JP4519724B2 - Connector fixing structure - Google Patents

Connector fixing structure Download PDF

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JP4519724B2
JP4519724B2 JP2005193971A JP2005193971A JP4519724B2 JP 4519724 B2 JP4519724 B2 JP 4519724B2 JP 2005193971 A JP2005193971 A JP 2005193971A JP 2005193971 A JP2005193971 A JP 2005193971A JP 4519724 B2 JP4519724 B2 JP 4519724B2
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piece
connector
board
fixing
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JP2007012522A (en
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信幸 坂元
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Yazaki Corp
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Description

本発明は、コネクタを基板に固定するためのコネクタ固定構造に関する。   The present invention relates to a connector fixing structure for fixing a connector to a board.

コネクタを基板に固定するための従来のコネクタ固定構造では、一般に、図8に示すような帯状の金属板を略L字形に折り曲げて形成した固定金具1が用いられている。固定金具1は、コネクタ2に装着されるコネクタ装着片3と、基板4に水平にコネクタ装着片3の一端縁に連設された基板接合片5とを有している。そして、基板接合片5が基板4に設けられたランドに半田付けされて、コネクタ2が基板4に固定されるようになっている(例えば、特許文献1参照)。   In a conventional connector fixing structure for fixing a connector to a substrate, generally, a fixing bracket 1 formed by bending a band-shaped metal plate as shown in FIG. 8 into a substantially L shape is used. The fixing bracket 1 includes a connector mounting piece 3 to be mounted on the connector 2 and a board joining piece 5 provided on the board 4 so as to be connected to one end edge of the connector mounting piece 3 horizontally. And the board | substrate joining piece 5 is soldered to the land provided in the board | substrate 4, and the connector 2 is fixed to the board | substrate 4 (for example, refer patent document 1).

特開平8−130055号公報JP-A-8-130055

ところで近年、電子機器の小型化等により基板4上の実装スペースは縮小傾向にあり、コネクタ2を基板4に固定するための固定金具1についても小型化が要求される。しかし、固定金具1の小型化に伴い、固定金具1と基板4との接合強度が低下してコネクタ2の基板4への固定強度が低下する虞があった。   By the way, in recent years, the mounting space on the substrate 4 tends to be reduced due to the downsizing of electronic devices and the like, and the fixture 1 for fixing the connector 2 to the substrate 4 is also required to be downsized. However, along with the downsizing of the fixing metal 1, there is a possibility that the bonding strength between the fixing metal 1 and the board 4 is lowered and the fixing strength of the connector 2 to the board 4 is lowered.

本発明は、上述した課題に鑑みてなされたものであり、その目的は、固定金具と基板との接合強度を向上させ、もってコネクタの基板への固定強度を十分に確保することができるコネクタ固定構造を提供することにある。   The present invention has been made in view of the above-described problems, and an object of the present invention is to improve the bonding strength between the fixing bracket and the substrate, thereby securing the fixing strength of the connector to the substrate sufficiently. To provide a structure.

上記した目的を達成するため、本発明に係るコネクタ固定構造は下記の点を特徴をとしている。   In order to achieve the above object, the connector fixing structure according to the present invention is characterized by the following points.

コネクタを基板に固定するコネクタ固定構造であって、前記コネクタに装着されるコネクタ装着片と、前記基板と水平に前記コネクタ装着片に連設されて前記基板に設けられたランドに半田付けされる基板接合片と、を有する固定金具を備え、前記固定金具が、前記コネクタ装着片からこれと略直交する方向に延設されて、前記基板接合片の縁との間に僅かな隙間をおいて且つ前記基板に起立した状態に配置された小片をさらに有し、前記小片が、前記基板接合片と一体に前記ランドに半田付けされること。また、前記小片が、前記コネクタ装着片から複数延設され、互いに間隔をおいて配置されていること。 A connector fixing structure for fixing a connector to a board, wherein the connector mounting piece is attached to the connector, and is soldered to a land provided on the board so as to be connected to the connector mounting piece horizontally with the board. Board fixing piece, and the fixing fitting extends from the connector mounting piece in a direction substantially perpendicular to the connector mounting piece , with a slight gap between the board connecting piece and the edge of the board connecting piece. And a small piece arranged in an upright state on the substrate, and the small piece is soldered to the land integrally with the substrate bonding piece. In addition, a plurality of the small pieces are extended from the connector mounting piece and arranged at intervals.

上記したコネクタ固定構造によれば、基板接合片の縁との間に僅かな隙間をおいて且つ基板に起立した状態に配置された小片が基板接合片と一体にランドに半田付けされることにより、基板接合片の縁と小片との隙間に半田が浸潤して小片を這い上がるように濡れ広がり、基板から十分な高さをもって半田フィレットが形成される。小片が形成されていない場合に比べて、このフィレットの分だけ半田と固定金具との接合面積が拡大しており、よって、半田と固定金具との接合強度を向上させ、ひいては半田を介しての固定金具と基板との接合強度を向上させることができる。   According to the connector fixing structure described above, a small piece placed in a state standing on the board with a slight gap between the edges of the board joining piece is soldered to the land integrally with the board joining piece. The solder infiltrates into the gap between the edge of the board joining piece and the small piece and wets and spreads the small piece so that a solder fillet is formed with a sufficient height from the board. Compared to the case where a small piece is not formed, the joint area between the solder and the fixing bracket is increased by the amount of the fillet, so that the bonding strength between the solder and the fixing bracket is improved. The bonding strength between the fixing bracket and the substrate can be improved.

上記したコネクタ固定構造において、好ましくは、前記基板接合片の一部が切り欠かれ、前記小片が前記基板接合片の切欠き部の内縁との間に僅かな隙間をおいて当該切欠き部内に配置される。これによれば、小片が設けられることによっても基板上における固定金具の占有面積が拡大することがない。   In the connector fixing structure described above, preferably, a part of the board bonding piece is cut out, and the small piece is in the cutout part with a slight gap between the inner edge of the cutout part of the board bonding piece. Be placed. According to this, even if a small piece is provided, the occupation area of the fixing bracket on the substrate does not increase.

本発明に係るコネクタ固定構造によれば、固定金具と基板との接合強度を向上させ、もってコネクタの基板への固定強度を十分に確保することができる。   According to the connector fixing structure according to the present invention, it is possible to improve the bonding strength between the fixing metal fitting and the substrate, thereby sufficiently securing the fixing strength of the connector to the substrate.

以下、本発明に係るコネクタ固定構造の好適な実施形態を図面に基づいて詳細に説明する。   DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, a preferred embodiment of a connector fixing structure according to the invention will be described in detail with reference to the drawings.

図1は本発明のコネクタ固定構造の第1施形態の斜視図、図2は固定金具の斜視図、図3は固定金具のランドへの実装を示す斜視図、図4は図3におけるIV-IV矢視断面図、図5は本発明のコネクタ固定構造の第2実施形態に係る固定金具の斜視図、図6は本発明のコネクタ固定構造の第3実施形態に係る固定金具の斜視図、図7は本発明のコネクタ固定構造の第4実施形態に係る固定金具の斜視図である。   1 is a perspective view of a first embodiment of a connector fixing structure of the present invention, FIG. 2 is a perspective view of a fixing bracket, FIG. 3 is a perspective view showing mounting of the fixing bracket to a land, and FIG. IV sectional view, FIG. 5 is a perspective view of a fixture according to the second embodiment of the connector fixing structure of the present invention, FIG. 6 is a perspective view of the fixture according to the third embodiment of the connector fixing structure of the present invention, FIG. 7 is a perspective view of a fixture according to a fourth embodiment of the connector fixing structure of the present invention.

(第1実施形態)
本実施形態のコネクタ固定構造は、図1に示すように、基板10にコネクタ11を固定する一組の固定金具12を備えている。
(First embodiment)
As shown in FIG. 1, the connector fixing structure of the present embodiment includes a set of fixing fittings 12 for fixing the connector 11 to the substrate 10.

コネクタ11は、複数の接続端子13と、これら接続端子13を基板10の上面に平行に整列させた状態に保持しているハウジング14とを備えている。ハウジング14には、相手コネクタが挿抜されると共に複数の接続端子13の先端部にそれぞれ設けられ相手コネクタの接続端子と電気的に接続される接点部分を取り囲む略角筒状のフード15が設けられている。そして、基板10の上面に対して略垂直に配置されるフード15の両外側面に、後述する固定金具12のコネクタ装着片16がそれぞれ装着されている。   The connector 11 includes a plurality of connection terminals 13 and a housing 14 that holds the connection terminals 13 in a state of being aligned in parallel with the upper surface of the substrate 10. The housing 14 is provided with a generally rectangular tube-shaped hood 15 that is provided at the tip of each of the plurality of connection terminals 13 and that surrounds a contact portion that is electrically connected to the connection terminal of the other connector. ing. Then, connector mounting pieces 16 of the fixing bracket 12 to be described later are respectively mounted on both outer side surfaces of the hood 15 disposed substantially perpendicular to the upper surface of the substrate 10.

図2に示すように、固定金具12は、全体が一枚の金属板から形成されており、基板10の上面に対して略垂直に配置されコネクタ11のフード15の外側面に装着されるコネクタ装着片16と、基板10の上面と水平にコネクタ装着片16の下端縁に連設された基板接合片17とを備えている。   As shown in FIG. 2, the fixing bracket 12 is formed of a single metal plate as a whole, is disposed substantially perpendicular to the upper surface of the substrate 10, and is a connector attached to the outer surface of the hood 15 of the connector 11. A mounting piece 16 and a board joining piece 17 provided on the lower end edge of the connector mounting piece 16 horizontally with the upper surface of the board 10 are provided.

コネクタ装着片16の上端部の両側縁には、それぞれ突出片18が設けられている。一方、コネクタ装着片16が装着されるコネクタ11のフード15の外側面には、上下に延びる一組のリブ19,19が形成されており、互いに対向する各リブ19の内側面には、コネクタ装着片16の各突出片18を上方から挿入可能な係合溝20が刻設されている。コネクタ装着片16は、一組のリブ19,19の間に上方から進入して各突出片18をそれぞれリブ19の係合溝20に収容されることで、フード15の外側面に装着されている。   Projecting pieces 18 are provided on both side edges of the upper end portion of the connector mounting piece 16. On the other hand, a pair of ribs 19, 19 extending vertically are formed on the outer surface of the hood 15 of the connector 11 to which the connector mounting piece 16 is mounted. Engagement grooves 20 into which the protruding pieces 18 of the mounting piece 16 can be inserted from above are formed. The connector mounting piece 16 is mounted on the outer surface of the hood 15 by entering from above between a pair of ribs 19 and 19 and accommodating the protruding pieces 18 in the engaging grooves 20 of the ribs 19 respectively. Yes.

固定金具12は、基板10の上面に垂直に起立した状態に配置された小片21,21をさらに有している。各小片21は、コネクタ接合片16の側縁に延設された小片を基板接合片17の側縁に沿うように略直角に折り曲げて形成されている。各小片21の下端縁と基板接合片17の側縁との間には僅かな隙間gがおかれている。   The fixing metal 12 further includes small pieces 21 and 21 that are arranged so as to stand vertically on the upper surface of the substrate 10. Each small piece 21 is formed by bending a small piece extending on the side edge of the connector joining piece 16 at a substantially right angle so as to follow the side edge of the board joining piece 17. A slight gap g is provided between the lower edge of each small piece 21 and the side edge of the substrate bonding piece 17.

図3および図4に示すように、基板接合片17および小片21,21は基板10の上面に設けられたランド23に一体に半田付けされる。ランド23には予め適量の半田が盛られており、基板接合片17および小片21,21がランド23上に載置された状態で適宜加熱・冷却されることで基板接合片17および小片21,21がランド23に半田付けされる。   As shown in FIGS. 3 and 4, the board bonding piece 17 and the small pieces 21 and 21 are integrally soldered to a land 23 provided on the upper surface of the board 10. An appropriate amount of solder is preliminarily deposited on the lands 23, and the substrate bonding pieces 17 and the small pieces 21, 21 are appropriately heated and cooled while the substrate bonding pieces 17 and the small pieces 21 and 21 are placed on the lands 23. 21 is soldered to the land 23.

ランド23は基板接合片17および小片21,21を含めた外形よりも若干大きく形成されており、溶融した半田は基板接合片17および小片21,21の最外周縁から裾野を引いて濡れ広がりフィレット25を形成する。   The land 23 is formed to be slightly larger than the outer shape including the board joining piece 17 and the small pieces 21, 21, and the melted solder draws a skirt from the outermost peripheral edges of the board joining piece 17 and the small pieces 21, 21 and fillets 25 is formed.

さらに、溶融した半田は基板接合片17の側縁と小片21の下端縁との間におかれた隙間gに浸潤する。小片21は基板接合片17の側縁の高さ(厚み)よりも高く形成されており、隙間gに浸潤した半田は、基板接合片17の側縁からさらに上方に向けて、小片21の内側面21aを這い上がるように濡れ広がりフィレット26を形成する。小片21が形成されていない場合に比べて、フィレット26の分だけ半田と固定金具12との接合面積が拡大しており、よって、半田と固定金具12との接合強度が向上し、ひいては半田を介しての固定金具12と基板10との接合強度が向上する。   Further, the melted solder infiltrates into the gap g between the side edge of the board bonding piece 17 and the lower end edge of the small piece 21. The small piece 21 is formed to be higher than the height (thickness) of the side edge of the board bonding piece 17, and the solder that has infiltrated into the gap g extends further upward from the side edge of the board bonding piece 17. A fillet 26 is formed so as to wet and spread up the side surface 21a. Compared to the case where the small piece 21 is not formed, the bonding area between the solder and the fixing bracket 12 is increased by the amount of the fillet 26, so that the bonding strength between the solder and the fixing bracket 12 is improved, so that the solder is removed. The bonding strength between the fixing metal 12 and the substrate 10 is improved.

このように、本実施形態のコネクタ固定構造によれば、基板接合片17の両側縁との間に僅かな隙間gをおいて且つ基板10に起立した状態に配置された小片21,21が基板接合片17と一体にランド23に半田付けされることにより、基板接合片17の両側縁と小片21,21とのそれぞれの隙間gに半田が浸潤して小片21,21を這い上がるように濡れ広がり、基板10から十分な高さをもってフィレット26が形成される。小片21が形成されていない場合に比べて、このフィレット26の分だけ半田と固定金具12との接合面積が拡大しており、よって、半田と固定金具12との接合強度を向上させ、ひいては半田を介しての固定金具12と基板10との接合強度を向上させることができる。   As described above, according to the connector fixing structure of the present embodiment, the small pieces 21, 21 arranged in a state where the substrate joining piece 17 is erected on the board 10 with a slight gap g between the both side edges of the board joining piece 17 are arranged on the board. By soldering to the land 23 integrally with the joining piece 17, the solder penetrates into the gaps g between the both side edges of the board joining piece 17 and the small pieces 21, 21, so that the small pieces 21, 21 are scooped up. The fillet 26 spreads and is formed with a sufficient height from the substrate 10. Compared to the case where the small piece 21 is not formed, the bonding area between the solder and the fixing bracket 12 is increased by the amount of the fillet 26. Therefore, the bonding strength between the solder and the fixing bracket 12 is improved, and consequently the solder. The bonding strength between the fixing metal 12 and the substrate 10 can be improved.

ここで、小片21は薄板状であり、その下端縁と基板接合片17の側縁との間におかれた隙間gも僅かなものであるから、基板10上における基板接合片17の占有面積、即ち固定金具12の占有面積は、小片21が形成されていない場合とほぼ同程度である。   Here, the small piece 21 has a thin plate shape, and the gap g between the lower edge of the small piece 21 and the side edge of the substrate bonding piece 17 is also very small. Therefore, the area occupied by the substrate bonding piece 17 on the substrate 10 is small. That is, the area occupied by the fixing bracket 12 is substantially the same as that when the small piece 21 is not formed.

(第2実施形態)
次に図5を参照して本発明のコネクタ固定構造の第2実施形態を説明する。尚、本実施形態のコネクタ固定構造は、上述した第1実施形態のコネクタ固定構造と固定金具の形状を異にするのみであり、他の部材については共通であるためその説明は省略し、また、固定金具について、第1実施形態の固定金具12と共通する部分には相当符号を付すことにより説明を簡略化する。
(Second Embodiment)
Next, a second embodiment of the connector fixing structure of the present invention will be described with reference to FIG. Note that the connector fixing structure of the present embodiment is different from the connector fixing structure of the first embodiment described above only in the shape of the fixing bracket, and the description of the other members is omitted because it is common to other members. The description of the fixing bracket is simplified by attaching the same reference numerals to the portions common to the fixing bracket 12 of the first embodiment.

図5に示すように、本実施形態のコネクタ固定構造に用いられる固定金具112は、基板10の上面に対して略垂直に配置されコネクタ11のフード15の外側面に装着されるコネクタ装着片116と、基板10の上面と水平にコネクタ装着片116の下端縁に連設された基板接合片117とを備えている。   As shown in FIG. 5, the fixing metal fitting 112 used in the connector fixing structure of this embodiment is disposed substantially perpendicular to the upper surface of the substrate 10 and is attached to the outer surface of the hood 15 of the connector 11. And a board joining piece 117 connected to the lower end edge of the connector mounting piece 116 horizontally with the upper surface of the board 10.

固定金具112は、基板10の上面に垂直に起立した状態に配置された小片121,121をさらに有している。各小片121は、コネクタ接合片116の側縁に延設された小片を基板接合片117の側縁に沿うように折り曲げ、さらにその先端部を基板接合片117の前端縁に沿うように折り曲げて形成されている。各小片121の下端縁と基板接合片117の側縁および前端縁との間には僅かな隙間gがおかれている。   The fixing metal 112 further has small pieces 121 and 121 arranged in a state of standing upright on the upper surface of the substrate 10. Each small piece 121 is formed by bending a small piece extending on the side edge of the connector bonding piece 116 so as to be along the side edge of the board bonding piece 117, and further bending the tip portion so as to be along the front edge of the board bonding piece 117. Is formed. A slight gap g is provided between the lower end edge of each small piece 121 and the side edge and front end edge of the substrate bonding piece 117.

基板接合片117および小片121,121は基板10の上面に設けられたランド23に一体に半田付けされる。溶融した半田は基板接合片117の側縁および前端縁と各小片121の下端縁との間におかれた隙間gに浸潤する。各小片121は基板接合片117の厚みよりも高く形成されており、隙間gに浸潤した半田は、基板接合片117の側縁および前端縁からさらに上方に向けて、各小片121の内側面を這い上がるように濡れ広がりフィレットを形成する。   The board bonding piece 117 and the small pieces 121 and 121 are integrally soldered to the land 23 provided on the upper surface of the board 10. The molten solder infiltrates into the gap g between the side edge and front end edge of the board bonding piece 117 and the lower end edge of each small piece 121. Each small piece 121 is formed higher than the thickness of the board bonding piece 117, and the solder that has infiltrated the gap g extends the inner surface of each small piece 121 further upward from the side edge and the front edge of the board bonding piece 117. Wet and spread so as to crawl up and form a fillet.

本実施形態によれば、上述した第1実施形態の固定金具12に比べ、基板接合片117の前端縁と各小片121の先端部の内側面との間に形成されたフィレットの分だけ半田と固定金具112との接合面積が拡大しており、よって、半田と固定金具112との接合強度をさらに向上させ、ひいては半田を介しての固定金具112と基板10との接合強度をさらに向上させることができる。   According to the present embodiment, as compared with the fixture 12 of the first embodiment described above, the solder and the solder formed by the amount of the fillet formed between the front end edge of the board joining piece 117 and the inner side surface of the tip portion of each small piece 121. The bonding area between the fixing metal 112 and the fixing metal 112 is increased. Therefore, the bonding strength between the solder and the fixing metal 112 is further improved, and as a result, the bonding strength between the fixing metal 112 and the substrate 10 via the solder is further improved. Can do.

(第3実施形態)
次に図6を参照して本発明のコネクタ固定構造の第3実施形態を説明する。尚、本実施形態のコネクタ固定構造は、上述した第1実施形態のコネクタ固定構造と固定金具の形状を異にするのみであり、他の部材については共通であるためその説明は省略し、また、固定金具について、第1実施形態の固定金具12と共通する部分には相当符号を付すことにより説明を簡略化する。
(Third embodiment)
Next, a third embodiment of the connector fixing structure of the present invention will be described with reference to FIG. Note that the connector fixing structure of the present embodiment is different from the connector fixing structure of the first embodiment described above only in the shape of the fixing bracket, and the description of the other members is omitted because it is common to other members. The description of the fixing bracket is simplified by attaching the same reference numerals to the portions common to the fixing bracket 12 of the first embodiment.

図6に示すように、本実施形態のコネクタ固定構造に用いられる固定金具212は、基板10の上面に対して略垂直に配置されコネクタ11のフード15の外側面に装着されるコネクタ装着片216と、基板10の上面と水平にコネクタ装着片216の下端縁に連設された基板接合片217とを備えている。基板接合片217には、当該基板接合片217の幅方向の中央においてコネクタ装着片216との連接部分から前端縁に向けて延び、当該基板接合片217を厚み方向に貫通するように略矩形状に切り欠かれた切欠き部227が設けられている。   As shown in FIG. 6, the fixing fitting 212 used in the connector fixing structure of the present embodiment is disposed substantially perpendicular to the upper surface of the substrate 10 and is attached to the outer surface of the hood 15 of the connector 11. And a board joining piece 217 provided on the upper surface of the board 10 so as to be parallel to the lower end edge of the connector mounting piece 216. The board bonding piece 217 has a substantially rectangular shape extending from the connecting portion with the connector mounting piece 216 toward the front edge at the center in the width direction of the board bonding piece 217 and penetrating the board bonding piece 217 in the thickness direction. A notch 227 is formed in the notch.

固定金具212は、基板10の上面に垂直に起立した状態に配置された小片221をさらに有している。この小片221は、基板接合片217の切欠き部227に連続してコネクタ装着片216に切り込まれた略L字形状のスリット228により、一方の側縁をコネクタ装着片216に接続した状態に当該コネクタ装着片216から区分された小片であって、コネクタ装着片216に接続している側縁を折り曲げて基板接合片227側に起こして形成されている。小片221の下端縁は、基板接合片217の切欠き部227内に配置され、小片221の下端縁と基板接合片217の切欠き部227の内縁との間には僅かな隙間gがおかれている。   The fixing fitting 212 further has a small piece 221 that is arranged in a state of standing upright on the upper surface of the substrate 10. The small piece 221 is connected in a state where one side edge is connected to the connector mounting piece 216 by a substantially L-shaped slit 228 cut into the connector mounting piece 216 continuously to the notch 227 of the board bonding piece 217. It is a small piece separated from the connector mounting piece 216, and is formed by bending the side edge connected to the connector mounting piece 216 and raising it to the board bonding piece 227 side. The lower end edge of the small piece 221 is disposed in the cutout portion 227 of the board bonding piece 217, and a slight gap g is provided between the lower end edge of the small piece 221 and the inner edge of the cutout portion 227 of the board bonding piece 217. ing.

基板接合片217および小片221は基板10の上面に設けられたランド23に一体に半田付けされる。溶融した半田は基板接合片217の切欠き部227の内縁と小片221の下端縁との間におかれた隙間gに浸潤する。小片221は基板接合片217の厚みよりも高く形成されており、隙間gに浸潤した半田は、基板接合片217の切欠き部227の内縁からさらに上方に向けて、小片221の側面を這い上がるように濡れ広がりフィレットを形成する。   The board bonding piece 217 and the small piece 221 are integrally soldered to the land 23 provided on the upper surface of the board 10. The melted solder infiltrates into the gap g between the inner edge of the notch 227 of the board bonding piece 217 and the lower edge of the small piece 221. The small piece 221 is formed to be higher than the thickness of the board bonding piece 217, and the solder that has infiltrated into the gap g scoops up the side surface of the small piece 221 from the inner edge of the notch 227 of the board bonding piece 217 further upward. So as to form a wetting spread fillet.

本実施形態によれば、基板10に起立した状態に配置された小片221により半田フィレットの高さを確保して半田と固定金具212との接合強度の向上を図る点は上述した第1実施形態と同様であるが、小片221を基板接合片217の切欠き部227内に配置することにより、基板10上における基板接合片217の占有面積、即ち固定金具212の占有面積の拡大を回避することができる。   According to the present embodiment, the point that the height of the solder fillet is secured by the small pieces 221 arranged in an upright state on the substrate 10 to improve the bonding strength between the solder and the fixture 212 is the first embodiment described above. However, by disposing the small piece 221 in the notch 227 of the substrate bonding piece 217, it is possible to avoid an increase in the area occupied by the substrate bonding piece 217 on the substrate 10, that is, the area occupied by the fixing bracket 212. Can do.

(第4実施形態)
次に図7を参照して本発明のコネクタ固定構造の第4実施形態を説明する。尚、本実施形態のコネクタ固定構造は、上述した第3実施形態のコネクタ固定構造と固定金具の形状を異にするのみであり、他の部材については共通であるためその説明は省略し、また、固定金具について、第3実施形態の固定金具212と共通する部分には相当符号を付すことにより説明を簡略化する。
(Fourth embodiment)
Next, a fourth embodiment of the connector fixing structure of the present invention will be described with reference to FIG. The connector fixing structure of the present embodiment is different from the connector fixing structure of the third embodiment described above only in the shape of the fixing bracket. The other members are the same, and the description thereof is omitted. The description of the fixing bracket will be simplified by giving the same reference numerals to the portions common to the fixing bracket 212 of the third embodiment.

図7に示すように、本実施形態のコネクタ固定構造に用いられる固定金具312は、基板10の上面に対して略垂直に配置されコネクタ11のフード15の外側面に装着されるコネクタ装着片316と、基板10の上面と水平にコネクタ装着片316の下端縁に連設された基板接合片317とを備えている。基板接合片317の中央部には、当該基板接合片317を厚み方向に貫通するように略矩形状に切り欠かれた切欠き部327が設けられている。   As shown in FIG. 7, the fixing fitting 312 used in the connector fixing structure of the present embodiment is disposed substantially perpendicular to the upper surface of the substrate 10 and is attached to the outer surface of the hood 15 of the connector 11. And a board joining piece 317 provided on the lower surface of the connector mounting piece 316 horizontally with the upper surface of the board 10. A cutout portion 327 that is cut out in a substantially rectangular shape so as to penetrate the substrate bonding piece 317 in the thickness direction is provided at the center of the substrate bonding piece 317.

固定金具312は、コネクタ接合片316の両側縁にそれぞれ延設された小片をコネクタ接合片316の幅方向の中央で互いに合流するように折り返し、さらにそれらの先端部を基板接合片317の前端縁に向かうように折り曲げて形成された小片321,321を有している。各小片321の先端部には、基板接合片317の切欠き部327内に進入して基板10の上面に垂直に起立した状態に配置される垂下部321bが延設されている。各小片321の垂下部321bの下端縁と基板接合片317の切欠き部327の内縁との間には僅かな隙間gがおかれている。また、両垂下部321b,321bとの間にも僅かな隙間Gがおかれている。   The fixing metal fitting 312 is folded back so that the small pieces respectively extending on both side edges of the connector joining piece 316 join each other at the center in the width direction of the connector joining piece 316, and the front ends thereof are the front end edges of the board joining piece 317. It has the small pieces 321 and 321 formed by bending so that it may face. A drooping portion 321 b that extends into the cutout portion 327 of the substrate bonding piece 317 and is erected perpendicularly to the upper surface of the substrate 10 is extended from the distal end portion of each small piece 321. A slight gap g is provided between the lower end edge of the hanging part 321 b of each small piece 321 and the inner edge of the notch 327 of the substrate bonding piece 317. In addition, a slight gap G is also provided between both hanging parts 321b and 321b.

基板接合片317および小片321,321は基板10の上面に設けられたランド23に一体に半田付けされる。溶融した半田は基板接合片317の切欠き部327の内縁と各小片321の垂下部321bの下端縁との間におかれた隙間gに浸潤する。各小片321は基板接合片317の厚みよりも高く形成されており、隙間gに浸潤した半田は、基板接合片317の切欠き部327の内縁からさらに上方に向けて各小片321の垂下部321bの側面を這い上がるように濡れ広がりフィレットを形成する。さらには、溶融した半田は両垂下部321b,321bとの間におかれた隙間Gに浸潤し、両垂下部321b,321bの側面を這い上がるように濡れ広がりフィレットを形成する。   The substrate bonding piece 317 and the small pieces 321 and 321 are integrally soldered to the land 23 provided on the upper surface of the substrate 10. The melted solder infiltrates a gap g between the inner edge of the notch 327 of the board bonding piece 317 and the lower edge of the hanging part 321b of each small piece 321. Each small piece 321 is formed to be higher than the thickness of the board bonding piece 317, and the solder infiltrated into the gap g is further lowered upward from the inner edge of the notch 327 of the board bonding piece 317 toward the upper part 321b of the small piece 321. A wet fillet is formed so as to crawl up the sides of the film. Further, the melted solder infiltrates into the gap G between the two hanging parts 321b and 321b, and forms a wet fillet so as to scoop up the side surfaces of both hanging parts 321b and 321b.

本実施形態によれば、半田フィレットの高さを確保するための小片321の垂下部321bを基板接合片317の切欠き部327内に配置して基板10上における固定金具312の占有面積の拡大を回避する点は上述した第3実施形態と同様であるが、基板接合片317の切欠き部327を埋めるように複数の小片321の垂下部321bを切欠き部327内に配置し、それら複数の小片321の垂下部321bと切欠き部327の内縁との間、並びに複数の垂下部321bの間に多数のフィレットを形成し、半田と固定金具312との接合面積を拡大させることができる。これにより、半田と固定金具312との接合強度をさらに向上させ、ひいては半田を介しての固定金具312と基板10との接合強度をさらに向上させることができる。   According to the present embodiment, the hanging portion 321b of the small piece 321 for securing the height of the solder fillet is disposed in the notch 327 of the board joining piece 317, and the occupied area of the fixing bracket 312 on the board 10 is increased. Is the same as in the third embodiment described above, but the hanging portions 321b of the plurality of small pieces 321 are arranged in the notches 327 so as to fill the notches 327 of the substrate bonding pieces 317, and the plurality A large number of fillets can be formed between the drooping portion 321b of the small piece 321 and the inner edge of the cutout portion 327, and between the plurality of drooping portions 321b, so that the bonding area between the solder and the fixture 312 can be increased. As a result, the bonding strength between the solder and the fixing metal 312 can be further improved, and as a result, the bonding strength between the fixing metal 312 and the substrate 10 via the solder can be further improved.

なお、本発明は上述した実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲において適宜変更可能である。   In addition, this invention is not limited to embodiment mentioned above, In the range which does not deviate from the summary of this invention, it can change suitably.

本発明のコネクタ固定構造の第1実施形態の斜視図である。It is a perspective view of 1st Embodiment of the connector fixing structure of this invention. (A)、(B)は互いに異なる角度から見た固定金具の斜視図である。(A) and (B) are the perspective views of the fixing bracket seen from a mutually different angle. 固定金具のランドへの実装を示す斜視図である。It is a perspective view which shows mounting to the land of a fixing metal fitting. 図3におけるIV-IV矢視断面図である。FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG. 3. 本発明のコネクタ固定構造の第2実施形態に係り、(A)、(B)は互いに異なる角度から見た固定金具の斜視図である。It is related with 2nd Embodiment of the connector fixing structure of this invention, (A), (B) is a perspective view of the fixing metal fitting seen from a mutually different angle. 本発明のコネクタ固定構造の第3実施形態に係り、(A)、(B)は互いに異なる角度から見た固定金具の斜視図である。It is related with 3rd Embodiment of the connector fixing structure of this invention, (A), (B) is a perspective view of the fixing metal fitting seen from a mutually different angle. 本発明のコネクタ固定構造の第4実施形態に係り、(A)、(B)は互いに異なる角度から見た固定金具の斜視図である。It is related with 4th Embodiment of the connector fixing structure of this invention, (A), (B) is a perspective view of the fixing bracket seen from a mutually different angle. 従来のコネクタ固定構造を示す斜視図である。It is a perspective view which shows the conventional connector fixing structure.

符号の説明Explanation of symbols

10 基板
11 コネクタ
12 固定金具
16 コネクタ装着片
17 基板接合片
21 小片
23 ランド
g 隙間
DESCRIPTION OF SYMBOLS 10 Board | substrate 11 Connector 12 Fixing bracket 16 Connector mounting piece 17 Board | substrate joining piece 21 Small piece 23 Land g Crevice

Claims (3)

コネクタを基板に固定するコネクタ固定構造であって、
前記コネクタに装着されるコネクタ装着片と、前記基板と水平に前記コネクタ装着片に連設されて前記基板に設けられたランドに半田付けされる基板接合片と、を有する固定金具を備え、
前記固定金具が、前記コネクタ装着片からこれと略直交する方向に延設されて、前記基板接合片の縁との間に僅かな隙間をおいて且つ前記基板に起立した状態に配置された小片をさらに有し、
前記小片が、前記基板接合片と一体に前記ランドに半田付けされることを特徴とするコネクタ固定構造。
A connector fixing structure for fixing a connector to a board,
A mounting bracket having a connector mounting piece mounted on the connector, and a board joining piece soldered to a land provided on the board connected to the connector mounting piece horizontally with the board;
A small piece in which the fixing bracket extends from the connector mounting piece in a direction substantially orthogonal to the connector mounting piece , with a slight gap between the fixing piece and the edge of the board joining piece, and standing on the board. Further comprising
The connector fixing structure, wherein the small piece is soldered to the land integrally with the board joining piece.
前記基板接合片の一部が切り欠かれており、
前記小片が、前記基板接合片の切欠き部の内縁との間に僅かな隙間をおいて当該切欠き部内に配置されていることを特徴とする請求項1に記載のコネクタ固定構造。
A part of the substrate bonding piece is cut away,
2. The connector fixing structure according to claim 1, wherein the small piece is disposed in the notch with a slight gap between the small piece and an inner edge of the notch of the board bonding piece.
前記小片が、前記コネクタ装着片から複数延設され、互いに間隔をおいて配置されていることを特徴とする請求項1または請求項2に記載のコネクタ固定構造 3. The connector fixing structure according to claim 1, wherein a plurality of the small pieces are extended from the connector mounting piece and are spaced from each other . 4.
JP2005193971A 2005-06-27 2005-07-01 Connector fixing structure Expired - Fee Related JP4519724B2 (en)

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