JP4611396B2 - Mold repair powder and mold repair method - Google Patents
Mold repair powder and mold repair method Download PDFInfo
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- JP4611396B2 JP4611396B2 JP2008047390A JP2008047390A JP4611396B2 JP 4611396 B2 JP4611396 B2 JP 4611396B2 JP 2008047390 A JP2008047390 A JP 2008047390A JP 2008047390 A JP2008047390 A JP 2008047390A JP 4611396 B2 JP4611396 B2 JP 4611396B2
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- 239000000843 powder Substances 0.000 title claims description 52
- 230000008439 repair process Effects 0.000 title claims description 49
- 238000000034 method Methods 0.000 title claims description 12
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 70
- 239000002245 particle Substances 0.000 claims description 26
- 229910052721 tungsten Inorganic materials 0.000 claims description 26
- 239000010937 tungsten Substances 0.000 claims description 26
- 229910045601 alloy Inorganic materials 0.000 claims description 25
- 239000000956 alloy Substances 0.000 claims description 25
- 239000000919 ceramic Substances 0.000 claims description 8
- 229910001080 W alloy Inorganic materials 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 230000001590 oxidative effect Effects 0.000 claims description 4
- 230000035515 penetration Effects 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 33
- 238000005219 brazing Methods 0.000 description 18
- 239000000463 material Substances 0.000 description 14
- 230000000694 effects Effects 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229910008423 Si—B Inorganic materials 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000004512 die casting Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910019819 Cr—Si Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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- Molds, Cores, And Manufacturing Methods Thereof (AREA)
- Powder Metallurgy (AREA)
Description
本発明は金型補修用粉末と金型補修方法に関する。 The present invention relates to a mold repair powder and a mold repair method.
溶融金属のダイカスト法では、金型表面温度は成形を行う材料によっても異なるが、例えば鉄系の材料においては約８００℃に達する。
タングステン合金の接合に用いられるロウ材としては、銀ロウ、ニッケル（Ｎｉ）ロウが従来知られている。これらのロウ材で溶融金属成形用ダイカスト金型であるタングステン焼結合金製金型の補修を行う場合には、補修部に耐ヒートチェック性と耐溶損性が求められる。
前記銀ロウは、液相線が低いことから、耐溶損性が問題となる。一方、Ｎｉロウは、液相温度が比較的高いので耐溶損性はよいが、タングステンとの熱膨張係数の差が大きいため、金型内への溶湯流入時の熱負荷によりタングステンとＮｉロウとの接合界面等に過大な熱応力が発生し、早期の割れにつながる問題がある。
In the molten metal die casting method, the mold surface temperature varies depending on the material to be molded, but reaches about 800 ° C. in an iron-based material, for example.
As brazing materials used for joining tungsten alloys, silver brazing and nickel (Ni) brazing are conventionally known. When repairing a tungsten sintered alloy die, which is a die casting die for molten metal forming, using these brazing materials, the repaired portion is required to have heat check resistance and melt resistance.
The silver wax has a low liquidus, so that the resistance to melting is a problem. On the other hand, Ni solder has good resistance to erosion because of its relatively high liquidus temperature. However, since the difference in thermal expansion coefficient from tungsten is large, the heat load during the flow of molten metal into the mold causes tungsten and Ni solder to There is a problem in that excessive thermal stress is generated at the bonding interface of the lead and leads to early cracking.
特開２００７−１１９９２１号公報（特許文献１）には、クラック修理用組成及び修理方法が開示されている。この修理用合金組成は単結晶のニッケル基材料と、第１のニッケル基ろう接合金と、第２のニッケル基ろう接合金とを含むものである。前記単結晶のニッケル基材料には、クロム、コバルト、チタン、タンタル等と共にタングステンを４〜６重量％含むことが記載されている。
また特開平９−１０８９１０号公報（特許文献２）には、Ｎｉ合金ロウ材を用いてダイヤモンド基焼結材料切刃片をろう付け接合する発明が開示されている。
Japanese Patent Laid-Open No. 9-108910 (Patent Document 2) discloses an invention in which a diamond-based sintered material cutting blade piece is brazed and joined using a Ni alloy brazing material.
上記特許文献１には、修理用合金組成に含まれる３つの合金のうちの１つである単結晶のニッケル基合金にタングステンを含有させることが記載されている。しかしタングステンは、あくまで単結晶のニッケル基合金の合金成分として含まれるだけである。また主たる修理対象が単結晶材料で構成されたタービンエンジン部品である。このためタングステン焼結合金の補修部には向かず、耐ヒートチェック性や耐溶損性を十分に改良することができないと考えられる。
また上記特許文献２に開示されるＮｉ合金ろう材は、耐熱性材料であるダイヤモンド基焼結材料を接合するロウ材ではあるが、タングステン焼結合金の補修には耐ヒートチェック性や耐溶損性において問題が残る。
Patent Document 1 describes that tungsten is contained in a single crystal nickel-based alloy which is one of three alloys included in the repair alloy composition. However, tungsten is only included as an alloy component of a single crystal nickel-based alloy. The main repair object is a turbine engine component made of a single crystal material. For this reason, it is not suitable for repaired parts of tungsten sintered alloys, and it is considered that heat check resistance and melt resistance cannot be sufficiently improved.
The Ni alloy brazing material disclosed in Patent Document 2 is a brazing material that joins a diamond-based sintered material that is a heat-resistant material. The problem remains.
そこで本発明は上記従来のタングステン焼結合金製金型の補修用ロウの欠点を解消し、タングステン焼結合金製金型におけるクラック、溶損部、その他の損傷箇所である補修必要箇所を容易に補修することができると共に、タングステン焼結合金製金型そのものと同等の耐ヒートチェック性や耐溶損性を有する補修部を得ることができる金型補修用粉末と金型補修方法の提供を課題とする。 Therefore, the present invention eliminates the drawbacks of the above-described conventional solder sintered alloy mold repairing wax, and easily repairs cracks, melted parts, and other damaged parts in the tungsten sintered alloy mold. It is an object to provide a mold repair powder and a mold repair method capable of repairing and obtaining a repaired part having heat check resistance and melt resistance equivalent to that of a tungsten sintered alloy mold itself. To do.
本発明者らは上記課題を解決すべく研究を行った結果、タングステン焼結合金製金型と熱膨張係数が近いタングステンそのものを粉として、Ｎｉロウの粉に混ぜてなる粉末を補修用粉末とすることで、上記の問題点を解消することが可能であることに気付き、本発明を完成した。
即ち、本発明の金型補修用粉末は、タングステン焼結合金製金型の補修を行うのに用いる金型補修用粉末であって、液相線温度が１０００℃以上のＮｉ系粉末ロウを６０〜９０重量％、粒径が５〜１５０μｍのタングステン粉末を１０〜４０重量％の割合で混合させてあることを第１の特徴としている。
また本発明の金型補修方法は、上記第１の特徴に記載の金型補修用粉末を、タングステン焼結合金製金型の補修必要箇所に充填し、非酸化雰囲気中で溶融、固化することを第２の特徴としている。
また本発明の金型補修方法は、上記第２の特徴に加えて、タングステン焼結合金製金型の補修必要箇所の周囲を耐熱性セラミックスで囲うことで補修必要箇所以外への漏れ、浸透を防止するようにしたことを第３の特徴としている。
As a result of studies conducted by the present inventors to solve the above problems, tungsten itself having a thermal expansion coefficient close to that of a sintered tungsten alloy mold is used as a powder, and a powder mixed with Ni braze powder is used as a repair powder. As a result, it was found that the above problems could be solved, and the present invention was completed.
That is, the powder for repairing a mold according to the present invention is a powder for repairing a mold used for repairing a mold made of a sintered tungsten alloy, and 60 Ni powder powder having a liquidus temperature of 1000 ° C. or more. The first feature is that tungsten powder having a particle size of ˜90 wt% and a particle size of 5 to 150 μm is mixed at a ratio of 10 to 40 wt% .
Mold repairing method of the present invention or the mold repair powder according to the first aspect, filling the repairing necessary portions of the tungsten sintered alloy mold, melted in a non-oxidizing atmosphere, to solidify This is the second feature.
Further, in addition to the second feature described above, the mold repair method of the present invention can prevent leakage and penetration of parts other than those requiring repair by surrounding the parts requiring repair of the sintered tungsten alloy mold with heat-resistant ceramics. The third feature is to prevent it.
請求項１に記載の金型補修用粉末によれば、液相線温度が１０００℃以上のＮｉ系粉末ロウにタングステン粉末を混合させてあるので、この粉末を用いてタングステン焼結合金製金型の補修必要箇所の補修を行うことにより、耐ヒートチェック性がよく且つ耐溶損性のよい補修部を得ることができる。即ち、１０００℃以上の液相線温度のＮｉ系粉末ロウと溶融温度の十分高いタングステン粉末との混合粉末であるので、得られる補修部が金型の使用温度に対しても十分な耐熱性を保持することから、耐溶損性の高い補修部を得ることができる。しかもタングステン粉末を加えることにより、補修部がもつ熱膨張係数をタングステン焼結合金製金型の熱膨張係数に近く調整することができ、よって補修部とその周囲の金型部分との熱膨張差を緩和できるので、ヒートチェックの発生や割れを抑制することができる。これにより耐久性のよい補修タングステン焼結合金製金型を得ることができる。 According to the powder for repairing a mold according to claim 1, tungsten powder is mixed with Ni-based powder solder having a liquidus temperature of 1000 ° C. or higher. By repairing the parts requiring repair, it is possible to obtain a repaired portion having good heat check resistance and good resistance to melting damage. That is, since it is a mixed powder of a Ni-based powder wax having a liquidus temperature of 1000 ° C. or higher and a tungsten powder having a sufficiently high melting temperature, the resulting repaired part has sufficient heat resistance even at the use temperature of the mold Since it holds, a repairing part with high resistance to melting can be obtained. In addition, by adding tungsten powder, the thermal expansion coefficient of the repaired part can be adjusted close to the thermal expansion coefficient of the tungsten sintered alloy mold, so the difference in thermal expansion between the repaired part and the surrounding mold part Therefore, the occurrence of heat check and cracking can be suppressed. Thereby, a durable tungsten sintered alloy mold can be obtained.
また請求項１に記載の金型補修用粉末によれば、Ｎｉ系粉末ロウを６０〜９０重量％、タングステン粉末を１０〜４０重量％の割合で混合させてあることにより、成分組成のそのような限定によってロウ付け用粉末としての十分な流動性、補修部充填性を確保しながら、且つ補修部のタングステン焼結合金製金型に対する熱膨張差緩和効果を発揮させることが可能となる。 According to the mold repair powder of claim 1 , the Ni-based powder wax is mixed in a proportion of 60 to 90% by weight, and the tungsten powder is mixed in a proportion of 10 to 40% by weight. With such a limitation, it is possible to ensure the sufficient fluidity as the powder for brazing and filling of the repaired part, and to exhibit the effect of reducing the thermal expansion difference for the tungsten sintered alloy mold of the repaired part.
また請求項１に記載の金型補修用粉末によれば、タングステン粉末の粒径を５〜１５０μｍに調整してあることにより、Ｎｉ系粉末ロウに対するタングステン粉末の均一分散性と得られる粉末のロウとしての流動性との両方を兼ね備えたものにすることができる。即ち、Ｎｉ系粉末ロウに加えられるタングステン粉末の粒径が小さいほど、より均一に分散させることができるが、一方、粒径が小さくなるほどロウの流動性が悪くなり、補修必要箇所への充填性能が悪くなる。本発明では混合するタングステンの粒径を上記の範囲にすることで、ロウとしての流動性を確保しながら良好なロウ付け、均一な組織、均一な熱膨張係数による熱膨張差緩和効果を得ることができる。 According to the mold repair powder of claim 1 , by adjusting the particle size of the tungsten powder to 5 to 150 μm, the uniform dispersibility of the tungsten powder with respect to the Ni-based powder wax and the obtained powder wax It can be made to have both fluidity as In other words, the smaller the particle size of the tungsten powder added to the Ni-based powder brazing, the more uniformly it can be dispersed. On the other hand, the smaller the particle size, the poorer the fluidity of the brazing, and the filling performance to the places where repair is necessary. Becomes worse. The particle size of the tungsten is mixed in the present invention is within the above range, good braze while ensuring fluidity of the wax, uniform structure, to obtain a thermal expansion buffer effect due to uniform thermal expansion coefficient Can do.
また請求項２に記載の金型補修方法によれば、請求項１に記載の金型補修用粉末を用い、且つこれを非酸化雰囲気中で溶融、固化するようにしているので、補修必要箇所に充填した粉末によるロウ付けの際、酸化が抑えられ、タングステン粉末が分散されたＮｉ系粉末ロウによる、良好なロウ付けが行われ、耐溶損性、耐ヒートチェック性のよい補修部を得ることが可能となる。 Further, according to the mold repair method of claim 2 , the mold repair powder of claim 1 is used and melted and solidified in a non-oxidizing atmosphere. When brazing with powder filled in, oxidation is suppressed, good brazing is performed with Ni-based powder braze in which tungsten powder is dispersed, and a repaired part with good resistance to melting damage and heat check is obtained. Is possible.
また請求項３に記載の金型補修方法によれば、上記請求項２に記載の構成による効果に加えて、タングステン焼結合金製金型の補修必要箇所の周囲を耐熱性セラミックスで囲うことで補修必要箇所以外への漏れ、浸透を防止するようにしたので、補修必要箇所以外で固化したロウを取り除く手間を無くすことができる。特に補修必要箇所での肉盛不足や厚み不足等のロウ付け不足を無くすことができる。 Further, according to the mold repair method of the third aspect , in addition to the effect by the configuration of the second aspect , the periphery of the tungsten sintered alloy mold where the repair is necessary is surrounded by heat-resistant ceramics. Since leakage and penetration to places other than those requiring repair are prevented, it is possible to eliminate the trouble of removing the solidified wax other than those requiring repair. In particular, it is possible to eliminate insufficient brazing such as lack of build-up or insufficient thickness in places requiring repair.
本発明の実施形態を以下に説明する。
本発明の実施形態に係る金型補修用粉末は、タングステン焼結合金製金型のクラック箇所や溶損部である補修必要箇所をロウ付け補修するのに用いられる粉末で、要するにＮｉ系粉末ロウにタングステン粉末を混合したものである。
Ｎｉ系粉末ロウにタングステン焼結合金金型に近い熱膨張係数を有するタングステン粉末を混合することで、補修部と金型本体との熱膨張差を緩和する。
Embodiments of the present invention will be described below.
The powder for repairing a mold according to an embodiment of the present invention is a powder used for brazing and repairing a crack-required part which is a crack part or a melted part of a tungsten sintered alloy mold. And tungsten powder.
By mixing tungsten powder having a thermal expansion coefficient close to that of a tungsten sintered alloy mold with Ni-based powder brazing, the difference in thermal expansion between the repaired part and the mold body is reduced.
ところで、Ｎｉ系粉末ロウとタングステン粉末の混合割合において、タングステン粉末の割合が多いほど、熱膨張差緩和効果が大きい。しかしタングステン粉末の割合を多くするほど、加熱処理時におけるロウの流動性が悪化するため、適切な混合割合で用いる必要がある。
また混合粉末における金型補修において、熱膨張差の緩和効果を安定して得るためには、補修におけるタングステン粉末が均一に分散していることが必要となる。
タングステン粉末の粒径が小さいほど均一に分散するのであるが、ロウの流動性はそれに反して悪化するため、適切な粒径を選択する必要がある。
By the way, in the mixing ratio of the Ni-based powder wax and the tungsten powder, the larger the ratio of the tungsten powder, the greater the effect of reducing the thermal expansion difference. However, as the proportion of tungsten powder increases, the flowability of the wax during the heat treatment deteriorates, so it is necessary to use it at an appropriate mixing ratio.
Further, in the mold repair in the mixed powder, it is necessary that the tungsten powder in the repair is uniformly dispersed in order to stably obtain the effect of relaxing the thermal expansion difference.
The smaller the particle size of the tungsten powder, the more uniformly it is dispersed. However, the flowability of the wax deteriorates on the contrary, so it is necessary to select an appropriate particle size.
上記補修の対象となるタングステン焼結合金は、タングステンを主成分とし、バインダーとして、Ｎｉ、Ｃｕ、Ｆｅ、Ｍｏ等を１０％未満で用いた焼結合金である。低熱膨張、高熱伝導、機械的特性、切削加工性の観点からダイカスト金型に用いられる。 The tungsten sintered alloy to be repaired is a sintered alloy containing tungsten as a main component and using Ni, Cu, Fe, Mo or the like as a binder in less than 10%. Used in die casting molds from the viewpoint of low thermal expansion, high thermal conductivity, mechanical properties, and machinability.
上記Ｎｉ系粉末ロウとしては、１０００℃以上の液相線温度を有するＮｉ系粉末ロウを用いる。
Ｎｉ系粉末ロウの粒径は、１５０μｍ程度のものを用いることができるが、補修必要箇所に要される精密性に応じて、適宜変更することが可能である。ただし、後述するタングステン粉末の粒径との関係では、タングステン粉末よりも大きいものを用いるのが好ましい。
前記液相線が１０００℃以上のＮｉ系粉末ロウとしては、ＪＩＳ規格のＢＮｉ−１、ＢＮｉ−１Ａ、ＢＮｉ−２、ＢＮｉ−３、ＢＮｉ−４、ＢＮｉ−５を用いることができる。
ここで、
ＢＮｉ−１ ：Ｎｉ−Ｃｒ−Ｆｅ−Ｓｉ−Ｂ系で、液相線が約１０６０℃である。
ＢＮｉ−１Ａ：Ｎｉ−Ｃｒ−Ｆｅ−Ｓｉ−Ｂ系で、液相線が約１０７５℃である。
ＢＮｉ−２ ：Ｎｉ−Ｃｒ−Ｓｉ−Ｂ−Ｆｅ系で、液相線が約１０００℃である。
ＢＮｉ−３ ：Ｎｉ−Ｓｉ−Ｂ系で、液相線が約１０４０℃である。
ＢＮｉ−４ ：Ｎｉ−Ｓｉ−Ｂ系で、液相線が約１０６５℃である。
ＢＮｉ−５ ：Ｎｉ−Ｃｒ−Ｓｉ系で、液相線が約１１３５℃である。
As the Ni-based powder wax, a Ni-based powder wax having a liquidus temperature of 1000 ° C. or higher is used.
The particle diameter of the Ni-based powder wax can be about 150 μm, but can be changed as appropriate according to the precision required for the repair required part. However, in relation to the particle size of the tungsten powder described later, it is preferable to use a powder larger than the tungsten powder.
JIS standard BNi-1, BNi-1A, BNi-2, BNi-3, BNi-4, BNi-5 can be used as the Ni-based powder wax having a liquidus of 1000 ° C. or higher.
here,
BNi-1: Ni-Cr-Fe-Si-B system, liquidus is about 1060 ° C.
BNi-1A: Ni—Cr—Fe—Si—B system, liquidus is about 1075 ° C.
BNi-2: Ni—Cr—Si—B—Fe system, liquidus is about 1000 ° C.
BNi-3: Ni-Si-B system, liquidus is about 1040 ° C.
BNi-4: Ni—Si—B system, liquidus is about 1065 ° C.
BNi-5: Ni—Cr—Si system, liquidus is about 1135 ° C.
前記タングステン粉末は、補修箇所の熱膨張係数を低減し、金型本体との熱膨張差を緩和する機能を果たす。また補修箇所の耐熱温度を上げる機能を果たす。
タングステン粉末の混合割合は、Ｎｉ系粉末ロウ６０〜９０重量％に対してタングステン粉末を４０〜１０重量％混合させる。より具体的には、Ｎｉ系粉末ロウ６０〜９０重量％、残部をタングステン粉末としたものを用いることができる。
タングステン粉末が１０重量％未満の場合には、得られる補修部の熱膨張係数の低減化が不十分で、タングステン焼結合金製金型との熱膨張差を十分に緩和することができない。一方、タングステン粉末が４０重量％を超える場合には、ロウの流動性が悪化し、割れ易くなる。
タングステン粉末の粒径は、５〜１５０μｍに調整する。
タングステン粉末の粒径が５μｍ未満の場合は、均一的な分散には適しているが、ロウとしての流動性が悪化して、補修が好ましくできなくなる。一方、タングステン粉末の粒径が１５０μｍを超えると、補修部の損傷が容易に生じる問題がある。
勿論、タングステン粉末の粒径はＮｉ系粉末ロウの粒径以下とするのが好ましい。
タングステン粉末は、好ましくは、Ｎｉ系粉末ロウ６０〜９０重量％に対してタングステン粉末を４０〜１０重量％の混合で且つ粒径を５〜１５０μｍにするのがよい。
The tungsten powder functions to reduce the coefficient of thermal expansion at the repair site and to reduce the difference in thermal expansion from the mold body. It also functions to raise the heat-resistant temperature of repaired parts.
The mixing ratio of the tungsten powder is such that 40 to 10% by weight of tungsten powder is mixed with 60 to 90% by weight of Ni-based powder wax. More specifically, Ni-based powder wax of 60 to 90% by weight and the balance of tungsten powder can be used.
When the tungsten powder is less than 10% by weight, the thermal expansion coefficient of the obtained repaired part is insufficiently reduced, and the difference in thermal expansion from the tungsten sintered alloy mold cannot be sufficiently relaxed. On the other hand, when the tungsten powder exceeds 40% by weight, the fluidity of the wax is deteriorated and is easily broken.
The particle size of the tungsten powder is adjusted to 5 to 150 μm.
When the particle size of the tungsten powder is less than 5 μm, it is suitable for uniform dispersion, but the fluidity as a wax deteriorates and repair is not preferable. On the other hand, when the particle size of the tungsten powder exceeds 150 μm, there is a problem that the repaired portion is easily damaged.
Of course, it is preferable that the particle size of the tungsten powder is not more than the particle size of the Ni-based powder wax.
The tungsten powder is preferably a mixture of 40 to 10% by weight of tungsten powder with respect to 60 to 90% by weight of Ni-based powder wax and a particle size of 5 to 150 μm.
Ｎｉ系粉末ロウとＷ（タングステン）粉末の粉末混合割合を変えて、また１つの混合割合に対してＷ粉末の粒径を変更して試料１〜１９を作成した。
試料１〜１９ついて、タングステン焼結合金製金型に予め形成した補修必要箇所に、試料１〜１９を適用して補修を行い、補修ができたものについては更に５００ショットの鉄系材の成形を行った時点で補修部の損傷状態を観察した。結果を表１に示す。
表１において、補修そのものができなかったものについては「×」印を記す。また５００ショット成形後に割れが発生したものについては、「割れ発生」と記した。
なおＮｉ系粉末ロウとして、ＪｉＳ規格のＢＮｉ−２、粒径１５０μｍを用いた。またタングステン焼結合金製金型は、３〜７％程度の金属系バインダーを含むものを使用した。
Samples 1 to 19 were prepared by changing the powder mixing ratio of the Ni-based powder wax and the W (tungsten) powder and changing the particle diameter of the W powder with respect to one mixing ratio.
Samples 1-19 were repaired by applying samples 1-19 to the repair-necessary parts previously formed in the tungsten sintered alloy mold, and for those that could be repaired, forming 500 shots of iron-based material The damage state of the repaired part was observed at the time of performing. The results are shown in Table 1.
In Table 1, those that could not be repaired are marked with “x”. Moreover, the thing which the crack generate | occur | produced after 500 shot shaping | molding was described as "crack generation | occurrence | production."
As the Ni-based powder wax, JiS standard BNi-2 and a particle size of 150 μm were used. Moreover, the tungsten sintered alloy mold used was one containing about 3 to 7% metal binder.
表１の結果からわかるように、タングステン粉末を５〜４０重量％混合した場合は、タングステン粉末の粒径３μｍの場合に補修必要箇所の補修ができなかった。またタングステン粉末が５０重量％の場合は、タングステン粉末の粒径が１５０μｍの場合に補修必要箇所の補修ができなかった。これはタングステン粉末の粒径が小さくなることにより、粉末のロウ付け時の流動性が損なわれた結果であることがわかる。勿論、タングステン粉末の混合量が多くなりすぎても流動性が悪くなることを示している。
また補修部損傷状況に関しては、タングステン粉末の混合割合が０重量％及び５重量％のものは、全てのタングステン粉末粒径において、補修部の割れに至っている。これはタングステン粉末の混合割合が少ない場合には、熱膨張差緩和効果が十分に発揮されないことを示している。またタングステン粉末の混合割合が１０〜５０重量％の場合は、タングステン粉末粒径が２００μｍまで大きくなると、補修部に割れが生じている。これはタングステン粉末の粒径が大きくなると結果として、熱膨張差緩和効果が十分に発揮されないことを示している。
以上より、Ｎｉ系粉末ロウを６０〜９０重量％、残部を粒径５〜１５０μｍのタングステン粉末からなる粉末が、タングステン焼結合金製金型の補修において、熱膨張差緩和効果と補修必要箇所を良好に充填することができる流動性を両立することができることがわかる。
As can be seen from the results in Table 1, when 5 to 40% by weight of the tungsten powder was mixed, it was not possible to repair the portion requiring repair when the particle size of the tungsten powder was 3 μm. Further, when the tungsten powder was 50% by weight, it was not possible to repair the repaired portion when the particle size of the tungsten powder was 150 μm. This shows that the flowability at the time of brazing of the powder is impaired due to the small particle size of the tungsten powder. Of course, it shows that the fluidity is deteriorated even if the amount of tungsten powder mixed becomes too large.
As for the repaired part damage state, when the mixing ratio of the tungsten powder is 0% by weight and 5% by weight, the repaired part is cracked in all the tungsten powder particle sizes. This indicates that when the mixing ratio of the tungsten powder is small, the thermal expansion difference relaxation effect is not sufficiently exhibited. When the mixing ratio of the tungsten powder is 10 to 50% by weight, the repaired portion is cracked when the tungsten powder particle size is increased to 200 μm. This indicates that when the particle size of the tungsten powder is increased, the thermal expansion difference relaxation effect is not sufficiently exhibited.
From the above, the powder composed of 60 to 90% by weight of Ni-based powder wax and the balance of tungsten powder having a particle size of 5 to 150 μm has the effect of reducing the thermal expansion difference and repairing necessary parts in repairing a tungsten sintered alloy mold. It turns out that the fluidity | liquidity which can be filled favorable can be made compatible.
ところで金型の補修を行うにあたり、補修必要箇所以外の部分にロウが流動、浸透するのを防止し、補修必要箇所において必要な厚みの肉盛を得るために、耐熱性セラミックを用いた補修が有効である。セラミックスは粉末ロウの加熱処理温度以上、即ち１２００℃以上の耐熱性が必要である。補修方法は、補修必要箇所を耐熱性セラミックで囲い、補修必要箇所へ補修用の粉末を充填し、非酸化雰囲気で加熱処理を行う工程となる。加熱処理後（ロウ付け後）耐熱性セラミックを除去し、補修部を機械加工及び手作業により仕上げる。耐熱性セラミックを用いずに加熱処理を行うと、補修必要箇所以外の部分へ流動、浸透したろう材の除去を行わなければならず、また肉盛した補修部において必要な厚みを得ることができなくなる問題が生じ得る。 By the way, when repairing the mold, in order to prevent the wax from flowing and penetrating into the parts other than the repair necessary part, and to build up the necessary thickness in the repair necessary part, the repair using the heat resistant ceramic is performed. It is valid. Ceramics are required to have a heat resistance higher than the heat treatment temperature of the powder wax, that is, 1200 ° C. or higher. The repair method is a process in which a repair-required portion is surrounded by heat-resistant ceramic, the repair-required portion is filled with powder for repair, and heat treatment is performed in a non-oxidizing atmosphere. After heat treatment (after brazing), the heat-resistant ceramic is removed and the repaired part is finished by machining and manual work. When heat treatment is performed without using heat-resistant ceramic, the brazing material that has flowed and penetrated to parts other than the part that requires repair must be removed, and the necessary thickness can be obtained at the built-up repair part. The problem of disappearing can arise.
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| JP2003176727A (en) * | 2001-12-10 | 2003-06-27 | Mitsubishi Heavy Ind Ltd | Repair method for high-temperature component and repaired high-temperature component |
| JP2005095905A (en) * | 2003-09-22 | 2005-04-14 | Toshiba Corp | Cladding-by-welding diffusion repairing device, and method therefor |
| JP2007160390A (en) * | 2005-12-16 | 2007-06-28 | Honda Motor Co Ltd | Paste agent for metallic mold repair |
| JP2007270339A (en) * | 2006-03-30 | 2007-10-18 | Fuji Dies Kk | Metal mold for die casting and its peripheral member |
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| JP2005095905A (en) * | 2003-09-22 | 2005-04-14 | Toshiba Corp | Cladding-by-welding diffusion repairing device, and method therefor |
| JP2007160390A (en) * | 2005-12-16 | 2007-06-28 | Honda Motor Co Ltd | Paste agent for metallic mold repair |
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