JP4517683B2 - Method for producing hot-dip plated plate - Google Patents

Description

The present invention relates to a manufacturing method of the dispersion plating plate by melt plating method.

  Hot dip plated steel is one of the steel products that has shown a quantitative expansion along with diversification of varieties. The reasons behind this are (1) social demands such as resource and energy savings, (2) technological innovations in key industries and development of advanced fields, and (3) improvement of living standards and lifestyle changes. As a result of the diversification, upgrading, and multifunctionality, there has been a change that the application range of hot-dip plated sheets has expanded.

  Many zinc-based alloy platings have been developed in search of corrosion resistance superior to conventional galvanizing. Alloying is one method for achieving high corrosion resistance, and it can be said that the service life of the product has been extended. However, customer demand is maintenance-free, and there is a further demand for materials having high corrosion resistance. In order to respond to this, it is necessary to combine plating films.

1) Dispersion plating with high corrosion resistance Dispersion plating that co-deposits SiO ₂ sol during zinc plating has been developed by electroplating. SiO ₂ is a stable substance over a wide pH range, and a complex oxide with Zn acts as a barrier against corrosion factors such as Cl ⁻ , O ₂ , and H ₂ O. Until now, the composite of plating films has been performed by forming some film on the plating surface by chemical conversion treatment or the like. Therefore, when the surface was scratched, the surface layer was destroyed and the function was easily lost. In contrast, with dispersion plating, SiO ₂ sol, Al ₂ O ₃ sol, BaCrO ₄ , SrCrO _4, etc. can be easily dispersed throughout the plating film, resulting in the formation of a plating film with much better corrosion resistance than conventional zinc plating. The

2) Colored dispersion plating Conventionally, the plating film is colored by applying a paint on the surface of the galvanized plate, which is called a color plate. In addition, as a method for coloring the galvanized film itself, a method has been developed in which a special element is added to a zinc bath, an oxide film is formed by post-treatment, and a color is produced by the interference color. Since these all have a colored layer only on the surface, the coloring effect is lost due to scratches.

  Therefore, color plating in which a color pigment or a fluorescent pigment is dispersed in a plated metal is promising. A metal plating film corresponding to the color tone of the pigment can be obtained, and it can have both corrosion resistance due to the plating metal and design static due to the color. Furthermore, unlike painting, it has the characteristic that the color is not lost even if the film is scratched.

3) Heat resistant dispersion plating Currently, there is Al plating as a heat resistant plating plate. However, stainless steel is used when used at higher temperatures, and Al plated stainless steel is used when high temperature corrosion resistance is required. If particles such as SiO ₂ are dispersed in the Al plating film, a heat-resistant and high-temperature corrosion-resistant plating film can be obtained.

4) Dispersion plating plate manufacturing method As described above, a dispersion plate in which fine particles are uniformly dispersed in a metal matrix is promising for a plating plate having high functions such as high corrosion resistance, coloring, and high heat resistance.

  As a method for producing dispersion plating, an electroplating method and an electroless plating method have been developed. However, there are restrictions on the combination of the matrix metal and the dispersed particles, and there are problems such as low deposition efficiency of the dispersed particles in the film. In addition, these methods are difficult to apply to a continuous plating plate because the deposition rate of the plating metal is slow.

  On the other hand, hot-dip plated plates such as zinc, aluminum, and alloys thereof are conventionally manufactured as follows. That is, the thin sheet after cold rolling is subjected to surface cleaning in a pretreatment step, the surface oxide film is removed in an annealing furnace maintained in a non-oxidizing or reducing atmosphere, annealing is performed, and then cooling is performed. Then, it is cooled to about the same temperature as the molten metal bath temperature and penetrates into the molten metal bath. Thereafter, the plate is pulled up from the bath, and excess molten metal adhering to the plate surface is wiped with a gas wiper.

  FIG. 1 is a schematic cross-sectional view showing the arrangement of main parts of a hot-dip plating plate manufacturing facility used for manufacturing a conventional hot-dip plating plate. After the material is adjusted in the annealing furnace 2, the plate 1 is drawn into the molten metal bath 4 held in the plating pot 4 a from the snout 3 kept in a non-oxidizing atmosphere, and passes through the sink roll 5 in the vertical direction. The excess molten metal is wiped off by the gas wiper 6. In the case of producing an alloyed hot-dip galvanized sheet, the zinc plated by heating in the heating furnace 8 and the Fe of the base iron are diffusion-alloyed, and the plating film is made an Fe—Zn alloy. Then, it cools to about normal temperature with the cooling device 9, is led to a post process, and becomes a product.

As a method for producing dispersion plating in this continuous hot dipping line, it is necessary to disperse particles uniformly in the molten metal and to immerse and plate the plate. However, in practice, even if the molten metal bath is vigorously stirred, it is difficult to uniformly disperse the particles in the bath, and the aggregation of the particles cannot be prevented. For this reason, only a plating plate in which particles are dispersed non-uniformly in the plating film can be obtained, and it is virtually impossible to produce a dispersion plating plate by a continuous hot dipping line.

Accordingly, an object of the present invention has been made in view of such conventional problems, the hot dipping method, particles in the plating film is to provide a method for producing a uniformly dispersed dispersion plating plate.

  The inventors of the present invention have intensively studied a production facility and a method for a hot-dip dispersion plating plate that can produce a hot-dip plating plate without having a hot metal plating pot in which particles are dispersed in advance.

  As a result, hot dip plating is performed in a single plating bath (pure metal or alloy), and dispersed particles are supplied and adhered after hot dip plating is completed, and then heated to melt the plated metal. It has been found that a dispersion plating plate can be manufactured by a hot dipping method by mixing the plated metal and the adhered particles.

  The present invention is based on this finding. The gist of the present invention is as follows.

In a first aspect of the present invention, there is provided a method of manufacturing a hot-dip plated metal plate, wherein the hot-dip plating process is performed on the metal plate by passing the metal plate through a hot-metal bath and a hot-dip plated layer is formed on at least one surface of the metal plate ,
Cooling the metal plate passed through the molten metal bath to a temperature at which the plated metal solidifies;
An adhesion step of attaching oxide particles dispersed in the plating layer to the plating surface of at least one surface of the metal plate;
Heating the metal plate and mixing the hot-dip plated metal and the adhered oxide particles;
In this order, a method for producing a hot-dip plated metal sheet.

A second invention is the method for producing a hot-dip plated metal sheet according to the first invention , wherein the attaching step sprays oxide particles to be dispersed in the plated layer onto the plated metal sheet.

A third invention is the method for producing a hot-dip dispersed plated metal plate according to the first invention , wherein the attaching step comprises electroplating a plated metal plate with oxide particles to be dispersed in the plated layer.

According to a fourth invention, in the first invention , the adhesion step is a method for producing a hot-dip plated metal sheet, characterized in that oxide particles dispersed in the plating layer are applied to the plated metal sheet.

According to a fifth aspect of the present invention, in the fourth aspect of the invention, the attaching step includes a pressure-bonding step in which the oxide particles dispersed in the plating layer are applied to the plated metal plate and then the oxide particles are pressure-bonded to the plating surface. It is the manufacturing method of the hot dip alloying treatment steel metal plate characterized.
A sixth invention is the method of manufacturing a hot-dip galvannealed steel plate according to any one of the first to fifth inventions, wherein particles obtained by mixing metal particles with oxide particles are used instead of the oxide particles. It is.

  In the present invention, since the particles to be dispersed are supplied after performing the base plating, a dispersed plating plate can be produced without having a molten metal plating pot in which the particles are dispersed in advance.

  Embodiments of the present invention will be described below. In the following drawings, the same parts as those shown in the already described figures are denoted by the same reference numerals, and the description thereof is omitted.

  FIG. 2 is a schematic cross-sectional view showing the main part of the manufacturing equipment for the hot-dip plated sheet according to the embodiment of the first invention of the present invention. In FIG. 2, 7a is a particle adhering device for adhering dispersed particles to the plating surface, 8a is a heating furnace, and 9a is a cooling device.

  FIG. 3 is a schematic cross-sectional view for explaining a first embodiment of a particle adhering device arranged in a manufacturing facility for a hot-dip plated plate according to an embodiment of the present invention. The particle adhering apparatus according to the present embodiment is an embodiment of a particle spraying apparatus that mixes particles dispersed in a plating layer (dispersed particles) with a gas and sprays and adheres particles to a plating plate.

  In FIG. 3, 10a is a particle supply device, 11 is a blower (particle blowing blower), 12 is a particle supply pipe, 13 is a particle return pipe, and 14 is a particle blowing box. The particles are sprayed on both sides of the plate 1 so that the particles can adhere to both sides of the plate. The traveling direction of the plate 1 is the direction of the arrow in the figure.

  The particles are supplied from the particle supply device 10 a to the particle return pipe 13 of the blower 11, mixed with the gas, pressurized by the blower 11, passed through the particle supply pipe 12, and sent to the spraying chamber 15 of the particle spraying box 14. It sprays on the board 1 from the slit 16 of the spraying chamber 15, and is made to adhere to the plating surface of the board 1. Excess particles are sucked from the upper and lower slits 18 of the particle blowing box 14, returned to the exhaust chamber 17, passed through the particle supply pipe 13, pressurized again by the particle blowing blower 11, and used for circulation. It is necessary to adjust the particle supply amount according to the plate width, the line speed, the plating adhesion amount, and the target alloying rate, and it is also necessary to consider the yield of the powder adhering to the plating surface (= adhesion efficiency).

  Particles produced by a physical pulverization method, a liquid phase method, a gas phase method, or the like can be used. As the particles, metallic or ceramic particles can be used. As the particle diameter, those prepared by classification are used. The average particle diameter is 0.01 μm to 200 μm. The smaller the particle size, the easier the dispersion into the plating film. Further, when the particle diameter is larger than the thickness of the plating film, the dispersion plating is formed such that part of the particles are exposed on the surface. On the other hand, if it exceeds 200 μm, it is possible that the entire particle is exposed on the surface, which is not preferable.

  When the particle spraying device 7c of FIG. 3 is disposed in the facility of FIG. 2, the particle spraying box 14 is disposed such that the traveling direction of the plate 1 is a vertical direction, and sprays particles onto the surface of the plated metal in a molten state. Adhere particles to the plated metal surface.

  The heating furnace 8a heats the plate 1 and mixes the molten metal and the particles adhered by the particle adhesion device 7a. The heating condition of the heating furnace 8a is adjusted by the hot-dip metal species and their adhesion amount, the adhered particle species and their adhesion amount. The heating method of the heating furnace 8a is not particularly limited. A known apparatus such as a gas heating furnace or a high-frequency induction heating furnace can be adopted, but a high-frequency induction heating furnace is advantageous in terms of controllability of the heating temperature.

  The cooling device 9a cools the alloyed plate 1 to a temperature of about room temperature. A known cooling device such as an air cooling device that blows air on the plate surface to cool the plate can be employed.

  When the particle adhering apparatus shown in FIG. 3 is installed in the facility shown in FIG. 2, a hot-dip plated sheet is manufactured as follows. After the material is adjusted in the annealing furnace 2, the plate 1 is drawn into the molten metal bath 4 from the snout 3 kept in a non-oxidizing atmosphere, pulled up in the vertical direction through the sink roll 5, and hot-dip plated. Excess molten metal is wiped off by the wiper 6 and adjusted to a predetermined plating adhesion amount. Immediately thereafter, the particles to be dispersed are adhered by the particle adhering device 7 for adhering the particles to be dispersed to the plating surface, and further, the plate is heated in the heating furnace 8 to mix the molten plating metal with the adhered particles. Then, after cooling to the room temperature by the cooling device 9, the coil is wound as it is, or before being wound into a coil, it is subjected to temper rolling or a post-treatment for forming a chemical conversion treatment / lubricating film, etc. After a subsequent process, the required product (molten dispersion plating plate) is obtained. When the particles to be deposited are metal, a part of the surface layer of the particles may be alloyed with the hot dip metal. On the other hand, when the alloy is completely alloyed to form one layer, the effect as dispersion plating is lost, which is not preferable.

  FIG. 4 is a schematic cross-sectional view for explaining a second embodiment of the particle adhering device arranged in the manufacturing facility for the hot-dip plated plate according to the embodiment of the present invention. The particle adhesion apparatus according to the present embodiment is another embodiment of the particle spraying apparatus that sprays and adheres particles to the plating surface. The apparatus of the present embodiment projects and deposits particles on the plating surface.

  In FIG. 4, (a) is a schematic diagram for explaining the structure of the particle spraying device 7d. The particle spraying device 7d is a particle projecting device 21a for projecting particles onto the plate surface facing the upper and lower surfaces of the plated plate. 21b. FIG. 4B is a schematic diagram illustrating the structure of a particle projection device 21a that projects particles onto the upper surface of the plate. 10b is a particle supply device, 22 is a motor, and 23 is a centrifugal rotor. The particles 24 are supplied from the particle supply device 10b, the centrifugal rotor 23 is rotated by the motor 22, the supplied particles 24 are projected onto the upper surface of the plate 1, and the particles 24 are attached to the plating surface. The particle projection device 21b that projects particles onto the lower surface of the plate also has the same configuration, and projects the particles onto the lower surface of the plate and attaches the particles to the plating surface.

  Particles produced by a physical pulverization method, a liquid phase method, a gas phase method, or the like can be used. As the particles, metallic or ceramic particles can be used. As the particle diameter, those prepared by classification are used.

  When projecting the particles, the average particle size of the particles needs to be 10 to 300 μm. This is because if the average particle diameter is less than 10 μm, the velocity of the projected solid particles decreases in the air, so that the projection cannot be made unless the projection velocity is increased very much. On the other hand, when the average particle diameter exceeds 300 μm, it is difficult to adjust the alloying rate. Further, the particle projection speed needs to be 30 m / sec or more. This is because if the projection speed is less than 30 m / s, sufficient kinetic energy is not imparted to attach the particles to the plating surface. From this viewpoint, the upper limit of the projection speed is not particularly set. However, if the projection speed is high, the kinetic energy of the particles becomes excessive and may damage the galvanized film. It is necessary to adjust the particle supply amount according to the plate width, line speed, plating adhesion amount and target alloying rate, and it is also necessary to consider the yield (= adhesion efficiency) of particles adhering to the plating surface.

  When the particle spraying device 7d of FIG. 4 is installed in the facility of FIG. 2, using the particle spraying device 7d, the particles are sprayed on the surface of the plated metal in the molten state to adhere the particles to the surface of the plated metal, The plate is heated in the heating furnace 8a, the molten plating metal and the adhered particles are mixed, and the molten dispersion plating plate can be manufactured by cooling to about room temperature with the cooling device 9a.

  FIG. 5 is a schematic cross-sectional view showing a main part of the manufacturing equipment for the hot-dip dispersion plated plate according to the second embodiment of the present invention. In FIG. 5, 7b is a particle adhering device, 8b is a heating furnace, and 9b and 9c are cooling devices. The heating furnace 8b heats the plate 1 and mixes the molten metal and the particles adhered by the particle adhesion device 7b. The heating method is not particularly limited. A known apparatus such as a gas heating furnace or a high-frequency induction heating furnace can be employed, but a high-frequency induction heating furnace is advantageous in terms of controllability of the alloying rate. The cooling devices 9b and 9c each cool the plate 1 to a temperature of about room temperature. A known cooling device such as an air cooling device that blows air on the plate surface to cool the plate can be employed.

  As the particle adhering device disposed in the apparatus shown in FIG. 5, the particle spraying apparatus shown in FIGS. 3 and 4 can be used.

  When the particle spraying device 7c of FIG. 3 is disposed in the facility of FIG. 5, the particle powder spraying box 14 is disposed such that the traveling direction of the plate 1 is in the horizontal direction. When the particle adhering device of FIG. 3 is arranged in the facility of FIG. 5, a hot-dip plated plate is manufactured as follows. After the material is adjusted in the annealing furnace 2, the plate 1 is drawn into the molten metal bath 4 from the snout 3 kept in a non-oxidizing atmosphere, pulled up in the vertical direction through the sink roll 5, and then hot-dipped. Then, excess molten metal is wiped off by the gas wiper 6 and adjusted to a predetermined plating adhesion amount. Then, after being cooled to about room temperature by the cooling device 9a, the particles to be dispersed are attached by the particle attaching device 7 for attaching the particles to be dispersed to the plating surface, and the plate is reheated in the heating furnace 8, The hot-dip plated metal and the adhered particles are mixed, and then cooled to about room temperature by the cooling device 9b and led to a subsequent process to become a product (hot-dispersed plated plate).

  When the particle spraying device 7d of FIG. 4 is disposed in the facility of FIG. 5, as shown in FIG. 4, the particle spraying device 7d is disposed so that the traveling direction of the plate 1 is horizontal. Particles are sprayed onto the surface of the plated metal by spraying the particles onto the surface of the plated plate cooled to about room temperature using a particle adhesion device. Next, the plate is heated in the heating furnace 8b, the molten plating metal and the adhered particles are mixed, and the molten dispersion plated plate is manufactured by cooling to about room temperature with the cooling device 9c.

  The apparatus d in FIG. 3 and FIG. 4 described above is configured so that the particles adhere to both surfaces of the plate 1, but if necessary, the particles are sprayed and adhered to only one surface of the plate. May be.

  FIG. 6 is a schematic cross-sectional view for explaining a third embodiment of the particle adhering device arranged in the production facility for the hot-dip plated plate according to the embodiment of the present invention. The particle adhesion apparatus according to the present embodiment is an embodiment in the case of an electroplating apparatus that adheres particles to a plating plate by electroplating. In FIG. 6, the electroplating device 7 e includes a pretreatment device 31, a plating device 32, and a water washing and drying device 33.

  The pretreatment device 31, the plating device 32, and the water washing device 33 may be devices generally used for electroplating plates. For example, the pretreatment device 31 may be an alkaline degreasing device, and if necessary, a washing device, a pickling and pickling device, and a washing scrubber may be sequentially arranged after the alkaline degreasing device. The plating device 32 may be a normal electroplating device, and the water washing and drying device 33 may be a surface adjustment device or a hot water washing device for neutralizing the electroplating solution.

  The particle adhering apparatus (electroplating apparatus 7e) of FIG. 6 is disposed in the hot-dispersion plating plate manufacturing facility of FIG. 5, and manufactures the hot-dispersion plating plate as follows. The plated plate that has been subjected to molten metal plating and cooled to about room temperature by the cooling device 9 b is pretreated by the pretreatment device 31, the particles to be dispersed by the plating device 32 are electroplated, and washed and dried by the washing and drying device 31. Next, the plate is heated in the heating furnace 8b to mix the molten plating metal and the adhered particles, and is cooled to about room temperature by the cooling device 9c.

  FIG. 7 is a schematic cross-sectional view for explaining a fourth embodiment of the particle adhering apparatus arranged in the hot-dispersion plated plate manufacturing facility according to the embodiment of the present invention. The particle adhering apparatus according to the present embodiment is an embodiment in the case of a particle applying apparatus that applies and adheres particles to a plating plate.

  In FIG. 7, the particle coating device 7 f includes a coating device 41, a drying device 42, and a pressure bonding device 43.

  The coating device 41 may be any device that can apply the particle slurry to the surface of the plating plate. A known coating apparatus used for slurry application, such as a curtain coater, a roll coater, or a spray coater, can be used. The drying device 42 is preferably high-frequency induction heating, and a known drying device (hot air drying furnace, baking furnace) can be used. The crimping device 43 can use a rolling roll.

  The particles to be dispersed are supplied as a slurry. As the particles, the same particles as those used in the apparatus shown in FIGS. 3 and 4 can be used. The particle adhering device (particle applying device 7f) of FIG. 7 is arranged in the manufacturing facility for the hot dispersion plated plate of FIG. 5, and manufactures the hot dispersion plated plate as follows. A coating process, a drying process, and a press-bonding process are sequentially performed on the plated plate that has been subjected to molten metal plating and cooled to about room temperature by the cooling device 9b. That is, the slurry of particles to be dispersed is applied to the surface of the plating plate cooled to about room temperature using the coating device 41, and heated and dried by the drying device 42 to adhere the particles to be dispersed on the plating surface. Next, the plating plate to which the particles are adhered is rolled using the pressure bonding device 43 to press the particles to the plating surface. The crimping device 43 is used as necessary. Next, the plate is heated in the heating furnace 8b to mix the hot-dip metal and the pressure-bonded particles, and is cooled to about room temperature by the cooling device 9c. When slurry-like metal powder is applied by an application device such as a roll coater, the slurry made of metal powder, water, and a small amount of a reaction inhibitor needs to appropriately adjust the content and particle size of the metal powder. That is, the viscosity of the slurry needs to be 200 cp or more when applied by a roll coater.

  The coating device 41 may be an electrostatic coating device that electrostatically attaches dried particles to a plate. For example, the electrostatic coating apparatus is a method in which a metal powder is introduced into a chamber by a gas jet ejected from a nozzle, charged by corona discharge generated in the chamber, and electrostatically adhered to a grounded steel sheet. It is. In this case, since the dry method does not include water as in the case of using a slurry, the drying device 42 may not be provided.

  The present invention can be variously modified without being limited to the above embodiment.

  In the present invention, the base hot-dip plating can be applied to various metal platings or alloy platings, and various kinds of dispersion plating can be manufactured by appropriately selecting particles to be adhered (dispersion particles).

  As the hot dip metal, not only a single metal but also various alloy metals can be used. That is, pure metals include zinc, aluminum, lead, etc., and alloys include Al—Zn alloys (5% Al—Zn alloy plating, 22% Al—Zn alloy plating (superplastic alloy plating), 55% Al—Zn. Alloy plating), Sn—Zn alloy, Pb—Zn alloy, and the like can be used.

  As the particles to be adhered (particles to be dispersed), not only a single kind of particles but also two or more kinds of particles can be blended to produce a wide variety of dispersion plating. Furthermore, a wide variety of dispersed alloy platings can be produced by mixing metal powder with the particles to be dispersed.

The function to be expressed is not limited to the above-described high corrosion resistance, colorability, heat resistance, etc., and the following functions can be expected to be expressed. That is,
(1) Electrical functions: insulating, dielectric, piezoelectric, pyroelectric semiconductivity, ionic conductivity, electron emission, magnetic properties (2) Optical functions: translucency, deflection, light guide, Fluorescence, photosensitivity, electroluminescence (EL)
(3) Biological function (4) Chemical function: adsorptivity, catalytic activity, corrosion resistance, radiation property, heat resistance can be mentioned.

Particles that exhibit these functions include alumina, zirconia (zirconium oxide), lead zirconate titanate (PZT) ceramic, mullite, ferrite (Fe ₂ O ₃ .MO), barium titanate (TiBaO ₃ ), titanium Strontium acid (SrTiO ₃ ), titanium oxide (TiO ₂ ), zinc oxide (ZnO), tin oxide (SnO ₂ ), magnesium oxide (MgO), silicon carbide (SiC), boron carbide (B ₄ C), silicon nitride ( Si ₃ N ₄ ), aluminum nitride (AlN), boron nitride, sialon (SiAlON), titanium diboride (TiB ₂ ), zirconium diboride (ZrB ₂ ), hybrid ceramics, SiC-TiC, Al ₂ O ₃ − _{TiC-based, A1 2 O 3 -TiC, TiB} 2 _{based, A1 2 O 3 -TiC, SiC} , SiO 2 system A1 ₂ O ₃ - mullite, A1 ₂ O ₃ -Ti system, A1 ₂ O ₃ -ZrO ₂ system, A1 ₂ O ₃ -SiC whiskers, mullite -ZrO ₂ system, mullite -β- sponge-menu Men system, SiC- TiC-based, SiC-TiB ₂ based, SiC-Si ₃ N ₄ system, SiC-BN system, BN-AlN-based, beta-sialon - a particle such as silicon carbide-based can be applied.

  In the present invention, the steel plate to be plated may be not only a cold rolled steel plate but also a descaled hot rolled steel plate.

  In the present invention, the plating method of the hot dip metal may be a known method. The molten metal bath is not limited in the hot dipping equipment. The present invention can be applied to all continuous hot dip plating equipment such as all-reduction-type continuous hot dip plating equipment and direct flame heating type hot dip continuous hot dip plating equipment.

  Continuous hot-dip plating of general-purpose low-carbon Al-killed steel with a thickness of 0.8 mm made of the component composition shown in Table 1 (the balance being Fe and inevitable impurities) equipped with a non-oxidation furnace and a reduction heating furnace After charging into the equipment, annealing and molten metal plating are performed, and particles are adhered to the plating surface in the particle adhesion process, and then heated to the melting point of the underlying molten metal plating in the heating process to be melted. The particles adhered to the plating layer in the adhesion process were dispersed in the plating film.

  The hot-dip metal plating includes 0.2% Al—Zn bath, 5% Al—Zn plating (Galfan), 55% Al—Zn plating (Galbalium), and 91% Al-9 used for the production of ordinary hot-dip galvanized steel sheets. It was carried out in a% Si (Al plating) bath.

Adhesion of particles to the plating surface was performed by any of the following methods: (1) spraying particles with gas, (2) spraying particles with projection, (3) electroplating, and (4) slurry application. Each condition is described below.
(1) Particle spraying with gas (test materials No. 1-3, 13-15, 25-27)
・ Particle type: Al ₂ O ₃
Average particle size: 1, 5, 10 μm
-Flow rate (injection port): 300-1000 g / min, nitrogen gas spray (2) Particle spray by projection (test material Nos. 4-6, 16-18, 28-30)
・ Particle type: SiO ₂
-Average powder particle size: 10 μm
-Projection speed (projection port): 100 m / s
・ Projection distance: 500mm
Projection amount: 7.5 to 30 g / m ²
(3) Electroplating (test materials No. 7-9, 19-21, 31-33)
Plating Metal: SiO ₂ -Zn dispersion plating-plating solution: zinc sulfate: 300 g / L, sodium sulfate: 30 g / L, sodium acetate: 12 g / L, colloidal silica: 70 g / L, sodium nitrate: 1.6 g / L , PH: 2
・ Current density: 50 A / dm ²
(4) Slurry coating method (test materials No. 10-12, 22-24, 34-38)
・ Particle type: Al ₂ O ₃ , carbon pigment, titanium oxide pigment, bengara pigment, bitumen pigment, fluorescent pigment ・ Slurry: particles (average particle size: 0.1, 1 μm) dispersed in water, particle amount 1000 g / l
-Application drying with a roll coater An induction heating furnace was used for the heating process, and the cooling process after alloying was air-cooled. SEM observation of the cross-section of the plated film of the plated steel sheet prepared above, and the case where the particles are dispersed in the plated film is evaluated as “dispersed”, and the one that is not dispersed in the plated film is “non-dispersed”. It was evaluated.

  Tables 2 and 3 show the conditions of each step and the evaluation results of the dispersed state of the particles.

  As shown in Table 2 and Table 3, in both examples, the particles adhered to the plating surface are dispersed in the plating film after the heating step, and the melt dispersion in which the particles are dispersed with respect to the plating metal to be hot-plated A plated steel sheet is obtained. As described in the column of “Characteristics improved by particle dispersion” in Tables 2 and 3, various characteristics can be improved according to the combination of the hot-dip metal species and the particles dispersed in the hot-metal plating film. It becomes like this.

  The manufacturing facility of the present invention can be used as a facility for manufacturing a hot-dip dispersion plated plate.

  The production method of the present invention can be used as a method for producing a molten dispersion plated plate in which dispersed particles are present in a plating layer.

It is a schematic sectional drawing which shows the principal part arrangement | positioning of the hot dip plate manufacturing equipment used for manufacture of the conventional hot dip plate. It is a schematic sectional drawing which shows the principal part of the manufacturing equipment of the hot-dip dispersion plating board which concerns on embodiment of 1st invention of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic sectional drawing explaining 1st Embodiment of the particle adhesion apparatus arrange | positioned at the manufacturing equipment of the hot-dip dispersion plating board which concerns on embodiment of this invention. It is a schematic sectional drawing explaining 2nd Embodiment of the particle adhesion apparatus arrange | positioned at the manufacturing equipment of the hot-dip dispersion plating board which concerns on embodiment of this invention. It is a schematic sectional drawing which shows the principal part of the manufacturing equipment of the hot-dip dispersion plating board which concerns on embodiment of 2nd invention of this invention. It is a schematic sectional drawing explaining 3rd Embodiment of the particle adhesion apparatus arrange | positioned at the manufacturing equipment of the hot-dip-plating plate which concerns on embodiment of this invention. It is a schematic sectional drawing explaining 4th Embodiment of the particle adhesion apparatus arrange | positioned at the manufacturing equipment of the hot-dip dispersion plating board which concerns on embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Sheet | seat 2 Annealing furnace 3 Snout 4a Plating pot 4 Molten metal bath 5 Sink roll 6 Gas wiper 7a, 7b Particle adhesion apparatus 7c, 7d Particle spraying apparatus 7e Electroplating apparatus 7f Particle coating apparatus 8, 8a, 8b Heating furnace 9, 9a , 9b, 9c Cooling device 10a, 10b Particle supply device 11 Blower (particle blowing blower)
DESCRIPTION OF SYMBOLS 12 Particle supply pipe 13 Particle return pipe 14 Particle spray box 15 Spray chamber 16 Slit 17 Exhaust chamber 18 Slit 21a, 21b Particle projection apparatus 22 Motor 23 Centrifugal rotor 24 Particle 31 Pretreatment apparatus 32 Plating apparatus 33 Washing and drying apparatus 41 Powder coating apparatus 42 Drying equipment 43 Crimping equipment

Claims (6)

In the method for producing a hot-dip metal sheet, the hot-dip metallization process is performed on the metal plate by passing the metal plate through a hot-metal bath, and a hot-dip plating layer is formed on at least one surface of the metal plate.
Cooling the metal plate passed through the molten metal bath to a temperature at which the plated metal solidifies;
An adhesion step of attaching oxide particles dispersed in the plating layer to the plating surface of at least one surface of the metal plate;
Heating the metal plate and mixing the hot-dip plated metal and the adhered oxide particles;
In this order, the manufacturing method of the hot-dip dispersion plating metal plate characterized by the above-mentioned. The method of manufacturing a hot-dip dispersed plated metal sheet according to claim 1 , wherein the attaching step sprays the plated metal sheet with oxide particles dispersed in the plated layer. The method of manufacturing a hot-dip dispersed plated metal plate according to claim 1 , wherein the attaching step includes electroplating a plated metal plate with oxide particles dispersed in the plated layer. The method for producing a hot-dip dispersed plated metal sheet according to claim 1 , wherein in the attaching step, oxide particles dispersed in the plated layer are applied to the plated metal sheet. 5. The melting according to claim 4 , wherein the adhesion step includes a pressure-bonding step in which the oxide particles dispersed in the plating layer are applied to a plated metal plate, and then the oxide particles are pressure-bonded to a plating surface. A method of manufacturing a plated alloyed steel metal plate. The method for producing a hot-dip galvannealed steel metal plate according to any one of claims 1 to 5 , wherein particles obtained by mixing metal particles with oxide particles are used instead of the oxide particles.

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