JP4471611B2 - Polyester film for dry film resist for high resolution - Google Patents
Polyester film for dry film resist for high resolution Download PDFInfo
- Publication number
- JP4471611B2 JP4471611B2 JP2003319604A JP2003319604A JP4471611B2 JP 4471611 B2 JP4471611 B2 JP 4471611B2 JP 2003319604 A JP2003319604 A JP 2003319604A JP 2003319604 A JP2003319604 A JP 2003319604A JP 4471611 B2 JP4471611 B2 JP 4471611B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- polyester
- coating
- layer
- antistatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920006267 polyester film Polymers 0.000 title claims description 38
- 239000011247 coating layer Substances 0.000 claims description 25
- 230000003746 surface roughness Effects 0.000 claims description 16
- 229920000728 polyester Polymers 0.000 claims description 15
- 238000002834 transmittance Methods 0.000 claims description 5
- 239000010408 film Substances 0.000 description 128
- 239000002245 particle Substances 0.000 description 40
- 239000010410 layer Substances 0.000 description 35
- 238000000576 coating method Methods 0.000 description 33
- 239000011248 coating agent Substances 0.000 description 30
- 238000000034 method Methods 0.000 description 24
- 229920002120 photoresistant polymer Polymers 0.000 description 24
- -1 polyethylene Polymers 0.000 description 21
- 239000002216 antistatic agent Substances 0.000 description 16
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 13
- 230000007547 defect Effects 0.000 description 11
- 239000001993 wax Substances 0.000 description 11
- 238000004804 winding Methods 0.000 description 11
- 229920000139 polyethylene terephthalate Polymers 0.000 description 10
- 239000005020 polyethylene terephthalate Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 229920006037 cross link polymer Polymers 0.000 description 7
- 239000000428 dust Substances 0.000 description 7
- 239000010419 fine particle Substances 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 7
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 125000000524 functional group Chemical group 0.000 description 5
- 229920000098 polyolefin Polymers 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 125000002091 cationic group Chemical group 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000009998 heat setting Methods 0.000 description 3
- 239000010954 inorganic particle Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000011146 organic particle Substances 0.000 description 3
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 229910021536 Zeolite Inorganic materials 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- 125000000129 anionic group Chemical group 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 2
- 229910001634 calcium fluoride Inorganic materials 0.000 description 2
- 239000001506 calcium phosphate Substances 0.000 description 2
- 229910000389 calcium phosphate Inorganic materials 0.000 description 2
- 235000011010 calcium phosphates Nutrition 0.000 description 2
- 239000008119 colloidal silica Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000007688 edging Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000009501 film coating Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 230000001846 repelling effect Effects 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 125000001302 tertiary amino group Chemical group 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 2
- 239000010457 zeolite Substances 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- CVBWTNHDKVVFMI-LBPRGKRZSA-N (2s)-1-[4-[2-[6-amino-8-[(6-bromo-1,3-benzodioxol-5-yl)sulfanyl]purin-9-yl]ethyl]piperidin-1-yl]-2-hydroxypropan-1-one Chemical compound C1CN(C(=O)[C@@H](O)C)CCC1CCN1C2=NC=NC(N)=C2N=C1SC(C(=C1)Br)=CC2=C1OCO2 CVBWTNHDKVVFMI-LBPRGKRZSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- WMRCTEPOPAZMMN-UHFFFAOYSA-N 2-undecylpropanedioic acid Chemical compound CCCCCCCCCCCC(C(O)=O)C(O)=O WMRCTEPOPAZMMN-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920001634 Copolyester Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- 241001422033 Thestylus Species 0.000 description 1
- ONTAEZSXZGCILH-UHFFFAOYSA-N [(4,6-diamino-1,3,5-triazin-2-yl)-methoxyamino]methanol Chemical compound CON(CO)C1=NC(N)=NC(N)=N1 ONTAEZSXZGCILH-UHFFFAOYSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- DQPBABKTKYNPMH-UHFFFAOYSA-M amino sulfate Chemical class NOS([O-])(=O)=O DQPBABKTKYNPMH-UHFFFAOYSA-M 0.000 description 1
- 239000012164 animal wax Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000002507 cathodic stripping potentiometry Methods 0.000 description 1
- 229920006317 cationic polymer Polymers 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 125000004985 dialkyl amino alkyl group Chemical group 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000012972 dimethylethanolamine Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 239000012184 mineral wax Substances 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000004209 oxidized polyethylene wax Substances 0.000 description 1
- 235000013873 oxidized polyethylene wax Nutrition 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000012169 petroleum derived wax Substances 0.000 description 1
- 235000019381 petroleum wax Nutrition 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N phosphonic acid group Chemical group P(O)(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 239000012165 plant wax Substances 0.000 description 1
- 229920000371 poly(diallyldimethylammonium chloride) polymer Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000223 polyglycerol Chemical group 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000012791 sliding layer Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/046—Forming abrasion-resistant coatings; Forming surface-hardening coatings
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Laminated Bodies (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Materials For Photolithography (AREA)
Description
本発明は、プリント配線板、リードフレームやBGA、CSP等のパッケージを製造するに適したドライフィルムレジスト(以下、DFRと称する)用フィルムに関するものであり、特に配線パターンが密な、ファインパターンが要求される基板の製造に好適なDFR用フィルムに関する。詳しくは、透明性が高く、表面粗さが極めて平坦なフィルムに静電気防止性、易滑性を有する塗布層を設けることにより、フィルム表面に帯電した静電気の放電による災害の防止やベースフィルムの表面にごみやほこりなどが引きつけられ付着するのを防止して、異物付着によるパターン不整を防止し、品質の安定化を図り、かつ平坦なフィルムをロール状に巻きとる際の作業性、易滑性等の加工適正に優れたDFR用フィルムに関するものである。 The present invention relates to a film for dry film resist (hereinafter referred to as DFR) suitable for manufacturing packages such as printed wiring boards, lead frames, BGAs, and CSPs. The present invention relates to a DFR film suitable for manufacturing a required substrate. Specifically, by providing a film with high transparency and extremely flat surface roughness with an antistatic and easy-to-slip coating layer, the surface of the base film can be prevented from being damaged by electrostatic discharge on the film surface. Prevents dirt and dust from attracting and adhering to it, preventing pattern irregularities due to adhesion of foreign matter, stabilizing quality, and workability and smoothness when winding a flat film into a roll It is related with the film for DFR excellent in processing appropriateness.
近年、印刷配線回路板の製造等において、DFRが広く用いられている。DFRは通常、支持フィルム/フォトレジスト層/保護フィルムの構成からなる。支持フィルムとしては、機械的性質、光学的性質、耐薬品性、耐熱性、寸法安定性、平面性等に優れたポリエステルフィルムが主に使用されている。フォトレジスト層は感光性樹脂からなる層であり、また、保護フィルムとしてはポリエチレンフィルム、ポリプロピレンフィルムやポリエステルフィルムが用いられている。DFRの使用方法を簡単に説明すると、まず保護フィルムを剥し、露出したフォトレジスト層を基盤に貼り付けた導電性基材の上に密着させる。導電性基材は一般的には銅板である。次に、支持フィルム側に、回路が印刷されたガラス板またはフィルム(フォトマスクと称する)を密着させ、当該フォトマスク側から光を照射する。この照射光には一般的に紫外線が用いられる。ガラス板に印刷された回路の画像で透明な部分を光が通り、フォトレジスト層の感光性樹脂はかかる露光が行われた部分のみ反応する。次いでガラス板と支持体層を取り除き、フォトレジスト層の未露光部分を適当な溶剤等を用いて除去する。さらに、酸等を用いてエッチングを行えば、フォトレジスト層が除去されて露出した導電性基材部分が除去される。しかる後、露光、反応したフォトレジスト層を適当な方法で除去すれば、基盤上に導電性基材層が回路として形成される。 In recent years, DFR has been widely used in the production of printed wiring circuit boards. A DFR usually consists of a support film / photoresist layer / protective film. As the support film, a polyester film excellent in mechanical properties, optical properties, chemical resistance, heat resistance, dimensional stability, flatness and the like is mainly used. The photoresist layer is a layer made of a photosensitive resin, and a polyethylene film, a polypropylene film, or a polyester film is used as the protective film. Briefly explaining how to use the DFR, the protective film is first peeled off, and the exposed photoresist layer is brought into close contact with the conductive base material affixed to the substrate. The conductive substrate is generally a copper plate. Next, a glass plate or film (referred to as a photomask) on which a circuit is printed is brought into close contact with the support film side, and light is irradiated from the photomask side. In general, ultraviolet light is used as the irradiation light. In the circuit image printed on the glass plate, light passes through a transparent portion, and the photosensitive resin of the photoresist layer reacts only to the exposed portion. Next, the glass plate and the support layer are removed, and the unexposed portion of the photoresist layer is removed using a suitable solvent or the like. Further, if etching is performed using an acid or the like, the photoresist layer is removed and the exposed conductive base material portion is removed. Thereafter, when the exposed and reacted photoresist layer is removed by an appropriate method, a conductive substrate layer is formed as a circuit on the substrate.
最近は、形成する回路が極めて複雑になり、線が細く、その間隔も狭くなってきており、画像形成の再現性、解像度が高度であることが必要になった。このため、支持体として用いられるポリエステルフィルムに対しても、高度な品質が要求されるようになった。支持体として用いられるポリエステルフィルムは、表面が平坦で透明性が高く、フィルムヘーズが低いことが必要である。フォトレジストフィルムにおいて、フォトレジスト層を露光する場合、前述のとおり光は支持体層を通ることになる。したがって、支持体の透明性が低いとフォトレジスト層が十分に露光されず、また、フィルムヘーズが高く、フィルム表面粗さが粗いとフィルム表面および内部の光の散乱により解像度が悪化する等の問題が生ずる。 Recently, the circuits to be formed have become extremely complicated, the lines have become narrower, and the intervals between them have become narrower, and it has become necessary to have high reproducibility and resolution of image formation. For this reason, the high quality came to be requested | required also with respect to the polyester film used as a support body. The polyester film used as a support needs to have a flat surface, high transparency, and low film haze. In the photoresist film, when exposing the photoresist layer, light passes through the support layer as described above. Therefore, if the transparency of the support is low, the photoresist layer is not sufficiently exposed, and if the film haze is high and the film surface roughness is rough, the resolution deteriorates due to scattering of light on the film surface and inside. Will occur.
表面が平坦で透明性が高く、フィルムヘーズが低いポリエステルフィルムは、フィルムの製造工程、巻き取り工程等での取り扱い性が悪く、かつ帯電も生じやすい。フォトレジスト層を形成させてDFRを製造する際に、このような帯電を生じたフィルムロールを使用すると静電気の作用によってごみやほこりなどの微少な異物を引きつけるため、クリーンルーム内においても異物の付着が発生し、特にロールからの巻きだしの際には、剥離による激しい帯電が生じ、異物の付着が一層大きくなるし、またフォトレジスト有機溶剤塗料への火花放電による引火の危険や、帯電箇所のレジスト密着性が強くなり、露光後の支持フィルム剥離に支障を来す等の問題がある。 A polyester film having a flat surface, high transparency, and low film haze is poor in handleability in the film production process, the winding process, and the like, and is easily charged. When manufacturing a DFR by forming a photoresist layer, the use of such a charged film roll attracts minute foreign matters such as dust and dirt by the action of static electricity. In particular, when unrolling from a roll, intense charging occurs due to peeling, and adhesion of foreign matter is further increased. In addition, there is a risk of ignition by spark discharge to the photoresist organic solvent paint, and the resist at the charged part. There are problems such as increased adhesion and hindering peeling of the support film after exposure.
こうしたフィルムの帯電性や取扱い性を良好にするため、あるいはDFR自身の取り扱い性、巻き特性を良好とするため、通常、ポリエステルフィルム中に粒子を含有させ、表面に微細な突起を形成させる方法が用いられている。しかしながら、粒子添加による突起形成を行うと、突起による紫外線の散乱やレジスト表面に凹みを生じ、昨今の極細線の回路形成に解像性の低下や欠陥を及ぼしたり、フィルムの透明性を低下させたりすることになる。このような相反する特性を有することから、透明性、帯電性、滑り性、平坦性を同時に満足させた高解像度用DFR用フィルムを得る方法は未だ見いだされていない。
本発明は上記実情に鑑みなされたものであって、その解決課題は、フィルム表面に帯電した静電気の放電による災害の防止やベースフィルムの表面にごみやほこりなどが引きつけられ付着するのを防止して、異物付着によるパターン不整を防止し、品質の安定化を図り、かつ平坦なフィルムをロール状に巻きとる際の作業性、易滑性等の加工適正に優れたフィルムを提供することにある。 The present invention has been made in view of the above circumstances, and its solution is to prevent disasters caused by the discharge of static electricity charged on the film surface and prevent the surface of the base film from attracting and adhering dust and dirt. In order to prevent irregular patterning due to adhesion of foreign matter, to stabilize quality, and to provide a film excellent in workability, smoothness, etc. when winding a flat film into a roll. .
本発明者は、上記の目的を達成すべく種々検討を重ねた結果、特定の構成からなるフィルムにすることで、上記課題が容易に解決できることを見いだし、本発明を完成するに至った。 As a result of various studies to achieve the above object, the present inventor has found that the above problem can be easily solved by using a film having a specific structure, and has completed the present invention.
すなわち、本発明の要旨は、少なくとも片面に、易滑性および帯電防止性の塗布層を有するフィルムであって、当該塗布層表面の平均表面粗さ(Ra)が2nm以上、10nm未満、最大表面粗さ(Rt)が20nm以上、200nm未満であることを特徴とする高解像度用ドライフィルムレジスト用ポリエステルフィルムに存する。 That is, the gist of the present invention is a film having an easy-to-slip and antistatic coating layer on at least one surface, and the average surface roughness (Ra) of the coating layer surface is 2 nm or more and less than 10 nm, the maximum surface The present invention resides in a polyester film for a dry film resist for high resolution, wherein the roughness (Rt) is 20 nm or more and less than 200 nm.
以下、本発明を詳細に説明する。
本発明で言うポリエステルとは、ポリエステルを構成するジカルボン酸成分として、テレルタル酸、イソフタル酸、2,6−ナフタレンジカルボン酸、ヘキサヒドロテレフタル酸、4.4´−ジフェニルジカルボン酸、アジピン酸、セバシン酸、ドデカンジカルボン酸等を例示しうる。特にフィルムの機械的性質の点からテレフタル酸、イソフタル酸、2,6−ナフタレンジカルボン酸が好ましい。ポリエステルを構成するグリコール成分としては、エチレングリコール、ジエチレングリコール、プロピレングリコール、1,3−プロパンジオール、1,4−ブタンジオール、ネオペンチルグリコール、1,6−へキサンジオール、シクロヘキサンジメタノール、ポリエチレングリコール等を例示しうる。特にフィルムの剛直性の点からエチレングリコールが好ましい。
Hereinafter, the present invention will be described in detail.
The polyester referred to in the present invention is a dicarboxylic acid component constituting the polyester, such as terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, hexahydroterephthalic acid, 4.4'-diphenyldicarboxylic acid, adipic acid, sebacic acid And dodecanedicarboxylic acid. In particular, terephthalic acid, isophthalic acid, and 2,6-naphthalenedicarboxylic acid are preferable from the viewpoint of mechanical properties of the film. Examples of the glycol component constituting the polyester include ethylene glycol, diethylene glycol, propylene glycol, 1,3-propanediol, 1,4-butanediol, neopentyl glycol, 1,6-hexanediol, cyclohexanedimethanol, polyethylene glycol, and the like. Can be illustrated. In particular, ethylene glycol is preferable from the viewpoint of the rigidity of the film.
上記のポリエステルは、第3成分として上記ジカルボン酸成分あるいはグリコール成分を共重合したコポリエステルであってもよく、三官能以上の多価カルボン酸成分あるいはポリオール成分を含んでもよく、得られるポリエステルが実質的に線状となる範囲(例えば5モル%以下)で少量共重合したポリエステルであってもよい。本発明で用いるポリエステルとしては、ポリエチレンテレフタレートまたはポリエチレン−2,6−ナフタレートが特に好ましい。かかるポリエステルは常法により作ることができ、ポリエステルの固有粘度(オルトクロロフェノール中、35℃)が、0.45以上であるとフィルムの引き裂き性、剛性が大きい等の機械的特性が良好となるため好ましい。 The polyester may be a copolyester obtained by copolymerizing the dicarboxylic acid component or glycol component as the third component, and may contain a trifunctional or higher polyvalent carboxylic acid component or polyol component. It may be a polyester copolymerized in a small amount within a linear range (for example, 5 mol% or less). As the polyester used in the present invention, polyethylene terephthalate or polyethylene-2,6-naphthalate is particularly preferable. Such a polyester can be produced by a conventional method, and if the intrinsic viscosity of the polyester (in orthochlorophenol, 35 ° C.) is 0.45 or more, the mechanical properties such as the tearability and rigidity of the film are good. Therefore, it is preferable.
このほかに、テレフタル酸とイソフタル酸等の共重合ポリエステル、安定剤、酸化防止剤等を必要に応じてポリエステル中に含有することもできる。本発明で用いるポリエステルフィルムは、公知の方法で製造することができる。例えば、二軸延伸ポリエステルフィルムは、ポリエステルレジンを乾燥後、押出し機にて溶融し、ダイ(例えばT−ダイ等)から回転冷却ドラム上に押出し、急冷して未延伸フィルムを製造し、次いで当該未延伸フィルムを縦方向および横方向に延伸し、必要に応じて熱固定することによって製造することができる。ポリエステルフィルムの厚さは10〜25μmの範囲であり、10〜18μmの範囲が好ましい。 In addition, copolymerized polyesters such as terephthalic acid and isophthalic acid, stabilizers, antioxidants and the like can be contained in the polyester as necessary. The polyester film used in the present invention can be produced by a known method. For example, a biaxially stretched polyester film is obtained by drying a polyester resin, melting it with an extruder, extruding it from a die (such as a T-die) onto a rotating cooling drum, and quenching to produce an unstretched film. It can manufacture by extending | stretching an unstretched film to the vertical direction and a horizontal direction, and heat-setting as needed. The thickness of the polyester film is in the range of 10 to 25 μm, and preferably in the range of 10 to 18 μm.
本発明のフィルムは、フィルム基材の少なくとも片方の面に易滑性および帯電防止性の塗布層を有するが、当該塗布層は両面であっても、フォトレジスト層に接する面のみ、あるいはその反対面のみでもよいが、保護フィルムと接する面であるレジスト反対面に塗設することが好ましい。DFRはロール状に巻き取られる際には支持フィルムのレジスト反対面と保護フィルムが接し、このロールが巻き戻される際に発生する剥離帯電を防止するには、保護フィルムと接する面に易滑性および帯電防止性を有する方が効果は顕著である。 The film of the present invention has a slippery and antistatic coating layer on at least one surface of the film substrate. However, even if the coating layer is both surfaces, only the surface in contact with the photoresist layer, or vice versa. Although it may be only the surface, it is preferably coated on the resist opposite surface which is the surface in contact with the protective film. When the DFR is wound up in a roll shape, the resist opposite surface of the support film is in contact with the protective film, and in order to prevent peeling electrification that occurs when this roll is rewound, the surface in contact with the protective film is slippery. In addition, the effect is more remarkable with antistatic properties.
本発明のフィルムの塗布層表面の表面粗さRaは2nm以上、10nm未満の範囲であり、好ましくは2〜7nmの範囲である。表面粗さRaが10nm以上の場合、ポリエステルフィルムの透明性が低下し、フィルム表面での光散乱が大となり、紫外線の露光量が低下して解像度が劣るようになる。また、塗布層表面の最大表面粗さRtは、20nm以上、200nm未満の範囲、好ましくは20〜150nmの範囲である。最大表面粗さが200nm以上では、レジスト面に生ずる凹みが大となり、酸エッジング処理によりレジストを除去する際に、凹み部分がラインエッジに存在すると、エッジング処理度に影響を及ぼしてラインの一部欠落を起こす問題が生ずる。一方、表面粗さRaが2nm未満、最大表面粗さRtが20nm未満となると、工程適正、特に製膜工程でフィルム表面にキズの発生が見られるようになり、キズは該表面に塗設したレジスト表面の欠陥となり、レジスト厚みが薄い高解像度のDFRでは解像性に及ぼす影響が大となる。また、フィルム塗布表面の摩擦係数の好ましい範囲である0.2〜0.6を発現させるため、塗布層中の滑剤と共に適度な粗さにすることにより、相乗的に摩擦係数の低減と同時にロール状に巻き取る際の抱き込み空気の逃げを与え、ロール表面の微少凹凸、ロール端面不揃いやシワといったロールフォーメーションを良好にする。 The surface roughness Ra of the coating layer surface of the film of the present invention is in the range of 2 nm or more and less than 10 nm, preferably in the range of 2 to 7 nm. When the surface roughness Ra is 10 nm or more, the transparency of the polyester film is lowered, the light scattering on the film surface is increased, the exposure amount of ultraviolet rays is lowered, and the resolution is deteriorated. Further, the maximum surface roughness Rt of the coating layer surface is in the range of 20 nm or more and less than 200 nm, preferably in the range of 20 to 150 nm. When the maximum surface roughness is 200 nm or more, the dent generated on the resist surface becomes large, and when the resist is removed by the acid edging process, if the dent part exists on the line edge, the edging process degree is affected and a part of the line is affected. There is a problem of missing. On the other hand, when the surface roughness Ra is less than 2 nm and the maximum surface roughness Rt is less than 20 nm, scratches can be seen on the film surface in the process proper, particularly in the film forming process, and the scratches are coated on the surface. A high resolution DFR with a thin resist thickness has a large influence on the resolution due to defects on the resist surface. Moreover, in order to express 0.2 to 0.6 which is a preferable range of the coefficient of friction on the film coating surface, the roll is formed synergistically with the lubricant in the coating layer to synergistically reduce the coefficient of friction and roll. Gives air escape when wrapping into a shape, and improves roll formation such as minute irregularities on the roll surface, unevenness of the roll end face, and wrinkles.
本発明のポリエステルフィルム表面に適度な粗さを付与する方法として、フィルム中に微粒子を配合する方法が一般的である。かかる含有粒子の例としては、炭酸カルシウム、リン酸カルシウム、シリカ、カオリン、タルク、二酸化チタン、アルミナ、硫酸バリウム、フッ化カルシウム、フッ化リチウム、ゼオライト、硫化モリブデン等の無機粒子、架橋高分子粒子、シュウ酸カルシウム等の有機粒子、およびポリエステル重合時に生成させる析出粒子を挙げることができる。かかる粒子の中でも、特に高度な透明性と傷防止性を得るために、アルミナ粒子、架橋高分子粒子またはシリカ粒子が好ましく用いられる。これらの粒子は、ポリエステルとの親和性や、屈折率の点で好ましい特性を有するため、フィルムのヘーズ値を高めずに擦り傷の防止と滑り性を向上することができる。表面層に含有させる粒子は一種類でもよく、二種類以上を同時に配合してもよい。同種の粒子で粒径の異なるものを同時に用いてもよい。かかる粒子の平均粒径は、通常0.01〜1.0μm、好ましくは0.02〜0.6μmの範囲である。平均粒径が1.0μmを超えると、フィルム表面に必要以上に大きな突起を形成してしまうため、回路印刷ガラスの表面との密着が不十分になって欠陥が発生する問題が生じたり、粒子がフィルム表面から脱落しやすくなったりするため、耐摩耗性悪化の原因となり好ましくない。また、平均粒径が0.01μm未満では、突起形成が不十分なためフィルムの滑り性が不足したり、製膜工程やレジスト塗布工程で擦り傷の発生見られるようになったりすることがある。 As a method for imparting an appropriate roughness to the polyester film surface of the present invention, a method of blending fine particles in the film is common. Examples of the contained particles include inorganic particles such as calcium carbonate, calcium phosphate, silica, kaolin, talc, titanium dioxide, alumina, barium sulfate, calcium fluoride, lithium fluoride, zeolite, molybdenum sulfide, crosslinked polymer particles, Shu Examples thereof include organic particles such as calcium acid, and precipitated particles formed during polyester polymerization. Among these particles, alumina particles, crosslinked polymer particles, or silica particles are preferably used in order to obtain particularly high transparency and scratch resistance. Since these particles have favorable characteristics in terms of affinity with polyester and refractive index, it is possible to prevent scratches and improve slipperiness without increasing the haze value of the film. One kind of particles may be contained in the surface layer, or two or more kinds may be blended simultaneously. You may use simultaneously the same kind of particle | grains from which a particle size differs. The average particle diameter of such particles is usually 0.01 to 1.0 μm, preferably 0.02 to 0.6 μm. If the average particle size exceeds 1.0 μm, excessively large protrusions will be formed on the film surface, resulting in problems such as insufficient adhesion to the surface of the circuit printed glass and the occurrence of defects. Is likely to fall off from the film surface, which is a cause of deterioration of wear resistance. On the other hand, if the average particle size is less than 0.01 μm, the formation of protrusions is insufficient, so that the slipperiness of the film is insufficient, or the generation of scratches may be observed in the film forming process or resist coating process.
本発明のドライフィルムレジスト用ポリエステルフィルムのヘーズは、フィルム厚み16μm換算で、好ましくは1%以下、より好ましくは0.6%以下である。また、350nmの光線透過率は、好ましくは80%以上、より好ましくは83%以上である。ヘーズが1%を超え、波長350nmの光線透過率が80%を下回ると、高解像のDFR用では紫外線の露光が不十分となり回路の欠陥を招いたり、解像度の低下を引き起こしたりするようになる傾向がある。 The haze of the polyester film for dry film resist of the present invention is preferably 1% or less, more preferably 0.6% or less in terms of a film thickness of 16 μm. The light transmittance at 350 nm is preferably 80% or more, more preferably 83% or more. If the haze exceeds 1% and the light transmittance at a wavelength of 350 nm is less than 80%, high-resolution DFR is not sufficiently exposed to ultraviolet rays, leading to circuit defects or reduced resolution. Tend to be.
本発明において帯電防止性と言うのは、例えば、表面の固有抵抗が1.0×1013Ω/□以下であることを指し、好ましくは1.0×107〜1.0×1011Ω/□の範囲が良い。表面固有抵抗の値が1.0×1013Ω/□を超えると、剥離帯電を制御することが困難となる。本発明の高解像性を要するDFR用の支持フィルムの場合、表面粗さが小さく、平坦なフィルムであり、掛かる帯電防止性を付与していないと帯電が激しく、特に剥離帯電による火花放電でレジスト溶剤への引火の危険性がある。また、ポリエステルフィルムの製膜工程やレジスト塗布工程で帯電によるゴミ、埃の付着でレジスト塗布欠陥やUV露光後の異物欠陥を発生させる。特に高解像性を要求されるDFRでは小さな、僅かな異物でも回路の欠陥となる恐れがある。 In the present invention, the term “antistatic property” means, for example, that the specific resistance of the surface is 1.0 × 10 13 Ω / □ or less, preferably 1.0 × 10 7 to 1.0 × 10 11 Ω. The range of / □ is good. If the value of the surface resistivity exceeds 1.0 × 10 13 Ω / □, it becomes difficult to control the peeling charge. In the case of the support film for DFR requiring high resolution of the present invention, the surface roughness is small and the film is flat, and if the applied antistatic property is not imparted, the charge is intense, particularly in the case of spark discharge due to peeling charging. Risk of ignition to resist solvent. Further, resist coating defects and foreign matter defects after UV exposure are caused by adhesion of dust and dust due to charging in the polyester film forming process and resist coating process. In particular, even a small amount of small foreign matter may cause a circuit defect in a DFR that requires high resolution.
帯電防止性を有する層を構成する成分としては、帯電防止樹脂や導電性樹脂等任意の帯電防止能を持つ高分子等から適宜選択することができる。この帯電防止剤としては、例えば、第4級アンモニウム塩、ピリジニウム塩、第1〜3級アミノ基等のカチオン性官能基を有するカチオン性帯電防止剤、スルホン酸塩基、硫酸エステル塩基、リン酸エステル塩基、ホスホン酸塩基等のアニオン性官能基を有するアニオン系帯電防止剤、アミノ酸系、アミノ硫酸エステル系等の両性帯電防止剤、ポリオール系、ポリグリセリン系、ポリエチレングリコール系等のノニオン性官能基を有する帯電防止剤等の各種高分子型帯電防止剤が挙げられ、また、第3級アミノ基や第4級アンモニウム基を有し、電離放射線により重合可能なモノマーやオリゴノマー、例えば、N,N−ジアルキルアミノアルキル(メタ)アクリレートモノマー、それらの第4級化合物等の重合性帯電防止剤、さらにポリアニリン、ポリピロール、ポリチオフェンなどの導電性ポリマー等も使用できる。これらの中でも、第4級アンモニウム塩型カチオン性官能基を有する高分子型帯電防止剤が好ましい。 The component constituting the layer having antistatic properties can be appropriately selected from a polymer having an arbitrary antistatic property such as an antistatic resin or a conductive resin. Examples of the antistatic agent include a cationic antistatic agent having a cationic functional group such as a quaternary ammonium salt, a pyridinium salt, and a primary to tertiary amino group, a sulfonate group, a sulfate ester base, and a phosphate ester. Anionic antistatic agents having anionic functional groups such as bases and phosphonic acid groups, amphoteric antistatic agents such as amino acids and aminosulfate esters, nonionic functional groups such as polyols, polyglycerols, and polyethylene glycols And various polymer type antistatic agents such as an antistatic agent having a tertiary amino group and a quaternary ammonium group, and monomers and oligomers that can be polymerized by ionizing radiation, such as N, N- Polymerizable antistatic agents such as dialkylaminoalkyl (meth) acrylate monomers and their quaternary compounds, and polyaniline Emissions, polypyrrole, conductive polymers such as polythiophene can be used. Among these, a polymer type antistatic agent having a quaternary ammonium salt type cationic functional group is preferable.
本発明においては、帯電防止剤と同時に、易滑性を付与するため塗布層中にワックスおよび微粒子を配合することが好ましい。ワックスとしては、植物系ワックス、動物系ワックス、鉱物系ワックス、石油ワックスなどの天然ワックスや、合成炭化水素、変性ワックス、水素化ワックスなどの合成ワックスなどが挙げられる。なかでもポリオレフィン系化合物が好ましい。具体的には、例えばエチレン、プロピレン、1−ブテン、4−メチル−1−ペンテン等の不飽和炭化水素の重合体、または共重合体からなるポリオレフィン系化合物等の化合物を基本骨格として有する化合物を溶解または分散して用いられ、ポリエチレン、ポリプロピレン、ポリ−1−ブテン、ポリ−4−メチル−1−ペンテン、エチレン−プロピレン共重合体、エチレン−1−ブテン共重合体、プロピレン−1−ブテン共重合体等を例示することができる。より具体的には末端に活性水素基を有する酸価10〜50のポリオレフィン、さらには酸化ポリエチレンまたは酸化ポリプロピレンを用いることが好ましい。 In the present invention, it is preferable to mix wax and fine particles in the coating layer in order to impart slipperiness simultaneously with the antistatic agent. Examples of the wax include natural waxes such as plant waxes, animal waxes, mineral waxes and petroleum waxes, and synthetic waxes such as synthetic hydrocarbons, modified waxes and hydrogenated waxes. Of these, polyolefin compounds are preferred. Specifically, for example, a compound having, as a basic skeleton, a compound such as a polymer of an unsaturated hydrocarbon such as ethylene, propylene, 1-butene, 4-methyl-1-pentene, or a polyolefin compound composed of a copolymer. Used by dissolving or dispersing, polyethylene, polypropylene, poly-1-butene, poly-4-methyl-1-pentene, ethylene-propylene copolymer, ethylene-1-butene copolymer, propylene-1-butene copolymer A polymer etc. can be illustrated. More specifically, it is preferable to use polyolefin having an active hydrogen group at the terminal and having an acid value of 10 to 50, and polyethylene oxide or polypropylene oxide.
一方、併用する微粒子としては、平均粒径が0.01〜0.2μmの無機粒子または有機粒子を配合することが好ましい。平均粒径が乾燥後の塗布層厚みの2倍以上となると、塗布層からの粒子の脱落が発生するようになる場合がある。逆に0.01μm未満であると易滑化および巻き改良の効果が見られなくなる傾向がある。かかる微粒子の例としては、炭酸カルシウム、リン酸カルシウム、シリカ、カオリン、タルク、二酸化チタン、アルミナ、硫酸バリウム、フッ化カルシウム、フッ化リチウム、ゼオライト、硫化モリブデン等の無機粒子、架橋高分子粒子、シュウ酸カルシウム等の有機粒子を挙げることができるが、これらの中でも、特に高度な透明性を得るために、架橋高分子粒子またはシリカ粒子が好ましく用いられる。なお、本発明においては、ポリエステルフィルムへの密着性等の向上のために、バインダーとしてポリエステル類、ポリウレタン類、アクリル樹脂類、ポリビニル樹脂類、ポリオレフィン類などの熱可塑性樹脂および/または熱硬化性アクリル樹脂、メラミン樹脂、エポキシ樹脂などの熱硬化性樹脂などを含有させてもよい。 On the other hand, as the fine particles to be used in combination, it is preferable to blend inorganic particles or organic particles having an average particle diameter of 0.01 to 0.2 μm. If the average particle diameter is twice or more the thickness of the coating layer after drying, the particles may fall off from the coating layer. On the other hand, if it is less than 0.01 μm, the effects of easy lubrication and winding improvement tend to be lost. Examples of such fine particles include calcium carbonate, calcium phosphate, silica, kaolin, talc, titanium dioxide, alumina, barium sulfate, calcium fluoride, lithium fluoride, zeolite, molybdenum sulfide and other inorganic particles, crosslinked polymer particles, oxalic acid Although organic particles, such as calcium, can be mentioned, among these, in order to obtain particularly high transparency, crosslinked polymer particles or silica particles are preferably used. In the present invention, in order to improve adhesion to the polyester film, thermoplastic resins such as polyesters, polyurethanes, acrylic resins, polyvinyl resins, polyolefins and / or thermosetting acrylics are used as binders. A thermosetting resin such as a resin, a melamine resin, or an epoxy resin may be included.
かかるワックスおよび微粒子の併用による塗布層を本発明の表面粗さを有する基材のポリエステルフィルム面上に塗設し、フィルムの摩擦係数を0.2〜0.6の範囲にすることが好ましい。摩擦係数をこの範囲にすることにより、ポリエステルフィルムをロール状に巻き取る際のシワや端面のズレを防止できるし、DFRをロールに巻き取る際の巻き取り性も良好となる。摩擦係数が0.2未満になると巻きズレが生ずるようになるし、逆に0.6を上回るとシワや空気溜まりが発生するようになるので好ましくないものとなる。 It is preferable to apply a coating layer formed by the combined use of such wax and fine particles on the polyester film surface of the base material having the surface roughness of the present invention, so that the friction coefficient of the film is in the range of 0.2 to 0.6. By setting the friction coefficient within this range, it is possible to prevent wrinkles and misalignment of the end face when the polyester film is wound into a roll, and the winding property when the DFR is wound around the roll is also improved. When the friction coefficient is less than 0.2, winding deviation occurs. On the other hand, when it exceeds 0.6, wrinkles and air pockets are generated, which is not preferable.
上述の層を構成する、帯電防止剤、ワックス、微粒子、バインダー、架橋剤の量比は、その選択される化合物よって最適値が異なるため特に規定するものではないが、下記の層特性を満足する量比であることが好ましい。塗布層中の帯電防止剤の含有量は、通常5重量%以上、好ましくは10〜90重量%の範囲であり、帯電防止剤がイオン性官能基を有する化合物の重合体である場合は、15〜90重量%、さらには20〜90重量%の範囲とすることが好ましい。帯電防止剤の比率が少なすぎると、十分な表面固有抵抗を達成することが難しくなり、逆に帯電防止剤の比率が多くなりすぎると、フィルム密着性の点で不十分な場合がある。またワックスの配合量は1重量%以上、好ましくは2〜10重量%の範囲であり、ワックスの比率が少なすぎると、十分な易滑効果を達成する事が難しく、比率が多すぎるとポリエステルフィルム基材との密着性を阻害するようになり好ましくない。併用する微粒子の比率は1重量%以上、好ましくは2〜10重量%が良い。1重量%未満では易滑化および巻き改良効果がみられず、10重量%以上となると粒子凝集により光線透過を阻害し、回路欠陥の原因となる恐れが生ずる。 The amount ratio of the antistatic agent, wax, fine particles, binder, and crosslinking agent constituting the above-mentioned layer is not particularly specified because the optimum value varies depending on the selected compound, but satisfies the following layer characteristics. A quantitative ratio is preferred. The content of the antistatic agent in the coating layer is usually in the range of 5% by weight or more, preferably 10 to 90% by weight, and when the antistatic agent is a polymer of a compound having an ionic functional group, 15 It is preferable to be in the range of -90% by weight, more preferably 20-90% by weight. If the ratio of the antistatic agent is too small, it will be difficult to achieve a sufficient surface resistivity. Conversely, if the ratio of the antistatic agent is too large, the film adhesion may be insufficient. The blending amount of the wax is 1% by weight or more, preferably in the range of 2 to 10% by weight. If the ratio of the wax is too small, it is difficult to achieve a sufficient slip effect, and if the ratio is too large, the polyester film The adhesiveness with the base material is inhibited, which is not preferable. The ratio of the fine particles used in combination is 1% by weight or more, preferably 2 to 10% by weight. If it is less than 1% by weight, no smoothing and winding improvement effects are observed, and if it is 10% by weight or more, light transmission is inhibited by particle aggregation, which may cause circuit defects.
本発明のフィルムを構成する易滑性および帯電防止性層は、水性塗液(水を媒体とする水溶性樹脂または水分散性樹脂)を塗布して形成することが好ましいが、少量の有機溶剤を含有した水性塗液を塗布して形成することも可能である。この有機溶剤としては、エタノール、イソプロパノール、エチレングリコール、グリセリン等のアルコール類、エチルセロソルブ、t−ブチルセロソルブ、プロピレングリコールモノメチルエーテル、テトラヒドロフラン等のエーテル類、アセトン、メチルエチルケトン等のケトン類、酢酸エチル等のエステル類、ジメチルエタノールアミン等のアミン類等を例示することができる。これらは単独、もしくは複数を組み合わせて用いることができる。水性塗液に、必要に応じてこれらの有機溶剤を適宜選択し、含有させることで、塗液の安定性、塗布性あるいは塗膜特性を助けることができる。 The slippery and antistatic layer constituting the film of the present invention is preferably formed by applying an aqueous coating liquid (water-soluble resin or water-dispersible resin using water as a medium), but a small amount of organic solvent. It is also possible to form it by applying an aqueous coating solution containing. Examples of the organic solvent include alcohols such as ethanol, isopropanol, ethylene glycol, and glycerin, ethers such as ethyl cellosolve, t-butyl cellosolve, propylene glycol monomethyl ether, and tetrahydrofuran, ketones such as acetone and methyl ethyl ketone, and esters such as ethyl acetate. And amines such as dimethylethanolamine. These can be used alone or in combination. By appropriately selecting and containing these organic solvents in the aqueous coating liquid as necessary, stability of the coating liquid, applicability, or coating film characteristics can be assisted.
本発明において、用いる塗液の固形分濃度は特に制約はないが、通常30重量%以下であり、0.2〜20重量%、さらには0.5〜15重量%、特に1〜10重量%の範囲が好ましい。塗液の固形分濃度が薄くなると、塗布はじきが生じやすくなる等の塗布面状の均一性に問題が生じやすくなる。また、塗液の固形分濃度が30重量%を超えると、塗布液の粘度が高くなる傾向にあり、このため塗布外観が悪化することがある。 In the present invention, the solid content concentration of the coating liquid to be used is not particularly limited, but is usually 30% by weight or less, 0.2 to 20% by weight, further 0.5 to 15% by weight, particularly 1 to 10% by weight. The range of is preferable. When the solid content concentration of the coating liquid is reduced, problems such as application repelling uniformity, such as easy application repelling, are likely to occur. On the other hand, when the solid content concentration of the coating liquid exceeds 30% by weight, the viscosity of the coating liquid tends to be high, and the coating appearance may be deteriorated.
基材フィルムへの塗液の塗布方法としては、例えば、原崎勇次著、槙書店、1979発行、「コーティング方式」に示されるような、リバースロールコーター、グラビアコーター、ロッドコーター、エアドクターコーターまたはこれら以外のコーティング装置を使用することができる。本発明による塗布層は、フィルム製膜中にコーティングを行うインラインコーティング、フィルムを製膜した後にコーティングを行うオフラインコーティングまたはこれら以外の方式により設けることができるが、インラインコーティングにより設けられることが好ましい。 As a method of applying the coating liquid to the base film, for example, reverse roll coater, gravure coater, rod coater, air doctor coater or these as shown in Yuji Harasaki, Tsuji Shoten, 1979, “Coating Method” Other coating equipment can be used. The coating layer according to the present invention can be provided by in-line coating in which coating is performed during film formation, off-line coating in which coating is performed after film formation, or other methods, but is preferably provided by in-line coating.
インラインコーティングは、ポリエステルフィルム製造の工程内で塗布を行う方法であり、具体的には、ポリエステルを溶融押出ししてから二軸延伸後熱固定して巻き上げるまでの任意の段階で塗布を行う方法である。通常は、溶融・急冷して得られる実質的に非晶状態の未延伸シート、その後に長手方向(縦方向)に延伸された一軸延伸フィルム、熱固定前の二軸延伸フィルムの何れかに塗布する。これらの中では、一軸延伸フィルムに塗布した後に横方向に延伸する方法が優れている。かかる方法によれば、製膜と塗布層乾燥を同時に行うことができるため、製造コスト上のメリットがあり、塗布後に延伸を行うために薄膜塗布が容易であり、塗布後に施される熱処理が他の方法では達成されない高温であるためにコート層とポリエステルフィルムが強固に密着する。 In-line coating is a method of coating within the process of manufacturing a polyester film. Specifically, it is a method of coating at any stage from melt-extrusion of polyester to biaxial stretching followed by heat setting and winding. is there. Usually applied to either a substantially amorphous unstretched sheet obtained by melting and quenching, a uniaxially stretched film stretched in the longitudinal direction (longitudinal direction), or a biaxially stretched film before heat setting. To do. In these, the method of extending | stretching to a horizontal direction after apply | coating to a uniaxially stretched film is excellent. According to such a method, since film formation and coating layer drying can be performed simultaneously, there is a merit in manufacturing cost, thin film coating is easy to perform stretching after coating, and heat treatment performed after coating is other than that. Since the high temperature is not achieved by this method, the coat layer and the polyester film are firmly adhered.
本発明フィルムの塗布層の厚みは0.02μm以上、0.1μm未満の範囲が好ましい。塗布厚みが0.02μm未満となると、塗布膜の均一性が悪くなり、帯電防止性にバラツキが生じるようになる。逆に塗布層厚みが0.1μm以上では、フィルムの生産性を低下させたり、ポリエステルフィルムとの界面で剥離が生ずるようになったりすることがある。 The thickness of the coating layer of the film of the present invention is preferably in the range of 0.02 μm or more and less than 0.1 μm. When the coating thickness is less than 0.02 μm, the uniformity of the coating film is deteriorated, and the antistatic property varies. On the other hand, when the coating layer thickness is 0.1 μm or more, the productivity of the film may be lowered, or peeling may occur at the interface with the polyester film.
本発明は、高解像性が必要なドライフィルムレジストの支持体として、透明性が高く、表面粗さが極めて平坦なフィルムに静電気防止性、易滑性を有する塗布層を設けることにより、フィルム表面に帯電した静電気の放電による災害の防止やベースフィルムの表面にごみやほこりなどが引きつけられ付着するのを防止して、異物付着によるパターン不整を防止し、品質の安定化を図り、かつ平坦なフィルムをロール状に巻きとる際の作業性、易滑性等の加工適正に優れるため、その工業的価値は非常に大きい。 The present invention provides a support for a dry film resist that requires high resolution by providing a coating layer having antistatic property and easy slipperiness on a film having high transparency and extremely flat surface roughness. Prevents accidents caused by electrostatic discharge on the surface and prevents dirt and dust from attracting and adhering to the surface of the base film, preventing pattern irregularities due to adhesion of foreign matter, stabilizing quality, and flatness The industrial value is very large because it is excellent in workability such as workability and slipperiness when winding a simple film into a roll.
以下、実施例によって本発明をさらに具体的に説明するが、本発明は以下の実施例に限定されるものではない。本発明におけるフィルム特性等の測定方法は、以下のとおりである。 EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to the following examples. The method for measuring film properties and the like in the present invention is as follows.
(1)塗布層厚み
塗布液の消費量より換算して求める。 塗布層の厚みはフィルム延伸、乾燥後の厚みで表す。
(1) Coating layer thickness Calculated from the consumption of coating solution. The thickness of the coating layer is expressed by the thickness after film stretching and drying.
(2)帯電防止性
日本ヒューレット・パッカード社製高抵抗測定器:HP4339Bおよび測定電極:HP16008Bを使用し、23℃,50%RHの測定雰囲気で十分調湿後、印可電圧100Vで1分後の基材フィルムの帯電防止層の表面固有抵抗値を測定した。この表面固有抵抗値から、帯電防止性として以下の基準で評価した。
○:表面固有抵抗値が1×1011Ω/□未満
△:表面固有抵抗値が1×1011Ω/□以上、1×1013Ω/□未満
×:表面固有抵抗値が1×1013Ω/□以上
(2) Antistatic property Using a high resistance measuring instrument made by Hewlett-Packard Japan: HP4339B and measuring electrode: HP16008B, after sufficient humidity adjustment in a measurement atmosphere of 23 ° C. and 50% RH, after 1 minute at an applied voltage of 100V The surface resistivity of the antistatic layer of the base film was measured. From the surface resistivity, the antistatic property was evaluated according to the following criteria.
○: Surface resistivity is less than 1 × 10 11 Ω / □ △: Surface resistivity is 1 × 10 11 Ω / □ or more and less than 1 × 10 13 Ω / □ ×: Surface resistivity is 1 × 10 13 Ω / □ or more
(3)易滑性
ASTM−D1894に準じて、ポリエステルフィルム塗設面と反対面とを合わせての動摩擦係数を測定した。測定した摩擦係数より、易滑性を以下の基準で評価した。
○:動摩擦係数が0.2以上、0.5未満
△:動摩擦係数が0.5以上、0.7未満
×:動摩擦係数が0.7以上
(3) Easiness of sliding According to ASTM-D1894, the dynamic friction coefficient was measured by combining the polyester film coated surface and the opposite surface. From the measured friction coefficient, the slipperiness was evaluated according to the following criteria.
○: Dynamic friction coefficient is 0.2 or more and less than 0.5 Δ: Dynamic friction coefficient is 0.5 or more and less than 0.7 ×: Dynamic friction coefficient is 0.7 or more
(4)フィルムヘーズ
JIS−7105に準じ、日本電色工業社製積分球式濁度計NDH−20Dによりフィルムのヘーズを測定し、数値をフィルム厚み16μmに基準化した。
(4) Film haze According to JIS-7105, the haze of the film was measured with an integrating sphere turbidimeter NDH-20D manufactured by Nippon Denshoku Industries Co., Ltd., and the numerical value was normalized to a film thickness of 16 μm.
(5)波長350nmの光線透過率
(株)島津製作所製の分光光度計MPC−3100を用いて波長350nmの光線透過率を測定した。
(5) Light transmittance at a wavelength of 350 nm The light transmittance at a wavelength of 350 nm was measured using a spectrophotometer MPC-3100 manufactured by Shimadzu Corporation.
(6)平均表面粗さ(Ra)
(株)小坂研究所社製表面粗さ測定器(SE−3F)を用いて次のようにして求めた。すなわち、フィルム断面曲線からその中心線の方向に基準長さL(2.5mm)の部分を抜き取り、この抜き取り部分の中心線をx軸、縦倍率の方向をy軸として粗さ曲線y=f(x)で表した時、次の式で与えられた値を〔μm〕で表す。中心線平均粗さは、試料フィルム表面から10本の断面曲線を求め、これらの断面曲線から求めた抜き取り部分の中心線平均粗さの平均値で表した。なお、触針の先端半径は2μm、荷重は30mgとし、カットオフ値は0.08mmとした。
Ra=(1/L)∫0 L |f(x)|dx
(6) Average surface roughness (Ra)
It calculated | required as follows using the Kosaka Laboratory Co., Ltd. surface roughness measuring device (SE-3F). That is, a portion having a reference length L (2.5 mm) is extracted from the film cross-sectional curve in the direction of the center line, the roughness line y = f with the center line of the extracted portion as the x axis and the direction of the vertical magnification as the y axis. When represented by (x), the value given by the following equation is represented by [μm]. The centerline average roughness was expressed as an average value of the centerline average roughness of the extracted portion obtained from 10 cross-sectional curves obtained from the sample film surface. The tip radius of the stylus was 2 μm, the load was 30 mg, and the cutoff value was 0.08 mm.
Ra = (1 / L) ∫ 0 L | f (x) | dx
(7)最大高さ(Rt)
Ra測定時に得られた断面曲線の抜き取り部分を、その平均線に平行な2直線で抜き取り部分を挟んだとき、この2直線の間隔を断面曲線の縦倍率の方向に測定して、その値をマイクロメートル(μm)単位で表したものを抜き取り部分の最大高さRtとした。最大高さは、試料フィルム表面から10本の断面曲線を求め、これらの断面曲線から求めた抜き取り部分の最大高さの平均値で表した。
(7) Maximum height (Rt)
When the extracted portion of the cross-sectional curve obtained at the time of Ra measurement is sandwiched between two straight lines parallel to the average line, the interval between the two straight lines is measured in the direction of the vertical magnification of the cross-sectional curve, and the value is calculated. The value expressed in units of micrometers (μm) was defined as the maximum height Rt of the extracted portion. The maximum height was expressed as an average value of the maximum heights of the extracted portions obtained from 10 cross-sectional curves obtained from the sample film surface.
(8)フィルム表面の傷付き
製品および巻きほぐしたフィルム面を目視により検査し、以下の基準で評価した。
○:検査範囲には全く傷つきが見られない
△:検査範囲の一部に薄い傷つきが見られる。
×:傷が認められる
(8) Scratched film surface The product and the unwound film surface were visually inspected and evaluated according to the following criteria.
○: No scratches are observed in the inspection range. Δ: Thin scratches are observed in a part of the inspection range.
×: Scratches are observed
(9)フォトレジストフィルム実用特性
フォトレジストフィルムを、常法にしたがって作製した。すなわち、フォトレジスト層を帯電防止および易滑性塗布面と反対側の面に設け、その上に保護層としてポリオレフィンフィルムを積層した。得られたフォトレジストフィルムを用いて、プリント回路の作製を行った。すなわち、ガラス繊維含有エポキシ樹脂板上に設けられた銅板に、保護層を剥離したフォトレジストフィルムのフォトレジスト層面を密着させた。次に、フォトレジストフィルムの上に、回路が印刷されたガラス板を密着させ、当該ガラス板側から紫外線の露光を行った。しかる後フォトレジストフィルムを剥離し、洗浄、エッチング等、一連の現像操作を行って回路を作製した。かくして得られた回路を目視あるいは顕微鏡を使って観察し、その品質によりフォトレジストフィルムの以下の実用評価を行った。
<解像性>
○:極めて高度な解像度を有し、鮮明な回路が得られる
△:鮮明度がやや劣り、線が多少太くなる等の現象が見られるが、実用上問題ない
×:鮮明度が劣るため、高密度の回路には使用できない
<回路の欠陥>
○:回路の欠陥は見られない
△:まれに回路の欠陥が見られる
×:回路の欠陥発生があり、実用上支障がある
<レジスト表面の凹み>
○:実用上問題になる凹みは認められない
△:凹みは認められるが、高解像性を要しないグレードには支障無いレベル
×:大きな凹みが認められ、実用上支障がある
(9) Photoresist film practical characteristics A photoresist film was produced according to a conventional method. That is, a photoresist layer was provided on the surface opposite to the antistatic and slippery coating surface, and a polyolefin film was laminated thereon as a protective layer. A printed circuit was produced using the obtained photoresist film. That is, the photoresist layer surface of the photoresist film from which the protective layer was peeled was adhered to a copper plate provided on the glass fiber-containing epoxy resin plate. Next, the glass plate on which the circuit was printed was brought into close contact with the photoresist film, and ultraviolet light exposure was performed from the glass plate side. Thereafter, the photoresist film was peeled off, and a series of development operations such as washing and etching were performed to produce a circuit. The circuit thus obtained was observed visually or using a microscope, and the following practical evaluation of the photoresist film was performed according to the quality.
<Resolution>
○: An extremely high resolution and a clear circuit can be obtained. Δ: Phenomena such as slightly inferior sharpness and slightly thick lines are observed, but there is no problem in practical use. Cannot be used for high density circuits
○: No circuit defects are observed. Δ: Circuit defects are rarely observed. ×: Circuit defects are present, which impede practical use.
○: Practical dents are not observed. △: Recesses are observed, but there is no problem for grades that do not require high resolution.
(10)DFR製造時の取り扱い性
フォトレジストフィルム作製時および使用時の取り扱い性に関して、評価を行った。
<帯電性>
○:巻きだしたポリエステルフィルムには帯電は全く認められず、安全上の問題もない
△:若干の帯電は認められるものの、安全上、実用上の問題は無い
×:帯電が激しく、レジスト塗布液への引火等の安全上の支障があり、ほこりやゴミ等を引きつけ、実用上の支障もある
<巻き特性>
○:フィルムに適度な粗さを有し、十分な滑り性を有するため、巻き特性は良好
△:若干粗さが不足するが、適度な滑り性があり、実用上問題ない
×:粗さが適度でなく、摩擦係数も適度出ないため、巻き乱れや巻き込み空気が介在し、レジスト特性に支障が生じたりする問題がある
(10) Handling property at the time of DFR manufacture Evaluation was performed regarding the handling property at the time of photoresist film preparation and use.
<Chargeability>
○: Charged polyester film is not charged at all and there is no safety problem. △: Slight charging is recognized, but there is no safety problem for practical use. There are obstacles in safety such as igniting fire, attracting dust and dirt, etc.
○: Since the film has an appropriate roughness and has sufficient slipperiness, the winding characteristics are good. Δ: Although the roughness is slightly insufficient, there is an appropriate slipperiness and there is no practical problem. There is a problem that the resist characteristics are hindered due to turbulence and entrainment air because it is not appropriate and the friction coefficient is not appropriate.
以下の実施例、比較例において用いた帯電防止層、易滑層の成分は、以下のとおりである。
[帯電防止層、易滑層成分]
・帯電防止剤(A1):ポリジアリルジメチルアンモニウムクロライド(平均分子量:約30000)
・ワックス(B1):酸化ポリエチレン水分散体(ジョンソンポリマー社製、ジョンワックス26)
・粒子(C1):平均粒径0.1μmのコロイダルシリカ水分散体
・水性樹脂(D1):水性アクリル樹脂(日本カーバイド工業社製、ニカゾールY−8106B)
・架橋剤(E1):メトキシメチロールメラミン(大日本インキ社製、ベッカミン J101)
The components of the antistatic layer and the slippery layer used in the following examples and comparative examples are as follows.
[Antistatic layer, easy slip layer component]
Antistatic agent (A1): polydiallyldimethylammonium chloride (average molecular weight: about 30000)
-Wax (B1): Oxidized polyethylene aqueous dispersion (Johnson Polymer 26, John Wax 26)
Particle (C1): Colloidal silica aqueous dispersion having an average particle size of 0.1 μm Water-based resin (D1): Water-based acrylic resin (Nicarbazole Y-8106B, manufactured by Nippon Carbide Industries, Ltd.)
Crosslinking agent (E1): Methoxymethylol melamine (Dainippon Ink Co., Ltd., Becamine J101)
極限粘度0.65dl/gのポリエチレンテレフタレート(平均粒径約0.3μmの架橋高分子粒子を100ppm含有)のペレットを180℃で熱風乾燥結晶化後、押出し機に供給し、280〜300℃の温度でTダイからシート状に溶融押し出しし、静電密着法を併用し、20℃に温度調整した鏡面冷却ドラム上にキャスト・急冷し、厚さ約230μmの未延伸フィルムを得た。次にこのフィルムを85℃で長手方向に3.7倍延伸し、一軸延伸フィルムを得た。このフィルムに帯電防止、易滑層として、4級アンモニウム塩型カチオン性高分子帯電防止剤:A1、酸化ポリエチレンワックス:B1、コロイダルシリカ粒子:C1、アクリル樹脂:D1、メラミン系化合物:E1を、20/4/4/52/20(固形分換算重量比)の比率で混合し、イオン交換水で固形分濃度3重量%に希釈し調製し調整した塗布液をポリエステルフィルムの片面に、バーコーターを用いて約5μm(wet厚)塗布した。次に110〜150℃のゾーンで横方向に3.9倍延伸し、230℃で熱処理して、結晶配向の完了した厚さ16μmの二軸延伸ポリエステルフィルムを得た。この横方向の延伸処理以降の熱処理で塗膜を乾燥させ帯電防止、易滑層を設けたフィルムを得た。この方法によって得られたポリエステルフィルムのフィルム特性を下記表1に示す。この塗布層と反対の面に、フォトレジスト膜を設け乾燥後、レジスト表面にポリエチレンフィルム保護フィルムラミネートしドライフィルムレジスト(DFR)を作成した。このDFRの特性を下記表2に示す。 Pellets of polyethylene terephthalate having an intrinsic viscosity of 0.65 dl / g (containing 100 ppm of crosslinked polymer particles having an average particle size of about 0.3 μm) are dried by hot air crystallization at 180 ° C., and then supplied to an extruder. It was melt-extruded from a T-die into a sheet shape at a temperature, and cast and quenched on a mirror-cooled drum whose temperature was adjusted to 20 ° C. in combination with an electrostatic adhesion method to obtain an unstretched film having a thickness of about 230 μm. Next, this film was stretched 3.7 times in the longitudinal direction at 85 ° C. to obtain a uniaxially stretched film. As an antistatic and easy-sliding layer on this film, a quaternary ammonium salt type cationic polymer antistatic agent: A1, oxidized polyethylene wax: B1, colloidal silica particles: C1, acrylic resin: D1, melamine compound: E1, A coating solution prepared by mixing at a ratio of 20/4/4/52/20 (weight ratio in terms of solid content), diluting with ion-exchanged water to a solid content concentration of 3% by weight, and preparing it on one side of a polyester film. About 5 μm (wet thickness). Next, the film was stretched 3.9 times in the transverse direction in a zone of 110 to 150 ° C. and heat-treated at 230 ° C. to obtain a biaxially stretched polyester film having a thickness of 16 μm and having completed crystal orientation. The coating film was dried by heat treatment after the transverse stretching treatment to obtain a film provided with an antistatic and slippery layer. The film properties of the polyester film obtained by this method are shown in Table 1 below. A photoresist film was provided on the surface opposite to the coating layer, and after drying, a polyethylene film protective film was laminated on the resist surface to prepare a dry film resist (DFR). The characteristics of this DFR are shown in Table 2 below.
ポリエチレンテレフタレート中の架橋高分子粒子の含有量および帯電防止、易滑層を構成する成分を下記表1に記載の組成に変更する以外は実施例1と同じ方法で二軸延伸ポリエステルフィルムを作成した。このフィルムのフィルム特性、DFRの特性を下記表2に示す。 A biaxially stretched polyester film was prepared in the same manner as in Example 1 except that the content of the crosslinked polymer particles in the polyethylene terephthalate and the antistatic and components constituting the slippery layer were changed to the compositions shown in Table 1 below. . The film properties and DFR properties of this film are shown in Table 2 below.
ポリエチレンテレフタレート中の架橋高分子粒子の含有量および帯電防止、易滑層を構成する成分を下記表1に記載の組成に変更する以外は実施例1と同じ方法で二軸延伸ポリエステルフィルムを作成した。このフィルムのフィルム特性、DFRの特性を下記表2に示す。 A biaxially stretched polyester film was prepared in the same manner as in Example 1 except that the content of the crosslinked polymer particles in the polyethylene terephthalate and the antistatic and components constituting the slippery layer were changed to the compositions shown in Table 1 below. . The film properties and DFR properties of this film are shown in Table 2 below.
ポリエチレンテレフタレート中に含有する粒子の種類、平均粒径を表1の示したものに変更し、帯電防止、易滑層を構成する成分を下記表1に記載の組成に変更する以外は実施例1と同じ方法で二軸延伸ポリエステルフィルムを作成した。このフィルムのフィルム特性、DFRの特性を下記表2に示す。 Example 1 except that the type and average particle size of the particles contained in the polyethylene terephthalate are changed to those shown in Table 1, and the components constituting the antistatic and easy-slip layer are changed to the compositions shown in Table 1 below. A biaxially stretched polyester film was prepared in the same manner as described above. The film properties and DFR properties of this film are shown in Table 2 below.
ポリエチレンテレフタレート中に含有する粒子の種類、平均粒径を表1の示したものに変更し、帯電防止、易滑層を構成する成分を下記表1に記載の組成に変更する以外は実施例1と同じ方法で二軸延伸ポリエステルフィルムを作成した。このフィルムのフィルム特性、DFRの特性を下記表2に示す。
(比較例1)
Example 1 except that the type and average particle size of the particles contained in the polyethylene terephthalate are changed to those shown in Table 1, and the components constituting the antistatic and easy-slip layer are changed to the compositions shown in Table 1 below. A biaxially stretched polyester film was prepared in the same manner as described above. The film properties and DFR properties of this film are shown in Table 2 below.
(Comparative Example 1)
ポリエチレンテレフタレート中に含有する粒子の種類、平均粒径を表1の示したものに変更し、帯電防止、易滑層を構成する成分を下記表1に記載の組成に変更する以外は実施例1と同じ方法で二軸延伸ポリエステルフィルムを作成した。このフィルムのフィルム特性、DFRの特性を下記表2に示す。
(比較例2)
Example 1 except that the type and average particle size of the particles contained in the polyethylene terephthalate are changed to those shown in Table 1, and the components constituting the antistatic and easy-slip layer are changed to the compositions shown in Table 1 below. A biaxially stretched polyester film was prepared in the same manner as described above. The film properties and DFR properties of this film are shown in Table 2 below.
(Comparative Example 2)
ポリエチレンテレフタレート中に粒子を含有しない以外は実施例1と同じ方法で二軸延伸ポリエステルフィルムを作成した。このフィルムのフィルム特性、DFR特性を表2に示す。
(比較例3)
A biaxially stretched polyester film was prepared in the same manner as in Example 1 except that polyethylene terephthalate did not contain particles. Table 2 shows the film characteristics and DFR characteristics of this film.
(Comparative Example 3)
ポリエチレンテレフタレート中に含有する粒子の種類、平均粒径を表1の示したものに変更し、かつ帯電防止、易滑層を塗布しないで実施例1と同じ方法で二軸延伸ポリエステルフィルムを作成した。そのフィルム特性、DFR特性を表2に示す。
(比較例4〜6)
The type and average particle size of the particles contained in the polyethylene terephthalate were changed to those shown in Table 1, and a biaxially stretched polyester film was prepared in the same manner as in Example 1 without applying an antistatic and slippery layer. . The film characteristics and DFR characteristics are shown in Table 2.
(Comparative Examples 4-6)
ポリエチレンテレフタレート中に含有する粒子の種類、平均粒径を表1の示したものに変更し、帯電防止、易滑層を構成する成分を下記表1に記載の組成に変更する以外は実施例1と同じ方法で二軸延伸ポリエステルフィルムを作成した。このフィルムのフィルム特性、DFRの特性を下記表2に示す。 Example 1 except that the type and average particle size of the particles contained in the polyethylene terephthalate are changed to those shown in Table 1, and the components constituting the antistatic and easy-slip layer are changed to the compositions shown in Table 1 below. A biaxially stretched polyester film was prepared in the same manner as described above. The film properties and DFR properties of this film are shown in Table 2 below.
本発明は、高解像性が必要なドライフィルムレジストの支持体として、好適に使用することができる。 The present invention can be suitably used as a support for a dry film resist that requires high resolution.
Claims (4)
Priority Applications (4)
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JP2003319604A JP4471611B2 (en) | 2003-09-11 | 2003-09-11 | Polyester film for dry film resist for high resolution |
PCT/JP2004/011444 WO2005026242A1 (en) | 2003-09-11 | 2004-08-09 | Polyester film for high resolution dry film resist |
CN2004800161224A CN1806000B (en) | 2003-09-11 | 2004-08-09 | Polyester film for high resolution dry film resist |
KR1020057023298A KR101064903B1 (en) | 2003-09-11 | 2004-08-09 | Polyester film for high resolution dry film resist |
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JP2003319604A JP4471611B2 (en) | 2003-09-11 | 2003-09-11 | Polyester film for dry film resist for high resolution |
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JP2005082784A JP2005082784A (en) | 2005-03-31 |
JP4471611B2 true JP4471611B2 (en) | 2010-06-02 |
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JP2003319604A Expired - Lifetime JP4471611B2 (en) | 2003-09-11 | 2003-09-11 | Polyester film for dry film resist for high resolution |
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JP (1) | JP4471611B2 (en) |
KR (1) | KR101064903B1 (en) |
CN (1) | CN1806000B (en) |
WO (1) | WO2005026242A1 (en) |
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JP4701838B2 (en) * | 2005-05-30 | 2011-06-15 | 東洋紡績株式会社 | Polyester film for ultra fine wire photoresist |
JP2007050631A (en) * | 2005-08-19 | 2007-03-01 | Mitsubishi Polyester Film Copp | Substrate film for manufacturing plastic film by cast method |
KR20070096102A (en) | 2005-12-23 | 2007-10-02 | 삼성전자주식회사 | Toner level sensing apparatus for developing device |
US8248750B2 (en) * | 2007-12-13 | 2012-08-21 | Bayer Materialscience Ag | Electroactive polymer transducers |
JP2008254282A (en) * | 2007-04-03 | 2008-10-23 | Mitsubishi Plastics Ind Ltd | Optical polyester film |
JP2009214360A (en) * | 2008-03-09 | 2009-09-24 | Mitsubishi Plastics Inc | Optical laminated polyester film |
KR101268250B1 (en) * | 2009-06-30 | 2013-05-30 | 코오롱인더스트리 주식회사 | Thermo-shrinkable polyester film |
JP5307050B2 (en) * | 2010-02-07 | 2013-10-02 | 三菱樹脂株式会社 | Laminated polyester film |
JP5271293B2 (en) * | 2010-02-07 | 2013-08-21 | 三菱樹脂株式会社 | Laminated polyester film |
JP5595892B2 (en) * | 2010-12-20 | 2014-09-24 | 三菱樹脂株式会社 | Single layer polyester film for photomask protective adhesive tape |
JP6150252B2 (en) * | 2013-09-10 | 2017-06-21 | 三菱ケミカル株式会社 | Coating film for transparent conductive film substrate |
JP6471490B2 (en) * | 2014-12-24 | 2019-02-20 | 三菱ケミカル株式会社 | Protective film for dry film resist and photosensitive resin laminate |
TWI535563B (en) * | 2015-03-31 | 2016-06-01 | 長興材料工業股份有限公司 | Laminated structure |
JP7005898B2 (en) * | 2016-01-13 | 2022-01-24 | 東レ株式会社 | Laminated film |
JP2017181673A (en) * | 2016-03-29 | 2017-10-05 | 三菱ケミカル株式会社 | Photoresist protection film |
JP6957856B2 (en) * | 2016-10-12 | 2021-11-02 | 三菱ケミカル株式会社 | Polyester film for dry film resist |
JP7172045B2 (en) * | 2017-01-31 | 2022-11-16 | 東レ株式会社 | Biaxially oriented polyester film roll for transfer material |
JP6825580B2 (en) * | 2018-01-12 | 2021-02-03 | 味の素株式会社 | Manufacturing method of printed wiring board |
JP7073774B2 (en) * | 2018-02-15 | 2022-05-24 | 三菱ケミカル株式会社 | Dry film Polyester film for resist substrate |
CN111699212B (en) * | 2018-02-15 | 2022-11-18 | 三菱化学株式会社 | Polyester film for dry film resist base material |
JP7290035B2 (en) * | 2018-02-15 | 2023-06-13 | 三菱ケミカル株式会社 | Polyester film for dry film resist substrate |
JP7290033B2 (en) * | 2018-02-15 | 2023-06-13 | 三菱ケミカル株式会社 | Polyester film for dry film resist substrate |
WO2019160119A1 (en) * | 2018-02-15 | 2019-08-22 | 三菱ケミカル株式会社 | Polyester film for dry film resist substrate |
JP7290036B2 (en) * | 2018-02-15 | 2023-06-13 | 三菱ケミカル株式会社 | Polyester film for dry film resist substrate |
JP7290034B2 (en) * | 2018-02-15 | 2023-06-13 | 三菱ケミカル株式会社 | Polyester film for dry film resist substrate |
CN111989618A (en) * | 2018-04-18 | 2020-11-24 | 三菱化学株式会社 | Polyester film for dry film resist |
KR102589138B1 (en) * | 2018-09-28 | 2023-10-12 | 코오롱인더스트리 주식회사 | High transparent polyester film |
JP6658927B2 (en) * | 2019-01-22 | 2020-03-04 | 三菱ケミカル株式会社 | Protective film for dry film resist and photosensitive resin laminate |
CN110372222B (en) * | 2019-06-28 | 2022-07-22 | 华为技术有限公司 | Glass panel, preparation method thereof, display screen comprising glass panel and terminal |
JP7275064B2 (en) * | 2020-03-31 | 2023-05-17 | 富士フイルム株式会社 | Method for manufacturing resin pattern, method for manufacturing conductive pattern, laminated polyester film, photosensitive transfer material, resin pattern, and touch panel |
TWI727768B (en) * | 2020-04-24 | 2021-05-11 | 南亞塑膠工業股份有限公司 | Polyester film for used in dry film |
CN114806100A (en) | 2021-01-29 | 2022-07-29 | 南亚塑胶工业股份有限公司 | Polyester black film and manufacturing method thereof |
TWI746359B (en) * | 2021-01-29 | 2021-11-11 | 南亞塑膠工業股份有限公司 | Polyester film and method for producing the same |
TWI790537B (en) * | 2021-01-29 | 2023-01-21 | 南亞塑膠工業股份有限公司 | White polyester film and method for manufacturing the same |
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US5783283A (en) * | 1996-03-08 | 1998-07-21 | Minnesota Mining And Manufacturing Company | Multilayer polyester film with a low coefficient of friction |
EP0959097B1 (en) * | 1998-05-21 | 2006-08-23 | Teijin Limited | Composite polyester film and magnetic recording medium. |
KR20010074862A (en) * | 1999-06-28 | 2001-08-09 | 야스이 쇼사꾸 | Biaxially oriented polyester film, process for producing the same, and use thereof as substrate for photographic sensitive material |
DE60039229D1 (en) * | 1999-12-28 | 2008-07-31 | Teijin Ltd | POLYESTER FILM ROLL |
US7053255B2 (en) * | 2000-11-08 | 2006-05-30 | Idemitsu Kosan Co., Ltd. | Substituted diphenylanthracene compounds for organic electroluminescence devices |
US20060037100A1 (en) * | 2004-08-12 | 2006-02-16 | Kim Young S | Fungal resistant transgenic pepper plants and their production method |
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2003
- 2003-09-11 JP JP2003319604A patent/JP4471611B2/en not_active Expired - Lifetime
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2004
- 2004-08-09 WO PCT/JP2004/011444 patent/WO2005026242A1/en active Application Filing
- 2004-08-09 KR KR1020057023298A patent/KR101064903B1/en active IP Right Grant
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KR20060052693A (en) | 2006-05-19 |
CN1806000B (en) | 2010-12-15 |
WO2005026242A1 (en) | 2005-03-24 |
JP2005082784A (en) | 2005-03-31 |
KR101064903B1 (en) | 2011-09-16 |
CN1806000A (en) | 2006-07-19 |
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