨天科技有限公司 | 一种芯片散热封装结构 |
CN116853508B (zh) * | 2023-09-04 | 2023-11-14 | 中国航空工业集团公司金城南京机电液压工程研究中心 | 一种飞行器喷雾冷却控制方法及装置 |
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US2812636A (en) * | 1950-06-16 | 1957-11-12 | Snecma | Process and device for deflecting jets |
US3595536A (en) * | 1968-08-26 | 1971-07-27 | Wayne H Ripley | Air-cooling device |
US5758823A (en) | 1995-06-12 | 1998-06-02 | Georgia Tech Research Corporation | Synthetic jet actuator and applications thereof |
US5963235A (en) | 1997-10-17 | 1999-10-05 | Eastman Kodak Company | Continuous ink jet printer with micromechanical actuator drop deflection |
US6079821A (en) * | 1997-10-17 | 2000-06-27 | Eastman Kodak Company | Continuous ink jet printer with asymmetric heating drop deflection |
US6012805A (en) | 1997-10-17 | 2000-01-11 | Eastman Kodak Company | Continuous ink jet printer with variable contact drop deflection |
US6509917B1 (en) | 1997-10-17 | 2003-01-21 | Eastman Kodak Company | Continuous ink jet printer with binary electrostatic deflection |
US6217163B1 (en) | 1998-12-28 | 2001-04-17 | Eastman Kodak Company | Continuous ink jet print head having multi-segment heaters |
JP2000252671A (ja) * | 1999-02-26 | 2000-09-14 | Sony Corp | 冷却装置及び電子機器 |
US6205799B1 (en) | 1999-09-13 | 2001-03-27 | Hewlett-Packard Company | Spray cooling system |
US6497510B1 (en) | 1999-12-22 | 2002-12-24 | Eastman Kodak Company | Deflection enhancement for continuous ink jet printers |
US6508532B1 (en) | 2000-10-25 | 2003-01-21 | Eastman Kodak Company | Active compensation for changes in the direction of drop ejection in an inkjet printhead having orifice restricting member |
US6508542B2 (en) | 2000-12-28 | 2003-01-21 | Eastman Kodak Company | Ink drop deflection amplifier mechanism and method of increasing ink drop divergence |
US6439703B1 (en) | 2000-12-29 | 2002-08-27 | Eastman Kodak Company | CMOS/MEMS integrated ink jet print head with silicon based lateral flow nozzle architecture and method of forming same |
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US6450619B1 (en) | 2001-02-22 | 2002-09-17 | Eastman Kodak Company | CMOS/MEMS integrated ink jet print head with heater elements formed during CMOS processing and method of forming same |
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US6604370B2 (en) | 2001-02-22 | 2003-08-12 | Hewlett-Packard Development Company, L.P. | Variably configured sprayjet cooling system |
US6595014B2 (en) * | 2001-02-22 | 2003-07-22 | Hewlett-Packard Development Company, L.P. | Spray cooling system with cooling regime detection |
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US6550263B2 (en) | 2001-02-22 | 2003-04-22 | Hp Development Company L.L.P. | Spray cooling system for a device |
US6708515B2 (en) * | 2001-02-22 | 2004-03-23 | Hewlett-Packard Development Company, L.P. | Passive spray coolant pump |
US6484521B2 (en) | 2001-02-22 | 2002-11-26 | Hewlett-Packard Company | Spray cooling with local control of nozzles |
US6644058B2 (en) | 2001-02-22 | 2003-11-11 | Hewlett-Packard Development Company, L.P. | Modular sprayjet cooling system |
US6572223B2 (en) | 2001-03-21 | 2003-06-03 | Eastman Kodak Company | Apparatus and method of balancing end jet forces in an ink jet printing system |
-
2004
- 2004-12-04 US US11/005,284 patent/US7549298B2/en active Active
-
2005
- 2005-10-31 WO PCT/US2005/039259 patent/WO2006062624A1/en active Application Filing
- 2005-10-31 CN CNB2005800415672A patent/CN100539095C/zh not_active Expired - Fee Related
- 2005-10-31 JP JP2007544354A patent/JP4616888B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7549298B2 (en) | 2009-06-23 |
CN101069284A (zh) | 2007-11-07 |
US20060117765A1 (en) | 2006-06-08 |
CN100539095C (zh) | 2009-09-09 |
JP2008522430A (ja) | 2008-06-26 |
WO2006062624A1 (en) | 2006-06-15 |
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