JP4560454B2 - Probe processing equipment - Google Patents

Description

  The present invention relates to a probe processing apparatus for processing a probe used when dispensing various liquids including a specimen such as a reagent or blood in a dispensing apparatus or an automatic analyzer.

  Conventionally, this type of probe is manufactured by processing a pipe, and is used when dispensing various liquids including specimens such as reagents and blood. For this reason, this type of probe has a dispensing hole for sucking and discharging a liquid with an inner diameter of less than 1 mm, and some of the liquid dispenses several nL to 10 μL. In addition, since the tip of the probe is inserted into the reaction container at the time of dispensing, a tapered portion that narrows toward the tip is formed at the end (see, for example, Patent Document 1). Such a conventional probe needs to process the tip of the dispensing hole for sucking and discharging the liquid with high accuracy from the viewpoint of dispensing accuracy that directly affects the analysis accuracy of the specimen, but is difficult to machine. Therefore, craftsmen were manufactured by hand.

Japanese Patent Laying-Open No. 2004-125780 (FIG. 1)

  By the way, when manufacturing a probe, the tapered portion at the tip is formed by manual drawing. However, if the taper part is formed manually, the probe has a variation in the shape of the taper part, and the dispensing hole is crushed and the opening area is varied, resulting in a variation in dispensing accuracy from probe to probe and unstable quality. There was a problem.

  The present invention has been made in view of the above, and it is possible to process a probe capable of mass-producing a probe with stable dispensing accuracy and quality by suppressing variations in the shape of the tapered portion and the machining accuracy of the dispensing hole. An object is to provide an apparatus.

  In order to solve the above-described problems and achieve the object, a probe processing apparatus according to claim 1 is a probe processing apparatus having a dispensing hole for sucking and discharging a liquid, and narrows toward the tip. A drawing part that applies the drawing process to one end of the pipe, and a holding member that rotatably holds the pipe to which the drawing process is performed, and the holding member passes through the pipe from the drawing part. Load applying means for applying a friction load to the rotating torque that acts is provided.

  The probe processing apparatus according to claim 2 is characterized in that, in the above invention, the load applying means is a torque limiter.

  In order to solve the above-described problems and achieve the object, a probe processing apparatus according to claim 3 is a probe processing apparatus having a dispensing hole for sucking and discharging a liquid, and is directed toward the tip. A conveying means for feeding the pipe to a drawing section that applies one end of the pipe to a drawing section that becomes narrower, and a control means for controlling the feeding speed of the pipe to the drawing section by the conveying means. Features.

  In the probe processing apparatus according to the present invention, the holding member that rotatably holds the pipe is provided with a load applying unit that applies a friction load to the rotational torque that acts from the drawing unit via the pipe, or by a conveying unit. Since the control means for controlling the feed speed of the pipe to the drawing section is provided, it is possible to mass-produce probes with stable dispensing accuracy and quality by suppressing variations in the shape of the tapered section and the processing accuracy of the dispensing holes. There is an effect that it is possible to provide a probe processing apparatus capable of performing the above.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of a probe processing apparatus according to the present invention will be described in detail with reference to the drawings. FIG. 1 is an overall view of a probe manufactured by the processing apparatus of the present invention. FIG. 2 is an enlarged view of part A in FIG. FIG. 3 is a plan view of the probe processing apparatus of the present invention. FIG. 4 is a front view showing a configuration of a transport unit that transports a probe used in the processing apparatus of FIG. 3.

  The probe 8 is formed from a metal pipe such as stainless steel (SUS304) having excellent chemical resistance. As shown in FIG. 1, the base end side of the probe main body 8a is protected by covers 8b and 8c, and the base end is provided with a base 8d. Is attached. In particular, the probe body 8a is formed from a soft metal pipe such as stainless steel (SUS316J) having excellent ductility in consideration of ease of processing in addition to chemical resistance, and a tapered portion T that tapers toward the tip. Is formed at the end. As shown in FIG. 2, the tapered portion T has a parallel portion P formed parallel to the central axis Ac of the probe 8 at the distal end, and has a diameter from the parallel portion P toward the rear proximal side. It is formed in a conical shape that increases. In the probe 8, the processing accuracy of the length of the parallel portion P in the probe main body 8a, the inner diameter (less than 1 mm) of the dispensing hole 8e in the parallel portion P, and the smoothness of the surface of the tapered portion T including the parallel portion P are in dispensing accuracy. A big influence.

  Next, the processing apparatus 1 and the polishing apparatus 100 used for manufacturing the probe main body 8a of the probe 8 configured as described above will be described below.

  As shown in FIG. 3, the processing device 1 includes a transport unit 2, a drawing processing unit 3, a drill processing unit 4, and a reamer processing unit 5 on a pedestal 1 a, and an input unit 6 and a processing device that perform an input operation. The control part 7 which controls operation | movement of 1 is provided. When the drawing unit 3, the drilling unit 4, and the reamer processing unit 5 are arranged in parallel with the axis of the workpiece W and the workpiece W is set on the transport unit 2, the processing device 1 is controlled under the control of the control unit 7. W is transported from the initial position to the drawing section 3, drill section 4 and reamer processing section 5 and sequentially subjected to predetermined processing, and then returns to the initial position, from the processing of the tapered portion T in the probe body 8a. Up to the shaping of the dispensing hole of the parallel part P is automatically performed.

  The transport unit 2 has an X-axis transport device 21 and a Y-axis transport device 31 for transporting a workpiece W, which is an unprocessed metal pipe, in the X-axis direction and the Y-axis direction indicated by X and Y in FIG. is doing. In the X-axis transport device 21 and the Y-axis transport device 31, the position shown in FIG. 3 is an initial position in operation, and the workpiece W is attached and detached at the initial position.

  The X-axis transport device 21 has an accuracy of positioning the workpiece W within an error range of ± 0.03 mm. As shown in FIGS. 3 and 4, the X-axis base 22, the ball screw 23, the motor 24, and the slide A table 26 is provided. The X-axis base 22 rotatably supports both ends of the ball screw 23. The ball screw 23 is rotated forward and backward by a motor 24 provided at one end of the X-axis base 22 to move the slider 25 in the axial direction. The slide table 26 is installed on the slider 25, and moves along the ball screw 23 together with the slider 25 by the rotation of the ball screw 23. As shown in FIG. 5, the slide table 26 is provided with a holding base 27, a clutch 29, and a torque limiter 30.

  As shown in FIG. 5, the holding table 27 rotatably supports the collet chuck 28 via a bearing 27 a. The collet chuck 28 holds the workpiece W to be processed. In the clutch 29, a fixed portion 29b is attached to a bracket 29a provided on the slide table 26, and a movable portion 29c is disposed at a position facing the fixed portion 29b. The fixed portion 29b includes an electromagnet that electromagnetically attracts the movable portion 29c. The movable portion 29c is pivotally attached to the extension shaft 28a of the collet chuck 28. When the electromagnet is energized, the movable portion 29c is electromagnetically attracted to the fixed portion 29b and restricts the rotation of the collet chuck 28. For this reason, the collet chuck 28 can attach and detach the workpiece W with one hand by adsorbing the fixed portion 29b and the movable portion 29c to restrict the rotation.

  The torque limiter 30 is a portion that applies a dry load due to friction to the workpiece W. The torque limiter 30 is attached to a fixed portion 30b attached to a bracket 30a provided on the slide table 26 and an end of the extension shaft 28a of the collet chuck 28. And a movable portion 30c. The fixed portion 30b has a built-in coil spring 30d that regulates the torque acting on the movable portion 30c, and hence the torque acting on the workpiece W. The torque limiter 30 applies a dry load to the workpiece W so that the parallel portion P and the tapered portion T having a stable shape can be drawn, and the torque acting on the workpiece W can be finely adjusted. Can do.

  Here, when the machining apparatus 1 draws the parallel part P and the taper part T without using the torque limiter 30, the torque acting on the workpiece W from a set of dies of the drawing part 3 changes abruptly. The irregularities of the dents remaining on the surface of the taper T and the parallel part P of the workpiece W are greatly roughened. For this reason, the machining apparatus 1 uses the torque limiter 30 to mitigate a rapid change in torque that acts on the workpiece W from a set of dies of the drawing unit 3.

  On the other hand, the Y-axis transport device 31 has an accuracy of positioning the workpiece W within an error range of ± 0.02 mm, and as shown in FIGS. 3 and 4, the Y-axis base 32, the ball screw 33, and the motor 34. The slider 35 and the linear guide 36 are provided. The Y-axis base 32 rotatably supports both ends of the ball screw 33. The ball screw 33 is rotated forward and backward by a motor 34 provided at one end of the Y-axis base 32 to move the slider 35 in the axial direction. The X-axis base 22 is placed on the slider 35, and supports the X-axis base 22 movably in the Y-axis direction together with the slider 36 b of the linear guide 36. The linear guide 36 includes a guide rail 36a provided on the base 1a in parallel with the Y-axis base 32, and a slider 36b attached to the lower surface of the X-axis base 22 and slidably assembled to the guide rail 36a. Yes.

  The drawing unit 3 is a part that performs drawing processing on the workpiece W, and strikes the surface of the workpiece W with a die while rotating a pair of dies arranged opposite to the end of the workpiece W around the axis. And the taper portion P is formed. In one set of dies, a hitting surface corresponding to the parallel portion P and the tapered portion T of the probe main body 8a is formed on the inner surface of the half-cracked cylinder. During the drawing process, the workpiece W is fed into the drawing unit 3 at various feed speeds according to the machining shape of the tapered part.

  At this time, the workpiece W has a stable machining shape when the feed speed is changed in accordance with the temporal transformation of the metal material that is plastically deformed by the impact of the die. For example, as shown in FIG. 6, for example, the workpiece W has a feed rate rapidly increased at the start of machining, and then the taper portion is machined while the rate of increase of the feed rate is suppressed. When the parallel part is machined, the feed speed is controlled by the controller 7 so as to feed at a constant speed. Further, along with the drawing with a set of dies, a rotational stress is applied to the workpiece W from the set of dies. Therefore, the clutch 29 is disengaged so that the workpiece W is processed into a suitable shape, thereby releasing the suction between the fixed portion 29b and the movable portion 29c as shown in FIG. Make sure that only dry loads act on the.

  The drilling unit 4 roughly shapes the dispensing holes in the parallel part of the workpiece W that has been subjected to drawing processing to a predetermined diameter. In the drill processing unit 4, a motor 41 is provided on an installation table 1 b installed on the base 1 a together with the reamer processing unit 5. The motor 41 holds the drill 42 in a replaceable manner by a chuck 41a, and a support member 43 is provided at the front. The support member 43 is installed below the chuck 41a and detachably supports a guide member 44 that concentrically positions the drill 42 and the tapered portion and parallel portion of the workpiece W. As shown in FIG. 7, the guide member 44 has a concave portion 44b formed at the center in the longitudinal direction of a cylindrical main body 44a, and a positioning hole 44c formed at the center of the column in the longitudinal direction. When the chuck 42 is held by the chuck 41a, the guide member 44 is guided to the positioning hole 44c and attached to the support member 43 so that the tip of the drill 42 protrudes into the recess 44b.

  The reamer processing unit 5 finishes and shapes the roughly shaped dispensing hole, and the reamer processing unit 5 is different from the drill processing unit 4 except that the chuck 51a of the motor 51 replaces the drill 42 and grips a single-blade reamer 52 interchangeably. It is constituted similarly. For this reason, in the following description, corresponding components are described with corresponding reference numerals.

  The input unit 6 includes input operations such as operation start, stop, and emergency stop of the processing apparatus 1, the work W feed speed by the X-axis transport device 21, the motor 41 of the drill processing unit 4, and the motor 51 of the reamer processing unit 5. It is a touch panel type operation panel for performing an input operation of processing conditions including the number of rotations.

  The control unit 7 controls the feed speed of the workpiece W to the drawing unit 3 and a predetermined program of the X-axis conveyance device 21 and the Y-axis conveyance device 31 in the conveyance unit 2 from drawing to reaming of the workpiece W. It controls the operation of the processing apparatus 1 including control of operation, control of connection / disconnection of the clutch 29 that transmits or interrupts a dry load to the workpiece W, and the like.

  On the other hand, the polishing apparatus 100 grinds and polishes the workpiece W in which the dispensing hole 8e of the parallel portion P is shaped and the cutting of the tip of the parallel portion P is completed. When the taper portion T and the parallel portion P are formed on the workpiece W by the drawing portion 3 of the processing apparatus 1, dent marks remain on the surface of the taper T and the parallel portion P of the workpiece W as irregularities. The polishing apparatus 100 improves the liquid breakage performance of the manufactured probe main body 8a by grinding and polishing the unevenness remaining on the workpiece W.

  As shown in FIG. 8, the polishing apparatus 100 includes a conveyance unit 110, a grinding processing unit 130, and a polishing processing unit 140 arranged on a pedestal 100 a, and controls the input unit 102 that performs input operations and the operations of the polishing apparatus 100. The control unit 104 is provided. When the workpiece W is set on the transport unit 110 at the initial position shown in FIG. 8, the polishing apparatus 100 moves the grinding unit 130 and the polishing unit from the initial position shown in FIG. 8 under the control of the control unit 104. After being conveyed to 140 and sequentially subjected to predetermined processing, the processing returns to the initial position, and the processing from grinding to polishing of the tapered portion T in the probe body 8a is automatically executed.

  The transport unit 110 includes an X-axis transport device 111 and a Y-axis transport device 121 that transport the workpiece W in the X-axis direction and the Y-axis direction indicated by X and Y in FIG. Here, the X-axis transport device 111 and the Y-axis transport device 121 can transport the workpiece W in the X-axis direction and the Y-axis direction in units of 0.001 mm, and the position shown in FIG. W is attached and detached at the initial position.

  As shown in FIGS. 8 and 9, the X-axis transport device 111 has an X-axis base 112, a ball screw 113, a motor 114, and a slider 115. The X-axis base 112 is disposed on the pedestal 100a along the X-axis direction, and rotatably supports both ends of the ball screw 113. The ball screw 113 is rotated forward and backward by a motor 114 provided at one end of the X-axis base 112 to move the slider 115 in the axial direction. The slider 115 is supported by the ball screw 113 so as to be movable along the axial direction. The Y-axis transport device 121 is placed on the slider 115 and moved in the X-axis direction.

  As shown in FIGS. 8 and 9, the Y-axis transport device 121 includes a Y-axis base 122, a ball screw 123, a motor 124, a slider 125, and a holding table 126. The Y-axis base 122 is disposed in the Y-axis direction on the slider 115 so as to be orthogonal to the X-axis base 112 and rotatably supports both ends of the ball screw 123. The ball screw 123 is rotated forward and backward by a motor 124 provided at one end of the Y-axis base 122 to move the slider 125 in the axial direction. A holding base 126 is placed on the slider 125.

  As shown in FIG. 9, the holding table 126 is rotatably supported by a collet chuck 127 that holds a workpiece W to be ground and polished, and a motor 128 is installed on the upper part. In the motor 128, a timing belt 128b is stretched between the rotating shaft 128a and the extending shaft 127a of the collet chuck 127. As a result, the workpiece W gripped by the collet chuck 127 is rotated by the motor 128 during grinding and polishing. Further, the holding table 126 has a core pushing portion 126b formed at the ends of the two arms 126a extending from the lower portions on both sides. The core pushing portion 126b has a core pushing shaft 129 attached rotatably via a bearing 126c.

  The core pushing shaft 129 is provided with a pin 129b at the end of a cylindrical main body 129a. The pin 129b is for positioning the workpiece W at the center of rotation during grinding or polishing. That is, when the work W is gripped by the collet chuck 127, the work W is aligned with the rotation center of the collet chuck 127 by engaging with the dispensing hole 8e of the work W as shown in FIG. Here, the workpiece W is made of a metal having excellent ductility and richness in softness. For this reason, if grinding or polishing is performed without pressing the core, the workpiece W is easily deformed and deviates from the rotation center of the collet chuck 127, and the tapered portion T or the parallel portion subjected to the grinding or polishing processing. The outer surface of P and the dispensing hole 8e cannot be processed into a concentric circle.

  In this case, if the workpiece W has a large diameter and the dispensing hole 8e of the probe main body 8a to be manufactured is thick, there is a means for processing the workpiece W by inserting a reinforcing die into the hole of the workpiece W. However, since the probe body 8a has a thin dispensing hole 8e at the tip of less than 1 mm in diameter, it is difficult to manufacture such a reinforcing mold, and the hole may be clogged with the reinforcing mold and may not come out. For this reason, the polishing apparatus 100 uses the core pushing shaft 129. The core pushing shaft 129 has a tapered surface 129c formed at the end of the main body 129a on the pin 129b side, and the tapered surface 129c serves as a stopper when the pin 129b is inserted into the dispensing hole 8e of the workpiece W.

  The grinding part 130 grinds the workpiece W. The grinding part 130 is installed at the approximate center of the base 100a in the X-axis direction, and includes a motor 131, a transmission 133, and a grindstone 134. In the motor 131, a timing belt 132 is stretched between a pulley attached to the rotating shaft and a pulley attached to the input shaft of the transmission 133. In the transmission 133, a grindstone 134 is attached to the output shaft, and the number of rotations of the motor 131 is changed and output to the grindstone 134. In the grindstone 134, the grinding surface 134a of the workpiece W is formed into a shape corresponding to the outer surfaces of the tapered portion T and the parallel portion P, and the outer surfaces of the tapered portion T and the parallel portion P are ground concentrically with the dispensing holes 8e by the grinding liquid. . For this reason, the polishing apparatus 100 is provided with a supply portion of the grinding liquid below the pedestal 100a, and the grinding liquid is circulated between the supply portion and the grinding portion 130. The grindstone 134 may be subjected to finish grinding with a grindstone having a different processing roughness after the workpiece W is roughly ground.

  The polishing processing unit 140 polishes the workpiece W that has been ground. The polishing unit 140 is disposed on the base 100a adjacent to the grinding unit 130 in the X-axis direction, and is configured in the same manner as the grinding unit 130 except that the outer surface of the tapered portion T of the workpiece W is polished by the buff 144. ing. For this reason, in the following description, corresponding components are described with corresponding reference numerals.

  The input unit 102 performs input operations such as start, stop, and emergency stop of the operation of the polishing apparatus 100, the feed speed of the workpiece W in the Y-axis direction by the transport unit 110, the time for grinding and polishing, and the work W by the motor 124. It is a touch panel type operation panel for performing an input operation of processing conditions including the number of rotations.

  The control unit 104 controls the feed speed of the workpiece W in the Y-axis direction by the Y-axis transport device 121 based on a predetermined control program, controls the rotational speed of the motor 124, and rotates the motors 131 and 141 by the transmissions 133 and 143. The operation of the polishing apparatus 100 including the control of the speed change conditions is controlled.

  The probe processing apparatus 1 of the present invention manufactures the probe main body 8a of the probe 8 as follows, and then grinds the tapered portion T and the parallel portion P of the probe main body 8a using the polishing apparatus 100 as follows. And polish.

  First, at the initial positions of the X-axis transport device 21 and the Y-axis transport device 31, as shown in FIG. 3, the work W, which is an unprocessed pipe, is gripped by the collet chuck 28 of the holding base 27. Next, when machining conditions and operation start are input from the input unit 6, the machining device 1 starts operation of the motors 41 and 51 of the drawing unit 3, the drilling unit 4, and the reamer machining unit 5, and the control unit 7. Under this control, the Y-axis transport device 31 is driven, and the X-axis transport device 21 is moved to a position facing the drawing unit 3 as shown in FIG.

  Next, the processing device 1 drives the X-axis transport device 21 under the control of the control unit 7 and moves the slide table 26 toward the drawing unit 3 in the X-axis direction as shown in FIG. At this time, the processing apparatus 1 moves the slide table 26 toward the drawing unit 3 under a preset feed speed under the control of the control unit 7, for example, under the feed rate shown in FIG. 6. The workpiece W is fed into the drawing unit 3. Thereby, the processing apparatus 1 processes the taper taper part T and the parallel part P in the edge part of the workpiece | work W with one set of dice | dies.

  At this time, the clutch 29 is in a disengaged state, thereby releasing the adsorption between the fixed portion 29b and the movable portion 29c so that only the dry load acts on the workpiece W as shown in FIG. deep. As a result, the workpiece W can be machined in a desired number by a moderate dry load and having a stable shape. Here, when the workpiece 29 is processed without applying a dry load with the clutch 29 in a contact state, the cross-sectional shape of the tapered portion T and the parallel portion P that have been drawn into a polygonal shape such as a star shape is close to a circle. It is difficult to process into a shape. After the processing of the taper portion T and the parallel portion P is completed, the processing device 1 drives the X-axis transport device 21 and moves the slide table 26 under the control of the control unit 7 as shown in FIG. Retreat.

  In this way, when the tapered portion T and the parallel portion P are plastically processed by a pair of dies at the end portion of the workpiece W, the workpiece W is parallel to the surface, particularly the tapered portion T, as shown in FIGS. The surface of the part P and the inner surface of the parallel part P become uneven, and in particular, the diameter of the dispensing hole 8e in the parallel part P becomes small. For this reason, if the workpiece W is plastically processed, the dispensing accuracy is lowered, and the dispensing accuracy varies and the quality of the probe body 8a becomes unstable.

  For this reason, in the probe processing apparatus of the present invention, the shaping of the dispensing hole 8e is performed after the plastic processing to the tip of the workpiece W by a set of dies is completed. That is, after the tip of the workpiece W is plastically processed, the processing device 1 drives the Y-axis transport device 31 under the control of the control unit 7 and drills the X-axis transport device 21 as shown in FIG. It moves to a position facing the part 4. Next, the processing apparatus 1 switches the clutch 29 to the engaged state under the control of the control unit 7 and rotates the collet chuck 28 by attracting the fixed unit 29b and the movable unit 29c as shown in FIG. To regulate.

  Next, the processing device 1 drives the X-axis transport device 21 under the control of the control unit 7 to move the slide table 26 toward the drill processing unit 4 in the X-axis direction as shown in FIG. As a result, in the processing apparatus 1, the tip of the workpiece W protrudes into the recess 44b through the positioning hole 44c, and the drill 42 and the tapered portion T and the parallel portion P of the workpiece W are moved by the guide member 44 as shown in FIG. It is accurately positioned concentrically. For this reason, the workpiece W is roughly shaped by the drill 42 into a dispensing hole 8e in which the hole of the parallel portion P has a predetermined diameter.

  Here, the workpiece W to be processed is a thin pipe made of a soft metal and having an inner diameter of the dispensing hole 8e of less than 1 mm. For this reason, the tip of the workpiece W is easily deformed in the outer diameter direction by the rotational force of the drill 42 at the moment when the cutting edge of the drill 42 contacts the parallel portion P. For this reason, if the processing apparatus 1 shapes the dispensing hole 8e without using the guide members 44 and 54, the axial center of the drill 42 or the reamer 52 and the center of the hole to be shaped into the dispensing hole 8e are shifted. . As a result, in the workpiece W, the processing accuracy of the dispensing hole 8e is lowered, and in the worst case, the drill 42 and the reamer 52 are broken. Therefore, the processing device 1 positions the drill 42, the reamer 52 and the parallel portion P concentrically by the guide members 44 and 54 when shaping the dispensing hole 8e, and suppresses deformation of the tip end of the workpiece W in the outer diameter direction. ing. The processing apparatus 1 improves the processing accuracy of the dispensing holes 8e in this way. Here, the guide members 44 and 54 may be provided on, for example, the holding table 27 on the workpiece W side instead of the motors 41 and 51 side.

  Further, if the workpiece W is rotatable, when the dispensing hole 8e is shaped by the drill 42 or the reamer 52, the workpiece W cannot be reshaped with the drill 42 or the like. For this reason, when shaping the dispensing hole 8e, the processing apparatus 1 regulates the rotation of the collet chuck 28 that holds the workpiece W as described above. Furthermore, when shaping the dispensing hole 8 e, the drill 42, the reamer 52, and the tapered portion T and the parallel portion P of the workpiece W are positioned in the concave portions 44 b and 54 b of the guide members 44 and 54. For this reason, the facet formed by shaping the dispensing hole 8e by the drill 42 or the reamer 52 is smoother than the case where the dispensing hole 8e is roughly shaped in the positioning holes 44c and 54c without clogging the dispensing hole 8e. To the recesses 44b and 54b.

  After the rough shaping of the dispensing hole 8e is completed in this way, the processing apparatus 1 drives the X-axis transport device 21 under the control of the control unit 7 to move the slide table 26 to the original position shown in FIG. Retreat to. Next, the processing device 1 drives the Y-axis transport device 31 under the control of the control unit 7 and moves the X-axis transport device 21 to a position facing the reamer processing unit 5 as shown in FIG. .

  Next, the processing device 1 drives the X-axis transport device 21 under the control of the control unit 7 and moves the slide table 26 in the X-axis direction toward the reamer processing unit 5 as shown in FIG. As a result, in the machining apparatus 1, the tip of the workpiece W is inserted into the positioning hole 54 c as in the case of the drill machining unit 4. As a result, in the processing apparatus 1, the reamer 52 projecting into the recess 54b and the tapered portion T and the parallel portion P of the workpiece W are positioned concentrically by the guide member 54, and as shown in FIGS. The holes in the parallel part P are finished and shaped by the reamer 52 into smooth dispensing holes 8e having a predetermined diameter. Also in this finishing shaping, the resulting facet is smoothly discharged into the recess 54b without clogging the dispensing hole 8e.

  Thereafter, in the processing apparatus 1, the X-axis transport device 21 and the Y-axis transport device 31 return to the initial positions under the control of the control unit 7. Then, the workpiece W is removed from the collet chuck 28 of the holding table 27. Thus, since the drawing device 3, the drilling portion 4, and the reamer processing portion 5 are arranged in parallel with the axis of the workpiece W, the processing device 1 has no waste in arrangement. Therefore, the processing apparatus 1 can eliminate waste in operation of the transport unit 2 that transports the workpiece W to the drawing unit 3, the drill unit 4, and the reamer processing unit 5, and can be downsized. Further, the X-axis transport device 21 and the Y-axis transport device 31 of the transport unit 2 can position the workpiece W with high accuracy within an error range of ± 0.03 mm and ± 0.02 mm, respectively. For this reason, in the processing apparatus 1, the processing accuracy in the drawing processing unit 3, the drill processing unit 4, and the reamer processing unit 5 is improved along with the positioning accuracy, and the quality of the processed workpiece W is stabilized. Furthermore, since the processing apparatus 1 processes the workpiece W by a machine, the workpiece W can be processed in a shorter time than when manually processing, the mass production of the probe is possible, and the position of the X-axis transport device 21 is increased. Thus, the processing mode of the workpiece W can be grasped at a glance.

  Then, as shown in FIG. 24, the workpiece W removed from the collet chuck 28 is cut at the tip by the dicing saw 9 to make the length of the parallel portion P constant. As a result, as shown in FIG. 25, the workpiece W has a mirror-cut surface Fc of the parallel portion P, and improves the liquid drainage performance when assembled as the probe body 8a as the probe 8. Moreover, the processing apparatus 1 which removed the workpiece | work W after a process sets the new workpiece | work W in the collet chuck 28 of the holding stand 27, the formation process of the taper part T and the parallel part P, and the shaping process of the dispensing hole 8e. repeat.

  The workpiece W whose end face has been cut in this way is subjected to grinding and polishing using the polishing apparatus 100. Hereinafter, grinding and polishing of the workpiece W by the polishing apparatus 100 will be described.

  First, at the initial positions of the X-axis transport device 111 and the Y-axis transport device 121, the work W is gripped by the collet chuck 127 of the holding table 126 as shown in FIG. Next, when processing conditions and operation start are input from the input unit 102, the polishing apparatus 100 starts operation of the motors 128, 131, and 141 of the holding table 126, the grinding processing unit 130, and the polishing processing unit 140, and the control unit. The Y-axis transport device 121 is driven under the control of 104, and the holding table 126 is moved to the grindstone 134 side while rotating the workpiece W as shown in FIG. Thereby, the parallel part P and the taper part T contact | abut the workpiece | work W to the grinding surface 134a of the grindstone 134 rotating while supplying the grinding fluid, and the unevenness | corrugation (refer FIG. 25) of the surface is ground by the grindstone 134. .

  Next, under the control of the control unit 104, the polishing apparatus 100 drives the Y-axis transport device 121 to return the holding base 126 to the initial position shown in FIG. 8, and then drives the X-axis transport device 111. 27, the Y-axis transport device 121 is moved to the buff 144 side of the polishing processing unit 140. Then, the polishing apparatus 100 drives the Y-axis transport device 121 under the control of the control unit 104, and moves the holding table 126 to the buff 144 side as shown in FIG. As a result, the workpiece W comes into contact with the side surface of the buff 144 where the surfaces of the parallel portion P and the taper portion T are rotating while rotating, and is polished by the buff 144.

  At this time, the grinding unit 130 and the polishing unit 140 perform grinding and polishing of the workpiece W by aligning the workpiece W with the center of rotation of the collet chuck 127 by the core pressing shaft 129 of the core pressing portion 126b. . For this reason, as shown in FIG. 29, the outer surface of the parallel part P and the dispensing hole 8e are processed into the work W by the concentric circle. However, the grinding unit 130 and the polishing unit 140 can perform the grinding and polishing of the workpiece W without aligning the center, but as shown in FIG. It becomes difficult to process the dispensing holes 8e into concentric circles.

  After finishing the workpiece W in this way, the polishing apparatus 100 returns the X-axis transport device 111 and the Y-axis transport device 121 to their initial positions under the control of the control unit 104. And the workpiece | work W is removed from the collet chuck 127 of the holding stand 126, and the process of the probe main body 8a is complete | finished. The probe body 8a processed in this manner is manufactured by attaching the covers 8b and 8c to the base end side and attaching the base 8d to the base end. In addition, the polishing apparatus 100 after removing the probe body 8a after polishing sets a new workpiece W on the collet chuck 127 of the holding table 126, and repeats grinding and polishing of the tapered portion T and the parallel portion P.

  In the processing apparatus 1 of the present invention, a torque limiter 30 is provided on the collet chuck 28 as load applying means for applying a friction load to the rotational torque acting from the drawing unit 3 via the workpiece W in accordance with drawing. . For this reason, the processing apparatus 1 can process the workpiece W into the probe body 8a in which the variation in the processing accuracy of the shape of the tapered portion T and the dispensing hole 8e is suppressed, and the probe 8 with stable dispensing accuracy and quality can be obtained. Can be mass-produced. In the processing apparatus 1 of the present invention, the control unit 7 controls the feeding speed of the work W to the drawing unit 3 by the transport unit 2. For this reason, since the processing apparatus 1 changes the feed rate in accordance with the temporal transformation of the metal material that is plastically deformed by the impact of the die, the processing shape of the workpiece W is stabilized, and the processing accuracy of the dispensing hole 8e is improved. Variability is suppressed. Therefore, the processing apparatus 1 can also mass-produce probes with stable dispensing accuracy and quality by controlling the feed speed of the workpiece W to the drawing unit 3.

  In the probe main body 8a of the above embodiment, the parallel part P is formed at the tip of the taper part T. However, the processing apparatus 1 of the present invention can process even the probe main body 8a having no parallel portion P and only the tapered portion T. In this case, the workpiece W having been formed with the taper portion T and the shaping of the dispensing hole 8e by the processing device 1 is cut by the dicing saw 9 at the tip of the taper portion T, and then ground and polished by the polishing device 100. Is given.

  Moreover, although the processing device 1 of the present invention uses a torque limiter as the load applying means, the processing device 1 is not limited to the torque limiter as long as it has the function described in the embodiment.

It is a general view of the probe manufactured with the processing apparatus of this invention. It is the A section enlarged view of FIG. It is a top view of the processing apparatus of the probe of this invention. It is the front view which expanded and showed the conveyance part which conveys the probe used with the processing apparatus of FIG. It is the front view which expanded and showed the slide table, the holding stand installed on a slide table, a clutch, and a torque limiter. It is a figure which shows an example of the position at the time of sending a workpiece | work to a drawing process part, and feed speed. It is a perspective view of the guide member which positions the front-end | tip of the taper part of a workpiece | work to the front-end | tip of a drill, or the front-end | tip of a reamer in a drill process part and a reamer process part. FIG. 4 is a plan view of a polishing apparatus for polishing a probe processed by the processing apparatus of FIG. 3. It is a front view which expands and shows the principal part of the conveyance part of the grinding | polishing apparatus shown in FIG. It is the B section enlarged view of FIG. FIG. 4 is a plan view showing a state in which the X-axis transport device is moved to a position facing a drawing portion of the processing device in the processing device of FIG. 3. FIG. 4 is a plan view showing a state where the X-axis transport device is driven and the slide table is moved to the drawing unit side in the processing apparatus of FIG. 3. FIG. 13 is a plan view showing a state in which a taper portion and a parallel portion are formed on the work and the slide table is retracted in the processing apparatus of FIG. 12. It is a front view of the parallel part shape | molded by the workpiece | work. It is a half sectional view showing the lower half of the taper part and the parallel part which were formed in the work. It is a top view which shows the state which moved the X-axis conveying apparatus to the position facing the drilling part of a processing apparatus. FIG. 17 is a plan view illustrating a state in which the X-axis transport device is driven and the slide table is moved to the drilling unit side in the processing apparatus of FIG. 16. FIG. 18 is a plan view showing a state where the drill and the tapered portion and the parallel portion of the workpiece are positioned concentrically by the guide member in the processing apparatus of FIG. 17. It is a front view which shows the state which switched the clutch shown in FIG. 5 to the state of contact. It is a top view which shows the state which moved the X-axis conveying apparatus from the position shown in FIG. 17 to the position facing a reamer process part. In the processing apparatus of FIG. 20, the X-axis conveyance apparatus is driven and the slide table is moved to the reamer processing part side. It is a front view of the parallel part by which the dispensing hole of the workpiece was finished and shaped. It is a semi-sectional view showing the lower half of the taper part and the parallel part of the workpiece in which the dispensing holes are finished and shaped. It is a perspective view which shows typically the state which cuts the front-end | tip from the parallel part of the workpiece | work in which the dispensing hole was finished and shaped. It is a half sectional view showing the taper part of the work which cut the tip of the parallel part, and the lower half of the parallel part. FIG. 9 is a plan view showing a state in which the Y-axis transport device is driven to move the holding table to the grindstone side in the polishing apparatus shown in FIG. 8. FIG. 27 is a plan view showing a state in which the X-axis drive device and the Y-axis transport device are driven to move the Y-axis transport device from the position shown in FIG. 26 to the buff side of the polishing unit and the holding table is retracted. It is a top view which shows the state which driven the Y-axis conveying apparatus and moved the holding stand to the buff side from the position shown in FIG. It is a front view of the workpiece | work which gave the grinding process and the grinding | polishing process with the grinding | polishing apparatus. It is a front view of the workpiece | work which performed the grinding process and the grinding | polishing process without centering.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Processing apparatus 2 Conveying part 3 Drawing part 4 Drilling part 5 Reaming part 6 Input part 7 Control part 8 Probe 8a Probe main body 8b, 8c Cover 8d Base 8e Dispensing hole 9 Dicing saw 21 X-axis conveyance apparatus 22 X-axis Base 23 Ball screw 24 Motor 25 Slider 26 Slide table 27 Holding table 28 Collet chuck 29 Clutch 30 Torque limiter 31 Y-axis transport device 32 Y-axis base 33 Ball screw 34 Motor 35 Slider 36 Linear guide 41 Motor 42 Drill 43 Support member 44 Guide Member 44a Body 44b Recess 44c Positioning hole 51 Motor 52 Reamer 53 Support member 54 Guide member 100 Polishing device 102 Input unit 104 Control unit 110 Conveying unit 130 Grinding unit 140 Polishing unit 111 X-axis conveying device 112 X-axis base 113 Ball screw 114 Motor 115 Slider 121 Y-axis transport device 122 Y-axis base 123 Ball screw 124 Motor 125 Slider 126 Holding stand 126b Core pushing part 127 Collet chuck 128 Motor 128b Timing belt 129 Core pushing shaft 130 Grinding part 131 Motor 132 Timing belt 133 Transmission 134 Grinding wheel 140 Polishing part 141 Motor 142 Timing belt 143 Transmission 144 Buff Ac Central axis P Parallel part T Taper part W Workpiece

Claims (2)

A probe processing apparatus having a dispensing hole for sucking and discharging liquid,
A drawing section that applies a drawing process that narrows toward the tip to one end of the pipe;
A holding member that rotatably holds the pipe subjected to the drawing process;
Load applying means for applying a frictional load to the pipe so as to regulate rotational torque acting from the drawing portion via the pipe ;
The load applying means is a torque limiter,
The holding member and the torque limiter are provided on a slide table,
The torque limiter includes a fixed portion fixed to the slide table, and a movable portion movable according to a rotational torque acting on the pipe,
The probe processing apparatus , wherein the fixed portion incorporates a coil spring that regulates rotational torque acting on the movable portion . Conveying means for conveying the pipe to the drawing section;
The probe processing apparatus according to claim 1, further comprising: a control unit that controls a conveyance speed of the pipe to the drawing unit by the conveyance unit.

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