JP4573952B2 - Method for improving water resistance of lignocellulose molded board - Google Patents
Method for improving water resistance of lignocellulose molded board Download PDFInfo
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- JP4573952B2 JP4573952B2 JP2000189301A JP2000189301A JP4573952B2 JP 4573952 B2 JP4573952 B2 JP 4573952B2 JP 2000189301 A JP2000189301 A JP 2000189301A JP 2000189301 A JP2000189301 A JP 2000189301A JP 4573952 B2 JP4573952 B2 JP 4573952B2
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Description
【０００１】
【発明の属する技術分野】
本発明は、木材の耐水性改良あるいは寸法安定性を改良する方法及び得られた成形板に関する。
【０００２】
【従来の技術】
木材の寸法安定性や耐水性を向上する技術として、
１） 従来木材を減圧状態としてその中に熱硬化性樹脂や樹脂原料を注入し常圧に戻す際に樹脂を木材中に浸透させ、その後に熱圧プレス等で反応し表面に防水樹脂層を形成する方法
２）表面からの吸湿を防止する為に塩ビ等のシートを貼り付ける方法
等が知られていた。
【０００３】
【発明が解決しようとする課題】
しかしながら、樹脂を圧入する方法では、用いられる樹脂が熱硬化性樹脂であったり、樹脂原料であったりするために、一定の反応時間を必要としていた。このため、その反応が完全に終結するか、互いに融着・接着等を発生しない状態になるまで、それぞれの成形板を重ねることができない等であり、より生産性の向上が求められていた。特に効率的な連続法でも製造可能な方法が望まれていた。
又、熱硬化性樹脂や樹脂原料を圧入するために、高圧設備が必要であり、構造材等に用いられる整形板の製造の為には過大な設備が必要となっていた。
また、シート等の張り付け方法においては近年、燃焼させてもダイオキシンが発生しない等環境負荷の少ないシートへの移行が求められていたが全てにおいて塩ビシートと同等以上となる材料が望まれていた。
【０００４】
【課題を解決する為の手段】
上記課題を鑑み、本発明者らは、鋭意検討を行った結果、成形されたリグノセルロース板の表面に熱可塑性樹脂を溶融させ加圧接着することで、反応時間を必要とせず、実質的に瞬時にリグノセルロース板の表面に樹脂含浸層を形成することができ、リグノセルロース板表面からの吸水を低減することができ、樹脂を含浸させない樹脂と比較して寸法安定性を著しく向上することができることを見出し、本発明を完成するに至った。
【０００５】
即ち以下の（１）〜（８）を提供するものである。
（１）成形されたリグノセルロース成形板に、融点（Ｔｍ）が１００℃以上２００℃以下のポリオレフィン樹脂又は該ポリオレフィンを含有する樹脂組成物を熱ロール上で加熱溶融しながら塗布し含浸させることを特徴とするリグノセルロース成形板の耐水性改良方法。
（２）前記ポリオレフィン樹脂が１９０℃におけるM.F.I.１０〜５０ｇ/10minのポリエチレンおよび２３０℃におけるM.F.I.１０〜８００ｇ/10minであるポリプロピレンから選ばれる少なくとも１種を含有する（１）記載のリグノセルロース成形板の耐水性改良方法。
（３）前記ポリオレフィン樹脂中のポリエチレンおよびポリプロピレンから選ばれる少なくとも１種の含有量が３０質量％以上である（２）記載のリグノセルロース成形板の耐水性改良方法。
（４）前記ポリオレフィン樹脂が、ポリプロピレンである（１）〜（３）のいずれかに記載のリグノセルロース成形板の耐水性改良方法。
（５）前記ポリプロピレンの融点よりも２０〜５０℃高い温度で加熱溶融する（４）に記載のリグノセルロース成形板の耐水性改良方法。
（６）成形されたリグノセルロース成形板に融点（Ｔｍ）が１００℃以上２００℃以下のポリオレフィン樹脂又は該ポリオレフィンを含有する樹脂組成物を熱ロール上で加熱溶融しながら塗布し含浸させて得られることを特徴とするリグノセルロース成形板。
（７）（１）〜（５）のいずれかに記載のリグノセルロース成形板の耐水性改良方法を用いて得られたリグノセルロース成形板。
（８）（１）〜（５）のいずれかに記載のリグノセルロース成形板の耐水性改良方法を含む、耐水性が改良されたリグノセルロース成形板の製造方法。
【０００６】
【発明の実施の形態】
以下、本発明を詳細に説明する。
【０００７】
[リグノセルロース成形板]
本発明で用いるリグノセルロース成形板とは、木質小削片を用いるパーティクルボード、木質繊維を用いるミディアムデンシティーファイバーボード、ハードボード、インシュレーションボード、大型のチップを用いるウエハーボード、細長いストランドを配向させたOSB等をいう。
【０００８】
[ポリオレフィン樹脂]
本発明に用いる、ポリオレフィン樹脂はその融点が(Tm)が１００℃以上、２００℃以下である。これらポリオレフィンに特に限定はなく本発明のαオレフィンの単独又は共重合体をもちいることができる。例えばポリエチレン、ポリプロピレン、ポリ４メチルペンテンー１等の単独重合体や共重合体が挙げられる。
【０００９】
そのなかでもポリエチレンまたはポリプロピレンの単独又は共重合体が好ましく用いられ、その融点(Tm)は、１００℃〜２００℃である。１００℃以上とすることで、成形後製品同士が融着を著しく抑制又は実質的防止することができ好ましい。２００℃以下とすることで加熱溶融が容易となり、操作、装置が簡便となり好ましい。
また、ポリエチレン樹脂のメルトフローインデックス（M.F.I.）１０〜５０ｇ/10min、またはポリプロピレン樹脂のメルトフローインデックス（M.F.I.）１０〜８００ｇ/10minであり、好ましくは１０乃至５００ｇ/10min、より好ましくは１０乃至３００ｇ/10minである。
【００１０】
これらのポリオレフィン樹脂はそれぞれ単独で用いても、混合して用いてもよく、更に必要に応じてその他の樹脂を含有していてもよい。その他の樹脂を含有する場合は例えばポリエチレン樹脂のメルトフローインデックス（M.F.I.）１０〜５０ｇ/10min、またはポリプロピレン樹脂のメルトフローインデックス（M.F.I.）１０〜８００ｇ/10minから選ばれる少なくとも１種の樹脂を３０質量％以上含有することが好ましく、５０質量％以上含有することが更に好ましい。
M.F.I．は、ASTM D-1238に規定されている測定方法に従って測定した。ポリエチレン樹脂は、2160ｇの荷重をピストンに加えたとき、190℃の溶融体が特定のオリフィスを通して10分間に押し出される重量であり、ポリプロピレン樹脂の場合、溶融体の温度が230℃で同様の荷重をピストンにかけた場合の10分間に押し出される重量を表している。
【００１１】
密度に特に限定はないが通常、０．９０〜０．９７０ｇ／cm3、好ましくは０．９１〜０．９７０ｇ／cm3であるエチレン単独重合体あるいはエチレン・α−オレフィン共重合体が好ましく製造される。なおここで密度はＡＳＴＭ Ｄ１５０５によって測定された値である。
【００１２】
これらオレフィン樹脂はそれぞれの主モノマー例えばエチレン、プロピレン、４メチルペンテンー１とチーグラ触媒やメタロセン触媒存在下、液相、気相、スラリー状態で重合させる。通常コモノマーとしては主モノマーと相異なる炭素数２ないし２０のα−オレフィンは用いられる。 例えば、エチレン、プロピレン、2-メチルプロピレン、1-ブテン、1-ヘキセン、1-ペンテン、4-メチル-1-ペンテン、3-メチル-1-ペンテン、1-オクテン、1-ノネン、1-デセン、1-ウンデセン、1-ドデセンなどが挙げられる。またα−オレフィンとポリエンとを共重合させることもできる。このようなポリエンとしては、ブタジエン、イソプレン、1,4-ヘキサジエン、ジシクロペンタジエン、5-エチリデン-2-ノルボルネンなどを例示することができる。
重合条件に特に限定はないが通常、重合温度は、通常２０〜１５０℃、好ましくは５０〜１２０℃、より好ましくは７０〜１１０℃であり、重合圧力は通常１〜１０００Kg／cm2 、好ましくは２〜４０Kg／cm2 である。上記のような共重合は二段以上の多段で行うこともできる。
これらオレフィン（共）重合体には、必要に応じて耐熱安定剤、耐候安定剤、帯電防止剤、アンチブロッキング剤、滑剤、核剤、顔料、染料、無機あるいは有機充填剤などを配合することもできる。
【００１３】
[成形条件]
成形温度は通常１００℃〜２５０℃、好ましくは、１２０〜２３０℃である。
融点に相関して条件を設定する必要はないが、融点よりも２０〜５０℃高い温度で成形すると操作性に優れ好ましい。
溶融状態での粘度に特に限定はないが加熱下ＢＨ型粘度計で測定した粘度が２５０ｍＰａ以上５０００ｍＰａ以下であることが好ましい。
これらの樹脂の状態としてフィルム状、粒状、ブロック状等があるが、フィルム状態の場合、溶融方法として加熱圧縮成形機の使用が望ましい。
加熱圧縮成形の場合、フィルムをリグノセルロース成形板表面及び下部に設置し上下に離型剤を塗布した鉄板あるいは、テフロンシートや離型フィルムを置き成形する。成形圧力は、特に規定しない。また、成形された板は、特に強制的な冷却を必要としなくともよいが、エアブローやファンなどで強制的に除熱し表面を固化させる事で、ボードの積み上げ速度を早くできる。
また、粒状樹脂を用いる場合は、熱ロール上で溶融させながら連続的に塗布する。この場合、熱ロール通過前に塗布する基材に熱風を吹き付け基材表面を暖め、熱ロール通過後に冷却エアを吹き付け固化させることで瞬時に安定した塗布状態を得ることが出来る。
ホットメルト樹脂の形態は、ポリエチレンまたはポリプロピレン樹脂同様、フィルム、ペレット、シート、粉末等の種類があるので溶融槽で溶融するかあるいは、熱ロールで加熱溶融しながらリグノセルロース成形板に塗布する必要がある。溶融槽を用いる場合、市販のロールコータ、カーテンコータ等任意に用いることが可能であるが、上面及び下面に同時に塗布する為には、ロールコータを用いるのが好ましい。
この場合、通常溶融したホットメルトをリグノセルロース板上に塗布し熱ロールで押し広げ板上に均一に塗布する方法、あるいは、塗布ロールとガイドロールを組み合わせた装置で板全面に均一に塗布する方法が用いられる。
この方法によれば、用いる樹脂が熱可塑性樹脂であるため固化後は、表面のベタツキがなく、成形板を連続的に表面加工し成形板同士を重ね合わせても、とも付き等の問題が生じない利点がある。
【００１４】
【実施例】
以下本発明を実施例にて説明するが、本発明は、これら実施例に限定されるものではない。
【００１５】
[分析]
（サンプル）
また評価は、厚み15mmのP-E1typeパーティクルボード及び厚み20mmM-E1typeMDFを用いた。
（測定方法）
吸水率・厚み変化率・ホルマリン放散量：JIS-5908に従って測定した。
融点の測定方法 ：自動融点測定装置（メトラー（株）製）にて測定
【００１６】
（参考例１）離型剤（三井化学（株）社製IMR-100）を塗布したコール板上にＭ.Ｆ.Ｉ.１０、融点(Tm)１００℃のポリエチレンシート（三井化学（株）社製テストシート、厚さ０．１mm）を置きその上に成形された15mm厚のパーティクルボードを設置、さらにポリエチレンシートを載せ離型剤を塗布したコール板を載せ、１８０℃で１分間、加熱圧縮成形しポリエチレンフィルムを含浸したパーティクルボードを得た。
【００１７】
（実施例２）
Ｍ.Ｆ.Ｉ.９５、融点(Tm)１６０℃のポリプロピレン樹脂（三井化学（株）社製J-739F）を粘度５０００mPa・sになるように１９０℃の熱ロール上で溶融し、15mm厚のパーティクルボード上に熱ロール塗布し、その後冷却空気で定着し表面にポリプロピレンの皮膜を形成した。出来たボードの裏面に対しても同様の操作を行い両面にポリプロピレン樹脂を塗布したパーティクルボードを得た。
【００１８】
（実施例３）
M.F.I＝３０、融点(Tm)１６０℃のポリプロピレン樹脂を２００℃の熱ロール上で溶融しながら15mm厚のパーティクルボード上に加熱塗布した。その後、冷却ロールで定着した。出来たボードの裏面に対しても同様の操作を行い両面にポリプロピレンフィルムを塗布したパーティクルボードを得た。
【００１９】
（参考例４）ペットフィルム上にM.F.I＝５０、融点(Tm)１３０℃のポリエチレンシートを置きその上に成形された20mm厚のMDFを設置、さらにポリエチレンシートを載せその上にペットフィルムを載せ、１９０℃、１MPaで１分間、加熱圧縮成形し、ペットフィルムを除去してポリエチレンフィルムを含浸したMDFを得た。
【００２０】
（比較例１）
表面処理しない15mm厚のP-E1typeパーティクルボード
（比較例２）
表面処理しない20mm厚のM-E1typeのMDF
【００２１】
【表１】
【発明の効果】
本発明は、成形板等の木材の表面にポリオレフィン樹脂を含浸させ、木材表面の吸水率を低下させることができる。また、熱可塑性樹脂であるポリオレフィンをもちいることにより、樹脂表面近傍に熱可塑性樹脂が含浸された後、直ちに固体となるため、実質的に瞬時に表面処理を実施することができる。このため、反応時間を必要としていた熱硬化性樹脂で発生していた、表面層形成直後の成形板同士の接着等が発生せず、成型後短時間で成形板を重ねても、互いが固着、又一部接着する等が発生せず、成形板同士に離型シートを挟むことなく、成型板同士を重ねることができる。このことにより、製品のロスが抑制されるだけでなく、高速で連続的成形板を製造することができた。
また、ボード表面からのホルマリンの放散を抑える効果も得られる有用な表面加工方法である。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for improving the water resistance or dimensional stability of wood and the resulting molded plate.
[0002]
[Prior art]
As a technology to improve the dimensional stability and water resistance of wood,
1) When a conventional wood is in a reduced pressure state, a thermosetting resin or resin raw material is injected into the wood and returned to normal pressure, the resin is infiltrated into the wood, and then reacted with a hot press or the like to form a waterproof resin layer on the surface. Forming method 2) In order to prevent moisture absorption from the surface, a method of attaching a sheet of polyvinyl chloride or the like has been known.
[0003]
[Problems to be solved by the invention]
However, the method of press-fitting the resin requires a certain reaction time because the resin used is a thermosetting resin or a resin raw material. For this reason, the respective molded plates cannot be stacked until the reaction is completely completed, or until no fusion, adhesion, or the like occurs, and further improvement in productivity has been demanded. In particular, a method that can be produced even by an efficient continuous method has been desired.
In addition, high pressure equipment is required to press-fit thermosetting resins and resin raw materials, and excessive equipment is required for manufacturing shaped plates used for structural materials and the like.
In addition, in the pasting method of sheets and the like, in recent years, there has been a demand for a shift to a sheet having a low environmental load such that dioxin is not generated even if it is burned.
[0004]
[Means for solving the problems]
In view of the above-mentioned problems, the present inventors have conducted intensive studies, and as a result, the thermoplastic resin is melted and pressure-bonded to the surface of the molded lignocellulose plate, so that the reaction time is not required and substantially. A resin-impregnated layer can be instantly formed on the surface of the lignocellulose plate, water absorption from the surface of the lignocellulose plate can be reduced, and the dimensional stability can be remarkably improved compared to a resin not impregnated with the resin. The present inventors have found that this can be done and have completed the present invention.
[0005]
That is, the following (1) to (8) are provided.
(1) Applying and impregnating a molded lignocellulose molded plate with a polyolefin resin having a melting point (Tm) of 100 ° C. or more and 200 ° C. or less or a resin composition containing the polyolefin while heating and melting on a hot roll. A method for improving the water resistance of a lignocellulosic molded sheet, which is characterized.
(2) The water resistance of the lignocellulose molded plate according to (1), wherein the polyolefin resin contains at least one selected from polyethylene having an MFI of 10 to 50 g / 10 min at 190 ° C. and polypropylene having an MFI of 10 to 800 g / 10 min at 230 ° C. Improvement method.
(3) The method for improving water resistance of a lignocellulose molded plate according to (2), wherein the content of at least one selected from polyethylene and polypropylene in the polyolefin resin is 30% by mass or more.
(4) The method for improving water resistance of a lignocellulose molded plate according to any one of (1) to (3), wherein the polyolefin resin is polypropylene.
(5) The method for improving water resistance of a lignocellulose molded plate according to (4), wherein the melt is heated and melted at a temperature 20 to 50 ° C. higher than the melting point of the polypropylene.
(6) Obtained by applying and impregnating a molded lignocellulose molded plate with a polyolefin resin having a melting point (Tm) of 100 ° C. or higher and 200 ° C. or lower or a resin composition containing the polyolefin while heating and melting on a hot roll. A lignocellulose molded board characterized by the above.
(7) A lignocellulose molded plate obtained by using the method for improving water resistance of a lignocellulose molded plate according to any one of (1) to (5).
(8) A method for producing a lignocellulose molded plate having improved water resistance, including the water resistance improving method for a lignocellulose molded plate according to any one of (1) to (5).
[0006]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail.
[0007]
[Lignocellulose molded board]
The lignocellulose molding plate used in the present invention is a particle board using wood chips, a medium density fiber board using wood fibers, a hard board, an insulation board, a wafer board using a large chip, and an elongated strand. OSB etc.
[0008]
[Polyolefin resin]
The polyolefin resin used in the present invention has a melting point (Tm) of 100 ° C. or higher and 200 ° C. or lower. These polyolefins are not particularly limited, and the α-olefin homo- or copolymer of the present invention can be used. Examples thereof include homopolymers and copolymers such as polyethylene, polypropylene, and poly-4-methylpentene-1.
[0009]
Among them, polyethylene or polypropylene homopolymer or copolymer is preferably used, and its melting point (Tm) is 100 ° C to 200 ° C. By setting it as 100 degreeC or more, the products after shaping | molding mutually can suppress or substantially prevent fusion | melting, and are preferable. When the temperature is 200 ° C. or lower, heating and melting are facilitated, and the operation and apparatus are simplified, which is preferable.
Also, the melt flow index (MFI) of polyethylene resin is 10 to 50 g / 10 min, or the melt flow index (MFI) of polypropylene resin is 10 to 800 g / 10 min, preferably 10 to 500 g / 10 min, more preferably 10 to 300 g / min. 10min.
[0010]
These polyolefin resins may be used alone or in combination, and may further contain other resins as necessary. When other resins are contained, for example, 30 masses of at least one resin selected from a melt flow index (MFI) of 10 to 50 g / 10 min of polyethylene resin or a melt flow index (MFI) of 10 to 800 g / 10 min of polypropylene resin % Or more, preferably 50% by mass or more.
MFI. Was measured according to the measurement method defined in ASTM D-1238. Polyethylene resin is the weight by which a 190 ° C melt is extruded through a specific orifice in 10 minutes when a load of 2160 g is applied to the piston. In the case of polypropylene resin, the melt temperature is 230 ° C and the same load is applied. It represents the weight pushed out for 10 minutes when applied to the piston.
[0011]
Although the density is not particularly limited, an ethylene homopolymer or ethylene / α-olefin copolymer having a density of 0.90 to 0.970 g / cm 3 , preferably 0.91 to 0.970 g / cm 3 is preferably produced. Is done. Here, the density is a value measured by ASTM D1505.
[0012]
These olefin resins are polymerized in the liquid phase, gas phase, and slurry state in the presence of respective main monomers such as ethylene, propylene, and 4-methylpentene-1, and Ziegler catalyst or metallocene catalyst. As the comonomer, an α-olefin having 2 to 20 carbon atoms which is different from the main monomer is usually used. For example, ethylene, propylene, 2-methylpropylene, 1-butene, 1-hexene, 1-pentene, 4-methyl-1-pentene, 3-methyl-1-pentene, 1-octene, 1-nonene, 1-decene 1-undecene, 1-dodecene and the like. Also, α-olefin and polyene can be copolymerized. Examples of such polyenes include butadiene, isoprene, 1,4-hexadiene, dicyclopentadiene, 5-ethylidene-2-norbornene and the like.
Although there are no particular limitations on the polymerization conditions, the polymerization temperature is usually 20 to 150 ° C., preferably 50 to 120 ° C., more preferably 70 to 110 ° C., and the polymerization pressure is usually 1 to 1000 kg / cm 2 , preferably 2 to 40 kg / cm 2 . The copolymerization as described above can be performed in two or more stages.
These olefin (co) polymers may be blended with heat stabilizers, weather stabilizers, antistatic agents, antiblocking agents, lubricants, nucleating agents, pigments, dyes, inorganic or organic fillers as necessary. it can.
[0013]
[Molding condition]
The molding temperature is usually 100 ° C to 250 ° C, preferably 120 ° C to 230 ° C.
Although it is not necessary to set conditions in relation to the melting point, molding at a temperature 20 to 50 ° C. higher than the melting point is preferable because of excellent operability.
Although there is no particular limitation on the viscosity in the molten state, the viscosity measured with a BH viscometer under heating is preferably 250 mPa or more and 5000 mPa or less.
These resin states include a film shape, a granular shape, a block shape and the like. In the case of a film state, it is desirable to use a heat compression molding machine as a melting method.
In the case of heat compression molding, the film is placed on the surface and lower part of the lignocellulose molding plate, and an iron plate coated with a release agent on the top and bottom, a Teflon sheet or a release film is placed and molded. The molding pressure is not particularly specified. In addition, the formed plate does not need to be forcibly cooled, but the board stacking speed can be increased by forcibly removing heat with an air blow or a fan to solidify the surface.
Moreover, when using granular resin, it apply | coats continuously, making it fuse | melt on a hot roll. In this case, a stable coating state can be obtained instantaneously by blowing hot air to the substrate to be applied before passing through the hot roll to warm the surface of the substrate and blowing cooling air after passing through the hot roll to solidify.
Like the polyethylene or polypropylene resin, there are various types of hot melt resins such as films, pellets, sheets, powders, etc., so it is necessary to melt them in a melting tank or apply them to a lignocellulose molding plate while heating and melting them with a hot roll. is there. In the case of using a melting tank, a commercially available roll coater, curtain coater, etc. can be arbitrarily used. However, in order to apply simultaneously to the upper surface and the lower surface, it is preferable to use a roll coater.
In this case, a method of applying a normally melted hot melt on a lignocellulose plate and spreading it uniformly on a hot roll, or a method of uniformly applying the entire surface of the plate with a device combining a coating roll and a guide roll Is used.
According to this method, since the resin to be used is a thermoplastic resin, there is no surface stickiness after solidification, and problems such as sticking occur even if the molded plates are continuously surface processed and the molded plates are overlapped with each other. There are no advantages.
[0014]
【Example】
EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples.
[0015]
[analysis]
(sample)
The evaluation was performed using a P-E1type particle board having a thickness of 15 mm and a thickness of 20 mmM-E1typeMDF.
(Measuring method)
Water absorption rate / thickness change rate / formalin emission amount: Measured according to JIS-5908.
Melting point measurement method: Measured with an automatic melting point measuring apparatus (Metler Co., Ltd.)
( Reference Example 1) A polyethylene sheet (Mitsui Chemicals, Inc.) with M.F.I.10 and a melting point (Tm) of 100 ° C. on a coal plate coated with a release agent (IMR-100 manufactured by Mitsui Chemicals, Inc.) A test board (thickness 0.1 mm) and a 15 mm thick particle board are placed on top of it, a polyethylene sheet is placed on it and a release plate is applied on it, and then heated at 180 ° C for 1 minute. A particle board impregnated with a polyethylene film by compression molding was obtained.
[0017]
(Example 2)
Melting polypropylene resin (J-739F, manufactured by Mitsui Chemicals, Inc.) having a melting point (Tm) of 160 ° C. on a hot roll at 190 ° C. to a viscosity of 5000 mPa · s, and having a thickness of 15 mm A heat roll was applied onto the particle board, and then fixed with cooling air to form a polypropylene film on the surface. The same operation was performed on the back side of the resulting board to obtain a particle board having a polypropylene resin applied on both sides.
[0018]
(Example 3)
A polypropylene resin having a MFI = 30 and a melting point (Tm) of 160 ° C. was heated and applied onto a 15 mm thick particle board while melting on a 200 ° C. hot roll. Then, it was fixed with a cooling roll. The same operation was performed on the back side of the resulting board to obtain a particle board having a polypropylene film applied on both sides.
[0019]
( Reference Example 4) A polyethylene sheet having a MFI = 50 and a melting point (Tm) of 130 ° C. was placed on a pet film, and a 20 mm thick MDF was formed thereon. Further, a polyethylene sheet was placed thereon, and a pet film was placed thereon. MDF impregnated with polyethylene film was obtained by heat compression molding at 190 ° C. and 1 MPa for 1 minute to remove the pet film.
[0020]
(Comparative Example 1)
15mm-thick P-E1type particle board without surface treatment (Comparative Example 2)
20mm thick M-E1type MDF without surface treatment
[0021]
[Table 1]
【The invention's effect】
In the present invention, the surface of wood such as a molded plate can be impregnated with a polyolefin resin to reduce the water absorption rate on the surface of the wood. Further, by using polyolefin, which is a thermoplastic resin, the resin is immediately solidified after being impregnated with the thermoplastic resin in the vicinity of the resin surface, so that the surface treatment can be carried out substantially instantaneously. For this reason, adhesion between the molded plates immediately after the surface layer formation, which occurred with the thermosetting resin that required reaction time, does not occur, and even if the molded plates are stacked in a short time after molding, they stick to each other In addition, there is no occurrence of partial adhesion or the like, and the molding plates can be stacked without sandwiching the release sheet between the molding plates. As a result, not only product loss was suppressed, but a continuous molded plate could be produced at high speed.
Moreover, it is a useful surface processing method which can also obtain the effect of suppressing the emission of formalin from the board surface.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| JP2000189301A JP4573952B2 (en) | 2000-06-23 | 2000-06-23 | Method for improving water resistance of lignocellulose molded board |
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| Application Number | Priority Date | Filing Date | Title |
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| JP2000189301A JP4573952B2 (en) | 2000-06-23 | 2000-06-23 | Method for improving water resistance of lignocellulose molded board |
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| Publication Number | Publication Date |
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| JP2002001707A JP2002001707A (en) | 2002-01-08 |
| JP4573952B2 true JP4573952B2 (en) | 2010-11-04 |
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| JP2000189301A Expired - Lifetime JP4573952B2 (en) | 2000-06-23 | 2000-06-23 | Method for improving water resistance of lignocellulose molded board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2006348467A (en) * | 2005-06-13 | 2006-12-28 | Noda Corp | Building backing material |
| JP2009263422A (en) * | 2008-04-22 | 2009-11-12 | Noda Corp | Waterproof agent for woody material and building board coated with the waterproof agent for woody material |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05228908A (en) * | 1992-02-24 | 1993-09-07 | Sumitomo Ringyo Kk | Manufacture of water-resistant woody board |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5814740A (en) * | 1981-07-18 | 1983-01-27 | 出口 幸平 | Manufacture of surface resin processed woody plywood |
| JPS6131205A (en) * | 1984-07-23 | 1986-02-13 | 住友林業株式会社 | Continuous manufacture and device for surface consolidated wood |
| JPS62271724A (en) * | 1986-05-21 | 1987-11-26 | Toagosei Chem Ind Co Ltd | Melt painting method |
| JPH0794508B2 (en) * | 1986-07-01 | 1995-10-11 | 昭和電工株式会社 | Method for producing modified olefin polymer |
| GB2226779A (en) * | 1988-12-23 | 1990-07-11 | Ici Plc | Coating with polypropylene particles |
| JP2862578B2 (en) * | 1989-08-14 | 1999-03-03 | ハイピリオン・カタリシス・インターナシヨナル・インコーポレイテツド | Resin composition |
| JPH0686042B2 (en) * | 1990-05-12 | 1994-11-02 | 東南産業株式会社 | Method for producing resin-impregnated wood |
| JPH04114046A (en) * | 1990-09-03 | 1992-04-15 | Showa Denko Kk | Production of thermoplastic elastomer |
| JPH0687194A (en) * | 1992-09-08 | 1994-03-29 | Bando Chem Ind Ltd | Decorative film for building material |
| JPH08165358A (en) * | 1994-12-14 | 1996-06-25 | Kanegafuchi Chem Ind Co Ltd | Polyolefin sheet for thermal forming |
| JPH08259753A (en) * | 1995-03-28 | 1996-10-08 | Kawasaki Steel Corp | Long-glass-fiber-reinforced polypropylene resin composition |
| JPH08336815A (en) * | 1995-06-12 | 1996-12-24 | Eidai Co Ltd | Method for coating surface of woody material and woody material having surface coating layer formed by same method |
| JPH1045967A (en) * | 1996-08-05 | 1998-02-17 | Mitsui Petrochem Ind Ltd | Polypropylene resin molding and its production |
| JP2000086722A (en) * | 1998-09-16 | 2000-03-28 | Asahi Chem Ind Co Ltd | High-density polyethylene resin for injection stretch blow molding |
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2000
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH05228908A (en) * | 1992-02-24 | 1993-09-07 | Sumitomo Ringyo Kk | Manufacture of water-resistant woody board |
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