JP4594871B2 - Ion generator - Google Patents

Description

  The present invention provides a primary side circuit for supplying low voltage power to a primary side winding of a booster coil, and a secondary side for supplying a high voltage output from the secondary side winding of the booster coil to a discharge electrode. The present invention relates to an ion generation device including a circuit.

  A conventional ion generator of this type receives supply of low-voltage AC power from the outside and supplies the AC power to the primary side of the booster coil. Then, high voltage AC power boosted from the secondary side is output. The output AC power is supplied to the discharge electrode via the secondary circuit. When high-voltage AC power is supplied to the discharge electrodes, a discharge is generated between the pair of discharge electrodes, and as a result, ions are released into the air.

The primary side circuit, the secondary side circuit, and the booster coil are mounted on one circuit board and unitized, and the unitized one circuit board is set in the casing. (For example, refer to Patent Document 1).
JP 2003-45611 A (FIG. 1)

  When setting the circuit board in the casing, it is necessary to secure a space for the electronic components mounted on the circuit board or to secure a space for wiring. Space must be provided. Further, in the conventional ion generator, since the booster coil is mounted on one circuit board, in order to set the circuit board in the casing, the height of the booster coil is added to the thickness of the circuit board. In addition to the dimensions, since a space to be secured is required on the surface side of the circuit board where the booster coil is not attached, the depth of the casing is increased. Therefore, the malfunction that a casing cannot be reduced in size arises. If the booster coil is simply removed from the circuit board and stored in a separate position in the casing, the wiring of the primary side circuit or the secondary side circuit and the booster coil becomes long, and the design of the circuit board becomes troublesome. A new problem occurs.

  Then, this invention makes it a subject to provide the ion generator which can reduce a casing in size, without producing the above-mentioned new malfunction in view of said problem.

In order to solve the above problems, an ion generator according to the present invention outputs a primary side circuit that supplies low voltage power to a primary side winding of a booster coil, and a secondary side winding of the booster coil. and a secondary circuit for supplying a high voltage to the discharge electrode, an ion generator for generating ions by a discharge in the discharge electrodes, the primary circuit board primary circuit is mounted and the secondary side A circuit board on which a secondary circuit board on which a circuit is mounted is formed separately, and is set in a casing so that the booster coil is sandwiched between the primary circuit board and the secondary circuit board. The terminals of the booster coil connected to the circuit board are parallel to each circuit board and pass through the bobbin of the booster coil, and one of the circuit boards is connected to one end of the terminal, and the booster coil is connected to the other end. It is characterized by connecting the windings .

  By dividing the circuit board into a primary side and a secondary side and sandwiching the booster coil between both circuit boards, the height of the booster coil from the surface of the circuit board is lowered. For this reason, it is not necessary to deepen the casing, and the casing can be reduced in size. By arranging the booster coil between the primary side circuit board and the secondary side circuit board, it is possible to arrange each electronic component including the booster coil according to the circuit diagram. The connection between the substrate and the booster coil can be made at the shortest distance.

  In order to reduce the size of the casing, it is desirable to make the booster coil as small as possible. In order to reduce the size of the booster coil, it is necessary to make the winding thinner. However, if the winding becomes thinner, the winding connected to the terminal protruding from the bobbin is likely to break due to deformation such as bending. To do.

  Therefore, the terminal of the booster coil connected to each circuit board is provided parallel to each circuit board and passing through the bobbin of the booster coil, and one of the circuit boards is connected to one end side of this terminal, It is desirable to connect the winding of the boosting coil to the other end side. If comprised in this way, even if the one end side connected to a circuit board deform | transforms, the influence of the deformation | transformation does not reach the other end side, and the possibility that a winding will break will reduce.

  When a large electronic component has to be mounted on the circuit board, downsizing of the casing is hindered by the electronic component. Therefore, an electronic component having a cylindrical main body is attached to at least one of the two circuit boards so that the axis of the main body is parallel to the circuit board, and the circuit board has an opening into which the main body is dropped. It is desirable to configure so as to be formed.

  On the outer surface of the bottom of the casing, there is formed an electrode mounting portion having a depth the same as the thickness of the discharge electrode, into which the discharge electrode is fitted, and in the state where the discharge electrode is fitted into the electrode mounting portion, A sealing member that covers a boundary portion with the discharge electrode and that can be printed on the surface may be attached.

  In addition, a power supply electrode for supplying a low voltage electrode from the outside to the primary circuit is fixed in advance to the casing, and the primary circuit board is slid toward the power supply electrode in the casing. The terminal may be mounted on the primary circuit board.

  By the way, when the potting coil is placed in the central part of the casing and the resin is poured into the casing and potting is performed, the resin rises due to the surface tension along the inner wall of the casing, and conversely, the liquid level of the resin in the central part is The phenomenon of dents occurs. Therefore, the booster coil is easily exposed from the resin.

  In such a case, with the booster coil set in the casing, a plate-shaped saddle member that covers the booster coil is attached, and resin is filled in the casing until it comes into contact with the saddle member, What is necessary is just to pot a circuit board and a step-up coil.

  Since the resin adheres to the flange member when it comes into contact with the flange member, the liquid level of the resin around the flange member rises. For this reason, the step-up coil is completely covered with the flange member and the resin around the flange member, and is not exposed to the outside.

  As is clear from the above description, the present invention arranges the booster coil without taking an unreasonable layout with respect to the primary side circuit and the secondary side circuit, and accommodates the circuit board and the both-pressure coil. Therefore, the casing can be downsized.

  Referring to FIG. 1, reference numeral 1 denotes a primary circuit for supplying low voltage AC power supplied from an AC power supply B to the primary side of the booster coil 2. High voltage AC power is output from the secondary side of the booster coil 2 and supplied to the secondary side circuit 3. The high-voltage AC power is supplied to the discharge electrode 4, and discharge is generated at the discharge electrode 4, whereby ions are generated and the ions are diffused into the air.

  Referring to FIG. 2, the primary circuit 1 is formed on the primary circuit board 10, and the secondary circuit 3 is formed on the secondary circuit board 30. Reference numeral 5 denotes a bottomed casing that opens upward, and is formed by injection molding using resin as a raw material. When this resin is injection-molded, a power supply terminal 51 that is fed from an external AC power source B is provided integrally with the casing 5. An output electrode 52 that supplies AC power output from the secondary circuit board 30 to the discharge electrode 4 is also provided integrally with the casing 5.

  Incidentally, a diode 32 is attached to the secondary circuit board 30, but a rectangular opening 33 is provided at a position where the diode 32 is attached, and a part of the body of the diode 32 is dropped into the opening 33. The height from the surface of the secondary circuit board 30 to the upper end of the main body of the diode 32 was made low.

  An input terminal 11 is attached to the primary circuit board 10. The primary circuit board 10 is set in the casing 5 closer to the center than the final mounting position, and the primary circuit board 10 is fed so that the feed terminal 51 is engaged with the input terminal 11 in this state. It was made to slide to the terminal 51 side. When the primary circuit board 10 is set at a predetermined position in this way, the secondary circuit board 30 is set in the casing 5 next. At that time, the output electrode 52 is inserted into the hole 34 provided in the secondary circuit board 30 so that the secondary circuit board 30 is set in the casing 5, and then the land surrounding the hole 34 and the output terminal 52 are arranged. Solder.

  Then, after setting the primary circuit board 10 and the secondary circuit board 30 in the casing 5, the booster coil 2 is set in the casing 5. As shown in FIG. 3, the booster coil 2 includes a pair of input terminals 23 a that pass through the bobbin 21 and a pair of output terminals 24 a that also pass through the bobbin 21. The winding of the primary coil is connected to the other end 23b of the input terminal 23a, and the winding of the secondary coil 24 is connected to the other end 24b of the output terminal 24a.

  When the booster coil 2 is inserted into the casing 5 from above, the input terminal 23a is engaged with the output terminal 12 of the primary circuit board 10, and one of the output terminals 24a of the booster coil 2 is the secondary circuit board. 30 input terminals 31 are engaged.

  Reference numeral 53 denotes an output terminal that forms a pair with the output terminal 52, and is inserted from the outside into a slit-shaped opening 53 a formed at the bottom of the casing 5 and fixed to the casing 5 as shown in FIG. 4. The other output terminal 24 a of the booster coil 2 is engaged with the output terminal 53.

  With reference to FIG. 4, reference numeral 40 denotes a discharge electrode plate on which the discharge electrode 4 is formed, and is fitted into a discharge electrode plate mounting portion 50 formed on the outer surface of the bottom of the casing 5. However, a pair of terminals are formed on the back surface of the discharge electrode plate 40. After connecting these terminals and the output terminals 52 and 53 with lead wires, the discharge electrode plate 40 is connected to the discharge electrode plate mounting portion 50. I tried to fit it in.

  After the discharge electrode plate 40 was fitted, a seal 7 was attached to close the gap between the discharge electrode plate 40 and the casing 5. It is possible to print on the surface of the seal 7. For example, if characters such as “high pressure caution” are printed as shown in the figure, it is not necessary to attach a separate seal for a caution note.

  Finally, after attaching the eaves member 6 to the pair of bosses 22 formed on the bobbin 21 of the booster coil 2, potting is performed by injecting urethane resin into the casing 5. At that time, as shown in FIG. 5, the resin is injected until the surface S of the resin comes into contact with the flange member 6. Then, the resin adheres to the flange member 6, the surface S around the flange member 6 is raised, and the booster coil 2 can be completely covered with the resin and the flange member 6. Reference numeral 41 denotes a lead wire.

  In addition, this invention is not limited to an above-described form, You may add a various change in the range which does not deviate from the summary of this invention.

Circuit diagram of an ion generator to which the present invention is applied Diagram showing assembly process of ion generator Diagram showing the configuration of the booster coil The figure which shows the attachment process of a discharge electrode plate Cross section of ion generator

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Primary side circuit 2 Boost coil 3 Secondary side circuit 4 Discharge electrode 5 Casing 40 Discharge electrode plate

Claims (5)

A primary circuit for supplying low-voltage power to the primary winding of the booster coil; and a secondary circuit for supplying a high voltage output from the secondary winding of the booster coil to the discharge electrode. , an ion generator for generating ions by a discharge in the discharge electrode, forming a secondary circuit board primary circuit board and the secondary circuit the primary side circuit is mounted are mounted separately In the casing, the booster coil is set to be sandwiched between the primary circuit board and the secondary circuit board, and the terminals of the booster coil connected to the circuit boards are parallel to the circuit boards. An ion generator characterized in that a bobbin of the booster coil is provided so as to pass through, one of the circuit boards is connected to one end of the terminal, and a winding of the booster coil is connected to the other end . At least one of the circuit boards is mounted with an electronic component having a cylindrical body so that the axis of the body is parallel to the circuit board, and the circuit board has an opening into which the body is dropped. The ion generator according to claim 1, wherein: On the outer surface of the bottom of the casing, an electrode mounting portion having a depth the same as the thickness of the discharge electrode is formed, into which the discharge electrode is fitted. The ion generator according to claim 1 or 2, wherein a sealing member that covers a boundary portion with the discharge electrode is attached with a sealable member on the surface. The power supply electrode for supplying an external low-voltage electrode to the primary circuit is fixed in advance to the casing, and the terminal connected by sliding the primary circuit board toward the power supply electrode in the casing The ion generator according to any one of claims 1 to 3 , wherein the ion generator is mounted on a primary circuit board. With the booster coil set in the casing, a plate-shaped saddle member covering the booster coil is attached, and the casing is filled with resin until it comes into contact with the saddle member, and the circuit boards and booster coils are potted. The ion generator according to any one of claims 1 to 4 , wherein:

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