JP4583549B2 - Catalyst removal solution and removal method for printed wiring board - Google Patents
Catalyst removal solution and removal method for printed wiring board Download PDFInfo
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- JP4583549B2 JP4583549B2 JP2000156088A JP2000156088A JP4583549B2 JP 4583549 B2 JP4583549 B2 JP 4583549B2 JP 2000156088 A JP2000156088 A JP 2000156088A JP 2000156088 A JP2000156088 A JP 2000156088A JP 4583549 B2 JP4583549 B2 JP 4583549B2
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Description
【０００１】
【発明の属する技術分野】
本発明は金属導体回路を形成後に絶縁層表面に残留する無電解めっきの触媒を除去するプリント配線板の除去液に関する。
【０００２】
【従来の技術】
プリント配線板の製造工程において、ダイレクトプレーティングや無電解銅めっき前処理として、プリント配線板の絶縁層表面には触媒が付与される。この触媒化処理後、無電解銅めっきを析出させ、更に電気銅めっきを施し、銅めっき層を形成する。又更に導体回路となる部分をエッチングレジスト膜で覆い、これ以外の部分をエッチングにより除去した後、エッチングレジスト膜を除去し、導体回路を形成している。
【０００３】
この際に使用されている触媒の作用は、不導体である絶縁層表面にキャタリスト−アクセレータ法等の化学還元反応（Ｓｎ2+＋Ｐｄ2+→Ｓｎ4+＋Ｐｄ0）により金属パラジウムを析出させるものである。
【０００４】
（従来技術の問題点）
このような従来技術ではエッチングレジストを剥離し、導体回路を形成した場合に、露出した絶縁層表面には、前記の触媒が残留している為、絶縁不良あるいは短絡（ショート）等を生じやすくなり、更に幅の狭い微細（ファイン）な回路に伴い、プリント配線板の絶縁性が著しく低下する問題があった。又、導体回路表面の全体又は一部に半田付けの信頼性向上のため、無電解Ｎｉ−Ａｕめっき等を行うが、導体回路以外の触媒が残留している絶縁層にＮｉ−Ａｕめっきが析出する為、半田付けの信頼性を向上できない問題点があった。
【０００５】
【発明が解決しようとする課題】
このような問題点を解決する手段として、導体回路形成後に絶縁層から触媒を除去する方法が提案されている。例えば、触媒除去液としてホウ弗酸−塩化ナトリウム混合液（特開昭６３−７２１９８）、シアン化合物含有液（特開平７−２０７４６６）などがある。しかしながらこれらの触媒除去液では、金属導体回路を腐食される欠点や有害なシアン化合物や弗化物を含有する問題点があった。
【０００６】
一方触媒除去方法としては、酸化処理による触媒を含む絶縁層の一部を除去する方法（特開平８−１８６３５１）、絶縁層表面の触媒にレーザーを照射し除去する方法（特開平１１−１３５９１８）などがあるが、絶縁層にダメージを与える問題点があった。このように、導体回路形成後に絶縁層に残留する触媒を除去できても、導体回路及び絶縁層の障害や公害性の問題点を克服するまでには至っていない状況であった。
【０００７】
【課題を解決するための手段】
本発明は、従来技術の問題点を鑑み、低公害性且つ銅導体回路の腐食性を防止した絶縁層表面のパラジウム触媒除去を鋭意研究した結果、硝酸及びハロゲンイオンと銅導体回路の腐食防止剤を含有した混合液で浸漬又はスプレー処理することにより、絶縁層表面に残留するパラジウム触媒を除去し、導体回路間の絶縁性を向上させ、プリント配線板の信頼性を確保することに成功したもので、有害物質を含有しない為、公害性を改善しうるものである。さらに、パラジウム金属導体回路及び絶縁樹脂を腐食させることがなく、上記目的を達成することができる。
【０００８】
すなわち、本発明は、ピロール及びその誘導体、ピロル及びその誘導体、ピロリジン及びその誘導体、インドール及びその誘導体、インドリン及びその誘導体、ピリジン及びその誘導体、ピペリジン及びその誘導体、キノリン及びその誘導体、ジアジン及びその誘導体、ピペラジン及びその誘導体、プリン及びその誘導体、オキサゾール及びその誘導体、オキサジン及びその誘導体、ピラゾール及びその誘導体、イミダゾール及びその誘導体、トリアゾール及びその誘導体、テトラゾール及びその誘導体より選択される窒素複素環化合物、エチレングリコール、ポリエチレングリコール、プロピレングリコール、ポリプロピレングリコール、グリセリンから選択される多価アルコール類、ポリオキシエチレン、ポリオキシプロピレンブロックポリマー、ポリオキシエチレンノニルフェニルエーテルから選択される非イオン界面活性剤、第四級アンモニウム塩、ピリジニウム塩から選択されるカチオン系界面活性剤の一種以上（ただし窒素複素環化合物は単独では使用しない）を含有することを特徴とするプリント配線板の触媒除去液を提供する。
ここに硝酸は３０〜５００ｇ／Ｌの濃度で含有されることが望ましい。
ハロゲンイオンは０．１〜１００ｇ／Ｌの濃度で含有されることが望ましい。
好ましくは、触媒の溶解促進剤として、鉄イオンを含有させる。
好ましくは、ＮＯｘ抑制剤として、尿素又はその誘導体、グアニジン類を一種以上含有する。
本発明が除去しようとする触媒は、絶縁層表面に無電解銅めっき下地として付与される触媒としてのパラジウムに対して特に好適であり、本発明は又、上記除去液をかかる触媒に適用することよりなる除去方法を提供する。
【０００９】
本発明によると、絶縁層表面の触媒が除去でき、導体回路間の絶縁性を確保でき、更に公害性を改善しうるプリント配線板の触媒除去液を提供するものである。更に、本発明は更に金属腐食防止剤を使用することにより導体回路及び絶縁樹脂を侵すことがなく上記作用効果を達成できる。
【００１０】
【発明の実施の形態】
以下に本発明のプリント配線板の触媒除去液に関し詳細に説明する。
本発明に関わる金属導体回路は銅導体回路を対象とするが、金及びニッケル導体回路等にも適用できる。又、絶縁層はプリント配線板の基材を構成するもので、例えばエポキシ樹脂、フェノール樹脂、ポリイミド樹脂、ボリエステル樹脂等の熱硬化性樹脂、ポリエチレン樹脂、ポリエーテルサルホン樹脂、ポリエーテルイミド樹脂等の熱可塑性樹脂、この他に熱硬化性及び熱可塑性樹脂等と紙ガラス繊維との複合材等が挙げられる。本発明の硝酸は絶縁層表面の触媒を溶解除去する主成分であって、３０〜５００ｇ／Ｌ濃度での使用が効果があり、特に２００〜３５０ｇ／Ｌが好ましい。硝酸濃度は３０ｇ／Ｌ未満では触媒の除去性が低下し、５００ｇ／Ｌを越えると硝酸ガスの発生が多く、作業性に問題がある。本発明で使用するハロゲンイオンは硝酸の作用で溶解除去された触媒金属を除去液中に安定に保持させる成分であって、再付着やスラッジ化を防止する。ハロゲンイオンは塩素イオン、臭素イオン、ヨウ素イオン等であって、塩素及びその塩、塩素酸及びその塩、臭化水素酸及びその塩、臭素酸及びその塩、ヨウ素水素酸及びその塩、ヨウ素酸及びその塩等より供給され、０．１〜１００ｇ／Ｌの濃度が好ましく、１〜５０ｇ／Ｌが更に好ましい。塩素イオン濃度は０．１ｇ／Ｌ未満では除去液中に溶解している触媒金属を安定に保持させる能力が低下し、１００ｇ／Ｌを越えると金属導体回路を腐食される。
【００１１】
本発明で使用する金属腐食抑制剤としては、含窒素複素環化合物、多価アルコール、非イオン界面活性剤、カチオン系界面活性剤の一種以上が使用できる。
【００１２】
本発明で使用する含窒素複素環化合物は金属腐食抑制剤として使用され、ピロール、１−メチルピロール、ジメチルピロール等のピロール及びその誘導体、２−ピロリンヘマチン酸等のピロル及びその誘導体、ピロリジン、２−ピロリドン等のピロリジン及びその誘導体、インドール、３−メチルインドール等のインドール及びその誘導体、インドリン、オキシドール等のインドリン及びその誘導体、ピリジン、ピコリン、ピリジノール、ニコチン酸、２−ピロリドン等のピリジン及びその誘導体、ピベリジン、ヒペコリン、２−ピベリドン等のピペリジン及びその誘導体、キノリン、２−メチルキノリン、２−キノロン等のキノリン及びその誘導体、１，２−ジアジン、１，３−ジアジン等のジアジン及びその誘導体、ピペラジン、２，５−ジメチルピペラジン等のピペラジン及びその誘導体、プリン、ヒポキサンチン等のプリン及びその誘導体、オキサゾール、４−オキサゾロン等のオキサゾール及びその誘導体、１，４−オキサジン、モルホリン等のオキサジン及びその誘導体、ピラゾール、３，５−ジメチルピラゾール、ベンズピラゾール等のピラゾール及びその誘導体、イミダゾール、メチルイミダゾール、ベンゾイミダゾール等のイミダゾール及びその誘導体、１，２，３−トリアゾール、１，２，４−トリアゾール、４−アミノ−１，２，４−トリアゾール、ベンゾトリアゾール等のトリアゾール及びその誘導体、テトラゾール、５−アミノテトラゾール、１−フェニルテトラゾール等のテトラゾール及びその誘導体が挙げられる。
【００１３】
本発明で使用できる多価アルコールとしては、エチレングリコール、ポリエチレングリコール、プロピレングリコール、ポリプロピレングリコール、グリセリン等が挙げられる。
【００１４】
本発明で使用できる非イオン界面活性剤としては、ポリオキシエチレン、ポリオキシプロピレンブロックポリマー、ポリオキシエチレンノニルフェニルエーテル等、カチオン系界面活性剤は第四級アンモニウム塩、ピリジニウム塩等が挙げられる。
【００１５】
これら金属腐食抑制剤は一種（ただし含窒素複素環化合物は単独で使用しない）以上の組み合わせで使用でき、０．０１〜１００ｇ／Ｌの濃度範囲より適宜調整し使用する。
【００１６】
本発明では、パラジウム等の触媒の溶解促進剤として、鉄イオンを使用しても良い。鉄イオンは、無機及び有機酸の鉄塩より供給され、硝酸による溶解除去作用を促進させる効果がある。その濃度は、５ｇ／Ｌ未満では触媒除去の促進性が低下し、１００ｇ／Ｌを越えると金属導体回路を腐食させるため、５〜１００ｇ／Ｌでの使用が好ましく、１０〜５０ｇ／Ｌで使用するのが更に好ましい。
【００１７】
本発明では、ＮＯｘ抑制剤を使用しても良く、それには尿素又はその誘導体、グアニジン類は、尿素、Ｎ−メチル尿素、Ｎ−エチル尿素、ジメチル尿素、アロファン酸、ビウレット、グアニジン、１−メチルグアニジン、Ｎ−アミノグアニジン、ジシアンジアミド等が挙げられる。それらの濃度は０．１〜３０ｇ／Ｌでの使用が好ましく、１〜１０ｇ／Ｌが更に好ましい。これは硝酸による触媒金属の溶解時に発生するＮＯｘガスを抑制する作用があるが、０．１ｇ／Ｌ未満の濃度では効果が小さく、３０ｇ／Ｌを越えると触媒除去性を低下させる為、使用する上で好ましくない。
【００１８】
【実施例】
以下に本発明の効果を実施例により説明するが、本発明は下記実施例に限定されるものではなく、適宜変更して実施することが可能なものである。
＜参考例１〜３、実施例４〜１２＞
ガラス布エポキシ樹脂基材をコンディショナー液（日立化成工業（株）製・ＣＬＣ−４０１）で脱脂し、水洗する。更にプレディップ液（日立化成工業（株）製・ＰＤ−２０１）に浸漬後直ちにキャタリスト液（日立化成工業（株）製・ＨＳ−２０１Ｂ）に浸潰し、水洗し、アクセレーター液（日立化成工業（株）製・ＡＤＰ−２０１）に浸漬し、金属パラジウム触媒を約１０ｍｇ／ｄｍ2に析出させ、水洗及び乾燥し試験片を作製する。
次に表１記載の触媒除去液（残部は水）で上記試験片を２５℃、５分の条件でスプレー処理し、水洗後ガラス布エポキシ樹脂基材表面に残留しているパラジウム測定の為、更に９０℃の５０％王水液に３分浸漬し、触媒除去処理前後のパラジウム量を原子吸光光度法により分析する。その結果を表２に示す。
【００１９】
＜比較例１〜３＞
上記実施例と同様操作で作製した試験片を表１記載の触媒除去液で２５℃、５分の条件でスプレー処理し、水洗後更に上記実施例と同様操作で触媒除去処理前後のパラジウム量を分析する。その結果を表２に示す。
【００２０】
【表１】
【表２】
【発明の効果】
本発明に係わるプリント配線板の触媒除去液は従来技術に比べ格段に優れた除去効果を示し、更に公害性を改善しうるもので、プリント配線板の金属導体回路間の絶縁性を確保でき、工業上極めて有益である。更に、金属腐食抑制剤を併用することで、導体回路及び絶縁樹脂を侵すことがなくなる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a printed wiring board removing solution for removing an electroless plating catalyst remaining on the surface of an insulating layer after forming a metal conductor circuit.
[0002]
[Prior art]
In the printed wiring board manufacturing process, a catalyst is applied to the surface of the insulating layer of the printed wiring board as a direct plating or electroless copper plating pretreatment. After this catalyzing treatment, electroless copper plating is deposited, and further electrolytic copper plating is performed to form a copper plating layer. Further, a portion to be a conductor circuit is covered with an etching resist film, and other portions are removed by etching, and then the etching resist film is removed to form a conductor circuit.
[0003]
The action of the catalyst used at this time is to deposit metallic palladium on the surface of the insulating layer, which is a nonconductor, by a chemical reduction reaction (Sn 2+ + Pd 2+ → Sn 4+ + Pd 0 ) such as a catalyst-accelerator method. Is.
[0004]
(Problems of conventional technology)
In such a conventional technique, when the etching resist is peeled off and a conductor circuit is formed, the above-mentioned catalyst remains on the exposed insulating layer surface, so that an insulation failure or a short circuit is likely to occur. In addition, there is a problem that the insulating property of the printed wiring board is remarkably lowered with a finer circuit having a narrower width. Electroless Ni-Au plating is performed on the entire or part of the conductor circuit surface to improve soldering reliability, but Ni-Au plating is deposited on the insulating layer where the catalyst other than the conductor circuit remains. Therefore, there is a problem that the reliability of soldering cannot be improved.
[0005]
[Problems to be solved by the invention]
As a means for solving such a problem, a method of removing a catalyst from an insulating layer after forming a conductor circuit has been proposed. Examples of the catalyst removal liquid include a borofluoric acid-sodium chloride mixed liquid (Japanese Patent Laid-Open No. 63-72198) and a cyanide-containing liquid (Japanese Patent Laid-Open No. 7-207466). However, these catalyst removal solutions have the drawback of corroding the metal conductor circuit and the problem of containing harmful cyanide compounds and fluorides.
[0006]
On the other hand, as the catalyst removal method, a method of removing a part of the insulating layer containing the catalyst by oxidation treatment (Japanese Patent Laid-Open No. 8-186351), and a method of removing the catalyst on the surface of the insulating layer by irradiating a laser (Japanese Patent Laid-Open No. 11-135918). However, there was a problem of damaging the insulating layer. As described above, even if the catalyst remaining in the insulating layer after the formation of the conductor circuit can be removed, the problem of the obstacle and pollution of the conductor circuit and the insulating layer has not yet been overcome.
[0007]
[Means for Solving the Problems]
The present invention, conventional view of the problems of the art, low pollution and copper conductors results palladium catalyst removal preventing the surface of the insulating layer corrosive and intensive studies of the circuit, nitrate and halide ions and copper conductor circuit corrosion inhibitor It has succeeded in removing the palladium catalyst remaining on the surface of the insulating layer, improving the insulation between the conductor circuits, and ensuring the reliability of the printed wiring board by dipping or spraying with a mixed solution containing Because it does not contain harmful substances, it can improve pollution. Furthermore, the above object can be achieved without corroding the palladium metal conductor circuit and the insulating resin.
[0008]
That is, the present invention relates to pyrrole and derivatives thereof , pyrrole and derivatives thereof, pyrrolidine and derivatives thereof, indole and derivatives thereof, indoline and derivatives thereof, pyridine and derivatives thereof, piperidine and derivatives thereof, quinoline and derivatives thereof, diazine and derivatives thereof , piperazine and its derivatives, purine and its derivatives, oxazole and its derivatives, oxazine and its derivatives, pyrazole and its derivatives, imidazole and its derivatives, triazole and its derivatives, tetrazole and nitrogen heterocyclic compounds that will be selected from its derivatives, ethylene glycol, polyethylene glycol, propylene glycol, polypropylene glycol, polyhydric alcohols selected from glycerol, polyoxyethylene, polyoxypropylene block Rimmer, nonionic surfactant selected from polyoxyethylene nonyl phenyl ether, quaternary ammonium salt, one or more cationic surfactants selected from the pyridinium salt (where the nitrogen heterocyclic compound is not used alone) A catalyst removal solution for a printed wiring board, comprising:
Here, nitric acid is desirably contained at a concentration of 30 to 500 g / L.
Halogen ions are preferably contained at a concentration of 0.1 to 100 g / L.
Preferably, iron ions are contained as a catalyst dissolution accelerator.
Preferably, the NOx inhibitor contains at least one of urea, its derivatives, and guanidines.
The catalyst to be removed by the present invention is particularly suitable for palladium as a catalyst applied as an electroless copper plating base to the surface of the insulating layer, and the present invention also applies the above removal liquid to such a catalyst. A removal method comprising:
[0009]
According to the present invention, there is provided a catalyst removal solution for a printed wiring board that can remove a catalyst on the surface of an insulating layer, ensure insulation between conductor circuits, and can further improve pollution. Furthermore, the present invention can achieve the above-described effects without further damaging the conductor circuit and the insulating resin by using a metal corrosion inhibitor.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
The catalyst removal solution for the printed wiring board of the present invention will be described in detail below.
The metal conductor circuit according to the present invention is a copper conductor circuit, but can also be applied to gold and nickel conductor circuits. The insulating layer constitutes the base material of the printed wiring board. For example, thermosetting resins such as epoxy resins, phenol resins, polyimide resins, polyester resins, polyethylene resins, polyethersulfone resins, polyetherimide resins, etc. In addition to these, there may be mentioned composite materials of thermosetting and thermoplastic resins and paper glass fibers. The nitric acid of the present invention is a main component for dissolving and removing the catalyst on the surface of the insulating layer, and is effective when used at a concentration of 30 to 500 g / L, particularly preferably 200 to 350 g / L. If the concentration of nitric acid is less than 30 g / L, the catalyst removability is lowered. The halogen ion used in the present invention is a component that stably retains the catalytic metal dissolved and removed by the action of nitric acid in the removal liquid, and prevents redeposition and sludge formation. Halogen ion is chlorine ion, bromine ion, iodine ion, etc., and chlorine and its salt, chloric acid and its salt, hydrobromic acid and its salt, bromic acid and its salt, iodohydroacid and its salt, iodic acid And a salt thereof and the like, and a concentration of 0.1 to 100 g / L is preferable, and 1 to 50 g / L is more preferable. If the chlorine ion concentration is less than 0.1 g / L, the ability to stably hold the catalytic metal dissolved in the removal solution is lowered, and if it exceeds 100 g / L, the metal conductor circuit is corroded.
[0011]
As the metal corrosion inhibitor used in the present invention, one or more of nitrogen-containing heterocyclic compounds, polyhydric alcohols, nonionic surfactants, and cationic surfactants can be used.
[0012]
The nitrogen-containing heterocyclic compound used in the present invention is used as a metal corrosion inhibitor, and pyrrole and derivatives thereof such as pyrrole, 1-methylpyrrole and dimethylpyrrole, pyrrole and derivatives thereof such as 2-pyrroline hematic acid, pyrrolidine, 2 -Pyrrolidine such as pyrrolidone and derivatives thereof, Indole such as indole and 3-methylindole and derivatives thereof, Indoline such as indoline and oxidol and derivatives thereof, Pyridine such as pyridine, picoline, pyridinol, nicotinic acid and 2-pyrrolidone and derivatives thereof , Piperidine such as piperidine, hypocoline, 2-piberidone and derivatives thereof, quinoline, 2-methylquinoline, quinoline such as 2-quinolone and derivatives thereof, diazine and derivatives thereof such as 1,2-diazine and 1,3-diazine, Piperazine 2,5 Piperazine such as dimethylpiperazine and derivatives thereof, purine and derivatives thereof such as purine and hypoxanthine, oxazole and derivatives thereof such as oxazole and 4-oxazolone, oxazine and derivatives thereof such as 1,4-oxazine and morpholine, pyrazole, 3, Pyrazole and derivatives thereof such as 5-dimethylpyrazole and benzpyrazole, imidazole and derivatives thereof such as imidazole, methylimidazole and benzimidazole, 1,2,3-triazole, 1,2,4-triazole, 4-amino-1, Examples include triazole and derivatives thereof such as 2,4-triazole and benzotriazole, and tetrazole and derivatives thereof such as tetrazole, 5-aminotetrazole and 1-phenyltetrazole.
[0013]
Examples of the polyhydric alcohol that can be used in the present invention include ethylene glycol, polyethylene glycol, propylene glycol, polypropylene glycol, and glycerin.
[0014]
Examples of nonionic surfactants that can be used in the present invention include polyoxyethylene, polyoxypropylene block polymer, polyoxyethylene nonylphenyl ether, and cationic surfactants include quaternary ammonium salts and pyridinium salts.
[0015]
These metal corrosion inhibitors can be used in combination of one or more kinds (however, nitrogen-containing heterocyclic compounds are not used alone) , and are appropriately adjusted and used from a concentration range of 0.01 to 100 g / L.
[0016]
In the present invention, iron ions may be used as a dissolution accelerator for catalysts such as palladium. Iron ions are supplied from iron salts of inorganic and organic acids and have the effect of promoting dissolution and removal by nitric acid. When the concentration is less than 5 g / L, the catalyst removal acceleration decreases, and when it exceeds 100 g / L, the metal conductor circuit is corroded. Therefore, the concentration is preferably 5 to 100 g / L, and preferably 10 to 50 g / L. More preferably.
[0017]
In the present invention, a NOx inhibitor may be used, and urea or a derivative thereof and guanidine are urea, N-methylurea, N-ethylurea, dimethylurea, allophanoic acid, biuret, guanidine, 1-methyl. Examples thereof include guanidine, N-aminoguanidine, dicyandiamide and the like. Their concentration is preferably 0.1 to 30 g / L, more preferably 1 to 10 g / L. This has the effect of suppressing NOx gas generated when the catalyst metal is dissolved by nitric acid, but the effect is small at a concentration of less than 0.1 g / L, and the catalyst removability is reduced when it exceeds 30 g / L. Unfavorable above.
[0018]
【Example】
The effects of the present invention will be described below with reference to examples, but the present invention is not limited to the following examples, and can be implemented with appropriate modifications.
< Reference Examples 1 to 3, Examples 4 to 12 >
The glass cloth epoxy resin base material is degreased with a conditioner solution (CLC-401, manufactured by Hitachi Chemical Co., Ltd.) and washed with water. Further, after being immersed in a pre-dip solution (manufactured by Hitachi Chemical Co., Ltd., PD-201), immediately immersed in a catalyst liquid (manufactured by Hitachi Chemical Co., Ltd., HS-201B), washed with water, and an accelerator solution (Hitachi Chemical Co., Ltd.). It is immersed in Kogyo Co., Ltd. (ADP-201), and a metal palladium catalyst is deposited at about 10 mg / dm 2 , washed with water and dried to prepare a test piece.
Next, the test piece was sprayed under conditions of 25 ° C. for 5 minutes with the catalyst removing liquid described in Table 1 (the remainder being water), and for the measurement of palladium remaining on the glass cloth epoxy resin substrate surface after washing with water, Further, it is immersed in a 50% aqua regia solution at 90 ° C. for 3 minutes, and the amount of palladium before and after the catalyst removal treatment is analyzed by atomic absorption spectrophotometry. The results are shown in Table 2.
[0019]
<Comparative Examples 1-3>
The test piece prepared by the same operation as in the above example was sprayed with the catalyst removal solution shown in Table 1 at 25 ° C. for 5 minutes. After washing with water, the amount of palladium before and after the catalyst removal treatment was further increased by the same operation as in the above example. analyse. The results are shown in Table 2.
[0020]
[Table 1]
[Table 2]
【The invention's effect】
The catalyst removal solution of the printed wiring board according to the present invention shows a remarkably superior removal effect as compared with the prior art, and can further improve the pollution, and can ensure the insulation between the metal conductor circuits of the printed wiring board, It is extremely useful industrially. Furthermore, by using the metal corrosion inhibitor in combination, the conductor circuit and the insulating resin are not affected.
Claims (6)
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| JP2000156088A JP4583549B2 (en) | 2000-05-26 | 2000-05-26 | Catalyst removal solution and removal method for printed wiring board |
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| JP2000156088A JP4583549B2 (en) | 2000-05-26 | 2000-05-26 | Catalyst removal solution and removal method for printed wiring board |
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| JP4583549B2 true JP4583549B2 (en) | 2010-11-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112424327A (en) * | 2018-07-20 | 2021-02-26 | 恩特格里斯公司 | Cleaning compositions containing corrosion inhibitors |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3881614B2 (en) | 2002-05-20 | 2007-02-14 | 株式会社大和化成研究所 | Circuit pattern forming method |
| DE102004017440A1 (en) | 2004-04-08 | 2005-11-03 | Enthone Inc., West Haven | Process for the treatment of laser-structured plastic surfaces |
| CN101605928B (en) * | 2006-11-06 | 2011-07-13 | 上村工业株式会社 | Direct plating method and solution for palladium conductor layer formation |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5232829A (en) * | 1975-09-09 | 1977-03-12 | Hitachi Ltd | Method of pretreatment in partial chemical plating of metal |
| JPS61133389A (en) * | 1984-11-30 | 1986-06-20 | Kizai Kk | Removing solution for nickel plating |
| JPH08225966A (en) * | 1995-02-21 | 1996-09-03 | Sanshin Chem Ind Co Ltd | Chemical polishing solution for metal and chemical polishing method using the same |
| JPH09302480A (en) * | 1996-05-14 | 1997-11-25 | Nikko Metal Pureeteingu Kk | Removing solution of tin or tin alloy and peeling method |
| JPH1121681A (en) * | 1997-07-04 | 1999-01-26 | Mec Kk | Method for regenerating removing solution for tin or solder |
-
2000
- 2000-05-26 JP JP2000156088A patent/JP4583549B2/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5232829A (en) * | 1975-09-09 | 1977-03-12 | Hitachi Ltd | Method of pretreatment in partial chemical plating of metal |
| JPS61133389A (en) * | 1984-11-30 | 1986-06-20 | Kizai Kk | Removing solution for nickel plating |
| JPH08225966A (en) * | 1995-02-21 | 1996-09-03 | Sanshin Chem Ind Co Ltd | Chemical polishing solution for metal and chemical polishing method using the same |
| JPH09302480A (en) * | 1996-05-14 | 1997-11-25 | Nikko Metal Pureeteingu Kk | Removing solution of tin or tin alloy and peeling method |
| JPH1121681A (en) * | 1997-07-04 | 1999-01-26 | Mec Kk | Method for regenerating removing solution for tin or solder |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112424327A (en) * | 2018-07-20 | 2021-02-26 | 恩特格里斯公司 | Cleaning compositions containing corrosion inhibitors |
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| JP2001339142A (en) | 2001-12-07 |
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