JP4500752B2 - Observation / inspection work support system and observation / inspection condition setting method - Google Patents

Description

  The present invention relates to the appearance confirmation of products and parts being manufactured, and in particular, an observation / inspection apparatus for detecting foreign matter, pattern defects, and hole defects on the surface of semiconductor wafers, photomasks, magnetic disks, liquid crystal substrates, etc. The present invention relates to an observation / inspection work support system and an observation / inspection condition setting method that improve the efficiency of the work for determining inspection conditions.

  In a semiconductor manufacturing process, foreign matters, pattern defects, and hole defects generated on the wafer surface on which semiconductor devices are formed cause product defects. For this reason, in the semiconductor manufacturing process, in order to improve the yield of semiconductor devices as products, it is very important to detect foreign matter, pattern defects, and hole defects generated on the wafer surface.

  Therefore, in the semiconductor manufacturing process, an observation / inspection apparatus for observing / inspecting a wafer on which a semiconductor device is formed is installed, and foreign matter, pattern defects, hole defects (hereinafter referred to as appearance defects or simply defects) generated on the wafer surface. It is necessary to constantly monitor whether there is a problem in the manufacturing apparatus and the manufacturing environment. Further, it is necessary to confirm whether or not the appearance defect has a fatal influence on the product by observing the shape of the appearance defect generated on the wafer surface by the observation / inspection apparatus.

  In the inspection of the appearance defect occurring on the surface of the wafer on which the semiconductor device is formed, various optical techniques for detecting the appearance defect have been proposed as the defect becomes finer.

  For example, Japanese Patent Application Laid-Open No. 7-128595 (Patent Document 1) and Japanese Patent Application Laid-Open No. 2000-155099 (Patent Document 2) show a defect inspection method using a defect emphasis method using a polarizing plate.

  By the way, conventionally, even in an observation / inspection apparatus to which a defect inspection method based on a defect emphasis method using this polarizing plate is applied, it is easy to set a detection condition for an appearance defect to be detected in a short time. It was something that could be done. That is, the detection conditions are often set only by setting one kind of detection condition for the wafer to be observed / inspected, and it does not take much time.

  Therefore, in the prior art, an example of setting an optical condition as an observation / inspection condition on an observation / inspection apparatus will be described as an example. First, an inspection / inspection apparatus repeats inspection work several times while repeating trial and error, and a wafer Clarify where the defect exists on the surface. Then, a detection device such as a scanning electron microscope (SEM) is used to confirm which detection defect is important. In addition, the optical conditions are adjusted so that more important defects can be detected.

  For example, in Patent Document 2 described above, as shown in [FIG. 8] of Patent Document 2, a parameter range for obtaining a preliminary image for an optical parameter including polarization characteristics is input, and this parameter range is input. Images are acquired under the above conditions and displayed so that diffraction images and pattern images can be listed, and the sum of secondary differential values indicating the contrast of the pattern and the sharpness of the pattern is displayed. By making it possible to list information relating to image resolution, it is possible to easily determine an appropriate value of an optical parameter as a condition for detecting an appearance defect.

JP 7-128595 A JP 2000-155099 A

  However, recently, with the further miniaturization of cutting-edge semiconductor devices, the ability and performance to detect various types of foreign matter, pattern defects and hole defects in the pattern on the device surface can be observed / inspected. There is a need for equipment.

  Therefore, in the observation / inspection apparatus to which the defect inspection method using the defect enhancement method using the polarizing plate described above is applied, a plurality of optical parameters are set as detection conditions for each appearance defect to be detected. Even if the pattern is repeatedly inspected with each optical parameter or when the pattern is inspected with one optical parameter as the detection condition, much more preliminary is required to determine the detection condition. It has become necessary to set conditions after carrying out various inspection operations and examining the detection results of each preliminary inspection operation.

  And, the adjustment of the polarizing plate for setting the optical parameters is usually done manually by manual operation, but in the case of the most advanced semiconductor devices, the amount of combination of conditions is enormous and each of multiple types of defects at multiple locations. The work of acquiring, arranging, and attaching images while adjusting the polarizing plate requires a great amount of work because of the enormous amount of work such as the trouble of image acquisition.

  As described above, with further pattern miniaturization of cutting-edge semiconductor devices, the optimum observation / inspection conditions for the detection of multiple types of defects that affect the yield often differ. When one observation / inspection condition must be set, optimization work to determine the common observation / inspection condition optimal for detecting multiple types of defects takes a lot of time, and observation / inspection takes a short time. Determining conditions is becoming increasingly difficult.

  The present invention has been made in view of such problems, and for the operation of determining the observation / inspection conditions in the observation / inspection apparatus that has come to require a great deal of effort with the miniaturization of semiconductor devices. Changes in observation / inspection images that change due to changes in the observation / inspection condition settings can be saved and reproduced as a movie, and observation / inspection can be easily obtained as information for setting observation / inspection condition conditions. An object is to provide a work support system and an observation / inspection condition setting method.

  Therefore, in the present invention, in order to solve the above-described problems, it is related to the result of inspecting a wafer as a sample by an observation / inspection apparatus. Check and define whether or not there is.

  The optical image of the place is captured by the light receiving system means of the observation / inspection device, for example, a review CCD (Charge Coupled Devices), and the starting direction and the ending direction of rotating the polarizing plate are determined, and the image is changed by rotating with a pulse motor. The state to be performed is stored as a moving image in a storage device such as an HDD or a DVD as image storage means.

  This operation is repeated as an important defect at a plurality of locations. Since the rotation of the polarizing plate takes only a few seconds or less, the moving image acquisition time ends in only a few minutes or less, depending on the number of moving images acquired.

  Multiple moving images are arranged on the screen, and the moving image is played at the same playback speed as the rotation speed of the polarizing plate, or any playback speed before and after it, and the highest contrast is obtained at the defective part. Find the condition.

  In addition, a moving image is cut out for each frame corresponding to the rotation position of the polarizing plate, and the optimum conditions are similarly determined by arranging the images.

  As a result, information for easily determining the optimum observation / inspection conditions in the shortest time can be easily obtained, and anyone can easily determine the optimum inspection / observation conditions.

For this purpose, the observation / inspection work support system according to the present invention receives irradiation system means for irradiating a sample with a light beam, and reflected light and scattered light generated from the sample irradiated with the light beam, and receives the received reflection. a light receiving system means for outputting a detection signal corresponding to the light or scattered light, a polarizing plate provided on the optical axis of the light receiving system means, by rotating the polarizing plate, the polarizing plate rotation to rotate the polarization direction of the polarizing plate And observation / inspection conditions for observing / inspecting the appearance defect of the sample based on the detection signal output from the light receiving system means according to the rotation position of the polarizing plate by the operation of the polarizing plate rotation means An observation / inspection work support system for determining the image, the image generation means for generating observation / inspection image data of the sample based on the detection signal output from the light receiving system means, and the observation of the sample generated by the image generation means / Inspection The image storage means for storing image data and the polarizing plate rotating means are controlled so that the polarizing plate rotates within a predetermined rotation range set in advance, and the polarizing plate rotation means rotates the polarizing plate within the predetermined rotation range. The observation / inspection image data of the sample generated and output from the image generation means is stored in correspondence with the amount of rotation of the polarizing plate or the polarization direction of the polarizing plate based on the amount of rotation of the polarizing plate. Observation / inspection image storage control means for storing a moving image in the means, and observation / inspection image reproduction means for reproducing and outputting the observation / inspection image data of the sample stored in the image storage means by the observation / inspection image storage control means. It is characterized by.

The observation / inspection work support method of the present invention also includes an irradiation step of irradiating the sample with a light beam by the irradiation system means, and receiving reflected light and scattered light generated from the sample irradiated with the light beam by the light receiving system means. , the light receiving step of outputting the received light detection signal corresponding to reflected light and scattered light was, the polarizing plate provided on the optical axis of the light receiving system means and rotating a polarizing plate rotating to rotate the polarization direction of the polarizing plate An observation / inspection condition for observing / inspecting the appearance defect of the sample based on the detection signal output from the light receiving system means according to the rotation position of the polarizing plate in the polarizing plate rotation step. An inspection condition setting method, an image generating step for generating observation / inspection image data of a sample based on a detection signal output from a light receiving system means in a light receiving step, and the predetermined rotation range of the polarizing plate in a polarizing plate rotating step In times The observation / inspection image data of the sample generated and output in the image generation process is stored in correspondence with the amount of rotation of the polarizing plate or the polarization direction of the polarizing plate based on the amount of rotation of the polarizing plate. An observation / inspection image storage step for storing a moving image in the means, and an observation / inspection image reproduction step for reproducing and outputting the observation / inspection image data of the sample stored in the image storage means in the observation / inspection image storage step as a moving image. And

  According to the present invention, after clarifying the location of an important defect through repeated inspection and review operations, a moving image is acquired on the inspection apparatus while changing the optical conditions such as the polarization direction of the polarizing plate and reproduced. By doing so, it will become difficult as design rules evolve to provide clues to the conditions that provide the highest contrast in the defect area, and thus dramatically reduce the time required to optimize the inspection conditions. It has a tremendous effect on the determination of defect detection conditions.

  Hereinafter, an observation / inspection work support system and an observation / inspection condition setting method according to an embodiment of the present invention will be described with reference to the drawings, taking as an example a case where it is applied to a semiconductor manufacturing line.

  FIG. 1 is an overall configuration diagram of a defect confirmation line system including a defect confirmation work support system according to an embodiment of the present invention.

  As shown in FIG. 1, the semiconductor manufacturing process 11 is normally provided in a clean room 10 in which a clean environment is maintained. In the clean room 10, an appearance inspection device 20, a review device 30, and a probe inspection device 40 are installed. The appearance inspection apparatus 20 detects a defective portion of a product wafer, which is a sample, such as a pattern defect, a hole defect, and a foreign object. The review device 30 observes (ie, reviews) the size, shape, texture (surface pattern), etc. of the defect portion in order to specify the generation process of the defect portion based on the defect information from the appearance inspection device 20. Do. When inspecting the characteristics of each chip on the product wafer, the probe inspection apparatus 40 assumes a use state after commercialization and performs a probe inspection in a temperature atmosphere corresponding to this, and determines whether the product is non-defective / defective. Sort out.

  The appearance inspection apparatus 20, the review apparatus 30, and the probe inspection apparatus 40 are connected to a data processing apparatus 50 installed outside the clean room 10 via a communication line 60.

  The data processing device 50 provides processing information necessary for the appearance inspection processing, the review processing, and the probe inspection processing to the appearance inspection device 20, the review device 30, and the probe inspection device 40, respectively. In response to the provision of the inspection result information from 20, 30, 40, the quality control of the product wafer manufactured in the semiconductor manufacturing process 11 is performed.

  Product wafers flow through the semiconductor manufacturing process 11 in lot units. In the appearance inspection by the appearance inspection apparatus 20, after the processing of the process in which the appearance inspection is determined in advance is completed, the product wafer is transported to the appearance inspection apparatus 20 for each lot by the operator or the transfer machine, and the product wafer is processed. This is done for all numbers.

  The appearance inspection apparatus 20 inspects the position and size of the defective portion of the product wafer, and acquires a defect ID (Identification) indicating identification of the defective portion and coordinate data of the defective portion on the product wafer. Further, the appearance inspection apparatus 20 also acquires an enlarged image of a defective portion, that is, an ADR image, by an attached ADR (Auto Defect Review).

  The wafer whose appearance inspection has been completed by the appearance inspection apparatus 20 is sent to the review apparatus 30 in order to observe in detail the size, shape, texture (surface pattern), etc., of the defective portion detected by the appearance inspection apparatus 20. A part of the wafer is taken out from the lot as a sample, and the review by the review device 30 is performed.

  Next, information transmitted between each of the devices 20 and 30 and the data processing device 50 at the time of the appearance inspection performed by the appearance inspection device 20 and the review performed by the review device 30 is based on FIG. I will explain.

  FIG. 2 is an explanatory diagram of a transmission sequence of information transmitted between the appearance inspection device, the review device, and the data processing device.

  As shown in FIG. 2, the review device 30 includes an optical review device 31 and an SEM review device 32. The optical review device 31 reviews the detailed size, shape, texture (surface pattern), and the like of the defective portion. For example, the SEM review device 32 detects electrical defects such as a contact defect in a hole process, a disconnection in a wiring process, and a short circuit that cannot be detected by the optical review apparatus 31.

  When the review is performed by the review device 30 (31, 32), the review device 30 uses the information on the product wafer to be reviewed, specifically, the product to be reviewed using the lot number, wafer number, and inspection process as key information. The defect information D3a (D31a, D32a) about the wafer is acquired from the data processing device 50.

  Here, the defect information D3 (D31a, D32a) acquired by the review apparatus 30 (31, 32) from the data processing apparatus 50 is acquired by the appearance inspection by the appearance inspection apparatus 20, and the data processing apparatus 50 via the communication line 60. Is generated based on the defect information D2 of the wafer in which the defective portion exists. The defect information D3a (D31a, D32a) acquired by the review device 30 from the data processing device 50 includes a defect ID (Identification) indicating identification of the defective portion (defect portion) and coordinate data on the wafer of the defective portion. In addition to the above, an ADR image of the above-described defective portion is also included.

  Here, since the defect information D2 of the wafer output from the appearance inspection apparatus 20 is usually enormous data, the defect information D2 is provided in the data processing apparatus 50 after being supplied to the data processing apparatus 50. The defect information D3 (D31a, D32a) to be supplied to each of the optical review device 31 and the SEM review device 32 is extracted by being filtered by the plurality of filter functions. A storage device (not shown) of the data processing apparatus 50 stores defect information D3 (D31a, D32a) extracted by filtering in correspondence with key information such as a lot number, a wafer number, and an inspection process.

  Therefore, when the data processing device 50 receives a supply request for defect information D3 (D31a, D32a) using the key information as an index from the review device 30 (31, 32), for example, it is stored in a storage device (not shown). The defect information D3 (D31a, D32a) of the corresponding product wafer is supplied to the review device 30 (31, 32).

  Based on the defect information D31a and D32a supplied from the data processing device 50, the optical review device 31 and the SEM review device 32 as the review device 30 perform detailed observation of the defective portion in the product wafer of the sample, When the defective part is an important defective part, image data of the important defective part is acquired. At the same time, the optical review device 31 and the SEM review device 32 acquire image data of important defect portions obtained by ADC (Automatic Defect Classification automatic defect classification function) mounted on each of them in order to improve analysis efficiency. Are automatically classified into categories according to their characteristics, and defect classification of important defect portions is performed.

  The image data of the critical defect portion and the defect classification information acquired by the review device 30 (31, 32), respectively, are sent to the data processing device 50 through the communication line 60 as ADR / ADC information D3b (D31b, D32b). Sent.

  By the way, in the manufacturing / inspection of the product wafer described above, the inspection conditions are usually optimized by the operator in the appearance inspection apparatus 20 for the product wafer of the type or process that is first inspected by the appearance inspection apparatus 20. This optimization is performed by checking whether or not a defect important for yield improvement in the semiconductor manufacturing process 11 has been detected by using a review device 30 by an operator. Thereafter, the wafer is returned from the review device 30 to the appearance inspection device 20 together with information on what kind of important defect confirmed by the review device 30 was present on the coordinates of the wafer.

  Next, an observation / inspection condition setting method for optimizing the inspection condition for an important defect whose existence has been clarified by this review will be described with reference to FIG.

  FIG. 3 is a flowchart of an optical condition setting method using the defect confirmation work support system according to the embodiment of the present invention.

  First, a product wafer 1 of the kind and process to be inspected for the first time is extracted from the rod and loaded into the appearance inspection apparatus 20, and after wafer alignment (step S11 in FIG. 3), certain arbitrary conditions are obtained. Thus, an appearance inspection of the surface of the wafer 1 is performed by the appearance inspection apparatus 20 (step S12).

  At this time, the defect information D2 (see FIG. 2) of the wafer including the ADR image output from the appearance inspection apparatus 20 is supplied to the data processing apparatus 50 via the communication line 60.

  In the data processing device 50, the defect information D2 of the wafer 1 supplied from the appearance inspection device 20 is processed using a plurality of filter functions, and the map 2 of the defective portion 72 of the wafer 1 shown in step S12 or the defective portion 72 is displayed. Information including each defect ID and coordinate data on the wafer is acquired, and the information is stored in a storage device (not shown) as an inspection file relating to defect information D2 supplied from the appearance inspection apparatus 20 for the wafer 1. To do.

  Here, in the map 2 of the wafer 1 shown in step S12, each of the plurality of rectangular portions 71 appearing on the surface of the wafer 1 indicates a die as a chip on which semiconductor devices are respectively formed. The granular portion 72 in the die 71 indicates a defective portion detected by the appearance inspection apparatus 20. Reference numeral 73 denotes an orientation flat mark that defines the coordinate axis direction on the wafer 1 during wafer alignment.

In addition, the wafer 1 of the type or process to be inspected for the first time after the appearance inspection by the appearance inspection apparatus 20 is completed is transferred from the appearance inspection apparatus 20 to the SEM type review apparatus 32 and from the data processing apparatus 50 to step S12. information examination file, such as coordinate data on the wafer map 2 or defect portion 72 of the wafer 1 which is illustrated, is supplied as defect information D32A (see FIG. 2) via the communication line 60 to the SEM review apparatus 32.

  The SEM review device 32 observes all or an arbitrary number of defective portions 72 of the wafer 1 detected by the visual inspection by the visual inspection device 20 based on the defect information D32d supplied from the data processing device 50. Then, it is identified whether there is an important defect portion, and if there is an important defect portion, which of the defect portions 72 is identified (step S13).

In addition, when the confirmation of the critical defect portion of the wafer 1 by the SEM review device 32 is completed, the data about the critical defect portion of the wafer 1 identified by the SEM review device 32 is ADR / ADC information D32b (FIG. 2), the data is supplied from the SEM review device 32 to the data processing device 50. The ADR / ADC information D32b is stored by the data processing device 50 in the inspection file relating to the wafer 1 of the storage device.

  Then, the wafer 1 is loaded into the optical review device 31, and the optical review device 31 indicates a defect indicating the identification of the important defect portion identified by the SEM review device 32 from the corresponding inspection file of the data processing device 50. It is important to align the wafer 1 and supply the defect information D31a (see FIG. 2) such as the ID and the coordinate data on the wafer of the critical defect portion, the ADR image of the important defect portion obtained at the time of inspection by the visual inspection apparatus 20 An optical image of the defective portion is observed (step S14).

  Here, the configuration of an embodiment of the optical review device 31 will be described with reference to FIG.

FIG. 4 is a configuration diagram of an embodiment of the optical review device.
In FIG. 4, the light 82 ′ emitted from the light source 81 is collected through a lens 83 and transmitted through a polarizing plate 84. The light transmitted through the polarizing plate 84 becomes linearly polarized light, and the light transmitted through the half mirror 85 becomes illumination light 82. The illumination light 82 transmitted through the half mirror 85 illuminates the wafer 1 placed on the sample stage 87 movable via the objective lens 86 by epi-illumination. Of the light 88 ′ reflected and diffracted by the wafer 1, the light 88 in the NA (Numerical Aperture) of the objective lens 86 is captured again by the objective lens 86, reflected by the half mirror 85, and guided to the detection optical path. The detection light 88 passes through the polarization plane of the polarizing plate (SR plate) 89 and forms an image of the wafer 1 on the image sensor (photoelectric conversion means) 91 via the imaging lens 90. The image sensor 91 receives light that has passed through the polarizing plate 89 out of the light collected by the lens 83 and generates an electric signal output corresponding to the intensity of the light. The electrical signal output of the image sensor 91 is supplied to an A / D converter 92, and is analog / digital converted by the A / D converter 92 and supplied to a computer 100 described later.

In addition, the polarizing plate 89 that passes only light of a specific polarization component out of the scattered light collected by the lens 83 is rotated about the optical axis by the polarizing plate rotation driving means 93 formed of, for example, a pulse motor. It is configured to be possible. As a result, according to the surface state of the wafer 1, the polarizing plate rotation driving means 93 is appropriately driven by the number of pulses to arbitrarily adjust the rotational position (polarization direction) of the polarizing plate 89 to detect foreign matter or pattern defects. The S / N ratio of this signal is prevented from decreasing, and the surface scattered light of the wafer 1 caused by foreign matter or pattern defects can be detected effectively. In the case of the present embodiment, the polarizing plate rotation driving means 93 composed of this pulse motor also serves as a polarizing plate rotation position detecting means for detecting the rotation position of the polarizing plate 89 based on the number of driving pulses.
The A / D converter 92 and the polarizing plate rotation driving means 93 are connected to a computer 100 as a component of the optical review device 31.

  The computer 100 includes an input operation means 103 such as a keyboard 101 and a mouse 102, a display device 104, a communication interface 105 for performing data transmission with the data processing device 50 shown in FIGS. And a recording device 106 configured by an HDD or the like and also functioning as image data storage means and reference image storage means.

  In addition, the computer 100 detects a defect indicating the identification of an important defect identified by the SEM review device 32 from the data processing device 50 shown in FIG. 2 that is connected to the communication interface 105 via the communication line 60. The recording device 106 receives the ID, the coordinate data on the wafer of the critical defect portion, and the defect information D31a (see FIG. 2) such as the ADR image of the critical defect portion obtained at the time of inspection by the appearance inspection apparatus 20. To do.

  In addition, the computer 100 generates a GUI (Graphical User Interface) operation screen of the optical review apparatus 31 using the window system, and based on the operation of the input operation means 103 on the GUI operation screen, the optical review is performed. It has a control function for controlling each part of the device 31.

  The computer 100 also outputs a digitized electrical signal output supplied from the image sensor 91 via the A / D converter 92 as an image processing unit based on the operation of the input operation unit 103 on the GUI operation screen. Image processing is performed to generate image data of an optical image of the wafer surface, and the generated image data is stored and managed in the recording device 106, and display control of the image data stored and managed in the recording device 106 is performed. In this case, the recording device 106 corresponds to image storage means.

  Further, when the computer 100 acquires an optical image of the wafer surface by the image sensor 91 based on the operation of the input operation unit 103 on the GUI operation screen, the computer 100 controls the polarizing plate rotation driving unit 93 to drive the polarizing plate 89. The optical axis is rotated as a central axis, and polarization control of the polarizing plate 89 is performed.

  Further, the computer 100 has a defect analysis function for comparing and contrasting the image data stored and managed in the recording device 106 with the reference image data stored in the recording device 106 and analyzing the appearance defect portion of the wafer 1. Have.

  Furthermore, the computer 100 also has an automatic defect classification function (ADC) that classifies defects of important defect portions of the wafer 1 detected by the defect analysis function or the like.

  In the optical review apparatus 31 configured as described above, the computer 100 controls and drives the polarizing plate rotation driving unit 93 as the polarizing plate rotation driving control unit based on the operation of the input operation unit 103 on the GUI operation screen. While the polarizing plate 89 is being rotated about its optical axis, the computer 100 is digitized as image processing means supplied from the image sensor 91 via the A / D converter 92. The wafer is changed according to the change in the rotation direction of the polarizing plate by sequentially processing the electrical signal output and generating image data of the optical image of the wafer surface as needed and continuously storing and managing it in the recording device 106. The moving image data of the optical image on the surface can be acquired.

  Hereinafter, in the description of the present specification, the digitized electrical signal output supplied from the image sensor 91 via the A / D converter 92 while the polarizing plate 89 is rotating in the optical review device 31. The image data of the optical image of the wafer surface is generated at any time by image processing sequentially, and the image data continuously stored and managed in the recording device 106 is referred to as moving image data.

  Next, an observation / inspection condition setting method for an important defect portion by the optical review device 31 in the observation / inspection work support system of the present embodiment described in step S14 of FIG. 3 will be described in detail.

  FIG. 5 is a diagram showing a moving image acquisition screen depending on the polarization condition of the important defect portion by the optical review device.

  The moving image acquisition screen 200 is obtained from the data processing device 50 at the time of inspection by the defect inspection ID 20 indicating the identification of the important defect portion identified by the SEM review device 32, coordinate data on the wafer of the important defect portion, and the appearance inspection device 20. The defect information D31a (see FIG. 2) such as an ADR image of the important defect portion is supplied by the computer 100 of the optical review device 31 and displayed on the display device 104.

  The moving image acquisition screen 200 includes an inspection map unit 210, a defect list unit 220, a moving image display unit 230, a moving image recording / playback operation unit 240, a recording / playback range setting display unit 260, and a signal level display unit 260. And an illumination operation unit 270.

  The inspection map unit 210 displays the coordinates of the location of the important defect identified by the SEM review device 32 in correspondence with the wafer as in the case of the map 2 shown in step S12 of FIG.

  The defect list unit 220 uses, as an index, the defect ID indicating the identification of the individual important defect part identified by the SEM type review device 32, the coordinate data on the wafer, the size, etc. of the important defect part corresponding to this defect ID. Information is displayed in a list format.

  The moving image display unit 230 displays a moving image of the optical image of the sample 1 captured by the image sensor 91 of the optical review device 31.

  The moving image recording / reproducing operation unit 240 displays individual operation units 241 for rewinding, stopping, reproducing, fast-forwarding, and recording, and can perform recording / reproducing operations for moving images.

  In the configuration of the optical review device 31 shown in FIG. 4, the recording / reproducing range setting display unit 250 displays the rotation amount or rotation amount range of the polarizing plate, or the polarization direction of the polarizing plate based on the rotation amount of the polarizing plate. It has a range display unit 251 for setting a change range and a progress status display unit 252 for displaying the progress status of recording / playback of moving images.

Signal level display unit 260 displays the change in status of the X-axis direction on the screen coordinate system for the image of the imaged object area portion, Y-axis direction of the gray level (brightness level).

  The illumination operation unit 270 displays the brightness of the entire image displayed on the moving image display unit 230 and the signal level display unit 260.

  In the determination operation of the observation / inspection condition, the observation / inspection condition of the corresponding part on the wafer identified as an important defect by the review by the SEM review device 32 in a state where the above-described moving image acquisition screen 200 is displayed on the display device 104. Is determined as follows.

  Place the mouse cursor on the corresponding critical defect number (defect ID) on the die 71 or the corresponding defective part 72 or the defect list part 220 including the relevant important defect on the inspection map part 210 of the moving image acquisition screen 200 and move the mouse 102. When clicked, the moving image display unit 230 displays an image in the field of view (in the imaging region) of the optical microscope image centered on the designated important defect, that is, a location corresponding to the important defect. The display of the important defect equivalent location is based on the fact that the defective portion 72 is specified by the above operation, and the computer 100 stores the SEM review device 32 stored in the recording device 106 prior to the determination of the observation / inspection conditions. The sample stage of the optical review apparatus 31 described and omitted in FIG. 4 based on the defect information D32a (see FIG. 2) of the important defect portion identified in (1), particularly the coordinate data on the wafer of the important defect portion therein. This is performed by controlling the movement of 87. In this state, the rotation position of the polarizing plate 89 shown in FIG. 4 is set to a predetermined initial position or a rotation stop position at the time of the previous review. Image data of an optical image acquired by the image sensor 91 in the plate state is displayed.

  Here, when the image data of the wafer (sample) 1 displayed on the moving image display unit 230 is adjusted and moved, the bars 231 and 232 of the moving image display unit 230 are moved with the mouse cursor. Receiving this, the computer 100 moves the sample stage 87 of the optical review device 31 to the operation amount and operation direction of the bars 231 and 232 in order to move the display portion of the wafer 1 displayed on the moving image display unit 230. In accordance with the movement control, the target area portion of the wafer 1 displayed on the moving image display unit 230 is moved.

  When the signal level on the image displayed on the moving image display unit 230 is to be confirmed on the signal level display unit 260, the display area (for example, a display area size of 512 × 512 pixels) on the moving image display unit 230 is displayed. The moving guides 233 and 234 are adjusted so that the intersections thereof intersect with the defective portions displayed on the moving image display unit 230. Of course, when the input operation means 103 is provided with a joystick, the position may be adjusted with the joystick while viewing the display image of the moving image display unit 230. At this time, the direction in which the signal level is to be confirmed on the signal level display unit 260 can be selected by checking the selection column 261 in either the X direction or the Y direction on the signal level display unit 260.

  Accordingly, the computer 100 displays the image data of the wafer (sample) 1 displayed on the moving image display unit 230 on the moving image display unit 230 in either the X direction or the Y direction selected by checking the selection column 261. The signal state of the image data in the region is extracted from the image data stored as a moving image in the recording device 106, and the signal level display unit 260 displays the gradation level on the vertical axis and the moving image on the horizontal axis. A graph is displayed as the number of pixels in the display area of the unit 230. According to the graph display of the signal level display unit 260, it is possible to grasp the change in the gradation level in either the X direction or the Y direction of the image data of the wafer 1 displayed on the moving image display unit 230.

  If the image display of the moving image display unit 230 or the graph display of the signal level display unit 260 is too bright or too dark, the adjustment button 271 of the illumination operation unit 270 can be dragged and slid with the mouse cursor, The gradation level can be directly input to the state display unit 272 for adjustment.

  In this way, when the above-described image position adjustment, brightness adjustment, and the like have been completed as necessary, moving image information at the adjusted image position is acquired.

  When moving image information at the image position adjusted as described above is acquired, first, polarized light is applied to the Start setting display unit 251s and End setting display unit 251e in the range display unit 251 of the recording / playback range setting display unit 250. The plate rotation driving means 93 performs setting input using the number of driving pulses for the polarizing plate rotation driving means 93 corresponding to the rotation position or rotation amount of the polarizing plate 89.

  Then, when the recording button of the moving image recording / reproducing operation unit 240 is operated with the mouse cursor, the computer 100 is displayed on the moving image display unit 230 of the wafer (sample) 1 as described below. The moving image information about the part is acquired.

  That is, the computer 100 sends a rotation instruction (that is, a drive pulse generation instruction) of the polarizing plate 89 in the rotation position range or rotation amount range set in the range display unit 251 of the recording / playback range setting display unit 250 to the polarizing plate. The rotation drive means 93 is supplied. The polarizing plate rotation driving means 93 generates a driving pulse in the rotation position range or rotation amount range supplied from the computer 100, drives the pulse motor, and rotates the polarizing plate 89 at a predetermined speed. In this case, the rotation speed of the polarizing plate 89 by the polarizing plate rotation driving means 93 is appropriately set according to the frame image acquisition time of the image sensor 91. Accordingly, the detection signal is sequentially supplied from the image sensor 91 to the computer 100 via the A / D converter 92 from the start to the end of the rotation of the polarizing plate 89. The computer 100 sequentially processes the digitized electrical signal output supplied via the A / D converter 92 to generate image data of an optical image of the wafer surface as needed, and displays it on the moving image display unit 230. In addition to the display output, the storage device 106 continuously stores and manages it. As a result, it is possible to acquire the image data of the optical image of the wafer surface that sequentially changes in accordance with the change in the rotation direction of the polarizing plate 89, that is, the moving image data of the optical image of the wafer surface. During this time, the polarizing plate rotation driving means 93 detects the current rotational position of the polarizing plate 89 and transmits rotational position information to the computer 100 as the polarizing plate 89 rotates.

  When the computer 100 performs continuous storage management of the image data of the optical image of the wafer surface generated at any time to the recording device 106 while the polarizing plate 89 is rotating, the corresponding rotation of the polarizing plate 89 at that time. The position (ie, corresponding to the polarization direction of the polarizing plate 89) is also stored.

  Therefore, when the recording button of the moving image recording / reproducing operation unit 240 is operated with the mouse cursor, a progress status display unit 252 for displaying the moving image recording / reproducing progress status is acquired along with the acquisition of the moving image. While moving at a speed corresponding to the rotation position range or rotation amount range set in the range display unit 251 of the recording / playback range setting display unit 250, the contrast change of the defect portion image displayed on the moving image display unit 230 is changed. The state is recorded on the recording device 106. With respect to the image data of the target area of the wafer 1 displayed on the moving image display unit 230, the time required for recording the moving image is several seconds.

  When the recording is completed, the rewind operation unit, stop operation unit, playback operation unit, fast forward operation unit, or progress instruction unit of the progress status display unit 252 by the moving image recording / playback operation unit 240 is operated, While observing the optical image of the wafer surface reproduced and displayed on the image display unit 230 and the signal level displayed on the signal level display unit 260 as a graph, the contrast of the defective portion is the highest at any rotation position or rotation amount of the polarizing plate 89. I can understand immediately.

  In this operation, instead of designating the die 71 including the relevant important defect on the inspection map unit 210 or the corresponding defect unit 72 with the mouse cursor, the desired defect ID on the defect list 220 is marked with the mouse cursor. It can be performed manually or automatically by specifying it by attaching it.

  Next, a method for investigating the dependency of the contrast change of the defective portion on the polarizing plate setting using the moving image acquired in the recording apparatus 106 as described above will be described with reference to FIG.

  For example, the progress display unit 252 records that the acquisition of the moving image of the target region portion of the wafer 1 in the rotation position range or rotation amount range set in the range display unit 251 of the recording / playback range setting display unit 250 is completed. / When the reproduction range setting display unit 250 confirms and storage of the moving image information of the defective portion in the recording device 106 for the wafer 1 is completed, the input operation unit 103 is operated and displayed on the display device 104. The moving image acquisition screen 200 shown in FIG. 5 is closed, and the contrast analysis screen 300 shown in FIG. 6 is opened.

  FIG. 6 is a diagram showing a contrast analysis screen depending on the polarization condition of the important defect portion by the optical review device.

  The contrast analysis screen 300 shown in FIG. 6 is a screen obtained by replacing the inspection map unit 210 with the contrast graph unit 310 and the moving image recording / playback operation unit 240 with the analysis operation unit 320 in the moving image acquisition screen 200 shown in FIG. It is configured. The other screen components of the contrast analysis screen 300 are the same as the remaining screen components of the moving image acquisition screen 200. Therefore, the same components as those of the moving image acquisition screen 200 are denoted by the same reference numerals and the description thereof is omitted. Is omitted.

  In FIG. 6, the contrast graph unit 310 compares the vertical axis with the gray level (GL level) difference between the images to be compared, and the horizontal axis is the drive supplied to the pulse motor of the polarizing plate rotation driving means 93 that rotates the polarizing plate 89. The graph configuration represents the number of pulses, that is, each rotation position or each rotation amount position in the rotation position range or rotation amount range of the polarizing plate 89. In the example shown in the figure, the polarizing plate 89 is represented as one rotation with 2000 driving pulses.

  The analysis operation unit 320 includes a C2C (cell to cell) analysis button 321 and a D2D (die to die) analysis button 322.

  Here, the C2C analysis button 321 is used to convert each frame image data of the obtained moving image into image data of wafers of the same lot or the same product type or process at an arbitrary cell pitch, and the gray level between corresponding pattern portions (region portions). It is an operation button for performing the analysis method compared with. In addition, the D2D analysis button 322 acquires a moving image in the same manner in the rotation position range or the rotation amount range of the polarizing plate set in the recording / playback range setting display unit 250 for the same location between adjacent dies 71, This is an operation button for executing an analysis method for comparing the gray levels of adjacent dies 71 corresponding to the rotation position range or the rotation amount of the polarizing plate at this time.

  In this case, when the image to be analyzed is displayed on the moving image display unit 230 and the C2C analysis button 321 is operated, the computer 100 displays the moving image of the target area portion of the wafer 1 displayed on the moving image display unit 230. Is already stored in the recording device 106. When the moving image of the target area portion of the wafer 1 is already recorded in the recording device 106, the computer 100 reads the moving image from the recording device 106. On the other hand, when the moving image of the target area portion of the wafer 1 is not yet stored in the recording device 106, the computer 100 displays the moving image recording / reproducing operation unit on the moving image acquisition screen 200 shown in FIG. Similarly to the processing when the 240 recording button is operated, the polarizing plate rotation driving means 93 is controlled to operate for the rotation position range or rotation amount range set in the range display section 251 of the recording / reproduction range setting display section 250. Then, the moving image information about the target area portion of the wafer 1 displayed on the moving image display unit 230 is acquired and stored in the recording device 106.

  When the computer 100 has already stored the moving image information about the same target area portion of another wafer 1 serving as a reference, the moving image information about the target area portion of the wafer 1 is stored in the recording device 106. First, the gray level of each moving image data is compared at an arbitrary cell pitch to obtain a difference, and this gray level difference is displayed on the contrast graph unit 310.

  When the image to be analyzed is displayed on the moving image display unit 230 and the D2D analysis button 332 is operated, the computer 100 displays the moving image of the target region portion of the wafer 1 displayed on the moving image display unit 230 and It is confirmed whether or not the moving image of the adjacent reference die 71 is already stored in the recording device 106. If the moving image is not yet recorded in the recording device 106, the moving image acquisition screen shown in FIG. In the same manner as when the record button of the moving image recording / playback operation unit 240 is operated at 200, the rotation position range or the rotation amount range set in the range display unit 251 of the recording / playback range setting display unit 250 is polarizing plate. The rotational driving means 93 is controlled to operate, and the moving image of the target area portion of the wafer (sample) 1 displayed on the moving image display unit 230 or a reference that is adjacent to the moving image is displayed. And retrieving the 71 moving images, stored in the recording device 106.

  Then, the computer 100 has already acquired a moving image of the same target area portion of another die 71 on the same wafer 1 adjacent to the die 71 including the acquired target area portion of the wafer 1, and stores it in the recording device 106. If stored, the gray levels of the two moving image data are compared to obtain a difference, and the difference between the gray levels is displayed on the contrast graph unit 310.

  Therefore, the C2C analysis on the contrast analysis screen 300 is similarly performed between the moving image of the wafer 1 having an important defect portion and the moving image of the wafer 1 having no important defect portion by the D2D analysis on the contrast analysis screen 300. As an observation / inspection condition for detecting an important defect portion by performing between the moving image of the die 71 having an important defect portion of the wafer 1 and the moving image of the die 71 having no important defect portion. The optical conditions (in this case, the rotation position and the rotation amount of the polarizing plate) can be confirmed immediately.

  Next, the moving image frame stored in the recording device 106 acquired while changing the setting of the polarizing plate 89 (the rotation position or the rotation amount or the polarization direction of the polarizing plate 89) is displayed on one screen of the display device 104. A method of arranging and displaying will be described with reference to FIG.

  FIG. 7 is a diagram showing an example of a contrast list display screen depending on the polarization condition of the important defect portion by the optical review device.

  In this case, the existing screen displayed on the display device 104 such as the moving image acquisition screen 200 shown in FIG. 5 displayed on the display device 104 by operating the input operation means 103 or the contrast analysis screen 300 shown in FIG. Is closed and the contrast list display screen 400 shown in FIG. 7 is opened.

  The contrast list display screen 400 is generated by the computer 100 of the optical review device 31 and includes a list display unit 410, a selection operation unit 420, and an enlargement operation unit 430.

  In the list display unit 410, a display content selection menu, a moving image for each of a plurality of important defect portions, and a contrast graph for each of a plurality of important defect portions are selectively switched and displayed.

  The selection operation unit 420 includes a display selection operation unit 421, a moving image selection operation unit 422, a C2C analysis selection operation unit 423, and a D2D analysis operation unit 424.

  The enlargement operation unit 430 instructs to enlarge and display a moving image for each of a plurality of important defect portions displayed on the list display unit 410 and a contrast graph for each of the plurality of important defect portions.

  Initially when the contrast list display screen 400 is opened, the computer 100 causes the list display unit 410 to display review result information including moving images stored in the recording device 106 as a selection menu of display contents (objects to be displayed as a contrast list). The key information (lot number, wafer number, inspection process, defect classification, etc.) of the wafer that has been taken out of the lot and reviewed is displayed in a selectable manner.

  Here, when the display object is sequentially narrowed down with the mouse cursor, and finally the one wafer 1 is designated and the moving image selection operation unit 422 is operated, the computer 100 displays the key information selected from the recording device 106. The review result information including the moving image of the wafer is read, the display content of the list display unit 410 is switched to the moving image of the wafer 1 designated from the selection menu, and displayed on the display device 104 as shown in FIG.

  In FIG. 7, the list display unit 410 of the contrast list display screen 400 has a setting condition of the polarizing plate 89 corresponding to each frame (rotational position of the polarizing plate 89) with respect to the designated wafer 1 with the defect ID 411 as the vertical axis. The frame image 413 corresponding to the moving image is displayed in an array with the horizontal axis 412 (rotation pulse number position of the pulse motor of the polarizing plate rotation driving means 93 corresponding to the above). In the case of FIG. 7, for the three important defects whose defect ID 411 is represented by “ID85”, “ID102”, “ID110”, the rotational pulse number position of the pulse motor of the polarizing plate rotation driving means 93 is “80”, “ A state is shown in which frame images 413 corresponding to the four rotational positions of the polarizing plate 89 of “100”, “120”, and “140” are arranged and displayed.

  In the list display section 410 of the contrast list display screen 400, when there are many frame images 413 to be displayed, bars 415 and 416 for scrolling the screen in the vertical direction or the horizontal direction appear, and the bars 415 and 416 are displayed. By moving the scale display position, it is possible to display a defect ID 411 that is not currently displayed on the list display unit 410 or an arbitrary frame image 413 corresponding to the setting conditions of the polarizing plate 89.

  In the case of FIG. 7, the contrast list display screen 400 is supposed to display a total of 12 frame images 413 on the list display unit 410, but by operating the enlargement operation unit 430 with a mouse cursor, The number of frame images 413 displayed on the list display unit 410 can be increased or decreased, and the display magnification of the frame images 413 displayed on the list display unit 410 can be increased or decreased.

  Further, when the C2C analysis selection operation unit 423 or the D2D analysis operation unit 424 is operated while the frame image 413 is displayed on the list display unit 410, the computer 100 displays the display contents of the list display unit 410. Is changed to a contrast graph of the C2C analysis result or D2D analysis result of the designated wafer 1 and displayed. When the display selection operation unit 421 is operated, the display content of the list display unit 410 is changed to the initial selection menu and displayed.

  On the other hand, when the selection menu is displayed on the list display unit 410 described above, if one wafer 1 is designated and the C2C analysis selection operation unit 423 or the D2D analysis operation unit 424 is operated, the contrast list display screen 400 is displayed. The list display unit 410 displays a contrast graph 414 of C2C analysis results and D2D analysis results for the designated wafer 1 in an array.

  FIG. 8 is a diagram illustrating an example of the D2D analysis result of the contrast list display screen depending on the polarization condition of the important defect portion by the optical review device.

  In the case of FIG. 8, the contrast graph 414 as described in the contrast graph section 310 shown in FIG. 6 is arranged for the three important defects whose defect ID 411 is represented by “ID85”, “ID102”, and “ID110”. Is displayed. Note that the functions of the bars 415 and 416, the enlargement operation unit 430, and the like in this case are the same as in the case of displaying the frame image 413 described above.

  In this way, it can be easily understood what optical conditions can be efficiently detected as observation / inspection conditions for a plurality of important defects having different modes (defect IDs).

  On the contrast list display screen 400, the defect ID of one or a plurality of important defects is designated with the mouse cursor, and the frame image 413 having the appropriate contrast among the frame images 413 displayed on the list display unit 410 is displayed. In the contrast graph 414, the computer 100 designates and registers the rotational pulse number position corresponding to the rotational position of the polarizing plate 89 having an appropriate contrast with the mouse cursor, whereby the computer 1 belongs to the corresponding rotational pulse number position. As the optical conditions of the product wafer 1 of the product type and process, the rotational pulse number position corresponding to the rotational position of the polarizing plate 89 can be set and recorded in correspondence with the designated defect ID.

  According to the present invention described above, it is possible to quickly find the optical condition setting for efficiently detecting important defects, and to facilitate the condition setting of an optical inspection apparatus that is becoming increasingly difficult. Great effect can be demonstrated.

1 is an overall configuration diagram of a defect confirmation line system including a defect confirmation work support system according to an embodiment of the present invention. It is explanatory drawing of the transmission sequence of the information transmitted between an external appearance inspection apparatus and a review apparatus, and a data processor. It is an operation | work flowchart until it sets optical conditions using the defect confirmation operation | work assistance system by one embodiment of this invention. It is a block diagram of one Example of an optical review apparatus. It is the figure which showed the moving image acquisition screen depending on the polarization conditions of the important defect part by an optical review apparatus. It is the figure which showed the contrast analysis screen depending on the polarization conditions of the important defect part by an optical review apparatus. It is the figure which showed an example of the contrast list display screen depending on the polarization conditions of the important defect part by an optical review apparatus. It is the figure which showed an example of the D2D analysis result of the contrast list display screen depending on the polarization conditions of the important defect part by an optical review apparatus.

Explanation of symbols

1 Wafer (Sample)
2 Map 10 Clean room 11 Semiconductor manufacturing process 20 Appearance inspection device 30 Review device 31 Optical review device 32 SEM review device 40 Probe inspection device 50 Data processing device 60 Communication line 71 Die 72 Defective part 73 Orientation flat mark 81 Light source 82, 82 ' Light 83 Lens 84 Polarizing plate 85 Half mirror 86 Objective lens 87 Sample stage 88, 88 'Light 89 Polarizing plate 90 Imaging lens 91 Image sensor 92 A / D converter 93 Polarizing plate rotation driving means 100 Computer 101 Keyboard 102 Mouse 103 Input Operating means 104 Display device 105 Communication interface 106 Device 200 Movie acquisition screen 210 Inspection map unit 220 Defect list unit 230 Moving image display unit 231, 232 Bar 240 Moving image recording / Playback operation unit 241 Individual operation unit 250 Recording / playback range setting display unit 251 Range display unit 252 Progress status display unit 260 Signal level display unit 261 Selection column 270 Illumination operation unit 300 Contrast analysis screen 310 Contrast graph unit 320 Analysis operation unit 321 C2C Analysis button 322 D2D analysis button 400 Contrast list display screen 410 List display section 411 Defect ID
412 Polarizer setting conditions 413 Frame image 414 Contrast graph 415, 416 Bar 420 Selection operation unit 421 Display selection operation unit 422 Movie selection operation unit 423 C2C analysis selection operation unit 424 D2D analysis operation unit 430 Enlargement operation unit

Claims (15)

Irradiation system means for irradiating the sample with a light beam;
A light receiving system means for receiving reflected light or scattered light generated from the sample irradiated with the light beam and outputting a detection signal corresponding to the received reflected light or scattered light;
A polarizing plate provided on the optical axis of the light receiving system means;
The polarizing plate was rotated, and a polarizing plate rotating means for rotating the polarization direction of the polarizing plate,
An observation / inspection condition for observing / inspecting an appearance defect of a sample based on a detection signal output from the light receiving system means according to the rotation position of the polarizing plate by the operation of the polarizing plate rotation means. An inspection work support system,
Image generating means for generating observation / inspection image data of a sample based on a detection signal output from the light receiving system means;
Image storage means for storing observation / inspection image data of the sample generated by the image generation means;
While controlling the operation of the polarizing plate rotating means so that the polarizing plate rotates within a predetermined rotation range set in advance, the image while the polarizing plate rotating means rotates the polarizing plate within the predetermined rotation range. Observation / inspection image data of the sample generated and output from the generation unit is stored as a moving image in the image storage unit in correspondence with the amount of rotation of the polarizing plate or the polarization direction of the polarizing plate based on the amount of rotation of the polarizing plate. Observation / inspection image storage control means;
Observation / inspection work support characterized by comprising observation / inspection image reproduction means for reproducing and outputting observation / inspection image data of the sample stored in the image storage means by the observation / inspection image storage control means system. The observation / inspection image reproduction means includes:
A plurality of frames of observation / inspection image data corresponding to different rotation amount positions of the polarizing plate are cut out from the observation / inspection image data that changes with the amount of rotation of the polarizing plate, and the cut-out observation / inspection images of the plurality of frames are extracted. The observation / inspection work support system according to claim 1, further comprising an editing / playback unit that synthesizes data and plays back and outputs a list. A display unit for displaying a range setting unit for setting a rotation amount or a rotation amount range of the polarizing plate or a change range of a polarization direction of the polarizing plate based on the rotation amount of the polarizing plate;
The observation / inspection work support system according to claim 1. A display unit for displaying a progress of recording or reproduction of the observation / inspection image data;
The observation / inspection work support system according to claim 1. A display unit that displays as a graph a parameter with an arbitrary rotation position or rotation amount of the polarizing plate and a gray level difference between the observation / inspection image data of at least two samples at the rotation position or rotation amount. The observation / inspection work support system according to claim 1, further comprising: An arbitrary rotation position or rotation amount of the polarizing plate and a gray level difference at an arbitrary cell pitch between the observation / inspection image data in the same region of one sample and another sample are displayed as a graph. The observation / inspection work support system according to claim 5, further comprising a display unit. Aforementioned and any rotational position or amount of rotation of the polarizing plate, and a gray level difference between the observation / inspection image data of a die adjacent to the observation / inspection image data and the die at any die parameters, as a graph 6. The observation / inspection work support system according to claim 5, further comprising a display unit for displaying. A display unit for displaying an instruction unit for starting display of the graph;
6. The observation / inspection work support system according to claim 5. Wherein the observation / inspection image data for calculating the gray level difference, to verify whether it is stored in the image storage means,
Wherein when the observation / examination image data is stored, the read the observation / inspection image data from the image storage means, if not stored, the observation at a rotation position range or rotation amount range of the range setting unit 6. The observation / inspection work support system according to claim 3, wherein the inspection / inspection image data is acquired and stored in the image storage means. A display unit configured to display at least one or more of the observation / inspection image data or at least one of the graphs;
6. The observation / inspection work support system according to claim 1 or 5. A display unit for displaying a magnification changing unit for changing a magnification of display of the observation / inspection image data or the graph;
6. The observation / inspection work support system according to claim 5. Irradiation system means for irradiating the sample with a light beam;
A light receiving system means for receiving reflected light or scattered light generated from the sample irradiated with the light beam and outputting a detection signal corresponding to the received reflected light or scattered light;
A polarizing plate provided on the optical axis of the light receiving system means;
The polarizing plate was rotated, and a polarizing plate rotating means for rotating the polarization direction of the polarizing plate,
An observation / inspection condition for observing / inspecting an appearance defect of a sample based on a detection signal output from the light receiving system means according to the rotation position of the polarizing plate by the operation of the polarizing plate rotation means. An inspection work support system,
Image generating means for generating observation / inspection image data of a sample based on a detection signal output from the light receiving system means;
Image storage means for storing observation / inspection image data of the sample generated by the image generation means;
While controlling the operation of the polarizing plate rotating means so that the polarizing plate rotates within a predetermined rotation range set in advance, the image while the polarizing plate rotating means rotates the polarizing plate within the predetermined rotation range. Observation / inspection image data of the sample generated and output from the generation unit is stored as a moving image in the image storage unit in correspondence with the amount of rotation of the polarizing plate or the polarization direction of the polarizing plate based on the amount of rotation of the polarizing plate. Observation / inspection image storage control means;
Observation / inspection image reproduction means for reproducing and outputting observation / inspection image data of the sample stored in the image storage means by the observation / inspection image storage control means, and moving image storage reproduced and output by the observation / inspection image reproduction means Rotation position of the polarizing plate rotated by the polarizing plate rotating means corresponding to the observation / inspection image data at a desired timing from the observed / inspected image data of the sample, or the polarization direction of the polarizing plate An observation / inspection condition registration means for registering as a rotation position of the polarizing plate or a polarization direction of the polarizing plate when detecting an appearance defect portion of the observed / inspected sample,
An observation / inspection work support system characterized by comprising : An irradiation step of irradiating the sample with a light beam by means of an irradiation system;
A light receiving step of receiving reflected light or scattered light generated from the sample irradiated with the light beam by the light receiving system means and outputting a detection signal corresponding to the received reflected light or scattered light;
A polarizing plate provided on the optical axis of the light receiving system means and rotation, has a polarizing plate rotating step of rotating the polarization direction of the polarizing plate, depending on the rotational position of the polarizing plate in the polarizing plate rotation step An observation / inspection condition setting method for determining an observation / inspection condition for observing / inspecting an appearance defect of a sample based on a detection signal output from the light receiving system means,
An image generating step of generating observation / inspection image data of the sample based on the detection signal output from the light receiving system means in the light receiving step;
While the polarizing plate is rotated in the predetermined rotation range in the polarizing plate rotating step, the observation / inspection image data of the sample generated and output in the image generating step is the rotation amount of the polarizing plate or the polarizing plate. An observation / inspection image storage step of storing a moving image in the image storage means corresponding to the polarization direction of the polarizing plate based on the rotation amount of
An observation / inspection condition setting method comprising an observation / inspection image reproduction step of reproducing and outputting the observation / inspection image data of the sample stored as a moving image in the image storage means in the observation / inspection image storage step. In the observation / inspection image reproduction step,
A plurality of frames of observation / inspection image data corresponding to different rotation amount positions of the polarizing plate are cut out from the observation / inspection image data that changes with the amount of rotation of the polarizing plate, and the cut-out observation / inspection images of the plurality of frames are extracted. 14. The observation / inspection condition setting method according to claim 13, further comprising an editing step of synthesizing data and reproducing and outputting a list. An irradiation step of irradiating the sample with a light beam by means of an irradiation system;
A light receiving step of receiving reflected light or scattered light generated from the sample irradiated with the light beam by the light receiving system means and outputting a detection signal corresponding to the received reflected light or scattered light;
A polarizing plate provided on the optical axis of the light receiving system means and rotation, has a polarizing plate rotating step of rotating the polarization direction of the polarizing plate, depending on the rotational position of the polarizing plate in the polarizing plate rotation step An observation / inspection condition setting method for determining an observation / inspection condition for observing / inspecting an appearance defect of a sample based on a detection signal output from the light receiving system means,
An image generating step of generating observation / inspection image data of the sample based on the detection signal output from the light receiving system means in the light receiving step;
While the polarizing plate is rotated in the predetermined rotation range in the polarizing plate rotating step, the observation / inspection image data of the sample generated and output in the image generating step is the rotation amount of the polarizing plate or the polarizing plate. An observation / inspection image storage step of storing a moving image in the image storage means corresponding to the polarization direction of the polarizing plate based on the rotation amount of
Among the observation / inspection image data of the moving image stored and reproduced by the observation / inspection image reproduction means, the polarizing plate rotation means corresponding to the observation / inspection image data at a desired timing is rotated. Observation / inspection conditions for registering the rotation position of the polarizing plate or the polarization direction of the polarizing plate as the rotation position of the polarizing plate or the polarization direction of the polarizing plate when detecting an appearance defect portion of the observed / inspected sample An observation / inspection condition setting method comprising a registration step.

Images