JP4505583B2 - Substrate-less double-sided adhesive tape used for die-cutting - Google Patents
Substrate-less double-sided adhesive tape used for die-cutting Download PDFInfo
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- JP4505583B2 JP4505583B2 JP2005178823A JP2005178823A JP4505583B2 JP 4505583 B2 JP4505583 B2 JP 4505583B2 JP 2005178823 A JP2005178823 A JP 2005178823A JP 2005178823 A JP2005178823 A JP 2005178823A JP 4505583 B2 JP4505583 B2 JP 4505583B2
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- sensitive adhesive
- pressure
- adhesive tape
- die
- double
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- 238000005520 cutting process Methods 0.000 title claims description 21
- 239000002390 adhesive tape Substances 0.000 title description 12
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 92
- 239000010410 layer Substances 0.000 claims description 58
- 239000002245 particle Substances 0.000 claims description 44
- 239000011521 glass Substances 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 description 26
- 230000001070 adhesive effect Effects 0.000 description 26
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- 238000004519 manufacturing process Methods 0.000 description 8
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- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
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- 239000004593 Epoxy Substances 0.000 description 1
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- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
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- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910002808 Si–O–Si Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- RJDOZRNNYVAULJ-UHFFFAOYSA-L [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] RJDOZRNNYVAULJ-UHFFFAOYSA-L 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
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- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- HPTYUNKZVDYXLP-UHFFFAOYSA-N aluminum;trihydroxy(trihydroxysilyloxy)silane;hydrate Chemical compound O.[Al].[Al].O[Si](O)(O)O[Si](O)(O)O HPTYUNKZVDYXLP-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
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- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
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- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
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- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
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- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
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- 239000004973 liquid crystal related substance Substances 0.000 description 1
- XCOBTUNSZUJCDH-UHFFFAOYSA-B lithium magnesium sodium silicate Chemical compound [Li+].[Li+].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Na+].[Na+].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3 XCOBTUNSZUJCDH-UHFFFAOYSA-B 0.000 description 1
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
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- 239000004926 polymethyl methacrylate Substances 0.000 description 1
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- 229920001155 polypropylene Polymers 0.000 description 1
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- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
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Images
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
本発明は、剥離シート上に剥離可能な粘着剤層を有する基材レス両面粘着テープおよび基材レス両面粘着シートに関する。テープは、シートに比べ幅の狭いものを呼ぶもので、以下では、両者に機能上の差異はないものとして説明する。 The present invention relates to a base material-less double-sided pressure-sensitive adhesive tape having a peelable pressure-sensitive adhesive layer on a release sheet and a base material-less double-sided pressure-sensitive adhesive sheet. The tape is referred to as having a narrower width than the sheet, and the following description will be made assuming that there is no functional difference between the two.
従来から、あらゆる分野において対向する2枚の平面部材を貼り合わせる場合に、取り扱い性、作業性、貼り合わせ接着性等に優れていることから、基材の両面に粘着剤が塗布された両面粘着テープが広く用いられる。特に近年においては、LCD等のパソコン表示部、携帯電話等の携帯情報端末の表示部、その他の液晶パネル、有機ELパネル、PDPパネル等のパネル型又はフラットパネル型表示装置等の表示部に、また、電話器、複写機、ファクシミリ、プリンター及び広告・情報表示プレート等に設けられる表示部には、タッチパネルを含めて各種の対向光学部材が設けられ、これらをフレームに貼り合わせ接着させるために透明な両面粘着テープが用いられている。
Conventionally, when two flat members facing each other in any field are bonded together, it is excellent in handleability, workability, bonding adhesiveness, etc., so double-sided adhesive with adhesive applied on both sides of the substrate Tape is widely used. In particular, in recent years, in display units of personal computer display units such as LCDs, display units of portable information terminals such as mobile phones, other liquid crystal panels, panel types such as organic EL panels, PDP panels, or flat panel type display devices, In addition, various counter optical members, including a touch panel, are provided on the display units provided in telephones, copiers, facsimiles, printers, advertisement / information display plates, etc., and these are transparent to bond and bond them to the frame. Double-sided adhesive tape is used.
また、携帯電話、デジタルカメラ等の小型電子機器の内部には、極小の電子部品が組み込まれている。これらの電子部品の固定や薄層銘板の固定、発砲シートの固定に両面粘着テープが用いられている。 In addition, extremely small electronic components are incorporated in small electronic devices such as mobile phones and digital cameras. Double-sided adhesive tape is used for fixing these electronic components, thin-layer nameplates, and fired sheets.
粘着剤層は、貼り合せ後に粘着剤がにじみでないように薄膜であることが望まれている。軽量・小型・薄型化の方向にある小型電子機器では、さらに粘着剤層の薄膜化が要求されている。このような要求から基材レスの粘着剤層のみからなる基材レス両面粘着テープが提案されている。 The pressure-sensitive adhesive layer is desired to be a thin film so that the pressure-sensitive adhesive does not bleed after bonding. Small electronic devices that are becoming lighter, smaller, and thinner are required to have a thinner adhesive layer. From such a demand, a base material-less double-sided pressure-sensitive adhesive tape consisting only of a base material-less pressure-sensitive adhesive layer has been proposed.
例えば、特許文献1特開平7−41736には、アクリル系共重合体を主成分とする粘着剤層からなる基材レス両面粘着テープが開示されている。 For example, Japanese Patent Application Laid-Open No. 7-41736 discloses a substrate-less double-sided pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer containing an acrylic copolymer as a main component.
しかしながら、上記基材レス両面粘着テープには、下記に示すような問題があった。
(1) 基材レスの両面粘着テープは、ブロッキングを生じ易いため、タックを高くすることができない。
(2) 基材がないと、粘着剤の保持が不十
分となる場合があり、被着体に基材レス両面粘着テープを貼り合せして、ダイカットする時に粘着剤が断裁刃に引きずり出されるという問題がある。また、保管中に粘着剤層のはみ出しが生じることもある。このように粘着剤がはみ出すと、粘着テープを巻き戻すときにブロッキングが生じ使用不能となる。このバリは、電子部品の接着のように精密性が要求される場合に特に問題となる。即ち、バリの存在により接着された電子部品が浮き上がり、製品に不良を来すという問題が生じる。
However, the base material-less double-sided adhesive tape has the following problems.
(1) Since the double-sided pressure-sensitive adhesive tape without a substrate is likely to cause blocking, the tack cannot be increased.
(2) If there is no base material, the adhesive may not be sufficiently retained, and the adhesive is dragged out to the cutting blade when the base material-less double-sided adhesive tape is bonded to the adherend and die-cut. There is a problem. In addition, the adhesive layer may protrude during storage. When the pressure-sensitive adhesive protrudes in this way, blocking occurs when the pressure-sensitive adhesive tape is rewound, and it becomes unusable. This burr becomes a problem particularly when precision is required such as adhesion of electronic parts. That is, there is a problem that the bonded electronic component is lifted due to the presence of burrs, and the product is defective.
これらの問題の解決のために特許文献2では、粘着剤層が3層型の基材レス両面粘着テープが提供された。この3層の内の真ん中の中間層は、伸び性のある樹脂層である。
(特許文献2では、この樹脂層を基材と称している。)この樹脂層の表面と裏面に第1粘着剤層、第2粘着剤層を設けたものである。この中間層は、切れ性がよいので前記(2)の断裁刃による粘着剤が引きずり出される等の問題は解消された。しかし、粘着剤層の薄膜を進めていくと、タック性能を左右する第1、第2粘着剤層の厚みが1層型の基材レス両面粘着テープに比べ、極端に薄くなりタック性能が低下する問題があった。タック性能を維持するために、この3層型の総厚みの下限値は、30μmにとどまっていた。実際に、この3層型の基材レス両面粘着テープは、特許文献2の出願人が製造、販売しているが、粘着剤層の総厚みの最小品は、品番200A―30である。この品の粘着剤層の総厚みは、30μmである。また、1層型に比べ、製造工程が複雑である、製造時間が長い、製造ロスが多い等によって、コストが大幅にアップするものであった。
In order to solve these problems,
(In
本発明は、粘着剤層の薄膜化を進めたとしても、タック性能の低下がなく、ダイカットする際の粘着剤の引きずりがなく、且つ製造コストが上がらない基材レス両面粘着テープを提供することを課題とする。 The present invention provides a substrate-less double-sided pressure-sensitive adhesive tape that does not cause a decrease in tack performance, does not drag the pressure-sensitive adhesive when die-cut, and does not increase the manufacturing cost even if the pressure-sensitive adhesive layer is made thinner. Is an issue.
本発明者は基材レス両面粘着テープの粘着剤層について鋭意研究した結果、粘着剤層中に鱗片状粒子を適量配合にすることにより、粘着剤層の薄膜化を進めたとしても、被着体に対する初期粘着力(タック性能)は低下しなく、ダイカットする際の粘着剤の引きずりもないことを見出し、本発明を完成するに至った。 As a result of earnest research on the pressure-sensitive adhesive layer of the substrate-less double-sided pressure-sensitive adhesive tape, the present inventor is able to adhere even if the pressure-sensitive adhesive layer is made thin by blending an appropriate amount of scaly particles in the pressure-sensitive adhesive layer. It was found that the initial adhesive strength (tack performance) to the body did not decrease and there was no drag of the adhesive when die-cutting, and the present invention was completed.
すなわち、本発明はつぎの基材レス両面粘着テープを提供する。
(1)剥離シートに粘着剤層を有する基材レス両面粘着テープにおいて、前記粘着剤層に厚さが1〜15μm、かつ粒子の平均長さおよび平均幅が40〜400μmで、平均幅と平均長さの比が1:1〜3である鱗片状ガラス粒子0.5〜5重量%を含有することを特徴とする基材レス両面粘着テープ。
(2)鱗片状粒子のモース硬度が4.5以上である前記(1)項記載の基材レス両面粘着テープ。
That is, the present invention provides the following substrate-less double-sided pressure-sensitive adhesive tape.
(1) In a base-less double-sided pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer on a release sheet, the pressure-sensitive adhesive layer has a thickness of 1 to 15 μm, and an average particle length and average width of 40 to 400 μm. A baseless double-sided pressure-sensitive adhesive tape comprising 0.5 to 5% by weight of scaly glass particles having a length ratio of 1: 1 to 3 .
(2) The substrate-less double-sided pressure-sensitive adhesive tape according to item (1), wherein the scale-like particles have a Mohs hardness of 4.5 or more.
本発明の基材レス両面粘着テープは、粘着剤層の薄膜化を進めたとしても、被着体へのタック性能の低下がなく、ダイカットする際の粘着剤の引きずりがないものである。 The base-less double-sided pressure-sensitive adhesive tape of the present invention does not cause a decrease in the tack performance on the adherend even if the pressure-sensitive adhesive layer is made thinner, and does not drag the pressure-sensitive adhesive when die-cutting.
本発明の基材レス両面粘着テープにおける剥離シートの支持体として、有機高分子フィルム支持体および紙支持体が好ましく使用される。有機高分子フィルム支持体としては、ポリエステルフィルム、ポリカーボネートフィルム、ポリメチルメタクリレートフィルム、ポリプロピレンフィルム、ポリイミドフィルムなど種々のフィルム支持体が使用可能であるが、コストおよび性能面からポリエステルフィルムが好ましい。また、フィルム支持体の厚みは、ダイカット性およびコスト面から20〜100μmの範囲が好ましい。また、紙支持体としては、グラシン紙のような高密度紙、およびクレーコート紙、クラフト紙や上質紙などにポリエチレンなどの樹脂フィルムをラミネートしたラミネート紙などの使用が可能であるが、コストおよび性能面からグラシン紙の使用が好ましい。紙支持体の厚さは20〜100μmの範囲が好ましい。 An organic polymer film support and a paper support are preferably used as the support for the release sheet in the substrate-less double-sided pressure-sensitive adhesive tape of the present invention. As the organic polymer film support, various film supports such as a polyester film, a polycarbonate film, a polymethyl methacrylate film, a polypropylene film, and a polyimide film can be used, but a polyester film is preferable from the viewpoint of cost and performance. Moreover, the thickness of a film support body has the preferable range of 20-100 micrometers from die cut property and a cost surface. In addition, as the paper support, high-density paper such as glassine paper, laminated paper in which a resin film such as polyethylene is laminated on clay-coated paper, kraft paper, or high-quality paper can be used. From the viewpoint of performance, glassine paper is preferred. The thickness of the paper support is preferably in the range of 20 to 100 μm.
なお、これらの支持体は、支持体両面の表面上にシリコーン化合物、フッ素樹脂、フルオロシリコーン樹脂などの離型剤を塗布することにより、両面が剥離性を有する剥離シートとなる。支持体の両面の剥離力は、剥離力の軽い面と剥離力の重い面に、差別化する必要がある。差別化の方法は、剥離剤の厚みの差や剥離剤の品種の違いによる方法がある。 In addition, these support bodies turn into a release sheet in which both surfaces have peelability by apply | coating release agents, such as a silicone compound, a fluororesin, and a fluorosilicone resin, on the surface of both surfaces of a support body. The peeling force on both sides of the support needs to be differentiated into a surface having a light peeling force and a surface having a heavy peeling force. As a differentiation method, there is a method based on a difference in the thickness of the release agent or a difference in the type of the release agent.
本発明の基材レス両面粘着テープにおける粘着剤層の形成に使用する粘着剤組成物は、特に限定されず、一般的な粘着剤組成物が使用可能であるが、アクリル系共重合体と架橋剤を必須成分とし、必要により、粘着付与樹脂を配合したものが好適に使用できる。 The pressure-sensitive adhesive composition used for forming the pressure-sensitive adhesive layer in the substrate-less double-sided pressure-sensitive adhesive tape of the present invention is not particularly limited, and a general pressure-sensitive adhesive composition can be used. An agent is an essential component, and if necessary, a compound containing a tackifier resin can be suitably used.
前記アクリル系共重合体としては、アルキル基の炭素数が4〜18である(メタ)アクリル酸アルキルエステルの1種または2種以上と他の共重合可能なエチレン性不飽和結合を有するモノマーの1種または2種以上との共重合体が挙げられる。 As the acrylic copolymer, one or more of (meth) acrylic acid alkyl ester having 4 to 18 carbon atoms in the alkyl group and another monomer having an ethylenically unsaturated bond that can be copolymerized are used. A copolymer with 1 type (s) or 2 or more types is mentioned.
前記(メタ)アクリル酸アルキルエステルとしては、例えば、n−ブチル(メタ)アクリレート、イソブチル(メタ)アクリレート、ヘキシル(メタ)アクリレート、2−エチルヘキシル(メタ)アクリレート、n−オクチル(メタ)アクリレート、イソオクチル(メタ)アクリレート、イソノニル(メタ)アクリレート、ラウリル(メタ)アクリレート、ステアリル(メタ)アクリレートなどが挙げられる。 Examples of the (meth) acrylic acid alkyl ester include n-butyl (meth) acrylate, isobutyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, and isooctyl. (Meth) acrylate, isononyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate and the like can be mentioned.
前記共重合可能なエチレン性不飽和結合を有するモノマーとしては、例えば、アクリロニトリル、メチル(メタ)アクリレート、エチル(メタ)アクリレート、プロピル(メタ)アクリレート、イソプロピル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、スチレン、α―メチルスチレン、酢酸ビニル、N−ビニル−2−ピロリドン、ベンジル(メタ)アクリレート、2−ヒドロキシエチル(メタ)アクリレート、2−ヒドロキシプロピル(メタ)アクリレート、アクリル酸、メタアクリル酸、イタコン酸、フマル酸などが挙げられる。前記アクリル系共重合体の製造においては、共重合可能なエチレン性不飽和結合を有するモノマーとして、後記架橋剤と反応しうる官能基を有するモノマー(たとえばカルボキシル基を有するモノマー)を必須成分として使用する。 Examples of the monomer having a copolymerizable ethylenically unsaturated bond include acrylonitrile, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, cyclohexyl (meth) acrylate, Styrene, α-methylstyrene, vinyl acetate, N-vinyl-2-pyrrolidone, benzyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, acrylic acid, methacrylic acid, itacon An acid, fumaric acid, etc. are mentioned. In the production of the acrylic copolymer, a monomer having a functional group capable of reacting with a crosslinking agent described later (for example, a monomer having a carboxyl group) is used as an essential component as a monomer having a copolymerizable ethylenically unsaturated bond. To do.
粘着付与樹脂としては、ロジン、ロジンフェノール樹脂、およびそれらのエステル化合物、金属塩などのロジン系樹脂や、テルペン重合体、テルペンフェノール樹脂、芳香族変性テルペン樹脂などのテルペン系樹脂、スチレン系樹脂、クマロン・インデン樹脂、アルキルフェノール樹脂、キシレン樹脂、C5系石油樹脂、C9系石油樹脂、脂環族水添系樹脂などが挙げられるが、アクリル系共重合体に対する相溶性に優れ、かつ、アクリル系共重合体に配合して用いると、紙や各種フィルムなどの被着体に対して良好な接着性、初期タック性を呈する天然樹脂系のロジン系樹脂やテルペン系樹脂が好ましく使用される。 As tackifying resins, rosin, rosin phenol resins, and rosin resins such as ester compounds and metal salts thereof, terpene polymers, terpene phenol resins, terpene resins such as aromatic modified terpene resins, styrene resins, Coumarone-indene resin, alkylphenol resin, xylene resin, C5 petroleum resin, C9 petroleum resin, alicyclic hydrogenated resin, etc. are mentioned. When used by blending with a polymer, natural resin-based rosin resins and terpene resins exhibiting good adhesion and initial tackiness to adherends such as paper and various films are preferably used.
また、本発明における粘着剤組成物において、アクリル系共重合体を架橋させるために使用する架橋剤としては、例えば、ヘキサメチレンジイソシアネート、キシリレンジイソシアネート、トリレンジイソシアネート、2−クロロ−1,4−フェニルジイソシアネート、トリメチルヘキサメチレンジイソシアネート、1,5−ナフタレンジイソシアネート、イソホロンジイソシアネートなどのジイソシアネート化合物、これらジイソシアネート化合物のビウレット型三量化物、イソシアヌレート型三量化物、トリイソシアネートなどのイソシアネート系架橋剤、エポキシ系架橋剤、メラミン系架橋剤、金属キレート系架橋剤、トリメチロールプロパンなどのポリオールのアダクト体などが挙げられ、適宜選択して使用することができる。 In the pressure-sensitive adhesive composition of the present invention, examples of the crosslinking agent used for crosslinking the acrylic copolymer include hexamethylene diisocyanate, xylylene diisocyanate, tolylene diisocyanate, 2-chloro-1,4- Diisocyanate compounds such as phenyl diisocyanate, trimethylhexamethylene diisocyanate, 1,5-naphthalene diisocyanate, isophorone diisocyanate, biuret-type trimers of these diisocyanate compounds, isocyanurate-type trimers, isocyanate-based crosslinking agents such as triisocyanate, epoxy-based Examples thereof include a cross-linking agent, a melamine-based cross-linking agent, a metal chelate-based cross-linking agent, and an adduct of a polyol such as trimethylol propane, which can be appropriately selected and used.
前記粘着剤組成物中には、ダイカット性を向上させるため鱗片状粒子を添加する。鱗片状粒子の厚さは、1〜15μmであるのが好ましい。厚さが前記範囲未満であるとダイカット性が劣り、前記範囲を超えると接着力が低下する。また、鱗片状粒子の平均長さおよび平均幅はダイカット性を考慮し40〜400μmであるのが好ましい。平均長さおよび平均幅が、前記範囲未満であるとダイカット性が劣り、前記範囲を超えると感熱接着層の塗工適正が悪くなり均一に塗工できなくなる。さらにダイカット性を考慮して、鱗片状粒子の平均幅と平均長さの比は1:1〜3であるのが好ましい。ここで、鱗片状粒子の平均長さおよび平均幅が40〜400μmであるとは、鱗片状粒子の平均長さおよび平均幅のいずれもが40〜400μmの範囲にあることをいう。また鱗片状粒子の長さおよび幅は、粒子の扁平面の最も長い辺を長さとし、その最も長い辺に対する垂直方向の高さを幅とする。さらに粒子の硬さは、ダイカット性を考慮し、モース硬度4.5以上が好ましい。モース硬度が4.5未満であるとダイカット性が劣ってくる。 In the pressure-sensitive adhesive composition, scaly particles are added to improve the die-cutting property. The thickness of the scaly particles is preferably 1 to 15 μm. When the thickness is less than the above range, the die-cutting property is inferior, and when it exceeds the above range, the adhesive strength is lowered. In addition, the average length and average width of the scaly particles are preferably 40 to 400 μm in consideration of die cutting properties. When the average length and the average width are less than the above range, the die-cutting property is inferior. When the average length and the average width are above the above range, the heat-sensitive adhesive layer is not properly applied and cannot be uniformly applied. Further, considering the die-cutting property, the ratio of the average width to the average length of the scaly particles is preferably 1: 1 to 3. Here, the average length and the average width of the scaly particles means that both the average length and the average width of the scaly particles are in the range of 40 to 400 μm. The length and width of the scaly particles are the longest side of the flat surface of the particle, and the height in the direction perpendicular to the longest side is the width. Furthermore, the hardness of the particles is preferably a Mohs hardness of 4.5 or more in consideration of die cutability. When the Mohs hardness is less than 4.5, the die-cutting property is inferior.
鱗片状粒子としては、鱗片状ガラス粒子、鱗片状雲母、鱗片状合成雲母、焼成雲母、
マジカナイト、カネマイト、モンモリロナイト、サポナイト、ラポナイト、ヘクトライト、バーキュムライト、カオリナイト、ハロイサイト、カネマイト、マカタイト、アイラアイト、アガディアイト、ケニヤアイト、セリサイト、焼成セリサイト、ベントナイト、ゾノトライト、スメクタイト、バモライト、鱗片状黒鉛、窒化ホウ素、シリカーX、シリカーYなどが挙げられる。シリカーX、シリカーYとしては、特開2001−163613に記載された鱗片状シリカが例示される。また、金属粉を鱗片状に加工した粒子があり、材料としては、金、銀、アルミニウム、銅、真鍮、クロム,錫、鉛、インジウム等が挙げられる。
As flaky particles, flaky glass particles, flaky mica, flaky synthetic mica, calcined mica,
Magicite, kanemite, montmorillonite, saponite, laponite, hectorite, barcumulite, kaolinite, halloysite, kanemite, macatite, iraite, agadiaite, kenyanite, sericite, calcined sericite, bentonite, zonotrite, smectite, vamorite, scaly graphite , Boron nitride, silica-X, silica-Y and the like. Examples of silica-X and silica-Y include flaky silica described in JP-A No. 2001-163613. In addition, there are particles obtained by processing metal powder into a scale shape, and examples of the material include gold, silver, aluminum, copper, brass, chromium, tin, lead, indium and the like.
必要に応じて、鱗片状粒子を表面処理したものを使用できる。表面処理方法としては、例えば弱アルカリで粒子表面のSi−O−Si結合を加水分解したもの、またはテトラエトキシシランなどのカップリング剤で表面処理したものが例示できる。
弱アルカリとしては、アンモニア、トリエタノールアミン等が例示しうるが、これに限定されるものではない。望ましい反応pH域としてはpH13〜9、特にpH11〜9が好ましい。
As needed, what surface-treated the scaly particle | grains can be used. Examples of the surface treatment method include those obtained by hydrolyzing Si—O—Si bonds on the particle surface with a weak alkali, or those obtained by surface treatment with a coupling agent such as tetraethoxysilane.
Examples of the weak alkali include ammonia and triethanolamine, but are not limited thereto. A desirable reaction pH range is pH 13 to 9, particularly pH 11 to 9.
鱗片状粒子の中でも、サイズを自在に加工でき、且つ低コスト、透明性を有する鱗片状ガラス粒子が特に好ましい。鱗片状ガラス粒子は、モース硬度が4.5以上であるので、ダイカット性にも優れている。一般には、鱗片状ガラス粒子はガラスフレークと呼ばれている。 Among the scaly particles, scaly glass particles that can be processed freely in size, and have low cost and transparency are particularly preferable. Since the scale-like glass particles have a Mohs hardness of 4.5 or more, they are also excellent in die cutting properties. Generally, scaly glass particles are called glass flakes.
前記燐片状粒子の配合量は、粘着剤層のタック性、ダイカット性および粒子分散性の点から、粘着剤層全量(固形分換算による粘着剤組成物全量)中に0.5〜5重量%であるのが好ましい。 The amount of the scaly particles is 0.5 to 5 wt% in the total amount of the pressure-sensitive adhesive layer (the total amount of the pressure-sensitive adhesive composition in terms of solid content) from the viewpoint of tackiness, die-cutting properties and particle dispersibility of the pressure-sensitive adhesive layer. % Is preferred.
前記粘着剤組成物中には、接着力、タック性、ダイカット性などを阻害しない範囲で無機または有機着色剤を添加し、接着層を着色してもよい。 In the pressure-sensitive adhesive composition, an inorganic or organic colorant may be added within a range that does not impair adhesive strength, tackiness, die-cutting properties, etc., and the adhesive layer may be colored.
前記粘着剤層の厚さは、被着体に対する接着力、保持力やダイカット性を考慮して、5〜100μmの範囲が好ましく、より好ましくは5〜40μmの範囲である。特に薄膜化を進める場合は、5〜25μmの範囲とする。粘着剤層の形成は、前記粘着剤組成物を、例えばバーコーター、ロールコーター、グラビアコーター、ナイフコーター、ダイコーター、コンマコーター、リップコーターなどを使用して塗布することにより行なうことができる。 The thickness of the pressure-sensitive adhesive layer is preferably in the range of 5 to 100 μm, more preferably in the range of 5 to 40 μm, in consideration of the adhesive force to the adherend, the holding power, and the die cutting property. In particular, when the film thickness is reduced, the range is 5 to 25 μm. The pressure-sensitive adhesive layer can be formed by applying the pressure-sensitive adhesive composition using, for example, a bar coater, roll coater, gravure coater, knife coater, die coater, comma coater, lip coater or the like.
本発明の基材レス両面粘着テープの粘着剤層は、2層型の粘着剤層であってもよい。例えば、2つの被着体の材質がアクリル樹脂とゴムとの異なる材質であった場合、1層型の粘着剤層で粘着剤にアクリル系粘着剤層を用いると被着体のアクリル樹脂には接着力が満足するが、ゴムに対しては、接着力が満足できないものとなる。このよう場合に、2層型の粘着剤層として、一方の粘着剤層にアクリル系粘着剤を使用し、他方の粘着剤層にゴム系粘着剤するとよい。被着体のアクリル樹脂には、アクリル系粘着剤層を、ゴムには、ゴム系粘着剤層を面して貼り合せるといずれの被着体にも接着力が満足する。2つの層にそれぞれ鱗片状粒子を含有するのが、好ましいが、1つの層のみに含有させても、本発明の効果を得ることができる。 The pressure-sensitive adhesive layer of the substrate-less double-sided pressure-sensitive adhesive tape of the present invention may be a two-layer type pressure-sensitive adhesive layer. For example, if the materials of the two adherends are different materials of acrylic resin and rubber, if an acrylic adhesive layer is used for the adhesive in a one-layer type adhesive layer, Adhesive strength is satisfactory, but for rubber, the adhesive strength is not satisfactory. In such a case, as the two-layered pressure-sensitive adhesive layer, an acrylic pressure-sensitive adhesive may be used for one pressure-sensitive adhesive layer, and a rubber-based pressure-sensitive adhesive may be used for the other pressure-sensitive adhesive layer. Adhesive strength is satisfied for any of the adherends when the acrylic pressure-sensitive adhesive layer is bonded to the acrylic resin of the adherend and the rubber-type pressure-sensitive adhesive layer is bonded to the rubber. It is preferable that each of the two layers contains scaly particles, but the effect of the present invention can be obtained even if contained in only one layer.
また、特許文献2に記載された3層型の基材レス両面粘着テープにおける第1粘着剤層、中間層、第2粘着剤層の少なくとも1層に、鱗片状粒子を含有させても本発明の効果を得ることができる。
Further, the present invention can be applied even if scale-like particles are contained in at least one of the first pressure-sensitive adhesive layer, the intermediate layer, and the second pressure-sensitive adhesive layer in the three-layer baseless double-sided pressure-sensitive adhesive tape described in
以上の説明では、1つの剥離シートを用いて基材レス両面粘着テープとしたが、軽剥離シートと重剥離シートの2つの剥離シートを用意して、本発明の粘着剤層の両面にそれぞれの剥離シートを挟んで基材レス両面粘着テープとしてもよい。 In the above description, a single release sheet was used as a baseless double-sided pressure-sensitive adhesive tape, but two release sheets, a light release sheet and a heavy release sheet, were prepared, and each side of the pressure-sensitive adhesive layer of the present invention was prepared on each side. It is good also as a base-material-less double-sided adhesive tape on both sides of a peeling sheet.
つぎに、本発明を実施例に基づいてさらに詳しく説明するが、本発明はこれらに限定されるものではない。なお、以下において、部とあるのは重量部を意味し、また塗工量、部数、混合割合などは全て固形分換算で表した。 Next, the present invention will be described in more detail based on examples, but the present invention is not limited thereto. In the following, “parts” means parts by weight, and the coating amount, the number of parts, the mixing ratio, etc. are all expressed in terms of solid content.
実施例1
(剥離シートの製造)
厚さ50μmのポリエステルフィルムの片面に、シリコーン剥離剤(信越化学工業(株)製「KS−3601」)93部、架橋剤(信越化学工業(株)製「cat.PL−50T」)5部およびシリカ粉末(日本シリカ工業(株)製「ニップシールE220A」)2部の混合物を、乾燥重量が0.4g/m2となるようグラビアコーターで塗工し、熱風乾燥して重剥離層を形成し、ついでポリエステルフィルムのもう一方の面にシリコーン剥離剤(信越化学工業(株)製「KS−3650」)95部および架橋剤(信越化学工業(株)製「cat.PL−50T」)5部の混合物を、乾燥重量が0.4g/m2となるようグラビアコーターで塗工し、熱風乾燥して軽剥離層を形成して、剥離シートを得た。
Example 1
(Manufacture of release sheet)
On one side of a 50 μm thick polyester film, 93 parts of a silicone release agent (“KS-3601” manufactured by Shin-Etsu Chemical Co., Ltd.) and 5 parts of a crosslinking agent (“cat.PL-50T” manufactured by Shin-Etsu Chemical Co., Ltd.) And a mixture of 2 parts of silica powder (“Nippal E220A” manufactured by Nippon Silica Kogyo Co., Ltd.) are coated with a gravure coater so that the dry weight is 0.4 g / m 2 and dried with hot air to form a heavy release layer. Then, on the other side of the polyester film, 95 parts of a silicone release agent (“KS-3650” manufactured by Shin-Etsu Chemical Co., Ltd.) and a crosslinking agent (“cat.PL-50T” manufactured by Shin-Etsu Chemical Co., Ltd.) 5 Part of the mixture was coated with a gravure coater so that the dry weight was 0.4 g / m 2 and dried with hot air to form a light release layer to obtain a release sheet.
(粘着剤組成物の製造)
まずアクリル系粘着剤(綜研化学(株)製「SKダイン801B」、アクリル系共重合体と粘着付与樹脂を含有している)98部と架橋剤(綜研化学(株)製「硬化剤L−45」)2部を混合してベースとなるアクリル系粘着剤組成物を得た。このベース粘着剤組成物95部に対して、鱗片状ガラス粒子(モース硬度:6.5、厚さ:5μm、平均長さ:150μm、平均幅:100μm)5部を混合して最終的な粘着剤組成物を得た。
鱗片状粒子の厚さ、長さ、幅は金属顕微鏡で粒子を観察して求めた。平均長さおよび平均幅は任意に選んだ50個の粒子についての平均値として求めた(以下、同様)。
(Manufacture of adhesive composition)
First, 98 parts of an acrylic adhesive (“SK Dyne 801B” manufactured by Soken Chemical Co., Ltd., containing an acrylic copolymer and a tackifier resin) and a crosslinking agent (“Curing Agent L-” manufactured by Soken Chemical Co., Ltd.) 45 ") 2 parts were mixed to obtain a base acrylic pressure-sensitive adhesive composition. The final pressure-sensitive adhesive is obtained by mixing 5 parts of scaly glass particles (Mohs hardness: 6.5, thickness: 5 μm, average length: 150 μm, average width: 100 μm) with 95 parts of this base adhesive composition. An agent composition was obtained.
The thickness, length, and width of the scaly particles were determined by observing the particles with a metal microscope. The average length and average width were determined as average values for 50 particles arbitrarily selected (hereinafter the same).
(基材レス両面粘着テープの製造)
前記粘着剤組成物を前記剥離シートの軽剥離層上に20μm(乾燥時)の厚さになるようコンマコーターにて塗布し、100℃で3分乾燥したのち重剥離層側と貼り合わせるようにしてロール状に巻き取り、さらに同ロールを25mm幅にスリットすることで基材レス両面粘着テープを得た。
(Manufacture of double-sided adhesive tape with no substrate)
The pressure-sensitive adhesive composition is applied onto the light release layer of the release sheet with a comma coater so as to have a thickness of 20 μm (when dried), dried at 100 ° C. for 3 minutes, and then bonded to the heavy release layer side. Then, it was wound up into a roll shape and further slitted into a width of 25 mm to obtain a substrate-less double-sided pressure-sensitive adhesive tape.
実施例2
実施例1におけるベース粘着剤組成物99.5部に対し、鱗片状ガラス粒子(モース硬度:6.5、厚さ:5μm、平均長さ:150μm、平均幅:100μm)0.5部を混合した以外は、実施例1と同様にして基材レス両面粘着テープを得た。
Example 2
0.5 parts of scaly glass particles (Mohs hardness: 6.5, thickness: 5 μm, average length: 150 μm, average width: 100 μm) are mixed with 99.5 parts of the base pressure-sensitive adhesive composition in Example 1. A substrate-less double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 1 except that.
実施例3
実施例1におけるベース粘着剤組成物97部に対し、鱗片状ガラス粒子(モース硬度:6.5、厚さ:4μm,平均長さ:300μm、平均幅:250μm)3部を混合した以外は、実施例1と同様にして基材レス両面粘着テープを得た。
Example 3
Except for mixing 3 parts of scaly glass particles (Mohs hardness: 6.5, thickness: 4 μm, average length: 300 μm, average width: 250 μm) to 97 parts of the base pressure-sensitive adhesive composition in Example 1, A substrate-less double-sided pressure-sensitive adhesive tape was obtained in the same manner as Example 1.
参考例4
実施例1におけるベース粘着剤組成物97部に対し、鱗片状雲母(モース硬度:3、厚さ:2μm,平均長さ:50μm、平均幅:35μm)3部を混合した以外は、実施例1と同様にして基材レス両面粘着テープを得た。
Reference example 4
Example 1 except that 3 parts of scaly mica (Mohs hardness: 3, thickness: 2 μm, average length: 50 μm, average width: 35 μm) were mixed with 97 parts of the base adhesive composition in Example 1. In the same manner, a baseless double-sided pressure-sensitive adhesive tape was obtained.
参考例5
実施例1におけるベース粘着剤組成物95部に対し、鱗片状ガラス粒子(モース硬度:6.5、厚さ:5μm,平均長さ:15μm、平均幅:10μm)5部を混合した以外は、実施例1と同様にして基材レス両面粘着テープを得た。
Reference Example 5
Except for mixing 5 parts of scaly glass particles (Mohs hardness: 6.5, thickness: 5 μm, average length: 15 μm, average width: 10 μm) to 95 parts of the base pressure-sensitive adhesive composition in Example 1, A substrate-less double-sided pressure-sensitive adhesive tape was obtained in the same manner as Example 1.
比較例1
実施例1におけるベース粘着剤組成物97部に対し、粒状フッ素樹脂粒子(平均粒径:3.5μm)3部を混合した以外は、実施例1と同様にして基材レス両面粘着テープを得た。
Comparative Example 1
A base-less double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 1 except that 97 parts of the base pressure-sensitive adhesive composition in Example 1 was mixed with 3 parts of granular fluororesin particles (average particle size: 3.5 μm). It was.
比較例2
実施例1におけるベース粘着剤組成物97部に対し、粒状ポリエチレン粒子(平均粒径:20μm)3部を混合した以外は、実施例1と同様にして基材レス両面粘着テープを得た。
Comparative Example 2
A base-less double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 1 except that 97 parts of the base pressure-sensitive adhesive composition in Example 1 was mixed with 3 parts of granular polyethylene particles (average particle size: 20 μm).
比較例3
実施例1におけるベース粘着剤組成物97部に対し、球状シリコーン粒子(平均粒径:12μm)3部を混合した以外は、実施例1と同様にして基材レス両面粘着テープを得た。
Comparative Example 3
A baseless double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 1 except that 97 parts of the base pressure-sensitive adhesive composition in Example 1 was mixed with 3 parts of spherical silicone particles (average particle size: 12 μm).
比較例4
実施例1におけるベース粘着剤組成物97部に対し、針状ガラス粒子(モース硬度:6.5、直径:10μm、平均長さ:70μm)3部を混合した以外は、実施例1と同様にして基材レス両面粘着テープを得た。
Comparative Example 4
Except that 97 parts of the base pressure-sensitive adhesive composition in Example 1 were mixed with 3 parts of acicular glass particles (Mohs hardness: 6.5, diameter: 10 μm, average length: 70 μm), the same as in Example 1 Thus, a baseless double-sided adhesive tape was obtained.
比較例5
実施例1におけるベース粘着剤組成物のみで、粘着剤層を構成した以外は、実施例1
と同様にして基材レス両面粘着テープを得た。
Comparative Example 5
Example 1 except that the pressure-sensitive adhesive layer was constituted only by the base pressure-sensitive adhesive composition in Example 1.
In the same manner, a baseless double-sided pressure-sensitive adhesive tape was obtained.
(物性の測定)
前記で得られた各基材レス両面粘着テープを20℃・65%RHの恒温恒湿室中で7日間養生した後、初期粘着力、ダイカット性を測定した。結果を表1に示す。
(Measurement of physical properties)
Each substrate-less double-sided pressure-sensitive adhesive tape obtained above was cured for 7 days in a constant temperature and humidity chamber at 20 ° C. and 65% RH, and then the initial adhesive strength and die-cut property were measured. The results are shown in Table 1.
各物性の測定は次の条件にて行なった。
(1)初期粘着力(タック力)
JIS Z0237に準じて、SUS304鋼板に試験片を貼り合わせ、20分後の1
80°剥離強度を測定した。引張速度は300mm/minで行なった。表1に示す初期粘着力(gf/25mm)の値は試験片10個についての平均値である。初期粘着力(gf/25mm)の判定はつぎの基準にしたがって行なった。
◎:1,000gf/25mm以上;極めて良好
○:800gf/25mm以上、1,000gf/25mm未満;良好
△:650gf/25mm以上、800gf/25mm未満;やや劣る
×:650gf/25mm未満;劣る
Each physical property was measured under the following conditions.
(1) Initial adhesive strength (tack force)
In accordance with JIS Z0237, a test piece was bonded to a SUS304 steel plate and 1 after 20 minutes.
The 80 ° peel strength was measured. The tensile speed was 300 mm / min. The value of the initial adhesive strength (gf / 25 mm) shown in Table 1 is an average value for 10 test pieces. The initial adhesive strength (gf / 25 mm) was determined according to the following criteria.
A: 1,000 gf / 25 mm or more; Extremely good B: 800 gf / 25 mm or more, less than 1,000 gf / 25 mm; Good Δ: 650 gf / 25 mm or more, less than 800 gf / 25 mm; Slightly inferior x: Less than 650 gf / 25 mm;
(2)ダイカット性
ダイカット性:基材レス両面粘着テープの剥離シートを安全カミソリの刃先で二つに
切り離すよう切り込みを入れ、両側から水平に引き離した際の粘着剤の糸引き状態を観察した。
なお、評価は以下の基準に基づいて行った。
◎:切り口がきれいに離れた
○:切り口のごく一部に粘着剤の糸引きがあった
△:切り口の一部に粘着剤の糸引きがあった
×:切り口のかなりの部分に粘着剤の糸引きがあった
××:切り口の全面に粘着剤の糸引きがあった
(2) Die-cutting property Die-cutting property: A sheet was cut so that the release sheet of the baseless double-sided adhesive tape was separated into two parts with a safety razor blade, and the threading state of the adhesive was observed when it was pulled horizontally from both sides.
Evaluation was performed based on the following criteria.
◎: The cut edge was cleanly separated. ○: Adhesive threading was found on a very small part of the cut. △: Adhesive threading was found on a part of the cut. X: Adhesive thread was present on a considerable part of the cut. XX: There was adhesive stringing across the entire cut surface
1 鱗片状粒子
2 粘着剤層
3 重剥離層
4 支持体A
5 軽剥離層
6 支持体B
1 Scaled
5 Light release layer 6 Support B
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JP2002194306A (en) * | 2000-12-26 | 2002-07-10 | Sekisui Chem Co Ltd | Heat-conductive sheet |
JP2003113353A (en) * | 2001-10-01 | 2003-04-18 | General Kk | Transfer tape |
JP2004256701A (en) * | 2003-02-26 | 2004-09-16 | Toppan Forms Co Ltd | Wear-resistant pressure-sensitive adhesive composition and wear-resistant sheet for information support |
JP2004331806A (en) * | 2003-05-07 | 2004-11-25 | Bando Chem Ind Ltd | Colored adhesive and sheet with colored adhesive |
WO2004104129A1 (en) * | 2003-05-22 | 2004-12-02 | Zeon Corporation | Thermally conductive pressure-sensitive adhesive composition, thermally conductive sheet-like moldings, and process for the production of the moldings |
JP2005044524A (en) * | 2003-07-22 | 2005-02-17 | Sumitomo Bakelite Co Ltd | Conductive adhesive film and semiconductor device using this |
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