JP4553647B2 - Calix resorcinarene derivative and process for producing the same - Google Patents
Calix resorcinarene derivative and process for producing the same Download PDFInfo
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- JP4553647B2 JP4553647B2 JP2004196329A JP2004196329A JP4553647B2 JP 4553647 B2 JP4553647 B2 JP 4553647B2 JP 2004196329 A JP2004196329 A JP 2004196329A JP 2004196329 A JP2004196329 A JP 2004196329A JP 4553647 B2 JP4553647 B2 JP 4553647B2
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- 238000000034 method Methods 0.000 title description 19
- 150000001875 compounds Chemical class 0.000 claims description 36
- 125000004432 carbon atom Chemical group C* 0.000 claims description 29
- 125000000962 organic group Chemical group 0.000 claims description 28
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 17
- -1 resorcinol compound Chemical class 0.000 claims description 17
- 125000000217 alkyl group Chemical group 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 125000001624 naphthyl group Chemical group 0.000 claims description 14
- 239000001257 hydrogen Substances 0.000 claims description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims description 11
- GHMLBKRAJCXXBS-UHFFFAOYSA-N Resorcinol Natural products OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims description 7
- 125000002947 alkylene group Chemical group 0.000 claims description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 claims description 4
- 150000007970 thio esters Chemical class 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- WETWJCDKMRHUPV-UHFFFAOYSA-N acetyl chloride Chemical class CC(Cl)=O WETWJCDKMRHUPV-UHFFFAOYSA-N 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 229910052717 sulfur Inorganic materials 0.000 claims description 2
- 239000011593 sulfur Substances 0.000 claims description 2
- 150000003553 thiiranes Chemical class 0.000 claims description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 24
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 22
- 239000002904 solvent Substances 0.000 description 21
- 238000006243 chemical reaction Methods 0.000 description 20
- 239000007787 solid Substances 0.000 description 19
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 18
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 11
- 239000003054 catalyst Substances 0.000 description 10
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 9
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 9
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 9
- 150000003839 salts Chemical class 0.000 description 9
- 238000003756 stirring Methods 0.000 description 9
- 150000002170 ethers Chemical class 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 8
- NHGXDBSUJJNIRV-UHFFFAOYSA-M tetrabutylammonium chloride Chemical compound [Cl-].CCCC[N+](CCCC)(CCCC)CCCC NHGXDBSUJJNIRV-UHFFFAOYSA-M 0.000 description 8
- 239000003708 ampul Substances 0.000 description 7
- 150000002148 esters Chemical class 0.000 description 7
- 239000003505 polymerization initiator Substances 0.000 description 7
- 229960001755 resorcinol Drugs 0.000 description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 6
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 6
- 150000002430 hydrocarbons Chemical class 0.000 description 6
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 6
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
- 239000004215 Carbon black (E152) Substances 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 229930195733 hydrocarbon Natural products 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 4
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 4
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 4
- 125000006165 cyclic alkyl group Chemical group 0.000 description 4
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 4
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 125000003518 norbornenyl group Chemical group C12(C=CC(CC1)C2)* 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 230000035484 reaction time Effects 0.000 description 4
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 4
- 238000007086 side reaction Methods 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 4
- 125000004417 unsaturated alkyl group Chemical group 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 238000005160 1H NMR spectroscopy Methods 0.000 description 3
- AJSVLJJVMLIBOZ-UHFFFAOYSA-N 2-(phenoxymethyl)thiirane Chemical compound C1SC1COC1=CC=CC=C1 AJSVLJJVMLIBOZ-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000001299 aldehydes Chemical class 0.000 description 3
- 150000001408 amides Chemical class 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 238000010538 cationic polymerization reaction Methods 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 239000005453 ketone based solvent Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 3
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- YMBCJWGVCUEGHA-UHFFFAOYSA-M tetraethylammonium chloride Chemical compound [Cl-].CC[N+](CC)(CC)CC YMBCJWGVCUEGHA-UHFFFAOYSA-M 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VGCXGMAHQTYDJK-UHFFFAOYSA-N Chloroacetyl chloride Chemical compound ClCC(Cl)=O VGCXGMAHQTYDJK-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- PMPVIKIVABFJJI-UHFFFAOYSA-N Cyclobutane Chemical compound C1CCC1 PMPVIKIVABFJJI-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-WFGJKAKNSA-N Dimethyl sulfoxide Chemical compound [2H]C([2H])([2H])S(=O)C([2H])([2H])[2H] IAZDPXIOMUYVGZ-WFGJKAKNSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 238000004949 mass spectrometry Methods 0.000 description 2
- 238000001840 matrix-assisted laser desorption--ionisation time-of-flight mass spectrometry Methods 0.000 description 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- UMRZSTCPUPJPOJ-KNVOCYPGSA-N norbornane Chemical group C1C[C@H]2CC[C@@H]1C2 UMRZSTCPUPJPOJ-KNVOCYPGSA-N 0.000 description 2
- 239000012788 optical film Substances 0.000 description 2
- 125000003566 oxetanyl group Chemical group 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- LKFCPWBGBPJDRC-UHFFFAOYSA-M potassium;thiobenzate Chemical compound [K+].[O-]C(=S)C1=CC=CC=C1 LKFCPWBGBPJDRC-UHFFFAOYSA-M 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
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- 235000017557 sodium bicarbonate Nutrition 0.000 description 2
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 230000004580 weight loss Effects 0.000 description 2
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 1
- OXYKVVLTXXXVRT-UHFFFAOYSA-N (4-chlorobenzoyl) 4-chlorobenzenecarboperoxoate Chemical compound C1=CC(Cl)=CC=C1C(=O)OOC(=O)C1=CC=C(Cl)C=C1 OXYKVVLTXXXVRT-UHFFFAOYSA-N 0.000 description 1
- 150000005207 1,3-dihydroxybenzenes Chemical class 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 1
- LEJLJNPQUUZXSU-UHFFFAOYSA-N 3-methyl-1-(thiiran-2-yl)but-3-en-2-one Chemical compound C(=O)(C(=C)C)CC1CS1 LEJLJNPQUUZXSU-UHFFFAOYSA-N 0.000 description 1
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- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 0 CC(C)(CCC1(CCCC(C)(C)c(c(OC(CSC(C2CS*C(COC(c3ccccc3)=O)COc3ccccc3)C2Oc2ccccc2)=O)c2)c3)c(cc4)ccc4OC(CSC(COc4ccccc4)CSC(COC(c4ccccc4)=O)COc4ccccc4)=O)C1c3c2OC(CSC(COc1ccccc1)CSC(COC(c1ccccc1)=O)COc1ccccc1)=O Chemical compound CC(C)(CCC1(CCCC(C)(C)c(c(OC(CSC(C2CS*C(COC(c3ccccc3)=O)COc3ccccc3)C2Oc2ccccc2)=O)c2)c3)c(cc4)ccc4OC(CSC(COc4ccccc4)CSC(COC(c4ccccc4)=O)COc4ccccc4)=O)C1c3c2OC(CSC(COc1ccccc1)CSC(COC(c1ccccc1)=O)COc1ccccc1)=O 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
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- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
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- VTJUKNSKBAOEHE-UHFFFAOYSA-N calixarene Chemical class COC(=O)COC1=C(CC=2C(=C(CC=3C(=C(C4)C=C(C=3)C(C)(C)C)OCC(=O)OC)C=C(C=2)C(C)(C)C)OCC(=O)OC)C=C(C(C)(C)C)C=C1CC1=C(OCC(=O)OC)C4=CC(C(C)(C)C)=C1 VTJUKNSKBAOEHE-UHFFFAOYSA-N 0.000 description 1
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- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
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- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
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- 150000002431 hydrogen Chemical class 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
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- KGKNBDYZZIBZQL-UHFFFAOYSA-N tert-butyl carboxyoxy carbonate Chemical compound CC(C)(C)OC(=O)OOC(O)=O KGKNBDYZZIBZQL-UHFFFAOYSA-N 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 229920001567 vinyl ester resin Chemical group 0.000 description 1
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- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Polyethers (AREA)
Description
本発明は、新規なカリックスレゾルシンアレーン誘導体及びその製造方法に関する。 The present invention relates to a novel calixresorcinarene derivative and a method for producing the same.
カリックスレゾルシンアレーンはレゾルシノールとアルデヒド類が脱水縮合した大環状化合物であり、分子内水素結合により、主にレゾルシン環が４のものが生成する。カリックスレゾルシンアレーンは、比較的安価に製造することが可能で、また比較的容易に官能基を導入することが可能である。例えば特許文献１では、レゾルシン水酸基をオキセタン官能基を有する化合物で修飾し各種機能性材料への応用について報告されている。また、カリックスレゾルシンアレーンは、高耐熱性と分子サイズが小さいという観点から、半導体デバイス用レジストへの応用例も報告されている（特許文献２参照）。 The calix resorcinarene is a macrocyclic compound obtained by dehydration condensation of resorcinol and aldehydes, and those having 4 resorcin rings are mainly generated by intramolecular hydrogen bonding. The calix resorcinarene can be produced at a relatively low cost, and a functional group can be introduced relatively easily. For example, Patent Document 1 reports the application to various functional materials by modifying the resorcin hydroxyl group with a compound having an oxetane functional group. In addition, calixresorcinarene has been reported to be applied to resists for semiconductor devices from the viewpoint of high heat resistance and small molecular size (see Patent Document 2).
一方、カリックスレゾルシンアレーンは、芳香族環を多数有しかつ環状物であることから、高屈折率透明耐熱樹脂としても応用が可能である。代表的な高耐熱透明樹脂として例えばポリカーボネート類があるが、屈折率調整が難しくかつ線状高分子であるため複屈折が大きいという欠点を有している。また、ポリアクリレート類は透明性が高くかつ屈折率調整が比較的容易であるが、耐熱性に劣ることが知られている。
本発明の目的は、高屈折率を有するカリックスレゾルシンアレーン誘導体及びその製造方法を提供することにある。 An object of the present invention is to provide a calixresorcinarene derivative having a high refractive index and a method for producing the same.
本発明によれば、以下のカリックスレゾルシンアレーン誘導体及びその製造方法等を提供できる。
１．式（１）で表されるカリックスレゾルシンアレーン誘導体。
２．式（２）で表されるカリックスレゾルシンアレーン誘導体。
３．式（３）で表されるカリックスレゾルシンアレーン誘導体。
４．式（４）で表されるカリックスレゾルシンアレーン誘導体。
５．Ｘが酸素で、ｍが１である４に記載のカリックスレゾルシンアレーン誘導体。
６．３〜５のいずれか一に記載のカリックスレゾルシンアレーン誘導体を含む化合物を硬化させて得られる３次元硬化物。
７．下記式に示されるレゾルシノール誘導体にアセチルクロリド誘導体を反応させる１に記載のカリクスレゾルシンアレーン誘導体の製造方法。
８．１に記載の誘導体に、チオエステル誘導体のカリウム塩を反応させる２に記載のカリックスレゾルシンアレーン誘導体の製造方法。
９．２に記載の誘導体に、チイラン誘導体を反応させる３に記載のカリックスレゾルシンアレーン誘導体の製造方法。
１０．３に記載の誘導体に、エポキシ化合物又はチイラン化合物を反応させる４又は５に記載のカリックスレゾルシンアレーン誘導体の製造方法。
１１．３〜５のいずれか一項に記載のカリックスレゾルシンアレーン誘導体を、加熱又は活性エネルギー線照射を行うことによって硬化させる６に記載の３次元硬化物の製造方法。
According to the present invention, the following calixresorcinarene derivatives and methods for producing the same can be provided.
1. A calix resorcinarene derivative represented by the formula (1).
2. A calix resorcinarene derivative represented by the formula (2).
3. A calix resorcinarene derivative represented by the formula (3).
4). A calix resorcinarene derivative represented by the formula (4).
5). 5. The calix resorcinarene derivative according to 4, wherein X is oxygen and m is 1.
A three-dimensional cured product obtained by curing a compound containing the calix resorcinarene derivative according to any one of 6.3 to 5.
7). 2. The method for producing a calix resorcinarene derivative according to 1, wherein a resorcinol derivative represented by the following formula is reacted with an acetyl chloride derivative.
8. The method for producing a calixresorcinarene derivative according to 2, wherein the derivative according to 8.1 is reacted with a potassium salt of a thioester derivative.
The method for producing a calixresorcinarene derivative according to 3, wherein the derivative according to 9.2 is reacted with a thiirane derivative.
10. A method for producing a calixresorcinarene derivative according to 4 or 5, wherein the derivative described in 10.3 is reacted with an epoxy compound or a thiirane compound.
6. The method for producing a three-dimensional cured product according to 6, wherein the calix resorcinarene derivative according to any one of 11.3 to 5 is cured by heating or irradiation with active energy rays.
本発明によれば、高屈折率を有するカリックスアレーン誘導体及びその製造方法を提供できる。 According to the present invention, a calixarene derivative having a high refractive index and a method for producing the same can be provided.
本発明者らは、カリックスレゾルシンアレーンのレゾルシン水酸基について化学修飾の検討を詳細に行い、塩素基を有する誘導体を出発原料にしてポリチオエーテル鎖を伸長することにより、高屈折率樹脂を見出すことができた。 The present inventors have studied in detail the chemical modification of the resorcin hydroxyl group of calix resorcin arene and can find a high refractive index resin by extending the polythioether chain using a derivative having a chlorine group as a starting material. It was.
本発明の原材料であるカリックスレゾルシンアレーンは、レゾルシノール化合物とアルデヒド類から合成するが、レゾルシン基の水酸基の分子内水素結合により主にレゾルシン基４つのものが生成する。 The calix resorcinarene, which is a raw material of the present invention, is synthesized from a resorcinol compound and an aldehyde, and mainly four resorcin groups are generated by intramolecular hydrogen bonding of the hydroxyl group of the resorcin group.
式（１）〜（４）中のＲ１は、１〜２０の２価の有機基であり、例えばメチレン基やエチレン基等のアルキレン基やフェニレン基などの芳香族基及びそれらの置換化合物であるが、塩素基の反応性の観点からメチレン基等の炭素数１〜３のアルキレン基又はジニトロ置換フェニレン基等の電子吸引性基が望ましい。 R 1 in the formulas (1) to (4) is a divalent organic group of 1 to 20, for example, an alkylene group such as a methylene group or an ethylene group, an aromatic group such as a phenylene group, or a substituted compound thereof. However, from the viewpoint of the reactivity of the chlorine group, an alkylene group having 1 to 3 carbon atoms such as a methylene group or an electron withdrawing group such as a dinitro-substituted phenylene group is desirable.
式（２）〜（４）中のＲ３は、炭素数１〜２０の１価の有機基であり、例えばメチル基、エチル基、ｎ−プロピル基、イソプロピル基、ｎ−ブチル基、イソブチル基、ｓｅｃ−ブチル基、ｔ−ブチル基等の飽和アルキル基や、ビニル基、アリル基等の不飽和アルキル基や、シクロヘキシル基、ノルボルネン基等の飽和又は不飽和環状アルキル基や、フェニル基、ナフチル基等の芳香族基や、エーテル類、エステル類、及びそれらの置換化合物である。好ましくは、メチル基、エチル基、フェニル基である。 R 3 in the formulas (2) to (4) is a monovalent organic group having 1 to 20 carbon atoms, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group. Saturated alkyl groups such as sec-butyl group and t-butyl group, unsaturated alkyl groups such as vinyl group and allyl group, saturated or unsaturated cyclic alkyl groups such as cyclohexyl group and norbornene group, phenyl group and naphthyl group Aromatic groups such as groups, ethers, esters, and substituted compounds thereof. Preferably, they are a methyl group, an ethyl group, and a phenyl group.
式（３）、（４）中のＲ４及びＲ５はそれぞれ水素、又は炭素数１〜２０の１価の有機基であり、例えば、互いに独立してメチル基、エチル基、ｎ−プロピル基、イソプロピル基、ｎ−ブチル基、イソブチル基、ｓｅｃ−ブチル基、ｔ−ブチル基等の飽和アルキル基や、ビニル基、アリル基等の不飽和アルキル基や、シクロヘキシル基、ノルボルネン基等の飽和又は不飽和環状アルキル基や、フェニル基、ナフチル基等の芳香族基や、エーテル類、エステル類、及びそれらの置換化合物である。また、Ｒ４とＲ５が結合して環を形成してもよく、例えばシクロブタン、シクロペンタン、シクロヘキサン、シクロヘプタン、ノルボルナン環である。好ましくは、水素、メチル基、フェニルオキシアルキレン基である。
式（３）の誘導体の好適な分子量は、３０００〜２０００００である。
R 4 and R 5 in the formulas (3) and (4) are each hydrogen or a monovalent organic group having 1 to 20 carbon atoms, for example, a methyl group, an ethyl group, or an n-propyl group independently of each other. Saturated alkyl groups such as isopropyl group, n-butyl group, isobutyl group, sec-butyl group and t-butyl group, unsaturated alkyl groups such as vinyl group and allyl group, saturated cyclohexyl group and norbornene group, etc. An unsaturated cyclic alkyl group, an aromatic group such as a phenyl group and a naphthyl group, ethers, esters, and substituted compounds thereof. R 4 and R 5 may combine to form a ring, such as a cyclobutane, cyclopentane, cyclohexane, cycloheptane, or norbornane ring. Preferably, they are hydrogen, a methyl group, and a phenyloxyalkylene group.
The preferred molecular weight of the derivative of formula (3) is 3000-200000.
式（４）中のＲ６及びＲ７はそれぞれ水素、又は炭素数１〜２０の１価の有機基であり、例えば、互いに独立してメチル基、エチル基、ｎ−プロピル基、イソプロピル基、ｎ−ブチル基、イソブチル基、ｓｅｃ−ブチル基、ｔ−ブチル基等の飽和アルキル基や、ビニル基、アリル基等の不飽和アルキル基や、シクロヘキシル基、ノルボルネン基等の飽和又は不飽和環状アルキル基や、フェニル基、ナフチル基等の芳香族基や、エーテル類、エステル類、及びそれらの置換化合物である。また、Ｒ６とＲ７が結合して環を形成してもよく、例えばシクロブタン、シクロペンタン、シクロヘキサン、シクロヘプタン、ノルボルナン環である。好ましくは、Ｒ６又はＲ７は重合性基を有し、例えば、（メタ）アクリロイルオキシアルキル基等である。
式（４）の誘導体の好適な分子量は、３０００〜２０００００である。
R 6 and R 7 in formula (4) are each hydrogen or a monovalent organic group having 1 to 20 carbon atoms, for example, independently of each other, a methyl group, an ethyl group, an n-propyl group, an isopropyl group, Saturated alkyl groups such as n-butyl group, isobutyl group, sec-butyl group and t-butyl group, unsaturated alkyl groups such as vinyl group and allyl group, saturated or unsaturated cyclic alkyl groups such as cyclohexyl group and norbornene group Groups, aromatic groups such as phenyl and naphthyl groups, ethers, esters, and substituted compounds thereof. R 6 and R 7 may combine to form a ring, such as a cyclobutane, cyclopentane, cyclohexane, cycloheptane, or norbornane ring. Preferably, R 6 or R 7 has a polymerizable group, such as a (meth) acryloyloxyalkyl group.
The preferred molecular weight of the derivative of formula (4) is 3000-200000.
また式（１）〜（４）中のＲ２は、炭素数１〜２０の１価の有機基であり、例えばメチル基、エチル基、ｎ−プロピル基、イソプロピル基、ｎ−ブチル基、イソブチル基、ｓｅｃ−ブチル基、ｔ−ブチル基等の飽和アルキル基や、ビニル基、アリル基等の不飽和アルキル基や、シクロヘキシル基、ノルボルネン基等の飽和又は不飽和環状アルキル基や、フェニル基、ナフチル基等の芳香族基や、エーテル類、エステル類、及びそれらの置換化合物である。また、出発原料を合成する際、アルデヒド類にｐ−ヒドロキシベンズアルデヒドを用いれば、Ｒ２のベンゼン環のパラ位に、式（１）中のレゾルシン水酸基付加体と同様のものを導入することができる。
具体的には、式（１）中のＲ２は好ましくは炭素数１〜３のアルキル基又は下記式で表される有機基である。
Specifically, R 2 in formula (1) is preferably an alkyl group having 1 to 3 carbon atoms or an organic group represented by the following formula.
式（１）で示されるカリックスレゾルシンアレーン誘導体は、対応するレゾルシン水酸基に対応するアセチルクロリド誘導体を塩基存在下で反応させることにより得ることができる。用いる塩基としては、ピリジン、トリエチルアミン等のアミン化合物、水酸化ナトリウムや水酸化カリウム等の金属水酸化物等がある。塩基の量はフェノール水酸基に対し１〜１０倍量用いる。反応に用いる溶剤は、ジエチルエーテルやテトラヒドロフラン等のエーテル類、ジクロロメタンやクロロホルム等のハロゲン系溶媒、ヘキサンやトルエン等の炭化水素系溶媒である。また、無溶媒でも反応させることができる。反応温度は−７８℃〜１００℃の間で行うが好ましくは−５０℃〜５０℃、さらに好ましくは−５０℃〜２０℃である。反応温度が低いと反応時間が長くなり、また反応温度が高すぎると副反応が起こりやすくなる。 The calix resorcinarene derivative represented by the formula (1) can be obtained by reacting an acetyl chloride derivative corresponding to the corresponding resorcin hydroxyl group in the presence of a base. Examples of the base used include amine compounds such as pyridine and triethylamine, and metal hydroxides such as sodium hydroxide and potassium hydroxide. The amount of the base is 1 to 10 times the phenol hydroxyl group. Solvents used for the reaction are ethers such as diethyl ether and tetrahydrofuran, halogen solvents such as dichloromethane and chloroform, and hydrocarbon solvents such as hexane and toluene. Moreover, it can be made to react even without solvent. The reaction temperature is −78 ° C. to 100 ° C., preferably −50 ° C. to 50 ° C., more preferably −50 ° C. to 20 ° C. If the reaction temperature is low, the reaction time becomes long, and if the reaction temperature is too high, side reactions tend to occur.
式（２）で示されるカリックスレゾルシンアレーン誘導体は、式（１）で示される化合物に、チオエステル誘導体のカリウム塩を塩触媒存在下反応させることにより得ることができる。塩触媒としては、テトラブチルアンモニウムブロミドやテトラエチルアンモニウムクロリド等の４級アンモニウム塩や、リチウムクロリド、リチウムブロミド等の金属塩が用いられる。触媒量は、式（１）で示される化合物１００部に対し１〜１０部である。チオエステル誘導体のカリウム塩は式（１）で示される化合物に対し大過剰加え、反応途中でさらに追加してもよい。反応に用いる溶媒はエーテル類、ハロゲン系溶媒、炭化水素系溶媒の他に、Ｎ，Ｎ−ジメチルホルムアミドやＮ−メチルピロリドン等のアミド系溶媒、アセトンやシクロヘキサノン等のケトン系溶媒、酢酸エチル等のエステル類を用いることができる。反応温度は−７８℃〜１００℃の間で行うが、好ましくは−５０℃〜８０℃、さらに好ましくは−５０℃〜５０℃である。反応温度が低いと反応時間が長くなり、また反応温度が高すぎると副反応が起こりやすくなる。 The calixresorcinarene derivative represented by the formula (2) can be obtained by reacting the compound represented by the formula (1) with a potassium salt of a thioester derivative in the presence of a salt catalyst. As the salt catalyst, quaternary ammonium salts such as tetrabutylammonium bromide and tetraethylammonium chloride, and metal salts such as lithium chloride and lithium bromide are used. The amount of the catalyst is 1 to 10 parts with respect to 100 parts of the compound represented by the formula (1). The potassium salt of the thioester derivative may be added in a large excess relative to the compound represented by the formula (1), and may be further added during the reaction. Solvents used in the reaction include ethers, halogen solvents, hydrocarbon solvents, amide solvents such as N, N-dimethylformamide and N-methylpyrrolidone, ketone solvents such as acetone and cyclohexanone, and ethyl acetate. Esters can be used. The reaction temperature is between −78 ° C. and 100 ° C., preferably −50 ° C. to 80 ° C., more preferably −50 ° C. to 50 ° C. If the reaction temperature is low, the reaction time becomes long, and if the reaction temperature is too high, side reactions tend to occur.
式（３）で示されるカリックスレゾルシンアレーン誘導体は、式（２）で示される化合物に、対応するチイラン化合物を塩触媒存在下反応させることによって得ることができる。塩触媒としては、テトラブチルアンモニウムブロミドやテトラエチルアンモニウムクロリド等の４級アンモニウム塩や、リチウムクロリド、リチウムブロミド等の金属塩が用いられる。触媒量は、式（１）で示される化合物の官能基量と等量が好ましい。反応に用いる溶媒はエーテル類、ハロゲン系溶媒、炭化水素系溶媒の他に、Ｎ，Ｎ−ジメチルホルムアミドやＮ−メチルピロリドン等のアミド系溶媒、アセトンやシクロヘキサノン等のケトン系溶媒、酢酸エチル等のエステル類を用いることができる。また、無溶媒でも反応させることができる。反応温度は０〜１５０℃の間で行うが、好ましくは２０℃〜１００℃、さらに好ましくは５０℃〜１００℃である。反応温度が低いと反応時間が長くなり、また反応温度が高すぎると副反応が起こりやすくなる。反応は、アンプル封管等、水分を除去できる状態で行うのが望ましい。 The calixresorcinarene derivative represented by the formula (3) can be obtained by reacting the compound represented by the formula (2) with the corresponding thiirane compound in the presence of a salt catalyst. As the salt catalyst, quaternary ammonium salts such as tetrabutylammonium bromide and tetraethylammonium chloride, and metal salts such as lithium chloride and lithium bromide are used. The amount of the catalyst is preferably equal to the amount of the functional group of the compound represented by the formula (1). Solvents used in the reaction include ethers, halogen solvents, hydrocarbon solvents, amide solvents such as N, N-dimethylformamide and N-methylpyrrolidone, ketone solvents such as acetone and cyclohexanone, and ethyl acetate. Esters can be used. Moreover, it can be made to react even without solvent. Although reaction temperature is performed between 0-150 degreeC, Preferably it is 20 to 100 degreeC, More preferably, it is 50 to 100 degreeC. If the reaction temperature is low, the reaction time becomes long, and if the reaction temperature is too high, side reactions tend to occur. The reaction is desirably performed in a state where moisture can be removed, such as an ampoule sealed tube.
式（４）で示されるカリックスレゾルシンアレーン誘導体は、式（３）で示される化合物に、対応するチイラン化合物又はエポキシ化合物を塩触媒存在下反応させることによって得ることができる。塩触媒としては、テトラブチルアンモニウムブロミドやテトラエチルアンモニウムクロリド等の４級アンモニウム塩や、リチウムクロリド、リチウムブロミド等の金属塩が用いられる。触媒量は、式（３）で示される化合物の官能基量と等量が好ましい。反応に用いる溶媒はエーテル類、ハロゲン系溶媒、炭化水素系溶媒の他に、Ｎ，Ｎ−ジメチルホルムアミドやＮ−メチルピロリドン等のアミド系溶媒、アセトンやシクロヘキサノン等のケトン系溶媒、酢酸エチル等のエステル類を用いることができる。また、無溶媒でも反応させることができる。反応温度は０〜１５０℃の間で行うが、好ましくは２０℃〜１００℃、さらに好ましくは５０℃〜１００℃である。反応温度が低いと反応時間が長くなり、また反応温度が高すぎると副反応が起こりやすくなる。反応は、アンプル封管等、水分を除去できる状態で行うのが望ましい。 The calixresorcinarene derivative represented by the formula (4) can be obtained by reacting the compound represented by the formula (3) with the corresponding thiirane compound or epoxy compound in the presence of a salt catalyst. As the salt catalyst, quaternary ammonium salts such as tetrabutylammonium bromide and tetraethylammonium chloride, and metal salts such as lithium chloride and lithium bromide are used. The amount of the catalyst is preferably equal to the amount of the functional group of the compound represented by the formula (3). Solvents used in the reaction include ethers, halogen solvents, hydrocarbon solvents, amide solvents such as N, N-dimethylformamide and N-methylpyrrolidone, ketone solvents such as acetone and cyclohexanone, and ethyl acetate. Esters can be used. Moreover, it can be made to react even without solvent. Although reaction temperature is performed between 0-150 degreeC, Preferably it is 20 to 100 degreeC, More preferably, it is 50 to 100 degreeC. If the reaction temperature is low, the reaction time becomes long, and if the reaction temperature is too high, side reactions tend to occur. The reaction is desirably performed in a state where moisture can be removed, such as an ampoule sealed tube.
式（３）及び式（４）で示される化合物中に、２重結合や３重結合をもつ不飽和炭化水素基や、アクリル基やメタクリル基、シクロプロパン基やシクロブタン基等の高歪炭化水素基、ビニルエーテル基、ビニルエステル基、エポキシ基やオキセタン基等の環状エーテル基などラジカル重合性やカチオン、アニオン重合性を有する基を含む場合、対応する重合触媒を加え加熱又は光等の活性エネルギー線を照射することによって、３次元硬化物を得ることができる。 High strain hydrocarbon such as unsaturated hydrocarbon group having double bond or triple bond, acrylic group, methacryl group, cyclopropane group or cyclobutane group in the compound represented by formula (3) or formula (4) Group, vinyl ether group, vinyl ester group, cyclic ether group such as epoxy group and oxetane group, etc. Can be obtained to obtain a three-dimensional cured product.
熱ラジカル重合開始剤としては、特に制限されず公知のものが使用できる。代表的なものを例示すると、ベンゾイルパーオキシド、ｐ−クロルベンゾイルパーオキシド、ラウロイルパーオキシド、ｔ−ブチルパーオキシジカーボネート等のパーオキシド、アゾイソブチロニトリル等のアゾ化合物である。熱ラジカル重合開始剤の使用量は、重合条件や開始剤の種類、重合性モノマーの種類や組成によって異なるため一概に限定できないが、一般には重合性基に対して０．０１〜１０当量％の範囲で用いるのが好適である。重合温度及び重合時間は、重合開始剤の種類と量や重合性モノマーの種類によって大きく変化するので限定できないが、一般には２〜４０時間で重合が完結するように条件を選ぶのが好ましい。 The thermal radical polymerization initiator is not particularly limited and known ones can be used. Typical examples are peroxides such as benzoyl peroxide, p-chlorobenzoyl peroxide, lauroyl peroxide, t-butyl peroxydicarbonate, and azo compounds such as azoisobutyronitrile. The amount of the thermal radical polymerization initiator used varies depending on the polymerization conditions, the type of initiator, the type and composition of the polymerizable monomer, and cannot be generally limited, but is generally 0.01 to 10 equivalent% with respect to the polymerizable group. It is preferable to use within a range. The polymerization temperature and polymerization time are not limited because they vary greatly depending on the type and amount of the polymerization initiator and the type of polymerizable monomer, but it is generally preferable to select conditions so that the polymerization is completed in 2 to 40 hours.
また紫外線、可視光、あるいは放射線等の活性エネルギー線を用いたラジカル重合の開始剤としては、特に制限されず公知のものが使用できる。代表的なものとして、ベンゾインメチルエーテル、ベンゾフェノン、アセトフェノン、ベンジルメチルケタール、２−イソプロピルチオキサントン等が用いられる。これらの重合開始剤は、重合性基に対して０．００１〜５当量％の範囲で用いるのが一般的である。 The initiator for radical polymerization using active energy rays such as ultraviolet rays, visible light, or radiation is not particularly limited, and known ones can be used. Representative examples include benzoin methyl ether, benzophenone, acetophenone, benzylmethyl ketal, 2-isopropylthioxanthone and the like. These polymerization initiators are generally used in the range of 0.001 to 5 equivalent% with respect to the polymerizable group.
熱カチオン重合開始剤としては、特に制限されず公知のものが使用できる。代表的なものを例示すると、塩化アルミニウム、４塩化スズ、４塩化チタン等が用いられる。熱カチオン重合開始剤の使用量は、重合条件や開始剤の種類、重合性モノマーの種類や組成によって異なるため一概に限定できないが、一般には重合性基に対して０．０１〜１０当量％の範囲で用いるのが好適である。重合温度及び重合時間は、重合開始剤の種類と量や重合性モノマーの種類によって大きく変化するので限定できないが、一般には２〜４０時間で重合が完結するように条件を選ぶのが好ましい。 The thermal cationic polymerization initiator is not particularly limited and known ones can be used. As a typical example, aluminum chloride, tin chloride, titanium tetrachloride and the like are used. The amount of the thermal cationic polymerization initiator used varies depending on the polymerization conditions, the type of initiator, the type and composition of the polymerizable monomer, and cannot be generally limited, but is generally 0.01 to 10 equivalent% with respect to the polymerizable group. It is preferable to use within a range. The polymerization temperature and polymerization time are not limited because they vary greatly depending on the type and amount of the polymerization initiator and the type of polymerizable monomer, but it is generally preferable to select conditions so that the polymerization is completed in 2 to 40 hours.
また紫外線、可視光、あるいは放射線等の活性エネルギー線を用いたカチオン重合の開始剤としては、特に制限されず公知のものが使用できる。代表的なものとして、スルホニウム塩類、ヨードニウム塩類等が用いられる。これらの重合開始剤は、重合性基に対して０．００１〜５当量％の範囲で用いるのが一般的である。アニオン重合開始剤としては、特に制限されず公知のものが使用できる。代表的なものを例示すると、水酸化カリウムや水酸化ナトリウム、金属リチウム等が用いられる。 The initiator for cationic polymerization using active energy rays such as ultraviolet rays, visible light, or radiation is not particularly limited, and known ones can be used. Typical examples include sulfonium salts and iodonium salts. These polymerization initiators are generally used in the range of 0.001 to 5 equivalent% with respect to the polymerizable group. The anionic polymerization initiator is not particularly limited, and known ones can be used. As typical examples, potassium hydroxide, sodium hydroxide, metallic lithium and the like are used.
以上の触媒に、各種増感剤や助触媒を加えてもよい。また、３次元硬化物の物性を制御するために、酸化防止剤、金属不活性化剤、紫外線吸収剤、難燃剤、安定剤、レベリング剤等の各種添加剤を加えてもよい。 Various sensitizers and promoters may be added to the above catalyst. In order to control the physical properties of the three-dimensional cured product, various additives such as an antioxidant, a metal deactivator, an ultraviolet absorber, a flame retardant, a stabilizer, and a leveling agent may be added.
さらに、３次元硬化物の特性を高める目的で、シリカや酸化チタン等無機フィラーや有機フィラーを任意の割合で加えてもよい。 Furthermore, for the purpose of enhancing the properties of the three-dimensional cured product, an inorganic filler such as silica or titanium oxide or an organic filler may be added at an arbitrary ratio.
式（３）及び式（４）で示される化合物中に、エポキシ樹脂、アクリル樹脂、ポリスチレン、ポリアミド、ポリイミド、ポリアミドイミド、ポリオレフィン、シロキサンポリマー等の各種ポリマーを任意の割合でブレンドしてもよい。 Various compounds such as epoxy resin, acrylic resin, polystyrene, polyamide, polyimide, polyamideimide, polyolefin, and siloxane polymer may be blended in the compound represented by formula (3) and formula (4) in an arbitrary ratio.
以下、実施例により本発明の樹脂の製造法について詳細に説明するが、本発明はこれら実施例に制限されない。 Hereinafter, although the Example demonstrates the manufacturing method of resin of this invention in detail, this invention is not restrict | limited to these Examples.
（実施例１）
式（５）で示される化合物（以下（５）と略す）を下記の方法で合成した。
得られた化合物の分析結果を以下に示す。
質量分析（ＭＡＬＤＩ−ＴＯＦ ＭＳ）
計算値（ｍ／ｚ）１１７９．４４（Ｍ＋Ｎａ）＋、
実測値（ｍ／ｚ）１１７７．３０（Ｍ＋Ｎａ）＋
ＩＲ（ｃｍ−１）：２９６８、１７６９、１４９１、１２３４
１Ｈ−ＮＭＲ（５００ＭＨｚ、ＤＭＳＯ−ｄ６）：δ（ｐｐｍ）１．５１（ｄ、３Ｈ）、４．０９〜４．３６（ｍ、５Ｈ）、５．９８〜７．４１（ｍ、２Ｈ）
Example 1
A compound represented by the formula (5) (hereinafter abbreviated as (5)) was synthesized by the following method.
The analysis results of the obtained compound are shown below.
Mass spectrometry (MALDI-TOF MS)
Calculated value (m / z) 1179.44 (M + Na) + ,
Actual value (m / z) 1177.30 (M + Na) +
IR (cm-1): 2968, 1769, 1491, 1234
1 H-NMR (500 MHz, DMSO-d 6 ): δ (ppm) 1.51 (d, 3H), 4.09 to 4.36 (m, 5H), 5.98 to 7.41 (m, 2H) )
（実施例２）
式（７）で示される化合物（以下（７）と略す）を下記の方法で合成した。
得られた化合物の分析結果を以下に示す。
質量分析（ＭＡＬＤＩ−ＴＯＦ ＭＳ）
計算値（ｍ／ｚ）１１７９．４４（Ｍ＋Ｎａ）＋、
実測値（ｍ／ｚ）１１７７．３０（Ｍ＋Ｎａ）＋
ＩＲ（ｃｍ−１）：２９６８、１７６９、１４９１、１２３４
１Ｈ−ＮＭＲ（５００ＭＨｚ、ＤＭＳＯ−ｄ６）：δ（ｐｐｍ）１．５１（ｄ、３Ｈ）、４．０９〜４．３６（ｍ、５Ｈ）、５．９８〜７．４１（ｍ、２Ｈ）
(Example 2)
A compound represented by the formula (7) (hereinafter abbreviated as (7)) was synthesized by the following method.
The analysis results of the obtained compound are shown below.
Mass spectrometry (MALDI-TOF MS)
Calculated value (m / z) 1179.44 (M + Na) + ,
Actual value (m / z) 1177.30 (M + Na) +
IR (cm −1 ): 2968, 1769, 1491, 1234
1 H-NMR (500 MHz, DMSO-d6): δ (ppm) 1.51 (d, 3H), 4.09 to 4.36 (m, 5H), 5.98 to 7.41 (m, 2H)
（実施例３）
式（９）で示される化合物（以下（９）と略す）を下記の方法で合成した。
得られた化合物の分析結果を以下に示す。
融点８６．５〜８８．０℃
ＩＲ（ｃｍ−１）：３０２６、１７６４、１６６７、１５９５、１５０４、１１２３、７７２
１Ｈ−ＮＭＲ（５００ＭＨｚ、ＣＤＣｌ３）：δ（ｐｐｍ）３．６７〜４．１９（ｍ、９Ｈ）、５．７１（ｓ、１Ｈ）、６．２０〜７．３２（ｍ、６Ｈ）、７．４０〜８．００（ｍ、１５Ｈ）
(Example 3)
A compound represented by the formula (9) (hereinafter abbreviated as (9)) was synthesized by the following method.
The analysis results of the obtained compound are shown below.
Melting point 86.5-88.0 ° C
IR (cm-1): 3026, 1764, 1667, 1595, 1504, 1123, 772
1 H-NMR (500 MHz, CDCl 3 ): δ (ppm) 3.67 to 4.19 (m, 9H), 5.71 (s, 1H), 6.20 to 7.32 (m, 6H), 7.40-8.00 (m, 15H)
（実施例４）
式（１０）で示される化合物（以下（１０）と略す）を下記の方法で合成した。
得られた化合物の分子量をＧＰＣ法で測定したところ、数平均分子量１．７ｘ１０４、分散度１．８であった。
また、３−フェノキシプロピレンスルフィドの量を変えて同様の条件で反応を行い、屈折率を測定したところ以下の値が得られた。
A compound represented by the formula (10) (hereinafter abbreviated as (10)) was synthesized by the following method.
When the molecular weight of the obtained compound was measured by the GPC method, it was a number average molecular weight of 1.7 × 10 4 and a dispersity of 1.8.
Moreover, when the reaction was carried out under the same conditions while changing the amount of 3-phenoxypropylene sulfide and the refractive index was measured, the following values were obtained.
（実施例５）
式（１１）で示される化合物（以下（１１）と略す）を下記の方法で合成した。
得られた化合物の分子量をＧＰＣ法で測定したところ、数平均分子量９．２ｘ１０３、分散度１．５であった。
(Example 5)
A compound represented by the formula (11) (hereinafter abbreviated as (11)) was synthesized by the following method.
When the molecular weight of the obtained compound was measured by GPC method, it was number average molecular weight 9.2 × 10 3 and dispersity 1.5.
（実施例６）
式（１２）で示される化合物（以下（１２）と略す）を下記の方法で合成した。
得られた化合物の分子量をＧＰＣ法で測定したところ、数平均分子量１．５ｘ１０４、分散度１．９であった。
(Example 6)
A compound represented by the formula (12) (hereinafter abbreviated as (12)) was synthesized by the following method.
When the molecular weight of the obtained compound was measured by the GPC method, it was a number average molecular weight of 1.5 × 10 4 and a dispersity of 1.9.
（実施例７）
式（１３）で示される化合物（以下（１３）と略す）を下記の方法で合成した。
得られた化合物の分子量をＧＰＣ法で測定したところ、数平均分子量９．５ｘ１０３、分散度１．９であった。
(Example 7)
A compound represented by the formula (13) (hereinafter abbreviated as (13)) was synthesized by the following method.
When the molecular weight of the obtained compound was measured by the GPC method, it was a number average molecular weight of 9.5 × 10 3 and a dispersity of 1.9.
（実施例８）
（１２）の３次元硬化物を下記の方法で合成した。
（１２）１．０ｇをＮ，Ｎ−ジメチルアセトアミド１ｍｌに溶解し、アゾイソブチロニトリル０．０１ｇを加える。溶液をポリエチレンテレフタレートフィルム上にキャストし、オーブン中６０℃で２０時間加熱後ポリエチレンテレフタレートフィルムからはがしフィルム状の淡黄色固体を得た。
得られた固体のガラス転移温度をＤＳＣ法で測定したところ、Ｔｇ＝１４５℃であった。固体の熱分解開始温度を測定したところ、空気中で５％重量減少する温度は２９０℃であった。また固体の屈折率をアッベ法で測定したところ、ｎＤ＝１．６９であった。
(Example 8)
The three-dimensional cured product (12) was synthesized by the following method.
(12) 1.0 g is dissolved in 1 ml of N, N-dimethylacetamide, and 0.01 g of azoisobutyronitrile is added. The solution was cast on a polyethylene terephthalate film, heated in an oven at 60 ° C. for 20 hours, and then peeled off from the polyethylene terephthalate film to obtain a film-like pale yellow solid.
It was Tg = 145 degreeC when the glass transition temperature of the obtained solid was measured by DSC method. When the thermal decomposition start temperature of the solid was measured, the temperature at which 5% weight loss was observed in air was 290 ° C. Moreover, it was nD = 1.69 when the refractive index of solid was measured by the Abbe method.
（実施例９）
（１３）の３次元硬化物を下記の方法で合成した。
（１３）１．０ｇをＮ，Ｎ−ジメチルアセトアミド１ｍｌに溶解し、アゾイソブチロニトリル０．０１ｇを加える。溶液をポリエチレンテレフタレートフィルム上にキャストし、オーブン中６０℃で２０時間加熱後ポリエチレンテレフタレートフィルムからはがしフィルム状の淡黄色固体を得た。
得られた固体のガラス転移温度をＤＳＣ法で測定したところ、Ｔｇ＝１３０℃であった。固体の熱分解開始温度を測定したところ、空気中で５％重量減少する温度は２８９℃であった。また固体の屈折率をアッベ法で測定したところ、ｎＤ＝１．６８であった。
Example 9
The three-dimensional cured product (13) was synthesized by the following method.
(13) 1.0 g is dissolved in 1 ml of N, N-dimethylacetamide, and 0.01 g of azoisobutyronitrile is added. The solution was cast on a polyethylene terephthalate film, heated in an oven at 60 ° C. for 20 hours, and then peeled off from the polyethylene terephthalate film to obtain a film-like pale yellow solid.
It was Tg = 130 degreeC when the glass transition temperature of the obtained solid was measured by DSC method. When the thermal decomposition start temperature of the solid was measured, the temperature at which 5% weight loss was observed in air was 289 ° C. Moreover, it was nD = 1.68 when the refractive index of solid was measured by the Abbe method.
新規カリックスレゾルシンアレーン誘導体を用いることにより、高耐熱性を有し屈折率調整可能であり、さらに高屈折率を有する樹脂を提供でき、この樹脂を用いることにより光学レンズ、光学フィルム、光学フィルムを用いた液晶表示装置などの用途に適用することができる。 By using a new calixresorcinarene derivative, it is possible to provide a resin having high heat resistance and adjustable refractive index, and further having a high refractive index. By using this resin, optical lenses, optical films, and optical films can be used. It can be applied to applications such as liquid crystal display devices.
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| JP2008019234A (en) * | 2006-06-14 | 2008-01-31 | Hitachi Chem Co Ltd | Graft polymer having sulfur atom in side chain, and method for producing the same |
| JP2008019233A (en) * | 2006-06-14 | 2008-01-31 | Hitachi Chem Co Ltd | Graft polymer having sulfur atom in side chain, and method for producing the same |
| JP2008031134A (en) * | 2006-07-07 | 2008-02-14 | Hitachi Chem Co Ltd | Phenol derivative and method for producing the same |
| JP5191682B2 (en) * | 2007-01-30 | 2013-05-08 | 日立化成株式会社 | Phenol derivative having anthracene residue in side chain and method for producing the same |
| JP4977099B2 (en) * | 2008-07-31 | 2012-07-18 | Ｊｓｒ株式会社 | Radical polymerizable group-containing cyclic polysulfide, process for producing the same, and polymer thereof |
| EP2474565B1 (en) * | 2009-08-31 | 2019-11-27 | Mitsubishi Gas Chemical Company, Inc. | Cyclic compound, manufacturing method therefor, radiation-sensitive composition, and method for forming a resist pattern |
| JP5825104B2 (en) | 2009-10-06 | 2015-12-02 | 三菱瓦斯化学株式会社 | CYCLIC COMPOUND, PROCESS FOR PRODUCING THE SAME, RADIATION-SENSITIVE COMPOSITION AND METHOD FOR FORMING RESIST PATTERN |
| KR101870298B1 (en) * | 2010-07-30 | 2018-07-23 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | Compound, radiation-sensitive composition, and method for forming resist pattern |
| CN114133548B (en) * | 2020-09-03 | 2022-12-13 | 华为技术有限公司 | Polycarbonate and preparation method thereof, thermoplastic composition, optical product and equipment |
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| JP2003321423A (en) * | 2002-05-09 | 2003-11-11 | Jsr Corp | Calixresorcinarene derivative and radiation-sensitive resin composition |
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