JP4614163B2 - Manufacturing method of pipe plated with copper on inner wall - Google Patents

Description

  The present invention is a water distribution pipe used for a water supply pipe, a drain pipe, etc., and a vinyl chloride pipe (hereinafter referred to as PVC pipe) whose inner wall surface is plated with copper, other resin pipes, metal pipes, and the like, and a manufacturing method thereof. It is invention regarding.

  Conventionally, metal pipes such as iron are often used as water distribution pipes. However, there are problems such as high cost, poor workability, deterioration due to rust, and deterioration of water quality due to red rust.

  Therefore, at present, PVC pipes are mainly used for water supply pipes such as houses and factories, and water pipes such as drain pipes. PVC pipes are widely used because they are inexpensive, have good workability such as cutting and adhesion, and do not deteriorate water quality due to the occurrence of rust.

  However, when the PVC pipe is used as a water supply pipe or a drain pipe, a null may be generated on the inner surface with use. Null is a slimy membrane-like substance that covers the inner surface of the water distribution pipe, and microorganisms, algae, molds, etc. grow as nutrients, such as slight minerals of water flowing through the water distribution pipe, impurities such as insoluble solid components, It is a flora adhering to the inner surface of the water pipe, that is, a collection of various microbial groups.

  In particular, in circulating water for factories that are not chlorinated and for circulating water in baths that can be used for 24 hours, microorganisms are generated by nutrients such as dirt and soap, and nulls are often generated in the distribution pipes. There is. Pathogenic microorganisms such as Legionella may grow in this null, and such health damage due to water is occasionally reported.

  On the other hand, it is known that generation of nulls is suppressed when the water distribution pipe is a copper pipe. This is due to the bactericidal effect of copper ions. Here, copper ions will be described. In general, copper ions are known to have a strong bactericidal effect, and have bactericidal effects against various pathogenic bacteria such as Legionella, Salmonella, and Staphylococcus. In particular, copper ions are known to have a high algicidal effect. Copper ions work by adsorbing to algae and killing algae and suppressing the generation and growth of algae. Legionella proliferates by symbiosis with algae and amoebae. Therefore, if water sterilization is performed using copper ions having a high algicidal effect, the growth of Legionella in water can be suppressed. Furthermore, copper ions are also known to have excellent antifungal properties.

  Copper ion water has no irritating odor, rough skin, or off-flavor due to chlorinated chemicals, and is harmless to the human body. For reference, the copper ion concentration is 1.0 ppm or less in the water quality standards of waterworks. Therefore, even if the PVC pipe copper-plated on the inner wall surface according to the present invention is used for a drinking water distribution pipe, the elution amount of copper ions from the copper-plated layer is less than the above-mentioned standard, and is harmless to the human body. You can say that. Therefore, copper ions are suitable for sterilization treatment of bathtubs, pools, water storage tanks and the like. In addition, depending on the copper ion water, there is no corrosion of water distribution pipes, equipment and equipment, other building materials, sashes and the like.

  As described above, if the water distribution pipe is a copper pipe, generation of nulls can be suppressed. Also, metals such as silver and gold have the effect of sterilizing microorganisms like copper. However, as described above, metal piping has various problems. Above all, it is expensive and impractical to use copper pipes for all residential and factory water distribution pipes.

Accordingly, various sterilization apparatuses have been developed using metals having a sterilizing effect such as copper. The sterilization apparatus described in Patent Document 1 is an apparatus for sterilization by elution of copper ions into hot water using copper that is cheaper than silver and has sterilization ability. Specifically, precious metal trace metals such as gold, silver, and copper retain excellent bactericidal and algicidal effects, and even in inexpensive copper ions, microorganisms or The algae can be surely sterilized and killed, and the copper ions can be stably and quantitatively eluted in the circulating water for a long period of time, so that the sterilization of the water can be performed.
Japanese Examined Patent Publication No. 03-1077

Furthermore, the sterilization apparatus described in Patent Document 2 is a water sterilization apparatus that uses a copper ion eluting body as a metal ion eluting body, such as a bathtub, a pool, a hot spring facility, a water storage tank, or the like that requires water sterilization treatment. By mounting, water can be effectively sterilized using the sterilizing effect of copper ions.
JP 2004-321878 A

  Certainly, the sterilization apparatus described in the above-mentioned document and other various sterilization apparatuses have an action of sterilizing microorganisms, but a new sterilization apparatus must be purchased. In addition, it is not economical because it takes time and expense to replace consumables. Furthermore, when treating a large amount of water such as factory water, it is very expensive and impractical.

  Accordingly, an object of the present invention is to provide an inexpensive water distribution pipe that does not generate a null like a copper pipe, has good workability like a PVC pipe, and is inexpensive.

A method of manufacturing a pipe plated with copper on an inner wall surface comprising a resin pipe, a metal base plating layer laminated on an inner wall surface of the resin pipe, and a copper plating layer formed on the base plating layer, The electroless plating solution stored in the plating tank is circulated between the plating tank and the resin pipe in which a plurality of the resin pipes are connected with a U-shaped elbow connecting pipe by using a pump. It was set as the structure of the manufacturing method of the pipe which plated the copper on the inner wall surface characterized by having laminated | stacked on the inner wall surface of the said resin pipe simultaneously by the plating method .
The copper plating layer is formed by laminating the base plating layer, the anode is passed through the resin pipe, and a plating solution for electrolytic copper plating stored in the plating tank is pumped to the plating tank and the resin pipe. And the above- described under plating layer was formed on the under-plating layer by electrolytic copper plating using the under-plating layer as a cathode .
And the manufacturing method of the pipe plated with copper on the inner wall surface consisting of the resin pipe, the metal base plating layer laminated on the inner wall surface of the resin pipe, and the copper plating layer formed on the base plating layer, After laminating the base plating layer, the copper plating layer is penetrated through a wire-shaped anode inside the resin pipe, both ends of the wire are pulled outside the resin pipe, and contact with the inner wall surface of the resin pipe is performed. A method of manufacturing a pipe plated with copper on an inner wall surface, characterized by being formed on the base plating layer by electrolytic copper plating using the base plating layer as a cathode, and immersed in a plating solution for electrolytic copper plating The configuration .

  The PVC pipe copper-plated on the inner wall surface according to the present invention has the same sterilizing effect as the copper pipe because the inner wall surface is copper-plated, that is, the effect of preventing the occurrence of nulls, and the workability that is an advantage of the PVC pipe. It can be used as a distribution pipe such as a water supply pipe and a drain pipe while maintaining goodness and low cost. That is, it is possible to easily replace a PVC pipe with a copper plating on the inner wall surface according to the present invention, such as a house, a distribution pipe for buildings, a distribution pipe for factories, etc., which uses PVC pipes, thereby preventing nulls in the distribution pipe. I was able to do it. Moreover, it is difficult to sterilize as in the past, copper plating inside the insufficient distribution pipe prevents the occurrence of nulls on the inner surface of the distribution pipe, which was a hotbed of pathogenic bacteria, and can supply safer water It became so. Furthermore, by applying it to many other water distribution pipes such as agricultural and livestock water supply pipes, it has become possible to avoid the risk of exposure to water containing pathogenic bacteria.

  The PVC pipe 1 plated with copper on the inner wall surface is subjected to chemical copper plating on the inner wall surface to form a thin copper film (underlying plating layer 3c) on the inner wall surface of the pipe, followed by electrolytic copper plating. This was realized by forming the layer 3b.

  Below, based on an accompanying drawing, the pipe which carried out copper plating to the inner wall surface which is the present invention, and the plating method are explained in detail using a PVC pipe as an example.

  FIG. 1 is a perspective view of a PVC pipe copper plated on the inner wall surface according to the present invention. The PVC pipe 1 plated with copper on the inner wall surface according to the present invention has a plating layer 3 on the inner wall surface of the PVC pipe 2, and the surface in contact with the water flowing through the water passage 4 of the plating layer 3, that is, the inner surface 3 a is made of copper. It is characterized by being plated by. Although the inner surface 3a may be plated with a metal such as gold or silver having a bactericidal effect in the same manner as copper, copper is preferable as the plating metal for the inner surface 3a in view of the cost of the water distribution pipe. If emphasis is placed on the sterilizing effect, the inner surface 3a is preferably plated with silver. Broken line arrows A and B represent cross-sectional positions in FIGS. 2 and 3, respectively.

  FIG. 2 is a cross-sectional view of the PVC pipe copper-plated on the inner wall surface according to the present invention at the position of the broken arrow A in FIG. The PVC pipe 1 plated with copper on the inner wall surface according to the present invention has a plating layer 3 on the inner wall surface of the PVC pipe 2, and the surface in contact with the water flowing through the water passage 4 of the plating layer 3, that is, the inner surface 3 a is made of copper. It is characterized by being plated by. For this reason, the copper of the copper plating layer 3b comes into contact with the water flowing through the water passage 4 and is eluted into the water as copper ions. The eluted copper ions can sterilize water and prevent the occurrence of nulls in the PVC pipe 2.

  FIG. 3 is a cross-sectional view of the PVC pipe copper-plated on the inner wall surface according to the present invention at the position of the broken arrow B in FIG. The PVC pipe 1 plated with copper on the inner wall surface according to the present invention has a plating layer 3 on the inner wall surface of the PVC pipe 2, and the surface in contact with the water flowing through the water passage 4 of the plating layer 3, that is, the inner surface 3 a is made of copper. It is characterized by being plated by. Note that it is not particularly necessary to form a metal plating layer such as copper on the outer side 2a of the PVC pipe 2. However, even when a plating layer similar to the inner wall surface is formed on the outer side 2a of the PVC pipe 2 in performing metal plating on the inner wall surface, the effect and action of the present invention are not affected. A circle C surrounded by a broken line represents the enlarged position in FIG.

  4 is an enlarged cross-sectional view of a portion of the plating layer 3 surrounded by a broken line C in FIG. In the PVC pipe 1 in which the inner wall surface according to the present invention is plated with copper, the inner surface 3a of the plating layer 3 is required to be the copper plating layer 3b, and a base is provided between the PVC pipe 2 and the copper plating layer 3b. The plating layer 3c may be laminated.

  When the copper plating layer 3b is laminated on the inner surface 3a by the electroplating method, the base plating layer 3c is an inner wall surface of the PVC pipe 2 by a known plating method such as electroless plating or vacuum deposition. It is a plating layer that is laminated to become a current-carrying layer. Since the PVC pipe 2 is an insulator, it cannot be subjected to electroplating without any pretreatment. Therefore, when copper is electroplated on the inner wall surface of the PVC pipe 2, a base plating layer 3c is formed. is required.

  Moreover, the base plating layer 3c can select various well-known metal plating layers with the functionality by the use of the water pipe which is this invention. Specifically, a plating layer such as vanadium or tin is conceivable as the base plating layer 3c in order to increase the adsorptivity with the copper plating layer 3b and the PVC pipe 2. These base plating layers 3c do not need to be a single layer, and a plurality of various metal platings may be stacked depending on applications and functions.

  Of course, it is also possible to thicken the copper plating layer 3b by a copper electroless plating method. Therefore, in the present invention, it is not always necessary to form the base plating layer 3c on the plating layer 3.

  However, the PVC pipe 1 plated with copper on the inner wall surface according to the present invention is obtained by laminating the base plating layer 3c, which is a current-carrying layer, on the inner wall surface of the PVC pipe 2, and then applying the copper plating layer 3b to the predetermined layer by the electroless plating method. It is desirable to be made by laminating to a thickness. Generally, a copper plating film formed by a copper electroless plating method has a slow film forming speed per unit time, and takes a long time to form the copper plating layer 3b having a predetermined thickness. As a result, the productivity of the PVC pipe 1 plated with copper on the inner wall surface of the present invention becomes poor, which is not preferable.

  Furthermore, various metal plating layers can be formed on the outer side 2a of the PVC pipe 2 in accordance with the use place and application of the PVC pipe 1 plated with copper on the inner wall surface according to the present invention and in order to harmonize the appearance.

  FIG. 5 shows an example of the manufacturing process of the PVC pipe 1 in which the inner wall surface according to the present invention is copper-plated. The PVC pipe 1 copper-plated on the inner wall surface according to the present invention of Example 1 is largely composed of a chemical copper plating step 5 and an electrolytic copper plating step 6. Since the PVC pipe 2 is an insulator, electrolytic copper plating cannot be directly applied to the PVC pipe 2. Therefore, after adopting the chemical copper plating process 5 and laminating the copper plating layer 3b as the base plating layer 3c and imparting electrical conductivity to the inner wall surface of the PVC pipe 2, a predetermined copper plating is performed in the electrolytic copper plating process 6. The layer 3b was efficiently laminated on the inner surface 3a of the PVC pipe 2.

  Hereinafter, each process of the chemical copper plating process 5 will be described. In addition, it is a place by a normal chemical copper plating method to perform water washing and hot water washing as needed at the end of each process.

  The etching process 7 is a process of roughening the inner wall surface of the PVC pipe 2. Thereby, the copper plating layer which is the base plating layer 3c can be laminated on the PVC pipe 2 with good adhesion. Specifically, a method of physically polishing the inner wall surface with a brush or the like is used. Moreover, the chemical etching method by chromic acid can also be employ | adopted, and it roughens by oxidizing and dissolving the PVC pipe 2 inner wall surface with the mixed acid of chromic anhydride and a sulfuric acid. In addition, the inner wall surface may be roughened with a known chemical agent made of acid or alkali.

  The degreasing step 8 is a step of removing PVC pipe 2 scraps, oils and fats, etc., polished by the etching step 7. Thereby, the adsorption efficiency of the catalyst in the next step can be increased. Specifically, it is performed by immersing the PVC pipe 2 in an alkaline solution kept at a temperature of 50 ° C. to 60 ° C. for about 5 minutes. Moreover, it can also carry out by sending the said alkali solution into the PVC pipe 2 inside with a pump. Next, a cleaning process and a conditioner process for neutralizing the alkaline solution are performed. Then wash away the cleaner and conditioner with hot water and water (washing).

  The catalyst application step 9 is a step of adsorbing the palladium necessary for the chemical copper plating catalyst onto the PVC pipe 2. Specifically, the PVC pipe 2 is immersed in a colloidal solution of palladium chloride and tin chloride containing palladium, and the colloid is adsorbed on the inner wall surface of the PVC pipe 2. Since this colloid is negatively charged, it is combined with the inner wall surface of the PVC pipe 2 that is positively charged. Moreover, it can also carry out by sending the said colloidal solution into the PVC pipe 2 with a pump. Thereafter, the excess colloidal solution is washed away with water (washing).

  The catalyst activation step 10 is a step of removing tin from the palladium-tin colloid adsorbed on the PVC pipe 2 and depositing metallic palladium on the inner wall surface of the PVC pipe 2. Specifically, the PVC pipe 2 is immersed in a solution of dilute hydrochloric acid or dilute sulfuric acid, or the acid solution is sent and circulated by a pump or the like, and tin is eluted from the colloid into the acid solution. Thereafter, the inside of the PVC pipe 2 is washed with water (washing).

  The electroless copper plating step 11 uses a metal palladium as a catalyst to reduce copper ions melted in the plating solution to a metal with a known reducing agent such as sodium hypophosphite, formaldehyde, glyoxyacid, and the like. It is deposited on the inner wall surface. As a result, a very thin copper plating layer of about 0.2 micrometers is formed as the base plating layer 3c.

  Specific electroless copper plating plating solutions and reaction conditions are as follows. 1) Plating solution: CuSO4 · 5H2O (1.0%), 37% formalin solution (1.5%), EDTA · 4Na / 4H2O (3.0%), a solution containing NaOH (1.0%) . 2) Reaction conditions: The temperature of the plating solution was 25 ° C., and the PVC pipe 2 was immersed for 15 minutes. Thereafter, the PVC pipe 2 is washed with water (washing). Moreover, you may carry out by the method of circulating a plating solution like the electroless copper plating process 11 of FIG. 6 mentioned later.

  Hereinafter, each process of the electrolytic copper plating process 6 will be described. As with the chemical copper plating step 5, the washing with water and the washing with hot water as necessary at the end of each step are performed by a normal electrolytic copper plating method.

  The jig mounting step 12 is a step of hanging (fixing) the PVC pipe 2 in which the copper base plating layer 3c is formed on the inner wall surface through the above-described chemical copper plating step 5 with a jig in the electrolytic copper plating solution. is there. Here, the jig needs to be in contact with the underlying plating layer 3c so that electricity flows through the underlying plating layer 3c. As a result, by applying a direct current, the base plating layer 3c becomes a cathode, and copper ions dissolved in the plating solution are deposited on the base plating layer 3c, thereby forming the copper plating layer 3b on the inner surface 3a. . Specifically, the jig may be a conductive material that does not elute into the plating solution.

  The activation treatment step 13 is a step of performing an acid treatment on the base plating layer 3c in order to remove dirt (dust, fats and oils) on the inner wall surface of the PVC pipe 2 and to remove the copper oxide film. As a result, the copper plating layer 3b is efficiently deposited on the base plating layer 3c. Specifically, it is performed by immersing the internal content of the PVC pipe 2 in a sulfuric acid solution of 5 to 10% by weight, or circulating the acid solution with a pump or the like. Thereafter, the remaining acid is washed away with water (washing).

  The copper sulfate electroplating step 14 is a step of further depositing (stacking) the copper plating layer 3b to a predetermined thickness on the copper base plating layer 3c formed in the electroless copper plating step 11 described above.

  The specific electrolytic copper plating solution and reaction conditions are as follows. 1) Plating solution: A solution containing H2SO4 (10 to 20%) and CuSO4 · 5H2O (5 to 10%) was used. 2) Reaction conditions: The plating solution temperature was 23 to 30 ° C., and a direct current (2 to 8 A / dm 2) was applied with the PVC pipe 2 immersed for about 15 minutes. Moreover, you may carry out by the method of circulating a plating solution like the electroless copper plating process 11 of FIG. 6 mentioned later.

  In addition, in the PVC pipe 1 in which the inner wall surface according to the present invention is copper-plated, the inner surface 3a only needs to be the copper plating layer 3b. Therefore, another metal is interposed between the copper plating layer 3b on the inner surface 3a and the PVC pipe 2. A plating layer may be formed. In particular, since the copper base plating layer 3c formed by the electroless copper plating process 11 is very thin, a metal plating layer such as nickel or tin is electroplated as a reinforcement of the base plating layer 3c before the copper sulfate electroplating process 14. You may laminate | stack by the method. There is a strike nickel plating method using a watt bath. Such multilayer plating may be selected according to the purpose of the water distribution pipe.

  By the copper sulfate electroplating step 14, a copper plating layer 3b is further laminated on the copper base plating layer 3c, and the thickness of the plating layer 3 becomes about 5 to 10 micrometers. With a plating thickness of this level, if it is a normal drinking water distribution pipe, even if copper ions are gradually eluted in the water, the copper plating layer 3 does not disappear for a long time and does not peel off.

  The drying step 15 is a step of washing (washing) and drying after electroplating in the copper sulfate electroplating step 14 described above. Leave it indoors or dry under reduced pressure. Thereby, the PVC pipe 1 in which the inner wall surface according to the present invention is plated with copper is completed.

  FIG. 6 is a schematic diagram illustrating an example of the electroless copper plating step 11. The length of the PVC pipe 2 used for the water distribution pipe varies. If it is the short PVC pipe 2, electroless copper plating can be easily given by immersing the PVC pipe 2 in the plating solution 16a. However, a very large plating tank 16 is required to immerse the long PVC pipe 2 in the plating solution 16a and perform electroless copper plating. Therefore, when the electroless copper plating is applied to the long PVC pipe 2, it is preferable to adopt the circulation type electroless copper plating method shown in FIG.

  In particular, when electroless copper plating is applied to the long PVC pipe 2, it is desirable to connect the outgoing pipe 11b and the return pipe 11c to the PVC pipe 2 and pump the plating solution 16a using the pump 11d. Furthermore, by connecting a plurality of PVC pipes 2 with a connecting pipe such as an elbow 11a, the plurality of PVC pipes 2 can be simultaneously subjected to electroless copper plating.

  At this time, in order to maintain the plating efficiency, the temperature of the plating solution 16a put in the plating tank 16 is maintained at a constant temperature by the heater 18, and the air 17a is inserted from the air supply pipe 17 so that the dissolved oxygen amount It is desirable to ensure. Furthermore, when the electroless copper plating is continuously performed, the composition of the plating solution 16a is changed, and the plating efficiency is lowered. Therefore, electroless copper plating can be efficiently performed by adjusting the plating solution 16a in a separate stock tank from the plating tank 16 or by replenishing the composition component of the decreasing plating solution 16a as needed.

  FIG. 7 is a cross-sectional view showing an example of the copper sulfate electroplating step 14. Of course, an anode and a cathode are required for electroplating. The jig 20 is brought into contact with the copper base plating layer 3c on the inner wall surface of the PVC pipe 2 in the plating tank 19 containing the plating solution 19a, the jig 20 is hooked on the hanging tool 20a, etc., and the wiring 22 is connected to the cathode of the DC power source 23. Connect through. Thereby, the entire inner wall surface of the PVC pipe 2 becomes a cathode. On the other hand, the anode is made of a known electrode material such as carbon, copper metal, platinum, iridium oxide or the like that penetrates the inside of the PVC pipe 2 and is connected to the anode of the DC power source 23 via the wiring 22 to connect with the anode (anode 21). To do. The anode 21 is preferably carbon from the viewpoint of cost.

  When the long PVC pipe 2 is lifted by the jig 20 and the suspending tool 20a, the central portion of the PVC pipe 2 may bend and the anode 21 and the inner wall surface of the PVC pipe 2 may come into contact with each other to cause a short circuit. As a result, there arises a problem that the electroplating treatment cannot be performed successfully on the inner wall surface of the PVC pipe 2. This is particularly problematic when the PVC pipe 2 has a small diameter.

  Then, the long PVC pipe 2 is fixed using the stand 19b etc., and the bending of the PVC pipe 2 is eliminated. Similarly, the anode 21 is fixed so as not to move by using a fixture 21 a such as a base fixed to the water tank, thereby preventing the PVC pipe 2 from contacting the inner wall surface. Alternatively, the wire-shaped anode 21 is used and both ends of the wire-shaped anode 21 are pulled outward and fixed to the center of the PVC pipe 2 to prevent contact between the wire-shaped anode 21 and the inner wall surface of the PVC pipe 2. You can also

  By supplying a direct current from the power supply 23 to the electroplating apparatus installed in this way, copper ions dissolved in the plating solution 19a are deposited on the underlying plating layer 3c of the long PVC pipe 2. Then, the copper plating layer 3b is efficiently laminated, and the inner surface 3a that comes into contact with water is plated with copper. In addition, + in a figure means a positive pole and-means a negative pole.

  Generally, when the reaction of copper sulfate electroplating proceeds, the composition of the plating solution 19a changes and the plating efficiency decreases. In particular, in the case of a long pipe, even if the plating solution 19a in the plating tank 19 is stirred with a stirrer or the like, the inside of the PVC pipe 2 cannot be sufficiently stirred and mixed. Therefore, as the plating reaction proceeds, the plating solution 19 a inside the PVC pipe 2 changes more greatly than the plating solution 19 a in the plating tank 19. As a result, the plating reaction rate decreases and the production efficiency deteriorates.

  Therefore, in order to prevent a decrease in plating efficiency due to a change in the composition of the plating solution 19a and to advance an efficient plating reaction, the plating solution 19a is injected into the PVC pipe 2 by the pump 11d, and plating inside the PVC pipe 2 is performed. It is preferable to make the liquid 19 a uniform with the plating liquid 19 a in the plating tank 19. By installing a circulation pipe 24 or the like in the plating tank 19, a jet (arrow) can be easily blown by the pump 11d.

  In addition, although the circulating electroless copper plating method shown in FIG. 6 can be used, the plating solution 19a is a plating solution 19a for copper sulfate electricity, the inner wall surface of the PVC pipe 2 is a cathode, and the anode is a PVC pipe. 2 needs to be penetrated. At this time, care should be taken so that the plating solution 19a does not leak from the connecting portion of the jig 20, the wiring 22 and the PVC pipe.

  Here, the result of the confirmation test of the null prevention effect which is the effect of the PVC pipe 1 which copper-plated the inner wall surface which is this invention is demonstrated. One of the PVC pipes 2 having the same shape was the PVC pipe 1 copper-plated on the inner wall surface according to the present invention, and the other was the PVC pipe 2 that was not subjected to any treatment as the target section. One hole of the PVC pipe 2 was closed, tap water was collected, and left in the room for one month. As a result, nulls were confirmed on the inner surface 3a of the PVC pipe 2 in the target section where no treatment was performed. On the other hand, no null was generated on the inner surface 3a of the PVC pipe 1 copper-plated on the inner wall surface according to the present invention. From this, it can be said that generation | occurrence | production of the null in a water pipe can be prevented by utilizing the PVC pipe 1 which plated the inner wall surface which is this invention as a water pipe.

  This plating method can be applied to resin pipes such as PP pipes and ABS pipes in addition to the PVC pipe 2. Furthermore, it can of course be applied to metallic pipes.

It is a perspective view of the PVC pipe which plated the inner wall surface which is this invention with copper. FIG. 2 is a cross-sectional view at the position of a broken line arrow A in FIG. FIG. 2 is a cross-sectional view at the position of a broken line arrow B in FIG. It is an expanded sectional view of a plating layer. It is a manufacturing-process figure of the PVC pipe which plated the inner wall surface which is this invention with copper. It is a schematic cross section of the electroless copper plating process of the PVC pipe which plated the inner wall surface which is this invention. It is a schematic cross section of the copper sulfate electroplating process of the PVC pipe which plated the inner wall surface which is this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 PVC pipe copper-plated to inner wall 2 PVC pipe 2a Outer side 3 Plating layer 3a Inner surface 3b Copper plating layer 3c Underlying plating layer 4 Water passage 5 Chemical copper plating process 6 Electro copper plating process 7 Etching process 8 Degreasing process 9 Catalyst provision process DESCRIPTION OF SYMBOLS 10 Catalyst activation process 11 Electroless copper plating process 11a Elbow 11b Outward pipe 11c Return pipe 11d Pump 12 Jig mounting process 13 Activation process 14 Copper sulfate electroplating process 15 Drying process 16 Plating tank 16a Plating solution 17 Air supply pipe 17a Air 18 Heater 19 Plating tank 19a Plating solution 19b Base 20 Jig 20a Suspension tool 21 Anode 21a Fixing tool 22 Wiring 23 Power supply 24 Tube

Claims (3)

A resin pipe, and the base plating layer of the metal laminated on the inner wall surface of the resin pipe, a process for the preparation of a copper plated pipe to the inner wall surface ing from a copper plating layer formed on the lower plating layer,
The base plating layer,
The electroless plating solution stored in the plating tank is circulated between the plating tank and a plurality of resin pipes connected by a U-shaped elbow connecting pipe with a pump, and simultaneously by the electroless plating method. A method for producing a pipe having an inner wall surface plated with copper, wherein the inner wall surface is laminated on the inner wall surface of the resin pipe . The copper plating layer ,
After laminating the base plating layer, the anode is passed through the resin pipe, and a plating solution for electrolytic copper plating stored in the plating tank is circulated between the plating tank and the resin pipe by a pump, and the base plating is performed. 2. The method for producing a pipe plated with copper on the inner wall surface according to claim 1, wherein the layer is formed on the base plating layer by an electrolytic copper plating method using a cathode as a cathode . A resin pipe, and the base plating layer of the metal laminated on the inner wall surface of the resin pipe, a process for the preparation of a copper plated pipe to the inner wall surface ing from a copper plating layer formed on the lower plating layer,
The copper plating layer ,
After laminating the base plating layer, a wire-shaped anode is passed through the resin pipe, and both ends of the wire are pulled outside the resin pipe to prevent contact with the inner wall surface of the resin pipe. A method of manufacturing a pipe plated with copper on an inner wall surface, which is immersed in a plating solution and formed on the underlying plating layer by electrolytic copper plating using the underlying plating layer as a cathode.

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