JP4608700B2 - Plasterboard - Google Patents

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Publication number
JP4608700B2
JP4608700B2 JP2000324527A JP2000324527A JP4608700B2 JP 4608700 B2 JP4608700 B2 JP 4608700B2 JP 2000324527 A JP2000324527 A JP 2000324527A JP 2000324527 A JP2000324527 A JP 2000324527A JP 4608700 B2 JP4608700 B2 JP 4608700B2
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Japan
Prior art keywords
gypsum
mesh
gypsum board
conductive
carbon fiber
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Expired - Fee Related
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JP2000324527A
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JP2002127297A (en
Inventor
慶直 大川
哲夫 遠藤
清光 長谷川
武彦 加藤
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Kumagai Gumi Co Ltd
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Kumagai Gumi Co Ltd
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  • Laminated Bodies (AREA)
  • Manufacturing Of Tubular Articles Or Embedded Moulded Articles (AREA)
  • Curing Cements, Concrete, And Artificial Stone (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、電磁波を遮蔽する性能(以下、「シールド性能」という)を有する石膏ボードに関する。
【0002】
【従来の技術】
図3(a)はシールド性能を有する従来の石膏ボードの一部断面斜視図、図3(b)は断面図を示す。この石膏ボード10は、矩形板状の石膏構成部11の裏面側に、当該裏面と略平行に導電性メッシュ12が埋設され、石膏構成部11の表,裏面には紙などの仕上げ材(表面仕上げ材13a,裏面仕上げ材13b)が貼られて成るものである。
上記導電性メッシュ12は、導電性材料により網状に形成されている。
【0003】
【発明が解決しようとする課題】
しかしながら、上記従来の石膏ボードは、必ずしもシールド性能が十分ではないという課題があった。
本発明では、シールド性能を向上させることができる石膏ボードを提供する。
【0004】
【課題を解決するための手段】
本発明に係る石膏ボードは、石膏構成部の表面側に当該表面と略平行に第1の導電性メッシュが埋設されるとともに、石膏構成部の裏面側に当該裏面と略平行に第2の導電性メッシュが埋設され、上記石膏構成部は、石膏等の主成分中に、炭素繊維材を重量比1Wt%以上及び粒径100μm以下の炭素材を重量比10Wt%以上混入して構成され、上記第1,第2の導電性メッシュ間の距離が、シールド対象電磁波のλ/4波長あるいはこれに近い値に設定されているものとした。
また、上記炭素繊維材が長さ6mm以下の炭素繊維材であり、上記石膏等の主成分中に、当該長さ6mm以下の炭素繊維材が重量比3Wt%以下の割合で混入されている構成とした。
また、上記第1の導電性メッシュのメッシュ開口の大きさと上記第2の導電性メッシュのメッシュ開口の大きさとが異なる構成とした。
【0005】
【発明の実施の形態】
以下、図1,2に基づいて本発明の実施の形態による石膏ボードを説明する。図1(a)は実施の形態による石膏ボードの一部断面斜視図、図1(b)は断面図を示す。尚、図3の従来例と同一構成要素については同一符号を付して詳説を省略する。
実施の形態による石膏ボード1は、石膏構成部2の表面側に第1の導電性メッシュ21が埋設されているとともに、石膏構成部2の裏面側に第2の導電性メッシュ22が埋設されているものである。
即ち、石膏ボード1の表面,裏面等の面と略平行に埋設される導電性メッシュを、石膏ボード1の厚さ方向に二枚備えたメッシュ二重構造を有する石膏ボード1である。
【0006】
尚、上記石膏構成部2は、焼石膏に消石灰とドロマイトプラスタと粘土及び接着剤等よりなる主成分中に、粒径44μm以下の炭素材を重量比10Wt%、長さ6mmの炭素繊維材を重量比2Wt%混入したもので構成されている。
また、第1,第2の導電性メッシュ21,22は、金,銀,鋼,ステンレス,アルミ,亜鉛,ニッケル,カーボン等の導電性材料よりなる線材、又は、高分子繊維の表面に上記導電性材料の被膜をコーティングした線材、又は、表面仕上げ材の裏側に導電性のインクで印刷したものやフィルム等により網状に形成されたものを用いる。尚、図1に示す実施の形態では、メッシュの網目,即ち、メッシュ開口の大きさが異なる第1,第2の導電性メッシュ21,22を用いている。即ち、第1の導電性メッシュ21として、第2の導電性メッシュ22よりメッシュ開口が大きいものを用いた例を示している。
【0007】
また、上記第1,第2の導電性メッシュ21,22間の距離Wは、シールド対象電磁波のλ/4波長あるいはこれにできるだけ近い値に設定されている。
【0008】
石膏構成部2の裏面側に導電性メッシュ22を埋設したメッシュ一重構造の石膏ボードと、本実施の形態によるメッシュ二重構造の石膏ボードのシールド性能を比較した結果を図2に示す。
図2において、下の曲線がメッシュ一重構造の石膏ボードのシールド性能曲線、上の曲線が本実施の形態によるメッシュ二重構造の石膏ボードのシールド性能曲線である。
尚、上記メッシュ一重構造とメッシュ二重構造の石膏ボードにおける石膏構成部2及び導電性メッシュ22の構成は同じである。
【0009】
図2から明らかなように、メッシュ一重構造の石膏ボードは10MHz〜1000MHzの周波数帯においてシールド性能が低い周波数帯では40dB程度の値であるのに対して、本実施の形態によるメッシュ二重構造の石膏ボードでは、10MHz〜1000MHzの周波数帯の電磁波に対して少なくとも50dB以上のシールド性能を有する。従って、シールド要求性能が50dB以上の場合に対応できる石膏ボード1が得られる。
また、メッシュ一重構造の石膏ボードと比べ、10MHz〜1000MHzの周波数帯の電磁波に対してのシールド性能が全体的に向上しており、メッシュ一重構造の石膏ボードと比べて全体的にシールド性能の高い石膏ボード1が得られる。
【0010】
即ち、実施の形態によるメッシュ二重構造の石膏ボード1によれば、例えば、100dBμV/mの電磁波が石膏ボード1の表面側から入射した場合、第1の導電性メッシュ21のシールド性能が20dBであれば、80dBμV/mの電磁波が40dB以上の性能を有するメッシュ一重構造の石膏ボードに入射することと同等になるので、全体的にシールド性能が上昇する。
【0011】
また、石膏ボード1の表面側から入射し、第1の導電性メッシュ21を透過した電磁波は、電気的な面抵抗(20Ω程度)を持つ石膏を介して第2の導電性メッシュ22に至る。ここで、電磁波は再び表面側に反射して上記第1,第2の導電性メッシュ21,22間の石膏中に入射することになる。このことが繰り返されるため、メッシュ一重構造の石膏ボードに比べて、電磁波吸収性能が向上する。
【0012】
また、上記第1,第2の導電性メッシュ21,22間の距離Wを、シールド対象電磁波のλ/4波長あるいはこれにできるだけ近い値に設定しているので、シールド性能及び電磁波吸収性能の高い石膏ボード1となる。
【0013】
即ち、本実施の形態の石膏ボード1によれば、第1,第2の導電性メッシュ21,22を備えたメッシュ二重構造を採用するとともに、シールド性能が高い石膏構成部2を備え、さらに、上記第1,第2の導電性メッシュ21,22間の距離Wを、シールド対象電磁波のλ/4波長あるいはこれにできるだけ近い値に設定したので、シールド性能及び電磁波吸収性能の高い石膏ボード1が得られる。
実施の形態による石膏ボード1を用いて部屋を構築すれば、部屋から外部あるいは外部から部屋への電磁波の漏洩を防止できるとともに、部屋内の通信装置から出る電磁波を吸収でき、電磁波の漏洩、通信装置の誤動作や情報伝達エラーを防止できるようになる。
【0014】
尚、実施の形態では、第1の導電性メッシュ21として、第2の導電性メッシュ22よりメッシュ開口が大きいものを用いたが、第1の導電性メッシュ21として、第2の導電性メッシュ22よりメッシュ開口が小さいものを用いてもよいし、メッシュ開口の大きさが同じ第1,第2の導電性メッシュ21,22を用いてもよい。
また、第1,第2の導電性メッシュ21,22のメッシュ開口をあまり大きくすると、シールド対象とする周波数帯の電磁波に対する遮蔽性能を満たさなくなるおそれがあるので、できるだけ小さい方がよいが、逆に、あまり小さくすると、導電性メッシュにより石膏構成部2が剥離を起こすおそれがある。そこで、小さくとも4mm角程度に設定するのが望ましい。
また、第1,第2の導電性メッシュ21,22は、同じ材料で形成されたものを用いてもよいし、異なる材料で形成されたものを用いてもよい。
【0015】
また、上記石膏構成部2は、石膏等の主成分中に、導電性材料を混入して構成すればよいが、少なくとも、例えば炭素繊維材を重量比1Wt%以上及び粒径100μm以下の炭素材を重量比10Wt%以上混入して構成することが好ましい。この場合、石膏構成部の主成分の重量比を50Wt%以下にすると石膏構成部の強度が弱くなるため、主成分の重量比は最低50Wt%とすることが望ましく、また、上記炭素繊維材は、6mm以下の炭素繊維材を重量比3Wt%以下とすることが望ましい。6mm以上の炭素繊維材を混ぜたり、重量比を3Wt%以上とすると、膨張が大きくなりうまく混ぜられないからである。
【0016】
尚、第1,第2の導電性メッシュ21,22間の距離Wを、シールド対象電磁波のλ/4波長あるいはこれにできるだけ近い値に設定したが、このようにしなくとも、二重メッシュ構造により、一重メッシュ構造を採用した石膏ボードに比べてシールド性能は向上する。
【0017】
また、炭素繊維材や炭素材等の導電性材料を混入していない石膏構成部に本願の二重メッシュ構造を採用してもかまわない。このようにしても、炭素繊維材や炭素材等の導電性材料を混入していない石膏構成部に一重メッシュ構造を採用した石膏ボードに比べてシールド性能の高い石膏ボードが得られるからである。
【0018】
また、実施の形態では、二重メッシュ構造の石膏ボードを例にして説明したが、本願においては、以下のような構成の石膏ボードであってもよい。
即ち、部屋の内側に位置する表面側に導電性メッシュを埋設し、部屋の外側に位置する裏面側にシート状に形成された導電性シートを埋設した石膏ボードでもよい。このような構成の石膏ボードでも、部屋から外部あるいは外部から部屋への電磁波の漏洩を防止できるとともに、部屋内の通信装置から出る電磁波を吸収でき、電磁波の漏洩、通信装置の誤動作や情報伝達エラーを防止できるようになる。
また、表面,裏面側にそれぞれ導電性シートを埋設した二重シート構造の石膏ボードとしてもよく、このような構成の石膏ボードでも、部屋から外部あるいは外部から部屋への電磁波の漏洩を防止でき、シールド性能を向上させることができる。
さらに、石膏ボードの面と略平行に埋設される導電性メッシュや導電性シートを、石膏ボードの厚さ方向に3枚以上設けるようにしてもよい。
【0019】
【発明の効果】
以上、本発明の請求項1に係る石膏ボードによれば、石膏構成部の表面側に当該表面と略平行に第1の導電性メッシュが埋設されるとともに、石膏構成部の裏面側に当該裏面と略平行に第2の導電性メッシュが埋設され、上記石膏構成部は、石膏等の主成分中に、炭素繊維材を重量比1Wt%以上及び粒径100μm以下の炭素材を重量比10Wt%以上混入して構成され、上記第1,第2の導電性メッシュ間の距離が、シールド対象電磁波のλ/4波長あるいはこれに近い値に設定されている構成としたので、メッシュ一重構造の石膏ボードに比べてシールド性能の高い石膏ボードを得ることができる。
また、炭素繊維材が長さ6mm以下の炭素繊維材であり、石膏等の主成分中に、当該長さ6mm以下の炭素繊維材が重量比3Wt%以下の割合で混入されている構成としたので、主成分中に炭素繊維材を良好に混入できるようになり、シールド性能の高い石膏ボードを得ることができる。
また、第1の導電性メッシュのメッシュ開口の大きさと第2の導電性メッシュのメッシュ開口の大きさとが異なるので、メッシュ一重構造の石膏ボードに比べてよりシールド性能の高い石膏ボードを得ることができる。
【図面の簡単な説明】
【図1】 本発明の実施の形態による石膏ボードの一部断面斜視図及び断面図である。
【図2】 メッシュ一重構造の石膏ボードと実施の形態によるメッシュ二重構造の石膏ボードのシールド性能を比較した図である。
【図3】 従来の石膏ボードの一部断面斜視図及び断面図である。
【符号の説明】
1 石膏ボード、2 石膏構成部、21,22 第1,第2の導電性メッシュ、W 第1,第2の導電性メッシュ間の距離。
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a gypsum board having the ability to shield electromagnetic waves (hereinafter referred to as “shielding performance”).
[0002]
[Prior art]
FIG. 3A is a partial cross-sectional perspective view of a conventional gypsum board having shielding performance, and FIG. 3B is a cross-sectional view. This gypsum board 10 has a conductive mesh 12 embedded in a back surface of a rectangular plaster gypsum constituting portion 11 substantially in parallel with the back surface, and a finishing material such as paper (surface) on the front and back surfaces of the gypsum constituting portion 11. The finishing material 13a and the back surface finishing material 13b) are pasted.
The conductive mesh 12 is formed in a net shape with a conductive material.
[0003]
[Problems to be solved by the invention]
However, the conventional gypsum board has a problem that the shielding performance is not always sufficient.
In the present invention, a gypsum board capable of improving shielding performance is provided.
[0004]
[Means for Solving the Problems]
In the gypsum board according to the present invention, the first conductive mesh is embedded on the surface side of the gypsum component part substantially parallel to the surface, and the second conductive material is arranged substantially parallel to the back surface side of the gypsum component part. The gypsum component is embedded in a main component such as gypsum by mixing a carbon fiber material in a weight ratio of 1 Wt% or more and a carbon material having a particle size of 100 μm or less in a weight ratio of 10 Wt% or more. The distance between the first and second conductive meshes is set to the λ / 4 wavelength of the electromagnetic wave to be shielded or a value close thereto .
The carbon fiber material is a carbon fiber material having a length of 6 mm or less, and the carbon fiber material having a length of 6 mm or less is mixed in the main component such as gypsum at a ratio of 3 Wt% or less by weight. It was.
Further, the size of the mesh opening of the first conductive mesh is different from the size of the mesh opening of the second conductive mesh.
[0005]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a gypsum board according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1A is a partial sectional perspective view of a gypsum board according to an embodiment, and FIG. 1B is a sectional view. The same components as those of the conventional example of FIG.
The gypsum board 1 according to the embodiment has a first conductive mesh 21 embedded in the surface side of the gypsum component 2 and a second conductive mesh 22 embedded in the back side of the gypsum component 2. It is what.
That is, the gypsum board 1 has a mesh double structure in which two conductive meshes are embedded in the thickness direction of the gypsum board 1 so as to be embedded substantially in parallel with the front and back surfaces of the gypsum board 1.
[0006]
The gypsum component 2 is composed of a carbon fiber material having a weight ratio of 10 Wt% and a length of 6 mm of a carbon material having a particle size of 44 μm or less in calcined gypsum in a main component made of slaked lime, dolomite plaster, clay, and an adhesive. It is composed of a mixture of 2 wt% by weight.
The first and second conductive meshes 21 and 22 are made of the conductive material on the surface of a wire made of a conductive material such as gold, silver, steel, stainless steel, aluminum, zinc, nickel, carbon, or polymer fiber. Wires coated with a coating of a conductive material, or those printed with a conductive ink on the back side of a surface finish or those formed in a net shape with a film or the like are used. In the embodiment shown in FIG. 1, the mesh mesh, that is, the first and second conductive meshes 21 and 22 having different mesh opening sizes are used. That is, an example is shown in which the first conductive mesh 21 has a mesh opening larger than that of the second conductive mesh 22.
[0007]
The distance W between the first and second conductive meshes 21 and 22 is set to the λ / 4 wavelength of the shielded electromagnetic wave or a value as close as possible to this.
[0008]
FIG. 2 shows a result of comparing the shielding performance of a single gypsum mesh gypsum board in which a conductive mesh 22 is embedded on the back side of the gypsum component 2 and a gypsum board having a double mesh structure according to the present embodiment.
In FIG. 2, the lower curve is the shielding performance curve of the gypsum board having a single mesh structure, and the upper curve is the shielding performance curve of the gypsum board having a mesh double structure according to this embodiment.
In addition, the structure of the gypsum component 2 and the conductive mesh 22 in the gypsum board having the mesh single structure and the mesh double structure is the same.
[0009]
As apparent from FIG. 2, the gypsum board having a single mesh structure has a value of about 40 dB in the frequency band where the shielding performance is low in the frequency band of 10 MHz to 1000 MHz. The gypsum board has a shielding performance of at least 50 dB against electromagnetic waves in a frequency band of 10 MHz to 1000 MHz. Therefore, the gypsum board 1 that can cope with the case where the required shield performance is 50 dB or more is obtained.
In addition, the shielding performance against electromagnetic waves in the frequency band of 10 MHz to 1000 MHz is improved as a whole compared to a gypsum board with a single mesh structure, and the overall shielding performance is higher than that of a gypsum board with a mesh single structure. A gypsum board 1 is obtained.
[0010]
That is, according to the gypsum board 1 having a mesh double structure according to the embodiment, for example, when an electromagnetic wave of 100 dBμV / m is incident from the surface side of the gypsum board 1, the shielding performance of the first conductive mesh 21 is 20 dB. If present, the electromagnetic wave of 80 dBμV / m is equivalent to being incident on a gypsum board having a mesh single structure having a performance of 40 dB or more, so that the shielding performance is improved as a whole.
[0011]
Further, the electromagnetic wave incident from the surface side of the gypsum board 1 and transmitted through the first conductive mesh 21 reaches the second conductive mesh 22 through gypsum having an electrical surface resistance (about 20Ω). Here, the electromagnetic wave is reflected again on the surface side and enters the gypsum between the first and second conductive meshes 21 and 22. Since this is repeated, the electromagnetic wave absorption performance is improved as compared with the gypsum board having a single mesh structure.
[0012]
Further, since the distance W between the first and second conductive meshes 21 and 22 is set to the λ / 4 wavelength of the electromagnetic wave to be shielded or a value as close as possible to this, the shielding performance and electromagnetic wave absorption performance are high. It becomes gypsum board 1.
[0013]
That is, according to the gypsum board 1 of the present embodiment, the gypsum component 2 having the first and second conductive meshes 21 and 22 is adopted, the gypsum component 2 having high shielding performance is provided, Since the distance W between the first and second conductive meshes 21 and 22 is set to the λ / 4 wavelength of the electromagnetic wave to be shielded or a value as close as possible to this, the gypsum board 1 having high shielding performance and electromagnetic wave absorption performance. Is obtained.
If a room is constructed using the gypsum board 1 according to the embodiment, leakage of electromagnetic waves from the room to the outside or from the outside to the room can be prevented, and electromagnetic waves emitted from the communication device in the room can be absorbed. It becomes possible to prevent malfunction of the device and information transmission error.
[0014]
In the embodiment, the first conductive mesh 21 has a larger mesh opening than the second conductive mesh 22, but the first conductive mesh 21 is the second conductive mesh 22. A smaller mesh opening may be used, or the first and second conductive meshes 21 and 22 having the same mesh opening size may be used.
Also, if the mesh openings of the first and second conductive meshes 21 and 22 are too large, the shielding performance against electromagnetic waves in the frequency band to be shielded may not be satisfied. If it is too small, the gypsum component 2 may peel off due to the conductive mesh. Therefore, it is desirable to set it to about 4 mm square at least.
Further, the first and second conductive meshes 21 and 22 may be made of the same material, or may be made of different materials.
[0015]
The gypsum component 2 may be constituted by mixing a conductive material in a main component such as gypsum. At least, for example, a carbon fiber material having a weight ratio of 1 Wt% or more and a particle size of 100 μm or less is a carbon material. Is preferably mixed with a weight ratio of 10 Wt% or more. In this case, if the weight ratio of the main component of the gypsum component is 50 Wt% or less, the strength of the gypsum component is weakened. Therefore, the weight ratio of the main component is desirably 50 Wt% at least. The carbon fiber material of 6 mm or less is preferably 3 Wt% or less. This is because if a carbon fiber material of 6 mm or more is mixed, or if the weight ratio is 3 Wt% or more, expansion will increase and mixing will not be possible.
[0016]
Although the distance W between the first and second conductive meshes 21 and 22 is set to the λ / 4 wavelength of the electromagnetic wave to be shielded or a value as close as possible to this, the double mesh structure can be used without doing this. The shield performance is improved compared to the gypsum board that adopts the single mesh structure.
[0017]
Moreover, you may employ | adopt the double mesh structure of this application for the gypsum structure part which does not mix electroconductive materials, such as a carbon fiber material and a carbon material. Even if it does in this way, it is because a gypsum board with a high shield performance is obtained compared with the gypsum board which employ | adopted the single mesh structure for the gypsum structure part which does not mix conductive materials, such as a carbon fiber material and a carbon material.
[0018]
In the embodiment, a gypsum board having a double mesh structure has been described as an example. However, in the present application, a gypsum board having the following configuration may be used.
That is, a gypsum board in which a conductive mesh is embedded on the front surface side located inside the room and a conductive sheet formed in a sheet shape on the back surface side located outside the room may be used. Even with this type of gypsum board, leakage of electromagnetic waves from the room to the outside or from the outside to the room can be prevented, and electromagnetic waves emitted from the communication devices in the room can be absorbed, leakage of electromagnetic waves, malfunction of communication devices and information transmission errors. Can be prevented.
Moreover, it is good also as the gypsum board of the double sheet structure which embeded the electroconductive sheet on the surface and the back side, respectively, and even the gypsum board of such a configuration can prevent leakage of electromagnetic waves from the room to the outside or from the outside to the room, Shield performance can be improved.
Furthermore, three or more conductive meshes or conductive sheets embedded substantially parallel to the surface of the gypsum board may be provided in the thickness direction of the gypsum board.
[0019]
【The invention's effect】
As described above, according to the gypsum board according to claim 1 of the present invention , the first conductive mesh is embedded substantially parallel to the surface on the surface side of the gypsum component, and the back surface on the back side of the gypsum component. A second conductive mesh is embedded substantially in parallel with the gypsum component, and the gypsum component is composed of a carbon fiber material having a weight ratio of 1 Wt% or more and a particle size of 100 μm or less of a carbon material in a weight ratio of 10 Wt%. Since it is configured to be mixed and the distance between the first and second conductive meshes is set to the λ / 4 wavelength of the electromagnetic wave to be shielded or a value close thereto , the gypsum has a single mesh structure. A gypsum board with higher shielding performance than the board can be obtained.
Further, the carbon fiber material is a carbon fiber material having a length of 6 mm or less , and the carbon fiber material having a length of 6 mm or less is mixed in a main component such as gypsum at a ratio of 3 Wt% or less by weight. Therefore, the carbon fiber material can be mixed well in the main component, and a gypsum board having high shielding performance can be obtained.
In addition, since the size of the mesh opening of the first conductive mesh and the size of the mesh opening of the second conductive mesh are different, it is possible to obtain a gypsum board having higher shielding performance than a gypsum board having a single mesh structure. it can.
[Brief description of the drawings]
FIG. 1 is a partial sectional perspective view and a sectional view of a gypsum board according to an embodiment of the present invention.
FIG. 2 is a diagram comparing the shielding performance of a gypsum board having a single mesh structure and a gypsum board having a mesh double structure according to an embodiment.
FIG. 3 is a partial sectional perspective view and a sectional view of a conventional gypsum board.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Gypsum board, 2 gypsum component, 21,22 1st, 2nd electroconductive mesh, W The distance between 1st, 2nd electroconductive mesh.

Claims (3)

石膏構成部の表面側に当該表面と略平行に第1の導電性メッシュが埋設されるとともに、石膏構成部の裏面側に当該裏面と略平行に第2の導電性メッシュが埋設され、
上記石膏構成部は、石膏等の主成分中に、炭素繊維材を重量比1Wt%以上及び粒径100μm以下の炭素材を重量比10Wt%以上混入して構成され、
上記第1,第2の導電性メッシュ間の距離が、シールド対象電磁波のλ/4波長あるいはこれに近い値に設定されていることを特徴とする石膏ボード。
A first conductive mesh is embedded substantially parallel to the surface on the surface side of the gypsum component, and a second conductive mesh is embedded substantially parallel to the back surface on the back side of the gypsum component,
The gypsum constituent part is configured by mixing a carbon fiber material in a weight ratio of 1 Wt% or more and a carbon material having a particle size of 100 μm or less in a weight ratio of 10 Wt% or more in a main component such as gypsum,
The gypsum board characterized in that the distance between the first and second conductive meshes is set to a λ / 4 wavelength of the electromagnetic wave to be shielded or a value close thereto.
上記炭素繊維材が長さ6mm以下の炭素繊維材であり、上記石膏等の主成分中に、当該長さ6mm以下の炭素繊維材が重量比3Wt%以下の割合で混入されていることを特徴とする請求項1に記載の石膏ボード。 The carbon fiber material is a carbon fiber material having a length of 6 mm or less, and the carbon fiber material having a length of 6 mm or less is mixed in the main component such as gypsum at a ratio of 3 Wt% or less by weight. The gypsum board according to claim 1. 上記第1の導電性メッシュのメッシュ開口の大きさと上記第2の導電性メッシュのメッシュ開口の大きさとが異なることを特徴とする請求項1又は請求項2に記載の石膏ボード。 The gypsum board according to claim 1 or 2, wherein the size of the mesh opening of the first conductive mesh is different from the size of the mesh opening of the second conductive mesh .
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04319162A (en) * 1991-04-18 1992-11-10 Noritake Co Ltd Architectural decorative material and decorative work of building using the same
JPH10107478A (en) * 1996-09-27 1998-04-24 Yoshino Sekko Kk Radio wave absorbing gypsum board
JP2000178063A (en) * 1998-12-11 2000-06-27 Kumagai Gumi Co Ltd Gypsum board

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0726343Y2 (en) * 1988-12-12 1995-06-14 東レ株式会社 Carbon fiber reinforced inorganic board
JPH10159244A (en) * 1996-12-03 1998-06-16 Tsurutomo Kurita Improving method of productivity and functional physical property in inorganic board for building material

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04319162A (en) * 1991-04-18 1992-11-10 Noritake Co Ltd Architectural decorative material and decorative work of building using the same
JPH10107478A (en) * 1996-09-27 1998-04-24 Yoshino Sekko Kk Radio wave absorbing gypsum board
JP2000178063A (en) * 1998-12-11 2000-06-27 Kumagai Gumi Co Ltd Gypsum board

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