JP4508845B2 - Semiconductor manufacturing equipment - Google Patents

Description

  The present invention generally relates to a semiconductor manufacturing apparatus, and more particularly to control of a semiconductor manufacturing apparatus using a servo bus. Here, the “servo bus” is a bus connecting the control unit and the servo amplifier. The present invention is suitable for a handler control method, for example.

  In recent years, semiconductor manufacturing apparatuses are required not only for miniaturization and space saving, but also for manufacturing efficiency and speedup. For example, a handler as an example of a semiconductor manufacturing apparatus is used in an inspection process performed after an assembly process (post process) in a semiconductor manufacturing process, and automatically supplies an assembled work to a test system, based on a test result. It is a device that automatically classifies and stores it in a tray. Since the handler drives and controls many motors, in recent years, a servo bus has been adopted from the viewpoint of miniaturization, space saving, and easy wiring (for example, see Patent Document 1). ). The servo bus is a wiring system that reduces the number of wires by serializing data communication. A plurality of slave stations such as I / O, A / D conversion, D / A conversion, and counter can be connected to the servo bus network.

  A conventional handler control system typically includes a controller and a network including a plurality of amplifiers and a plurality of driving units. The drive unit includes an air valve, a camera, camera illumination, and the like in addition to the motor. The servo bus is applied to a connection (serial connection) between a plurality of amplifiers (and an amplifier and a drive unit) in the network, and enables serial communication between the amplifiers.

In the control, the amplifier issues a command to the drive unit in response to a command from the controller, and as a result, the drive unit operates. The operation information of the drive unit is transmitted to the controller through the amplifier, and in response, the controller commands a predetermined command to the drive unit.
Japanese Patent Laid-Open No. 7-248812

  However, the conventional handler control system can achieve downsizing and space saving of the apparatus, but has a problem that the processing speed cannot be sufficiently achieved. For example, when the second motor is driven to a predetermined position or the air valve is opened when the first motor moves to the first position, the controller moves the first motor to the first position. When the operation information indicating that the first motor has reached the first position is received via the amplifier, the command to move to the position is transmitted to the amplifier connected to the first motor. In response, a command for driving the second motor and the air valve is transmitted. For this reason, the second motor and the air valve are not driven unless a predetermined time elapses after the first motor reaches the first position.

  The predetermined time includes a communication time between the controller and the amplifier and a response time for the controller to perform necessary calculations. In parallel communication, the time lag due to the communication time was not a problem, but in the servo bus system, multiple amplifiers on the network are scanned in sequence and signals are sent serially to the specified amplifier. Occurs. In addition, with recent demands for higher speed semiconductor manufacturing apparatuses, real-time performance for feedback control is increasingly required, and in particular, some drive units (for example, X-axis motor, Y-axis motor, Z-axis motor, θ-axis) High speed control is required for motors). However, as described above, during communication between the controller and the amplifier, scan delay and variation occur, and real-time feedback control cannot be realized.

  Furthermore, the controller needs to perform not only position control but also image processing calculation and overall sequence control, but there is a problem that other processing cannot be performed if real-time feedback control is performed.

  In order to solve these problems, it is conceivable to increase the number of wires by connecting the controller and amplifier in parallel as in the past, and to achieve real-time processing, but this reduces the size, space saving and wiring of the device. This is not preferable because it becomes impossible to realize this.

  Therefore, an object of the present invention is to provide a semiconductor manufacturing apparatus that maintains realization of wiring and realizes real-time feedback control of a drive unit that requires high-speed control.

A semiconductor manufacturing apparatus according to one aspect of the present invention includes a first motor and a second motor used in the pickup mechanism in a semiconductor manufacturing apparatus including a pickup mechanism that picks up and conveys a workpiece. A plurality of motors, a servo amplifier that drives each of the plurality of motors, a host controller that is serially connected to the servo amplifier and controls the servo amplifiers so as to drive the plurality of motors, An air valve that performs separation, a camera that captures an image of the state of the workpiece, and a lower controller that controls the air valve and the camera based on the position of the second motor. Based on the position of the second motor, the opening / closing timing of the air valve and the imaging timing of the camera And the host controller performs image processing on an image picked up by the camera, calculates a displacement amount of the workpiece, corrects the positions of the plurality of motors based on the displacement amount, and picks up the pickup. The mechanism is operated. Accordingly, real-time feedback control with little deviation can be performed, and a plurality of processes can be executed in parallel by the upper controller and the lower controller, so that the process can be made more efficient.

  Other objects and further features of the present invention will be made clear by the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, it is possible to provide a semiconductor manufacturing apparatus that maintains realization of wiring and realizes real-time feedback control of a drive unit that requires high-speed control.

  Hereinafter, a handler 100 as an example of a semiconductor manufacturing apparatus of the present invention will be described with reference to the accompanying drawings. The handler 100 is used in an inspection process performed after an assembly process (post-process), and has a function of automatically supplying a workpiece to be measured after assembly to a test system and automatically classifying and storing the workpiece based on a test result. . Further, the handler 100 may simply store the workpieces separated by cutting in a tray.

  As shown in FIG. 1, the handler 100 includes a controller 110 serving as a first control unit, a servo amplifier 120 serving as a second control unit configuring the network NW, that is, the network NW, a first drive unit 140, It has a lower controller 160 and a second drive unit 170 which are third control units. Here, FIG. 1 is a schematic block diagram showing a control system of the handler 100 according to the present invention. Note that the first drive unit 140 to be described later summarizes the drive units 140A and 140B.

  The controller 110 controls each part of the apparatus and performs various processes. The controller 110 has a master station 112, an image processing system 114, and an I / O circuit 124. The controller 110 refers to a control computer, and includes control devices such as a personal computer, FA personal computer, microcomputer, programmable controller, and sequencer. As the controller 110, a system to which option modules such as the master station 112, the image processing system 114, and the I / O circuit 124 can be added can be used.

  The master station 112 is an interface that is communicably connected to the network NW (that is, the servo amplifier 120 and the lower controller 160), and a serial bus is used for connection (serial connection). The image processing system 114 processes an image captured by the camera 146 of the second drive unit 170. In the embodiment described later with reference to FIG. 4, the controller 110 also controls a storage tray driving unit that drives a storage tray that stores workpieces.

  In the present embodiment, the controller 110 is connected to one or more servo amplifiers 120, one or more first drive units 140, a lower controller 160, and a second drive unit 170 via a network NW.

  The network NW is a transmission path for control signals from the controller 110 and information to the servo amplifier 120 and the lower-level controller 160. As will be described later, each connection is serially connected to facilitate wiring (that is, (The number of wiring is small).

  The servo amplifier 120 is controlled by the controller 110, and in the present embodiment, controls the first drive unit 140 in accordance with a control signal from the controller 110. That is, the servo amplifier 120 receives a control signal from the controller 110 and controls the first drive unit 140, and feeds back information related to the control from the first drive unit 140 to the controller 110. In other words, the servo amplifier 120 performs feedback control.

  One or more servo amplifiers 120 are configured in the network NW and are serially connected to each other. In addition, one first driving unit 140 is connected to one servo amplifier 120 and performs one-to-one control. Therefore, the servo amplifier 120 acquires information corresponding to the connected first drive unit 140 from the control signal from the controller 110 and controls the first drive unit 140.

  The servo amplifier 120 includes a slave station 121, a microcomputer 122, a drive circuit 123, and an I / O (input / output) circuit 124.

  The slave station 121 is an interface that is communicably connected to the master station 112 of the controller 110. As described above, a serial bus is used for connection. The servo amplifier 120 has an interface that is communicably connected to each other. Of course, it goes without saying that the servo amplifier 120 initially connected to the controller 110 also has an interface capable of communicating with other servo amplifiers 120.

  The microcomputer 122 controls each unit, performs various processes, and includes a processing unit such as a CPU or MPU whose name is not limited. The drive circuit 123 generates a power signal that drives the motor 142 and supplies the power signal to the motor 142. Feedback control is performed by returning the current value of the motor from the encoder to the drive circuit 123. The I / O circuit 124 of the servo amplifier 120 is an interface for an origin, an overrun signal, and the like, and an origin or overrun signal sensor 180 is wired as necessary. Similarly, an I / O circuit 124 such as an origin or an overrun signal may be provided on the controller 110 side as well.

  In the present embodiment, a drive unit that does not require relatively high speed control (real-time performance with respect to feedback control) is the first drive unit 140A, and a drive unit that requires high speed control is the first drive unit 140B. The second drive unit 170 is assumed. Specifically, a motor 142 such as an X-axis motor, a Y-axis motor, or a Z-axis motor used in the pickup mechanism 150 is used as the drive unit 140B, and the air valve 144, the camera 146, and the camera illumination 147 are used as the second drive unit. 170. However, a motor that does not require high-speed control is included in the first drive unit 140A, not the first drive unit 140B, but both the drive unit 140A and the drive unit 140B are connected to the same network, so The communication speed is the same.

  Here, with reference to FIG. 2, the functions of the first driving unit 140B and the second driving unit 170 will be described in more detail. Here, FIG. 2 is a schematic block diagram for explaining an arrangement example of the first drive unit 140 </ b> B and the second drive unit 170. In FIG. 2, a handler 100 picks up a workpiece W from an adhesive wafer sheet WS on which a workpiece W as a semiconductor device is mounted, and conveys the workpiece W to a predetermined position (for example, a test position or a storage position). The handler 100 further includes a pickup mechanism 150 as shown in FIG.

  The motor 142 is connected to the pickup mechanism 150 and moves the pickup mechanism 150. In the present embodiment, as shown in the first drive unit 140B in FIG. 1, three motors 142 (that is, an X-axis motor, a Y-axis motor, and a Z-axis motor) 142 are provided. 150 is moved three-dimensionally. The motor 142 is connected to the drive circuit 123 of the servo amplifier 120.

  The air valve 144 is connected between a suction pump (not shown) and the pickup mechanism 150 so as to be openable and closable, and is also connected to the I / O circuit 124 of the lower controller 160. As a result of opening and closing of the air valve 144, the inside of the main body (cylinder block) 152 of the pickup mechanism 150 is evacuated and the vacuum is released. If the air valve 144 is opened, the pickup mechanism 150 sucks the workpiece W, and if the air valve 144 is closed, the vacuum in the pickup mechanism 150 is released and released to atmospheric pressure. And separate.

  The camera 146 is installed above the wafer sheet WS, and is used to align the pickup mechanism 150 and the workpiece W when picking up the workpiece W or when the workpiece W is stored in the tray position. These are photographed in order to align with the workpiece. The camera 146 includes a CCD camera and the number and arrangement thereof are not limited. Various modes (momentary / alternate, 1 shot / designated shot / continuous) synchronized with the position and time, which are preset from the I / O circuit 124 of the lower controller 160 and processed in the lower controller 160 in advance. Shot, position / time), and the camera 146 captures an optimum image.

  The image acquired by the camera 146 is processed by the image processing system 114 of the controller 110. Based on the information processed by the image processing system 114, the positions of the pickup mechanism 150 and the wafer sheet WS are controlled by a motor 142 or an XYZ moving device (not shown) to pick up a specific workpiece W or not shown. The work W is stored in a specific position of the tray. In an embodiment described later with reference to FIG. 4, the controller 110 controls the tray position two-dimensionally based on information from the camera 146.

  The camera illumination 147 is preset according to a necessary image and processed in the lower controller 160 in various modes (momentary / alternate, one shot / designated shot / continuous shot, position / time) synchronized with the position and time. ) Is output from the I / O circuit 124, the optimal illumination for the camera 146 becomes possible.

  In FIG. 2, the pickup mechanism 150 is located above the workpiece W, picks up the workpiece W from the wafer sheet WS, and conveys the workpiece W to the test position or the storage position. In addition, the pickup mechanism 150 can transport the workpiece W that has been tested to a predetermined position on the storage tray, but the storage tray and the like are not shown.

  The pickup mechanism 150 has a suction part 154 at the bottom of its main body (or arm) 152, and the suction part 154 is formed with a suction hole for vacuum-sucking the upper surface of the workpiece W. Further, a suction hole is provided on the upper surface of the main body 152, and is connected directly or via a pipe or the like to an air valve 144 connected to a suction pump (not shown). As described above, when the air valve 144 is opened, the suction portion 154 sucks the upper surface of the work W, and when the air valve 144 is closed, the suction portion 154 is separated from the work W.

  The pickup mechanism 150 is connected to the motor 142 of the first drive unit 140B and can be moved three-dimensionally by the three motors 142. The present invention does not limit the number of motors 142 shown in FIG.

  Returning to FIG. 1, the lower-level controller 160 connects the servo amplifier 120 and the feedback signal of the first drive unit 140 </ b> B, and the series of the first drive unit 140 </ b> B to be performed at a predetermined position from the controller 110 to the lower-level controller 160 in advance. By giving a control signal for controlling the operation of the first drive unit 140B, the first drive unit 140B and the second drive unit 170 are controlled without using the controller 110 for feedback control of the first drive unit 140B. When the controller 110 controls the first driving unit 140B via one or more servo amplifiers 120 connected in series, the same scanning time is obtained on the same servo bus, and high-speed control as required by the first driving unit 140B ( Real-time feedback control cannot be realized. However, the feedback signal of the first drive unit 140B is connected to the lower controller 160, and control for controlling a series of operations that the first drive unit 140B should perform at a predetermined position from the controller 110 to the lower controller 160 in advance. By providing a signal, feedback control of the first drive unit 140B can be performed without using the controller 110, and the high speed required for the first drive unit 140B can be achieved. Control can be realized.

  By connecting the feedback signal of the first driving unit 140B in series to the servo amplifier 120 and the lower controller 160, the servo amplifier 120 and the lower controller 160 can share the control information of the first driving unit 140B almost simultaneously. ing. If this signal is not connected to the lower controller 160, when the lower controller 160 wants to obtain control information of the first drive unit 140B, it goes through the upper controller 110, and a scan time delay occurs, resulting in high-speed control. Is not desirable.

  FIG. 3 is a schematic block diagram showing an example of the internal configuration of the lower controller 160. The lower controller 160 includes a slave station 121, an I / O circuit 124, a memory 162, a detection unit 163, a processing unit (microcomputer) 164, and a timing generation circuit 165. Note that all or part of the memory 162, the detection unit 163, the processing unit 164, and the timing generation circuit 165 may be configured by a microcomputer.

  The slave station 121 is an interface that is communicably connected to the network NW. In this embodiment, the slave station 121 can communicate with the servo amplifier 120 and / or the controller 110.

  The memory 162 stores in advance control information related to the first driving unit 140B (for example, “when the first motor 142 moves to the first position, the second motor 142 moves to the second position”). To do. The memory 162 is configured to be able to communicate with the outside, and is configured to be able to change (programmable) control information regarding the first drive unit 140B. For example, the memory 162 is configured to be able to communicate with the controller 110 and the servo amplifier 120 via the slave station 121, and can receive control information regarding the first drive unit 140 </ b> B via the detection unit 163.

  The detection unit 163 connects the feedback signal of the first drive unit 140B, detects the operation information of the first drive unit 140B almost simultaneously with the servo amplifier 120, and sends the first drive unit to the processing unit 164 described later. 140B operation information is transmitted. In the present embodiment, the number of first drive units 140B from which the detection unit 163 can detect operation information is four as shown in FIG. 3, but this number is exemplary.

  The processing unit (microcomputer) 164 is connected to the memory 162 and the detection unit 163, and the control information related to the first drive unit 140B stored in the memory 162 and the operation information of the first drive unit 140B detected by the detection unit 163. The servo amplifier 120 connected to the first drive unit 140B to be driven next is connected to the operation command of the first drive unit 140B (for example, “the second motor 142 is set to the second position”). Move "). Communication between the processing unit 164 and the servo amplifier 120 is performed via the slave station 121 as described above.

  When the second drive unit 170 controlled by the lower controller 160 is the air valve 144, the camera 146, and the camera illumination 147, the I / O circuit 124 and the timing generation circuit 165 may be used. By setting control information (position, mode, etc.) in the memory 162, an event is generated at the specified position / time through the detection unit 163, and the signal of the specified mode is output from the timing generation circuit 165 to the I / O circuit 124. Can be output. In addition, the lower-level controller 160 can directly control the timing with the I / O circuit 124 of the servo amplifier 120.

  Hereinafter, the operation of the control system of the handler 100 will be described. First, when driving the first drive unit 140, the controller 110 controls information to be simultaneously operated by the plurality of first drive units 140 via the master station 112, for example, “first motor 142. Is moved to the first position "is sent to the network NW. Note that the controller 110 controls the network NW to control a series of operations that the plurality of first driving units 140 should perform at predetermined positions, for example, “the first motor 142 is the first motor 142 Note that if the first motor 142 moves to the first position, then the second motor 142 moves to the second position, etc. " Such description will be understood with reference to the following description.

  In the conventional configuration, the controller 110 transmits an operation command for moving the first motor 142 to the first position to the servo amplifier 120 connected to the first motor 142, and then the servo 110 The amplifier 120 drives the first motor 142 to the first position via the drive circuit 123. Subsequently, the servo amplifier 120 receives operation information indicating that the first motor 142 has reached the first position from the first motor 142, and transmits the information to the controller 110. Next, the controller 110 transmits an operation command for moving the second motor 142 to the second position to the servo amplifier 120 connected to the second motor 142. In response to this, the servo amplifier 120 drives the second motor 142 to the second position via the drive circuit 123. Subsequently, the servo amplifier 120 receives operation information indicating that the second motor 142 has reached the second position from the second motor 142 and transmits the information to the controller 110. Next, the controller 110 controls the I / O circuit 124 of the controller 110 to which the air valve 144 is connected to open an air valve 144 with an operation command for opening the air valve 144.

  As described above, in the conventional configuration, the servo amplifier 120 needs to feed back the information of the first and second motors 142 to the controller 110, and a plurality of servo amplifiers 120 are provided between the controller 110 and the first and second motors 142. Since the servo amplifier 120 was interposed, it took time to scan communications. In addition, when the information is fed back from the servo amplifier 120, the controller 110 must immediately calculate the control information of the second motor 142 and the air valve 144 in order to maintain the real-time property, which puts a load. The communication time when the controller 110 transmits the control information of the second motor 142 and the air valve 144 to the servo amplifier 120 also takes a long time because the plurality of servo amplifiers 120 are scanned.

  On the other hand, in the present embodiment, a control signal from the controller 110 is transmitted to a plurality of serially connected servo amplifiers 120 and lower-order controllers 160 via the network NW. When a control signal from the controller 110 flows through the network NW, the corresponding servo amplifier 120 acquires the control signal and supplies a corresponding operation command to the connected first driving unit 140 via the lower controller 160. To do. For example, the corresponding servo amplifier 120 generates a drive signal for moving the first motor 142 to the first position and supplies the drive signal to the first motor 142.

  In the first drive unit 140B, for example, the first motor 142 moves to the first position in accordance with an operation command from the servo amplifier 120 via the lower controller 160. The lower controller 160 detects the operation information of the first drive unit 140B, for example, detects operation information indicating that the first motor 142 has moved to the first position. The lower controller 160 has control information related to the first drive unit 140B (for example, “when the first motor 142 moves to the first position, the second motor 142 moves to the second position”). The first drive unit 140B is controlled according to the control information that has been set. Specifically, the lower controller 160 detects the operation information of the first driving unit 140B (for example, “the first motor 142 has moved to the first position”), and based on the preset control information Then, the servo amplifier 120 to which the first drive unit 140B to be driven next is connected generates an operation command for the first drive unit 140B (moves the second motor 142 to the second position), It supplies to the 1st drive part 140B. In other words, the lower controller 160 performs feedback control of the first drive unit 140B without using the controller 110. Therefore, when a series of operations is started by giving a command in advance, the controller 110 and the lower controller 160 are controlled independently, and the drive unit 140B and the drive unit 170 operate. This makes it possible to realize high-speed control (real-time feedback control) between the first drive unit 140B and the second drive unit 170.

  In addition, the I / O circuit 124 of the lower controller 160 receives various modes (momentary / alternate, one shot / designated shot / continuous shot, position / time) synchronized with the position and time according to a command from the upper controller 110. Signals can be output in a programmable manner, which is effective for output to air valves, cameras, and lighting.

  On the other hand, the controller 110 executes other processes in parallel while the lower controller 160 feedback-controls the first drive unit 140B and the second drive unit 170. Other processing includes, for example, feedback control of the first driving unit 140A, image processing, storage tray driving, and the like. As described above, the controller 110 can perform other processing by leaving the feedback control of the first driving unit 140B to the lower controller 160, and thus the handler 100 can efficiently perform various processes.

  Hereinafter, the processing of the handler 100 will be described with reference to FIG. Here, FIG. 4 is a schematic diagram illustrating an operation example of the driving unit 140 of the handler 100.

  As shown in FIG. 4, in this embodiment, the main body (arm) 152 of the pickup mechanism 150 performs the work of attracting the workpiece at point 1 and storing it in the tray at point 7. The work points include points 1 to 7, and the work contents at each point are as follows.

  That is, at point 1, the air valve 144 is opened to attract the workpiece, and then the main body 152 (hereinafter referred to as the arm Z axis) of the pickup mechanism 150 corresponding to the third (or Z axis) motor 142 is raised. I do. At point 2, the main body 152 (hereinafter referred to as the arm Y axis) of the pickup mechanism 150 corresponding to the second (or Y axis) motor 142 is activated. At point 3, when the arm Y axis passes point 3, it is checked whether the arm Z axis has been moved. If the movement has not been completed, the related axes are stopped with an error. At point 4, in synchronization with the set passing position, the camera 146 and camera illumination 147 are instructed to perform flash emission and image capture of the workpiece. At point 5, a command to lower the arm Z axis is issued. At point 6, the air valve 144 is commanded to close. At point 7, the arm Y axis and the arm Z axis are finally positioned and then returned to their original positions.

  First, the operations from points 1 to 7 are set in the lower controller 160. Next, the controller 110 instructs the servo motor 120 to start conveyance via the lower controller 160. As a result, at point 1, the lower controller 160 opens the air valve 144 via the I / O circuit 124, and then drives the third motor 142 via the lower controller 160. At point 2, the lower controller 160 detects that the driving of the third motor 142 is completed, and drives the second motor 142. At point 3, it is determined from the information from the second motor 142 that the arm Y axis has reached point 3, and the lower controller 160 determines whether or not the movement of the arm Z axis has been completed. At point 4, the lower controller 160 outputs a signal from the timing generation circuit 165 to execute flash emission and image capture. At point 5, the lower controller 160 drives the third motor 142. At point 6, the air valve 144 is closed via the I / O circuit 124 of the lower controller 160. At point 7, the lower controller 160 moves the second motor 142 to the position corrected by the image processing, moves the third motor to the set height, and then returns each motor to the initial position. .

  In this way, the lower controller 160 controls the driving of the second and third motors 142, so that the communication time to be fed back to the controller 110 can be eliminated, and the driving unit (first driving) that requires high-speed control. Real-time feedback control of the driving unit 140B and the second driving unit 170) can be realized.

  At point 4, the controller 110 receives an image captured by the camera 146 and the image processing system 114 performs image processing. Next, the controller 110 calculates the displacement amounts X and Y of the workpiece (and the rotation angle θ in some cases) by image processing. Since the controller 110 can perform image processing while the lower controller 160 drives the second and third motors 142, the processing of the handler 100 is efficient.

  Further, the controller 110 commands the movement of the storage tray XY based on the deviation amount. Since the controller 110 can drive the storage tray while the lower controller 160 drives the arm Z axis downward, the processing of the handler 100 is efficient.

  The preferred embodiments of the present invention have been described above, but the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the gist. For example, in this embodiment, a handler is used as an example of a semiconductor manufacturing apparatus. However, the present invention can be applied to other semiconductor manufacturing apparatuses.

It is a schematic block diagram which shows the control system of the semiconductor manufacturing apparatus (handler) of this invention. It is a schematic block diagram which shows the example of the drive part of the handler shown in FIG. It is a schematic block diagram which shows an example of the internal structure of the counter of the handler shown in FIG. It is the schematic which shows the operation example of the drive part of the handler shown in FIG.

Explanation of symbols

100 handler (semiconductor manufacturing equipment)
110 controller 112 master station 114 image processing system 120 servo amplifier 121 slave station 122 microcomputer 123 drive circuit 124 I / O (input / output) circuit 140 first drive unit 140A first drive unit (low speed unit)
140B 1st drive part (high speed part)
142 Motor 144 Air valve 146 Camera 147 Camera illumination 150 Pickup mechanism 152 Main body (or arm)
154 Adsorption unit 160 Lower controller 162 Memory 163 Detection unit 164 Processing unit (microcomputer)
165 Timing generation circuit 170 Second drive unit 180 Sensor NW network

Claims (1)

In a semiconductor manufacturing apparatus equipped with a pickup mechanism for picking up and transporting a workpiece,
A plurality of motors including a first motor and a second motor used in the pickup mechanism;
A servo amplifier for driving each of the plurality of motors;
A host controller that is serially connected to the servo amplifier and controls the servo amplifier to drive the plurality of motors;
An air valve for adsorbing or separating the workpiece;
A camera that images the state of the workpiece;
A lower controller for controlling the air valve and the camera based on the position of the second motor,
The lower controller controls the opening / closing timing of the air valve and the imaging timing of the camera based on the position of the second motor, and the upper controller performs image processing on an image captured by the camera. 2. A semiconductor manufacturing apparatus, comprising: calculating a displacement amount of the workpiece, correcting positions of the plurality of motors based on the displacement amount, and operating the pickup mechanism.