JP4526870B2 - Ink jet head, ink jet recording apparatus, and method of manufacturing ink jet head - Google Patents

Description

  The present invention relates to an inkjet head, an inkjet recording apparatus, and an inkjet head manufacturing method.

  2. Description of the Related Art Conventionally, an ink jet recording apparatus such as an ink jet printer is provided with an ink jet head that selectively ejects ink as ink droplets from a plurality of nozzles to a recording medium, and is an apparatus that records an image on a recording medium using the ink jet head. is there.

  In such an ink jet head, warpage, undulation, or the like may occur due to a temperature change caused by a recording operation or a use environment, and damage such as a crack may occur. In particular, in the process of manufacturing an ink jet head, a thermosetting adhesive (heat bonding) is often used, and the heat applied at this time causes warping or undulation and breakage such as cracks. It may end up. In order to prevent this, techniques such as Patent Document 1 and Patent Document 2 have been proposed.

  Patent Document 1 proposes a technique for suppressing the occurrence of warpage, cracks, and the like due to temperature changes by forming a recording element substrate, a top plate provided with a liquid chamber, and a holding substrate that supports the recording element substrate with the same material. Has been.

  In Patent Document 2, there is a technique for suppressing the occurrence of warpage and undulation due to temperature change by providing a dummy substrate having a thermal expansion coefficient equivalent to that of the substrate on the back surface of the substrate made of a piezoelectric member and having a plurality of grooves on the surface. Proposed.

JP-A-9-52365 JP-A-10-157105

  However, as in Patent Document 1, if the recording element substrate, the top plate provided with the liquid chamber, and the holding substrate that supports the recording element substrate are formed of the same material, the shape and size of these plate members, etc. Therefore, there is a problem that it is impossible to completely suppress the occurrence of warpage, cracks, and the like due to temperature changes. In particular, when heat bonding is performed in the process of manufacturing an inkjet head, it is not possible to completely suppress the occurrence of warpage, cracks, and the like due to the heating.

  Further, as in Patent Document 2, simply by providing a dummy substrate having a thermal expansion coefficient equivalent to that of the substrate on the back surface of the substrate made of a piezoelectric member, the shape, size, etc. of these substrates are different. There is a problem that it is not possible to completely suppress the occurrence of warping and undulation due to changes. In particular, when heat bonding is performed in the process of manufacturing an inkjet head, it is not possible to completely suppress the occurrence of warpage, cracks, and the like due to the heating.

  The object of the present invention is to completely suppress the occurrence of warpage and undulation due to temperature changes, particularly heating, and prevent the occurrence of breakage.

The present invention has a head body having a plurality of grooves extending substantially in parallel from the front surface to the rear surface of the head, and a recess provided with an opening and a bottom, and an inlet that is a through hole communicating with the recess. a first substrate disposed to face the opening of the recess into a plurality of grooves, are opposed across the head body to the second substrate and having a same shape is formed from the first substrate and the same material first substrate An opening of the recess is provided toward the head body, and a nozzle plate having a plurality of nozzles respectively communicating with the plurality of grooves is provided to face the plurality of grooves.

According to the present invention, is provided to the head body so as to sandwich the head body toward the first substrate and the second head body of each of the openings to the substrate and formed a member of the same shape from the same material Therefore, each of them is also provided in the head body in the same way, and the temperature change, especially the stress that causes the warpage and waviness due to heating, is canceled out. Occurrence can be prevented. In particular, even when the first substrate and the second substrate are heat-bonded to the head body, it is possible to prevent warping and waviness due to the heating.

  The best mode for carrying out the present invention will be described with reference to the drawings.

<Inkjet recording apparatus>
FIG. 1 is a schematic diagram schematically showing the configuration of the ink jet recording apparatus of the present embodiment, FIG. 2 is an exploded perspective view schematically showing an ink jet head provided in the ink jet recording apparatus, and FIG. 3 schematically shows the ink jet head. It is a vertical side view.

  The inkjet recording apparatus 1 includes an inkjet head 3 that selectively ejects ink as ink droplets from a plurality of nozzles 2, an ink supply unit 4 that supplies ink to the interior of the inkjet head 3, and temperature control inside the inkjet head 3. And a liquid supply unit 5 for supplying the liquid. Further, the ink jet recording apparatus 1 includes a recording medium transport unit that sequentially feeds recording media (not shown) and transports them in the sub-scanning direction, and a carriage that carries the ink-jet head 3 and reciprocates in the main scanning direction (not shown). Etc.).

The ink jet head 3 includes a nozzle plate 6 having nozzles 2 that are a plurality of through holes for discharging ink, a head body 8 having a plurality of ink chambers 7 that contain ink and communicate with the nozzles 2, respectively, A top plate 10 that is a first substrate having a storage chamber 9 that is provided in the main body 8 and communicates with the ink chamber 7, and is provided at the position facing the top plate 10 with the head main body 8 interposed therebetween. It is comprised from the board | substrate 11 etc. which are 2nd board | substrates. The substrate 11 is a member and the same shape are formed from the same material as the top plate 10. Therefore, the top board 10 and the board | substrate 11 are formed with the same material, and the shape is also the same.

  The head body 8 is formed by laminating an upper layer substrate 12 and a lower layer substrate 13 at least one of which is made of a piezoelectric member. In the present embodiment, the head body 8 is formed by bonding the upper layer substrate 12 and the lower layer substrate 13 made of two piezoelectric members polarized in the plate thickness direction so that the polarization directions are opposite to each other. . In the head body 8, the upper layer substrate 12 and the lower layer substrate 13 are shaved in the stacking direction with a diamond wheel or the like, and a plurality of grooves 14 reaching from the upper surface of the upper layer substrate 12 to the inside of the lower layer substrate 13 are formed. These grooves 14 are formed so as to reach the inside of the lower layer substrate 13 from the upper surface of the upper layer substrate 12, and the front surface is opened and the rear portion is closed. That is, the plurality of grooves 14 extend substantially parallel to the head main body 8 from the front surface to the rear surface until the middle.

  Electrodes 15 are formed on the inner surfaces of the plurality of grooves 14 by an electroless nickel plating method or the like. A wiring pattern 16 that is continuous with the electrode 15 is formed on the upper surface of the upper substrate 12. When water-based ink is used as the ink, an insulating film 17 is formed on a part of the electrode 15 and the wiring pattern 16, that is, a portion that comes into contact with the ink (see FIG. 3). Here, the ink chamber 7 includes a bottom wall 18 of the groove 14, a side wall 19 formed on both sides of the groove 14, and a part of the top plate 10.

  The top plate 10 communicates with the inflow port 20 into which ink, which is a liquid supplied from the ink supply unit 4 flows, the accommodation chamber 9 that accommodates ink and communicates with the accommodation chamber 9, and the ink flows out. The outlet 21 is provided. The storage chamber 9 is a recess 24 having an opening 22 and a bottom 23. The storage chamber 9 communicates with the plurality of ink chambers 7 and supplies ink to these ink chambers 7. Such a top plate 10 is provided in the head main body 8 with the openings 22 of the storage chamber 9 facing the plurality of grooves 14. At this time, the top plate 10 is fixed to the head main body 8 with, for example, a thermosetting adhesive (heat bonding).

Substrate 11 is a member and the same shape are formed from the same material as the top plate 10, accommodating the inflow port 25 which is liquid supplied from the liquid supply unit 5 flows, and communicates with the inlet port 25 accommodating the liquid It has the outflow port 27 etc. from which the chamber 26 and the accommodation chamber 26 communicate and open and the liquid flows out. The storage chamber 26 is a recess 24 having an opening 22 and a bottom 23. Such a substrate 11 is provided so that the opening 22 of the accommodation chamber 26 faces the head main body 8 and faces the top plate 10 and the head main body 8. At this time, the substrate 11 is fixed to the head body 8 by, for example, a thermosetting adhesive (heat bonding).

  The ink supply unit 4 includes an ink tank 28 that stores ink, an ink supply pipe 29 that communicates the ink tank 28 and the inlet 20 of the top plate 10, and an ink supply pipe 29 that is provided in the storage chamber 9 of the top plate 10. The pump 30 is configured to generate a supply force for supplying ink, and an ink outflow pipe 31 that connects the outlet 21 of the top plate 10 and the ink tank 28. The ink supply pipe 29, the storage chamber 9 of the inkjet head 3, the ink outflow pipe 31, and the like constitute an ink flow path through which ink flows.

  Such an ink supply unit 4 supplies ink from the ink tank 28 to the storage chamber 9 of the top plate 10 through the ink supply pipe 29 by the supply force of the pump 30. Further, the ink supply unit 4 causes ink to flow out from the outlet 21 of the top plate 10 and return the ink to the ink tank 28 via the ink outlet pipe 31. That is, the ink supply unit 4 causes the ink flowing out from the outlet 21 of the top plate 10 to flow into the inlet 20 of the top plate 10 again. Thereby, since the ink circulates in the ink flow path, the bubbles existing inside the storage chamber 9 of the top plate 10 can be removed.

  The liquid supply unit 5 includes a liquid tank 32 that stores liquid, a liquid supply pipe 33 that connects the liquid tank 32 and the inflow port 25 of the substrate 11, and a liquid that is provided in the storage chamber 26 of the substrate 11 provided in the liquid supply pipe 33. A pump 34 for generating a supply force for supply, a temperature adjusting unit 35 provided in the liquid supply pipe 33 for adjusting the temperature of the passing liquid to a predetermined temperature, and the outlet 27 of the substrate 11 and the liquid tank 32 communicate with each other. The liquid outflow pipe 36 and the like are configured. The liquid supply pipe 33, the storage chamber 26 of the substrate 11, the liquid outflow pipe 36, and the like constitute a liquid flow path through which the liquid flows.

  The temperature adjustment unit 35 is a device that adjusts a liquid such as water to a predetermined temperature. Here, the temperature adjustment unit 35 is a device that cools a liquid such as water to a predetermined temperature using, for example, a Peltier element, and further heats the liquid to a predetermined temperature using, for example, a heating element. In addition, although water is used as a liquid, for example, it is not restricted to this.

  Such a liquid supply unit 5 supplies the liquid from the liquid tank 32 to the storage chamber 26 of the substrate 11 through the liquid supply pipe 33 by the supply force of the pump 34. At this time, the liquid supply unit 5 adjusts the liquid to a predetermined temperature by the temperature adjustment unit 35. Thereby, the temperature-adjusted liquid is supplied to the storage chamber 26 of the substrate 11. Further, the liquid supply unit 5 causes the liquid to flow out from the outlet 27 of the substrate 11 and return the liquid to the liquid tank 32 via the liquid outflow pipe 36. That is, the liquid supply unit 5 causes the liquid that has flowed out from the outlet 27 of the substrate 11 to flow into the inlet 25 of the substrate 11 again. As a result, the temperature of the liquid is adjusted to a predetermined temperature and circulates in the liquid flow path, so that the head body 8 that is in contact can be directly cooled or kept warm. In particular, when the inkjet head 3 is driven, the heat generated by the driving is cooled, and when the inkjet head 3 is not used, the ink inside the inkjet head 3 is kept warm. Thereby, the ink viscosity is stabilized, and the ink is stably ejected from the nozzle 2, so that a good print image can be obtained.

  Here, as the ink, for example, various inks such as water-based ink, oil-based ink, solvent ink, and UV ink (ultraviolet curable ink) are used. The UV ink is composed of, for example, a pigment, a monomer, an oligomer, a photopolymerization initiator, a dispersant, and other additives (for example, a surface tension adjusting agent).

  In the present embodiment, the piezoelectric inkjet head 3 using a piezoelectric member (for example, a piezo element) is used as the ink ejection energy means. However, the present invention is not limited to this. For example, a heating element is used. A thermal ink jet type ink jet head may be used. In this case, the heating element is provided in the groove 14 communicating with the nozzle 2, that is, in the ink chamber 7. In particular, the heating element is formed on the bottom wall 18 of the groove 14.

  Next, the electrical connection of each part provided in the inkjet recording apparatus 1 will be described with reference to FIG. FIG. 4 is a block diagram schematically showing the electrical connection of each part provided in the inkjet recording apparatus 1.

  The ink jet recording apparatus 1 includes a controller 50. The controller 50 includes a central processing unit (CPU) 51 that centrally controls each unit, a read only memory (ROM) 52 that stores various programs executed by the CPU 51, and a random access memory (RAM) that functions as a work area for the CPU 51. ) 53 etc. are connected by the bus line 54.

  The inkjet head 3 is connected to the CPU 51 via an inkjet head control circuit 55, the pumps 30 and 34 are connected via a pump control circuit 56, and a temperature adjustment unit via a temperature adjustment unit control circuit 57. 35 is connected. Furthermore, an external device (not shown) such as a personal computer is connected to the CPU 51 via a communication interface (not shown), and a recording medium transport unit and a drive unit (not shown) are connected. The carriage is connected.

  In such a configuration, the inkjet recording apparatus 1 is equipped with the inkjet head 3 while conveying the recording medium in the sub-scanning direction by the recording medium conveying unit based on the image data received from the external device via the communication interface. The carriage is moved from the home position (standby position) in the main scanning direction, and the inkjet head 3 is driven and controlled to form an image on the recording medium. That is, the ink jet head 3 selectively ejects ink supplied to the ink chamber 7 from a plurality of nozzles 2 as ink droplets by selectively changing the volume of the desired ink chamber 7 and applying pressure to the ink. Let The ink chamber 7 is supplied with ink from the storage chamber 9 of the top plate 10.

  In addition, the ink jet recording apparatus 1 is connected to the storage chamber 9 of the top plate 10 of the ink jet head 3 from the ink tank 28 via the ink supply pipe 29 by the ink supply unit 4 at a predetermined timing, for example, after the ink tank 28 is replaced. Ink is supplied, the ink is caused to flow out from the outlet 21 of the top plate 10, and the ink is returned to the ink tank 28 via the ink outlet pipe 31. At this time, the ink circulates in the ink flow path, and the bubbles existing in the storage chamber 9 of the top plate 10 are moved together with the ink to be removed.

  Further, the ink jet recording apparatus 1 cools the head main body 8 by supplying the temperature adjusted liquid to the storage chamber 26 of the substrate 11 by the liquid supply unit 5 at a predetermined timing, for example, when the ink jet head 3 is driven. When not in use, the liquid supply unit 5 supplies the temperature-adjusted liquid to the storage chamber 26 of the substrate 11 to keep the ink inside the inkjet head 3 warm. At this time, the liquid circulates through the liquid flow path.

As described above, in this embodiment, to sandwich the head body 8 toward respective openings 22 a top plate 10 and the substrate 11 is a member and the same shape are formed from the same material to the head body 8 In this way, each is similarly provided in the head body 8, and the temperature change, in particular, the stress that causes the warp and the undulation due to the heating is offset, so the occurrence of the warp and the undulation due to the temperature change is completely eliminated. Suppressing and preventing the occurrence of breakage. In particular, even when the top plate 10 and the substrate 11 are heat-bonded to the head body 8, it is possible to prevent warpage and undulation from being generated.

  Further, by supplying the liquid adjusted to a predetermined temperature to the storage chamber 26 of the substrate 11, the head body 8 can be directly cooled or kept warm. Thereby, the temperature rise of the head main body 8 can be suppressed, and the temperature of the head main body 8 can be raised when necessary. As described above, for example, when the inkjet head 3 is driven, heat generated by the driving is cooled, and when the inkjet head 3 is not used, the ink inside the inkjet head 3 is kept warm. Thereby, the ink viscosity is stabilized, and the ink is stably ejected from the nozzle 2, so that a good print image can be obtained.

  In this embodiment, the top plate 10 as the first substrate and the substrate 11 as the second substrate have outlets 21 and 27 that are through holes communicating with the storage chambers 9 and 26 that are the recesses 24, respectively. Therefore, ink can flow out from the outflow port 21 of the storage chamber 9 of the top plate 10, and liquid such as water can flow out of the outflow port 27 of the storage chamber 26 of the substrate 11.

  In the present embodiment, the ink jet head 3, the ink supply unit 4 that allows ink to flow into the inlet 20 of the top plate 10, and the liquid are adjusted to a predetermined temperature, and the adjusted liquid is supplied to the inlet 25 of the substrate 11. Since the liquid supply unit 5 is supplied to the storage chamber 26, the liquid adjusted to a predetermined temperature can be supplied to the storage chamber 26 of the substrate 11. Therefore, the head body 8 can be directly cooled or kept warm. it can.

  In the present embodiment, the ink jet head 3, the ink supply unit 4 that allows ink to flow into the inlet 20 of the top plate 10, and the liquid are adjusted to a predetermined temperature, and the adjusted liquid is supplied to the inlet 25 of the substrate 11. The liquid supply unit 5 is configured to flow into the inlet 25 of the substrate 11 by adjusting the liquid flowing out from the outlet 27 of the substrate 11 to a predetermined temperature again and flowing into the inlet 25 of the substrate 11. Since the liquid whose temperature is constantly adjusted can be supplied to the storage chamber 26, the head body 8 can be reliably cooled or kept warm. Furthermore, since it becomes possible to use a liquid repeatedly, cost can be held down.

<Inkjet head manufacturing method>
Next, a method for manufacturing the inkjet head 3 will be described with reference to FIG. FIG. 5 is a perspective view schematically showing the manufacturing process of the inkjet head 3.

The method of manufacturing the ink jet head 3 includes a step of laminating an upper layer substrate 12 and a lower layer substrate 13 at least one made of a piezoelectric member to form a head body 8 (lamination step: see FIG. 5A), A step of forming a plurality of grooves 14 (groove forming step: see FIG. 5B), a step of forming electrodes 15 in the plurality of grooves 14 (electrode forming step: see FIG. 5C), and the top plate 10 Is provided in the head body 8 with the openings 22 of the storage chamber 9 facing the plurality of grooves 14, and the substrate 11 is opposed to the head body 8 with the top plate 10 sandwiched between the head body 8 and the openings 22 of the storage chamber 26 are set to A process of providing the main body 8 (first installation process: see FIG. 5D and FIG. 2) and a process of providing the nozzle body 6 in the head main body 8 with the plurality of grooves 14 facing each other (second installation process: FIG. 5 (e)). Note that the top plate 10 and the substrate 11 is a member of the same shape and are formed from the same material. Therefore, the top board 10 and the board | substrate 11 are formed with the same material, and the shape is also the same.

  In the step of forming the head body 8, the upper layer substrate 12 and the lower layer substrate 13 are bonded together with an adhesive. As the adhesive, for example, a thermosetting adhesive is used. The adhesive is applied to the upper substrate 12 by screen printing or the like, for example. In addition to screen printing, a method such as spin coater, spray coating, and brush coating can be selected as an adhesive coating method in accordance with the adhesive to be used. When a thermosetting adhesive is used, the bonded upper layer substrate 12 and lower layer substrate 13 are placed in an autoclave device (not shown) and heated under pressure to cure the adhesive (heat bonding). Note that the bonded upper layer substrate 12 and lower layer substrate 13 may be mechanically pressed with a jig or the like and placed in an oven in the pressurized state to be cured by heating. Here, the adhesive may be cured in a later step without curing the adhesive.

  In the step of forming the plurality of grooves 14, the head main body 8 is processed to form the plurality of grooves 14 extending substantially in parallel from the front surface toward the rear surface. This groove processing is performed using a diamond wheel of a dicing saw used for cutting an IC wafer or the like.

  In the step of forming the electrode 15, the electrode 15 is formed on the inner surfaces of the plurality of grooves 14 by an electroless nickel plating method or the like. At this time, a wiring pattern 16 continuous with the electrode 15 is also formed on the upper surface of the upper substrate 12. When water-based ink is used as the ink, the insulating film 17 is formed on a part of the electrode 15 and the wiring pattern 16, that is, a part in contact with the ink (see FIG. 3). This insulating film 17 is formed of, for example, an electrodeposition paint. Since the electrodeposition paint solution reaches the inside of the groove 14, the insulating film 17 is uniformly formed on the electrode 15.

  In the first installation step, the top plate 10 and the substrate 11 are bonded to the head body 8 with an adhesive. At this time, the openings 22 of the top plate 10 and the substrate 11 face each other. As the adhesive, for example, a thermosetting adhesive is used. The adhesive is applied to the top plate 10 and the substrate 11 by screen printing or the like, for example. As the method for applying the adhesive, in addition to screen printing, a method such as spray coating or brush coating can be selected in accordance with the adhesive to be used. When a thermosetting adhesive is used, the head main body 8 to which the top plate 10 and the substrate 11 are bonded is put in an autoclave device (not shown) and heated under pressure to cure the adhesive (heat bonding) ). That is, the adhesive between the top plate 10 and the head main body 8 and the adhesive between the substrate 11 and the head main body 8 are simultaneously heated and cured. At this time, the top plate 10 and the substrate 11 cancel out the stress that causes the warping and the undulation due to the heating, so that the occurrence of the warping and the undulation due to the heating can be completely suppressed. Note that the bonded upper layer substrate 12 and lower layer substrate 13 may be mechanically pressed with a jig or the like and placed in an oven in the pressurized state to be cured by heating. If the adhesive is not cured in the step of forming the head body 8, the adhesive may be cured at the same time in the first installation step.

  In the second installation step, the nozzle plate 6 is bonded to the head body 8 with an adhesive so as to face the plurality of grooves 14. In the nozzle plate 6, a plurality of nozzles 2 are formed to face the plurality of grooves 14, respectively. These nozzles 2 communicate with the plurality of grooves 14, respectively.

In this manner, by providing to sandwich the head body 8 toward respective openings 22 a top plate 10 and the substrate 11 is a member and the same shape are formed from the same material to the head main body 8, respectively Is also provided in the head body 8 to compensate for temperature changes, especially stress that causes warping and waviness due to heating, thus completely preventing warpage and waviness due to temperature changes and preventing damage. can do. In particular, even when the top plate 10 and the substrate 11 are heat-bonded to the head body 8, it is possible to prevent warpage and undulation from being generated.

  Further, it is not necessary to use an expensive member having a thermal expansion coefficient equivalent to that of the head main body 8, and an inexpensive member such as a resin can be used, so that the cost can be suppressed. Furthermore, by making the top plate 10 and the substrate 11 common, it is not necessary to form a mold or the like for each member, and the cost can be suppressed.

  In the present embodiment, in the step of providing the top body 10 as the first substrate and the substrate 11 as the second substrate on the head body 8 (first installation step), the top plate 10 and the substrate 11 are placed on the head body 8. Since each of the adhesives is affixed with a thermosetting adhesive and the adhesive is cured at the same time, it is possible to reliably prevent warping and undulation from occurring.

1 is a schematic diagram schematically illustrating a configuration of an ink jet recording apparatus according to an embodiment of the present invention. It is a disassembled perspective view which shows schematically the inkjet head with which an inkjet recording device is provided. It is a vertical side view which shows an inkjet head schematically. It is a block diagram which shows roughly the electrical connection of each part with which an inkjet recording device is provided. It is a perspective view which shows the manufacturing process of an inkjet head roughly.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Inkjet recording device 2 Nozzle 3 Inkjet head 4 Ink supply part 5 Liquid supply part 6 Nozzle plate 8 Head main body 10 1st board | substrate (top plate)
11 Second substrate (substrate)
14 Groove 20, 25 Inlet 21, 27 Outlet 22 Opening 23 Bottom 24 Recess

Claims (6)

A head body having a plurality of grooves extending substantially in parallel from the front surface toward the rear surface to the middle;
A recess provided with an opening and a bottom, and an inflow port which is a through hole communicating with the recess;
A first substrate provided in the head body with the openings of the recesses facing the plurality of grooves;
A member and having a same shape is formed from the first substrate and the same material, provided the opening of the recess toward the head main body to face each other across the head body to said first substrate A second substrate,
A nozzle plate provided in the head body so as to face the plurality of grooves, and having a plurality of nozzles respectively communicating with the plurality of grooves;
An inkjet head comprising:   The inkjet head according to claim 1, wherein each of the first substrate and the second substrate has an outlet that is a through hole communicating with the recess. An inkjet head according to claim 1 or 2,
An ink supply unit for causing ink to flow into the inlet of the first substrate;
A liquid supply unit that adjusts the liquid to a predetermined temperature and causes the adjusted liquid to flow into the inlet of the second substrate;
An inkjet recording apparatus comprising: An inkjet head according to claim 2;
An ink supply unit for causing ink to flow into the inlet of the first substrate;
A liquid supply unit that adjusts the liquid to a predetermined temperature and causes the adjusted liquid to flow into the inlet of the second substrate;
With
The liquid supply unit is an ink jet recording apparatus, wherein the liquid flowing out from the outlet of the second substrate is adjusted again to a predetermined temperature and flows into the inlet of the second substrate. A first substrate having a head body having a plurality of grooves extending substantially in parallel from the front surface to the rear surface thereof and having a recess provided with an opening and a bottom and an inflow port which is a through hole communicating with the recess. provided to face the opening of the recess into a plurality of grooves, it is opposed across the head body and the second substrate to the first substrate and having a same shape is formed from the first substrate and the same material Providing the opening of the recess toward the head body;
Providing a nozzle plate having a plurality of nozzles respectively communicating with the plurality of grooves in the head body so as to face the plurality of grooves;
A method for manufacturing an inkjet head comprising:   In the step of providing the first substrate and the second substrate on the head body, the first substrate and the second substrate are respectively attached to the head body with a thermosetting adhesive, and the adhesives are simultaneously cured. The manufacturing method of the inkjet head of Claim 5 which was made to do.

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