JP4601542B2 - Attachment structure of shield member, shield member, camera device, and method of manufacturing camera device - Google Patents

Description

  The present invention relates to a technique for attaching a shield member so as to cover an imaging element and a substrate.

  In a camera device using an image sensor such as a CCD, it is necessary to take measures against electromagnetic noise from the outside to the inside or from the inside to the outside. As a countermeasure against such noise, there is a configuration in which a shield member is disposed so as to cover the imaging element.

  A configuration shown in FIG. 12 has been proposed as a configuration for fixing the imaging element so as to cover it with a shield member.

  In FIG. 12, the image sensor 102 is mounted and fixed on one main surface of the substrate 100. In addition, a substantially bowl-shaped shield member 104 is disposed so as to cover the imaging element 102 on one main surface side of the substrate 100. The shield member 104 is formed with an opening 104h for allowing the imaging surface 102a of the imaging element 102 to face the outside. Note that optical filters 103 a and 103 b are provided on the imaging surface 102 a of the imaging element 102.

  Further, a boss 112 for screwing is provided upright in a case 110 that accommodates the substrate 100 and the image sensor 102. A lens holder 111 for holding the lens 114 is formed on the front portion of the case 110 so as to protrude. The lens 114 is accommodated and fixed in the lens holder 111.

  In this configuration, the substrate 100, the image sensor 102, and the shield member 104 are assembled to the case 110 as follows.

  That is, the substrate 100 and the shield member 104 are accommodated in the case 110 so that the corner portion of the substrate 100 and the attachment piece 104 </ b> P of the shield member 104 are overlapped on the boss portion 112. Then, the position of the image sensor 102 and the lens 114 is adjusted by moving the substrate 100 in a direction substantially orthogonal to the optical axis of the lens 114. Thereafter, screws (not shown) are passed through the corner portions of the substrate 100 and the attachment pieces 104P of the shield member 104 and screwed and fastened to the boss portion 112 to fix the substrate 100 and the shield member 104 at fixed positions in the case 110. To do.

  However, in the mounting structure of the shield member 104 as described above, the image sensor 102 is movable with respect to the shield member 104 before the substrate 100 and the shield member 104 are fixed to the case 110. . For this reason, when the position of the image sensor 102 is adjusted, the image pickup surface 102a and the optical filters 103a and 103b above the image sensor 102 come into contact with the opening 104h, resulting in attachment or damage of scratches. There is a risk.

  In particular, if the opening 104h of the shield member 104 is set at a position near the upper portion of the image sensor 102 in order to reduce the size, this is likely to occur.

  Therefore, an object of the present invention is to prevent the image sensor from being damaged or damaged due to the contact between the image sensor and the shield member.

The shield member mounting portion structure according to the present invention includes a substrate, an imaging surface, an imaging element fixed to one main surface of the substrate, and an opening that faces the imaging surface to the outside. A shielding member that covers the imaging element with the imaging surface facing outside through an opening, and the shield member is formed in a conical shape that covers the imaging element on one main surface side of the substrate, A shield body having the opening formed therein is provided. The shield body extends from the peripheral edge of the shield main body, contacts the outer peripheral edge of the substrate, and moves the substrate along the direction of the imaging surface of the imaging element. It has a plurality of positioning holding pieces held at a fixed position .

In this case, in the shield member, the shield main body portion and the plurality of positioning holding pieces of the shield member may be formed by pressing a conductive plate material.

  In addition, the shield member may be provided on at least one of the one main surface side portion and the other main surface side portion of the substrate with respect to a portion where the at least one positioning holding piece contacts the peripheral edge portion of the substrate. You may form in the shape dented rather than the part to contact | abut in the part.

  Furthermore, at least one of the positioning holding pieces may include a position regulation step that regulates the movement of the substrate into the shield main body.

  Moreover, the peripheral part of the said opening part may have the bending piece bent outside.

In addition, the shield member according to the present invention covers the image sensor fixed to the substrate and extends from the peripheral part of the shield main body having an opening that exposes the image pickup surface of the image sensor to the outside. And a plurality of positioning holding pieces that are in contact with the outer peripheral edge of the substrate and hold the substrate at a fixed position along the direction of the imaging surface of the imaging device .

The camera device according to the present invention includes a substrate, an imaging surface, an imaging element fixed to one main surface of the substrate, and an opening that faces the imaging surface to the outside. A shield member that covers the imaging element with the imaging surface facing outside, an optical system that guides external light toward the imaging element, and a holder portion that holds the optical system, and the imaging element And a case for accommodating and holding the substrate, the imaging device, and the shield member in a state of being arranged in a predetermined positional relationship with respect to the optical system, and the shield member is one main surface of the substrate A shield body formed on the side to cover the imaging device, and having the opening formed therein, extended from the peripheral edge of the shield main body, and in contact with the outer peripheral edge of the substrate Imaging the imaging device with the substrate Those having a plurality of positioning holding piece for holding in a fixed position along the direction.

  Furthermore, in the method of manufacturing a camera device according to the present invention, the substrate is held by the substrate holding means, and the step of temporarily holding the shield member, the substrate and the shield member temporarily held by the substrate, A step of accommodating and arranging in the case, and a position where the substrate is moved together with the shield member so that the imaging element is arranged in the predetermined positional relationship with respect to the optical system held by the holder. A step of adjusting, and a step of permanently fixing the substrate and the shield member to the case in the state where the position is adjusted.

  According to the shield member mounting portion structure of the present invention, since the shield member has the substrate holding means for holding the substrate at a fixed position along at least the direction of the imaging surface of the imaging device, the substrate is fixed to the substrate. The image pickup element thus held is held at a fixed position along at least the direction of the image pickup surface with respect to the shield member. Therefore, it becomes difficult for the image sensor to come into contact with the peripheral edge of the opening, and it is possible to effectively prevent the image sensor from being damaged or damaged due to the contact between the image sensor and the shield member.

  The shield member includes a container-shaped shield main body that covers the imaging element on one main surface side of the substrate, and extends as a substrate holding means from a peripheral portion of the shield main body. If there are a plurality of positioning holding pieces that hold the substrate at a fixed position along the direction of the imaging surface of the imaging device by contacting the outer peripheral edge of the imaging device, the peripheral edge of the substrate is brought into contact with the positioning holding piece. Thereby, a board | substrate can be hold | maintained in a fixed position along the direction of the imaging surface of an image pick-up element.

  Further, the shield member may be provided on at least one of the one main surface side portion and the other main surface side portion of the substrate with respect to a portion where the at least one positioning holding piece abuts on a peripheral edge portion of the substrate. If the portion is formed in a shape that is recessed from the abutting portion, interference between the component mounted on the substrate and the shield member can be effectively prevented.

  Further, when at least one of the positioning holding pieces has a position regulation step that regulates the movement of the substrate into the shield main body, the substrate is prevented from entering the shield main body, and the shield The member and the substrate can be kept in a more constant posture.

  If the peripheral portion of the opening has a bent piece bent outward, the peripheral portion of the opening can be finished into a gently curved surface. Therefore, even if the image sensor and the peripheral edge of the opening are in contact with each other, it is possible to more effectively prevent the image sensor from being damaged or damaged.

  According to the shield member of the present invention, since the shield member has substrate holding means for holding the substrate at a fixed position along at least the direction of the imaging surface of the image sensor, the substrate and the image sensor fixed thereto Is held at a certain position along at least the direction of the imaging surface with respect to the shield member. Therefore, it becomes difficult for the image sensor to come into contact with the peripheral edge of the opening, and it is possible to effectively prevent the image sensor from being damaged or damaged due to the contact between the image sensor and the shield member.

  Further, according to the camera device of the present invention, the shield member has the substrate holding means for holding the substrate at a fixed position along at least the direction of the imaging surface of the imaging element. Even when the position of the image sensor is adjusted so as to be arranged in a predetermined positional relationship with respect to the system, the substrate and the image sensor fixed thereto are constant along the direction of the image sensing surface at least with respect to the shield member Held in position. Therefore, it is possible to effectively prevent the image sensor from being damaged or damaged due to the contact between the image sensor and the shield member.

  Further, according to the manufacturing method of the camera device according to the present invention, the step of temporarily holding the substrate by the substrate holding means so that the substrate is held by the substrate holding means, the substrate and the shield member temporarily held by the substrate, And moving the substrate together with the shield member so that the imaging device is disposed in the predetermined positional relationship with respect to the optical system held by the holder. Since the method includes the step of adjusting the position and the step of permanently fixing the substrate and the shield member to the case in the position-adjusted state, the imaging element is less likely to contact the peripheral edge of the opening, and imaging The contact between the element and the shield member can effectively prevent the imaging element from being damaged or damaged.

  Hereinafter, a camera device to which a shield member and its attachment structure according to the present invention are applied will be described.

  FIG. 1 is an exploded perspective view showing the camera device, and FIG. 2 is an exploded perspective view showing a shield member, a substrate, and a front case portion of the camera device.

  This camera device is installed in a vehicle and images the surrounding scenery of the vehicle, and more specifically, is installed in the front part of the vehicle and images both left and right side scenery of the vehicle. The image captured by the camera device is displayed on, for example, a liquid crystal display device or the like installed in the vehicle, and is used for purposes such as monitoring a landscape that is a blind spot around the vehicle in the passenger compartment. Of course, the present invention is not limited to a camera device for a vehicle, and can be applied to any electronic camera that performs imaging with an image sensor.

  The basic configuration of the camera device will be described. The board unit 10, the image sensor 20, the shield member 30 that covers the image sensor 20, the optical system 40 that guides external light toward the image sensor 20, and the board unit 10. The image pickup device 20 and the shield member 30 are accommodated and disposed inside, and a case 50 for holding the optical system 40 is provided. For convenience of explanation, the image side of the optical system 40 is assumed to be the front, and the imaging element 20 side is assumed to be the rear.

  The board unit 10 includes a main board 12 and a sub board 14 provided in a stacked form. An imaging element 20 is mounted and fixed at a substantially central portion of one main surface (front surface) of the main substrate 12. In addition, a predetermined circuit pattern is formed on each of the substrates 12 and 14 and electronic components such as a semiconductor chip are mounted to form a drive circuit, a control circuit, a power supply circuit, and the like for the image sensor 20.

  The main board 12 is formed with a screw insertion hole 12h for fixing the board unit 10. Here, screw insertion holes 12 h are formed in two corner portions facing each other in the main substrate 12.

  As the image pickup device 20, a CCD or the like is used, and in a state where the image pickup surface 21 is mounted and fixed on one main surface of the main substrate 12, the image pickup surface 21 is disposed substantially in parallel along the main substrate 12 (an optical system). 40 side). The imaging element 20 includes an optical filter 22 such as a low pass filter or an IR cut filter on the imaging surface 21.

  The shield member 30 is a member that covers the imaging element 20 on one main surface side of the main substrate 12, and has an opening 32 h corresponding to the imaging surface 21. The imaging surface 21 is exposed to the outside through the opening 32h in a state where the shield member 30 covers the imaging element 20 and the both are attached and fixed.

  The case 50 includes a rear case 52 and a front case 54, and each of the rear case 52 and the front case 54 has a substantially bowl-shaped accommodation space. Then, the rear case 52 and the front case 54 are united and fixed by the screw S1 with packing or the like interposed therebetween.

  A boss portion 54 a for fixing the substrate unit 10 and the shield member 30 is formed inside the front case 54. Here, two boss portions 54 a are formed at two corner portions facing each other in the internal space of the front case 54. A screw screw hole 54ah is formed in each boss portion 54a.

  The substrate unit 10, the image sensor 20, and the shield member 30 are housed and held in a housing space between the rear case 52 and the front case 54 while being fixed to the front case 54. In addition, the wiring to the outside extended from the board | substrate unit 10 penetrates the rear side case 52, and is withdraw | derived to the exterior, for example.

  A substantially cylindrical holder portion 55 that holds the optical system 40 is provided on the front side of the front case 54. The image sensor 20 is disposed in the case 50 so as to face the opening in the holder portion 55.

  The optical system 40 is composed of a single lens or a plurality of lenses, and has a desired optical characteristic according to a desired range for imaging, for example, a characteristic for coupling light from a wide angle range to the imaging surface 21. Yes. The optical system 40 is inserted into the holder portion 55 from the front and is fixed at a fixed position inside.

  The image pickup device 20 is arranged so as to have a predetermined positional relationship with respect to the optical system 40, and images a predetermined range of external scenery through the optical system 40.

  Note that the optical system 40 may include a reflecting mirror, a prism, and the like in addition to the lens. In addition, the predetermined positional relationship of the imaging device 20 with respect to the optical system 40 is such that the central axis of the optical system coincides with the central axis of the imaging surface 21 of the imaging device 20 and the positional relationship is shifted by a predetermined amount in a predetermined direction. It can be arbitrarily set according to the imaging range.

  The shield member 30 will be described in more detail. 3 is a bottom view showing the shield member, FIG. 4 is a side view of the shield member viewed from one side surface direction (from the upper direction in FIG. 3), and FIG. 5 is a side view in the other side surface direction (FIG. 3). 6 is a sectional view taken along line VI-VI in FIG. 3, and FIG. 7 is a sectional view taken along line VII-VII in FIG.

  As shown in FIGS. 1-7, the shield member 30 is formed of a conductive member. Here, it is formed by pressing a conductive plate material such as SUS alloy.

  The shield member 30 includes a shield body portion 32 and positioning holding pieces 36, 37, 38, 39.

  The shield main body 32 is formed in a bowl shape that covers the image pickup device 20 on one main surface side of the main substrate 12. Here, the shield main body 32 is formed in a substantially rectangular parallelepiped shape with one opening. The main substrate 12 is disposed at the opening of the shield main body 32 so as to close the opening, and the image sensor 20 is accommodated in the shield main body 32.

  More specifically, the shield body 32 includes a substantially rectangular main plate 32a and side plates 32b extending substantially perpendicular to the main plate 32a on each of the four sides of the main plate 32a.

  An opening 32h corresponding to the imaging surface 21 is formed in the main plate 32a. The opening 32 h is formed in a size and shape that can accommodate the optical filter 22 on the top of the image sensor 20.

  Further, a bent piece 32hp is extended so as to be bent outward from the four peripheral edges of the opening 32h in the main plate 32a. Thereby, it is comprised so that the peripheral part of the opening part 32h may be comprised by the curved surface of the bending part outer periphery side of the bending piece 32hp.

  Each side plate 32b is formed narrower than each side of the main plate 32a. In the two corner portions facing each other in the shield main body 32, adjacent side plates 32b are connected to each other via a swash plate 32c.

  In addition, two attachment pieces 33 are provided at the other two corner portions facing each other in the shield main body 32. Each attachment piece 33 is disposed so as to extend into the shield main body 32 in a posture substantially parallel to the main plate 32a at a position away from the main plate 32a by a support piece extending from the side of each side plate 32b. . Then, in a state where the main board 12 is disposed in the rear opening of the shield main body 32, each mounting piece 33 and a position regulating step part 37a to be described later abut against one main surface of the main board 12, and the main board 12 is maintained at a fixed position behind the opening 32h. In this state, the opening 32 h is disposed at a position surrounding the peripheral edge of the front surface portion of the optical filter 22, which is the upper part of the image sensor 20. Thereby, the height dimension of the shield main body 32 can be set to the minimum size according to the height dimension of the image pickup device 20, and the shield member 30 can be reduced in size, and hence the camera device itself can be reduced in size. To contribute.

  Each attachment piece 33 is formed with a screw insertion hole 33h. Then, in a state where the screw insertion hole 12h of the main board 12 and the main screw insertion hole 33h are arranged so as to overlap each other, the corner portion of the main board 12 and the mounting piece 33 are arranged in a superposed manner on the boss portion 54a. It is set up.

  The positioning holding pieces 36, 37, 38, 39 are members that function as substrate holding means for holding the main substrate 12 at a fixed position along at least the direction of the imaging surface 21 of the imaging device 20.

  Each positioning holding piece 36, 37, 38, 39 is a plate-like member that extends rearward from each side plate 32 b that is a peripheral portion of the shield main body 32. Each positioning holding piece 36, 37, 38, 39 is configured to contact the outer peripheral edge of the main substrate 12 and hold the main substrate 12 at a fixed position along the direction of the imaging surface 21.

  Here, between the base end side parts (that is, the rear part of each mounting piece 33) of the opposing positioning holding pieces 36 and 38, and the base end side parts (that is, each of the positioning positioning pieces 37 and 39 facing each other) The space between the rear portions of the mounting pieces 33 is formed to have substantially the same distance as the vertical dimension or horizontal dimension of the main board 12. Then, in a state where one main surface of the main substrate 12 is disposed so as to contact the mounting piece 33, the four sides around the main substrate 12 are the inner surfaces of the base end side portions of the positioning holding pieces 36, 37, 38, 39. The main substrate 12 is restricted from moving in the direction of one main surface.

  Further, in this shield member 30, the portions 36a and 38a where the two opposing positioning holding pieces 36 and 38 abut against the main substrate 12 are compared with the portions 36b and 38b on the one main surface side of the main substrate 12, respectively. It is formed in a shape that is recessed from the abutting portions 36a, 38a (see FIG. 6). As a result, the space on the one main surface side of the main board 12 is expanded by the concave shape inside the shield member 30, and various electronic components mounted on the main board 12 interfere with the side plate 32 b of the shield member 30. I try to prevent it.

  In the shield member 30, the concave shape is formed with respect to the two positioning holding pieces 36, 38. However, the concave shape is formed with respect to at least one of the positioning holding pieces 36, 37, 38, 39. It may be. Further, the portion on the other main surface side of the main substrate 12 relative to the abutting portions 36a, 38a may be formed in the concave shape.

  Furthermore, the positioning holding piece 37 has a position restricting step 37a that restricts the main substrate 12 from moving into the shield body 32 (see FIG. 7). More specifically, the positioning holding piece 37 spreads outward from the side plate 32b on the base end side in a stepped manner, and a position regulating step 37a is provided between the positioning holding piece 37 and the side plate 32b. Is formed. The position restricting step portion 37 a has a receiving surface 37 b facing the back of the shield member 30, and the receiving surface 37 b is disposed on substantially the same plane as the receiving surface of the mounting piece 33. Each mounting piece 33 and the position restricting step 37a abut against the peripheral portion of one main surface of the main substrate 12 to restrict the main substrate 12 from moving into the shield main body 32. .

  The position restricting step portion 37a may be configured by a linearly extending protrusion, or may be formed on other position determination holding pieces 36, 38, 39.

  Moreover, the front-end | tip part of each positioning holding piece 36, 37, 38, 39 is bent so that it may spread outward. As a result, the main board 12 can be easily disposed between the positioning holding pieces 36, 37, 38, 39.

  A method of manufacturing the camera device configured as described above will be described.

  First, as shown in FIG. 8, the front case 54, the shield member 30, and the board unit 10 are prepared.

  As shown in FIG. 9, one main surface of the main board 12 is brought into contact with each mounting piece 33 and the position restricting step portion 37 a, and the four sides around the main board 12 are set to the positioning holding pieces 36, 37, The image pickup device 20 is accommodated in the shield main body 32 of the shield member 30 so as to be in contact with the inner surfaces of the base end portions of 38 and 39. Thus, the substrate unit 10 is temporarily attached to the shield member 30 in a state where the main substrate 12 is held at a fixed position with respect to the direction of the imaging surface 21 and the main substrate 12 is restricted from moving into the shield main body 32. Retained. In this state, the presence or absence of scratches on the imaging surface 21 and the optical filter 22 can be visually confirmed.

  At this time, since the positioning holding pieces 36, 37, 38, 39 are in contact with the four sides around the main substrate 12, the imaging element 20 is disposed in a fixed positional relationship in the direction of the imaging surface 21 with respect to the shield member 30. Is done. Accordingly, the image pickup surface 21 and the optical filter 22 at the upper part of the image pickup device 20 are accurately disposed in the corresponding region of the opening 32h, and the image pickup surface 21 and the optical filter 22 are unlikely to contact the peripheral edge of the opening 32h. In addition, since the bent piece 32hp is formed at the peripheral portion of the opening 32h, even if the imaging surface 21 and the optical filter 22 are in contact with the peripheral portion of the opening 32h, they are in contact with the curved surface of the bent piece 32hp. As a result, the imaging surface 21 and the optical filter 22 are hardly damaged.

  Next, as shown in FIG. 10, the shield member 30 and the board unit 10 are accommodated in the front case 54 such that the two mounting pieces 33 and the two corner parts of the main board 12 are superimposed on the boss part 54a. It is accommodated in the recess. Then, the substrate unit 10 is moved along the direction of the imaging surface 21, and the position adjustment is performed so that the imaging element 20 is disposed in a predetermined positional relationship with respect to the optical system 40. Note that the optical system 40 is fixed in the holder portion 55 in the previous step.

  When performing the position adjustment, the main board 12 is held at a fixed position in the direction of the imaging surface 21 with respect to the shield member 30, so that the shield member 30 also moves with the board unit 10. For this reason, the relative positional relationship between the imaging surface 21 and the optical filter 22 at the upper part of the imaging device 20 and the opening 32h is difficult to shift, and the imaging surface 21 and the optical filter 22 are unlikely to contact the opening 32h.

  And after performing the said position adjustment, as shown in FIG. 11, the screw S2 is penetrated to the screw penetration hole 12h of the main board 12, and the screw penetration hole 33h of each attachment piece 33, and a screw hole is made to the boss | hub part 54a. Fastened with screws. As a result, the board unit 10 and the shield member 30 are attached and fixed to the front case 54.

  Thereafter, the front case 54 and the rear case 52 are combined and fixed by the screw S1. Thereby, manufacture of a camera apparatus is completed.

  According to the camera device configured as described above, the shield member 30 includes the positioning holding piece 36 as substrate holding means for holding the main substrate 12 at a fixed position along at least the direction of the imaging surface 21 of the imaging device 20. 37, 38, and 39, the main substrate 12 and the image sensor 20 fixed thereto are held at a fixed position with respect to the shield member 30 at least along the direction of the imaging surface 21. Therefore, when the image sensor 20 is assembled to the shield member 30 or when the position of the image sensor 20 is adjusted, the image sensor 20 is less likely to contact the peripheral edge of the opening 32h. Thereby, it is possible to effectively prevent the imaging element 20, in particular, the imaging surface 21 and the optical filter 22 above the imaging element 20 from being damaged or damaged due to the contact between the imaging element 20 and the shield member 30.

  In this embodiment, the four positioning holding pieces 36, 37, 38, 39 are brought into contact with the four sides around the substantially rectangular main substrate 12 to position the main substrate 12. This is not always necessary. For example, a positioning holding piece having a substantially L-shaped cross section may be brought into contact with an opposing corner portion of the substrate 12 so as to position the substrate 12.

  Further, the shield member 30 has a portion 36a, 38a where the positioning holding pieces 36, 38 abut against the peripheral edge portion of the main substrate 12, and a portion 36a, 38a that abuts on the one main surface side portion of the main substrate 12. Further, since the concave portions 36 b and 38 b are formed, the interference between the components mounted on the main board 12 and the shield member 30 can be effectively prevented.

  Further, since the positioning holding piece 37 has a position regulation step portion 37a for restricting the main board 12 from moving into the shield main body 32, the main board 12 is prevented from entering the shield main body 32. By effectively regulating, the shield member 30 and the main board 12 can be kept in a more fixed positional relationship.

  In particular, in this embodiment, two mounting pieces 33 are provided to support the two corner portions of the main board 12. However, in the configuration in which the main board 12 is supported at two points by the two mounting pieces 33, the main board is used. There is a possibility that 12 is inclined obliquely. Therefore, the main substrate 12 can be stably supported by supporting at least three locations together with the support by the position regulation step portion 37a.

  Furthermore, since the peripheral part of the opening part 32h has the bending piece 32hp bent outward, the peripheral part of the opening part 32h can be comprised by the curved surface of the bending piece 32hp. Therefore, even if the image pickup surface 21 and the optical filter 22 on the upper part of the image pickup device 20 come into contact with the peripheral edge portion of the opening 32h, they can be more effectively prevented from being damaged or damaged.

  Moreover, since this bending piece 32hp is extended outside from the peripheral part of the opening part 32h, the area | region four directions above the imaging surface 21 can be covered with a conductive member, and more excellent shielding performance can be obtained. .

It is a disassembled perspective view which shows the camera apparatus which concerns on embodiment. It is a disassembled perspective view which shows the shield member, board | substrate, and front case part of a camera apparatus same as the above. It is a bottom view which shows a shield member. It is the side view which looked at the shield member from one side. It is the side view which looked at the shield member from the other side surface direction. It is the VI-VI sectional view taken on the line of FIG. It is the VII-VII sectional view taken on the line of FIG. It is a figure which shows the manufacturing process of a camera apparatus. It is a figure which shows the manufacturing process of a camera apparatus. It is a figure which shows the manufacturing process of a camera apparatus. It is a figure which shows the manufacturing process of a camera apparatus. It is a figure which shows the camera apparatus which concerns on background art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Board | substrate unit 12 Main board 12h Screw insertion hole 20 Image pick-up element 21 Imaging surface 22 Optical filter 30 Shield member 32h Opening part 32hp Bending piece 33 Mounting piece 36, 37, 38, 39 Positioning holding piece 36a, 38a Contact part 36b, 38b Recessed portion 37a Position regulating step 40 Optical system 50 Case 54 Front case

Claims (8)

A substrate,
An imaging device having an imaging surface and fixed to one principal surface of the substrate;
A shield member that covers the image sensor in a state where the imaging surface is exposed to the outside through the opening having the opening facing the imaging surface to the outside;
With
The shield member is
A shield body that is formed in a conical shape that covers the imaging element on the one main surface side of the substrate and has the opening formed therein,
A plurality of positioning holding pieces that extend from the peripheral edge of the shield main body and hold the substrate at a fixed position along the direction of the imaging surface of the imaging element in contact with the outer peripheral edge of the substrate; Mounting structure of shield member. The shield member mounting portion structure according to claim 1,
The shield body mounting portion structure of the shield member, wherein the shield main body portion and the plurality of positioning holding pieces of the shield member are formed by pressing a conductive plate material . The shield member mounting portion structure according to claim 1 or claim 2,
The shield member is
From at least one of the first main surface side portion and the other main surface side portion of the substrate in contact with the portion where the at least one positioning holding piece contacts the peripheral edge of the substrate. The shield member mounting portion structure is also formed in a concave shape. It is the attachment part structure of the shield member in any one of Claims 1-3 ,
At least one of the positioning holding pieces has a shield member mounting part structure having a position regulation step part that regulates movement of the substrate into the shield main body part. It is the attachment part structure of the shield member in any one of Claims 1-4,
The peripheral part of the said opening part is an attaching part structure of a shield member which has the bending piece bent outside. A shield body having an opening that covers the imaging device fixed to the substrate and faces the imaging surface of the imaging device to the outside ;
A plurality of positioning holding pieces that extend from the peripheral edge of the shield main body, abut against the outer peripheral edge of the substrate, and hold the substrate at a fixed position along the direction of the imaging surface of the imaging element;
Shield member with A substrate,
An imaging device having an imaging surface and fixed to one main surface of the substrate;
A shield member that covers the image sensor in a state where the imaging surface is exposed to the outside through the opening having the opening facing the imaging surface to the outside;
An optical system for guiding external light toward the image sensor;
A case for holding and holding the substrate, the imaging element, and the shield member in a state having a holder portion that holds the optical system, and the imaging element is disposed in a predetermined positional relationship with the optical system; ,
With
The shield member is
A shield body that is formed in a conical shape that covers the imaging element on the one main surface side of the substrate and has the opening formed therein,
A plurality of positioning holding pieces that extend from the peripheral edge of the shield main body and hold the substrate at a fixed position along the direction of the imaging surface of the imaging element in contact with the outer peripheral edge of the substrate; Camera device. It is a manufacturing method of the camera device according to claim 7,
Temporarily holding the shield member so that the substrate is held by the substrate holding means;
Accommodating and arranging the substrate and the shield member temporarily held therein in the case;
A step of adjusting the position by moving the substrate together with the shield member so that the imaging element is disposed in the predetermined positional relationship with respect to the optical system held by the holder;
A step of permanently fixing the substrate and the shield member to the case in the adjusted state;
A method for manufacturing a camera device comprising:

Images