JP4519120B2 - Pattern forming device - Google Patents

Description

  The present invention relates to a technique for forming a pattern on a substrate.

  Conventionally, photolithography has been used to form a fine pattern on a substrate. For example, in the formation of barrier ribs when manufacturing a panel used in a plasma display device, after the barrier rib material is applied to the entire surface of the substrate, unnecessary portions are removed through steps such as resist coating, drying, exposure, development, etching, and peeling. Done. When a thick pattern is formed on a substrate, photolithography is generally used, but a complicated process using a large number of apparatuses is required, and thus there is a problem that the manufacturing cost increases. . Furthermore, when changing the type of pattern, it is necessary to replace the related masks or change all the settings of each apparatus.

  On the other hand, when a thick pattern is formed on a substrate using screen printing, multiple printing is required, and the screen mesh used for multiple printing and the pattern (opening size) are slightly reduced. It is necessary to change, resulting in a decrease in throughput and an increase in cost associated with mesh replacement.

  Therefore, in recent years, a technique for forming a pattern on a substrate by discharging a material from a nozzle has been proposed.

  By the way, in order to efficiently form a pattern in a wide area on the substrate, it is preferable that the material for pattern formation is simultaneously discharged from a large number of discharge ports. In addition, for example, there are various sizes of flat panel display panels, and in consideration of pattern formation at various pitches for each substrate and ease of maintenance, a plurality of panels having a plurality of ejection openings. It can be said that it is preferable that the nozzle is detachably provided.

  On the other hand, in order to improve the accuracy of the pattern to be formed, it is necessary to bring the nozzle as close to the substrate as possible. However, when a plurality of nozzles are brought close to the substrate to a position lower than the height of the pattern to be formed, the pattern formed by one nozzle interferes with the other nozzle depending on the arrangement state of the plurality of nozzles (that is, , The pattern will be crushed).

  The present invention has been made in view of the above problems, and has as its main purpose to form an appropriate pattern on a substrate while using a plurality of nozzles having a plurality of discharge ports.

The invention according to claim 1 is a pattern forming apparatus for forming a pattern on a substrate, wherein a discharge portion that discharges a predetermined material for forming the pattern toward the substrate, and a first portion along the main surface of the substrate. a moving mechanism for relatively moving the discharge unit with respect to the substrate and the first direction, the move with the ejection portion, the light irradiation to cure by irradiating light to the predetermined material discharged onto the substrate and a section, the discharge section, have a light shielding portion for shielding light from the light irradiation unit with respect to the discharge port of the discharge portion, the discharge port, relative the direction toward the substrate of the discharge portion The light-shielding portion is a portion that protrudes toward the light irradiation portion on the upper side of the discharge port .

A second aspect of the present invention is the pattern forming apparatus according to the first aspect, wherein the light shielding portion is a member that protrudes from a tip of a nozzle block provided with the discharge port .

According to a third aspect of the present invention, there is provided a pattern forming apparatus for forming a pattern on a substrate, wherein a discharge portion that discharges a predetermined material for forming the pattern toward the substrate, and a first portion along the main surface of the substrate. A moving mechanism that moves the discharge unit relative to the substrate in the direction of 1; and light irradiation that moves together with the discharge unit and irradiates the predetermined material discharged on the substrate with light to be cured. A member that protrudes from the tip of the nozzle block in which the discharge port is provided, the discharge unit including a light-blocking unit that blocks light from the light irradiation unit against the discharge port. It is .

The invention described in claim 4 is the pattern forming apparatus according to claim 2 or 3, wherein the light shielding part, the protruded from the tip length of the nozzle block is a member can be changed.
A fifth aspect of the present invention is the pattern forming apparatus according to any one of the second to fourth aspects, wherein a plurality of discharge ports are provided in the nozzle block.

  According to the present invention, a pattern with high shape accuracy can be formed.

  FIG. 1 is a diagram showing a schematic configuration of a pattern forming apparatus 1 according to an embodiment of the present invention. The pattern forming apparatus 1 is an apparatus that forms a pattern of partition walls 91 on a glass substrate (hereinafter referred to as “substrate”) 9 of a plasma display device. The substrate 9 on which the partition walls 91 are formed is subjected to other processes. A panel (usually a rear panel) is an assembly part of the plasma display device.

  In the pattern forming apparatus 1, the stage moving mechanism 2 is provided on the base 11, and the stage 3 holding the substrate 9 can be moved in the X direction shown in FIG. 1 by the stage moving mechanism 2. A frame 12 is fixed to the base 11 so as to straddle the stage 3, and a head portion 5 that discharges a partition material toward the substrate 9 is attached to the frame 12.

  The stage moving mechanism 2 has a structure in which a ball screw 22 is connected to a motor 21 and a nut 23 fixed to the stage 3 is attached to the ball screw 22. A guide rail 24 is fixed above the ball screw 22, and when the motor 21 rotates, the stage 3 together with the nut 23 moves smoothly in the X direction along the guide rail 24.

  The head unit 5 has a plurality of nozzle units 53 that cure while discharging the partition wall material onto the support unit 52 and the substrate 9, and the support unit 52 is attached to the lower surface of the base 51 fixed to the frame 12. The nozzle unit 53 is attached to the lower portion of the support portion 52. A supply pipe 522 that supplies a partition wall material via a check valve 521 and a light source unit 527 that generates ultraviolet rays via an optical fiber 526 are connected to the support portion 52, and each nozzle passes through the support portion 52. A partition wall material and ultraviolet rays are guided to the unit 53. The supply pipe 522 is branched, and one is connected to the pump 523 and the other is connected to the tank 525 storing the partition wall material via the control valve 524.

  The motor 21, the pump 523, the control valve 524 and the light source unit 527 of the stage moving mechanism 2 are connected to the control unit 6, and these components are controlled by the control unit 6, so that the pattern forming apparatus 1 applies the pattern onto the substrate 9. A partition pattern is formed.

  FIG. 2 is a view showing a state when the nozzle unit 53 attached to the support portion 52 is viewed from the (−Z) side in the (+ Z) direction. The plurality of nozzle units 53 are attached to the support portion 52 so as to form two rows in the Y direction while alternately shifting in the (+ X) direction and the (−X) direction (that is, the relative movement direction of the head portion 5 with respect to the substrate 9). It is done. The nozzle unit 53 is inserted into the insertion port 528 formed in the support portion 52, and a plurality of reference portions on the nozzle unit 53 side and a plurality of reference portions in the insertion port 528 come into contact with each other, thereby the nozzle unit 53. Are accurately positioned in the X, Y and Z directions. In FIG. 2 (and FIG. 3 described later), illustration of positioning protrusions and the like existing in the gap between the insertion port 528 and the nozzle unit 53 is omitted.

  The nozzle unit 53 is fixed to the support portion 52 by being urged by a fixing screw (not shown) that penetrates the support portion 52. Therefore, the replacement of the nozzle unit 53 can be easily performed by taking out the nozzle unit 53 by loosening the fixing screw or the like and fixing the new nozzle unit 53 in contact with the inside of the insertion port 528.

  FIG. 3 is a view showing a state when the nozzle unit 53 attached to the support portion 52 is viewed from the (+ Y) side in the (−Y) direction, and FIG. 4 is a view from the (−X) side to (+ X). It is a figure which shows a mode when it sees facing the direction. Hereinafter, the configuration of the nozzle unit 53 will be described with reference to FIGS.

  In the nozzle unit 53, a nozzle block 72 provided with a plurality of discharge ports 721 arranged in the Y direction at the tip is attached to the lower portion of the unit main body 71, and the light irradiation unit 73 which is an optical fiber whose tip is processed is also the discharge port 721. It is attached to the unit main body 71 so as to be located approximately above. The flow path in the unit main body 71 and the nozzle block 72 reaching the discharge port 721 is connected to the flow path of the partition wall material in the support part 52 through packing or the like, and the light irradiation part 73 is also connected to the light in the support part 52. Optically connected to a fiber (an optical fiber connected to the optical fiber 526 shown in FIG. 1) via a coupling. These connections are realized only by attaching the nozzle unit 53 to the support portion 52.

  As shown in FIG. 3, the nozzle block 72 moves from the (−Z) direction (that is, the direction toward the substrate 9) to the (−X) side (that is, the rear side with respect to the relative movement direction of the head unit 5 with respect to the substrate 9). Inclined and attached to the unit main body 71, the flow path to the discharge port 721 is inclined from the (−Z) direction to the (−X) side. The (−Z) side corner of the tip of the nozzle block 72 is processed into a surface 722 parallel to the XY plane, and the (+ Z) side corner projects in the (−X) direction on the light irradiation unit 73 side ( For example, a shape in which large chamfering is not intentionally performed). The corner on the (+ Z) side plays a role of shielding the ultraviolet rays from the light irradiation unit 73 with respect to the ejection port 721 as will be described later, and hence is referred to as a light shielding unit 723 hereinafter.

  In the nozzle unit 53, the plurality of discharge ports 721 are formed in the Y direction at a predetermined pitch L1, as shown in FIG. Further, the discharge gap of the partition wall material between the nozzle units 53 is also made equal to the pitch L1 of the discharge ports 721 in the Y direction. That is, in one nozzle block 72 (hereinafter, referred to as “target nozzle block”) and an adjacent nozzle block 72 (hereinafter, referred to as “adjacent nozzle block”), discharge on the adjacent nozzle block 72 side of the target nozzle block 72. A distance in the Y direction between the outlet 721 and the discharge port 721 on the target nozzle block 72 side of the adjacent nozzle block 72 is defined as a pitch L1.

  Two nozzle blocks 72 adjacent to each nozzle block 72 in the Y direction are arranged symmetrically with respect to a symmetry plane that is parallel to the ZX plane and passes through the center of each nozzle block 72. Accordingly, all the ejection ports 721 are arranged at a pitch L1 with respect to the Y direction (that is, a direction perpendicular to the relative movement direction of the head unit 5 and parallel to the main surface of the substrate 9), and a constant pitch L1 over a wide range. The partition wall material is discharged.

  2 to 4, the nozzle block 72 of the nozzle unit 53 provided on the (−X) side (the rear nozzle block with respect to the relative traveling direction of the head portion 5 is hereinafter referred to as “rear nozzle”). Cutouts 724 are provided at both ends of the block in the Y direction. As shown in FIG. 4, when viewed from the (−X) side toward the (+ X) direction, the notch 724 has a nozzle block 72 (hereinafter referred to as “front nozzle block”) in which the rear nozzle block 72 is the (+ X) side. The size of the discharge port 721 is not overlapped.

  Specifically, in FIG. 4, the distance from the center of the discharge port 721 at the end of the rear nozzle block 72 to the end surface of the notch 724 is L2, and the width of the discharge port 721 in the Y direction (or the partition wall to be formed) In the case where L3 is set to L3, the notch 724 is formed so that (L2 <L1-L3 / 2) is satisfied. Furthermore, the height of the notch 724 in the Z direction is set higher than the height of the partition wall to be formed. As a result, the partition wall 91 formed by the front nozzle block 72 is prevented from interfering with the rear nozzle block 72 as will be described later.

  FIG. 5 is a diagram showing a state in which the partition wall material is discharged onto the substrate 9 as viewed from the (+ Y) side in the (−Y) direction, and FIG. It is a top view which shows the above state. In these drawings, reference numeral 72a is assigned to the front nozzle block, and reference numeral 72b is assigned to the rear nozzle block. Hereinafter, the basic operation of the partition formation by the pattern forming apparatus 1 will be described.

  The partition wall material is discharged from the discharge port 721 by the check valve 521, the pump 523, and the control valve 524 shown in FIG. First, the pump 523 performs a suction operation with the control valve 524 being opened under the control of the control unit 6. At this time, since the check valve 521 prevents the back flow of the partition wall material, the partition wall material is drawn from the tank 525 to the pump 523. Next, the control valve 524 is closed under the control of the control unit 6, and the pump 523 performs an extrusion operation. Thereby, the partition material is continuously discharged from the discharge port 721.

  At this time, the controller 6 drives and controls the motor 21 of the stage moving mechanism 2 so that the surface of the substrate 9 moves in the (−X) direction (the direction of the arrow 31 in FIG. 1) below the discharge port 721. To control. As a result, the head unit 5 moves relatively in the direction along the main surface of the substrate 9, and the front nozzle block 72 a precedes the X direction as shown in FIGS. 5 and 6 to apply the partition material to the substrate 9. The partition wall 91 is formed, and the partition wall 91 is formed so that the rear nozzle block 72b follows the front nozzle block 72a. And the area | region on the board | substrate 9 after the rear side nozzle block 72b passes will be in the state in which many partition walls 91 were formed with the predetermined pitch, as shown in FIG.

  As shown in FIG. 5, the discharge port 721 through which the partition material is discharged is close to the distance between the surface 722 of the nozzle block 72 and the substrate 9 to about 10 μm, and the partition material has a shape corresponding to the shape of the discharge port 721. It is discharged onto the substrate 9. Thereby, the partition wall material can be accurately and stably discharged from the discharge port 721 toward the substrate 9. Note that the distance between the surface 722 and the substrate 9 may be changed as appropriate according to the viscosity of the material, and the nozzle block 72 and the substrate 9 may contact each other as long as the substrate 9 is not damaged.

  As described above, since the discharge ports 721 of the plurality of nozzle blocks 72 are arranged at a constant pitch in the Y direction, both ends of the rear nozzle block 72b are arranged at the front nozzle block 72a as shown in FIGS. Will overlap with the partition wall 91 formed. However, since the notch 724 is provided in the rear nozzle block 72b in the pattern forming apparatus 1, the partition 91 formed by the two front nozzle blocks 72a adjacent to both sides is the notch on the rear nozzle block 72b side. It will pass below 724. As a result, interference between the partition wall 91 and the rear nozzle block 72b due to the front nozzle block 72a can be avoided, and a large number of partition walls 91 can be formed at a predetermined pitch.

  On the other hand, as shown in FIG. 5 and FIG. 6, the partition 91 discharged onto the substrate 9 is irradiated with ultraviolet rays from the light irradiation unit 73. The partition wall material is made of glass or ceramic powder mixed with a resin containing an ultraviolet curable resin. The partition wall 91 is cured by irradiating with ultraviolet rays, and the shape of the partition wall 91 collapses over time. It is prevented from spreading.

  Thereby, it becomes possible to increase the ratio (H / W) of the height (H) to the length (W) of the portion of the partition wall 91 in contact with the substrate 9. In addition, since the discharge port 721 and the substrate 9 are close to each other, it is possible to form the partition wall 91 with extremely high shape accuracy. For example, it is possible to appropriately form a partition wall having a width of 50 μm and a height of 400 μm.

  In addition, the partition formed by the pattern forming apparatus 1 is separately baked to remove organic substances.

  By the way, in the nozzle block 72, in order to bring the discharge port 721 close to the substrate 9, the discharge port 721 is opened so as to be inclined rearward with respect to the relative movement direction of the head unit 5 from the direction toward the substrate 9 ( That is, the normal direction of the opening region or the flow path is inclined), but in this case, if the corner of the tip of the nozzle block 72 is small or the corner is chamfered, there is a possibility that ultraviolet rays may directly enter the discharge port 721. Becomes higher. When ultraviolet rays are directly applied to the discharge port 721, the partition wall material slightly adhered to the periphery of the discharge port 721 is cured, and there is a possibility that proper discharge is impaired (or clogged). In the nozzle unit 53, as shown in FIG. 5, since the upper part of the discharge port 721 of the nozzle block 72 is a light shielding portion 723 that protrudes to the (−X) side (light irradiation unit 73 side), ultraviolet rays are discharged from the discharge port 721. Direct irradiation is prevented, and proper discharge is maintained.

  As described above, the pattern forming apparatus 1 can prevent interference between the nozzle units 53 arranged in two rows by providing the notches 724 at both ends of the rear nozzle block 72b. Further, by providing the light shielding portion 723, the partition wall material discharged onto the substrate 9 can be cured while light from the light irradiation portion 73 is shielded from the ejection port 721. As a result, the partition wall 91 having an appropriate shape corresponding to the shape of the discharge port 721 can be formed on the substrate 9 by inclining the discharge port 721 and approaching the substrate 9.

  By the way, without providing the notch 724, the thickness of the end of the nozzle block 72 (distance from the discharge port 721 at the end to the side surface of the nozzle block 72) is such that it does not interfere with the partition wall 91 formed by the adjacent nozzle block 72. A method of thinning is also conceivable. However, in this case, the strength of the entire side surface of the nozzle block 72 on the Y direction side is low, and the strength necessary for handling such as replacement of the nozzle unit 53 cannot be obtained. In particular, in view of processing accuracy and processing cost, it is preferable to use ceramics as the material of the nozzle block 72. If the notch portion 724 is not provided, the side surface on the Y direction side of the nozzle block 72 is damaged by a slight impact. It will end up. As described above, the notch 724 plays an important role in view of the strength and manufacturing cost of the nozzle block 72.

  FIG. 7 is a diagram illustrating another example of the nozzle block 72 and the light irradiation unit 73. In FIG. 7, the front end of the light irradiation unit 73 is provided to be inclined from the (−Z) direction to the (+ X) side, and light from the light irradiation unit 73 is irradiated onto the upper surface of the front end of the nozzle block 72. A light shielding member 723a is attached to prevent this. Thereby, the light from the light irradiation part 73 does not harden the partition material near the discharge port 721, and the partition material discharged onto the substrate 9 can be cured immediately after discharge.

  Here, the relative position of the light shielding member 723a with respect to the nozzle block 72 can be adjusted, and the length of the tip of the light shielding member 723a protruding from the tip of the nozzle block 72 is appropriately changed. Thereby, it is easy to irradiate ultraviolet rays to an appropriate position of the material discharged from the discharge port 721 according to a change in the position and orientation of the light irradiation unit 73 or according to a change in the characteristics of the discharged material. It becomes possible.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made.

  The arrangement of the nozzle units 53 is not limited to two rows, and may be three or more rows. Further, when there is one adjacent and preceding (that is, front) nozzle block 72, only one notch 724 needs to be formed.

  The shape of the notch 724 is not limited to the shape shown in the above embodiment, and may be any shape as long as it can avoid interference with the partition wall 91 formed by another nozzle unit 53. . When the nozzle block 72 is formed of ceramics, the cutout portion 724 is formed to be cut out by grinding, cutting, or the like, but in the case of other materials, other methods (for example, melting or electric discharge machining) Etc.). That is, it may be formed in an arbitrary shape as a recess that avoids the partition wall 91 from the front nozzle block 72.

  The shape of the light shielding part 723 and the light shielding member 723a is not limited to the above embodiment, and any shape may be used as long as the discharge port 721 can be shielded from the light from the light irradiation part 73.

  The pattern forming apparatus 1 can be used when forming a plurality of linear patterns using not only a partition wall material but also a conductive wiring material or other materials, and a flat display device in which a large number of such patterns are formed. It is particularly suitable for manufacturing a panel for (FPD such as plasma display device, organic EL display device, liquid crystal display device). In addition, the present invention can be applied to a technique for forming a wiring using a conductive material on a semiconductor substrate or a normal wiring board, and the pattern forming apparatus 1 can be applied to various pattern forming techniques.

  Curing of the partition wall material (may be another material such as a wiring material) may be performed by other types of light (electromagnetic waves). For example, curing may be performed by heating with infrared rays.

  In the pattern forming apparatus 1, the stage 3 moves with respect to the head unit 5, but the head unit 5 may move with respect to the stage 3. The movement of the head unit 5 with respect to the stage 3 may be relative.

It is a figure which shows schematic structure of a pattern formation apparatus. It is a bottom view which shows a nozzle unit. It is a side view which shows a nozzle unit. It is a front view which shows the lower part of a head part. It is a figure which shows a mode that a partition material is discharged on a board | substrate. It is a figure which shows the mode of the board | substrate in the middle of discharge of a partition material. It is a figure which shows the other example of the lower part of a nozzle unit.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Pattern formation apparatus 2 Stage moving mechanism 9 Substrate 72 Nozzle block 91 Bulkhead 73 Light irradiation part 721 Discharge port 723 Light shielding part 723a Light shielding member

Claims (5)

A pattern forming apparatus for forming a pattern on a substrate,
A discharge unit that discharges a predetermined material for forming a pattern toward the substrate;
A moving mechanism for moving the discharge unit relative to the substrate in a first direction along a main surface of the substrate;
A light irradiation unit that moves together with the discharge unit and irradiates and cures the predetermined material discharged onto the substrate;
With
The discharge section, have a light shielding portion for shielding light from the light irradiation unit with respect to the discharge port of the discharge portion,
The discharge port is inclined and opened rearward with respect to the relative movement direction of the discharge unit from the direction toward the substrate,
The pattern forming apparatus , wherein the light shielding portion is a portion protruding to the light irradiation portion side above the discharge port . The pattern forming apparatus according to claim 1,
  The pattern forming apparatus, wherein the light shielding portion is a member protruding from a tip of a nozzle block provided with the discharge port. A pattern forming apparatus for forming a pattern on a substrate,
  A discharge unit that discharges a predetermined material for forming a pattern toward the substrate;
  A moving mechanism for moving the discharge unit relative to the substrate in a first direction along a main surface of the substrate;
  A light irradiation unit that moves together with the discharge unit and irradiates and cures the predetermined material discharged onto the substrate;
With
  The ejection unit has a light shielding unit that shields light from the light irradiation unit with respect to the ejection port;
  The pattern forming apparatus, wherein the light shielding portion is a member protruding from a tip of a nozzle block provided with the discharge port. A pattern forming apparatus according to claim 2 or 3,
The light shielding part, a pattern forming apparatus, wherein the length protruding from the tip of the nozzle block is a member can be changed. The pattern forming apparatus according to any one of claims 2 to 4,
  A pattern forming apparatus, wherein the nozzle block is provided with a plurality of ejection openings.

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