JP4537955B2 - データキャリアを製造する方法 - Google Patents
データキャリアを製造する方法 Download PDFInfo
- Publication number
- JP4537955B2 JP4537955B2 JP2005501327A JP2005501327A JP4537955B2 JP 4537955 B2 JP4537955 B2 JP 4537955B2 JP 2005501327 A JP2005501327 A JP 2005501327A JP 2005501327 A JP2005501327 A JP 2005501327A JP 4537955 B2 JP4537955 B2 JP 4537955B2
- Authority
- JP
- Japan
- Prior art keywords
- support
- support strip
- data carrier
- support element
- plug
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Clamps And Clips (AREA)
Description
・オーバーモールド工程;ここでは、複数のデータキャリア本体が得られるように、前記支持体ストリップの支持体エレメントがオーバーモールドされる;
・マイクロ回路接続工程;ここでは、マイクロ回路がデータキャリア本体の配線パッドに電気的に接続されて、複数のデータキャリアが得られる。
こうして、連続様式でGSMプラグが製造される。
・オーバーモールド工程;ここでは、複数のデータキャリア本体が得られるように、支持体ストリップの支持体エレメントがオーバーモールドされる;
・マイクロ回路接続工程;ここでは、複数のデータキャリアが得られるように、複数のマイクロ回路がデータキャリア本体の配線パッド(3)に電気的に接続される。
Claims (7)
- 概ね平行な少なくとも1つのグリップ領域(10)と、
それぞれが複数の導電性素子を含み、当該導電性素子がコンタクトパッド及び配線パッドを含んでいる、第一の支持体エレメント(1a)及び少なくとも第二の支持体エレメント(1b、1c)とを具備する支持体ストリップにおいて、
前記各支持体エレメント(1a、1b、1c)は、少なくとも1つのスナップオフ連結領域(11)によって前記少なくとも1つのグリップ領域(10)と接続され、
前記各支持体エレメント(1a、1b、1c)は、オーバーモールドして第一及び第二のデータキャリア本体それぞれを得るよう構成されている、
ことを特徴とする支持体ストリップ。 - 請求項1に記載の支持体ストリップにおいて、前記支持体エレメント(1a)が支持体格子であることを特徴とする支持体ストリップ。
- 請求項1に記載の支持体ストリップにおいて、前記支持体エレメント(1a)が第一の失敗防止エッジ(foolproofing edge)(6a)を具備することを特徴とする支持体ストリップ。
- 請求項3に記載の支持体ストリップにおいて、前記支持体エレメント(1a)が第二の失敗防止エッジ(6b)を具備することを特徴とする支持体ストリップ。
- 請求項2に記載の支持体ストリップにおいて、前記支持体格子(1a)が金属製であることを特徴とする支持体ストリップ。
- 請求項1に記載の支持体ストリップにおいて、前記各支持体エレメント(1a、1b、1c)は、その形状が実質的にGSM 11.11規格に従う輪郭を有することを特徴とする支持体ストリップ。
- 請求項1に記載の支持体ストリップにおいて、前記支持体エレメント(1a)が電子部品を収容するように構成される支持体ストリップ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02292545 | 2002-10-15 | ||
EP03290338.7A EP1411550A2 (fr) | 2002-10-15 | 2003-02-11 | Boítier électronique |
PCT/IB2003/004536 WO2004036648A2 (en) | 2002-10-15 | 2003-10-15 | Method of manufacturing a data carrier |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006503383A JP2006503383A (ja) | 2006-01-26 |
JP4537955B2 true JP4537955B2 (ja) | 2010-09-08 |
Family
ID=32044348
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005501327A Expired - Fee Related JP4537955B2 (ja) | 2002-10-15 | 2003-10-15 | データキャリアを製造する方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7242079B2 (ja) |
EP (1) | EP1554754A2 (ja) |
JP (1) | JP4537955B2 (ja) |
AU (1) | AU2003269337A1 (ja) |
WO (1) | WO2004036648A2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004028218B4 (de) * | 2004-06-09 | 2006-06-29 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung eines tragbaren Datenträgers |
EP1785916B1 (de) | 2005-11-14 | 2009-08-19 | Tyco Electronics France SAS | Smartcard-Körper, Smartcard und Herstellungsverfahren |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
USD701864S1 (en) | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3123198C2 (de) * | 1980-12-08 | 1993-10-07 | Gao Ges Automation Org | Trägerelemente für einen IC-Baustein |
FR2584862B1 (fr) * | 1985-07-12 | 1988-05-20 | Eurotechnique Sa | Procede de fabrication en continu de micromodules pour cartes contenant des composants, bande continue de micromodules et micromodules realises selon un tel procede |
JPH0815829B2 (ja) * | 1987-11-27 | 1996-02-21 | 松下電器産業株式会社 | Icカード用モジュールの製造方法 |
FR2632100B1 (fr) * | 1988-05-25 | 1992-02-21 | Schlumberger Ind Sa | Procede de realisation d'une carte a memoire electronique et cartes a memoire electronique obtenue par la mise en oeuvre dudit procede |
FR2645680B1 (fr) * | 1989-04-07 | 1994-04-29 | Thomson Microelectronics Sa Sg | Encapsulation de modules electroniques et procede de fabrication |
JP3686358B2 (ja) * | 1993-08-02 | 2005-08-24 | 大日本印刷株式会社 | 板状枠体付きicキャリア、およびその製造方法 |
US5581065A (en) * | 1993-08-02 | 1996-12-03 | Dai Nippon Printing Co., Ltd. | Sheet-framed IC carrier, method for producing the same, and IC carrier case |
FR2741191B1 (fr) * | 1995-11-14 | 1998-01-09 | Sgs Thomson Microelectronics | Procede de fabrication d'un micromodule, notamment pour cartes a puces |
DE19816066A1 (de) * | 1998-04-09 | 1999-10-14 | Philips Patentverwaltung | Folie als Träger von integrierten Schaltungen |
DE19943092A1 (de) | 1999-09-09 | 2001-03-15 | Orga Kartensysteme Gmbh | Datenträger mit Halbleiterschaltkreis und abtrennbarem optischen Speichermedium |
US6641049B2 (en) * | 2000-08-31 | 2003-11-04 | Pacusma Company, Ltd. | Integrated circuit card with multiple integral electronic modules |
FR2817374B1 (fr) * | 2000-11-28 | 2003-02-21 | Schlumberger Systems & Service | Support electronique d'informations |
-
2003
- 2003-10-15 WO PCT/IB2003/004536 patent/WO2004036648A2/en active Search and Examination
- 2003-10-15 EP EP03751118A patent/EP1554754A2/en not_active Withdrawn
- 2003-10-15 US US10/531,365 patent/US7242079B2/en not_active Expired - Fee Related
- 2003-10-15 JP JP2005501327A patent/JP4537955B2/ja not_active Expired - Fee Related
- 2003-10-15 AU AU2003269337A patent/AU2003269337A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP1554754A2 (en) | 2005-07-20 |
US20060012023A1 (en) | 2006-01-19 |
US7242079B2 (en) | 2007-07-10 |
WO2004036648A2 (en) | 2004-04-29 |
JP2006503383A (ja) | 2006-01-26 |
WO2004036648A3 (en) | 2004-07-15 |
AU2003269337A1 (en) | 2004-05-04 |
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