JP4615878B2 - Dye-sensitized solar cell and solar cell unit panel using the same - Google Patents

Description

  The present invention relates to a dye-sensitized solar cell that directly converts light energy into electric energy, and a solar cell unit panel in which the dye-sensitized solar cell is disposed in a panel body. More specifically, the present invention includes a dye-sensitized solar cell that includes a negative electrode side and a positive electrode electrode terminal for placement on the panel body, and is easily attached to and detached from the panel body, and the dye-sensitized solar cell panel. The present invention relates to a solar cell unit panel arranged in the main body.

  At present, in solar power generation, solar cells using single crystal silicon, polycrystalline silicon, amorphous silicon, and HIT (Heterojunction with Intrinsic Thin-layer) combined with these have been put into practical use and have become the main technology. These solar cells have an excellent photoelectric conversion efficiency of nearly 20%. However, silicon-based solar cells are expensive in terms of energy production, have many problems in terms of environmental impact, and have limitations in price and material supply. On the other hand, a dye-sensitized solar cell proposed by Gratzel et al. Has attracted attention as an inexpensive solar cell (see, for example, Non-Patent Document 1 and Patent Document 1). This solar cell has a structure in which an electrolyte is interposed between a titania porous electrode supporting a sensitizing dye and a counter electrode, and although the photoelectric conversion efficiency is lower than that of the current silicon-based solar cell, the material, Significant cost reduction is possible in terms of manufacturing method.

  Conventionally, silicon-based solar cells that have been conventionally used are practically used as unit panels having a predetermined voltage and capacity by connecting a plurality of cells each having a pair of positive and negative electrodes in series or in parallel. Also in the case of a dye-sensitized solar cell, a unit panel having a predetermined voltage and capacity can be obtained by connecting a plurality of cells in series or in parallel.

Japanese Patent Laid-Open No. 1-220380 Nature (Vol. 353, pp. 737-740, 1991)

However, in the conventional solar cell unit panel, it is difficult to partially replace the cells on the unit panel. With this unit panel, even if some cells are deteriorated or damaged, the unit panel itself must be replaced. did not become.
The present invention solves the above-described conventional problems, and a dye-sensitized solar cell in which an electrode terminal that can be easily attached to and detached from a panel body is provided on a substrate, and the solar cell corresponds to the electrode terminal. It aims at providing the solar cell unit panel arrange | positioned at a panel main body provided with a socket.

The present invention is as follows.
1. Translucent substrate 1, substrate 2 disposed opposite to translucent substrate 1, semiconductor electrode 3 having a sensitizing dye disposed on one surface side of translucent substrate 1, and the substrate 2, a catalyst electrode 4 disposed on one surface side, and an electrolyte 5 contained in at least a part of the semiconductor electrode 3 and filled between the semiconductor electrode 3 and the catalyst electrode 4, A dye-sensitized solar cell comprising a negative electrode terminal 31 that is electrically connected to the semiconductor electrode 3 and a positive electrode terminal 41 that is electrically connected to the catalyst electrode 4 provided on the other surface of the substrate 2. .
2. 1. The substrate 1 is a ceramic substrate. 2. A dye-sensitized solar cell according to 1.
3. The semiconductor electrode 3 and the negative electrode terminal 31 include at least one of a negative current collecting electrode 81 and a transparent conductive layer 91 provided on the one surface side of the translucent substrate 1, and the substrate. 2 is filled in a through hole 211 formed so as to penetrate the substrate 2 and the conductive bonding layer 6 disposed so as to surround the semiconductor electrode 3 and the catalyst electrode 4. The catalyst electrode 4 and the positive electrode terminal 41 are conducted through a conductor 72 filled in a through hole 212 formed through the substrate 2. 1 above. Or 2. 2. A dye-sensitized solar cell according to 1.
4). The other end surface side of the conductor 71 is connected to the negative electrode terminal 31, and one end surface side of the conductor 71 is disposed on the one surface side of the substrate 2 so as to surround the catalyst electrode 4. The other end surface of the conductor 72 is connected to the positive electrode terminal 41 and the one end surface of the conductor 72 is connected directly to the catalyst electrode 4 or other member. Are connected via 3 above. 2. A dye-sensitized solar cell according to 1.
5. 4. One side of the conductive bonding layer 6 is connected to the negative current collecting electrode 81, and the other side of the conductive bonding layer 6 is connected to the connecting conductor 73. 2. A dye-sensitized solar cell according to 1.
6). Each of the negative electrode terminal 31 and the positive electrode terminal 41 is a pin 311 or 411 constituting a pin connector, respectively. To 5 . The dye-sensitized solar cell of any one of these.
7). Translucent substrate 1, substrate 2 disposed opposite to translucent substrate 1, semiconductor electrode 3 having a sensitizing dye disposed on one surface side of translucent substrate 1, and the substrate 2, a catalyst electrode 4 disposed on one surface side, and an electrolyte 5 contained in at least a part of the semiconductor electrode 3 and filled between the semiconductor electrode 3 and the catalyst electrode 4, The substrate 2 has a protruding portion 22 in at least one direction, a negative electrode terminal 31 that is electrically connected to the semiconductor electrode 3 is provided on one surface side of the protruding portion 22, and on the other surface side of the protruding portion 22. A dye-sensitized solar cell, comprising a positive electrode terminal 41 that is electrically connected to the catalyst electrode 4.
8). The 7 above substrate 2 is a ceramic substrate. 2. A dye-sensitized solar cell according to 1.
9. The semiconductor electrode 3 and the negative electrode terminal 31 include at least one of a negative current collecting electrode 81 and a transparent conductive layer 91 provided on the one surface side of the translucent substrate 1, and the substrate. 2 through the conductive bonding layer 6 disposed so as to surround the semiconductor electrode 3 and the catalyst electrode 4, and the catalyst electrode 4 and the positive electrode terminal 41 above 7, which is conducted through the conductor 72 filled in the through-hole 212 formed through the substrate 2. Or 8 . 2. A dye-sensitized solar cell according to 1.
10. A connection conductor 73 is disposed on the one surface side of the substrate 2 so as to surround the catalyst electrode 4, and the negative electrode terminal 31 is connected to the connection conductor 73 or the connection conductor. The conductor 73 is formed to extend, the other end surface side of the conductor 72 is connected to the positive electrode side electrode terminal 41, and the one end surface side of the conductor 72 is directly attached to the catalyst electrode 4 or another member. 9. connected through the above-mentioned 9 . 2. A dye-sensitized solar cell according to 1.
11. One side of the conductive bonding layer 6, the is connected to the said negative-side collector electrode 81 9. Or 10 . 2. A dye-sensitized solar cell according to 1.
12 7 above each of the negative electrode-side electrode terminal 31 and the positive side electrode terminal 41, an edge terminals 312, 412 constituting the card edge connector, respectively. To 11 . The dye-sensitized solar cell of any one of these.
13. 6. above. And a panel body 101 for disposing a plurality of the dye-sensitized solar cells, wherein the panel body 101 includes each of the dye-sensitized solar cells. Sockets 1011 and 1012 corresponding to the respective pins 311 and 411 provided in the photosensitive solar cell are provided, the pins 311 and 411 are inserted into the sockets 1011 and 1012, and the dye-sensitized solar cell is connected to the panel. A solar cell unit panel, which is disposed in a main body 101.
14 The 13 each of said pin 311, 411 are provided so that the dye-sensitized solar cell can be disposed only in a certain direction of the panel body 101. The solar cell unit panel described in 1.
15. The above-mentioned 13 ... 4 wherein at least one of the number and shape of each of the pins 311 and 411 is different. Or 14 . The solar cell unit panel described in 1.
16. 12 above. And a panel body 102 for disposing a plurality of the dye-sensitized solar cells, wherein the panel body 102 includes each of the dye-sensitized solar cells. Sockets 1021 and 1022 corresponding to the respective edge terminals 312 and 412 provided in the photosensitive solar cell are provided, the edge terminals 312 and 412 are inserted into the sockets 1021 and 1022, and the dye-sensitized solar cell is A solar cell unit panel disposed on the panel body 102.

The semiconductor electrode 3 disposed on the one surface side of the translucent substrate 1 and the catalyst electrode 4 disposed on the one surface side of the substrate 2 are provided, and the negative electrode terminal 31 is provided on the other surface side 22 of the substrate 2. In addition, the dye-sensitized solar cell of the present invention in which the positive electrode terminal 41 is provided can be easily placed on the panel main body 101 and can be fixed simultaneously with the conduction to the panel main body 101.
In addition, when the substrate 2 is a ceramic substrate, the area of the current collecting electrode can be increased as compared with the case of using a substrate having high strength, excellent durability, and a light-transmitting conductive layer. Since the resistance can be lowered, a dye-sensitized solar cell with high photoelectric conversion efficiency can be obtained. Note that the area of the collecting electrode can be increased by using nickel, titanium, tungsten, or the like that has low reactivity with the electrolyte and high melting point, and is in direct contact with the electrolyte on one side of the substrate 2. This is because a current collecting electrode can be provided.
Further, the semiconductor electrode 3 and the negative electrode terminal 31 are formed by connecting at least one of the negative electrode current collecting electrode 81 and the transparent conductive layer 91 provided on one surface side of the translucent substrate 1 and one surface of the substrate 2. The conductive bonding layer 6 disposed so as to surround the semiconductor electrode 3 and the catalyst electrode 4 and the conductor 71 filled in the through hole 211 formed through the substrate 2. When the catalyst electrode 4 and the positive electrode terminal 41 are electrically connected via the conductor 72 filled in the through hole 212 formed through the substrate 2, the structure is simple. Thus, the semiconductor electrode 3 and the negative electrode side electrode terminal 31 and the catalyst electrode 4 and the positive electrode side electrode terminal 41 can be reliably conducted.
The other end surface side of the conductor 71 is connected to the negative electrode terminal 31, and the one end surface side of the conductor 71 is connected to the one surface side of the substrate 2 so as to surround the catalyst electrode 4. 73, the other end surface side of the conductor 72 is connected to the positive electrode side electrode terminal 41, and the one end surface side of the conductor 72 is connected to the catalyst electrode 4 directly or via another member. Is a simple structure, and the semiconductor electrode 3 and the negative electrode terminal 31 and the catalyst electrode 4 and the positive electrode terminal 41 are easily connected.
Further, when one surface side of the conductive bonding layer 6 is connected to the negative electrode side collecting electrode 81 and the other surface side of the conductive bonding layer 6 is connected to the connecting conductor 73, the semiconductor electrode 3. And the negative electrode terminal 31 can be conducted more reliably.
Further, when each of the negative electrode terminal 31 and the positive electrode terminal 41 is a pin 311 or 411 constituting a pin connector, each dye-sensitized solar cell can be easily attached to or detached from the panel body 101. Can do.
The semiconductor electrode 3 disposed on one surface side of the translucent substrate 1 and the catalyst electrode 4 disposed on one surface side of the substrate 2, and a negative electrode terminal on one surface side of the protruding portion 22 of the substrate 2 31 and the other dye-sensitized solar cell of the present invention in which the positive electrode terminal 41 is provided on the other surface side of the protruding portion 22 can be easily disposed on the panel body 102. The battery can be fixed simultaneously with the conduction to 102.
Further, when the substrate 2 is a ceramic substrate, the area of the current collecting electrode can be increased as compared with the case of using a substrate having high strength, excellent durability, and a light-transmitting conductive layer. Since the resistance can be lowered, a dye-sensitized solar cell with high photoelectric conversion efficiency can be obtained. The reason why the area of the current collecting electrode can be increased is as described above.
Further, the semiconductor electrode 3 and the negative electrode terminal 31 include at least one of the negative electrode current collecting electrode 81 and the translucent conductive layer 91 provided on one surface side of the translucent substrate 1 and one surface of the substrate 2. The conductive electrode 6 conducts through the conductive bonding layer 6 disposed so as to surround the semiconductor electrode 3 and the catalyst electrode 4, and the catalyst electrode 4 and the positive electrode terminal 41 penetrate through the substrate 2. When conducting through the conductor 72 filled in the formed through hole 212, the structure is simple, and the semiconductor electrode 3, the negative electrode terminal 31, the catalyst electrode 4, and the positive electrode terminal 41 are connected to each other. It is possible to ensure conduction.
Further, a connecting conductor 73 is disposed on one surface side of the substrate 2 so as to surround the catalyst electrode 4, and the negative electrode terminal 31 is connected to the connecting conductor 73, or the connecting conductor 73 extends. When the other end surface side of the conductor 72 is connected to the positive electrode side electrode terminal 41 and the one end surface side of the conductor 72 is connected to the catalyst electrode 4 directly or via another member. The semiconductor electrode 3 and the negative electrode side electrode terminal 31 and the catalyst electrode 4 and the positive electrode side electrode terminal 41 are easily connected.
In addition, when one surface side of the conductive bonding layer 6 is connected to the negative electrode side collecting electrode 81, the semiconductor electrode 3 and the negative electrode side electrode terminal 31 can be more reliably conducted.
Further, when each of the negative electrode terminal 31 and the positive electrode terminal 41 is an edge terminal 312, 412 constituting a card edge connector, each dye-sensitized solar cell can be easily attached to and detached from the panel body 102. can do.
A panel body 101 having a dye-sensitized solar cell in which each of the negative electrode-side electrode terminal 31 and the positive electrode-side electrode terminal 41 is pins 311 and 411 and sockets 1011 and 1012 for arranging a plurality of dye-sensitized solar cells. In the solar cell unit panel of the present invention, each battery can be easily attached and detached, only a deteriorated or damaged battery can be replaced, and stable battery performance can be maintained.
Further, when each of the pins 311 and 411 is provided so that the dye-sensitized solar cell can be arranged only in a certain direction of the panel body 101, occurrence of a short circuit or the like can be prevented. .
Furthermore, when at least one of the number and shape of each of the pins 311 and 411 is different, the occurrence of a short circuit or the like can be prevented.
A panel body having a dye-sensitized solar cell in which each of the negative electrode terminal 31 and the positive electrode terminal 41 is an edge terminal 312, 412 and sockets 1021, 1022 for arranging a plurality of dye-sensitized solar cells. The other solar cell unit panel of the present invention comprising 102 can easily attach and detach each battery, can replace only a deteriorated or damaged battery, and can maintain stable battery performance.

Hereinafter, with reference to FIGS. 1-18, the dye-sensitized solar cell and solar cell unit panel of this invention are demonstrated in detail.
Examples of the “translucent substrate 1” include substrates made of glass, resin sheets, and the like. The resin sheet is not particularly limited, and examples thereof include resin sheets made of polyester such as polyethylene terephthalate and polyethylene naphthalate, polyphenylene sulfide, polycarbonate, polysulfone, and polyethyleneidene norbornene. When a plurality of solar cells are used while being arranged on the panel body, the light-transmitting substrate 1 of each solar cell may be a glass substrate or a resin substrate. Moreover, when it is a resin substrate, the resin may be the same resin or a different resin.
In addition, translucency means that the transmittance | permeability of visible light with a wavelength of 400-900 nm is 10% or more. This transmittance is preferably 60% or more, particularly 85% or more. Hereinafter, the meaning of translucency and preferable transmittance are all the same.
Transmittance (%) = (transmitted light amount / incident light amount) × 100
The thickness of the translucent substrate 1 varies depending on the material and is not particularly limited. However, it is preferable that the transmissivity is 60 to 99%, particularly 85 to 99%.

  The “substrate 2” disposed opposite to the light-transmitting substrate 1 may have a light-transmitting property or may not have a light-transmitting property. The substrate 2 having a light-transmitting property can be formed using glass, a resin sheet, or the like as in the case of the light-transmitting substrate 1. When this board | substrate 2 consists of resin sheets, said various thermoplastic resins are mentioned as resin used for formation of this resin sheet. When the substrate 2 is a light-transmitting substrate, the thickness varies depending on the material and is not particularly limited. However, the thickness may be 60 to 99%, particularly 85 to 99%. preferable.

  The substrate 2 that does not have translucency can be formed of ceramic. The ceramic substrate has high strength, and this substrate can be used as a support substrate to provide a dye-sensitized solar cell having excellent durability. The ceramic used for forming the ceramic substrate is not particularly limited, and various ceramics such as oxide ceramics, nitride ceramics, and carbide ceramics can be used. Examples of the oxide ceramic include alumina, mullite, zirconia and the like. Examples of the nitride ceramic include silicon nitride, sialon, titanium nitride, and aluminum nitride. Further, examples of the carbide-based ceramic include silicon carbide, titanium carbide, and aluminum carbide. As the ceramic, alumina, silicon nitride, zirconia and the like are preferable, and alumina is particularly preferable.

When the board | substrate 2 consists of ceramics, the thickness is not specifically limited, However, It can be referred to as 100 micrometers-5 mm, 300 micrometers-4 mm, Especially 500 micrometers-2 mm, Furthermore, it can be set as 700 micrometers-1.5 mm. When the thickness of the ceramic substrate is 100 μm to 5 mm, particularly 500 μm or more, the substrate having this high strength becomes a support substrate, and a dye-sensitized solar cell having excellent durability can be obtained.
When a plurality of solar cells are arranged and used in the panel body, the substrate 2 may be any of a glass substrate, a resin substrate, and a ceramic substrate. Furthermore, when it is a resin substrate, the resin may be the same resin or a different resin. When the ceramic substrate is used, the ceramics may be the same ceramic or different ceramics.

  The light-transmitting substrate 1 can be formed of glass, resin, or the like, and the substrate 2 can be formed of glass, resin, ceramic, or the like. The light-transmitting substrate 1 is a glass substrate, and the substrate 2 is A ceramic substrate is preferred. As the ceramic used for the ceramic substrate, alumina, silicon nitride, zirconia and the like are preferable, and alumina is particularly preferable. Thus, the translucent substrate 1 is a glass substrate, the substrate 2 is preferably a ceramic substrate made of alumina, silicon nitride, zirconia, etc., the translucent substrate 1 is a glass substrate, and the substrate 2 is alumina. More preferably, it is a substrate.

  The semiconductor electrode 3 in the dye-sensitized solar cell of the present invention and other dye-sensitized solar cells of the present invention is disposed on one surface side of the translucent substrate 1. The electrode substrate of the semiconductor electrode 3 can be formed of metal oxide, metal sulfide, or the like. Examples of the metal oxide include titania, tin oxide, zinc oxide, niobium oxide such as niobium pentoxide, tantalum oxide, and zirconia. Also, double oxides such as strontium titanate, calcium titanate, and barium titanate can be used. Furthermore, examples of the metal sulfide include zinc sulfide, lead sulfide, and bismuth sulfide.

  The method for producing the electrode substrate is not particularly limited. For example, the electrode substrate can be produced by applying a paste containing fine particles such as metal oxide and metal sulfide on the surface of the light-transmitting substrate 1 and baking the paste. The method for applying the paste is not particularly limited, and examples thereof include a screen printing method, a doctor blade method, a squeegee method, and a spin coating method. The electrode substrate produced in this way is formed in the form of an aggregate made up of fine particles.

  The electrode substrate is coated with a colloidal solution in which fine particles such as metal oxide and metal sulfide and a small amount of organic polymer are dispersed on the surface of the translucent substrate 1 and the like, then dried and then heated. It can also be produced by a process such as decomposing and removing the organic polymer. This colloidal solution can also be applied by various methods such as a screen printing method, a doctor blade method, a squeegee method, and a spin coating method. The electrode substrate produced by this method is also formed in the form of an aggregate made up of fine particles.

  The thickness of the semiconductor electrode 3 is not particularly limited, but may be 0.1 to 100 μm, preferably 1 to 50 μm, particularly 2 to 40 μm, and more preferably 5 to 30 μm. If the thickness of the semiconductor electrode 3 is 0.1 to 100 μm, photoelectric conversion is sufficiently performed and power generation efficiency is improved. Further, the semiconductor electrode 3 is preferably heat-treated in order to improve its strength and adhesion to the translucent substrate 1 and the substrate 2. The temperature and time of the heat treatment are not particularly limited, but the heat treatment temperature is preferably 40 to 700 ° C., particularly 100 to 500 ° C., and the heat treatment time is preferably 10 minutes to 10 hours, particularly preferably 20 minutes to 5 hours. In addition, when using a resin sheet as the translucent board | substrate 1 and the board | substrate 2, it is preferable to heat-process at low temperature so that resin may not thermally deteriorate.

  As said "sensitizing dye" which the semiconductor electrode 3 has, the complex dye and organic dye which improve the effect | action of a photoelectric conversion can be used. Examples of complex dyes include metal complex dyes, and examples of organic dyes include polymethine dyes and merocyanine dyes. Examples of the metal complex dye include a ruthenium complex dye and an osmium complex dye, and a ruthenium complex dye is particularly preferable. Furthermore, in order to expand the wavelength range in which photoelectric conversion is performed and improve the photoelectric conversion efficiency, two or more sensitizing dyes having different wavelength ranges in which a sensitizing action is exhibited can be used in combination. In this case, it is preferable to set the type of sensitizing dye to be used in combination and the amount ratio thereof depending on the wavelength range and intensity distribution of the irradiated light. The sensitizing dye preferably has a functional group for bonding to the semiconductor electrode. Examples of this functional group include a carboxyl group, a sulfonic acid group, and a cyano group.

  The method for attaching the sensitizing dye to the electrode substrate is not particularly limited. For example, the electrode substrate is immersed in a solution in which the sensitizing dye is dissolved in an organic solvent, the solution is impregnated, and then the organic solvent is removed. Can be attached. Alternatively, this solution can be applied to the electrode substrate and then adhered by removing the organic solvent. Examples of the coating method include a wire bar method, a slide hopper method, an extrusion method, a curtain coating method, a spin coating method, and a spray coating method. Furthermore, this solution can also be applied by a printing method such as offset printing, gravure printing or screen printing.

  The adhesion amount of the sensitizing dye is preferably 0.01 to 1 mmol, particularly 0.5 to 1 mmol with respect to 1 g of the semiconductor electrode. When the adhesion amount is 0.01 to 1 mmol, photoelectric conversion in the semiconductor electrode is efficiently performed. Moreover, if the sensitizing dye that has not adhered to the semiconductor electrode is liberated around the electrode, the conversion efficiency may be lowered. For this reason, it is preferable to remove the excess sensitizing dye by washing the semiconductor electrode after the treatment for attaching the sensitizing dye. This removal can be performed by washing with a polar solvent such as acetonitrile and an organic solvent such as an alcohol solvent using a washing tank. In order to attach a large amount of sensitizing dye to the electrode substrate, it is preferable to heat the semiconductor electrode and perform a treatment such as dipping or coating. In this case, in order to avoid water adsorbing on the surface of the semiconductor electrode, it is preferable to perform the treatment promptly at 40 to 80 ° C. without heating to room temperature after heating.

  The catalyst electrode 4 in the dye-sensitized solar cell of the present invention and the other dye-sensitized solar cells of the present invention is disposed on one surface side of the substrate 2. The catalyst electrode 4 must be provided so as not to be electrically connected to the conductive bonding layer 6 and the connecting conductor 73 described later. The catalyst electrode 4 includes at least one of a metal having a catalytic activity or a metal having a catalytic activity, a conductive oxide and a conductive polymer used for forming a light-transmitting conductive layer 91 described later. One type can be used. As a substance having catalytic activity, noble metals such as platinum, gold and rhodium (however, silver is not preferred because of its low corrosion resistance to electrolytes, etc. Hereinafter, silver is also not preferred for the parts where the electrolyte etc. can contact) .), Carbon black and the like, and these have conductivity together. The catalyst electrode is preferably formed of a noble metal having catalytic activity and electrochemically stable, and it is particularly preferable to use platinum having high catalytic activity and high corrosion resistance to the electrolyte.

In the case of using a metal, a conductive oxide, a conductive polymer, or the like that does not have catalytic activity, examples of the metal used by mixing with the catalyst electrode include aluminum, copper, chromium, nickel, tungsten, and the like. Furthermore, polyaniline, polypyrrole, polyacetylene, etc. are mentioned as a conductive polymer used by mixing with a catalyst electrode. Moreover, as this conductive polymer, what was prepared by mix | blending various electroconductive substances with resin which does not have electroconductivity is mentioned. The resin not having conductivity is not particularly limited, and may be a thermoplastic resin or a thermosetting resin. Examples of the thermoplastic resin include thermoplastic polyester resin, polyamide, polyolefin, and polyvinyl chloride. Furthermore, examples of the thermosetting resin include an epoxy resin, a thermosetting polyester resin, and a phenol resin. The conductive substance is not particularly limited, and examples thereof include metals such as carbon black, copper, aluminum, nickel, chromium, and tungsten, and conductive polymers such as polyaniline, polypyrrole, and polyacetylene. As the conductive substance, a noble metal and carbon black having both conductivity and catalytic activity are particularly preferable. Only one type of conductive material may be used, or two or more types may be used.
When metals, conductive oxides, conductive polymers, etc. that do not have catalytic activity are used, the content of the above-mentioned substances having catalytic activity is 100 masses of metals, conductive oxides, conductive polymers, etc. Parts, preferably 1 to 99 parts by mass, particularly 50 to 99 parts by mass.

  Thus, the catalyst electrode 4 can be formed of a substance having conductivity and catalytic activity. Further, it can be formed of at least one of a metal, a conductive oxide and a conductive polymer containing a substance having catalytic activity. Furthermore, the catalyst electrode 4 may be a layer made of only one kind of material or a mixed layer made of two or more kinds of materials. Further, the catalyst electrode 4 may be a single layer, a metal layer, a conductive oxide layer, a conductive polymer layer, and a mixed layer composed of two or more of metal, conductive oxide and conductive polymer. A multilayer catalyst electrode composed of two or more of them may be used. The thickness of the catalyst electrode is not particularly limited, but can be 3 nm to 10 μm, particularly 3 nm to 2 μm in both cases of a single layer and a multilayer. When the thickness of the catalyst electrode is 3 nm to 10 μm, the catalyst electrode can have a sufficiently low resistance.

  The catalytic electrode 4 made of a substance having catalytic activity can be formed by applying a paste containing fine particles of a substance having catalytic activity to the surface of the substrate 2 or the like. Further, the catalyst electrode 4 made of a metal containing a substance having catalytic activity or a conductive oxide can also be formed by the same method as that for the substance having catalytic activity. Examples of the coating method include various methods such as a screen printing method, a doctor blade method, a squeegee method, and a spin coating method. Furthermore, these catalyst electrodes 4 can also be formed by depositing metal or the like on the surface of the substrate 2 or the like by sputtering, vapor deposition, ion plating or the like.

  Further, the catalyst electrode 4 made of a conductive polymer containing a substance having a catalytic activity is composed of a conductive polymer and a substance having a catalytic activity such as a powder or a fiber, a Banbury mixer, an internal mixer, an open The resin composition prepared by kneading with a roll or the like can be formed into a film, and the film can be bonded to the surface of the substrate 2 or the like. Further, a solution or dispersion prepared by dissolving or dispersing the resin composition in a solvent can be applied to the surface of the substrate 2 and the like, dried, the solvent removed, and heated as necessary. . In addition, when the catalyst electrode 4 is a mixed layer, it can be formed by an appropriate method among the above-described various methods according to the type of material contained.

  The “electrolyte 5” is contained in at least a part of the semiconductor electrode 3 and is filled between the translucent substrate 1 and the substrate 2. The electrolyte 5 is usually contained in the entire semiconductor electrode 3 and filled in the entire gap between the translucent substrate 1 and the substrate 2.

Examples of the electrolyte include (1) I ₂ and iodide, (2) Br ₂ and bromide, (3) metal complexes such as ferrocyanate-ferricyanate, ferrocene-ferricinium ion, and (4) sodium polysulfide. And electrolytes containing sulfur compounds such as alkylthiol-alkyldisulfides, (5) viologen dyes, (6) hydroquinone-quinones, and the like. As iodide in (1) is, LiI, NaI, KI, CsI, metal iodide such as CaI _2, and tetraalkylammonium iodide, pyridinium iodide, imidazolium iodide iodine salt of quaternary ammonium compounds such as id, etc. Is mentioned. As the bromide in (2), LiBr, NaBr, KBr, CsBr, CaBr 2 , etc. of the metal bromide, and tetra-alkyl ammonium bromide, bromine salts of quaternary ammonium compounds such as pyridinium bromide and the like. Among these electrolytes, an electrolyte obtained by combining I ₂ and an iodine salt of a quaternary ammonium compound such as LiI, pyridinium iodide, and imidazolium iodide is particularly preferable. These electrolytes may use only 1 type and may use 2 or more types.

  The electrolyte 5 can be blended in a solvent together with various additives and used as an electrolyte solution. This solvent preferably has a low viscosity, a high ion mobility, and sufficient ion conductivity. Examples of such solvents include (1) carbonates such as ethylene carbonate and propylene carbonate, (2) heterocyclic compounds such as 3-methyl-2-oxazolidinone, (3) ethers such as dioxane and diethyl ether, (4 ) Chain ethers such as ethylene glycol dialkyl ether, propylene glycol dialkyl ether, polyethylene glycol dialkyl ether, polypropylene glycol dialkyl ether, (5) methanol, ethanol, ethylene glycol monoalkyl ether, propylene glycol monoalkyl ether, polyethylene glycol monoalkyl Monoalcohols such as ether and polypropylene glycol monoalkyl ether, (6) ethylene glycol, propylene glycol, polyethylene Polyhydric alcohols such as polyglycol, polypropylene glycol and glycerin, (7) nitriles such as acetonitrile, glutarodinitrile, methoxyacetonitrile, propionitrile, benzonitrile, and (8) aprotic such as dimethyl sulfoxide and sulfolane. Examples include polar substances. These solvent may use only 1 type and may use 2 or more types.

  When an electrolyte solution is used, this solution is sealed between the light-transmitting substrate 1 and the substrate 2 with a resin or glass around the semiconductor electrode 3 or the like, and the electrolyte solution is injected into a gap formed thereby. Can be made. The electrolyte solution may be injected into the gap from the translucent substrate 1 side or the substrate 2 side, and it is preferable to provide an injection port on the side that is easily perforated and to inject from this injection port. In addition, although one injection port is sufficient, another hole can also be provided for air venting. Thus, by providing the hole for air venting, the electrolyte solution can be injected more easily.

  The distance between the semiconductor electrode 3 and the catalyst electrode 4 is not particularly limited, but can be 200 μm or less, particularly 100 μm or less, and further 50 μm or less (usually 1 μm or more). If this interval is less than or equal to a predetermined value, the conversion efficiency can be sufficiently increased.

  Examples of resins used for sealing around the semiconductor electrode 3 and the like include polyamide resins, thermoplastic polyester resins, modified polyolefin resins such as maleic acid-modified polyethylene, and polyolefin resins having adhesive properties such as ethylene-ethyl acrylate copolymer resins. And other thermoplastic resins. Moreover, thermosetting resins, such as an epoxy resin, a urethane resin, a polyimide resin, and a thermosetting polyester resin, are mentioned. Furthermore, this sealing can also be performed with glass, and it is preferable to seal with glass particularly in a solar cell that requires long-term durability.

  As shown in FIGS. 1, 3, 4, 7, 8, 10 and the like on one surface side of the translucent substrate 1, the “negative electrode side collecting electrode 81” and the “translucent conductive layer 91” are arranged. At least one can be provided. In this case, the semiconductor electrode 3 and the negative electrode terminal 31 can be electrically connected via at least one of the negative electrode collector electrode 81 and the translucent conductive layer 91.

  The shape of the negative electrode side collecting electrode 81 is not particularly limited as long as the translucency is maintained, and can be formed so as to surround the semiconductor electrode 3 as shown in FIGS. Furthermore, it can be an electrode made of a linear electrode and formed by a specific electrode pattern, for example, a lattice shape (see FIGS. 3, 4, 10, 14), a comb shape, a radial shape, or the like. It can be an electrode. Further, in the case of the negative electrode side collector electrode 81 made of this linear electrode and formed by a specific electrode pattern, the width and thickness of the linear electrode are not particularly limited, and its electric resistance, cost, etc. It is preferable to set in consideration. The total area of the negative electrode side collector electrode 81 is 0.1 to 20%, particularly 0.1 to 5% with respect to the total area of the semiconductor electrode 3 when the negative electrode side collector electrode 81 is projected onto the semiconductor electrode 3. Further, 0.1 to 1% is preferable. If the total area of the negative electrode side collecting electrode 81 is 0.1 to 20% with respect to the total area of the semiconductor electrode 3, the amount of light irradiated to the semiconductor electrode 3 can be sufficiently maintained, and the current collecting efficiency Can be increased.

The translucent conductive layer 91 only needs to have translucency and conductivity. The material of the translucent conductive layer 91 is not particularly limited, and examples thereof include a thin film made of a conductive oxide, a metal thin film, and a carbon thin film. Examples of the conductive oxide include tin oxide, fluorine-doped tin oxide, indium oxide, tin-doped indium oxide, and zinc oxide. Examples of the metal include platinum, gold, copper, aluminum, rhodium and indium. The thickness of the transparent conductive layer 91 is different depending on the material, but are not limited to, surface resistance 100 [Omega / cm ² or less, particularly preferably 1~10Ω / cm ² become thick. Further, the method for forming the light-transmitting conductive layer 91 is not particularly limited, and a paste containing fine particles such as metal and conductive oxide can be applied to the surface of the light-transmitting substrate 1. Examples of the coating method include various methods such as a doctor blade method, a squeegee method, and a spin coating method. The light-transmitting conductive layer 91 can also be formed by a sputtering method, a vacuum evaporation method, an ion plating method, or the like using a metal, a conductive oxide, or the like.

  Further, in the case where the negative electrode side current collecting electrode 81 is provided, the current collecting efficiency is further improved if the light transmitting conductive layer 91 is additionally provided, but the light transmitting conductive layer 91 is not necessarily provided. In particular, in a dye-sensitized solar cell having a specific structure as shown in FIG. 4, a solar cell with sufficiently high power generation efficiency can be obtained without providing the translucent conductive layer 91. In this dye-sensitized solar cell, a porous insulating layer I that electrically insulates the catalyst electrode 4, the negative electrode side, and the positive electrode side in this order from the substrate 2 side between the substrate 2 and the translucent substrate 1. The negative current collecting electrode 81 and the semiconductor electrode 3 are laminated and provided. An electrolyte is filled and contained between the interface between the catalyst electrode 4 and the porous insulating layer I and the interface between the translucent substrate 1 and the semiconductor electrode 3. Therefore, when the negative electrode side collector electrode 81 is flat, the negative electrode side collector electrode 81 needs to be a porous body. The porosity of the negative electrode side collector electrode 81 made of this porous material is not particularly limited, but may be 2 to 40%, particularly 10 to 30%, and further 15 to 25%. If the porosity is 10 to 30%, the electrolyte can be easily contained without lowering the current collection efficiency.

  The material of the porous insulating layer I is not particularly limited, and examples thereof include ceramic, resin, and glass, and ceramic is preferable. As the ceramic, various ceramics such as oxide ceramics, nitride ceramics, and carbide ceramics can be used. Examples of the oxide ceramic include alumina, mullite, zirconia and the like. Examples of the nitride ceramic include silicon nitride, sialon, titanium nitride, and aluminum nitride. Further, examples of the carbide-based ceramic include silicon carbide, titanium carbide, and aluminum carbide. As the ceramic, alumina, silicon nitride, zirconia and the like are preferable, and alumina is particularly preferable.

  The planar shape of the porous insulating layer I is not particularly limited as long as the negative electrode side and the positive electrode side can be electrically insulated. For example, the planar shape may be a planar shape, and may be a specific shape such as a lattice shape, a comb shape, or a radial shape. It may be a shape. Furthermore, the porosity of the porous insulating layer I is not particularly limited, but is preferably 2 to 40%, particularly 10 to 30%, and more preferably 15 to 25%. When the porosity is 10 to 30%, the electrolyte is easily contained, and the function as a solar cell is not impaired. Further, the thickness of the porous insulating layer I is not particularly limited, but also varies depending on the method of manufacturing the dye-sensitized solar cell. For example, the dye-sensitized solar cell includes a laminate in which the substrate 2, the catalyst electrode 4, the porous insulating layer I, the negative-side collector electrode 81, and the semiconductor electrode 3 are arranged in this order, and a translucent substrate. In the case of manufacturing by laminating 1 and facing, the thickness of the porous insulating layer I can be 0.5 to 20 μm, particularly 1 to 10 μm, and further 2 to 5 μm. When the thickness of the porous insulating layer I is 0.5 to 20 μm, the negative electrode side and the positive electrode side can be sufficiently electrically insulated.

The porous insulating layer I may be formed by forming a coating film on the surface of the catalyst electrode 4 by a screen printing method or the like using a paste containing each ceramic component or the like, and then firing at a predetermined temperature. it can. Further, a ceramic such as alumina, silicon nitride, zirconia, or the like can be deposited on the surface of the catalyst electrode 4 by a physical vapor deposition method such as a magnetron sputtering method or an electron beam vapor deposition method.
In the dye-sensitized solar cell of FIG. 4, a positive current collecting electrode 82 described later can be provided between the substrate 2 and the catalyst electrode 4.

  As shown in FIG. 7, at least one of the positive electrode side collector electrode 82 and the conductive layer 92 can be provided on one surface side of the substrate 2. In this case, the catalyst electrode 4 and the positive electrode terminal 41 can be electrically connected via at least one of the positive electrode collector electrode 82 and the conductive layer 92. However, the positive electrode side collecting electrode 82 and the conductive layer 92 must be provided so as not to be electrically connected to the conductive bonding layer 6 and the connecting conductor 73 described later.

  The positive electrode side collector electrode 82 is formed from a noble metal excellent in conductivity, such as platinum or gold, and has a thickness of 20 nm or more, more preferably 1 μm or more (usually 10 μm or less), from the viewpoint of conductivity. Is not necessary, but is preferably provided in terms of cost. That is, since platinum or the like is expensive, it is preferable to make the catalyst electrode 4 as thin as possible. However, if the layer is thin, the resistance increases, so that the positive electrode side collector electrode made of a metal such as tungsten, titanium, or nickel. By providing 82, the current collection efficiency can be improved and the cost can be reduced. Furthermore, when the catalyst electrode 4 is formed of a composition in which the conductive oxide is mixed with a substance having catalytic activity, the resistance of the catalyst electrode 4 is higher, so the positive electrode side collector electrode 82 is provided, It is more preferable to increase the current collection efficiency.

  The shape of the positive-side current collecting electrode 82 is not particularly limited, but the light-transmitting property is not essential on the substrate 2 side, and can be a flat shape. When this positive electrode side collecting electrode 82 is planar, in order to make the positive electrode side collecting electrode 82 with low resistance, it has a planar shape similar to that of the catalyst electrode 4 and 50% or more with respect to the catalyst electrode 4. In particular, a planar electrode having an area of 65% or more, more preferably 80% or more (or the same area) is preferable. Further, it is more preferable that the catalyst electrode 4 is disposed in a similar shape. Moreover, the positive electrode side current collection electrode 82 can also be used as the electrode which consists of a linear electrode and is formed with the specific electrode pattern. This specific pattern is not particularly limited, and may be, for example, a lattice shape, a comb shape, a radial shape, or the like. In the case of the positive electrode side collector electrode 82 made of this linear electrode and formed by a specific electrode pattern, the width and thickness of the linear electrode are not particularly limited, taking into account its electrical resistance, cost, etc. It is preferable to set. When the positive electrode side collecting electrode 82 is an electrode made of a linear electrode and formed by a specific electrode pattern, the total area of the positive electrode side collecting electrode 82 is not particularly limited. When projected onto the catalyst electrode 4, the total area of the catalyst electrode 4 can be 0.1% or more, particularly 5% or more, and more preferably 10% or more. In addition, the total area can be 90% or more, and the current collecting efficiency can be further improved with the positive electrode side current collecting electrode 82 having such a large area.

The conductive layer 92 may have a light-transmitting property or may not have a light-transmitting property. The conductive layer 92 can be formed using a material similar to that of the light-transmitting conductive layer 91. The thickness of the conductive layer 92 is not particularly limited because the conductive layer 92 need not be light-transmitting, but is preferably a thin film from the viewpoint of cost. In addition, although it will become translucent if it is set as a thin film, internal resistance becomes high. Therefore, the thickness of the conductive layer 92 is preferably set in consideration of the light-transmitting and internal resistance, usually a surface resistance of 100 [Omega / cm ² or less, in particular to the thickness of the 1~10Ω / cm ² Can do. The conductive layer 92 can be formed by a method similar to that of the light-transmitting conductive layer 91.

  The method of providing the negative electrode side current collecting electrode 81 and the positive electrode side current collecting electrode 82 is not particularly limited. For example, a physical pattern such as a magnetron sputtering method or an electron beam vapor deposition method is used by using a mask on which a predetermined pattern is formed. Examples thereof include a method of depositing a metal such as tungsten, titanium, or nickel by an evaporation method or the like and then patterning by photolithography or the like. Moreover, it can form by the method of patterning by the screen-printing method etc. using the metallized ink containing each metal component, and baking it after that. As a metal used for physical vapor deposition or the like, noble metals such as platinum and gold, copper, and the like can be used in addition to tungsten, titanium, and nickel. As this metal, it is preferable to use tungsten, titanium, nickel, a noble metal, etc. which are excellent in corrosion resistance. Furthermore, noble metals such as tungsten, titanium, nickel, platinum, and gold, copper, and the like can be used as the metal contained in the metallized ink. As this metal, it is preferable to use tungsten, titanium, nickel, noble metal, etc. which are excellent in corrosion resistance.

The “negative electrode terminal 31” connected to the semiconductor electrode 3 and the “positive electrode terminal 41” connected to the catalyst electrode 4 are provided on the substrate 2 where translucency is not essential (FIGS. 1, 3, 4). , 7, 8, 10 etc.). In this case, the substrate 2 may be any of a glass substrate, a resin substrate, a ceramic substrate, and the like, but it is easy to dispose the negative electrode terminal and the positive electrode terminal, and the dye sensitization has excellent durability. A ceramic substrate that can be a type solar cell is preferred.

  In the dye-sensitized solar cell including the negative electrode side electrode terminal 31 and the positive electrode side electrode terminal 41, the semiconductor electrode 3 and the negative electrode side electrode terminal 31 may be electrically connected in any way. In the dye-sensitized solar cell of the present invention, as shown in FIGS. 1, 3, 4, and 7, the semiconductor electrode 3 and the negative electrode terminal 31 are arranged on the negative electrode side provided on one surface side of the translucent substrate 1. A conductive bonding layer 6 disposed so as to surround the semiconductor electrode 3 and the catalyst electrode 4 between at least one of the electric electrode 81 and the translucent conductive layer 91 and one surface side of the substrate 2; 2 can be conducted through a conductor 71 filled in a through hole 211 formed so as to penetrate 2. In addition, the catalyst electrode 4 and the positive electrode terminal 41 may be electrically connected in any way. For example, as shown in FIGS. Can be conducted through a conductor 72 filled in a through hole 212 formed through the substrate 2.

  The “conductive bonding layer 6” may be formed using a conductive resin in which a conductive component is blended with the thermoplastic resin and the thermosetting resin used for sealing around the semiconductor electrode 3 and the like. it can. Examples of the conductive component include titanium, nickel, tungsten, and carbon black. These conductive components may be used alone or in combination of two or more. For the conductive bonding layer 6, a conductive paste containing a conductive resin is prepared, and this conductive paste is applied to one side of the translucent substrate 1 and / or one side of the substrate 2, and heated as necessary. It can be formed by a process such as. In addition, a frame made of a conductive resin is formed in advance, and this frame is interposed between the one surface side of the translucent substrate 1 and the one surface side of the substrate 2 and heated as necessary. It can be formed by a process.

  The “conductor 71” can be provided by filling the “through hole 211” formed through the substrate 2 with a conductive material. Further, the “conductor 72” can be provided by filling the “through hole 212” formed through the substrate 2 with a conductive material. Further, when the conductive layer 92 is provided, the conductive layer 92 can be provided by filling the through hole 212 formed through the substrate 2 and the conductive layer 92 with a conductive material. The conductive material may be filled in the entire through holes 211 and 212, or a conductor layer may be formed on the wall surface of the through hole.

  The shape of the cross section of the through holes 211 and 212 is not particularly limited, and may be a circle, an ellipse, a polygon such as a triangle, a quadrangle, or the like. The cross-sectional shape is usually circular. Moreover, the dimension of the radial direction of a through hole is not specifically limited, either, When a cross section is circular, it can be set as a through-hole with a diameter of 0.05-1 mm, especially 0.1-0.8 mm. Furthermore, when the cross section is not circular, a through hole having an opening size equivalent to that of a circular area can be obtained. The through holes 211 and 212 can be formed by various methods such as irradiation with a laser beam such as a YAG laser or a carbon dioxide laser, drilling, or punching using a punch. When the substrate 2 is a ceramic substrate, a through hole can be easily formed in a green ceramic sheet using a punch or the like.

  Filling the through holes 211 and 212 with the conductive material can be performed by filling a conductive paste from at least one opening of the through holes by a hole-filling printing method or the like, and then firing. The conductor paste is not particularly limited, but a paste prepared by mixing a metal powder, an organic binder, an organic solvent, a solvent such as water, and the like can be used. The metal powder is not particularly limited, and examples thereof include powders of metals such as gold, silver, platinum, palladium, copper, tungsten, nickel and titanium, and powders of alloys such as silver-platinum alloys and silver-palladium alloys. Moreover, a glass component can also be contained in the paste for conductors. A glass component is preferable because it can be fired at a lower temperature. Furthermore, the formation of the conductor layer on the wall surface of the through hole can be performed by an electroless plating method or the like.

  The other end face side of the conductor 71 is connected to the negative electrode terminal 31 and the one end face side of the conductor 71 is connected to the conductive bonding layer 6 so that the semiconductor electrode 3 and the negative electrode terminal 31 are electrically connected. . In order to make the electrical connection more reliable, as shown in FIGS. 1, 3, 4, 7, 8, 10, etc., a connecting conductor 73 is provided on one side of the substrate 2 so as to surround the catalyst electrode 4. And connecting at least one of the negative electrode side collecting electrode 81 and the light transmitting conductive layer 91 provided on the one surface side of the conductive bonding layer 6 and the one surface side of the light transmitting substrate 1, and conductive bonding It is preferable to connect the other surface side of the layer 6 and the connecting conductor 73. In particular, as shown in FIGS. 1, 3, 4, 7, 8, 10, and the like, a negative electrode side collector electrode 81 is provided on one surface side of the translucent substrate 1 so as to surround the semiconductor electrode 3, and the conductive bonding layer 6. It is more preferable to connect the one surface side and the entire surface of the negative electrode side collecting electrode 81, and connect the other surface side of the conductive bonding layer 6 and the entire surface of the connecting conductor 73.

  The method for providing the connecting conductor 73 is not particularly limited, and, as in the case of the negative electrode side collector electrode 81 and the positive electrode side collector electrode 82, by physical vapor deposition such as magnetron sputtering and electron beam vapor deposition. It can be formed by a method of depositing a metal and then patterning by photolithography or the like, and a method of patterning by a screen printing method or the like using a metallized ink containing a metal component, and then baking. As the metal, in addition to tungsten, titanium, nickel, noble metals such as platinum and gold, copper, and the like can be used. It is preferable to use tungsten, titanium, nickel, noble metals, and the like that are excellent in corrosion resistance to the electrolyte. In addition, when the connection conductor 73 is covered with the conductive bonding layer 6, a metal such as silver having insufficient corrosion resistance may be used.

  The other end surface side of the conductor 72 is connected to the positive electrode side electrode terminal 41, and the one end surface side of the conductor 72 is connected to the catalyst electrode 4, so that the catalyst electrode 4 and the positive electrode side electrode terminal 41 are electrically connected. In addition, when at least one of the positive electrode side collector electrode 82 and the conductive layer 92 is provided on one surface side of the substrate 2, the one end surface side of the conductor 72 is the positive electrode side collector electrode 82 and / or the conductive layer. 92 may be connected. Note that one end surface side of the conductor 72 may be directly connected to the catalyst electrode 4 and may be in contact with the positive-side collector electrode 82 and / or the conductive layer 92.

  The negative electrode side electrode terminal 31 and the positive electrode side electrode terminal 41 are not particularly limited as long as a dye-sensitized solar cell can be disposed on the “panel body 101, 102” of the solar cell unit panel. In the case of another dye-sensitized solar cell of the present invention, as shown in FIGS. 1, 3, 4, and 7, each of the negative electrode terminal 31 and the positive electrode terminal 41 constitutes the “pin connector”. The “pins 311 and 411” may be used. Thus, in the dye-sensitized solar cell in which the negative electrode terminal 31 and the positive electrode terminal 41 are pins, the pins 311 and 411 are connected to the socket 1011 on the panel body 101 including the sockets 1011 and 1012 corresponding to the pins. It can arrange | position by inserting in 1012 (refer FIG. 16, 17).

  The pin 311 and the pin 411 are not particularly limited as long as a dye-sensitized solar cell can be disposed on the panel body 101 of the solar cell unit panel. The pins 311 and 411 can be formed of copper, brass, or the like, and the surface may be covered with gold, tin, nickel, or the like. Further, the shape of the cross section of each of the pins 311 and 411 may be any of a circle, an ellipse, a triangle, a polygon such as a quadrangle, and the like. Furthermore, the pins 311 and 411 can be bonded and fixed to the other end surface sides of the conductors 71 and 72 using a brazing material such as a silver-palladium brazing material. The pins 311 and 411 can be bonded and fixed to the other end surfaces of the conductors 71 and 72 by laser light irradiation.

  The panel body 101 includes sockets 1011 and 1012 corresponding to the pins 311 and 411, respectively. By inserting the pins 311 and 411 into the sockets 1011 and 1012, conduction and fixing of the dye-sensitized solar cell to the panel body are performed. The above-mentioned “solar cell unit panel” can be manufactured (see FIGS. 16 and 17). In this solar cell unit panel, each solar cell can be connected in series or in parallel, and a solar cell unit panel having a predetermined voltage and capacity can be obtained. The solar cell unit panel is preferably provided with a protective material 1013 for protecting each of the arranged dye-sensitized solar cells from dust, wind and rain. As this protective material, what consists of resin, such as glass and highly transparent polycarbonate, polysulfone, can be used.

  Each of the pins 311 and 411 is preferably provided so that the dye-sensitized solar cell can be arranged only in a certain direction of the panel main body 101. Thereby, generation | occurrence | production of a short circuit etc. can be prevented. More specifically, for example, the pins 311 and 411 may have different numbers and shapes. Further, by specifying the planar shape of the solar cell, the planar shape of the solar cell package each including a plurality of semiconductor electrodes and catalyst electrodes, and the direction in which these are fitted into the panel body 101, the dye sensitization is performed. The type solar cell can also be arranged only in a certain direction of the panel body 101. Furthermore, the dye-sensitized solar cell can be arranged only in a certain direction of the panel body 101 by a method of displaying the fitting direction at a visible position of the solar cell and the solar cell package.

  In another dye-sensitized solar cell of the present invention, as shown in FIGS. 8 and 10, the substrate 2 has a protruding portion 22 in at least one direction, and a negative electrode conducting to the semiconductor electrode 3 on one surface side of the protruding portion 22. A side electrode terminal 31 is provided, and a positive electrode side electrode terminal 41 that is electrically connected to the catalyst electrode 4 is provided on the other surface side of the protruding portion 22. In this case, the substrate 2 may be any of a glass substrate, a resin substrate, a ceramic substrate, and the like, but it is easy to dispose the negative electrode terminal and the positive electrode terminal, and the dye sensitization has excellent durability. A ceramic substrate that can be a type solar cell is preferred. Examples of the ceramic include those described above, and alumina, silicon nitride, zirconia and the like are preferable, and alumina is particularly preferable.

  In the other dye-sensitized solar cell of the present invention, the negative electrode terminal 31 can be formed separately from the connecting conductor 73 and provided in contact with the connecting conductor 73. Further, the connection conductor 73 can be provided in an extended manner. As described above, when the connecting conductor 73 is extended to form the negative electrode terminal 31, the process is simplified, and the connecting conductor 73 and the negative electrode terminal 31 are integrated. Therefore, the semiconductor electrode 3 and the negative electrode terminal 31 can be more reliably conducted.

The semiconductor electrode 3 and the negative electrode side electrode terminal 31 may be electrically connected in any way. For example, as shown in FIGS. 8 and 10, the semiconductor electrode 3 and the negative electrode side electrode terminal 31 are transparent substrates. 1 is disposed between at least one of the negative electrode side collector electrode 81 and the translucent conductive layer 91 provided on one surface side of the substrate 1 and the one surface side of the substrate 2 so as to surround the semiconductor electrode 3 and the catalyst electrode 4. Conduction can be conducted through the provided conductive bonding layer 6. The catalyst electrode 4 and the positive electrode terminal 41 may be electrically connected in any way. For example, as shown in FIGS. 8 and 10, the catalyst electrode 4 and the positive electrode terminal 41 are connected to the substrate 2. It is possible to conduct through a conductor 72 filled in a through hole 212 formed so as to pass through.

One surface side of the conductive bonding layer 6 is connected to at least one of the negative electrode side collecting electrode 81 and the translucent conductive layer 91, and the other surface side of the conductive bonding layer 6 is connected to the negative electrode side electrode terminal 31. Thus, the semiconductor electrode 3 and the negative electrode terminal 31 are electrically connected. In order to make the electrical connection more reliable, a connecting conductor 73 is provided on one surface side of the substrate 2 so as to surround the catalyst electrode 4, and the one surface side of the conductive bonding layer 6 and the negative current collecting electrode 81. In addition, it is preferable to connect at least one of the light-transmitting conductive layer 91 and the other surface side of the conductive bonding layer 6 and the connecting conductor 73. In particular, as shown in FIGS. 8 and 10, a negative current collecting electrode 81 is provided on one side of the translucent substrate 1 so as to surround the semiconductor electrode 3, and one side of the conductive bonding layer 6 and the negative current collecting electrode are provided. More preferably, the entire surface of 81 is connected, and the other surface side of the conductive bonding layer 6 is connected to the entire surface of the connecting conductor 73.

  The other end surface side of the conductor 72 is connected to the positive electrode side electrode terminal 41, and the one end surface side of the conductor 72 is connected to the catalyst electrode 4, so that the catalyst electrode 4 and the positive electrode side electrode terminal 41 are electrically connected. In addition, when at least one of the positive electrode side collector electrode 82 and the conductive layer 92 is provided on one surface side of the substrate 2, the one end surface side of the conductor 72 is the positive electrode side collector electrode 82 and / or the conductive layer. 92 may be connected. Note that one end surface side of the conductor 72 may be directly connected to the catalyst electrode 4 and may be in contact with the positive-side collector electrode 82 and / or the conductive layer 92.

  The above description can be applied as it is for the material and forming method of the conductive bonding layer 6. Further, the above description can be applied as it is to the shape of the cross section of the through hole 212, the size and forming method in the radial direction, and the material of the conductor 72 and the filling method of the through hole 212. Further, the above description can be applied as it is to the material and forming method of the connecting conductor 73.

  In the case of another dye-sensitized solar cell of the present invention, each of the negative electrode terminal 31 and the positive electrode terminal 41 has the above “edge” that constitutes the “card edge connector” as shown in FIGS. Terminals 312, 412 ". Thus, in the dye-sensitized solar cell in which the negative electrode terminal 31 and the positive electrode terminal 41 are edge terminals, the edge terminals 312 and 412 are provided on the panel body 102 including the sockets 1021 and 1022 corresponding to the edge terminals. It can be arranged by being inserted into the sockets 1021 and 1022. Further, conduction and fixation can be performed simultaneously, and a solar cell unit panel can be manufactured (see FIG. 18). In this solar cell unit panel, each solar cell can be connected in series or in parallel, and a solar cell unit panel having a predetermined voltage and capacity can be obtained. Further, the edge terminal can be made of the same material as that of the negative electrode side collecting electrode 81, the positive electrode side collecting electrode 82, the connecting conductor 73 and the like, and can be formed by the same method. The solar cell unit panel is preferably provided with a protective material 1023 for protecting each of the arranged dye-sensitized solar cells from dust, wind and rain. As this protective material, what consists of resin, such as glass and highly transparent polycarbonate, polysulfone, can be used.

Hereinafter, the present invention will be described specifically by way of examples.
Example 1
The dye-sensitized solar cell 201 and the solar cell unit panel (see FIGS. 16 and 17) shown in FIGS. 1, 2, and 6 were produced as follows.
(1) Production of Laminate with Semiconductor Electrode A light-transmissive conductive layer 91 made of fluorine-doped tin oxide having a thickness of 500 nm is formed on one side of a glass substrate 1 having a length of 100 mm, a width of 100 mm, and a thickness of 1 mm by RF sputtering. Formed. Thereafter, a negative electrode-side current collecting electrode 81 having a width of 1 mm and a thickness of 1 μm is formed by RF sputtering on the surface of the glass substrate 1 on which the translucent conductive layer 91 is formed using RF sputtering. 3 was formed so as to surround 3. Next, a paste containing titania particles having a particle size of 10 to 20 nm (product name “Ti-Nonoxide D / SP”, manufactured by Solaronix) was applied by screen printing, dried at 120 ° C. for 1 hour, and then 480 Firing at 30 ° C. for 30 minutes formed a titania electrode layer (electrode substrate) having a length of 95 mm, a width of 95 mm, and a thickness of 20 μm. Thereafter, this laminate was immersed in an ethanol solution of a ruthenium complex (manufactured by Solaronix, trade name “535bis-TBA”) for 10 hours to attach a ruthenium complex, which is a sensitizing dye, to the titania sintered particles. 3 was formed.

(2) Production of laminate comprising catalyst electrode 100 parts by mass of alumina powder having a purity of 99.9% by mass, 5 parts by mass of magnesia, calcia and silica mixed powder, 2 parts by mass of binder and solvent as a sintering aid A slurry was prepared by blending and using this slurry, an alumina green sheet was prepared by the doctor blade method. Thereafter, two through holes 211 and 212 were formed at predetermined positions of the alumina green sheet by punching holes. Next, using a metallized ink containing a tungsten component (content of tungsten component: 96 mass%), a conductive coating film that becomes the connection conductor 73 by screen printing is formed on one side of the alumina green sheet in a later step. It was formed in a shape surrounding the produced catalyst electrode 4. At the same time, the metalized ink containing the above tungsten component was filled into the through hole 211. Then, it dried at 100 degreeC for 30 minutes, the surface of the electrically conductive coating film was pressed with the pressure of 0.2 MPa, and the smoothness was improved.

  Next, a conductive coating film to be the catalyst electrode 4 was formed on one side of the alumina green sheet by a screen printing method using a metallized ink containing a platinum component. At the same time, the through hole 212 was filled with a metallized ink containing a platinum component. Next, it is integrally fired at 1500 ° C. in a reducing atmosphere, and a connecting conductor 73 having a width of 1 mm and a thickness of 5 μm on one surface side of an alumina substrate 2 having a length of 100 mm, a width of 100 mm and a thickness of 1 mm, and a length of 90 mm and a width of 90 mm. A laminated body in which the catalyst electrode 4 having a thickness of 500 nm was formed was produced. Further, the conductor 71 was formed in the through hole 211, and the conductor 72 was formed in the through hole 212.

(3) Joining of pins 311 and 411 After that, one end surface of the two conductors 71 on the other surface side of the alumina substrate 2 having a circular cross section (side joined to the other end surface side of the conductor 71) A pin 311 having a diameter of 4 mm, a diameter of the other end surface (tip side) of 3.5 mm, and a length of 10 mm was joined using a silver-palladium raw material. Further, on the other end surface side of the two conductors 72 on the other surface side of the alumina substrate 2, the long side of one end surface (side joined to the other end surface side of the conductor 72) is 6 mm and the short side is rectangular in cross section. A pin 411 having a length of 3 mm, a long side of the other end surface (tip side) of 5 mm, a short side of 2.5 mm, and a length of 10 mm was joined using a silver-palladium raw material.

(4) Formation of electrolyte layer Using a conductive adhesive in which 99% by mass of tungsten powder is blended in thermosetting resin, the negative electrode side collecting electrode 81 formed on one side of the glass substrate 1 is covered. Then, a coating film having a width of 1 mm and a thickness of 60 μm is formed by screen printing, and then the glass substrate 1 is opposed to the connecting conductor 73 provided with the negative electrode side collecting electrode 81 on one surface side of the alumina substrate 2. In addition, the semiconductor electrode 3 is disposed so as to face the catalyst electrode 4, and then left for 1 hour in a dryer adjusted to 100 ° C. with the alumina substrate 2 side down, so that the translucent conductive The layer 91 and the negative electrode side collecting electrode 81 were joined to the alumina substrate 2 and the connecting conductor 73. The conductive bonding layer 6 had a width of 2 mm and a thickness of 30 μm. Thereafter, an iodine electrolyte solution (product name “Iodolyte PN-50”, manufactured by Solaronix Co., Ltd.) is injected from an electrolyte solution injection port provided at a predetermined position of the alumina substrate 2, and the electrolyte 5 is contained in the semiconductor electrode 3. The electrolyte 5 was filled between the semiconductor electrode 3 and the collector electrode 4. After injection of the iodine electrolyte, the inlet was sealed using the above adhesive. In this way, a dye-sensitized solar cell 201 was produced.

(5) Manufacture of solar cell unit panel Each of panel-sensitized solar cells manufactured in the above (1) to (4) is arranged in a panel main body 101 in which a total of 20 pieces can be arranged, 4 vertically and 5 horizontally. The pins 311 and 411 of the dye-sensitized solar cell are inserted into the respective sockets 1011 and 1012 of the panel main body 101 corresponding to the pins 311 and 411, are made conductive and fixed, and arranged to arrange the solar cell unit panel. Produced. In addition, each of the four pieces in the vertical direction was connected in parallel, and in the horizontal direction, each of the four pieces in the vertical direction connected in parallel was connected in series.

Example 2
The dye-sensitized solar cell 205 and the solar cell unit panel (see FIG. 18) shown in FIGS. 8 and 9 were produced as follows.
(1) Production of Laminate with Semiconductor Electrode As in Example 1, on one surface side of glass substrate 1, translucent conductive layer 91 having the same shape and thickness as Example 1, negative electrode side collector electrode 81 and the semiconductor electrode 3 were formed, and the laminated body provided with the semiconductor electrode 3 was produced.

(2) Production of Laminate with Catalyst Electrode An alumina green sheet was produced in the same manner as (2) of Example 1. This alumina green sheet had a large dimension in the transverse direction with respect to the longitudinal direction so that the protruding portion 22 was formed on the substrate 2 after firing. Thereafter, four through-holes 212 were formed by punching holes at predetermined locations on the alumina green sheet. Next, in the same manner as in Example 1 (2), a conductive coating film to be the connection conductor 73 was formed on one surface side of the alumina green sheet so as to surround the catalyst electrode 4 produced in a later step. . Then, the conductive coating film used as the catalyst electrode 4 was formed in the one surface side of the alumina green sheet like (2) of Example 1. FIG. At the same time, the through hole 212 was filled with a metallized ink containing a platinum component.

  Next, after firing the alumina green sheet, the negative electrode terminal 31 and the one end edge of the alumina substrate 2 are in contact with one surface of the portion that becomes the protruding portion 22 of the alumina substrate 2 so that the conductive coating film 73 and one end edge are in contact with each other. The conductive coating film was formed in the same manner as the conductive coating film to be the connecting conductor 73. Further, a conductive coating film to be the positive electrode terminal 41 is provided on the other surface side of the portion to be the protruding portion 22 so as to come into contact with one end surface side of the metallized ink filled in the through hole 212. It formed like the case of the conductive coating film used. Thereafter, it is integrally fired at 1500 ° C. in a reducing atmosphere, and a connecting conductor having a width of 1 mm and a thickness of 5 μm is formed on one side of the alumina substrate 2 having a length of 100 mm, a width of 114 mm (a width of the protruding portion of 14 mm), and a thickness of 1 mm. 73 and a catalyst electrode 4 having a length of 90 mm, a width of 90 mm, and a thickness of 500 nm are formed, and an edge terminal 312 (negative electrode terminal 31) having a thickness of 5 μm is formed on one surface side of the protruding portion 22, and the other surface side is thick. A laminated body in which an edge terminal 412 (positive electrode terminal 41) having a thickness of 5 μm was formed was produced. A conductor 72 was formed in the through hole 212.

(3) Formation of electrolyte layer 1 mm in width so as to cover the negative electrode side collector electrode 81 formed on the one surface side of the glass substrate 1 in the same manner using the same conductive adhesive as in (1) of Example 1. Then, a coating film having a thickness of 60 μm is formed, and then the glass substrate 1 is arranged so that the negative electrode side collecting electrode 81 faces the connecting conductor 73 provided on one surface side of the alumina substrate 2 and the semiconductor electrode 3 Is disposed so as to face the catalyst electrode 4, and then, in the same manner as in (3) of Example 1, the translucent conductive layer 91 and the negative electrode side collecting electrode 81, the alumina substrate 2, the connecting conductor 73, and After joining the negative electrode terminal 31, an iodine electrolyte solution (product name “Iodolyte PN-50” manufactured by Solaronix Co., Ltd.) is injected from an electrolyte solution injection port provided at a predetermined position of the alumina substrate 2. Contain electrolyte 5 in semiconductor electrode 3 In addition, the electrolyte 5 was filled between the semiconductor electrode 3 and the collecting electrode 4. After injection of the iodine electrolyte, the inlet was sealed using the above adhesive. In this way, a dye-sensitized solar cell 205 was produced.

(4) Production of Solar Cell Unit Panel Each of the panel main bodies 102 in which the dye-sensitized solar cells produced in the above (1) to (3) can be arranged in a total of 20 pieces, 4 vertically and 5 horizontally, respectively. The edge terminals 312 and 412 of the dye-sensitized solar cell are inserted into the respective sockets 1021 and 1022 of the panel main body 102 corresponding to the edge terminals 312 and 412 to be electrically connected and fixed and arranged, and the solar cell unit. A panel was produced. In addition, each of the four pieces in the vertical direction was connected in parallel, and in the horizontal direction, each of the four pieces in the vertical direction connected in parallel was connected in series.

  It should be noted that the present invention is not limited to the description of the above-described embodiments, and can be variously modified embodiments within the scope of the present invention. For example, as shown in FIG. 13, a dye-sensitized solar cell in which a plurality of semiconductor electrodes 3 and a plurality of catalyst electrodes 4 opposed to the semiconductor electrodes 3 are disposed between a pair of substrates, If this solar cell is used, a solar cell unit panel having a high voltage or a large capacity can be easily produced. 14 and 15, both the negative electrode terminal 31 and the positive electrode terminal 41 can be provided on the other surface side of the protruding portion 22 of the substrate 2. In this case, the negative electrode terminal 31 is provided through the conductor 71 and the conductive bonding layer 6 filled in the through hole 211 provided in the substrate 2 or when the connecting conductor 73 is provided. The semiconductor electrode 3 can be conducted through the conductor 71, the connecting conductor 73 and the conductive bonding layer 6. The positive electrode terminal 41 can be electrically connected to the catalyst electrode 4 via a conductor 72 filled in a through hole 212 formed through the substrate 2.

  Furthermore, a locking portion protruding in a direction substantially perpendicular to the insertion direction is formed on the tip side of the pins 311 and 411 provided on the other surface side of the substrate 2 and the like, and the pins 311 and 411 are inserted into the sockets 1011 and 1012 respectively. Thereafter, by sliding or rotating the solar cell, the solar cell can be securely fixed to the panel main body 101 and the solar cell can be prevented from falling off from the panel main body 101. As the electrolyte 5, an ionic liquid such as a non-volatile imidazolium salt, a gel obtained by gelling this ionic liquid, and a solid such as copper iodide or copper thiocyanide can also be used.

3 is a schematic diagram showing a cross section of a dye-sensitized solar cell 201 of Example 1. FIG. It is explanatory drawing which looked at the dye-sensitized solar cell 201 of Example 1 from the glass substrate 1 side. In the dye-sensitized solar cell 201 of FIG. 2, it is a schematic diagram which shows the cross section of the dye-sensitized solar cell 202 in which the negative electrode side current collection electrode 81 was formed in the grid | lattice form. It is a schematic diagram which shows the cross section of the dye-sensitized solar cell 203 which is not provided with the translucent conductive layer 91, and is provided with a specific structure. It is explanatory drawing which looked at the dye-sensitized solar cell 202 of FIG. 3 from the glass substrate 1 side. FIG. 3 is an explanatory view of the dye-sensitized solar cell 201 of FIGS. 1 and 2 and the dye-sensitized solar cells 202 and 203 of FIGS. 3, 4, and 5 as viewed from the ceramic substrate 2 side. FIG. 2 is a schematic diagram showing a cross section of a dye-sensitized solar cell 204 in which a positive electrode side collector electrode 82 and a conductive layer 92 are further provided in the dye-sensitized solar cell 201 of FIG. 1. 6 is a schematic diagram showing a cross section of a dye-sensitized solar cell 205 of Example 2. FIG. It is explanatory drawing which looked at the dye-sensitized solar cell 205 of Example 2 from the glass substrate 1 side. FIG. 9 is a schematic diagram showing a cross section of a dye-sensitized solar cell 206 in which negative electrode-side current collecting electrodes 81 are formed in a lattice pattern in the dye-sensitized solar cell 205 of FIG. 8. It is explanatory drawing which looked at the dye-sensitized solar cell 206 of FIG. 10 from the glass substrate 1 side. FIG. 10 is an explanatory view of the dye-sensitized solar cell 205 in FIGS. 8 and 9 and the dye-sensitized solar cell 206 in FIGS. 10 and 11 when viewed from the ceramic substrate 2 side. It is explanatory drawing which shows typically the dye-sensitized solar cell 207 in which the several cell was formed between a pair of board | substrates. 4 is a schematic diagram showing a cross section of a dye-sensitized solar cell 208 in which edge terminals 312 and 412 are both provided on the other surface side of the protruding portion 22 of the ceramic substrate 2. FIG. It is a schematic diagram which shows the cross section in the AA cross section of the dye-sensitized solar cell 208 of FIG. It is a front view which shows a mode that the three dye-sensitized solar cells 201 are arrange | positioned at the panel main body 101 provided with the socket 1011 and 1012. FIG. It is a schematic diagram which shows the cross section in the BB cross section of FIG. 16, and also shows a mode that the dye-sensitized solar cell 201 is arrange | positioned. It is a schematic diagram which shows the mode that the cross section of the solar cell unit panel which has arrange | positioned the dye-sensitized solar cell 205 to the panel main body 102 provided with the socket 1021,1022 and also arrange | positions the dye-sensitized solar cell 205 is shown.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1; Translucent board | substrate, 2; Board | substrate, 211, 212; Through-hole, 22; Protruding part, 3; Semiconductor electrode, 31, Negative electrode terminal, 311, Pin, 312; Edge terminal, 4: Catalyst electrode, 41 Positive electrode terminal, 411; pin, 412; edge terminal, 5; electrolyte, 6; conductive bonding layer, 71; 72; conductor, 73; conductor for connection, 81; Positive electrode side collecting electrode, 91; translucent conductive layer, 92; conductive layer, 101, 102; panel main body, 1011, 1012, 1021, 1022; socket, 1013, 1023; protective material, 201, 202, 203, 204 205, 206, 207, 208; dye-sensitized solar cells.

Claims (16)

  Translucent substrate 1, substrate 2 disposed opposite to translucent substrate 1, semiconductor electrode 3 having a sensitizing dye disposed on one surface side of translucent substrate 1, and the substrate 2, a catalyst electrode 4 disposed on one surface side, and an electrolyte 5 contained in at least a part of the semiconductor electrode 3 and filled between the semiconductor electrode 3 and the catalyst electrode 4, A dye-sensitized solar cell comprising a negative electrode terminal 31 that is electrically connected to the semiconductor electrode 3 and a positive electrode terminal 41 that is electrically connected to the catalyst electrode 4 provided on the other surface of the substrate 2. .   The dye-sensitized solar cell according to claim 1, wherein the substrate 2 is a ceramic substrate. The semiconductor electrode 3 and the negative electrode terminal 31 include at least one of a negative current collecting electrode 81 and a transparent conductive layer 91 provided on the one surface side of the translucent substrate 1, and the substrate. 2 is filled in a through hole 211 formed so as to penetrate the substrate 2 and the conductive bonding layer 6 disposed so as to surround the semiconductor electrode 3 and the catalyst electrode 4. The catalyst electrode 4 and the positive electrode terminal 41 are conducted through a conductor 72 filled in a through hole 212 formed through the substrate 2. The dye-sensitized solar cell according to claim 1 or 2 . The other end surface side of the conductor 71 is connected to the negative electrode terminal 31, and one end surface side of the conductor 71 is disposed on the one surface side of the substrate 2 so as to surround the catalyst electrode 4. The other end surface of the conductor 72 is connected to the positive electrode terminal 41 and the one end surface of the conductor 72 is connected directly to the catalyst electrode 4 or other member. The dye-sensitized solar cell according to claim 3 , which is connected via One side of the conductive bonding layer 6 is connected to the negative electrode side current collector electrode 81, and the other surface side of the conductive bonding layer 6 is, in claim 4, which is connected to the connection conductor 73 The dye-sensitized solar cell described. Each of the above negative electrode side electrode terminal 31 and the positive side electrode terminal 41, dye-sensitized solar cell according to any one of claims 1 to 5, which is a pin 311, 411 that constitute the pin connector, respectively .   Translucent substrate 1, substrate 2 disposed opposite to translucent substrate 1, semiconductor electrode 3 having a sensitizing dye disposed on one surface side of translucent substrate 1, and the substrate 2, a catalyst electrode 4 disposed on one surface side, and an electrolyte 5 contained in at least a part of the semiconductor electrode 3 and filled between the semiconductor electrode 3 and the catalyst electrode 4, The substrate 2 has a protruding portion 22 in at least one direction, a negative electrode terminal 31 that is electrically connected to the semiconductor electrode 3 is provided on one surface side of the protruding portion 22, and on the other surface side of the protruding portion 22. A dye-sensitized solar cell, comprising a positive electrode terminal 41 that is electrically connected to the catalyst electrode 4. The dye-sensitized solar cell according to claim 7 , wherein the substrate 2 is a ceramic substrate. The semiconductor electrode 3 and the negative electrode terminal 31 include at least one of a negative current collecting electrode 81 and a transparent conductive layer 91 provided on the one surface side of the translucent substrate 1, and the substrate. 2 through the conductive bonding layer 6 disposed so as to surround the semiconductor electrode 3 and the catalyst electrode 4, and the catalyst electrode 4 and the positive electrode terminal 41 9 is a dye-sensitized solar cell according to claim 7 or 8 , which is electrically connected through a conductor 72 filled in a through hole 212 formed through the substrate 2. A connecting conductor 73 is disposed on the one surface side of the substrate 2 so as to surround the catalyst electrode 4, and the negative electrode terminal 31 is connected to the connecting conductor 73 or the connecting conductor. The conductor 73 is formed to extend, the other end surface side of the conductor 72 is connected to the positive electrode side electrode terminal 41, and the one end surface side of the conductor 72 is directly attached to the catalyst electrode 4 or another member. The dye-sensitized solar cell according to claim 9 , which is connected via One side of the conductive bonding layer 6, dye-sensitized solar cell according to claim 9 or 10 is connected with the negative electrode side current collector electrode 81. The dye-sensitized dye according to any one of claims 7 to 11 , wherein each of the negative electrode side electrode terminal 31 and the positive electrode side electrode terminal 41 is an edge terminal 312 or 412 constituting a card edge connector. Solar cell. A solar cell unit panel comprising the dye-sensitized solar cell according to claim 6 and a panel main body 101 for arranging a plurality of the dye-sensitized solar cells, wherein the panel main body 101 includes Sockets 1011 and 1012 corresponding to the respective pins 311 and 411 provided on the dye-sensitized solar cell are provided, and the pins 311 and 411 are inserted into the sockets 1011 and 1012, and the dye-sensitized solar cell is provided. Is disposed in the panel main body 101. Each of the said pins 311 and 411 is a solar cell unit panel of Claim 13 provided so that the said dye-sensitized solar cell can be arrange | positioned only to the fixed direction of the said panel main body 101. The solar cell unit panel according to claim 13 or 14 , wherein at least one of the number and shape of each of the pins 311 and 411 is different. A solar cell unit panel comprising the dye-sensitized solar cell according to claim 12 and a panel main body 102 for arranging a plurality of the dye-sensitized solar cells, wherein the panel main body 102 includes Sockets 1021 and 1022 corresponding to the respective edge terminals 312 and 412 provided in the dye-sensitized solar cell are provided, and the edge terminals 312 and 412 are inserted into the sockets 1021 and 1022, and the dye-sensitized type is provided. A solar cell unit panel, wherein a solar cell is disposed in the panel body 102.

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